TW201813492A - Mounting method and mounting device of electronic part capable of mounting an electronic part to a mounting position of a mounting substrate in a short time with high precision - Google Patents

Abstract

The present invention provides an electronic part mounting method and device, capable of heating a mounting substrate while mounting the electronic part, and completing position correction in a short time with high degree of precision so as to mount the electronic part to the mounting substrate. The present invention includes: a mounting head, for holding the electronic part and mounting the electronic part to a mounting position of the mounting substrate; a stage opposite to the mounting head and capable of sucking the mounting substrate and the calibration substrate, respectively; a driving mechanism for driving the mounting head or the stage to relatively move in a transverse direction that intersects a vertical direction; a plurality of cameras capable of simultaneously shooting images of a region of the calibration substrate sucked by the stage body, the region at least comprising a position corresponding to the same mounting position. The mounting device further includes an image processing device, which is configured to calculate a correction amount of the mounting position of the electronic part according to the information of the positions corresponding to the mounting positions of the plurality of images simultaneously shot by the plurality of cameras, and to mount the electronic part to the mounting position of the mounting substrate according to the correction amount.

Description

Method and device for mounting electronic parts

FIELD OF THE INVENTION The present invention relates to a mounting method and a mounting device for an electronic part while mounting the electronic part while correcting a mounting position of the electronic part.

BACKGROUND OF THE INVENTION In recent years, with the progress of miniaturization and high performance of electronic devices typified by smart phones or tablet terminals, high-density and electrode terminals of electronic components typified by semiconductor devices used in these terminals have been developed. The trend of multi-pinning and narrower spacing has gradually accelerated. Therefore, in a mounting apparatus for mounting electronic components on a substrate, it is required to mount on a substrate with high accuracy. In general, in order to mount electronic components on a substrate with high accuracy, a mounting device for electronic components is provided with a camera for substrate identification. The camera is used to detect the position of the substrate by photographing the substrate, and based on the position detection results, Alignment when mounting parts. However, the position of the optical system coordinates of the substrate identification camera is not necessarily the position shown on the control data. For example, a positional shift occurs due to an error in a moving mechanism such as a ball screw that moves the camera, or a difference in thermal expansion amount due to a temperature difference at each position in the mounting area. For this reason, there is known a device having a function capable of performing so-called calibration (for example, refer to Patent Document 1), and can obtain a position shift amount peculiar to each position in a mounting area that is an object for mounting electronic components. . 7A and 7B are explanatory diagrams of calibration in a mounting method of an electronic component proposed in Patent Document 1. FIG. A method of calibrating the mounting position will be described with reference to FIGS. 7A and 7B. FIG. 7A is a plan view of a mounting device for an electronic component having a calibration function. The electronic component mounting device of Patent Document 1 includes a component supply unit 105 and a substrate transfer unit 102. A mounting head 103 is disposed above the substrate transfer unit 102, and a camera 104 integrated with and adjacent to the mounting head 103 is mounted. The head 103 is integrated with the camera 104 and moves above the calibration substrate 101 via an X drive shaft 106 and a Y drive shaft 107. An identification mark is formed on the calibration substrate 101 at a position of the measurement point Pi at a predetermined interval in a grid pattern and fixed at an arbitrary position on the substrate transfer unit 102. Next, the X driving shaft 106 and the Y driving shaft 107 are driven to move the camera 104 to the position where the measurement points Pi of the calibration substrate 101 can be recognized one by one, and the identification marks of each measurement point Pi are captured and identified one by one. FIG. 7B is an explanatory diagram showing a position shift amount between the control data of the measurement point Pi and the recognition by the camera 104. When the camera 104 moves to the position of the measurement point Pi, although it is controlled in the control data to move to the position of the origin O of the optical coordinate system, according to the recognition result of the camera 104, the measurement point Pi is at the coordinate (Δxi, Δyi). By using this position shift amount (Δxi, Δyi) as the position error peculiar to each measurement point Pi and obtaining the position errors of all measurement points, the calibration data of the entire calibration substrate 101 can be obtained. According to the method described in Patent Document 1, it is considered that the electronic component can be mounted on the substrate with high accuracy by correcting the position and mounting based on the calibration data of the entire substrate. Prior Art Literature Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2002-9495

Summary of the Invention The problem to be solved by the invention In order to maintain the high-precision mounting of electronic parts in the steps after mounting, it is necessary to use, for example, die attach film, die attach paste, and anisotropy A thermosetting material such as a conductive adhesive or a non-conductive adhesive is mounted while heating the substrate to ensure sufficient bonding strength. However, when the substrate is heated, since the temperature distribution in the adsorption stage of the fixed substrate is uneven, the stage body and the mechanism parts near the stage body each undergo uneven thermal expansion. Also, for example, due to the arrangement of the suction grooves of the suction stage, the substrate near the suction grooves will shrink, and the substrate without the suction grooves will swell, and the amount of deformation of the substrates will become uneven. In particular, when a substrate is heated to a high temperature using a large substrate, these tendencies are clearly visible. Therefore, even if the calibration is performed by the method of Patent Document 1 at normal temperature, and the thermal expansion coefficient obtained by multiplying the thermal expansion coefficient of the substrate by the temperature difference during mounting is used to perform position correction, when mounting while heating, when After cooling to normal temperature, there is still a problem that a position shift amount shifted from a predetermined mounting position becomes large. In addition, if the calibration is performed by the method of Patent Document 1 while the stage is being heated, the gap in the axial direction of the ball screw driving the camera or the stage is not uniform due to thermal expansion, so the stopping position of the camera or the stage may be unstable. , The problem that the position error of each measurement point becomes large. Furthermore, in order to improve the accuracy of the measurement, it is necessary to slow down the respective operating speeds of the X drive shaft 106 and the Y drive shaft 107 and perform the measurement with the vibration of each drive shaft calmed down. Therefore, it may take too much time to calibrate the entire substrate. It is difficult to apply the problem at the production site. Moreover, even in order to eliminate the error caused by the driving of the camera or the table, the image using the calibration substrate 101 can enter the high-resolution and high-resolution camera 104 in the entire field of view, so that the camera 104 moves to When the entire position of the image of the calibration substrate 101 can be taken to capture an image and the coordinates of the measurement points can be calculated from the image, it is also necessary to arrange the calibration substrate 101 with respect to the optical axis of the camera 104 in a completely vertical direction. difficult. The calibration substrate 101 is inclined at an arbitrary angle with respect to the optical axis of the camera 104, and the inclination is greatly changed by heating of the table body. However, in the case where one camera 104 captures images of the calibration substrate 101 at normal temperature and during heating, the displacement of each measurement point Pi cannot be distinguished because the optical axis of the camera 104 and the tilt of the heated calibration substrate 101 are different. It is generated due to thermal deformation of the calibration substrate 101 itself. Therefore, when position correction is performed based on the displacement of each measurement point Pi in the image with the difference between normal temperature and heating time, there is a problem that the position error of each measurement point Pi becomes considerably large. Therefore, due to various factors as described above, when an electronic component is mounted while heating the substrate, a positional deviation error becomes large, and it cannot be mounted with high accuracy, and calibration cannot be performed in a short time. The present invention has been made in view of the foregoing problems, and an object thereof is to provide an electronic component mounting method and a mounting device, which can greatly reduce positional deviation errors and mount with high accuracy even when electronic components are mounted while heating a substrate. , And can be calibrated in a short time. Means to solve the problem

In order to achieve the foregoing object, a method for mounting electronic parts of the present invention is to use a calibration substrate to calculate correction data of a mounting position of the electronic part, and to place the electronic part on the mounting position according to the correction data. An installation method for mounting on a mounting substrate heated to a mounting temperature, and heating or cooling the mounting substrate on which the electronic components are mounted to a guaranteed temperature, the correction data of the mounting position is obtained by the following steps: The substrate is adsorbed on the table body, and the plurality of cameras simultaneously take images of the area of the calibration substrate including at least the corresponding position of the same mounting position, and then based on the information of the corresponding position of the mounting position in the foregoing area, The plurality of images captured by the camera at the same time calculate the correction amount of the aforementioned mounting position. Furthermore, another aspect of the present invention is a mounting device for an electronic component, which includes: a mounting head having a function of holding the electronic component and mounting the mounting position on a mounting substrate; a table body disposed to face the mounting head, and It can absorb the mounting substrate and the calibration substrate separately; the driving mechanism moves the mounting head or the table relative to the transverse direction crossing the vertical direction; and a plurality of cameras, the resolution, magnification and focal length are all the same, and relative The above-mentioned table is arranged at the same height, and an image of an area corresponding to at least the same mounting position of the calibration substrate adsorbed by the table can be taken at the same time, and the mounting device of the electronic component has image processing The device calculates the correction amount of the mounting position of the electronic component corresponding to the mounting position from the information of the mounting position corresponding to the plurality of images captured by the plurality of cameras simultaneously, and according to the calculated mounting Position correction amount to mount the electronic parts held by the mounting head to the front The mounting position of the table body is adsorbed on the mounting substrate. Invention effect

According to the aforementioned aspect of the present invention, even when mounting while heating the substrate, it is not necessary to recognize the identification mark of the mounting substrate every time, which can greatly reduce the positional deviation error and mount with very high accuracy, and Position correction can be performed in a short time.

Embodiments for Carrying Out the Invention Embodiments of the present invention will be described below with reference to the drawings. (Embodiment) FIG. 1 is a schematic configuration diagram showing a configuration of an electronic component mounting apparatus in an embodiment of the present invention. The electronic component mounting device of the present invention shown in FIG. 1 includes at least a mounting head 3, a table body 2, a driving mechanism 8, a camera 4, and an image processing device 5. In addition, in FIG. 1, the mounting device includes a supply unit 31 of the electronic component 7. In this mounting device, the correction data of the mounting position of the electronic component 7 is calculated using the calibration substrate 1, and the electronic component 7 is mounted on the mounting substrate heated to the mounting temperature T ₂ at the mounting position based on the correction data. 32, and is attached to the electronic component mounting board 7 32 heated or cooled to ensure that the temperature T _1. The mounting head 3 has a function of holding (for example, adsorbing) the electronic component 7 from the supply unit 31 of the electronic component 7 and mounting the electronic component 7 on the mounting substrate 32 (see FIG. 6A) after heating and pressing. As an example, the mounting head 3 can move in the X and Z directions, and the table body 2 can move in the X and Y directions. The table body 2 is provided so as to be opposed to the mounting head 3, and can mount and adsorb the calibration substrate 1 and the mounting substrate 32 respectively. Here, a pattern is provided on the surface of the calibration substrate 1 in advance, and the calibration substrate 1 having the pattern is placed on the stage 2 and placed thereon. The table body 2 is provided with a substrate fixing function performed by any method of vacuum adsorption, mechanical fixing, or electrostatic adsorption. The pattern is formed by, for example, plating, sputtering, vapor deposition, ink, or spray, and a regular pattern or an irregular pattern can be used. The driving mechanism 8 causes the mounting head 3 to independently move with respect to the plane surface of the table body 2 in a direction along the surface and in a vertical direction orthogonal to the surface. As an example, although the driving mechanism 8 allows the mounting head 3 to move in the X and Z directions, it is not limited to this. The driving mechanism 8 may also move the mounting head 3 in the Y and Z directions, or The mounting head 3 may be moved in the X direction, the Y direction, and the Z direction. Instead of driving the mounting head 3, the driving mechanism 8 may be configured to move the table body 2 in a direction along the surface, in other words, to move in a lateral direction crossing the vertical direction. The camera 4 functions as a pair of image capturing devices composed of a first camera 4a and a second camera 4b. The first camera 4a and the second camera 4b simultaneously capture images of an area of the calibration substrate 1 adsorbed by the stage 2 including at least the same mounting position. The first camera 4a and the second camera 4b of the mounting device are respectively disposed at positions where the entire calibration substrate 1 can be photographed at the same time, and are at the same height relative to the calibration substrate 1 above the calibration substrate 1 and present with respect to the surface of the table body. different angles. Here, the first camera 4a and the second camera 4b are imaging elements such as CCD or CMOS, which use lenses of the same magnification and the same focal length and use the same resolution. An image of the pattern of the calibration substrate 1 is captured by the pair of cameras 4 at the same time, that is, an image including at least an area corresponding to the same mounting position. The image processing device 5 has a function of converting information of an image captured by the camera 4 into position coordinates corresponding to the mounting position. The image processing device 5 performs image processing on two images captured by a pair of cameras 4 at the same time, and converts any point on the calibration substrate 1 (for example, corresponding to the mounting position) into X, Y, and Z coordinates. And finally get the correction amount of the installation position. Here, since the arbitrary point Gi on the calibration substrate 1 is captured by the two first cameras 4a and the second camera 4b at the same time, the position coordinates of the arbitrary point Gi can be calculated from the following angles and distances. The angle is from The angle formed between the straight line of the first camera 4a and the second camera 4b toward the arbitrary point (for example, the corresponding position of the mounting position) Gi and the surface of the table body, and the distance is the first camera 4a and the second camera 4b distance (distance on a plane parallel to the surface of the table). Here, i of the arbitrary point Gi is an integer of 1 or more, and is an integer of less than the total number of arbitrary points of the calibration substrate 1. With this method, based on the image information captured by the first camera 4a and the second camera 4b on the calibration substrate 1, the position coordinates can be calculated by the image processing device 5 with high accuracy. In addition, if the shooting time points are not the same, but the two first and second cameras 4a, 4b are deviated in time, the calculated position may be caused by the vibration, shake, or temperature change of the calibration substrate 1. The deviation becomes larger. In contrast, by simultaneously shooting with two first and second cameras 4a and 4b, the aforementioned deviation can be eliminated and the position can be calculated with high accuracy. According to this embodiment, the first and second cameras 4a and 4b can be installed obliquely with respect to the calibration substrate 1. The degree of freedom in arranging the two first and second cameras 4a and 4b in a limited space of the mounting device increases, and There is also an effect that the design of the mounting device becomes easy. The correction data of the mounting position used in the mounting method in the embodiment of the present invention is a method in which the calibration substrate 1 is adsorbed on the stage 2 and a plurality of cameras 4a and 4b are used to simultaneously capture at least the same mounting of the calibration substrate 1 G at the position corresponding to the image region 43 _i, G _i and the information corresponding to the region 43 in accordance with the mounting position, from a plurality of cameras 4a, 4b while a plurality of captured images by the calculated mounting position correction amount. This will be described in detail below. FIG. 2 is an explanatory diagram showing a method of calculating a correction amount of a mounting position in the embodiment of the present invention. Carried out for at mounting temperature T ₂ while correcting the mounting position while the electronic component 7 is mounted to the mounting substrate 32, so that T ₂ lower than the mounting temperature to ensure temperature T _1, the distance 7 between the electronic component can be a method regular intervals Instructions. Hereinafter, a description is given of a case where the intervals between the electronic components 7 at the guaranteed temperature T ₁ are Px and Py in the X direction and the Y direction, respectively. First, to ensure that the temperature T ₁ by the first camera 4a and the camera 4b 2 simultaneously photographing the image of the entire calibration substrate 1, in the image processing device 5, the camera calibration of the first substrate 4a of the one shot The image is divided into a grid shape at intervals of Px and Py in the X direction and the Y direction, respectively. Next, in the image processing device 5, the images captured simultaneously by the second camera 4b are processed by, for example, pattern matching to detect the area in the vicinity of the vertex among all the vertices of the grid 42 in the first camera 4a. An image equivalent to the image (for example, as described later with reference to FIG. 3A and the like, an image of an area having similar patterns to each other). Then, from the image captured by the second camera 4b, the vertices of the vertices of the grid 42 equivalent to the image captured by the first camera 4a in the X direction and the Y direction at intervals of Px and Py are calculated coordinate. At all the vertices of the grid, the absolute coordinates are calculated by the image processing device 5 based on the coordinates calculated by the first camera 4a and the second camera 4b. Here, the position of the center of gravity of the quadrilateral A ₁ B ₁ C ₁ D ₁ surrounded by the vertices A ₁ , B ₁ , C ₁ , and D _{1 of} the lattice is set to a point G _i1 . Here, as an example, each gravity center position corresponds to a mounting position corresponding to a mounting position of the mounting substrate 32. Next, at the mounting temperature T ₂ , the first camera 4 a and the second camera 4 b simultaneously take an image of the entire calibration substrate 1 at the same time as the guaranteed temperature T ₁ , and then the image is processed by the image processing device 5. Image processing, and the image processing device 5 converts the vertices of the grid into absolute coordinates. In the image processing device 5, a quadrangular A ₁ B ₁ C ₁ D ₁ at a guaranteed temperature T ₁ is captured by an image processing method such as a luminance distribution analysis to deform to a quadrangular A ₂ B ₂ C at a mounting temperature T ₂ after ₂ D _2, is calculated quadrangle a ₂ B ₂ C ₂ D ₂ position of the center of gravity Gi _2. In the image processing apparatus 5, the difference between the center of gravity position G _{i2 at the} mounting temperature T ₂ and the center of gravity position G _{i1 at} the guaranteed temperature T ₁ becomes a correction amount corresponding to the mounting position, in other words, on the mounting substrate 32 The correction amount of the installation position. In this way, the image processing device 5 can be used to calculate the position correction amount. Therefore, the electronic component 7 such as a semiconductor element is mounted on a mounting substrate 32 such as a circle or a rectangle at a mounting temperature T ₂ such that the electronic components 7 are arranged in a grid pattern at intervals of Px and Py in the X and Y directions, respectively. Next, the position obtained by adding the above-mentioned position correction amount to the position of the center of gravity of the grid-shaped quadrangle may be mounted as the mounting position. When the mounting substrate 32 is returned from the mounting temperature T ₂ to the guaranteed temperature T ₁ after the mounting, the distances between the centers of the electronic components 7 will be at equal intervals in the X direction and the Y direction with Px and Py, respectively. According to this mounting method, the deformation amount of the calibration substrate 1 at the mounting temperature T ₂ is calculated at all mounting positions, so the electronic components 7 can be mounted on the mounting substrate 32 at equal intervals. The calculation of the correction amount in FIG. 2 will be described specifically with respect to an example applied to the calibration substrate 1. FIG. 3A is a plan view showing an example of a pattern of the calibration substrate 1 in the embodiment of the present invention. Calibration quadrangular substrate A ₁ B ₁ C ₁ 1 D 1 on a vertex near the A _1, as an example of an irregular pattern is formed with a pattern of speckle patterns 40. First, at a guaranteed temperature T ₁ , the first camera 4 a and the second camera 4 b shoot at the same time. As shown in FIGS. 3B and 3C, images near the vertex A ₁ are observed. In FIG. 3B, the image processing device 5 calculates the position of the center of gravity of the pattern of the area 43 surrounded by the solid line frame 41 in FIG. 3B as A _1a . Here, the area 43 surrounded by the frame 41 is an area including the center of gravity position A _1a as an example of the mounting position correspondence. Next, in FIG. 3C, the image processing device 5 detects the pattern of the spot pattern equivalent to the pattern of the spot pattern of the area 43 surrounded by the solid line frame 41 in FIG. 3B by pattern matching and the like, and performs image processing. The device 5 calculates the position of its center of gravity as A _1b . At the mounting temperature T ₂ of these patterns, when the calibration substrate 1 itself is deformed due to heating or adsorption fixation, the pattern on the surface thereof will also be deformed as the calibration substrate 1 itself deforms. Next, at the mounting temperature T ₂ , the first camera 4 a and the second camera 4 b shoot at the same time, and as shown in FIGS. 3D and 3E, images near the vertex A ₁ are observed. Here, the pattern of the area 43 surrounded by the solid line frame 41 in FIGS. 3B and 3C is moved to the area 43 surrounded by the solid line frame 41 in FIGS. 3D and 3E, respectively. The positions of the centers of gravity have changed from A _1a and A _1b to A _2a and A _{2b, respectively} . Although it seems that the two first and second cameras 4a and 4b are respectively displaced in different directions, it is because the coordinates of the first and second cameras 4a and 4b from the center of gravity positions A _1a , A _1b , A _2a , A _2b , and The distances between the first camera 4a and the second camera 4b, and the angle formed between the first camera 4a and the second camera 4b toward the calibration substrate 1 and the surface of the table 2 are used to calculate the vertices A ₁ , A ₂ And the image processing device 5 derives the difference as the displacement amount (ΔX, ΔY) of the vertex A _1. Therefore, the image processing device 5 can be used to calculate the displacement amount (the correction amount of the position coordinate) with high accuracy. ). As with vertex A ₁ , by analyzing all the vertices of the grid on the calibration substrate 1 with the image processing device 5, the image processing device 5 can be used to derive the displacement amount of the coordinates of each vertex (the correction amount of the position coordinates). ). In addition, although the case where the digital image correlation method is used in the image processing apparatus 5 has been described, it is not limited to this method. The image processing device 5 may use a general image analysis method. FIG. 4 is a flowchart showing a procedure of a method for calculating a correction amount of an installation position in the embodiment of the present invention. FIG. 5 is a time chart showing a method of calculating a correction amount of a mounting position in the embodiment of the present invention. FIG. 6A is a schematic configuration diagram showing a configuration of an electronic component mounting device in the embodiment. FIG. A method of calculating the mounting correction amount will be described with reference to FIGS. 1, 4, 5, and 6A. First, in step S1, a calibration substrate 1 stored in a substrate storage unit (not shown) is taken out of the substrate storage unit by a transfer jig (not shown) and placed on the stage 2. Here, the vacuum suction of the calibration substrate 1 by the stage 2 is not performed. The calibration substrate 1 is made of, for example, silicon, glass, stainless steel, or copper. The external dimensions of the calibration substrate 1 are, for example, 200 mm × 200 mm to 600 mm × 600 mm, and a pattern such as a spot shape is formed on the surface of the calibration substrate 1. Next, in step S2, the temperature of the substrate 1 becomes the calibration ensuring the temperature T ₁ of time T11 by the first camera 4a and the camera 4b 2 simultaneously photographing a calibration image of the entire substrate 1 C _11A, C _11B. Here, the guaranteed temperature T _{1 is,} for example, 25 ° C. Thereafter, in step S3, the table body 2 is heated at least to the installation temperature after T _2, open (ON) coupled to the table body of more than two grooves 2a vacuum suction means 10, the table body 2 so that a suction calibration substrate, The calibration substrate 1 is fixed on the table body 2. Next, in step S4, the substrate temperature is calibrated at installation temperature T ₂ the time T21 by the first camera 4a and the camera 4b 2 simultaneously photographing a calibration image of the entire substrate 1 C _21A, C _21B. The data of the images captured in steps S2 and S4 are loaded into the image processing device 5. Each image captured simultaneously by the first camera 4a and the second camera 4b may include at least an image including a region corresponding to the same mounting position. After that, in step S5, the calibration substrate 1 is removed from the stage body 2 and stored in the substrate storage unit. After repeating the same steps as step S3 and step S4, in step S8, as in step S1, the calibration substrate 1 stored in the substrate storage unit is removed from the substrate storage unit by the transfer jig and mounted on the stage. After 2 turns on, steps S3 to S5 are performed. For example, when step S3 and step S4 are performed twice, at times t22 and t23, the first camera 4a and the second camera 4b are used to simultaneously capture images C _22A , C _22B , and C _{23A of the} entire calibration substrate 1, respectively. After C _23B , these images are loaded into the image processing device 5. Here, the mounting temperature T _{2 is,} for example, 150 ° C. Next, in step S6, the images C _11A and C _11B , the images C _21A and C _21Bl , the images C _22A and C _22B , and the images C _23A and C _{23B are} converted into the grid 42 by the image processing device 5. After the apex coordinates of, the position coordinates (X _1Gi , Y _1Gi ) of the installation temperature corresponding to the guaranteed temperature T ₁ and time t11 are derived by the image processing device 5 according to the above-mentioned calculation method of the center of gravity position, and the installation temperature T ₂ and Position coordinates (X _2Gi1 , Y _2Gi1 ), (X _2Gi2 , Y _2Gi2 ), (X _2Gi3 , Y _2Gi3 ) at the positions corresponding to the installation positions at times t21, t22, and t23. Furthermore, in the image processing device 5, the position coordinates (X _2Gi1 , Y _2Gi1 ), (X _2Gi2 , Y _2Gi2 ), and (X _2Gi3 , Y _2Gi3 ) corresponding to the mounting positions are averaged as the mounting temperature T Position coordinates (X _2Gi , Y _2Gi ) corresponding to the mounting position under ₂ . Further, in step S7, the position coordinates (X _1Gi , Y _1Gi) corresponding to the mounting position at the guaranteed temperature T ₁ are subtracted from the position coordinates (X _2Gi , Y _2Gi ) at the mounting position corresponding to the mounting temperature T ₂ ), And the image processing device 5 calculates a position correction amount (Δxi, Δyi) corresponding to each mounting position. The above is the method of deriving the position correction amount by the image processing device 5. Moreover, in the said embodiment, although the example which showed 1 time at the guaranteed temperature T ₁ and 3 times at the mounting temperature T ₂ was shown, it is not limited to this. When the installation temperature T ₂ is once, the position correction amount can be derived in a short time. In addition, by repeating the adsorption and removal of the calibration substrate 1 and increasing the number of times the image is loaded, the position correction accuracy is further improved. Moreover, although the method of adsorbing the calibration substrate 1 with a transport jig using a substrate storage unit has been described, the calibration substrate 1 is not limited to this. Even if the calibration substrate 1 is manually removed from the stage 2 and placed on the stage 2, the same effect can be obtained. Not only when the mounting substrate 32 is heated, the mounting substrate 32 may be bent. When the mounting substrate 32 is attracted to the stage 2 in the mounting step, the adsorption position may be deviated. Therefore, the mounting substrate 32 is mounted each time the substrate is mounted and adsorbed. The deformation will be biased. By repeatedly calibrating the adsorption and removal of the substrate 1 and loading the image multiple times, the average value of the position deviations corresponding to the mounting position can be calculated, and the effect of improving the accuracy of the position correction can be improved. In addition, when the temperature of the guaranteed temperature T ₁ or the mounting temperature T ₂ is high, the air near the calibration substrate will be heated due to radiant heat and cause a temperature deviation of the air. When the image is loaded by the camera 4, the air will be like a heat wave It shakes like a camera and distorts the image. In this case, load the image multiple times and average it. With this configuration, even if the calibration substrate 1 is at a high temperature, a high position correction accuracy can be ensured. Next, a method of mounting the electronic component on the mounting substrate 32 will be described using the aforementioned method of deriving the position correction amount. At the time of installation, the design coordinates (x _i , y _i ) of each installation position at the installation temperature T ₂ are added to the position correction amount (Δx _i , Δy) obtained by the image processing device 5 in the above-mentioned method. _{The position} of the coordinates (x _i + Δx _i , y _i + Δy _i ) after _i ), when returning to the guaranteed temperature T ₁ , the coordinates of each mounting position will become (x _i , y _i ). As an example, a description will be given based on a specific embodiment. For mounting a semiconductor element of an electronic component 7 on a circular mounting substrate 32 made of glass with an outer dimension of 300 mm in diameter, a thickness of 0.7 mm, a linear expansion coefficient of 8 ppm / ° C (that is, μm / ° C / m), and glass The situation is explained. The semiconductor elements are 10 mm × 10 mm and the thickness is 0.3 mm. The mounting pitch between the designed semiconductor elements is 15 mm. With the first camera 4a and the second camera 4b each having 5 million pixels, the adsorption of the table body 2 is stopped (OFF) at 30 ° C and the adsorption of the table body 2 is started (ON) at 150 ° C. Next, the changes in the pattern on the calibration substrate 1 are captured at the same time. According to the image analysis of the image processing device 5, it is found that a maximum positional displacement of 130 to 160 μm occurs at 30 ° C. and 150 ° C. The image processing device 5 is used for image processing to determine the position correction amount in the 15 mm-pitch mounting position. At the position where the position correction amount is added, the mounting device shown in FIG. 6A is used to heat the position. Alternatively, the mounting substrate 32 is cooled and maintained at 150 ° C. for mounting. After that, the mounting substrate 32 is removed from the stage body 2 and the position shift amount of the design value for the mounting position of the electronic component is measured with a measuring microscope at 30 ° C. As a result, it was confirmed that the displacement amount of the mounting position within 200 points with respect to the mounting position fell within ± 3 μm in both the x and y directions. In addition, two first and second cameras 4a and 4b were used to capture one frame at 30 ° C and three frames at 150 ° C. Each frame can be captured within a short time of less than 10ms. . In the above embodiment, the case where the camera 4 is configured by the two cameras 4a and 4b has been described, but it is not limited to this. It is also possible to use three or more cameras 4. For example, FIG. 6B is a schematic configuration diagram showing a configuration of an electronic component mounting apparatus in a modification of the embodiment of the present invention. The point different from the mounting device of FIG. 1 is that the camera 4 is composed of three cameras, namely a first camera to a third camera 4a, 4b, and 4c. The obstacle 6 is constituted by, for example, a pillar or a partition wall. The point Gia, which is an example of the position corresponding to the mounting position on the calibration substrate 1, is captured by the first camera 4a and the second camera 4b simultaneously. Although the point Gib, which is another example of the position corresponding to the mounting position on the calibration substrate 1, is blocked by the obstacle 6 and cannot be captured from the first camera 4a, it can be captured simultaneously from the positions of the second camera 4b and the third camera 4c. By using the third camera 4c to compensate for the area that cannot be captured by the first camera 4a and the second camera 4b, the correction amount of the mounting position of the entire calibration substrate 1 can be calculated, and the entire calibration substrate 1 can be accurately adjusted. To install. In particular, there is an effect that it can be applied to a larger mounting substrate 32 than in the case of the mounting device of FIG. 1. As described above, according to the embodiment of the present invention, when the electronic component 7 is mounted while the mounting substrate 32 is heated, even if the identification mark is not set on the mounting substrate 32, the position deviation error can be greatly reduced, and very high accuracy can be exhibited. Moreover, the position correction (calibration) can be completed in a short time, and it can be mounted on the mounting substrate 32 with high accuracy. In addition, the present invention is not limited to the aforementioned embodiments, and can be implemented in various other aspects. For example, the irregular pattern is not limited to spots, and may be an irregular pattern such as an arbitrary shape, pattern, or pattern. In the case of an arbitrary irregular pattern, there is an advantage that the corresponding position of the installation position can be calculated from any place. Instead of an irregular pattern, a regular pattern such as an arbitrary shape, pattern, or pattern may be used. Furthermore, any one of the above-mentioned various embodiments or modifications can be appropriately combined to achieve the respective effects. In addition, combinations of the embodiments or combinations of the embodiments or combinations of the embodiments and the embodiments are possible, and combinations of features in different embodiments or embodiments are also possible. Industrial availability

The mounting method and mounting device of the aforementioned electronic parts of the present invention have the effect of mounting the electronic parts with very high precision while heating the substrate, and can perform calibration in a short time. In high-speed large-capacity memory, It is particularly useful in mounting methods and mounting devices for semiconductor components such as application processors, CPUs, or high-frequency communication modules.

1.101‧‧‧calibration substrate

2‧‧‧ Taiwan body

2a‧‧‧Adsorption Ditch

3.103‧‧‧Mounting head

4, 104‧‧‧ camera

4a‧‧‧1st camera

4b‧‧‧ 2nd camera

4c‧‧‧3rd camera

5‧‧‧Image processing device

6‧‧‧ obstacles

7‧‧‧Electronic parts

8‧‧‧ Drive mechanism

10‧‧‧Vacuum adsorption device

31‧‧‧Supply Department

32‧‧‧Mounting base

40‧‧‧ pattern

41‧‧‧box

42‧‧‧ Grid

43‧‧‧area

102‧‧‧Substrate Transfer Department

105‧‧‧Parts Supply Department

106‧‧‧X drive shaft

107‧‧‧Y drive shaft

A ₁ , B ₁ , C ₁ , D ₁ , A ₂ , B ₂ , C ₂ , D ₂ ‧‧‧ vertices

G _i , G _ia , G _ib ‧‧‧ points

G _i1 , G _i2 , A _1a , A _1b , A _2a , A _2b ‧‧‧ position of the center of gravity

O‧‧‧ origin

Pi‧‧‧ measuring points

Px, Py‧‧‧ interval

S1 ~ S8‧‧‧ steps

T ₁ ‧‧‧ Guaranteed temperature

T ₂ ‧‧‧Installation temperature

t11, t21, t22, t23‧‧‧time

X, Y, Z‧‧‧ directions

FIG. 1 is a schematic configuration diagram showing a configuration of an electronic component mounting apparatus in an embodiment of the present invention. FIG. 2 is an explanatory diagram showing a method of calculating a correction amount of a mounting position in the embodiment of the present invention. 3A is a plan view showing an example of a pattern of a calibration substrate in the embodiment of the present invention. FIG. 3B is an enlarged plan view showing the pattern of the calibration substrate viewed by the first camera at the guaranteed temperature T ₁ in FIG. 3A. FIG. 3C is an enlarged plan view showing the pattern of the calibration substrate observed by the second camera at the guaranteed temperature T ₁ in FIG. 3A. FIG. 3D is an enlarged plan view showing the pattern of the calibration substrate viewed by the first camera at the mounting temperature T ₂ in FIG. 3A. FIG. 3E is an enlarged plan view showing the pattern of the alignment substrate viewed by the second camera at the mounting temperature T ₂ in FIG. 3A. FIG. 4 is a flowchart showing a procedure of a method for calculating a correction amount of an installation position in the embodiment of the present invention. FIG. 5 is a time chart showing a method of calculating a correction amount of a mounting position in the embodiment of the present invention. FIG. 6A is a schematic configuration diagram showing a configuration of an electronic component mounting device in an embodiment of the present invention. FIG. 6B is a schematic configuration diagram showing a configuration of an electronic component mounting apparatus in a modification of the embodiment of the present invention. FIG. 7A is an explanatory diagram of calibration in a conventional method of mounting electronic components. FIG. 7B is a more detailed illustration of the calibration of FIG. 7A.

Claims (3)

An electronic component mounting method uses a calibration substrate to calculate correction data of a mounting position of an electronic component, and mounts the electronic component on a mounting substrate heated to a mounting temperature at the mounting position according to the correction data. And an installation method for heating or cooling the mounting substrate on which the electronic components are mounted to a guaranteed temperature, the correction data of the mounting position is obtained by the following steps: the calibration substrate is adsorbed on a table body, and a plurality of The camera simultaneously captures an image of the area of the calibration substrate that includes at least the location corresponding to the same mounting position, and then calculates the foregoing based on the information corresponding to the location of the mounting position in the area, from the multiple images captured by the multiple cameras simultaneously Correction amount of installation position. For example, the mounting method of the electronic component of claim 1, wherein after the aforementioned calibration substrate is adsorbed, the aforementioned images are simultaneously captured by the aforementioned plurality of cameras, after the adsorption of the aforementioned calibration substrate is released and then re-adsorbed, the aforementioned plurality of cameras are simultaneously used to photograph the aforementioned The image is then based on the images captured by the plurality of cameras at the plurality of times to calculate the correction amount of the mounting position. An electronic component mounting device is provided with: a mounting head having a function of holding an electronic component and being mounted on a mounting position of a mounting substrate; a table body disposed opposite to the mounting head and capable of adsorbing the mounting substrate and calibration respectively A substrate; a driving mechanism that moves the mounting head or the table relative to each other in a transverse direction crossing the vertical direction; and a plurality of cameras with the same resolution, magnification, and focal length, and arranged at the same height relative to the table And at the same time, images of the area of the calibration substrate adsorbed by the table body including at least the corresponding mounting position can be taken at the same time, and the mounting device of the electronic component is provided with an image processing device, which simultaneously shoots from the plurality of cameras Based on the information of the corresponding positions of the mounting positions of the plurality of images, the correction amount of the mounting position of the electronic component corresponding to the mounting position is calculated. Based on the calculated correction amount of the mounting position, The electronic part held by the head is mounted to the safety device adsorbed by the table body. The mounting position of the substrate.