TW201642363A - Bonding device and bonding method - Google Patents

Abstract

The present invention provides a highly reliable die bonding device and bonding method for correctly bonding a die at a mounting position. The present invention uses a mounting camera to carry out imaging on a head reference mark disposed on a bonding head at a position within an imaging vision of the camera and away from a center of a clamping head that sucks and holds the die, further uses the mounting camera to carry out imaging on a conveyance reference mark disposed within a moving range of the bonding head on a conveying path for conveying the substrate to a mounting position, and based on the imaging result of the conveyance reference mark and the imaging result of the head reference mark, detects an over-time posture deviation defined by an over-time position deviation and an over-time rotational angle deviation caused by over-time changes of the mounting camera and the bonding head relative to the conveying path, in order to determine relative positions of the three ones.

Description

Bonding device and joining method

The present invention relates to a bonding apparatus and a bonding method, and more particularly to a highly reliable bonding apparatus and bonding method.

There is a die bonding process in which a substrate (a semiconductor wafer) is mounted on a wiring board, a lead frame, or the like, and a part of a process of assembling a package is bonded to a substrate from a wafer.

In the die bonding process, it is necessary to properly bond the die to the bonding surface of the substrate. However, when the substrate surface is joined by DAF (die bond film), it is heated to a high temperature of about 80 ° C to 160 ° C. Further, there is also a heat generation or a change in the temperature of the atmosphere from the driving unit that performs the XYZ axis operation. The heating or the heating of the driving portion or the change in the temperature of the atmosphere causes a positional deviation of the constituent members or the like to cause the die to be bonded to the correct position.

As a conventional technique for solving such a problem, reference 1 is cited. In the semiconductor manufacturing apparatus in which the semiconductor element is mounted on the semiconductor device to be mounted, the invention has a variation detecting unit that detects the semiconductor element mounted on the target to be mounted and is mounted thereon. The correction amount of the mounting target position on the object; and a correction circuit that statistically processes the value of the plurality of deviation amounts detected by the deviation detecting unit and feeds back the position correction calculation of the semiconductor element.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-311569

However, due to the recent small package. In the advancement of the technology of chip on chip due to thinning and thinning of crystal grains, the bonding of crystal grains requires higher precision (ten to several μm). Therefore, in addition to the subject of Patent Document 1, the thermal expansion of the transport path of the substrate or the like causes a variation in the bonding position on the substrate side.

Accordingly, it is an object of the present invention to provide a highly reliable die bonder and bonding method that can accurately bond a die to a mounting position.

In order to achieve the above object, the present invention includes a heating path, a radiant heat, a heating of a driving part, or an atmospheric temperature change in a conveying path which is caused by a high temperature before and after exposure to a temperature of 80 ° C to 160 ° C. The deviation of the posture itself is detected, and the time-dependent posture deviation caused by the change of the joint head and the mounted camera is detected, and the relative positions of the three persons are determined, so that the positioning accuracy in the mounting position is improved. According to an example of the present invention, there is provided a bonding apparatus comprising: a pickup imaging device having a first imaging field of view; and a placement position imaging means having a second imaging field of view capable of capturing a position at which a die is placed; The particle transfer tool picks up the crystal grains in the first imaging field of view and places the crystal grains on the placement position in the second imaging field of view. When the crystal grains are picked up, the image is captured in the first imaging field of view. The reference mark is provided, and when the die is placed on the placement position, the reference mark is provided at a position where the image can be captured in the second imaging field of view; and the first image is captured by the pickup imaging means. a predetermined crystal grain held by the particle transfer tool; a second image, a reference mark provided by the die transfer tool for holding the die by the pickup imaging means; and a third image by the placement position imaging means a substrate on which a predetermined object is placed by the die transfer tool; and a fourth image, a reference mark provided by the die transfer tool for capturing and holding the die by the placement position imaging means; and a correction means The placement of the crystal grains held by the die transfer tool is corrected based on the first, second, third, and fourth images.

Moreover, the present invention is a joining method comprising: a first step of picking up an image pickup means held by a die transfer tool The predetermined crystal grain is photographed; in the second step, the pick-up imaging means captures the reference mark provided in the die transfer tool holding the die; and in the third step, the placement position imaging means performs the predetermined substrate on which the die is placed. Shooting; in the fourth step, the placement position imaging means captures the reference mark provided in the die transfer tool holding the die; and according to the first, second, third and fourth steps, corrects the retention of the die transfer tool The step of placing the crystal grains.

Here, the die transfer tool includes, in addition to the bonding head for bonding the die, a pick-up head for picking up from the wafer, and a head portion for moving between the intermediate platform and some other places.

Further, the pickup imaging means includes an imaging means for picking up the crystal grains from the wafer, an imaging means for picking up the crystal grains placed on the intermediate stage, and an imaging means for picking up the crystal grains from the tool holding the other crystal grains. In other words, it is an imaging means that can be taken when picking up the die. In addition, the placement position imaging means includes an imaging means when the crystal grain is placed on the intermediate stage, an imaging means for placing the crystal grain on the substrate, and the like, and is placed on a target portion such as a substrate on which the die is transferred. The camera means of shooting.

Further, the placement of the crystal grains includes any of the bonding behaviors such as temporary pressure bonding or fixed pressure bonding, in addition to placing the crystal grains on the target site.

Further, the correction means is not limited to the correction by the die transfer tool alone, and may be any correction means capable of correcting the mounting position of the die held by the die transfer tool, as described below. The method can also be used to correct the position of the die transfer tool. Angled way to correct the placement of the die, or by correcting the position of the intermediate platform. In the angle mode, it is also possible to correct the mounting position of the crystal grain or other correction means as long as it can correct the mounting position of the crystal grain.

Further, although these corrections are also described below, for example, the control means is based on the position or direction of the crystal grains in the first image, the position or direction of the reference mark in the second image, and the like. Relationship, the position or direction of the grain is estimated from the reference mark. Further, the control means estimates the position of the substrate from the position and direction of the reference mark or the relationship between the position and direction of the substrate in the third image and the like, and the position or direction of the reference mark in the fourth image. direction. Further, the behavior is such that the position or direction of the crystal grain estimated from the reference mark coincides with the position or direction of the substrate estimated from the reference mark by the control means.

Further, the pickup imaging means of the present invention may be an imaging means for capturing the first image and the second image at the same position.

Further, the placement position imaging means of the present invention may be an imaging means for imaging the third image and the fourth image at the same position.

Further, the correction means of the present invention may be a reference mark from the third image based on the position or direction of the crystal grain in the first image and the position or direction of the reference mark in the second image. The means of correcting the position or orientation.

Moreover, the reference mark of the present invention may be such that it can be picked up by means of an optical system having a beak disposed on the transfer tool. Or a reference mark on which the position imaging means is placed.

Further, the present invention has a pick-up means for reversing the crystal grains and rotating in a plane parallel to the mounting surface having the mounting position, and the correcting means can be corrected by the pick-up means.

Further, in the pickup imaging device of the present invention, the first step and the second step may be performed at the same position. Further, in the placement position imaging means of the present invention, it is also possible to perform imaging at the same position in the third step and the fourth step.

Moreover, the step of modifying the present invention may be the position or direction of the die image captured according to the first step, the position or direction of the reference mark captured in the second step, the position of the substrate captured in the third step, or The direction and the step of correcting the position or direction of the fiducial mark taken in the fourth step.

Further, the second or third detecting step of the present invention may be a step of photographing the reference mark via an optical system having a beak disposed in the transfer tool.

Further, the step of the modification of the present invention may be a step of correcting the crystal grains and correcting them by means of a pick-up means rotatable in a plane parallel to the mounting surface having the mounting position.

According to the present invention, it is possible to provide a highly reliable die bonder and bonding method capable of accurately bonding a die to a mounting position.

11‧‧‧Supply platform camera

12‧‧‧Supply platform

13‧‧‧ pick up head

21‧‧‧Intermediate platform camera

21c‧‧‧Center position of the camera field of view of the intermediate platform camera

22‧‧‧Intermediate platform

23‧‧‧ Bonding head

23C‧‧‧ chuck

23cp‧‧‧ center position of the chuck

23j‧‧‧ chuck central axis

23m‧‧‧Marking Department

23o‧‧‧Optical system

23p1, 23p2‧‧‧稜鏡

23s‧‧‧Optical system support

23K‧‧‧Camera posture deviation detection department

23H‧‧‧ body of the joint head

25‧‧‧Rotary drive

31‧‧‧Installing the camera

31c‧‧‧Center position of the camera's field of view

32‧‧‧Affiliated Platform

32m‧‧‧ mounting surface

34‧‧‧ heating device

41‧‧‧Lower camera

60‧‧‧Transfer path

100,200‧‧‧die bonder

D‧‧‧ die (semiconductor wafer)

BM‧‧ head reference mark

HM, HM1, HM2‧‧‧ transport reference mark

HML‧‧‧ benchmark mark straight line

P‧‧‧Substrate

W‧‧‧ wafer

θ ag‧‧‧Intermediate rotation angle deviation of the intermediate platform camera relative to the transport path

Deviation of the rotation angle of the θ ab‧‧‧ intermediate platform camera relative to the joint head

θ bc‧‧‧ Deviation of the joint rotation angle with respect to the mounted camera

θ bg‧‧‧Time-dependent rotation angle deviation of the joint head relative to the reference mark line

θ cg‧‧‧Installation of the camera's time-dependent rotation angle deviation from the reference mark line

θ cd‧‧‧The deviation of the processing rotation angle relative to the mounting position of the mounted camera

θ ad‧‧‧Processing rotation angle deviation from the grain on the intermediate platform of the intermediate platform camera

Fig. 1 is a schematic side view showing a main part of a first embodiment of the present invention in a first embodiment of a preferred die bonder of the present invention.

Fig. 2 is a view showing a state in which a camera and a bonding head are mounted in a transport path.

Fig. 3 is a view schematically showing the structure of a bonding head in the first embodiment.

Fig. 4 is a view showing an operation of mounting a camera and a bonding head for detecting a time-dependent posture deviation between a mounting camera and a bonding head.

Fig. 5 shows the results obtained by the operation shown in Fig. 4; (a) is a view showing the detection result of the mounted camera; and (b) is a view showing the detection result of the bonding head.

FIG. 6 is a view showing a state in which the X drive shaft to which the camera is mounted is moved to the position where the conveyance reference mark is moved, and the conveyance reference mark is set as the operation origin due to the time-dependent posture deviation.

Fig. 7 is a view showing a flow of a detection process of a time-lapse posture deviation of a camera.

Fig. 8 is a view showing the detection result of the processing posture deviation of the intermediate stage camera with respect to the bonding head obtained by the processing.

[ Fig. 9] (a) is a view showing a state in which a mounting position of a new die D is mounted on a substrate P or a mounted die which is conveyed to an attached platform by a dotted line; ), with an intermediate platform camera A diagram of when the machine is photographed on the die D placed on the intermediate platform.

FIG. 10 is a view showing a flow of an installation process when the temporal posture deviation and the treatment posture deviation are simultaneously performed.

Fig. 11 is a schematic side view showing a main part of a second embodiment of a preferred die bonder of the present invention and is a fourth embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described using a drawing or the like. In addition, the following description is for explaining an embodiment of the present invention, and is not intended to limit the scope of the invention. Therefore, any one of the above-described elements or all elements may be replaced by an equivalent embodiment as long as it is a person having ordinary knowledge in the technical field of the invention. The embodiments are also included in the scope of the invention.

In the description of the drawings, the same reference numerals are given to components having a common function, and the repeated description is avoided as much as possible.

Fig. 1 is a schematic side view showing a main part of a first embodiment of the present invention in a first embodiment of a preferred die bonder of the present invention. The die bonder 100 is a device in which the die D picked up by the pickup head 13 is placed on the intermediate stage (holding position) 22 once, and the bonded die D is picked up again by the bonding head 23 to be bonded. The substrate P is transported to the mounting position and mounted.

The die bonder 100 has a platform camera 11 for recognizing the posture of the die D on the wafer, and an intermediate platform camera 21, The posture of the die D placed on the intermediate platform 22 is recognized; and the camera 31 is mounted to identify the mounting position on the auxiliary platform 32. Further, in the present embodiment, the intermediate stage camera 21 is a pickup camera in the present invention.

Moreover, the die bonder 100 has a rotary drive device 25 disposed on the intermediate platform 22, a lower view camera 41 disposed between the intermediate platform 22 and the auxiliary platform 32, and a heating device 34 disposed on the auxiliary platform 32; Control device 50.

The lower view camera 41 is in a state in which the die D adsorbed by the bonding head 23 during movement is observed from below, and the heating device 34 heats the sub-platform 32 in order to easily pick up or mount the die D.

The control device 50 includes a CPU (Central processor unit) not shown, a ROM (Read only memory) that stores a control program, a RAM (Random access memory) that stores data, a control bus, and the like, and controls the die bonder 100. Each element is used for the installation control described below.

The mounting unit participating in the joining process in the present embodiment means the transport path 60, the mounting camera 31, the joint head 23, the intermediate stage camera 21, and the intermediate stage 22, which also include the attachment platform 32 constituting the transport system. The mounting camera 31, the joint head 23, and the intermediate stage camera 21 have an XY drive shaft that moves in the X and Y directions in a plane parallel to the mounting surface 32m having the mounting position shown in FIG. 2, and does not have a pair. A rotating shaft on which the mounting surface 32m is orthogonal to the axis. The intermediate platform 22 has a rotary driving device 25 in the intermediate platform surface 22m (see figure) 1) The intermediate platform 22 is rotated on a plane parallel to the mounting surface 32m.

In addition, the Y direction in the present embodiment refers to a direction in which the joint head 23 moves between the intermediate stage 22 and the auxiliary platform 32, and the X direction refers to the direction orthogonal to the Y direction in the parallel plane in the mounting surface 32m. direction. Further, the XY drive shaft is as shown in Fig. 1, and the linear scale position is detected. For example, 26, 36, the joint head 23 and the respective Y-axis drive shafts of the mounted camera are linearly scaled.

FIG. 2 is a view showing a state in which the camera 31 and the bonding head 32 are mounted in the transport path 60. The mounting unit includes a transport path 60 for the satellite platform 32, a joint head 23 that is present on the upper side of the transport path 60, and a mounting camera 31 for receiving the crystal grain D, and the heating device 34 is subjected to the temperature of 80 ° C to 160 ° C. Impact. In other words, the conveyance path 60 thermally expands due to the high temperature, and the joint head 23 and the attachment camera 31 cause a posture deviation due to heat radiation or the like.

Therefore, in the present invention, the conveyance path 60 causing the posture deviation of the substrate P includes a posture deviation due to heating or the like itself, and the temporal posture deviation due to the temporal change of the attachment head 23 and the attachment camera 31 is detected. , determine the relevant position of the three, so as to improve the positioning accuracy in the installation position. The temporal posture deviation is a rotation angle deviation and a positional deviation as will be described later. In the following description, the former is referred to as a warp rotation angle deviation, and the latter is referred to as a warp time position deviation.

In order to realize the above-described detection of the temporal posture deviation, in the present embodiment, there are two reference marks next.

First, for detecting the elapsed time from the origin of the movement of the transport path 60 The transport reference mark HM provided with the posture deviation. In the present embodiment, as shown in FIG. 2, HM1, HM2 are provided on the convex portions on both sides of the transport path 60. The conveyance reference marks HM1, HM2 are provided along the line in which the camera 31 and the bonding head 23 are moved in the Y direction, and enter the imaging range in which the camera 31 is mounted. The transport reference marks HM1 and HM2 may have a shape that can be discriminated by the resolution of the camera as long as the transport path 60 is used for comparison. Further, the conveyance reference marks HM1, HM2 may be provided at positions spaced apart by a predetermined distance from the attachment platform 32.

Second, the head reference mark BM is provided on the bonding head 23. Fig. 3 (a) is a view schematically showing the configuration of the joint head 23 in the present embodiment. The head reference mark BM is set to the offset clip so that the center position 23cp of the chuck 23C that sucks and holds the die D matches the center position of the imaging field of view of the camera when the bonding head 23 is imaged from directly above. The position of the center position 23cp of the head 23C. Further, the distance L from the imaging surface of the camera to the head reference mark BM is formed so as to be a distance from the position of the focus distance WD of the camera shown in FIG. 3(b), that is, L1+L2+L3. In addition, the head reference mark BM may have a shape that can be distinguished by the resolution of the camera, as long as the mark portion 23m is used for comparison. For example, a notch mark may be provided in the mark portion 23m in addition to the black dot mark, or a straight line mark parallel to the X direction or the Y direction may be provided in the mark portion 23m.

Next, the configuration of the joint head 23 will be described. The joint head 23 has a chuck 23C for sucking and holding the crystal grain D, and a body 23H for the chuck The 23C moves up and down and moves on a two-dimensional plane parallel to the mounting surface 32m. The camera posture deviation detecting unit 23K has a head reference mark BM. The joint head 23 does not have a rotating shaft that rotates the chuck on the parallel surface in the mounting surface 32m.

The camera posture deviation detecting unit 23K includes a marking portion 23m extending from the main body 23H and provided with a head reference mark BM, and an optical system 23o that images the head reference mark BM by the center position 23cp of the chuck 23C. It is guided to the central axis 23j orthogonal to the mounting surface 32m. Further, the center position 23cp shown in Fig. 3(a) is shown on the side parallel to the paper surface for the sake of convenience.

In the present embodiment, the optical system 23o has two 稜鏡23p1, 23p2, which are provided on the upper portion of the main body 23H, and an optical system supporting portion 23s which is supported by the main body 23H.稜鏡23p2 is set such that its optical axis coincides with the central axis 23j. As the optical system, for example, a fiberscope may be used, which is disposed such that one end faces the head reference mark BM and the other end faces the imaging surface of the camera at the position of the 稜鏡23p2.

First, a method of detecting the temporal posture deviation of the mounting camera 31 and the bonding head 23 based on the transport path 60 and a method of detecting the temporal posture deviation of the mounting camera 31 with respect to the bonding head 23 will be described with reference to FIGS. 4 and 5 . .

Fig. 4 is a view showing the operation of mounting the camera 31 and the bonding head 23 for detecting the temporal posture deviation of the mounting camera 31 and the bonding head 23. Figure 5 is a diagram for transporting the reference marks HM1, HM2 by the connection The dotted line indicates the reference mark straight line HML as a result of the operation shown in FIG. 4 as a reference, and the map shown by the camera 31 and the bonding head 23 is attached. Fig. 5(a) is a view showing the result of mounting the camera 31, and Fig. 5(b) is a view showing the result of the bonding head 23. The positions of the HMMs in FIGS. 5(a) and 5(b) are the midpoints of the transport reference marks HM1 and HM2, and indicate the virtual transport reference mark HMM.

As shown in FIG. 4(a), the mounting camera 31 is moved so that the center position of the imaging field of view of the mounting camera 31 coincides with the center position of the transport reference mark HM1, thereby obtaining the image as shown in FIG. 5(a). The position (Xcg1, Ycg1) of the conveyance reference mark HM1 of the camera 31 is mounted. Then, as shown in FIG. 4(b), the bonding head 23 is moved so that the center position of the head reference mark BM coincides with the center position of the imaging field of view of the mounting camera 31, thereby obtaining the image from FIG. 5(b). The position (Xbg1, Ybg1) of the transfer reference mark HM1 of the bonding head 23 shown.

Then, the mounting camera 31 and the bonding head 23 are sequentially moved to the transport reference mark HM2, and the processing on the transport reference mark HM1 is also performed on the transport reference mark HM2, and the obtained signals are respectively shown in FIGS. 5(a) and 5; (b) The position (Xcg2, Ycg2) of the conveyance reference mark HM2 of the camera 31, and the position (Xbg2, Ybg2) of the conveyance reference mark HM1 from the bonding head 23. In X, the conveyance direction of the substrate P is set to be positive, and Y is set to be positive in the direction in which the bonding head 23 is directed from the sub-platform 32 toward the intermediate stage 22.

From the results shown in FIG. 5, the bonding head 23 is opposite to the base. The deviation of the rotation angle of the quasi-marking line HML is θ bg in the clockwise direction, and the deviation of the rotation angle of the mounting camera 31 with respect to the reference mark line HML connecting the transport reference marks HM1 and HM2 is The hour hand is set to positive and becomes θ cg. Further, the time-lapse rotation angle deviation θ bc of the mounting camera 31 with respect to the bonding head 23 is clockwise and becomes θ bg - θ cg . The deviation of the respective rotation angles does not necessarily make the clockwise direction positive. In short, it is necessary to make the same rotation set to be positive. In the following description, the rotation angle deviation is also performed by clockwise.

It is assumed that as long as the joint head 23 has a rotation axis, the rotation axis is moved as the operation origin Bg on the reference mark straight line HML, and as long as only the warp rotation axis deviation -θ bg is rotated, the movement trajectory Br of the joint head 23 is Consistent with the reference mark line HML. In the present embodiment, since the joint head 23 does not have a rotation axis, it is performed by the rotation of the intermediate stage 22 which will be described later. Further, Jcg is an operation origin of the Y drive shaft to which the camera 31 is mounted, and Jcr is a movement locus in which the camera 31 is mounted.

FIG. 6 shows an example in which the operation origin of the X drive shaft of the joint head 23 is set as the transport reference mark HM1. In FIG. 6, as long as the distance between the conveyance reference marks HM1 and HM2 at the time of the initial or previous menstrual posture deviation detection is set to Ly, the ΔYb is extended when the temporal posture deviation of the current time is detected. However, ΔYb, when the mounting camera 31 reaches the mounting position, does not become larger as the mounting position deviates from the field of view. Therefore, it can be corrected from the image obtained by mounting the camera 31 at the time of actual bonding. . In addition, the origin of the X drive shaft is not limited. When the reference mark HM1 is transported, even if the HM2 is the midpoint, that is, the HMM.

The description of the mounting of the camera 31 may be the same as that of the bonding head 23 shown in FIG. 6, and thus will be omitted. The movement trajectory in the mounting camera 31 coincides with the movement trajectory Br of the joint head 23 and the reference mark straight line HML. The operation origin of the camera 31 is not necessarily matched with the transport reference mark HM1 of the operation origin of the bonding head 23.

Next, the detection of the temporal posture deviation of the intermediate platform camera 21 will be described using FIG. 7 and FIG. Fig. 7 is a view showing the flow of the detection processing of the time-lapse posture deviation of the intermediate platform camera 21. Fig. 8 is a view showing the detection result of the time-lapse processing posture deviation of the intermediate stage camera 21 with respect to the bonding head 23 obtained by the processing. In addition, as long as the influence of the heating of the transport path 60 and the heating of the intermediate stage 22 is small and the time-lapse posture deviation of the intermediate platform camera itself may be ignored, it may not be implemented.

Before the detection flow of FIG. 7 is carried out, when the center position 21c of the imaging field of view of the intermediate stage camera 21 does not coincide with the rotation axis of the intermediate stage 22, the intermediate stage camera 21 is moved and aligned.

First, as shown in FIG. 8, the bonding head 23 is moved in parallel in the Y direction on the one-point chain line passing through the center position 21c of the imaging field of view of the intermediate stage camera 21, thereby obtaining the imaging BM1 of the head reference mark BM (step S1). Thereafter, the bonding head 23 is moved in parallel in the X direction by a predetermined distance, thereby obtaining the imaging BM2 of the head reference mark BM at this time (step S2). The predetermined distance can be moved in parallel, which can also be in the Y direction.

As shown in FIG. 8, although the head reference mark BM is moved in parallel with the X direction, the image BM1 of the head reference mark BM is connected, The linear inclination of the BM 2 indicates that the intermediate stage camera 21 is inclined with respect to the joint head 23, that is, the warp rotation angle deviation θ ab is obtained (step S3). Since the imaging BM1 of the head reference mark BM is located at the center position 23cp of the chuck 23C, the deviation of the imaging BM1 from the center position 21c of the imaging field of view of the mounted camera 31 is the intermediate platform camera 21 with respect to the bonding head 23. The temporal position deviation is obtained, thereby obtaining the temporal position deviation (Xab, 0) (step S4). Further, when the head reference mark BM is a straight line mark in the X direction or the Y direction, S2 is not performed, and the chain can be chained by one of the center positions 21c of the imaging field of view of the intermediate stage camera 21 with respect to the line mark. The slope of the line obtains the warp angle deviation θ ab over time.

Thereafter, the intermediate stage 22 is rotated to correct the deviation of the rotation angle of each of the attachment units. However, the position of the origin of the time-dependent posture deviation is corrected so as not to cause a positional deviation by rotation, so that the X of each unit is changed. The position is on a straight line. Specifically, the origin position of the bonding head 23 and the position where the camera 31 is mounted is moved by -Xab. As a result, since the positional operation origin of the intermediate stage camera 21, the joint origin 23, and the movement origin of the attachment camera 31 in the X direction are located on a straight line, there is no positional deviation between them. This straight line is formed at a position offset from the conveyance reference mark HM1 Xab. Since the positional shift in the Y direction is as described above, it can be covered by the field of view of the camera, and therefore, it can be apparently ignored.

Not only the elapsed rotation angle deviation θ ab due to the intermediate stage camera 21, but also the transport reference to be carried by the transport path 60 The warp rotation angle deviation θ cg of the mounted camera obtained by the mark HM and the warp rotation angle deviation of the joint head 23 with respect to the time-lapse rotation angle deviation θ bc of the mounted camera 31 are corrected for the warp angle deviation. . Therefore, the total warp rotation angle deviation θ ag of the intermediate platform camera 21 with respect to the transport path 60 is expressed by the formula (1) or the formula (2). Here, the intermediate stage 22 is rotated by -θ ag to correct the deviation of the rotation angle at the time of the entire warp.

θ ag=θ cg+θ bc+θ ab (1) =θ cg+(θ bg−θ cg)+θ ab=θ bg+θ ab (2)

Further, according to the formula (2), a case is shown in which the deviation of the rotation angle of all the mounting units with respect to the conveyance path 60 can be corrected as long as the joint head 23 has the rotation axis.

When the posture change of the transport path 60, the mounting camera 31, and the joint head 23 is changed all the time, the time-lapse posture detection due to the above-described temporal change is performed every time, and the posture deviation can be maintained for a certain period of time. Next, it is carried out at every certain time.

As described above, according to the present embodiment, it is possible to correct the temporal posture deviation of the mounting unit with respect to the transport path 60, that is, the mounting units, particularly the joint heads, which are placed in the correct posture with respect to the substrate P in the transport path 60. 23. When the time-lapse posture of the camera 31 is mounted, the positioning accuracy of the transport path, that is, the substrate P (installation position) that is transported can be improved.

Next, explain the installation process. In the installation process, the intermediate platform camera (pickup camera) and the mounting camera are relatively engaged The rotation angle deviation θ ac of the head affects the positioning accuracy of the die toward the mounting position. The intermediate platform camera captures the position of the die while picking up the die. The mounting camera is engaged in the die. At the time of shooting, take a picture of the installation location.

θ ac = θ ab - θ cb = θ ab + θ bc (3)

The content of the formula (3) is included in the formula (1), and is corrected in the process of the postural posture deviation.

Moreover, in the case where the positioning process is performed with higher precision, the mounting process is corrected in consideration of the processing posture deviation described later.

The treatment posture deviation refers to the deviation of the posture of the substrate P or the mounted mounted crystal grain D that has been transported to the auxiliary platform 32 with respect to the mounting camera 31, and the grain D placed on the intermediate platform 22 with respect to the intermediate platform. A general term for the posture deviation of the camera 21. Hereinafter, the processing posture deviation will be described using FIG. 9. In the processing posture deviation, there is also a processing rotation angle deviation and a processing position deviation similarly to the temporal posture deviation.

Fig. 9(a) is a view showing a state in which the mounting position of the new die D is mounted by the mounting camera 31 on the substrate P or the mounted die D shown by the broken line conveyed to the sub-platform 32. As seen from Fig. 9(a), the processing posture deviation with respect to the mounting position at which the camera 31 is mounted is such that the processing rotation angle deviation becomes θ cd and the processing position deviation becomes (Xcd, Ycd). Similarly, in FIG. 9(b), the crystal grains D placed on the intermediate stage 22 are imaged, and the processing posture of the crystal grains is deviated. The processing rotation angle deviation becomes θ ad, and the processing position deviation becomes (Xad, Yad).

From Fig. 9, the deviation of the processing rotation angle of the die D on the intermediate stage 22 with respect to the mounting position on the sub-platform 32 is expressed by the formula (4).

Handling the rotation angle deviation θ d: θ cd-θ ad (4)

Therefore, when the correction of the temporal position deviation and the correction of the processing posture deviation are simultaneously performed, the rotation angle deviation is corrected by the rotation of the intermediate stage 22 as shown in the equation (5). The full rotation angle deviation after the angular deviation is added.

Full rotation angle deviation θ s: θ ag + θ d (5)

On the other hand, for the positional shift, after the full rotation angle deviation of the equation (5) is corrected, the processing position deviation (Xad`, Yad`) of the crystal grain D on the intermediate stage obtained after the rotation is obtained, The position of the joint head 23 is corrected.

Next, the flow of the mounting process when the temporal posture deviation and the processing posture deviation are simultaneously performed will be described with reference to FIG. 10 .

First, in the subsidiary platform 32, the temporal rotation angle deviation θ cg, θ bc or θ cg with respect to the transport path 60 is obtained (step S101), and the processing rotation angle deviation with respect to the mounting position of the mounting camera 31 is obtained. θ cd , processing position deviation (Xcd, Ycd) (step S102). Next, in the intermediate stage 22, the temporal rotation angle deviation θ ab with respect to the intermediate stage camera 21 of the joint head 23 is obtained (step S103), and the processing rotation angle deviation θ with respect to the crystal grain D of the intermediate stage camera 21 is obtained. Ad (step S104). Subsequent steps The rotation angle deviation obtained in steps S101 to S104 obtains the full rotation angle deviation θ s as shown in the equation (5), and the intermediate stage is rotated by -θ s (step S105).

Next, the crystal grain D on the intermediate stage 22 is imaged to obtain a processing position deviation (Xad`, Yad`) of the rotated crystal grain D (step S106). The bonding head 23 is moved, and the processing position deviation (Xad`, Yad`) is corrected to pick up the die D (step S107). The bonding head 23 is moved to the sub-platform 32, and the processing position deviation (Xcd, Ycd) at the mounting position is corrected to bond the die D (step S108).

When the posture deviation can be maintained for a certain period of time, it is determined whether or not the temporal posture deviation needs to be corrected (step S100), and if necessary, the above-described steps S101 to S108 are performed. When it is not necessary, only the correction of the processing posture deviation is performed. That is, in the satellite platform, the processing rotation angle deviation θ cd and the processing position deviation (Xcd, Ycd) with respect to the mounting position of the mounting camera 31 are obtained in advance (step S111). Next, in the intermediate stage 22, the processing rotation angle deviation θ ad with respect to the crystal grain D of the intermediate stage camera 21 is obtained (step S112). Further, the processing rotation angle deviation θ d as shown in the equation (4) is obtained, and the intermediate stage 22 is rotated by -θ d (step S113). Thereafter, the processing of steps S106 to S108 is performed.

Further, as shown in FIG. 1, in the case of performing the lamination processing of the laminated crystal grains, the processing posture of the crystal grains D of the posture layer of the mounted crystal grains D from the attached platform 32 can be obtained with a predetermined positioning accuracy. In the case of deviation, step S111 is omitted, and in step S108, the layering is caused. The processing position deviation at the mounting position is corrected as a displacement, and the die D is joined.

In the above description, the processing position deviation correction is performed on the respective platforms. However, it is not the form in which the die D of the bonding head 23 takes the crystal grain D into the inside, and since the crystal grain D is adsorbed on the same surface, the intermediate stage 22 does not necessarily have to be accurately performed with respect to the crystal grain D. The position of the pickup is such that the positional deviation correction can be performed in any platform or movement toward the auxiliary platform 32.

According to the present embodiment described above, it is possible to detect the temporal change of the mounting unit with respect to the time-dependent posture deviation of the mounting unit of the transport path, and it is possible to accurately bond the crystal grains to the mounting position.

Further, according to the present embodiment described above, since the temporal posture deviation with respect to the mounting unit of the transport path can be detected, the temporal posture deviation between the intermediate platform camera and the mounted camera can be detected and corrected, and therefore, The crystal grains can be further joined to the mounting position with high precision.

Next, a second embodiment of the method of detecting the temporal posture deviation with respect to the transport path 60 will be described. In the first embodiment, the time-dependent deviation detection of the bonding head 23 with respect to the transport path 60 and the temporal deviation detection of the mounting camera 31 with respect to the transport path 60 are simultaneously performed on the two transport reference marks HM. In the embodiment, the temporal deviation detection of the mounting camera 31 with respect to the transport path 60 is first performed, and secondly, the temporal deviation of the joint head 23 with respect to the mounted camera 31 is detected.

The method for detecting the temporal posture deviation of the mounted camera 31 in the present embodiment is the same as that of the first embodiment. Further, the detection of the deviation of the engagement posture of the joint head 23 with respect to the attachment camera 31 is performed in the same manner as the processing posture detection processing of the intermediate stage camera with respect to the joint head 23. That is, the bonding head 23 is moved in the X direction or the Y direction with respect to the mounting camera 31. However, in the first embodiment, the temporal posture shift of the intermediate stage camera 21 with respect to the joint head 23 is detected. In contrast, in the present embodiment, the time-lapse of the joint head 23 with respect to the mounting of the camera 31 is detected. Posture shift

Even in the second embodiment, the same effects as those of the first embodiment can be achieved.

Further, a third embodiment of the temporal posture deviation detecting method with respect to the transport path 60 will be described. In the first and second embodiments, the two posture reference marks are separated by a predetermined distance, and the temporal posture deviation of the attachment camera 31 and the joint head 23 with respect to the conveyance path 60 is detected. The third embodiment is performed by using one transport reference mark HM provided on the transport path 60 including the satellite platform 32, for example, the transport reference mark HM1.

In the third embodiment, the mounting camera 31 is moved in parallel in the X direction or the Y direction with respect to the one transport reference mark HM, and the trajectory of the reference mark HM is transported from one of the times to detect the transport path with respect to the transport path. The time-lapse posture deviation of the mounted camera 31 of 60. That is, in FIGS. 7 and 8, the head reference mark BM which is provided with respect to the bonding head 23 of the camera is moved, but in the present embodiment, it is fixed with respect to the fixing. The transport reference mark HM moves the mounted camera 31, and detects the temporal posture deviation of the mounted camera 31 with respect to the transport path 60. In the same manner as in the second embodiment, the subsequent posture deviation detection of the bonding head 23 with respect to the mounted camera 31 is performed.

Even in the third embodiment, the same effects as those of the first embodiment can be achieved.

Next, a fourth embodiment of the present invention will be described. The fourth embodiment is a second embodiment of a preferred die bonder of the present invention and will be described with reference to Fig. 11 . The die bonder 200 of the second embodiment differs from the first embodiment in that the device is not provided with the intermediate stage 22, and the bonding head 23 directly picks up the die D from the wafer (holding position) W. It is directly joined to the mounting position of the accessory platform 32.

In the second embodiment, the supply platform camera 11 that confirms the posture of the crystal grain D on the wafer W on the stage 12 is a pickup camera. That is, the mounting unit is configured to include a camera 31, a bonding head 23, and a supply platform camera 11 in addition to the transport path 60.

In the second embodiment, the embodiment 1 can be applied by providing the supply platform camera 11 as the intermediate stage camera 21 of the first embodiment and the supply platform 12 as the intermediate stage 22 of the first embodiment. 3.

Even in the fourth embodiment, the same effects as those of the first embodiment can be achieved.

Next, a fifth embodiment of the present invention will be described. Fifth implementation For example, a third embodiment of a preferred die bonder of the present invention. The third embodiment is a flip chip bonder. The flip chip bonder picks up the die D from the wafer W and reverses it for acceptance, and has a pickup head 13 that can rotate in a plane parallel to the mounting face 32m having the mounting position, the bonding head 23, The position (holding position) after the die D is reversed by the pickup head 13 is sucked and held by the die D to be bonded to the mounting position. The reversed position corresponds to the intermediate stage 22 of the first embodiment. The other configuration is the same as that of the first embodiment of the die bonder. Therefore, Embodiments 1 to 3 can be applied to the present embodiment 3 of the die bonder.

Even in the fifth embodiment, the same effects as those of the first embodiment can be achieved.

23‧‧‧ Bonding head

31‧‧‧Installing the camera

60‧‧‧Transfer path

BM‧‧ head reference mark

HM1‧‧‧Transportation benchmark mark

Claims (12)

A bonding apparatus includes: a pickup imaging device having a first imaging field of view; a placement position imaging means having a second imaging field of view capable of capturing a position at which a die is placed; and a die transfer tool for picking up the first image The crystal grains in the imaging field of view are placed on the mounting position in the second imaging field of view, and when the crystal grain is picked up, the reference mark is provided at a position where the image can be captured in the first imaging field of view. When the crystal grain is placed on the mounting position, a reference mark is provided at a position where the image can be captured in the second imaging field of view; and the first image is imaged by the pick-up imaging means. a predetermined crystal grain held by the transfer tool; and the second image, wherein the reference image included in the die transfer tool for holding the die is imaged by the pick-up imaging means; and the third image is Positioning means for capturing a substrate to be placed by the die transfer tool; and fourth image capturing and holding the die by the placement position imaging means The reference mark provided in the die transfer tool and the correction means correct the placement of the crystal grains held by the die transfer tool based on the first, second, third, and fourth images. For example, the joint device of claim 1 of the patent scope, wherein The pickup imaging means is an imaging means for capturing the first image and the second image at the same position. The bonding apparatus according to claim 1, wherein the placement position imaging means is an imaging means for capturing the third image and the fourth image at the same position. The bonding apparatus according to any one of claims 1 to 3, wherein the correction means is based on a position or a direction of a crystal grain in the first image and a reference mark in the second image The relationship between the position or the direction is corrected from the position or direction of the reference mark in the third image. The joining device according to any one of claims 1 to 3, wherein the reference mark is imaged by the pick-up imaging means or the mounting position via an optical system provided in the transfer tool A reference mark for shooting. The joining device according to any one of claims 1 to 3, further comprising: a pick-up means for reversing the crystal grain, and rotatable in a plane parallel to the mounting surface having the mounting position; The above correction means is corrected by the above-described pickup means. A joining method comprising: a first step of picking up an image capturing means for photographing a predetermined crystal grain held by a die transfer tool; In the second step, the pick-up imaging means captures a reference mark provided in the die transfer tool holding the die; and in the third step, the placement position imaging means images a predetermined substrate on which the die is placed; In the fourth step, the placement position imaging means captures the reference mark included in the die transfer tool holding the die; and corrects the above according to the first, the second, the third, and the fourth step. The step of placing the die held by the die transfer tool. The joining method of the seventh aspect of the invention, wherein the pick-up imaging means performs the photographing at the same position by the first step and the second step. The joining method of the seventh aspect of the invention, wherein the mounting position imaging means performs the same position at the same position as the third step and the fourth step. The bonding method according to any one of claims 7 to 9, wherein the step of correcting is based on a position or a direction of the crystal grain captured in the first step and a reference to the reference in the second step. The position or direction of the mark, the position or direction of the substrate captured in the third step, and the position or direction of the reference mark captured in the fourth step are corrected. The joining method according to any one of claims 7 to 9, wherein the second step or the third step is provided The optical system of the transfer tool described above is a step of photographing the aforementioned reference mark. The joining method according to any one of claims 7 to 9, wherein the step of modifying the film is reversed and can be parallel to the mounting surface having the mounting position. The step of correcting the internal rotation to perform the correction.