JP2009132966A - Film deposition system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vapor deposition system 1 which is excellent in maintenability capable of performing the maintenance of a film deposition system and the reregulation of a film deposition source in a short period of time. <P>SOLUTION: The vapor deposition system 1 has a vacuum chamber 2 whose inside is disposed with film deposition mechanisms (an evaporation source 6, a gas introduction tube 10b, a substrate holder 4 and a rotation supporting frame 12a). The vacuum chamber 2 comprises: a bottom plate 22; a plurality of side columns 206a to 206d erected on the corner part 2022 of the bottom plate 22 so as to form a treatment space on the bottom plate 22 via a bottom frame 202; a top plate 24 provided at the upper edges of a plurality of the side columns 206a to 206d so as to clog the upper opening of the treatment space via a top frame 204; and a plurality of side plates 26, 28, 30 freely openable/closable to a side opening formed between the adjoining column members with hinges 40, 42, 44 whose one end is connected to the side columns 206a, 206c, 206d as rolling supporting points. The film deposition mechanisms are arranged only at the bottom plate 22 and the top plate 24, and the side plates 26, 28, 30 do not have the film deposition mechanisms. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming apparatus such as a vacuum vapor deposition apparatus.

  It consists of a skeleton member made of pillars and plates manufactured by welding, and a plurality of doors attached to the skeleton member so as to hermetically seal the space surrounded by the skeleton member, and the door is formed by the skeleton member A film forming apparatus using a vacuum vessel having a skeleton structure in which doors are provided on two adjacent surfaces is known (Patent Document 1).

JP 7-4516

  However, in the vacuum container described in Patent Document 1, a part of the rotation fulcrum is connected to the top plate and the bottom plate. For this reason, when it becomes necessary to remove the top plate or the bottom plate for some reason, for example, maintenance inspection of the film forming mechanism or readjustment of the film forming source, the door disposed on the side surface of the container can be rotated simultaneously. It had to be removed, took time and effort, and had a problem in maintainability.

  The problem to be solved by the present invention is to provide a film forming apparatus excellent in maintainability.

  The present invention solves the above problems by the following means. In addition, although the code | symbol corresponding to drawing which shows embodiment of this invention is attached | subjected and demonstrated, this code | symbol is only for making an understanding of this invention easy, and is not the meaning which limits this invention.

  The film forming apparatus (1) according to the present invention has a vacuum chamber (2). A film forming mechanism (6, 10b, 4, 12a) is arranged inside the vacuum chamber (2).

  The vacuum chamber (2) includes a bottom member (22), a plurality of column members (206a to 206d), a top member (24), and a plurality of opening / closing members (26, 28, 30).

  The column members (206a to 206d) are erected near the corners of the bottom member (22) so as to form a processing space on the bottom member (22). The top member (24) is provided in the vicinity of the upper ends of the plurality of column members (206a to 206d) so as to close the upper opening of the processing space. The open / close members (26, 28, 30) are formed on the side formed between adjacent column members, with the rotation members (40, 42, 44) having one ends connected to the column members (206a to 206d) as rotation fulcrums. It is arranged to be openable and closable with respect to the direction opening.

  The film forming mechanism is arranged only on the bottom member (22) and the top member (24), and the opening / closing members (26, 28, 30) do not have the film forming mechanism.

  The “film formation mechanism” means an apparatus or member directly related to film formation, such as a film formation source, a substrate holder, a film thickness correction mechanism, a film thickness monitoring device, a plasma generation unit, an ion beam irradiation unit, and the like. However, it is intended to exclude devices and members such as an exhaust system that are only indirectly involved in film formation.

  In the film forming apparatus of the present invention, it is preferable that one of the opening / closing members is disposed so as to face the indoor side of the clean room, and the other opening / closing member is disposed so as to face the outside of the clean room.

  In the substrate take-out method of the present invention, at least one of the opening and closing members facing the outside of the clean room is opened, and a gap is formed between the opening and the pillar member, and the dust in the apparatus is discharged from the gap to the outside of the apparatus. After discharging, and then closing the gap, one of the opening / closing members facing the inside of the clean room is opened, and the processed substrate is carried out of the apparatus.

  According to the present invention, the rotation fulcrum of the opening / closing member (door) attached to the side surface of the vacuum chamber is formed not by connecting to the bottom member and the top member but to the column member. As a result, each surface can be configured to be functionally independent. Thereby, the troublesomeness which removes an opening-and-closing member from a vacuum chamber is not produced, but the maintenance check of a film-forming apparatus, the readjustment of a film-forming source, etc. can be performed reliably in a short time. That is, it can be excellent in maintainability.

  In addition, since the rotation fulcrum of the opening / closing member (door) is formed by connecting to the column member, there is an advantage that the use restriction of the surface (the bottom member and the top member) on which the rotation fulcrum is fixed is eliminated. . Specifically, it is not necessary to consider the space for fixing the rotation fulcrum for the bottom member and the top member, and it can be expected that the degree of freedom when installing various facilities such as a film forming mechanism is expanded. .

  In addition, by consolidating the film forming mechanism on the bottom and top members of the vacuum chamber, it is not necessary to consider the placement accuracy and mechanical accuracy related to the film forming mechanism for the opening and closing members attached to the side surface of the vacuum chamber. There is also an advantage that the installation work is facilitated.

  The film forming apparatus is not particularly limited, and examples thereof include a metallization sputtering apparatus, a vacuum deposition apparatus, a dry etching apparatus, and a CVD apparatus in an IC apparatus process. In particular, it is preferable to apply to a vacuum deposition apparatus.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

  In the present embodiment, the vapor deposition apparatus 1 shown in FIGS. 1A and 1B will be described as an example of the film forming apparatus.

<< Evaporation equipment >>
As shown in FIGS. 1A and 1B, a vapor deposition apparatus 1 according to this embodiment is a batch-type film deposition apparatus capable of vapor deposition on a plurality of substrates (not shown) in a single process, and is a vacuum chamber ( Vacuum chamber) 2. A substrate holder (substrate holding means) 4 for holding a substrate (not shown) is disposed on the upper inner surface of the vacuum chamber 2. On the lower inner surface of the vacuum chamber 2, a vapor deposition source 6 is disposed.

  The vacuum chamber 2 of the present embodiment is a vacuum container made of, for example, stainless steel having a generally hollow quadrangular prism (hexahedron) shape, details of which will be described later. The vacuum chamber 2 is grounded. The internal space of the vacuum chamber 2 is a film formation chamber (processing space) 2A that is a space for film formation by vapor deposition.

  An exhaust port 2a of the exhaust system 7 is provided on the back surface of the vacuum chamber 2, and a vacuum pump (not shown) is connected through the exhaust port 2a. By operating the vacuum pump, the film forming chamber 2A can be brought into a vacuum state. The vacuum chamber 2 is connected to a gas introduction pipe 10b for introducing gas into the film forming chamber 2A.

  A gas cylinder 10 is connected to the gas introduction pipe 10b, and the gas accommodated in the gas cylinder 10 can be supplied from the gas cylinder 10 to the film forming chamber 2A. The gas accommodated in the gas cylinder 10 is not particularly limited, but a convenient one is selected according to the constituent elements of the thin film to be formed. For example, a reactive gas such as oxygen gas, nitrogen gas, fluorine gas, ozone gas, or argon gas is accommodated in the gas cylinder 10.

  A plurality of gas cylinders may be installed so that a plurality of types of gases (for example, oxygen gas and argon gas) can be supplied from the gas cylinder 10 to the film forming chamber 2A. The flow rate of the gas from the gas cylinder 10 is adjusted by the mass flow controller 10a.

  The substrate holder 4 is for holding a substrate on which a thin film is to be formed, and the substrate holder 4 of this embodiment has a substantially disk shape. The substrate holder 4 is provided at an upper position in the film forming chamber 2A. The substrate holder 4 is provided with a plurality of openings. The substrate is placed on the substrate holder 4 so that the bottom surface of the vacuum chamber 2 faces the opening, and the deposition source 6 disposed on the bottom surface of the vacuum chamber 2 is opposed to the substrate. The substrate is fixed to the base holder 4 using a fixing tool such as a bolt, a fixing flange, or a leaf spring. The board | substrate hold | maintained at the base | substrate holder 4 is not restricted to a plate-shaped thing, A column shape, a circular tube shape, etc. may be sufficient.

  The substrate holder 4 is rotatably supported in the vacuum chamber 2 by the rotation support frame 12a. A motor 12 is connected to the rotation support frame 12a. The rotational driving force of the motor 12 is transmitted to the substrate holder 4 through the rotation support frame 12a, and the substrate holder 4 rotates. When the substrate holder 4 is rotated by the motor 12, the substrate held by the substrate holder 4 revolves around the rotation axis Z while facing the vapor deposition source 6.

  The vapor deposition source 6 is provided on the bottom surface of the vacuum chamber 2. The vapor deposition source 6 of this embodiment is an electron beam vapor deposition source, and includes a crucible 61 that holds a thin film raw material and an electron gun 62 for generating an electron beam that irradiates the raw material filled in the crucible 61. Yes. The crucible 61 is provided with piping so that it can be cooled with water. By irradiating the vapor deposition material filled in the crucible 61 with an electron beam, the vapor deposition material is evaporated.

  An electron gun power source 63 is connected to the electron gun 62. By supplying electric power to the electron gun 62 by the electron gun power source 63, an electron beam is generated from the electron gun 62, and the evaporation material in the crucible 61 is heated by this electron beam. Note that a shutter 64 is movably disposed above the crucible 61 so that the vapor deposition material in the crucible 61 is sufficiently heated and opened after the vapor deposition process is ready. When the shutter 64 is opened, the evaporated material, which is a heated evaporated material, diffuses into the film forming chamber 2A, and a part of the evaporated material adheres to the substrate held by the substrate holder 4 to form a thin film. To do.

  As the vapor deposition source 6, a resistance overheating vapor source, a high-frequency heating vapor source, or a vapor deposition source using a laser beam can be used. The resistance overheating evaporation source is an evaporation source that evaporates the evaporation material using electric heat generated by energizing a heater or a board filled with the evaporation material. The high-frequency heating evaporation source is an evaporation source that evaporates the evaporation material by heating the evaporation material filled in a crucible such as alumina by high-frequency induction using a high-frequency coil.

  In the present embodiment, high-frequency plasma generation means can be installed in the vacuum chamber 2 to efficiently assist film formation with plasma (electrons, ions, radicals, etc.). The plasma generating means is not limited to the one that generates plasma using a high frequency, and one that generates plasma by a direct current method can also be used. For example, as a plasma generating means, an electrode for performing arc discharge may be provided in the vacuum chamber 2, and a voltage may be applied to the electrode from a DC power source to generate plasma in the vacuum chamber 2.

  In the present embodiment, an ion beam irradiation unit is provided in the vacuum chamber 2, and film formation can be performed while irradiating the ion beam from the ion beam irradiation unit toward the substrate. Various ion sources such as a direct current type, a high frequency type, and a microwave type can be used as the ion beam irradiation means. By performing film formation using the ion beam irradiation means in this manner, it is possible to perform vapor deposition while assisting ions having high energy as compared with film formation using high-frequency plasma generation means.

  In the present embodiment, a film thickness correction plate may be disposed inside the upper surface of the vacuum chamber 2. The film thickness correction plate is a plate-like member. This film thickness correction plate is for making the raw material evaporate generated from the vapor deposition source 6 reach the substrate disposed on the substrate holder 4 uniformly or in a desired distribution. It is installed so as to be positioned between the vapor deposition source 6. As the shape of the film thickness correction plate, various shapes are adopted depending on the arrangement of the substrate, the relative position between the vapor deposition source 6 and the substrate holder 4, the film thickness distribution of the thin film to be formed, and the like.

《Vapor deposition method》
Next, an example of a film forming method using the vapor deposition apparatus 1 having the above-described configuration will be described.

First, the crucible 61 is filled with a vapor deposition raw material, and a plurality of substrates are held by the base holder 4 and placed in the vacuum chamber 2. In this state, the inside of the vacuum chamber 2 is depressurized to about 1 × 10 ⁻³ Pa or less, for example.

  Next, the substrate holder 4 is rotated at a predetermined rotational speed by the motor 12 to revolve the substrate. The rotation speed of the substrate holder 4 is set so that a thin film is uniformly formed on each substrate held by the substrate holder 4. For example, the substrate holder 4 is rotated at a rotation speed of 50 rpm or more.

When the film forming chamber 2A is stabilized at a predetermined pressure, the mass flow controller 10a is controlled to introduce a necessary gas from the gas cylinder 10 at a predetermined flow rate into the film forming chamber 2A. For example, oxygen gas is introduced into the film forming chamber 2A at about 50 cm ³ / min. If not necessary, gas introduction from the gas cylinder 10 may not be performed, and other gases may be introduced.

  Next, power supply to the electron gun 62 is started by the electron gun power source 63 to perform vapor deposition. In the present embodiment, the raw material evaporated material, which is the evaporated material of the vapor deposition material, diffuses into the film forming chamber 2A and adheres to the substrate, and a film having a predetermined thickness is formed.

《Vacuum chamber》
Next, an example of the detailed structure of the vacuum chamber 2 of the present embodiment will be described.

  The vacuum chamber 2 has a chamber body 20. As shown in FIG. 2, the chamber body 20 of the present embodiment includes a bottom frame (bottom frame member) 202, a top frame (top frame member) 204, and four side columns (column members) 206a to 206d. A case where six openings 20a to 20f are formed in each of the upper and lower, left and right and front and rear portions is illustrated.

  In the present embodiment, the bottom frame 202 and the top frame 204 are both formed in a square shape, and have four corner portions 2022 and 2042 that connect the left and right sides and the front and rear sides. Side pillars 206 a to 206 d are erected on each corner 2022 of the bottom frame 202. The upper ends of the side columns 206a to 206d are in contact with the corner portions 2042 of the top frame 204. The corner portions 2022 and 2042 and the side pillars 206a to 206d are firmly fixed by welding, and the vacuum airtightness is maintained on the surface in contact with these. The bottom frame 202, the top frame 204, and the side pillars 206a to 206d are made of metal such as stainless steel, for example. The bottom frame 202 and the top frame 204 may be formed as a single plate, or may be formed by combining four columns or plates.

  As shown in FIG. 3, a rectangular bottom plate (bottom member) 22 is fixed to the lower end of the bottom frame 202 with a bolt (not shown) or the like so that the lower opening 20a of the bottom frame 202 can be closed. It has become. As shown in FIG. 1A, the evaporation source 6 is installed in the bottom plate 22, and the gas introduction pipe 10b from the gas cylinder 10 is inserted through the mass flow controller 10a.

  Returning to FIG. 3, a rectangular top plate (top member) 24 is fixed to the upper end of the top frame 204 with a bolt (not shown), and the upper opening 20 b of the top frame 24 can be closed. ing. As shown in FIG. 1A, the top plate 24 is provided with a substrate holder 4 that can be rotated by a motor 12 via a rotation support frame 12a. The bottom plate 22 and the top plate 24 are made of a metal such as stainless steel. The seal between the bottom plate 22 and the bottom frame 202 and the seal between the top frame 204 and the top plate 24 are not shown, but are performed using a rubber O-ring or the like.

  Returning to FIG. 3, in this embodiment, the first side plate (opening / closing member) 26 and the second side plate (opening / closing member) 28 that face each other so as to close the left and right openings 20c, 20d of the four side columns 206a to 206d are provided. It is arranged. Further, a third side plate (opening / closing member) 30 and a fourth side plate 32 facing each other are disposed so as to close the front and rear openings 20e and 20f of the four side columns 206a to 206d. The fourth side plate 32 has an exhaust port 2a (see FIG. 1A). Thus, the space in the chamber body 20 surrounded by the bottom plate 22, the top plate 24, and the side plates 26, 28, 30, and 32 constitutes the film forming chamber 2A of FIG. 1A.

  As shown in FIGS. 4 and 5, the side plates 26, 28, and 30 are rotated by a pair of hinges (rotating members) 40, 42, and 44 as connecting tools with respect to the side columns 206d, 206c, and 206a, respectively. Connected freely. In the present embodiment, the side plate 32 is fixed to the side columns 206c and 206d with bolts (not shown). The side plates 26, 28, 30, and 32 are provided with rubber O-rings (see FIG. 1B) that go around each of the four sides, and the side plates 26, 28, 30, and 32 are closed with respect to the chamber body 20. Sometimes the inside of the chamber body 20 can be kept airtight. The side plates 26, 28, and 30 constitute doors that can be opened and closed independently.

  The hinge 40 is fixed to the first side plate 26 and the side pillar 206d by a bolt (not shown). The hinge 42 is fixed to the second side plate 28 and the side pillar 206c by a bolt (not shown). The hinge 44 is fixed to the third side plate 30 and the side pillar 206a by a bolt (not shown). The hinges 40, 42, and 44 are made of metal, for example.

  An example of the structure will be described taking the hinge 40 as a representative example. In the present embodiment, the other hinges 42 and 44 are formed in the same structure as that of the hinge 40, and therefore the description thereof is omitted.

  As shown in FIG. 6, the hinge 40 includes a pair of shaft support portions 402a and 404a and a rotation shaft 406a. Each of the shaft support portions 402a and 404a is formed in a substantially cylindrical shape having a through hole extending in the axial direction, and is arranged so as to be parallel to the axial direction by inserting the rotating shaft 406a into the through hole. It is. The shaft support portion 402a is connected to the vicinity of one end of the first side plate 26 using a bolt or the like, and the shaft support portion 404a is connected to the fourth side plate 32 (see FIG. 4) side of the side column 206d (other adjacent measuring plate side). ) With bolts. Thus, the first side plate 26 is supported so as to be rotatable about the rotation shaft 406a penetrating the pair of shaft support portions 402a and 404a with respect to the side column 206d. The first side plate 26 is pivotable at an angle exceeding 0 to 90 degrees toward the outside of the chamber body 20 with the hinge 40 as a pivot for the side column 206d.

  Returning to FIG. 4 and FIG. 5, in the present embodiment, the same applies to the second side plate 28 and the third side plate 30. The second side plate 28 uses the hinge 42 as a rotation fulcrum with respect to the side column 206 c, and the third side plate 28 c. The side plates 30 are rotatable at angles exceeding 0 to 90 degrees toward the outside of the chamber body 20 with the hinge 44 as a rotation fulcrum with respect to the side column 206a. In particular, in the present embodiment, the hinges 44 and 42 are arranged so that the third side plate 30 and the second side plate 28 adjacent to the third side plate 30 are so-called double doors.

  Next, the installation example of the vapor deposition apparatus 1 (refer FIG. 1A and FIG. 1B) of this embodiment is demonstrated.

  As shown in FIG. 7, the apparatus 1 is arranged so that only the side plate 30 of the three openable and closable measuring plates 26, 28, 30 faces the clean room (high cleanness) side.

  In order to take out the substrate from the inside of the apparatus 1 after film formation in this state, first, a leak valve (not shown) is opened, and the inside of the chamber 2 is returned to the atmospheric environment. Next, at least one of the side plates 26 and 28 facing the machine room (not clean) is slightly opened, and maintained in this state for a predetermined time (for example, about 1 to 5 minutes). Exhale into the machine room. After that, the measuring plate 30 facing the clean room is also slightly opened to create a flow of air from the clean room to the machine room. The reason why dust does not enter the clean room even when the side plate 30 is opened is that the clean room is set to be pressurized. Next, after the opened measuring plates 26 and 28 are closed, the measuring plate 30 is opened widely, and the substrate is taken out from the inside of the apparatus.

  In order to perform maintenance and inspection of the inside of the apparatus 1, the side plate 26, 28 on the machine room side is opened with the hinges 40, 42 being pivoted and opened with the measuring plate 30 facing the clean room closed. Perform proper maintenance.

  In the conventional vapor deposition apparatus, a mechanism relating to film formation is arranged on the side wall portion in addition to the upper and lower wall portions of the vacuum chamber. For this reason, it is necessary to adjust the positional accuracy and mechanical accuracy of the mechanisms on the side walls on which such mechanisms are arranged, as well as the upper and lower walls, and both the ease of maintenance and the mechanical accuracy of the film forming mechanism must be satisfied. I couldn't.

  In the present embodiment, a film forming mechanism (in this embodiment, the bottom plate 22 provided at the lower end of the bottom frame 202 of the chamber body (frame member) 20 and the top plate 24 provided at the upper end of the top frame 204 are provided. The evaporation source 6, the gas introduction pipe 10 b, the substrate holder 4, the rotation support frame 12 a and the like shown in FIG. 1A are integrated, and the side plates 26, 28, and 30 have only the role of walls. Accordingly, the side plates 26, 28, and 30 do not need to be considered in terms of arrangement accuracy and mechanical accuracy related to the film forming mechanism, and can be easily installed.

  Further, the side plates 26, 28, and 30 are configured to be openable and closable over the entire surface, and can be opened over 90 degrees. In addition, the hinges 44 and 42 are arranged so that the side plates 28 and 30 are so-called double doors. Further, a hinge serving as a rotation fulcrum is provided on the column portion constituting the vacuum chamber. Therefore, the side plates 26, 28, and 30 can be opened and closed independently, and the side plates 28 and 30 can be opened and closed in a double-speech manner so that the opening can be widened, compared with the conventional structure. It can be expected that the maintainability will be dramatically improved.

  In the present embodiment, the side plate 32 is provided with the exhaust system 7, but this does not require positional accuracy required for the film forming mechanism, and for the exhaust system 7, It is possible to arrange this in the bottom plate 22 portion or the top plate 24 portion.

<< Other Embodiments >>
The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention. In the following description, the same members as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted because it is the same as described above.

  In the present embodiment, the shape of the vacuum chamber 2 is a hollow hexahedron (for example, a quadrangular prism). However, the present invention is not limited to this, but a pentahedron (for example, a triangular prism), a hexahedron or more (for example, a pentagonal prism or more polygonal column). ). In this case, the chamber body constituting the vacuum chamber 2 can employ the door structure of the above-described embodiment in the measuring plate portion excluding the upper and lower plates.

  In this embodiment, as shown in FIGS. 4 and 5, the attachment position of the hinge 40 (the shaft support portion 404 a) with respect to the side column 206 d is set to the fourth side plate 32 (see FIG. 4) side (the other adjacent measurement plate side). However, as shown in FIG. 8, the first side plate 26 (see FIG. 4) side (same measurement side) may be used. The same applies to the other hinges 42 and 44.

  In the present embodiment, the chamber body 20 is formed using the bottom frame 202 and the top frame 204 as shown in FIG. 2, but the present invention is not limited to this. For example, as shown in FIG. The top frame 204 may be omitted, and the bottom plate 22 and the top plate 24 may be directly fixed to both end surfaces of the side pillars 206a to 206d with bolts (not shown). Moreover, as shown in FIG. 10, you may use the bottom plate 22a and the top plate 24a of the shape inserted in the upper and lower ends of one side instead of the both end surfaces of the side pillars 206a-206d.

  In this embodiment, the bottom frame 202 and the top frame 204 and the side pillars 206a to 206d are not necessarily fixed by welding, and a fastening member such as a bolt can also be used. The same applies to the case where the bottom plate 22 and the top plate 24 and the side columns 206a to 206d are fixed when the bottom frame 202 and the top frame 204 are omitted. When it is fixed by using a bolt or the like regardless of welding, it is easy to remove the bottom frame 202 and the top frame 204 or the bottom plate 22 and the top plate 24 even after the apparatus is installed. As a result, even when it is desired to change the function inside the apparatus after the apparatus is installed, it is possible to appropriately cope with it.

  In the present embodiment, a batch type vapor deposition apparatus is described as an example. However, the present invention is not limited to this, and the present invention is not limited to this, but a continuous type vapor deposition apparatus capable of continuously processing a plurality of substrates, and other film forming apparatuses. It is also possible to apply.

FIG. 1A is a cross-sectional view showing a schematic configuration of a vapor deposition apparatus according to this embodiment. FIG. 1B is a perspective view showing a schematic configuration of the vapor deposition apparatus according to the present embodiment. FIG. 2 is an exploded perspective view of a chamber body constituting a vacuum chamber of the vapor deposition apparatus of FIGS. 1A and 1B. FIG. 3 is an exploded perspective view showing the arrangement of the bottom plate, the top plate, and the side plate with respect to the chamber body of FIG. 4 is a cross-sectional view showing the arrangement of the measuring plates with respect to the chamber body of FIG. FIG. 5 is a cross-sectional view for explaining the open / closed state of the side plate of FIG. FIG. 6 is a diagram for explaining a configuration example of the hinge. FIG. 7 is a view for explaining an installation example of the chamber body of FIG. FIG. 8 is a cross-sectional view showing another example of the hinge attachment position. FIG. 9 is a perspective view showing another embodiment of the chamber body. FIG. 10 is a perspective view showing another embodiment of the chamber body.

Explanation of symbols

1 ... Vapor deposition equipment (film deposition equipment)
2 ... Vacuum chamber (vacuum tank)
2A ... Film formation chamber 2a ... Exhaust port 20 ... Chamber body 20a-20f ... Opening 202 ... Bottom frame (bottom frame member)
204 .. top frame (top frame member)
206a-206d ... Side pillar (pillar member)
22, 22a ... Bottom plate (bottom member)
24, 24a ... Top plate (top member)
26, 28, 30, 32 ... side plates (opening and closing members)
40, 42, 44 ... Hinge (rotating member)
4 ... Substrate holder (substrate holding means)
DESCRIPTION OF SYMBOLS 6 ... Deposition source 61 ... Crucible 62 ... Electron gun 63 ... Electron gun power supply 64 ... Shutter 7 ... Exhaust system 10 ... Gas cylinder 10a ... Mass flow controller 10b ... Gas introduction pipe 12 ... Motor 12a ... Rotation support frame

Claims (7)

A film forming apparatus having a vacuum chamber in which a film forming mechanism is disposed,
The vacuum chamber is
A bottom member;
A plurality of pillar members erected near the corners of the bottom member so as to form a processing space on the bottom member;
A ceiling member provided in the vicinity of the upper ends of the plurality of column members so as to close the upper opening of the processing space;
Having a plurality of opening and closing members that can be opened and closed with respect to a side opening formed between the adjacent column members, with a rotation member having one end connected to the column member as a rotation fulcrum;
A film forming apparatus, wherein a film forming mechanism is disposed only on the bottom member and the top member. The film forming apparatus according to claim 1,
The film forming apparatus, wherein the rotating member is arranged so that two opening / closing members arranged adjacent to the left and right of any one of the plurality of column members are double-spread. . The film forming apparatus according to claim 1 or 2,
The film forming apparatus includes a substrate holding unit that holds a substrate to be processed, a film forming source, and does not include an exhaust system. It is the film-forming apparatus as described in any one of Claims 1-3,
The column member is erected on a corner portion of the bottom member via a bottom frame member,
The film forming apparatus, wherein the top member is provided on an upper end of the column member via a top frame member. It is the film-forming apparatus as described in any one of Claims 1-4,
A film forming apparatus, which is a batch type vapor deposition apparatus. Using the film forming apparatus according to any one of claims 1 to 5,
One of the opening / closing members is disposed so as to face the indoor side of the clean room, and the other opening / closing member is disposed so as to face the outside of the clean room. Using the film forming apparatus arranged by the method according to claim 6,
Opening at least one of the opening / closing members facing the outside of the clean room, holding the gap for a predetermined time in a state of forming a gap between the pillar members, and discharging dust in the apparatus from the gap to the outside of the apparatus; ,
After closing the gap, opening any of the opening / closing members facing the room interior of the clean room and unloading the processed substrate from the apparatus.

Images