TW201641293A - Apparatus for manufacturing lamination device - Google Patents

Abstract

The abrasion of a first workpiece holding surface and a second workpiece holding surface with time is prevented, while the contact areas of the first workpiece holding surface and the second workpiece holding surface with respect to a workpiece are minimized. The present invention pertains to an apparatus for manufacturing a lamination device in which a pair of workpieces is held by a first holding member and a second holding member, respectively, and is positioned and laminated to each other by the relative approaching movements between the first holding member and the second holding member, wherein one of or both the first workpiece holding surface of the first holding member and the second workpiece holding surface of the second holding member are provided with a hard covering layer opposed to one of or both the pair of workpieces and having a front surface thereof formed in a concavo-convex shape by a material harder than those of the first holding member, the second holding member, and the pair of workpieces, and the hard covering layer has a plurality of supporting projections projecting from one of or both the first workpiece holding surface and the second workpiece holding surface toward one of or both the pair of workpieces in a chevron shape and brought into point-contact with one of or both smooth surfaces of the pair of workpieces.

Description

Manufacturing device for bonding equipment

The present invention relates to a flat panel display (FPD) or sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), a flexible display, or a touch panel type FPD. Or a 3D (3D) display or a liquid crystal module (LCM) such as an electronic book or a flexible printed circuit board (FPC), such as a touch panel or a protective glass or protective film or FPD. A manufacturing apparatus for a bonding apparatus such as a plate-like workpiece.

Conventionally, as a manufacturing apparatus of such a bonding apparatus, there is a substrate stacking device in which an upper substrate and a lower side are provided so as to be movable up and down along a through hole provided in the upper substrate holder and the lower substrate holder. When the lift pins of the substrate are transported under the atmospheric pressure, the lift pins that are vertically moved so as to protrude from the surfaces of the upper substrate holder and the lower substrate holder are individually received by the transfer robot arm and transported to the upper substrate. In the lower substrate, the lift pins are moved in the reverse direction, and the upper substrate and the lower substrate are respectively transferred to the surfaces of the upper substrate holder and the lower substrate holder (see, for example, Patent Document 1).

Then, the upper substrate holder is vacuum-sucked and received by the upper substrate, the lower substrate holder is held by the lower substrate, and the upper substrate holder and the lower substrate holder are moved closer to each other in the vacuum container. After the vacuum state is reached, the upper substrate and the lower substrate are positioned, and then overlapped and temporarily fixed. After the temporary fixing, the upper substrate holding member is released from the upper substrate, and the upper substrate holding member is moved away from the original Then, after the inside of the vacuum container becomes atmospheric pressure, one of the bonded substrates is transferred to the transfer robot arm by the lift pins and carried out.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-229471

However, in the manufacturing apparatus of the conventional bonding apparatus, the upper substrate holder is held by vacuum suction of the upper substrate by the adsorption port, and therefore a part of the substrate is bent and deformed toward the adsorption port to cause warpage. Therefore, the upper substrate and the lower substrate cannot be aligned with each other with high precision.

Further, the operation of peeling off the upper substrate from the substrate holding surface of the upper substrate holder is performed in a vacuum state in a state of absolute humidity (a state in which the humidity is almost 0%), so that the substrate is in contact with and peeled off from the substrate holding surface. Static electricity is accumulated in the substrate of the insulator, and the influence of the peeling electrification becomes extremely large. Further, since the peeling operation is performed in the sealed space in order to maintain the vacuum state, it is easy to use a Blow type ionizer or a photo-irradiation static eliminator (Photoionizer) unlike the peeling operation in the air. The stripping charge generated by the ground removal is actually a difficult condition.

As a result, arc discharge occurs in the conductive portion due to the electric charge generated by the stripping, and the electronic circuit or the like which is present on the bonding surface of the substrate causes disconnection or does not break, but has a problem of changing its characteristics due to static electricity.

After the substrate is bonded and returned to the atmospheric pressure, the pair of substrates are bonded from the substrate holding surface of the lower substrate holder by the lift pins, but since the interface between the substrate holding surface and the substrate is smoothly formed, Therefore, there is a case where the substrate holding surface is adhered to the interface of the substrate. In this case, if the lift pin is used, it will be attached to one of the substrates. When a part of the substrate is forcibly pushed away, the substrate holding surface and the substrate temporarily become in a vacuum state, and one of the bonded substrates is instantaneously pulled to the lower substrate holder and warped. Even if the substrate is bonded with high precision, if local warpage occurs at the time of peeling, there is a problem that the alignment accuracy is deteriorated and some products are defective.

Therefore, in order to solve such a problem, it is considered that the interface between the substrate holding surface and the substrate can be suppressed by forming the uneven portion on the substrate holding surface of the upper substrate holder and the lower substrate holder to reduce the contact area with the substrate. At the same time as static electricity, it is conceivable to prevent vacuum adhesion between the substrate holding surface and the substrate.

However, in this case, when the substrate holding surface of the upper substrate holder and the substrate holding surface of the lower substrate holder are formed of a metal such as aluminum which is softer than glass or tantalum as a material of the substrate, The friction generated when the substrate repeatedly contacts the substrate holding surface of the upper substrate holder and the lower substrate holder causes the convex portion to gradually wear over time, and finally the substrate becomes surface contact.

As a result, there is a problem that static electricity generated at the interface between the substrate holding surface and the substrate cannot be suppressed over a long period of time, and it is impossible to prevent vacuum adhesion between the substrate holding surface and the substrate.

In order to achieve such a problem, the manufacturing apparatus of the bonding apparatus of the present invention holds the pair of workpieces in the first holding member and the second holding member, respectively, and the first holding member and the second holding member move relatively close to each other. And the pair of workpieces are aligned, and one or both of the first workpiece holding surface of the first holding member or the second workpiece holding surface of the second holding member are provided with a hard coat layer. The hard coat layer faces one or both of the pair of workpieces, and the surface thereof is formed into a concavo-convex shape by a material harder than the materials of the first holding member, the second holding member, and the pair of workpieces, and the The hard coat layer protrudes in a mountain shape from one of the first workpiece holding surface or the second workpiece holding surface or the pair of workpieces in the bidirectional direction, and has one of the pair of workpieces. a plurality of support protrusions on a smooth surface or a smooth surface on both sides Start.

1‧‧‧1st holding member

1a‧‧‧1st workpiece holding surface

1b‧‧‧ outside the domain of the first workpiece holding surface 1a

1h‧‧‧through hole in the first holding member

2‧‧‧2nd holding member

2a‧‧‧2nd workpiece holding surface

2b‧‧‧ outside the domain of the second workpiece holding surface 2a

2h‧‧‧through hole in the second holding member 2

3‧‧‧ Keeping the chuck

4‧‧‧Contact separation drive unit

5‧‧‧ Positioning drive unit

6‧‧‧Control Department

7‧‧‧ peeling members

7a‧‧‧lifting pin

7b‧‧‧Removal slave

7c‧‧‧ peeling drive unit

12‧‧‧hard coating

12a‧‧‧Support protrusion

12b‧‧‧Intake tank

12c‧‧‧Mountain-like convex

12d‧‧‧ valley recess

12P‧‧‧ panel

12s‧‧‧ Space Department

31‧‧‧Adsorption chuck

31a‧‧‧Adsorption port

31b‧‧‧Airway

31c‧‧‧ Inhalation source

32‧‧‧Adhesive chuck

32a‧‧‧ Lifting Department

32b‧‧‧Adhesive

32c‧‧‧Adhesive follower

32d‧‧‧Adhesive drive unit

A‧‧‧ manufacturing equipment for bonding equipment

B‧‧‧Various pressure chamber

AP‧‧‧ atmosphere

DP‧‧‧ decompression atmosphere

W‧‧‧Fitting equipment

W1‧‧‧ workpiece (1st workpiece)

W2‧‧‧ workpiece (second workpiece)

W3‧‧‧ sealing material

1 is an explanatory view showing an overall configuration of a manufacturing apparatus of a bonding apparatus according to an embodiment of the present invention, and is a longitudinal cross-sectional front view before a workpiece is bonded in a workpiece bonding step.

Fig. 2 is a longitudinal sectional front view of the workpiece in the workpiece bonding process.

Fig. 3 is a longitudinal sectional front view of the workpiece bonding process after the workpiece is bonded.

Fig. 4 is a front view showing a reduced longitudinal section of the peeling and bonding apparatus in the workpiece bonding step.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

As shown in FIG. 1 to FIG. 4, the manufacturing apparatus A of the bonding apparatus W according to the embodiment of the present invention is a workpiece bonding apparatus in which one of the plates is formed to hold the workpieces W1 and W2 in the first holding. In the member 1 and the second holding member 2, the first holding member 1 and the second holding member 2 are moved relatively close to each other, and the pair of workpieces W1 and W2 are attached to the workpiece bonding apparatus with high precision alignment. It is preferable that the workpieces W1 and W2 are peeled off from the first holding member 1 and the second holding member 2 in one of the completed bonding.

As a specific example of the workpiece bonding apparatus, the first holding member 1 and the second holding member 2 are disposed to face each other inside the pressure changing chamber B, and the holding cards provided in the first holding member 1 and the second holding member 2 are used. The disk 3 receives the first workpiece W1 and the second workpiece W2 that are carried into the pressure change chamber B, respectively. Then, in the pressure-reducing chamber B that has been depressurized, one of the first holding member 1 or the second holding member 2 or the opposite direction in the two directions is relatively moved, and intersects with the opposing direction. After the orientation is relatively aligned, the first workpiece W1 and the second workpiece W2 are bonded (bonded) with high precision. Thereby, a bonding apparatus W having a sealed space inside is produced. Then, after the first workpiece W1 of the bonding apparatus W is peeled off from the first holding member 1, the pressure changing chamber B is returned to the atmospheric pressure to generate a pressure difference with the internal pressure of the sealing space of the bonding apparatus W, and the pressure difference is caused by the pressure difference. The bonding apparatus W is uniformly pressurized to a prescribed gap. Then, the completed bonding apparatus W is peeled off from the second holding member 2 and carried out to the outside of the pressure changing chamber B. good.

Further, as shown in FIGS. 1 to 4, the first workpiece W1 and the second workpiece W2 are normally arranged to face in the up-down direction, and the upper first workpiece W1 and the lower second workpiece W2 are attached below. The direction of the combination is called the "Z direction." Hereinafter, the direction along the first workpiece W1 and the second workpiece W2 that intersects the Z direction is referred to as "XY direction".

Specifically, the manufacturing apparatus A of the bonding apparatus W according to the embodiment of the present invention includes the following constituent elements as main components: the first holding member 1 and the second holding member 2 are disposed to face each other in the Z direction; The disk 3 is for detachably and detachably holding the pair of workpieces W1 and W2 on the first holding member 1 and the second holding member 2, and the contact separating drive unit 4 to make the first holding member 1 or the second One of the holding members 2 or the two-direction Z direction relatively moves, and the positioning drive unit 5 adjusts one of the first holding member 1 or the second holding member 2 or the two-direction XY direction and the XYθ direction. The movement unit and the control unit 6 are configured to perform actuation control of at least the holding chuck 3, the contact separating drive unit 4, the positioning driving unit 5, and the like.

Further, it is preferable to provide the peeling member 7 for peeling off one of the workpieces W1 and W2 from the second holding member 2 to complete the bonding.

In addition, as the holding chuck 3 to be described later, the suction chuck 31 is preferably held by the first workpiece W1 and held by the first workpiece holding surface 1a of the first holding member 1 and the second workpiece using the second holding member 2. The holding surface 2a sucks and holds the second workpiece W2. In addition to this, an adhesive chuck 32, an electrostatic chuck, or the like which is held by adhering the first workpiece W1 and the second workpiece W2 may be used.

The bonding apparatus W is a thin plate-like structure in which components are integrally assembled, such as an FPD, a 3D (three-dimensional) display, an electronic book, or an organic EL display.

The first workpiece W1 is made of, for example, a glass touch panel or a cover glass, and is bonded to the second workpiece W2 made of an LCM or a flexible printed circuit board (FPC) to form an FPD or an OLED.

In addition, the sealing material W3 is applied to the one or both of the opposing surfaces of the first workpiece W1 and the second workpiece W2 by a quantitative discharge nozzle such as a dispenser.

As the sealing material W3, a photocurable bonding agent such as a UV curable optically transparent resin (OCR) which is cured by absorption of light energy such as ultraviolet rays and which is cured and which exhibits adhesion is used.

Further, as another example, the sealing material W3 may be changed to a thermosetting type bonding agent or a two-liquid mixing curing type bonding agent which is cured by polymerization by absorption of thermal energy, or may be provided without interposing the sealing material W3. The opposing faces of the first workpiece W1 and the second workpiece W2 are bonded to each other.

The first holding member 1 is formed of a flat plate or the like which is formed of a rigid body such as a metal so as to be deformed without being distorted (flexed), and has a surface that is in contact with the first workpiece W1 that has been moved in the Z direction. The first workpiece holding surface 1a.

The second holding member 2 is formed of a flat plate or the like which is formed of a rigid body such as a metal so as not to be distorted (flexed), and has a surface which is in contact with the second workpiece W2 that has been moved in the Z direction. The second workpiece holding surface 2a.

As a specific example of the first workpiece holding surface 1a and the second workpiece holding surface 2a, as shown in FIGS. 1 to 4, only the first workpiece W1 is in contact with the slightly smooth surface of the first holding member 1. A part of the first workpiece holding surface 1a is formed, and only a part of the slightly smooth surface of the second holding member 2 that is in contact with the second workpiece W2 forms the second workpiece holding surface 2a.

In addition, although not shown in the figure, the entire surface of the first holding member 1 may be the first workpiece holding surface 1a, and the entire surface of the second holding member 2 may be the second workpiece holding surface 2a.

In order to reduce the contact area between the first workpiece holding surface 1a and the first workpiece W1, the second workpiece holding surface 2a, and the second workpiece W2, the first workpiece holding surface 1a or the second workpiece holding surface 2a is formed into a hard uneven shape. At the same time, there is a holding chuck 3.

In other words, the first workpiece holding surface 1a of the first holding member 1 or the second workpiece of the second holding member 2 One or both of the member holding faces 2a are opposed to one or both of the pair of workpieces W1, W2 and have a hard coat layer 12 formed in a concavo-convex shape at least on the surface thereof.

In either or both of the first workpiece holding surface 1a of the first holding member 1 or the second workpiece holding surface 2a of the second holding member 2, the suction port 31a is provided to detachably hold the pair of workpieces W1 and W2. It is preferred that one or both of the holding chucks 3 are provided.

The suction port 31a that serves as the holding chuck 3 is opened so as to be opposed to the surface of the first workpiece W1 to attract the first workpiece W1 and to face the surface of the second workpiece W2 to attract the second. The suction hole of the suction chuck 31 of the workpiece W2 is connected to the suction port 31a via the air passage 31b and communicates with the intake air source 31c.

The plurality of adsorption ports 31a are disposed on the first workpiece holding surface 1a and the second workpiece holding surface 2a so as to be dispersed in the XY direction, and the number and interval of the adsorption ports 31a and the sizes of the first workpiece W1 and the second workpiece W2 are The thickness, material, weight, and the like are determined correspondingly.

The intake air source 31c is composed of a pump, a compressor, and the like, and is controlled by the control unit 6 to be sucked at least from the time of receiving and feeding the first workpiece W1 and the second workpiece W2 in the pressure change chamber B to the bonding. The mouth 31a is actuated by suction through the air passage 31b.

After the first workpiece W1 and the second workpiece W2 are bonded together, the first workpiece W1 held by the first workpiece holding surface 1a of the first holding member 1 and the second workpiece W1 may be held from the suction port 31a. The second workpiece W2 of the second workpiece holding surface 2a discharges a fluid such as compressed air.

As a specific example of the holding chuck 3, in the case of the example shown in FIGS. 1 to 4, the adsorption chuck 31 and the adhesion are provided on the first workpiece holding surface 1a of the first holding member 1 disposed above. In the chuck 32, only the suction chuck 31 is provided on the second workpiece holding surface 2a of the second holding member 2 disposed below.

The adhesive chuck 32 has a lifting portion 32a that is reciprocally movable in the Z direction by a through hole 1h that is cut into the first holding member 1, and an adhesive portion 32b that is provided at the tip end of the lifting portion 32a in the Z direction and the first workpiece. W1 is opposed; the adhesive follower portion 32c is provided at the base end of the lift portion 32a; and the adhesive drive portion 32d is connected to the adhesive follower portion 32c.

The plurality of array lifting portions 32a and the adhesive portions 32b are disposed so as to be dispersed in the XY direction, and the number and interval of the lifting portions 32a and the adhesive portions 32b are determined in accordance with the size, thickness, material, weight, and the like of the first workpiece W1.

The adhesive drive unit 32d is configured by a driver or the like that can reciprocate in the Z direction. As shown by the solid line in FIG. 1, the control unit 6 described later is used to carry the first workpiece W1 into the pressure change chamber B. The actuation control is performed in such a manner that the adhesive portion 32b is contacted on the surface to be adhered and held. After the first workpiece W1 and the second workpiece W2 are bonded together, as shown by the solid line in FIG. 3, the first workpiece holding surface 1a of the first holding member 1 is in contact with the surface of the first workpiece W1. The surface of the first workpiece W1 is controlled to move away from the adhesive portion 32b in the Z direction.

Further, although not shown in the drawings, the adhesive chuck 32 may not be provided on the first workpiece holding surface 1a of the first holding member 1, instead, the electrostatic chuck and the adsorption chuck 31 may be combined. The adhesive chuck 32 and the electrostatic chuck are provided in combination with the adsorption chuck 31 on the second workpiece holding surface 2a of the second holding member 2.

However, the material of the first holding member 1 and the second holding member 2 is generally used because it is easy to perform precision machining (excellent workability), light weight (excellent workability), and low cost.

On the other hand, as the material of the first workpiece W1 and the second workpiece W2 constituting the substrate such as the LCD and the OLED, a glass and a crucible which are harder than a metal material such as an aluminum-based material are generally used.

Therefore, when the first workpiece W1 and the first workpiece holding surface 1a of the first holding member 1 and the second workpiece W2 are brought into contact with the second workpiece holding surface 2a of the second holding member 2 and repeatedly attached and detached, each time The friction generated during the contact causes the soft first workpiece holding surface 1a and the second workpiece holding surface 2a to gradually wear.

Further, as the material of the first holding member 1 and the second holding member 2, it is also conceivable to use a hard material such as ceramic which is harder than glass and hard to wear. However, in this case, when the first workpiece holding surface 1a and the second workpiece holding surface 2a are formed into a concavo-convex shape by sandblasting, etching, polishing, or the like, such as a sandblasting method, the mountain-shaped front end of the convex portion is not only It is easy to be damaged, and may be broken by the mountain-shaped front end of the convex portion when it comes into contact with the first workpiece W1 and the second workpiece W2. Therefore, the processing precision and the workability (processing time and processing cost) of the uneven shape are inferior to those of the metal material, and it is also disadvantageous in that the first workpiece W1 and the second workpiece W2 are damaged by cracks or the like. In particular, in the case of a ceramic material, a process such as firing is required, which is disadvantageous in terms of difficulty in enlargement.

Therefore, in order to simultaneously achieve such problems as wear prevention and workability, the first holding member 1a of the first holding member 1 and the second workpiece holding surface 2a of the second holding member 2 are formed by the first holding member 1 . The second holding member 2 and the hard coating layer 12 made of a material having a harder material than the pair of workpieces W1 and W2.

The hard coat layer 12 is formed by laminating a material having a thickness smaller than that of the pair of workpieces W1 and W2 along the first workpiece holding surface 1a and the second workpiece holding surface 2a. Further, it is preferable that the hard coat layer 12 is grounded (grounded) via the first workpiece holding surface 1a and the second workpiece holding surface 2a.

As a specific example of the material of the hard coat layer 12, for example, an insulator such as an oxide film does not occur on the surface of the hard coat layer 12, for example, a ceramic containing a conductive material composed of titanium, tantalum carbide or tungsten, carbon particles, or the like is used. A material composed of a glass or a metal substrate is preferred.

Specific examples of the coating method of the hard coat layer 12 include coating, dipping, vapor deposition, plating, sputtering, and thermal spraying.

As a specific example of the hard coat layer 12, as shown in FIGS. 1 to 4, the panel 12P having the hard coat layer 12 is detachably laid on the first workpiece partially formed in the first holding member 1. The surface 1a and its outer surface 1b are held on the entire surface. Similarly, the panel 12P having the hard coat layer 12 is also detachably laid on the entire surface of the second workpiece holding surface 2a and the outer surface 2b of the region which are partially formed in the second holding member 2.

The panel 12P is formed of a metal such as aluminum into a thin plate shape, and a hard coat layer 12 is integrally formed on the surface thereof. The panel 12P is formed in a rectangular shape or the like, and a panel 12P having substantially the same size as that of the first workpiece holding surface 1a and the second workpiece holding surface 2a is attached, or is arranged in the XY direction. In this manner, a plurality of panels 12P having a smaller size than the first workpiece holding surface 1a and the second workpiece holding surface 2a are mounted.

Further, as another example, although not shown, the hard coating layer 12 may be partially formed only on the first workpiece holding surface 1a except the domain outer surface 1b, or only the second workpiece other than the domain outer surface 2b. The holding surface 2a is partially formed with the hard coat layer 12, or the hard coating layer 12 is formed only on either of the first workpiece holding surface 1a or the second workpiece holding surface 2a, or the panel 12P is not used and the first workpiece holding surface is used. The surface of the 1a and the second workpiece holding surface 2a directly forms the hard coat layer 12.

Further, the hard coat layer 12 has a plurality of support protrusions 12a protruding from one of the first workpiece holding surface 1a or the second workpiece holding surface 2a or one or both of the pair of workpieces W1 and W2 in two directions and in point contact. And a plurality of suction grooves 12b are formed such that the plurality of support protrusions 12a communicate with the adsorption ports 31a of the adsorption chuck 31, respectively.

The plurality of support projections 12a are in contact with the surfaces of the first workpiece W1 and the second workpiece W2, respectively, so that the first workpiece W1 and the second workpiece W2 are maintained in a smooth state. Therefore, in order to prevent the point contact portions of the first workpiece W1 and the second workpiece W2 from being deformed by weight, it is preferable to hold a plurality of minute support projections 12a densely arranged per unit area.

The plurality of suction grooves 12b form a plurality of minute space portions 12s in a dispersed manner between the first workpiece W1 and the second workpiece W2, and reduce the contact area with the first workpiece W1 and the second workpiece W2. Composition.

As a method of ensuring that the workpiece is smoothly held, it is preferable to form a plurality of support protrusions 12a so that one or both of the pair of workpieces W1 and W2 protrude in a mountain shape. It is preferable to form a plurality of suction grooves 12b in a valley shape so as to be adjacent to the plurality of support protrusions 12a in the XY direction and the XYθ direction.

Further, either or both of the first workpiece holding surface 1a or the second workpiece holding surface 2a have a plurality of mountain-shaped convex portions 12c and a plurality of valley-shaped concave portions formed by surface roughening treatment. In the portion 12d, it is preferable to laminate the hard coat layer 12 along the plurality of mountain-like convex portions 12c and the plurality of valley-shaped concave portions 12d. The plurality of mountain-shaped convex portions 12c and the plurality of valley-shaped concave portions 12d are also preferably arranged in a plurality of densely arranged portions per unit area, similarly to the support protrusions 12a and the intake grooves 12b.

Thereby, a plurality of support protrusions 12a are formed on the outer side of the plurality of mountain-shaped convex portions 12c, and a plurality of suction grooves 12b are formed on the outer side of the plurality of valley-shaped concave portions 12d.

Examples of the surface roughening treatment include blasting treatment such as sand blasting, etching treatment, and polishing treatment.

As a specific example of the surface roughening treatment, as shown in FIGS. 1 to 4, the metal surface which is the surface of the panel 12P is sandblasted to roughen the surface, and the rough surface is laminated to form a hard surface. Coating 12. Specifically, particles such as ceramics, glass, and metal having a particle size of #60 to #240 are brought into rapid contact with the metal surface of the surface of the panel 12P, so that a plurality of mountain-like convexities are simultaneously formed with a predetermined surface roughness. a portion 12c and a plurality of valley recesses 12d.

Further, although not shown, the surface roughening treatment may be changed, the etching treatment and the polishing treatment may be performed instead of the sandblasting treatment, or the first workpiece holding surface 1a and the first workpiece holding surface 1a may be used without using the panel 12P. 2 The surface of the workpiece holding surface 2a is directly roughened by the surface, and the hard coat layer 12 is laminated on the rough surface.

The degree of surface roughness (Ra) of about 0.1 to 3.0 is preferable as the degree of the rough surface state by the surface roughening treatment.

According to the experiment, when the surface roughness (Ra) of the plurality of support protrusions 12a and the plurality of suction grooves 12b is less than 0.1, the difference in height between the support protrusions 12a and the suction grooves 12b becomes too small, from the adsorption chuck 31. It is difficult for the suction force of the adsorption port 31a to sufficiently extend to the plurality of suction grooves 12b. Therefore, it is known that the first workpiece W1 can be stably sucked and held by the entire first workpiece holding surface 1a, and the second workpiece W2 can be stably sucked and held by the entire second workpiece holding surface 2a.

Further, when the surface roughness (Ra) of the plurality of support protrusions 12a and the plurality of suction grooves 12b is more than 3.0, the difference in height between the support protrusions 12a and the suction grooves 12b becomes excessive, resulting in the adsorption chuck 31. The suction force of the adsorption port 31a excessively flows to the plurality of suction grooves 12b. In particular, as shown in the example, when the hard coat layer 12 is formed on the outer surface 1b of the first workpiece holding surface 1a and the outer surface 2b of the second workpiece holding surface 2a, the amount of leakage outside the domains 1b, 2b is excessive. . Therefore, it is known that the first workpiece W1 can be stably sucked and held by the entire first workpiece holding surface 1a, and the second workpiece W2 can be stably sucked and held by the entire second workpiece holding surface 2a.

Further, in order to confirm the above-described improvement in the frictional force by the point contact of the hard coat layer 12, the following experiment was conducted.

A contact plate having a hard coat layer 12 in which the above-described support protrusions 12a and the suction grooves 12b are dispersed, a surface contact plate in which a smooth surface of aluminum is exposed, and a glass block placed thereon are prepared. The contact portion between the point contact plate and the block and the contact portion between the surface contact plate and the block were brought into a vacuum state, and then a friction measurement test (block. contact plate) was performed while returning to atmospheric pressure.

As a result of the friction measurement test, the frictional force of the point contact plate is "0.090 Kg", the frictional force of the surface contact plate is "0.193 Kg", and the friction coefficient of the point contact plate is about 1 of the friction coefficient of the surface contact plate. /2. Thereby, it is found that the frictional force of the above-mentioned point contact plate can be halved compared with the above-mentioned surface contact plate.

The contact/separation drive unit 4 is configured by a driver or the like that reciprocates either one of the first holding member 1 or the second holding member 2 or the two-direction Z direction, and is controlled by the control unit 6 to be described later. As a control example of the contact/separation drive unit 4 based on the control unit 6, as shown by the solid line in FIG. 1, when the first workpiece W1 and the second workpiece W2 are transferred to the pressure change chamber B, the contact separation is performed. The drive unit 4 moves the first holding member 1 or the second holding member 2 away from each other in the other direction Z direction, or causes the first holding member 1 and the second holding member 2 to move toward each other. The direction is relatively moved away. then, As shown by the two-dotted line in FIG. 1 and the second drawing, the contact holding drive unit 4 moves the first holding member 1 side or the second holding member 2 side closer to the other direction Z direction. Or both the first holding member 1 side and the second holding member 2 side are moved closer to each other in the Z direction, and the first workpiece W1 and the second workpiece W2 are overlapped in the Z direction with the sealing material W3 interposed therebetween. In the case of further press fit.

As a specific example of the contact separation drive unit 4, as shown in FIGS. 1 to 4, only the first holding member 1 is connected to the contact separation drive unit 4, and the first holding member 1 side is oriented. 2 The member 2 is held and moved relatively close to the Z direction.

In addition, although it is not shown in the figure, the second holding member 2 may be connected to the contact separation drive unit 4, and the second holding member 2 side may be directed toward the first holding member 1 side. The first holding member 1 and the second holding member 2 are connected to the contact separating drive unit 4, and the first holding member 1 side and the second holding member 2 side are simultaneously opposed to each other in the Z direction. Move closer.

The positioning drive unit 5 is configured by a driver or the like that adjusts the movement of either the first holding member 1 or the second holding member 2 or the two-direction XY direction and the XYθ direction, and performs the actuation control by the control unit 6 to be described later. As shown in Fig. 2, as a control example of the positioning drive unit 5 by the control unit 6, the positioning drive unit is placed before the first workpiece W1 and the second workpiece W2 that are carried into the pressure changing chamber B are to be bonded together. 5, one of the first holding member 1 or the second holding member 2 is relatively moved from the other direction XY direction and the XYθ direction, and the first workpiece W1 and the second workpiece W2 are aligned or the first holder is held. Both the member 1 and the second holding member 2 are relatively moved in the XY direction and the XYθ direction, and the first workpiece W1 and the second workpiece W2 are aligned.

As a specific example of the positioning drive unit 5, in the case of the examples shown in FIGS. 1 to 4, only the first holding member 1 is connected to the positioning drive unit 5, and the first holding member 1 side is oriented. 2 The holding member 2 is laterally adjusted to move in the XYθ direction.

Further, although not shown, other examples may be changed by merely making the second The holding member 2 is connected to the positioning drive unit 5, and the second holding member 2 side is moved toward the first holding member 1 side in the XY direction and the XYθ direction to be aligned, or the first holding member 1 and the second holder are placed. Each of the holding members 2 is connected to the positioning driving unit 5, and the first holding member 1 side and the second holding member 2 side are simultaneously moved in the XY direction and the XYθ direction to be aligned and aligned.

The controller 6 is not only electrically connected to the intake source 31c of the adsorption chuck 31, the adhesion drive unit 32d of the adhesive chuck 32, the contact separation drive unit 4, and the positioning drive unit 5, but also to the controller. Further, the opening and closing portion (not shown) in which the first workpiece W1 and the second workpiece W2 are placed is taken out inside and outside the pressure changing chamber B, and the atmosphere in the pressure changing chamber B is adjusted from the atmospheric atmosphere AP to a predetermined degree of vacuum. A controller that is electrically connected to an indoor pressure adjusting unit (not shown) that presses the atmosphere DP.

The controller that becomes the control unit 6 performs the actuation control in sequence at a preset time according to a program preset to its control circuit (not shown).

As described in detail below, the control unit 6 receives the first workpiece W1 that has been carried into the pressure changing chamber B of the atmospheric atmosphere AP by the adsorption chuck 31 and the adhesive chuck 32 as shown by the solid line in FIG. The first workpiece holding surface 1a of the holding member 1 is controlled to be moved so that the second workpiece W2 is received by the suction chuck 31 to the second workpiece holding surface 2a of the second holding member 2.

Then, as shown in the two-dotted line in FIG. 1 and the second figure, after the pressure change chamber B is switched to the reduced pressure atmosphere DP, the adhesion driving portion 32d and the contact separation driving portion 4 of the adhesive chuck 32 are used. The first holding member 1 and the adhesive portion 32b are moved in the Z direction relative to the second holding member 2, and the first workpiece W1 and the second workpiece W2 are moved in the Z direction with the sealing material W3 interposed therebetween. control.

At the same time as the overlap, the first holding member 1 or the second holding member 2 is adjusted to move in the XY direction and the XYθ direction in the other direction, and the first workpiece W1 is accurately performed. Opposing (positioning) with respect to the second workpiece W2. After the alignment is completed, the first workpiece M1 and the second workpiece are brought into contact by the separation driving unit 4 W2 fits the way to control the action.

Then, as shown by the solid line in FIG. 3, after the first workpiece W1 and the second workpiece W2 are bonded together, the first workpiece holding surface 1a and the first holding member 1 are held by the contact separating drive unit 4 In the state in which the surface of the workpiece W1 is in contact with each other, the adhesive portion 32b of the adhesive chuck 32 moves the adhesive portion 32b to the direction separated from the first workpiece W1 and is peeled off to perform the actuation control.

According to the manufacturing apparatus A of the bonding apparatus W of the embodiment of the present invention, the workpiece (the first workpiece W1 and the second workpiece W2) and the first workpiece holding surface 1a and the second holding formed on the first holding member 1 are held. The hard coat layer 12 of the second workpiece holding surface 2a of the member 2 is repeatedly contacted, and the workpiece (the first workpiece W1 and the second workpiece W2) is held in a smooth shape, and the workpiece (the first workpiece W1 and the second workpiece W2) is mountained. The plurality of support projections 12a projecting in a manner also come into point contact with the workpieces (the first workpiece W1 and the second workpiece W2), so that the contact area is extremely small. Therefore, the binding force based on friction with the workpiece (the first workpiece W1 and the second workpiece W2) is small.

In addition, since the material of the plurality of support protrusions 12a is harder than the first holding member 1, the second holding member 2, and the workpieces (the first workpiece W1 and the second workpiece W2), it does not wear out over time. .

With this configuration, even if the first holding member 1 and the second holding member 2 are formed using a metal material excellent in processing precision, workability, and the like, only the tip end portion of the support protrusion 12a can be worn without a wear and a smooth workpiece over a long period of time ( The first workpiece W1 and the second workpiece W2) are in point contact and are held with high precision.

Thereby, the contact area between the first workpiece holding surface 1a and the second workpiece holding surface 2a of the workpiece (the first workpiece W1 and the second workpiece W2) can be made very small, and the first workpiece holding surface 1a can be prevented. The second workpiece holding surface 2a is worn over time.

As a result, it is possible to continuously manufacture a high-precision bonding apparatus W of submicron precision over a long period of time.

In particular, either or both of the first workpiece holding surface 1a or the second workpiece holding surface 2a It is preferable that a plurality of mountain-like convex portions 12c having a roughened surface are formed by laminating a plurality of support protrusions 12a on the outer side of the plurality of mountain-shaped convex portions 12c by coating.

In this case, even if the front ends of the plurality of mountain-like convex portions 12c are sharp-angled in a pointed shape due to the roughening of the surface, a plurality of support protrusions 12a are coated by coating the outer sides of the plurality of mountain-shaped convex portions 12c. The mountain-shaped front end portion is spherical in shape due to the surface tension of the coating material.

Thereby, it is possible to simultaneously prevent warpage of a part of the workpiece when the workpiece (the first workpiece W1 and the second workpiece W2) comes into contact with each other, and to prevent puncture of the plurality of support protrusions 12a.

As a result, it is possible to suppress warpage when the workpiece W1 is held by the first workpiece holding surface 1a and the workpiece W2 is held by the second workpiece holding surface 2a, and the workpiece (the first workpiece W1 and the second workpiece W2) does not cause turtles. Cracked and so on. Therefore, it is particularly effective for the workpieces having a small thickness (the first workpiece W1 and the second workpiece W2).

In addition, either or both of the first workpiece holding surface 1a and the second workpiece holding surface 2a are provided with suction ports 31a for sucking one or both of the pair of workpieces (W1, W2), and the hard coat layer 12 has a plurality of Preferably, the plurality of suction grooves 12b are formed in a valley shape so that the support projections 12a communicate with each other.

In this case, even if the workpiece (the first workpiece W1 and the second workpiece W2) is repeatedly brought into contact with the hard coat layer 12, the intake groove 12b does not disappear over a long period of time. Therefore, the suction force from the suction port 31a spreads over the entire first workpiece holding surface 1a and the second workpiece holding surface 2a, and the workpiece (the first workpiece W1 and the second workpiece W2) is sucked and held.

Further, since the plurality of suction grooves 12b formed between the plurality of support projections 12a do not abut against the workpieces (the first workpiece W1 and the second workpiece W2), the first workpiece from the first holding member 1 is not attached. When the holding surface 1a and the second workpiece holding surface 2a of the second holding member 2 are peeled off from the workpiece (the first workpiece W1 and the second workpiece W2), the workpiece can be smoothly peeled off and static electricity accompanying peeling hardly occurs.

Thereby, it is possible to ensure that local warpage of the workpieces W1, W2 due to adsorption holding is prevented.

As a result, it is possible to prevent the workpiece W1 from being held by the first workpiece holding surface 1a and the workpiece W2 from being held by the second workpiece holding surface 2a as compared with the case where warpage is caused by bending and deforming a part of the substrate to the suction port during the conventional suction holding. The warpage of the time, in particular, for the bonding requiring submicron precision, it is also possible to fit the in-plane in a uniform state. Therefore, it is possible to manufacture the high-precision bonding apparatus W.

In addition, it is possible to cause the pair of workpieces W1 and W2 to be in parallel with each other for a long period of time, and to prevent the influence of the peeling electrification, compared with the case where the substrate is separated from the conventional one. Thereby, it is possible to ensure stable and high-precision bonding for a long period of time, and it is possible to ensure not only damage of the bonding apparatus W but also disconnection of the circuit, and to prevent deterioration of characteristics due to static electricity.

In particular, it is preferable to arrange a plurality of suction grooves 12b close to each other so as to be adjacent to the plurality of support projections 12a.

In this case, the support protrusions 12a and the suction grooves 12b are disposed at a high density per unit area on the surface of the entire hard coat layer 12.

Thereby, the workpiece (the first workpiece W1 and the second workpiece W2) can be held more smoothly.

As a result, it is possible to further improve the bonding accuracy of the workpieces (the first workpiece W1 and the second workpiece W2).

Further, either or both of the first workpiece holding surface 1a or the second workpiece holding surface 2a have a plurality of valley-shaped recesses 12d having a roughened surface, and the outer sides of the plurality of valley-shaped recesses 12d are laminated to form a plurality of layers by coating. A suction groove 12b is preferred.

In this case, as the pre-machining, the first workpiece holding surface 1a and the second workpiece holding surface 2a are subjected to surface roughening treatment, and a plurality of mountain-shaped convex portions 12c and a plurality of valley-shaped concave portions 12d are simultaneously formed as The post-treatment is carried out by laminating the hard coat layer 12 on the outer side thereof, and at the same time, a plurality of support protrusions 12a and suction grooves 12b are formed.

Thereby, a plurality of minute mountain-shaped convex portions 12c and valley-shaped concave portions 12d can be formed substantially uniformly with a simple process.

As a result, the mountain-shaped convex portion 12c and the valley-shaped concave portion 12d can be densely formed in a short time and at low cost.

Further, a plurality of support protrusions 12a formed on the outer side of the plurality of mountain-shaped convex portions 12c and a plurality of suction grooves 12b formed on the outer side of the plurality of valley-shaped concave portions 12d are roughened to have a surface roughened It is preferable that the surface roughness (Ra) is about 0.1 to 3.0.

In this case, the difference in height between the support protrusion 12a and the suction groove 12b enables the suction force from the adsorption port 31a of the adsorption chuck 31 to spread to the plurality of suction grooves 12b in the required amount, respectively, in the whole first The workpiece holding surface 1a stably sucks and holds the first workpiece W1 and stably sucks and holds the second workpiece W2 on the entire second workpiece holding surface 2a.

Further, the hard coat layer 12 is grounded (grounded) via the first workpiece holding surface 1a and the second workpiece holding surface 2a, and the material of the hard coat layer 12 is used so as not to be oxidized on the surface of the hard coat layer 12. A material of a conductive material such as an insulator such as a film is further preferable.

In this case, when the pressure is applied to the pressure change chamber B, most of the electric charges existing on the surfaces of the first workpiece W1 and the second workpiece W2 are in contact with the hard coat layer 12, and pass through the first workpiece holding surface 1a and the first 2 The workpiece holding surface 2a flows out.

In addition, since the plurality of support projections 12a are in point contact with the first workpiece W1 and the second workpiece W2, the contact area is extremely small, so that it is difficult to cause peeling electrification.

Thereby, it is basically possible to completely prevent the generation of static electricity.

Further, it is more preferable to attach the panel 12P having the hard coat layer 12 to either or both of the first workpiece holding surface 1a or the second workpiece holding surface 2a.

In this case, by attaching the panel 12P to the first workpiece holding surface 1a and the second workpiece holding surface 2a, the precise uneven structure composed of the plurality of support projections 12a and the plurality of suction grooves 12b is assembled into one body. .

Thereby, a plurality of support protrusions 12a and a plurality of suction grooves 12b can be easily provided by a simple mounting process.

As a result, the assembly accuracy can be improved.

[Examples]

Next, an embodiment of the present invention will be described based on the drawings.

As shown in FIGS. 1 to 4, in this embodiment, the second holding member 2 has one of the completed workpieces W1 and W2, that is, the bonding apparatus W is peeled off from the second workpiece holding surface 2a. The peeling member 7 is removed.

In the example shown in FIGS. 1 to 4, the second workpiece W2 is pressed and peeled from the second workpiece holding surface 2a by the pressing of the peeling member 7.

The peeling member 7 has a plurality of lift pins 7a, and is inserted into the through hole 2h of the second holding member 2, and is reciprocally movable in the Z direction so as to face the surface of the second workpiece W2 in the Z direction; The driven portion 7b is provided over the base end of the plurality of lift pins 7a, and the peeling drive portion 7c is connected to the peeling driven portion 7b.

The lift pins 7a are disposed so as to be dispersed in the XY direction with respect to the second workpiece holding surface 2a, and the number and interval of the lift pins 7a are performed in accordance with the size, thickness, material, weight of the bonding apparatus W, and the like of the second workpiece W2. determine.

The peeling drive unit 7c is configured by a driver or the like that can reciprocate in the Z direction. As shown in FIGS. 1 to 3, the control unit 6 receives the second workpiece W2 in the pressure change chamber B from the reception to the second workpiece W2. When the first workpiece W1 and the second workpiece W2 are bonded together, the operation of controlling the movement of the tip end portion of the lift pin 7a into the through hole 2h is performed. As shown in Fig. 4, after the first workpiece W1 and the second workpiece W2 are bonded together, the front end portion of the lift pin 7a protrudes from the through hole 2h toward the surface of the second workpiece W2, and the second workpiece W2 is held from the second workpiece. The surface 2a is stripped to perform actuation control.

Further, it is preferable that the front end portion of the lift pin 7a is provided with a workpiece holding chuck portion (not shown).

According to the manufacturing apparatus A of the bonding apparatus W of the embodiment of the present invention, the workpiece (the second workpiece W2) and the second holding member 2 are generated (consisting of the minute space portion 12s) Since the air layer is plural, the adhesion between the workpiece (the second workpiece W2) based on the pressure difference and the second holding member 2 disappears. At the same time, since the contact area of the workpiece (second workpiece W2) and the second holding member 2 is extremely small by the plurality of suction grooves 12b, the peeling electrification is suppressed and the restraint of the static electricity is lost. Thereby, even if the pair of workpieces (the first workpiece W1 and the second workpiece W2) are completed and bonded by using the peeling member 7, the bonding apparatus W is peeled off from the second workpiece holding surface 2a of the second holding member 2, However, since the interface between the workpiece (the second workpiece W2) and the second workpiece holding surface 2a is not adhered, the pressing portion of the bonding apparatus W can be smoothly peeled off without warping deformation.

Thereby, it is possible to peel off one of the bonded workpieces (bonding device W) without warpage deformation using the peeling member 7, and to prevent the change in the alignment accuracy.

As a result, it is possible to prevent the occurrence of partial warpage by a high-definition liquid crystal display or an organic EL display, etc., compared with a conventional one in which a pair of substrates are separated by a lift pin. Local defects such as unevenness and light leakage have the advantage of achieving improved yield.

Further, in the above-described embodiment, as a specific example of the holding chuck 3, adsorption chucks are provided on the first workpiece holding surface 1a of the first holding member 1 and the second workpiece holding surface 2a of the second holding member 2, respectively. 31. However, the first workpiece holding surface 1a and the second workpiece holding surface 2a may be provided with an adhesive chuck 32 or an electrostatic chuck without providing the chuck 31.

Further, in the above-described embodiment, the pair of workpieces W1 and W2 are removed from the second workpiece holding surface 2a by the peeling member 7 of the second holding member 2, but the present invention is not limited thereto. One of the pair of workpieces W1 and W2 can be peeled off from the second workpiece holding surface 2a by the peeling member provided independently of the second holding member 2.

1‧‧‧1st holding member

1a‧‧‧1st workpiece holding surface

1b‧‧‧ outside the domain of the first workpiece holding surface 1a

1h‧‧‧through hole in the first holding member

2‧‧‧2nd holding member

2a‧‧‧2nd workpiece holding surface

2b‧‧‧ outside the domain of the second workpiece holding surface 2a

2h‧‧‧through hole in the second holding member 2

3‧‧‧ Keeping the chuck

4‧‧‧Contact separation drive unit

5‧‧‧ Positioning drive unit

6‧‧‧Control Department

7‧‧‧ peeling members

7a‧‧‧lifting pin

7b‧‧‧Removal slave

7c‧‧‧ peeling drive unit

12‧‧‧hard coating

12a‧‧‧Support protrusion

12b‧‧‧Intake tank

12c‧‧‧Mountain-like convex

12d‧‧‧ valley recess

12P‧‧‧ panel

12s‧‧‧ Space Department

31‧‧‧Adsorption chuck

31a‧‧‧Adsorption port

31b‧‧‧Airway

31c‧‧‧ Inhalation source

32‧‧‧Adhesive chuck

32a‧‧‧ Lifting Department

32b‧‧‧Adhesive

32c‧‧‧Adhesive follower

32d‧‧‧Adhesive drive unit

A‧‧‧ manufacturing equipment for bonding equipment

B‧‧‧Various pressure chamber

DP‧‧‧ decompression atmosphere

W‧‧‧Fitting equipment

W1‧‧‧1st workpiece

W2‧‧‧2nd workpiece

W3‧‧‧ sealing material

Claims (6)

A manufacturing apparatus for a bonding apparatus, wherein a pair of workpieces are respectively held by the first holding member and the second holding member, and the first holding member and the second holding member are relatively moved toward each other, and One or both of the first workpiece holding surface of the first holding member or the second workpiece holding surface of the second holding member are provided with a hard coat layer, and the hard coat layer is provided. Or facing the one or both of the pair of workpieces, and the surface thereof is formed into a concavo-convex shape by a material harder than the materials of the first holding member, the second holding member, and the pair of workpieces, and the hard coat layer is One or both of the pair of workpieces from the first workpiece holding surface or the second workpiece holding surface or both of the pair of workpieces protrude in a mountain shape, and have a smooth surface or both of the pair of workpieces The smooth surfaces are in contact with a plurality of support protrusions. The apparatus for manufacturing a bonding apparatus according to claim 1, wherein one or both of the first workpiece holding surface and the second workpiece holding surface have a plurality of mountain-shaped convex portions that are roughened by a surface, and the plurality of support protrusions The laminate is formed on the outer side of the plurality of mountain-shaped convex portions by coating. The manufacturing apparatus of the bonding apparatus according to claim 1 or 2, wherein either or both of the first workpiece holding surface and the second workpiece holding surface are provided with suction ports for sucking and holding one or both of the pair of workpieces The hard coat layer has a plurality of suction grooves formed in a valley shape so that the plurality of support protrusions communicate with the adsorption port. The manufacturing apparatus of the bonding apparatus of claim 3, wherein One or both of the first workpiece holding surface or the second workpiece holding surface has a plurality of valley-shaped recesses that are roughened by a surface, and the plurality of suction grooves are laminated and formed on the plurality of valleys by coating The outside of the recess. The apparatus for manufacturing a bonding apparatus according to claim 3, wherein a panel having the hard coat layer is attached to either or both of the first workpiece holding surface or the second workpiece holding surface. The manufacturing apparatus of the bonding apparatus of claim 3, wherein the second holding member has a peeling member that peels off the pair of workpieces that have been bonded from the second workpiece holding surface.