TW201638395A - 酸性銅電鍍浴以及用於電鍍低內應力及優良延展性的銅沈積物的方法 - Google Patents

酸性銅電鍍浴以及用於電鍍低內應力及優良延展性的銅沈積物的方法 Download PDF

Info

Publication number
TW201638395A
TW201638395A TW105110410A TW105110410A TW201638395A TW 201638395 A TW201638395 A TW 201638395A TW 105110410 A TW105110410 A TW 105110410A TW 105110410 A TW105110410 A TW 105110410A TW 201638395 A TW201638395 A TW 201638395A
Authority
TW
Taiwan
Prior art keywords
copper
acid
bath
internal stress
sulfopropyl
Prior art date
Application number
TW105110410A
Other languages
English (en)
Chinese (zh)
Inventor
玲芸 魏
雷貝卡 海茲布魯克
布萊安 賴布
玉樺 高
馬克 列斐伏爾
羅伯特Ａ 科羅納
Original Assignee
羅門哈斯電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料有限公司 filed Critical 羅門哈斯電子材料有限公司
Publication of TW201638395A publication Critical patent/TW201638395A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C08G73/0206—Polyalkylene(poly)amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/13—Morphological aspects
    • C08G2261/131—Morphological aspects dendritic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW105110410A 2015-04-27 2016-03-31 酸性銅電鍍浴以及用於電鍍低內應力及優良延展性的銅沈積物的方法 TW201638395A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/697,599 US20160312372A1 (en) 2015-04-27 2015-04-27 Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits

Publications (1)

Publication Number Publication Date
TW201638395A true TW201638395A (zh) 2016-11-01

Family

ID=55173808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105110410A TW201638395A (zh) 2015-04-27 2016-03-31 酸性銅電鍍浴以及用於電鍍低內應力及優良延展性的銅沈積物的方法

Country Status (6)

Country Link
US (1) US20160312372A1 (de)
EP (1) EP3088570A3 (de)
JP (1) JP2016204749A (de)
KR (1) KR20160127647A (de)
CN (1) CN106086954A (de)
TW (1) TW201638395A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3360988B1 (de) * 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridiniumverbindungen, ein syntheseverfahren dafür, metall- oder metalllegierungsplattierungsbäder mit besagten pyridiniumverbindungen und verfahren zur verwendung besagter metall- oder metalllegierungsplattierungsbäder
KR101992841B1 (ko) 2017-07-13 2019-06-27 케이씨에프테크놀로지스 주식회사 울음, 주름 및 찢김이 최소화된 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조 방법
EP3608447B1 (de) * 2018-08-10 2021-10-06 SK Nexilis Co., Ltd. Kupferfolie mit minimierter ausbeulung, faltigkeit und rissigkeit, elektrode damit, sekundärbatterie damit und verfahren zur herstellung davon
CN112030199B (zh) * 2020-08-27 2021-11-12 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液
WO2022041093A1 (en) * 2020-08-28 2022-03-03 Suzhou Shinhao Materials Llc Method of electroplating stress-free copper film

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1050924A (en) * 1975-03-11 1979-03-20 Hans-Gerhard Creutz Electrodeposition of copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6800188B2 (en) 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
JP4120806B2 (ja) * 2002-10-25 2008-07-16 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP2004346422A (ja) * 2003-05-23 2004-12-09 Rohm & Haas Electronic Materials Llc めっき方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
EP1741804B1 (de) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Procédé de dépôt électrolytique de cuivre
US20120142532A1 (en) * 2009-08-10 2012-06-07 Monsanto Technology Llc Low volatility auxin herbicide formulations
SG183821A1 (en) * 2010-03-18 2012-10-30 Basf Se Composition for metal electroplating comprising leveling agent
JP5595301B2 (ja) * 2011-02-22 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
EP2537962A1 (de) * 2011-06-22 2012-12-26 Atotech Deutschland GmbH Verfahren zur Kupferplattierung
JP5995636B2 (ja) * 2012-10-02 2016-09-21 信越ポリマー株式会社 半導体ウェーハのメッキ用サポート治具
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
CN103258810B (zh) * 2013-05-10 2015-07-08 华进半导体封装先导技术研发中心有限公司 一种减少硅通孔电镀铜后晶圆表面过电镀的方法
CN103698372B (zh) * 2013-12-17 2016-02-10 上海交通大学 铜互连电镀填充效果的评价方法

Also Published As

Publication number Publication date
EP3088570A2 (de) 2016-11-02
US20160312372A1 (en) 2016-10-27
EP3088570A3 (de) 2017-01-25
JP2016204749A (ja) 2016-12-08
KR20160127647A (ko) 2016-11-04
CN106086954A (zh) 2016-11-09

Similar Documents

Publication Publication Date Title
JP6496755B2 (ja) 低内部応力銅電気めっき方法
CN101435094B (zh) 镀铜浴的配方
TWI391536B (zh) 銅電鍍製程
TW201638395A (zh) 酸性銅電鍍浴以及用於電鍍低內應力及優良延展性的銅沈積物的方法
KR102332676B1 (ko) 시아나이드를 함유하지 않는 산성 무광택 은 전기도금 조성물 및 방법
TW201712160A (zh) 酸性銅電鍍浴以及用於電鍍低內應力及優良延展性之銅沈積物的方法
US10435380B2 (en) Metal plating compositions
EP3170923A1 (de) Verfahren zum elektroplattieren von kupferschichten mit geringer interner spannung auf dünnfilmsubstraten zur hemmung von verzerrung
US20200149176A1 (en) Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
CN108441898B (zh) 一种电镀溶液及方法
US10590556B2 (en) Copper electroplating baths containing compounds of reaction products of amines and quinones
SG2012066940A (en) Low internal stress copper electroplating method
US20230091747A1 (en) Electroplating with a polycarboxylate ether supressor