TW201634551A - Semiconductor light emitting device, resin composition for forming reflection body, and lead frame provided with reflector - Google Patents

Abstract

The present invention provides a semiconductor light emitting device that has a high shape forming precision. The semiconductor light emitting device according to the present invention includes a reflection body that contains an isocyanurate compound represented by formula (1), and a pigment. In the formula, R1 is a hydrocarbon group having 4-30 carbon atoms which may contain a hetero atom, and R2 and R3 represent alkenyl groups having 3-6 carbon atoms. R2 and R3 may be identical to each other or may be different from each other.

Description

Semiconductor light-emitting device, resin composition for forming a reflector, and lead frame with reflector

The present invention relates to a semiconductor light-emitting device, a resin composition for forming a reflector, and a lead frame with a reflector.

Conventionally, as a method of attaching an electronic component to a substrate or the like, a method of temporarily fixing an electronic component to a substrate on which a solder is electrically attached to a predetermined position is used, and then the substrate is heated by means of infrared rays, hot air, or the like. The electronic parts are fixed by melting (reflow method). By this method, the mounting density of the electronic components on the surface of the substrate can be increased.

Further, the LED element which is one of the semiconductor light-emitting devices is widely used as a light source such as a display lamp because it is small in size, long in life, and excellent in power saving. Further, in recent years, LED elements having higher brightness have been gradually produced relatively economically, and thus it is being studied as a light source for replacing fluorescent lamps and incandescent light bulbs. In order to obtain a large illuminance when applied to such a light source, a plurality of LED elements are disposed on a surface mount type LED package, that is, a substrate made of metal such as aluminum (a substrate for mounting LEDs), and A reflector (reflector) that reflects light in a specific direction is disposed around each of the LED elements.

However, since the LED element is accompanied by heat generation during light emission, in the LED illumination device of this type, the reflector is inferior due to an increase in temperature during illumination of the LED element. The reflectance is lowered, and thus the brightness is lowered, resulting in shortening of the life of the LED element. Therefore, heat resistance is required for the reflector.

In order to achieve the above heat resistance requirement, Patent Document 1 proposes a polymer composition for a reflector of a light-emitting diode, and specifically, discloses polyphthalamide, carbon black, titanium oxide, A polymer composition of glass fibers and an antioxidant. Further, the reflectance after heat aging of the composition was measured, and compared with the polymer composition containing no carbon black, it was revealed that the composition had good reflectance and less yellowing. However, the heat aging test of the polymer composition described in Patent Document 1 is evaluated at 170 ° C for a short period of 3 hours, and it is not clear whether the heat resistance durability under a practical condition for a longer period of time can be obtained well. The result.

Further, Patent Document 2 discloses a resin composition for thermosetting light reflection of an optical semiconductor device in which an optical semiconductor element and a wavelength conversion means such as a phosphor are combined. The heat aging test of the thermosetting light-reflecting resin composition described in Patent Document 2 was carried out at 150 ° C under a more practical condition of 500 hours, but the molding time was 90 seconds and was longer than the thermoplastic resin. The post-hardening treatment must be carried out at 150 ° C for 2 hours, so that there is a problem in productivity.

In order to solve such problems, Patent Document 3 proposes an electron beam curable resin composition containing polymethylpentene and a crosslinking treatment agent having an allyl substituent having a molecular weight of 1,000 or less. In the case of the above-mentioned Patent Document 3, an electron beam curable composition containing a white pigment and further containing inorganic particles other than the white pigment has excellent heat resistance in the reflow step, and is formed into a molded body such as a reflector. When it is excellent, heat resistance can be obtained. In Patent Document 3, as the crosslinking treatment agent having an allyl group substituent, an isomeric isocyanate having 3 allyl groups or a heterotrimer having 2 allyl groups and an epoxy group is used. Polycyanate. When such a crosslinking treatment agent is used and the electron beam is irradiated to cure the resin composition, it is necessary to increase the amount of electron beam irradiation. In addition, when the amount of electron beam irradiation is increased, the polyolefin resin such as polymethylpentene to be used is deteriorated. Therefore, the amount of electron beam irradiation is expected to be as small as possible.

As described above, in the semiconductor light-emitting device, it is required to form a semiconductor light-emitting device having high precision on the basis of high productivity.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2006-503160

Patent Document 2: Japanese Laid-Open Patent Publication No. 2009-149845

Patent Document 3: Japanese Laid-Open Patent Publication No. 2013-166926

It is an object of the present invention to provide a semiconductor light-emitting device having high forming precision.

The inventors of the present invention have solved the above problems by using a specific isomeric cyanurate compound. That is, the present invention is as follows:

[1] A semiconductor light-emitting device comprising: a reflector comprising an isocyanurate compound represented by the following formula (1) and a pigment; In the formula, R ¹ represents a hydrocarbon group having 4 to 30 carbon atoms which may contain a hetero atom, and R ² and R ³ represent an alkenyl group having 3 to 6 carbon atoms, and R ² and R ³ may be the same or different.

[2] The semiconductor light-emitting device according to [1], wherein the pigment is a white pigment or a black pigment.

[3] The semiconductor light-emitting device according to [1], wherein the reflector contains silica.

[4] The semiconductor light-emitting device according to any one of [1] to [3] wherein the reflector includes a fluidity improver.

[5] The semiconductor light-emitting device according to any one of [1] to [4] wherein the reflector contains a polyolefin resin.

[6] The semiconductor light-emitting device according to any one of [1] to [5] wherein the reflector is made of a cured product of free radiation.

[7] A resin composition for forming a reflector, comprising the reflector provided in the semiconductor light-emitting device according to any one of [1] to [6].

[8] A lead frame with a reflector comprising the cured product of the resin composition for forming a reflector according to [7].

According to the present invention, a semiconductor light-emitting device having high forming precision can be provided.

10‧‧‧Optical semiconductor components

12‧‧‧ reflector

14‧‧‧Substrate

16‧‧‧ lead

18‧‧‧ lens

Fig. 1 is a schematic cross-sectional view showing an example of a semiconductor light-emitting device according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view showing an example of a semiconductor light-emitting device according to an embodiment of the present invention.

[Semiconductor Light Emitting Device

A semiconductor light-emitting device according to an embodiment of the present invention will be described with reference to the drawings. Furthermore, in the present specification, the provisions regarded as being preferable can be arbitrarily employed, and it is preferable that the combination of the preferred ones is preferable.

The semiconductor light-emitting device of the present embodiment has a reflector containing a different isocyanurate compound represented by the following formula (1) and a pigment (hereinafter referred to as a reflector).

In the formula, R ¹ represents a hetero atom may contain carbon atoms of the hydrocarbon group having 4 to 30, R ² and R ³ represents an alkenyl group having a carbon number of 3-6, R ² and R ³ may be the same or different.

As shown in FIG. 1, the semiconductor light-emitting device of the present embodiment has an optical semiconductor element 10 on a substrate 14, and light disposed around the optical semiconductor element 10 and having light reflected from the optical semiconductor element 10 reflected in a specific direction. The reflector 12 of the reflecting surface is formed. The optical semiconductor component 10 is preferably an LED component or an LED package. In the semiconductor light-emitting device, at least a part of the light-reflecting surface of the reflector 12 (in the case of FIG. 1) is formed of a molded body composed of the following resin composition for forming a reflector.

The optical semiconductor element 10 is composed of an n-type and p-type cladding layer, and emits emitted light (generally, UV or blue light in a white LED), for example, AlGaAs, AlGaInP, A semiconductor wafer (light-emitting body) having an active layer composed of GaP or GaN and having a double heterostructure has, for example, a hexahedral shape having a length of about 0.5 mm on one side. Further, in the case of the wire bonding type, it is connected to an electrode (connection terminal) (not shown) via the lead wire 16.

The shape of the reflector 12 is based on the shape of the end portion (joining portion) of the lens 18, and is generally a cylindrical shape or a ring shape such as a square shape, a circular shape, or a circular shape. In the schematic cross-sectional view of FIG. 1, the reflector 12 is a cylindrical body (annular body), and all end faces of the reflector 12 are in contact with and fixed to the surface of the substrate 14.

Further, in order to improve the directivity of the light from the optical semiconductor element 10, the inner surface of the reflector 12 may be expanded upward in a tapered shape (see Fig. 1).

Further, in the case where the end portion of the reflector 12 is processed in a shape corresponding to the shape of the lens 18, the reflector 12 may function as a lens holder.

As shown in Fig. 2, only the light reflecting surface side of the reflector 12 may be formed as the light reflecting layer 12b composed of the resin composition for forming a reflector. In this case, the thickness of the light-reflecting layer 12b is preferably 500 μm or less, and more preferably 300 μm or less from the viewpoint of reducing thermal resistance and the like. The member 12a forming the light reflection layer 12b may be composed of a known heat resistant resin.

As described above, the lens 18 is provided on the reflector 12. The lens 18 is made of a resin, and may have various structures depending on the purpose, use, and the like, and may be colored.

The space formed by the substrate 14, the reflector 12, and the lens 18 may be a transparent sealing portion, and may be a void portion as needed. The space portion is usually a transparent sealing portion filled with a material that imparts light transmissivity and insulation, and is prevented from being electrically defective due to the following causes during wire bonding: a force applied by direct contact with the lead wire 16 And indirectly applying a vibration, an impact, or the like to connect the lead 16 to the connection portion with the optical semiconductor element 10, and/or the connection portion with the electrode Deviate, or cut off, or short circuit. Further, the optical semiconductor element 10 can be protected from moisture, dust, and the like at the same time, and reliability can be maintained for a long period of time.

Examples of the material (transparent sealant composition) that imparts light transmittance and insulation properties include polyoxynoxy resin, epoxy polyoxyn resin, epoxy resin, acrylic resin, and polyimide resin. , polycarbonate resin, etc. Among these, from the viewpoint of heat resistance, weather resistance, low shrinkage, and discoloration resistance, a polyoxyxylene resin is preferable.

Hereinafter, an example of a method of manufacturing the semiconductor light-emitting device shown in FIG. 1 will be described.

First, the following resin composition for forming a reflector is formed into a reflector 12 having a specific shape by transfer molding, compression molding, injection molding, or the like using a mold having a cavity space having a specific shape. Thereafter, the separately prepared optical semiconductor element 10 and the electrode are fixed to the substrate 14 by an adhesive or a bonding member, and the LED element is connected to the electrode by the lead 16. Then, a transparent sealant composition containing a polyoxymethylene resin or the like is injected into the concave portion formed by the substrate 14 and the reflector 12, and is cured by heating, drying, or the like to form a transparent sealing portion. Thereafter, the lens 18 is disposed on the transparent sealing portion to obtain the semiconductor light-emitting device shown in FIG.

Further, the lens 18 may be removed after the transparent sealant composition is not cured, and the composition may be cured.

When the molded article obtained by the following resin composition for forming a reflector is cured by irradiation with free radiation, the amount of free radiation irradiation can be reduced, so that a reflector having less deterioration due to free radiation or a reflection can be obtained. Lead frame of the device.

[Resin composition for forming a reflector]

Then, the tree for forming the reflector used in the semiconductor light-emitting device of the present embodiment The lipid composition (referred to as a resin composition for forming a reflector) will be described.

The resin composition for forming a reflector contains an isocyanurate compound and a pigment. Further, the resin composition for forming a reflector contains a thermoplastic resin.

<isomeric cyanurate compound>

The iso-c-cyanate compound used for the resin composition for forming a reflector is a compound represented by the following formula (1).

In the formula, R ¹ represents a hetero atom may contain carbon atoms of the hydrocarbon group having 4 to 30, R ² and R ³ represents an alkenyl group having a carbon number of 3-6, R ² and R ³ may be the same or different.

R ¹ may contain a hydrocarbon group having 4 to 30 carbon atoms of a hetero atom. Among the hydrocarbon groups, a hydrocarbon group having no olefinic unsaturated bond is preferred. Examples of the hydrocarbon group include an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group. As the alkyl group, for example, hexyl, heptyl, octyl, decyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecane may be mentioned. a linear alkyl or branched alkyl group such as a heptadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group or an eicosyl group. Examples of the cycloalkyl group include a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclodecyl group, a cyclodecyl group, a cycloundecyl group, a cyclododecyl group, and the like. Examples of the aryl group include a phenyl group, a naphthyl group, an anthracenyl group and the like. Examples of the aralkyl group include a benzyl group, a phenethyl group, a trityl group, a naphthylmethyl group, and a decylmethyl group. The hydrocarbon group may contain a hetero atom as described above, and examples of the hetero atom include a hetero atom such as an oxygen atom, a nitrogen atom or a sulfur atom. The above R ^{1 is} preferably an alkyl group, and more preferably an alkyl group having 6 to 20 carbon atoms.

R ² and R ^{3 each} represent an alkenyl group having 3 to 6 carbon atoms, and examples thereof include an alkenyl group of a propenyl group, a butenyl group, a pentenyl group, and a hexenyl group. The position of the carbon-carbon double bond in the alkenyl group may be the terminal position or the internal position. R ² and R ³ may be the same or different. R ² and R ^{3 are} particularly preferably an allyl group, and among them, an allyl group is preferred. Further, it is preferred that both R ² and R ³ are allyl groups.

As the specific isocyanurate compound represented by the above formula (1), for example, a specific compound in the case where both R ² and R ³ are allyl groups is exemplified by isomeric cyanuric acid 5- Decyl ester-1,3-diallyl ester, 5-nonyl isocyanate-1,3-diallyl ester, 5-pentadecyl isocyanate-1,3-diene Propyl ester, 5-tridecyl-1,3-diallyl isocyanate, 5-tetradecyl-1,3-diallyl isomeric cyanide, heterotrimerization 5-cyclohexyl-1,3-diallyl cyanate, 5-phenyl ester-1,3-diallyl isocyanate, 5-benzyl isopropyl cyanide-1,3- Diallyl ester and the like.

In the resin composition for forming a reflector of the present invention, the formability and hardening treatment of the resin composition can be improved by using the isocyanurate compound represented by the formula (1). In the hardening treatment after the resin composition is molded, the radiation is usually irradiated with free radiation, but by using the isocyanurate compound represented by the general formula (1), the amount of irradiation of the free radiation can be reduced. Therefore, deterioration of the thermoplastic resin, pigment, or the like used can be reduced. And, general formula (1) represents the iso cyanurate-based compounds, R ¹ has the relatively large because of the molecular weight, and therefore when used in a polyolefin resin as the thermoplastic resin, compatibility with the polyolefin resin to improve the resin When the fluidity of the composition is increased, when the molded article is formed by injection molding or the like, the unfilled portion in the molding die can be reduced, and the molded article can be obtained with good moldability. In particular, when a reflector is obtained in the form of a molded body, a plurality of smaller reflectors are preferably formed by one injection molding.

<pigment>

The resin composition for forming a reflector of the present embodiment contains a pigment. As the pigment, a white pigment or a black pigment can be preferably used.

As the white pigment, titanium oxide, aluminum oxide, talc, aluminum hydroxide, mica, calcium carbonate, zinc sulfide, zinc oxide, barium sulfate, potassium titanate or the like can be used alone or in combination. The white pigment is used to impart a white color tone to a cured product obtained by curing the resin composition of the present invention, and in particular, by setting the color tone to a white color, the light reflectance of the cured product can be improved. The light reflectance of the cured product obtained by hardening the resin composition of the present invention can be used as a reflector. In particular, when a cured product is used as a reflector, since a good light reflectance is required, it is preferable to use titanium oxide which is easy to obtain and excellent in light reflectance as a white pigment. The average particle diameter of the white pigment in the primary particle size distribution is preferably from 0.1 to 100 μm, more preferably from 0.1 to 10 μm, still more preferably from 0.2 to 1 μm, from the viewpoint of obtaining formability and obtaining a high reflectance. The average particle diameter can be obtained in the form of a mass average value D50 in particle size distribution measurement by a laser diffraction method.

Further, the black pigment is at least in the visible light region (400 to 700 nm), and the light reflectance indicates that the powder is less than 1%, and is used to impart a black color to the cured product obtained by curing the resin composition of the present invention. The color tone reduces the light reflectance of the cured product. Such a cured material that reduces light reflectance can also be used as a reflector for LEDs for specific purposes. As the black pigment, carbon black or graphite can be preferably used.

<thermoplastic resin>

The resin composition for forming a reflector may also contain a thermoplastic resin.

The thermoplastic resin may be excellent in chemical resistance and electrical insulating properties without decomposition at a molding temperature, and examples thereof include polyvinyl alcohol such as acrylic resin and polyvinyl butyral. Polyester resin such as acetal (butyraldehyde resin), polyethylene terephthalate or polybutylene terephthalate; vinyl chloride resin, urethane resin, polyolefin resin, polystyrene, Styrene resin such as α-methylstyrene; acetal resin such as polyamine, polycarbonate, polyoxymethylene; fluororesin such as ethylene-tetrafluoroethylene copolymer; polyimine, polylactic acid, polyvinyl alcohol The acetaldehyde resin, the liquid crystalline polyester resin, and the like may be used alone or in combination of two or more. When two or more types are combined, a copolymer constituting the monomers of the resins may be used, and various resins may be used in combination.

Among these, it is possible to select the size of the reflector as a molded article, the fluidity based on the fine structure of the reflector, and the like. Among them, a polyolefin resin is preferably used in terms of excellent light resistance.

(polyolefin resin)

In the embodiment of the present invention, the polyolefin resin used for the resin composition for forming a reflector is a polymer having a structural unit composed of a carbon-carbon bond in the main chain, and a case where the carbon bond contains a cyclic structure. It may be a homopolymer or a copolymer copolymerized with other monomers. Since the carbon-carbon bond does not undergo a hydrolysis reaction, it is excellent in water resistance. Examples of the olefin resin include a resin obtained by ring-opening metathesis polymerization of a norbornene derivative, a hydrogenated product thereof, a homopolymer of an olefin such as ethylene or propylene, or a block copolymer of ethylene-propylene, or a random A copolymer, or a copolymer of ethylene and/or propylene with other olefins such as butene, pentene or hexene, and a copolymer of ethylene and/or other monomers such as propylene and vinyl acetate. Among them, polyethylene, polypropylene, and polymethylpentene are preferred, and have a melting point of up to 230 to 240 ° C, a molding temperature of about 280 ° C, and no decomposition, and excellent chemical resistance and electrical insulation. In terms of characteristics, polymethylpentene having less change in reflectance and less coloration is more preferable.

The polyethylene may be a homopolymer of ethylene, and may also be ethylene and other comonomers copolymerizable with ethylene (for example, α-olefins such as propylene, 1-butene, 1-hexene, 1-octene, etc. a copolymer of vinyl acetate, vinyl alcohol, etc.). Examples of the polyethylene resin include high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and ultra low density polyethylene (VLDPE). ), ultra high molecular weight polyethylene (UHMWPE), crosslinked polyethylene (PEX), and the like. These polyethylenes may be used alone or in combination of two or more.

The polypropylene may be a homopolymer of propylene, and may also be propylene and other comonomers copolymerizable with propylene (for example, α-olefins such as ethylene, 1-butene, 1-hexene, 1-octene, etc., a copolymer of vinyl acetate, vinyl alcohol, etc.). These polypropylenes may be used alone or in combination of two or more.

As the polymethylpentene resin, a homopolymer of 4-methylpentene-1 is preferred, and 4-methylpentene-1 and other α-olefins such as ethylene, propylene, and 1-butene may also be used. 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-octadecene, 1-eicosene, 3-methyl-1 a copolymer of a 2 to 20 carbon atoms such as butene or 3-methyl-1-pentene, or a copolymer mainly composed of 4-methyl-1-pentene. In the case of the copolymer, from the viewpoint of heat resistance, it is preferred that the alkene having a carbon number of 10 to 18 is copolymerized, more preferably an alkene having a carbon number of 16 or more. Co-aggregation.

By setting the refractive index of the polyolefin resin used for the resin composition for forming a reflector to 1.40 to 1.60, in particular, a molded body obtained by molding a resin composition using a white pigment as a pigment is used as a reflector. Increases light reflectivity. Further, the weight average molecular weight of the polyolefin resin is preferably from 220,000 to 800,000. If the weight average molecular weight is 220,000 As described above, the molded body obtained by molding the resin composition is less likely to be cracked, which is preferable. For example, when cracks occur in the semiconductor light-emitting device, moisture is immersed and the semiconductor light-emitting device is broken, so that the life of the product is extremely shortened. Moreover, when the weight average molecular weight is 800,000 or less, it is easy to form a resin composition, which is preferable. The lower limit of the weight average molecular weight of the polyolefin resin is preferably 230,000 or more, and more preferably 240,000 or more. Further, the upper limit of the weight average molecular weight is preferably 700,000 or less, more preferably 650,000 or less. Further, the weight average molecular weight is preferably a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography (GPC), but a method for measuring the average molecular weight by weight for good reproducibility is used. It is not limited to this. For example, the weight average molecular weight can be measured by a method exemplifying a material obtained by extraction with a suitable solvent.

As an example of the GPC-based weight average molecular weight measurement conditions, the following conditions can be exemplified.

Lysate: o-dichlorobenzene

Temperature: 140~160°C

Flow rate: 1.0mL/min

Sample concentration: 1.0/L

Injection volume: 300μL

< blending ratio of each component>

In the case where a polyolefin resin is used as the thermoplastic resin in the resin composition for forming a reflector of the present embodiment, the blending amount of the isocyanurate compound in the resin composition for forming a reflector is relative to the polyolefin resin. 100 parts by mass, usually 1 to 100 parts by mass, preferably 8 to 60 parts by mass, more preferably 10 to 50 parts by mass. By setting the content of the isomeric cyanurate compound In the above range, the moldability of the resin composition for forming a reflector and the heat resistance of the cured product obtained by curing the resin composition for forming a reflector can be simultaneously achieved.

In the case of using a polyolefin resin as the thermoplastic resin, the blending amount of the pigment in the resin composition for forming a reflector is usually 10 to 1000 parts by mass, preferably 50%, based on 100 parts by mass of the polyolefin resin. ~800 parts by mass, more preferably 100 to 600 parts by mass. When the content of the pigment is within the above range, the effect of the pigment can be sufficiently exhibited in the cured product obtained from the resin composition, and the moldability can be ensured when the resin composition is molded.

<Inorganic filler other than pigment>

Further, the resin composition of the present invention may further contain an inorganic filler other than the pigment (hereinafter sometimes referred to as an inorganic filler). By containing an inorganic filler, the strength of the cured product obtained by hardening the resin composition of the present invention can be enhanced. As such an inorganic filler, other inorganic fillers such as a fibrous inorganic filler, a plate shape or a particulate form can be used.

(fibrous inorganic filler)

Examples of the fibrous inorganic filler include glass fiber, asbestos fiber, carbon fiber, graphite fiber, metal fiber, aluminum borate whisker, magnesium whisker, lanthanum whisker, ash stone, filamentous aragonite, and sea blisters. Stone, slag fiber, hard calcareous stone, gypsum fiber, silica fiber, cerium oxide-alumina fiber, zirconia fiber, boron nitride fiber, cerium nitride fiber and boron fiber.

(Other inorganic fillers)

Examples of the other inorganic fillers include cerium oxide particles, layered ceric acid salts, layered ceric acid salts exchanged with organic cerium ions, glass flakes, non-swelling mica, graphite, metal foil, ceramic granules, and clay. , mica, sericite, zeolite, bentonite, dolomite, kaolin, citric acid powder, feldspar powder, shirasu balloon, gypsum, uniform quartzite, dawsonite A plate-like or particulate inorganic filler such as carbon nanoparticle such as white clay fullerene.

The resin composition for forming a reflector for use as a reflector is preferably a glass fiber from the viewpoint of excellent mechanical strength at a mechanical strength or temperature when used as a semiconductor light-emitting device, and more preferably used. Glass fiber having 60% by mass or more of silicon dioxide. The proportion of cerium oxide in the glass fiber is more preferably 65 mass% or more, further preferably 70 mass% or more.

The cross-sectional shape of the fibrous filler may be a generally circular shape or a profiled shape such as a flat shape. Further, it may be a fiber which is not fixed in cross-sectional shape or cross-sectional area. In this case, the sectional area is defined as the sectional area obtained by averaging the cross-sectional areas different in the longitudinal direction. In the case where the fibrous filler is glass fiber, it is preferable that the cross-sectional area is satisfied as the cross-sectional area, and the short diameter D1 of the cross-section is 0.5 μm or more and 25 μm or less, and the long diameter D2 is 0.5 μm or more. Further, 300 μm or less, and the ratio of D2 to D1, that is, D2/D1 is 1.0 or more and 30 or less. Further, the average fiber length of the glass fibers is preferably 0.75 μm or more and 300 μm or less. Such glass fibers are also referred to as ground fibers and can be obtained by pulverizing long fibers. The inorganic filler other than the pigment may be used in an amount of usually 10 to 500 parts by mass based on 100 parts by mass of the polyolefin resin.

<Liquidity improver>

In the semiconductor light-emitting device of the embodiment, the reflector may further contain a fluidity improver. In other words, the resin composition for forming a reflector may contain a fluidity improver. By containing a fluidity improver, the formability of the resin composition for forming a reflector containing a pigment or an inorganic filler other than the pigment can be improved.

Examples of the fluidity improving agent include polyethylene wax, polypropylene wax, polar wax, and liquid stone. Wax, a decane compound used as a decane coupling agent, and a metal soap. The fluidity improving agent may be used alone or in combination of two or more.

In the present embodiment, the fluidity improving agent is high in dispersibility and compatibility in the resin, and the fluidity improving agent can be improved from the viewpoint of improving reflectance, mechanical properties, and dimensional stability when the reflector is formed. It is preferred to use a decane compound which is used as a decane coupling agent. Examples of the decane compound include diazane gas such as hexamethyldiazepine; cyclic decazane; trimethyl decane, trimethyl chlorodecane, dimethyl dichloro decane, and methyl trisole; Chlorodecane, allyldimethylchlorodecane, trimethoxydecane, benzyldimethylchlorodecane, methyltrimethoxydecane, methyltriethoxydecane, isobutyltrimethoxydecane, dimethyl Dimethoxy decane, dimethyl diethoxy decane, trimethyl methoxy decane, hydroxypropyl trimethoxy decane, phenyl trimethoxy decane, n-butyl trimethoxy decane, positive sixteen Alkyltrimethoxydecane, n-octadecyltrimethoxydecane, vinyltrimethoxydecane, vinyltriethoxydecane, gamma-methacryloxypropyltrimethoxydecane, and vinyl An alkyldecane compound such as triethoxydecane; γ-aminopropyltriethoxydecane, γ-(2-aminoethyl)aminopropyltrimethoxydecane, γ-(2-amino group Ethyl)aminopropylmethyldimethoxydecane, N-phenyl-3-aminopropyltrimethoxydecane, N-(2-aminoethyl)3-aminopropyltrimethyl Silane-yl, and N-β- (N- vinyl benzyl aminoethyl) [gamma] aminopropyl trimethoxy Silane, hexyl group and the like trimethoxy Silane Silane compound.

The fluidity improver can be usually used in an amount of 0.1 to 50 parts by mass based on 100 parts by mass of the polyolefin resin.

<Other additives>

Further, in the resin composition of the present invention, various additives may be contained as long as the effects of the present invention are not impaired. For example, in order to improve the properties of the resin composition, various polyoxynitride powders may be blended. Internal mold release agent such as thermoplastic elastomer, organic synthetic rubber, fatty acid ester, glycerate, zinc stearate, calcium stearate, or benzophenone, salicylic acid or cyanoacrylate , isomeric isocyanate, oxalic acid anilide, benzoate, hindered amine, benzotriazole, phenolic antioxidants, or hindered amines, benzoates, etc. Additives such as agents.

In the present embodiment, the resin composition for forming a reflector can be obtained by using the thermoplastic resin, the isocyanurate compound, and the pigment, and optionally an inorganic filler other than the pigment, a fluidity improver, and other additives. It is melt-kneaded and produced in the form of granules such as granules. As the melt-kneading method, a melt kneading extruder, a two-roll mill or a three-roll mill, a homogenizer, a planetary mixer or the like, a polymer laboratory test system (PolyLab System) or a closed type kneader ( A well-known melt kneading method such as a melt kneader such as Laboplastomill).

In addition, the cured product obtained from the resin composition for forming a reflector can be obtained by forming the resin composition for forming a reflector into a molded body having a specific shape by various molding methods, and curing the molded body.

As the molding method, a molding method such as transfer molding, compression molding, or injection molding can be used. For example, in the case of using an injection molding method, it can be obtained by injection molding at a cylinder temperature of 200 to 400 ° C and a mold temperature of 20 to 150 ° C. As a method of hardening the molded body thus obtained, a cured product can usually be obtained by irradiating free radiation. In other words, it is preferable that the reflection system is made of a cured product obtained by curing a resin composition for forming a reflector by using free radiation. The free radiation includes an electron beam, an ultraviolet ray, etc., and an electron beam is preferably used from the viewpoint of obtaining a cured product in a relatively short period of time.

When using an electron beam as the free radiation, the accelerating voltage of the electron beam can be It is suitably selected according to the size of the resin composition to be used or the thickness of the molded body. For example, in the case of a molded body having a thickness of about 1 mm, the acceleration voltage is usually about 250 to 3000 kV, and the crosslinking treatment agent to be used can be crosslinked and hardened. Further, when the electron beam is irradiated, the higher the acceleration voltage is, the more the penetrating ability is increased. Therefore, when the substrate which is deteriorated by the electron beam is used as the substrate, the penetration depth and formation of the electron beam are made. The acceleration voltage is selected such that the thickness of the body is substantially equal, thereby suppressing the irradiation of the excess electron beam to the molded body, and the deterioration of the molded body due to the excessive electron beam can be minimized. Further, the absorbed dose when irradiating the electron beam is appropriately set depending on the composition of the resin composition, and is preferably an amount which saturates the crosslinking density in the molded body, and the irradiation amount is preferably from 50 to 600 kGy, particularly preferably from 100 to 250 kGy. .

Further, the electron beam source is not particularly limited, and for example, various electron beams such as a Cockcroft Walton type, a Van de Graaff type, a resonant transformer type, an insulated core transformer type, or a linear type, a high frequency high voltage accelerator type, and a high frequency type can be used. accelerator.

[Lead frame with reflector]

The lead frame with a reflector according to the embodiment of the present invention is composed of a cured product of the resin composition for forming a reflector. The lead frame represents a substrate on which the reflector is placed.

The reflector may be incorporated as part of the semiconductor light-emitting device described above, or may be combined with a semiconductor light-emitting device (LED mounting substrate) made of another material. The reflector mainly has a function of reflecting light from the LED elements of the semiconductor light-emitting device toward the lens (light-emitting portion). The details of the reflector are the same as those of the reflector 12 described above, and thus the description thereof is omitted here.

The lead frame can be used as long as it is used by a user in the field of a semiconductor light-emitting device. Examples of the material of the lead frame include ceramics composed of alumina, or sintered bodies such as aluminum nitride, mullite, and glass. In addition to this, polyimine resin, etc. A flexible resin material or the like. In particular, as a lead frame made of a metal, aluminum, copper, and a copper alloy are often used, and in order to increase the reflectance, plating is usually performed by a noble metal having a high reflectance such as silver. In particular, a substrate for a reflector formed of a metal is also often referred to as a lead frame. The terminal portion or the like formed on the lead frame may be formed by half etching. Specifically, the resin composition for forming a reflector is injection-molded by the lead frame, and is formed into a desired reflector shape and cured, thereby producing a lead wire of the reflector of the present invention. frame.

The thickness of the lead frame (reflector thickness) of the reflector with this embodiment is preferably 0.1 to 3.0 mm, more preferably 0.1 to 1.0 mm, still more preferably 0.1 to 0.8 mm.

With regard to the lead frame with a reflector of the present embodiment, the LED wafer is placed thereon and further sealed with a known sealing agent, and bonded to a desired shape, thereby fabricating a semiconductor light-emitting device. Further, the lead frame with a reflector of the present embodiment functions as a reflector, but may function as a frame for supporting the semiconductor light-emitting device.

[Examples]

The invention will be described in detail using the examples. The invention is not limited to the embodiments.

[test methods]

<Measurement of Fluidity (MVR)>

The MVR (unit: cm ³ /60 sec) of the resin composition was measured by the method described in JVR of JIS K 7210:1999 thermoplastic. Specifically, it was carried out under the conditions of a test temperature of 280 ° C and a test load of 2.16 kg and 60 seconds. As the measuring device, a melt flow tester (Melt Flow Tester) manufactured by CEAST Corporation was used.

<formability>

The resin composition (thickness: 500 μm, outer dimension: 50 mm × 50 mm) was molded using the injection molding machine Sodick TR40ER Sodick (preplasticized formula). The conditions of the injection molding machine were set to a cylinder temperature: 270 ° C, a mold temperature: 80 ° C, an injection speed: 100 mm/sec, a holding pressure: 80 MPa, a dwell time: 1 sec, and a cooling time: 8 sec. The formability was evaluated based on the plunger stability at the time of molding.

A: good formability and stable plunger position

B: Formable, but the plunger position is unstable (the possibility of a bad situation)

C: unable to form

<Dimensional stability>

The optical semiconductor mounting substrate produced in each of the examples and the comparative examples was cut and singulated, and the magnification was appropriately adjusted by a digital microscope (VHX1000 manufactured by KEYENCE Co., Ltd.) to The lateral dimensions were measured. Then, it was heated on a hot plate set to a surface temperature of 265 ° C for 20 seconds. The longitudinal and transverse dimensions were measured by a digital microscope in the same manner as before heating. The dimensional change rate was calculated from the difference in size between the above-described single sheets before and after heating. The dimensional change rate is obtained by calculating the dimensional change ratio of the longitudinal direction and the lateral direction of the single sheet, and the result of the direction in which the dimensional change rate is larger at this time is taken as the dimensional stability, and the measurement results are shown in the first table. The above-mentioned single sheet was allowed to stand at 265 ° C for 20 seconds, and was subjected to high heat treatment under the assumption that heating was performed to melt the solder to mount the semiconductor light-emitting device such as the semiconductor light-emitting device on the wiring board.

<High temperature and high humidity action test>

In the semiconductor light-emitting device produced in each of the examples and the comparative examples, solder is placed on the wiring board in advance, and the semiconductor light-emitting device is placed on the solder, and heated to 240 ° C in a reflow furnace to melt the solder on the wiring substrate. A semiconductor light emitting device is mounted thereon. For a semiconductor light-emitting device mounted on a wiring substrate, an optical beam of a constant current of 200 mA is measured by an Intensified Multichannel Photodetector (wide dynamic range type) MCPD-9800 (manufactured by Otsuka Electronics Co., Ltd.), and Set as the initial beam (Φ ₀ ). Further, the same semiconductor light-emitting device was continuously irradiated with a constant current of 200 mA in an environment of a temperature of 85 ° C and a humidity of 85% RH. After a total of 500 hours, the beam was measured by an instantaneous multi-channel photometric system (wide dynamic range type) MCPD-9800 (manufactured by Otsuka Electronics Co., Ltd.) for a constant current of 200 mA, and set to a beam of 500 hours (Φ _500). ).

Based on the measured initial light beam (Φ ₀ ) and the light beam (Φ ₅₀₀ ) after 500 hours, the beam deterioration rate was calculated according to the following formula A.

Beam degradation rate (%)=|(Φ ₅₀₀ -Φ ₀ )/Φ ₀ ×100|‧‧‧式A

The beam deterioration rate calculated from the initial beam (Φ ₀ ) and the beam after 500 hours (Φ ₅₀₀ ) is shown in Table 1.

[Examples 1 to 6, Comparative Examples 1 to 2]

Various materials were blended and kneaded as shown in the following Table 1, to obtain a resin composition.

Further, the resin composition was prepared by blending various materials and using an extruder (Nippon Placon Co., Ltd. MAX30: mold diameter: 3.0 mm) and a granulator (Toyo Seiki Co., Ltd. MPETC1). The resin composition can be molded by an injection molding machine (Sodick Co., Ltd. TR40ER) to produce a molded body. The formed body was irradiated with an electron beam at an acceleration dose of an acceleration voltage of 800 kV and 200 kGy to obtain a cured product. Each characteristic of the obtained cured product was evaluated based on the above evaluation method. The results are shown in the first table below.

Among them, in the first table,

*1 isocyanurate

*2 5-pentadecyl cyanate-1,3-diallyl ester [In the formula (1), R ¹ is n-dodecyl group, and R ² and R ³ are allylic groups Base compound]

*3 Isopropyl cyanurate diglycidyl ester

*4 Titanium oxide PF-691 (manufactured by Ishihara Sangyo Co., Ltd. rutile structure average particle size 0.21 μm)

*5 carbon black #45 (manufactured by Mitsubishi Chemical Corporation)

*6 cerium oxide glass fiber SS05DE-413 (manufactured by Nitto Spin Co., Ltd., fiber length 100 μm, fiber diameter 6.5 μm)

*7 polymethylpentene resin TPX RT18 (manufactured by Mitsui Chemicals, Inc.)

*8 Polypropylene J137G (manufactured by Prime Polymer Co., Ltd.)

*9 Polyethylene resin Hi-Zex 1300 (manufactured by Prime Polymer Co., Ltd.)

*10 zinc stearate SZ-2000 (release agent, manufactured by 堺Chemical Co., Ltd.)

*11 Antioxidant IRGANOX 1010 (manufactured by BASF JAPAN Co., Ltd.)

*12 Antioxidant Adekastab PEP36 [bis(2,6-di-t-butyl-4-methylphenyl)neopentitol diphosphite, manufactured by ADEKA Co., Ltd.]

*13 KBM-3063 (made by Shin-Etsu Chemical Co., Ltd.)

According to the results of the above examples, it was clearly shown that the resin compositions obtained in Examples 1 to 6 had sufficient curability even by reducing the amount of electron beam irradiation by using a specific isomeric cyanurate compound. Further, it is shown in Examples 1 to 6 obtained in the resin composition due to the more MVR 6cm ^3/60 seconds, and therefore is excellent in moldability.

On the other hand, the resin compositions obtained in Comparative Examples 1 and 2 were different from the isomeric cyanurate compounds of the examples. In this case, the fluidity or formability of the resin composition was lowered.

In Comparative Examples 1 and 2, the curing resistance was insufficient, and the heat resistance was insufficient. In the welding step and the reflow step in the production of the semiconductor light-emitting device, the cured product of the resin composition was melt-deformed, and the dimensional change rate was 10% or more. . Therefore, it is impossible to manufacture a semiconductor light-emitting device.

10‧‧‧Optical semiconductor components

12‧‧‧ reflector

14‧‧‧Substrate

16‧‧‧ lead

18‧‧‧ lens

Claims (8)

A semiconductor light-emitting device comprising: a reflector containing an isocyanurate compound represented by the following formula (1) and a pigment; In the formula, R ¹ represents a hydrocarbon group having 4 to 30 carbon atoms which may contain a hetero atom, and R ² and R ³ represent an alkenyl group having 3 to 6 carbon atoms, and R ² and R ³ may be the same or different. The semiconductor light-emitting device of claim 1, wherein the pigment is a white pigment or a black pigment. The semiconductor light-emitting device of claim 1 or 2, wherein the reflector comprises silica. The semiconductor light-emitting device according to any one of claims 1 to 3, wherein the reflector contains a fluidity improver. The semiconductor light-emitting device according to any one of claims 1 to 4, wherein the reflector comprises a polyolefin resin. The semiconductor light-emitting device according to any one of claims 1 to 5, wherein the reflection system is composed of a cured product obtained by free radiation hardening. A resin composition for forming a reflector, which is a reflector provided in the semiconductor light-emitting device according to any one of claims 1 to 6. A lead frame with a reflector comprising a cured product of a resin composition for forming a reflector of claim 7 of the patent application.