TW201608743A - Reflector and resin composition - Google Patents

Abstract

The present invention relates to a reflector having a light reflecting surface which is formed from a resin composition containing a resin and an inorganic filler including a white pigment and a fibrous filler. The cross sectional area in the radial direction of said fibrous filler is 1-100 [mu]m2, inclusive. By using a simultaneous thermogravimetric/differential thermal analyzer based on a TG-DTA method, the mass of said reflector before heated is measured, and thereafter the content of remaining ash is measured after said reflector is heated, in the ambient atmosphere, to 600 DEG C at 10 DEG C/min and then for 30 minutes at 600 DEG C. Since the measured content of the remaining ash is 70-90 mass%, inclusive, on the basis of the total mass of said reflector before heated, the present invention is capable of ensuring excellent adhesiveness of the reflector to a substrate while at least maintaining basic performance such as heat resistance and reflectivity requirements.

Description

Reflector, lead frame with reflector, semiconductor light-emitting device and resin composition

The present invention relates to a reflector, a lead frame with a reflector, a semiconductor light-emitting device, and a resin composition.

Conventionally, as a method of attaching an electronic component to a substrate, the electronic component is temporarily fixed to a substrate on which solder is spot-welded in a specific portion, and then the substrate is heated by infrared rays or hot air to melt the solder. , a method of fixing electronic parts (reflow method). By this method, the mounting density of the electronic components on the surface of the substrate can be increased.

Moreover, since the LED element which is one of the semiconductor light-emitting devices is small, has a long life, and is excellent in power-saving property, it is widely used as a light source such as a display lamp. Further, in recent years, LED elements having higher brightness have been manufactured at relatively low cost, and therefore, use as a light source instead of a fluorescent lamp and an incandescent light bulb has been studied. In the case of being applied to such a light source, in order to obtain a large illuminance, a plurality of LEDs are disposed on a surface-mounted LED package, that is, a substrate made of metal such as aluminum (a substrate for LED assembly). In the element, a reflector (reflector) that reflects light in a specific direction is disposed around each of the LED elements.

However, the LED element is accompanied by heat generation during light emission. Therefore, the LED illumination device of this type is caused by the temperature rise of the LED element when the light is emitted, and the reflector is deteriorated, so that the reflectance is lower. As a result of the drop, the brightness is lowered, resulting in a short life of the LED element. Therefore, heat resistance is required for the reflector.

In order to meet the above requirements for heat resistance, Patent Document 1 proposes a polymer composition for use in a reflector of a light-emitting diode, and specifically, discloses polyphthalamide, carbon black, titanium oxide, A polymer composition of glass fibers and an antioxidant. Further, it has been revealed that the reflectance after heat aging of the composition is measured, and the composition has a good reflectance and less yellowing as compared with a polymer composition containing no carbon black. However, the heat aging test of the polymer composition described in Patent Document 1 is evaluated at 170 ° C for a short period of 3 hours, and it is possible to obtain good results in terms of heat resistance durability under practical conditions for a longer period of time. clear.

Further, Patent Document 2 discloses a resin composition for thermosetting light reflection which is used in an optical semiconductor device in which a wavelength conversion means such as an optical semiconductor element or a phosphor is combined. The heat aging test of the thermosetting light-reflecting resin composition described in Patent Document 2 was carried out under the practical conditions of 150 ° C for 500 hours, but the molding time was 90 seconds and was longer than the thermoplastic resin. Since it needs to be carried out at 150 ° C for 2 hours as a post-hardening treatment, there is a problem in productivity.

In order to solve such a problem, Patent Document 3 discloses inorganic particles containing an olefin resin, a crosslinking treatment agent having an allyl group having a molecular weight of 1,000 or less, spherical cerium oxide oxide, glass fiber, and the like. A resin composition of a white pigment. Further, it is described that such a resin composition has excellent heat resistance, and therefore it is useful when a molded body such as a reflector is produced by a reflow step.

However, the following situation becomes clearer: the use of glass in the above resin composition When the glass fiber is used as an inorganic particle, for example, when a reflector is formed, the thickness of the reflector becomes thinner, and the deformation of the reflector becomes conspicuous, and the adhesion between the reflector and the substrate is deteriorated. In this case, it is presumed that the sealed LED element is not completely sealed, and the life of the light-emitting device is shortened.

Therefore, when glass fiber is used as the inorganic particle, it is required to have a reflector excellent in adhesion to the substrate in a state where at least the required basic properties such as heat resistance are maintained.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2006-503160

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-149845

[Patent Document 3] Japanese Laid-Open Patent Publication No. 2013-166926

An object of the present invention is to provide a reflector having excellent adhesion to a substrate while maintaining at least the required basic properties such as heat resistance and reflectance.

The inventors of the present invention have solved the above problems by using a fibrous filler having a specific cross-sectional area in the radial direction. That is, the present invention provides the following.

A reflector having a light reflecting surface formed by a resin composition containing a resin and an inorganic filler containing a white pigment and a fibrous filler, wherein the fibrous filler has a radial cross-sectional area of 1 μm ² Above 100 μm ² or less, the mass before heating of the reflector is measured using a thermogravimetric/differential thermal synchronous analyzer according to the TG-DTA method, and then heated to 600 ° C at 10 ° C / min in an atmospheric environment, at 600 ° C. The ash component remaining after heating at ° C for 30 minutes is 70% or more and 90% or less based on the total mass of the reflector before heating.

According to the present invention, it is possible to provide a reflector having excellent adhesion to a substrate in a state in which at least the required basic properties such as heat resistance and reflectance are maintained.

10‧‧‧Optical semiconductor components

12‧‧‧ reflector

14‧‧‧Substrate

16‧‧‧ lead

18‧‧‧ lens

Fig. 1 is a schematic cross-sectional view showing an example of a semiconductor light-emitting device according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view showing an example of a semiconductor light-emitting device according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to the embodiments. Furthermore, in the present specification, it is possible to arbitrarily adopt a rule which is considered to be preferable, and it is preferable that the combination of the preferred ones is better.

[1. Reflector]

The reflector according to the embodiment of the present invention has a light reflecting surface formed by a resin composition containing a resin and an inorganic filler containing a white pigment and a fibrous filler (hereinafter, there is a resin called a reflector). In the case of the material, the radial cross-sectional area of the fibrous filler is 1 μm ² or more and 100 μm ² or less, and the quality of the reflector before heating is measured using a thermogravimetric/differential thermal synchronization analyzer according to the TG-DTA method. Thereafter, the temperature is raised to 600 ° C at 10 ° C /min in an atmospheric environment, and then heated at 600 ° C for 30 minutes to retain the ash component, which is 70% by mass or more based on the total mass of the reflector before heating. Below mass%.

If the ash component of the reflector of the present embodiment is less than 70% by mass, the heat resistance required in the reflow step cannot be satisfied. Further, when the ash content exceeds 90% by mass, the formability of the reflector is lowered.

From the above viewpoint, the lower limit of the ash component is preferably 72% by mass, more preferably 75% by mass. Further, the upper limit of the ash component is preferably 88% by mass, more preferably 85% by mass.

The reflector of the embodiment of the present invention mainly has a function of reflecting light from the LED element of the semiconductor light-emitting device toward the lens (light-emitting portion).

The reflector of this embodiment can be used in combination with the semiconductor light-emitting device described below, or can be used in combination with a semiconductor light-emitting device composed of another material, a substrate for LED assembly, or the like. The details of the reflector are the same as those applied to the reflector (the reflector 12 in FIGS. 1 and 2) used in the semiconductor light-emitting device described below with reference to FIGS. 1 and 2, and thus are omitted here.

The reflector of this embodiment can be applied to various uses. For example, it can be applied to a lamp represented by a heat-resistant insulating film, a heat-resistant release sheet, a light-reflecting sheet of a solar cell, or an LED, a reflector for a light source for television, and the like. In particular, in the case of an LED, the sealing property of the optical semiconductor element affects the life of the semiconductor element. However, since the reflector of the embodiment has good adhesion and high sealing property, it is preferable. Applied to LEDs. Further, it can be more preferably applied to a metal substrate type LED which is processed by etching and half etching to form a lead frame, and the back surface of the installation portion of the element is used as an electrode.

Next, the constituent elements of the reflector will be described in detail.

[2. Resin composition for reflector]

The resin composition for a reflector used in the formation of the light-reflecting surface of the reflector of the embodiment of the present invention contains at least a resin and an inorganic filler containing a white pigment and a fibrous filler.

<Resin>

The resin which can be used in the present embodiment may be any resin which can be used in the molding of the light-reflecting surface, and examples thereof include polyamine, polycarbonate, acrylic resin, polyacetal, and polyethylene terephthalate. Diester, polystyrene, etc. Among them, a polyolefin resin is preferably used. The resin may be used singly or in combination with a different resin. Further, block polymers, copolymers, and terpolymers obtained from different monomers can also be used.

Examples of the polyolefin resin include a resin obtained by ring-opening metathesis polymerization of polyethylene, polypropylene, polybutene, polymethylpentene, and norbornene derivative, or a hydrogenated resin thereof. Among them, the polyolefin resin is preferably at least one selected from the group consisting of polyethylene, polypropylene, polyethylene having a cyclic structure, polypropylene having a cyclic structure, and polymethylpentene.

Polymethylpentene has the following characteristics: a melting point of 230 to 240 ° C is high, and it does not decompose even when the molding temperature is about 280 ° C, and is excellent in chemical resistance and electrical insulation. When such a characteristic is considered, a polyolefin resin such as polymethylpentene can be preferably used, for example, in a reflector of a semiconductor light-emitting device.

As the polymethylpentene resin, a homopolymer of 4-methylpentene-1 is preferred, but 4-methylpentene-1 and other α-olefins such as ethylene, propylene, and 1-butyl may also be used. Alkene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-octadecene, 1-eicosene, 3-methyl A copolymer of a 2- to 20-membered α-olefin such as 1-butene or 3-methyl-1-pentene, that is, a copolymer mainly composed of 4-methyl-1-pentene.

In the present embodiment, the polyolefin used in the resin composition for a reflector can be used. The resin preferably has a weight average molecular weight of from 220,000 to 800,000.

When the weight average molecular weight of the polyolefin resin is in the above range, cracking of a molded body such as a reflector obtained by molding a resin composition for a reflector containing a polyolefin resin can be suppressed, and for example, a reflector in the reflow step can be prevented. Damage, etc.

In addition, the lower limit of the weight average molecular weight is preferably 230,000 or more, and more preferably 240,000 or more, from the viewpoint of moldability of the resin composition for a reflector containing a polyolefin resin. Further, the upper limit of the weight average molecular weight is preferably 700,000 or less, more preferably 650,000 or less.

Further, the weight average molecular weight is preferably a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography (GPC). However, the method is not limited to this as long as it is a method capable of measuring the weight average molecular weight with good reproducibility. For example, the weight average molecular weight can be determined by the exemplified method for materials extracted with a suitable solvent.

An example of the measurement conditions using the weight average molecular weight of GPC is as follows.

Dissolved solution: o-dichlorobenzene

Temperature: 140~160°C

Flow rate: 1.0mL/min

Sample concentration: 1.0g / L

Injection volume: 300μL

<Inorganic filler>

In the present embodiment, the inorganic filler used in the resin composition for a reflector contains a white pigment and a fibrous filler. Hereinafter, the inorganic filler will be described.

(white pigment)

In the present embodiment, as a white pigment which can be used in the resin composition for a reflector, Titanium oxide, zinc sulfide, zinc oxide, barium sulfide, potassium titanate or the like may be used singly or in combination.

The white pigment is used to impart a white hue to the molded body obtained from the resin composition, and in particular, the light reflectance of the molded body can be improved by setting the color tone to a white color. In the case where the molded body is a reflector, a good light reflectance is required. Therefore, as the white pigment, it is preferred to use titanium oxide which is easy to obtain and excellent in light reflectance.

The average particle diameter of the white pigment in the primary particle size distribution is preferably 0.10 μm or more and 0.50 μm or less, more preferably 0.10 μm or more and 0.40 μm or less, from the viewpoint of obtaining the moldability and obtaining a high reflectance. Further, it is preferably 0.21 μm or more and 0.25 μm or less. The average particle diameter can be obtained as the mass average value D50 in the particle size distribution measurement by the laser light diffraction method.

(fibrous filler)

In the present embodiment, the inorganic filler used in the resin composition for a reflector needs to contain a fibrous filler, and the radial cross-sectional area of the fibrous filler needs to be 1 μm ² or more and 100 μm ² or less. When the radial cross-sectional area of the fibrous filler is less than 1 μm ² , the strength of the filler is lowered, and it is easy to be broken and bent in the longitudinal direction of the fiber during processing, and the length is shortened. As a result, a sufficient reinforcing effect cannot be obtained and heat resistance is obtained. Sexual decline.

There are several methods for measuring the cross-sectional area of the fibrous filler. The cross-sectional area of the fibrous filler of the present embodiment is as follows: the reflector of the semiconductor light-emitting device is broken, and the measured value obtained by SEM observation of the fractured section is obtained. Calculated.

That is, in the SEM image, the diameter of the fibrous filler present in the cross section of the reflector was measured. When the cross section of the filler is an elliptical shape, the long diameter and the short diameter of the ellipse are measured, and the ratio of the long diameter to the short diameter is 0.8 or more and 1.2 or less, and the average value of at least 10 cross sections is used. The cross-sectional area of the fibrous filler was set.

When the cross-sectional area of the fibrous filler is calculated from the diameter obtained by the measurement, the diameter is determined by measuring the number of significant digits to three digits. In addition, the cross-sectional area is calculated as an average value of 50% of the total number of the cross-sectional areas in the cross section of the fibrous filler, and the third digit of the calculated value is rounded off to be a measured value.

When the radial cross-sectional area of the fibrous filler exceeds 100 μm ² , the fluidity in the resin is lowered, so that it becomes difficult to uniformly fill the vicinity of the interface between the reflector and the substrate, so that the fibrous filler does not exist at the interface. In the vicinity, the strength in the vicinity of the interface is lowered, and when used in a semiconductor light-emitting device or the like, the adhesion between the reflector and the substrate is lowered.

From the above viewpoint, the lower limit of the cross-sectional area of the radial direction of the fibrous filler is preferably 30 μm ² , more preferably 35 μm ² . Further, the upper limit of the cross-sectional area in the radial direction of the fibrous filler is preferably 85 μm ² , more preferably 50 μm ² .

Examples of the fibrous filler include asbestos fibers, carbon fibers, graphite fibers, metal fibers, slag fibers, gypsum fibers, cerium oxide fibers, cerium oxide-alumina fibers, zirconia fibers, boron nitride fibers, cerium nitride fibers, and boron. Fiber, glass fiber, etc.

In the above, the fibrous filler is preferably a glass fiber containing 60% by mass or more of cerium oxide from the viewpoint of forming a light reflecting surface of the reflector and increasing the light reflectance. The ratio of the cerium oxide in the fibrous filler is more preferably 65% by mass or more, and still more preferably 70% by mass or more.

The cross-sectional shape of the fibrous filler may be a generally circular shape or a profiled cross section such as a flat shape. Further, it may not be a fiber having a cross-sectional shape and a cross-sectional area. The cross-sectional area in this case is defined as the cross-sectional area obtained by averaging the cross-sectional areas which are different in the longitudinal direction.

As an example, when the fibrous filler is glass fiber, the cross-sectional area is preferably a size that satisfies the cross-sectional area, and the short-diameter D1 of the cross-section is 0.5 μm or more and 25 μm. Next, the long diameter D2 is 0.5 μm or more and 300 μm or less, and the ratio D2/D1 of D2 to D1 is 1.0 or more and 30 or less. Further, the average fiber length of the glass fibers is preferably 0.75 μm or more and 300 μm or less. Such a glass fiber is also called a milled fiber and can be obtained by pulverizing long fibers.

(Other inorganic fillers)

In the present embodiment, as the inorganic filler other than the white pigment and the fibrous filler which can be blended in the resin composition for a reflector, generally, it can be formulated as a thermoplastic resin composition; for example, an epoxy resin or an acrylic resin. The inorganic filler of the thermosetting resin composition such as a resin or a polyoxynylene resin, and an inorganic filler which does not inhibit the reflection property of the reflector, may be used singly or in combination.

Examples include, for example, aluminum borate whiskers, magnesium whiskers, lanthanum whiskers, ash, stone amphibole, sepiolite, hard strontium sulphate, cerium oxide particles, layered ceric acid salts, and the like. Layered tantalate, glass flakes, non-swelling mica, graphite, metal foil, ceramic beads, clay, mica, sericite, zeolite, bentonite, dolomite, kaolin, powder mash obtained by ion exchange of organic hydrazine A plate-like or particulate inorganic filler such as carbon nanoparticle such as acid, feldspar powder, white sand hollow sphere, gypsum, uniform quartzite, dawsonite and white soil fullerene.

<Crosslinking treatment agent>

In the present embodiment, the resin composition for a reflector may further contain a crosslinking treatment agent. In the case where the resin composition contains a crosslinking treatment agent, after being shaped into a shape of a reflector, an electron beam is irradiated to obtain a reflector. Thereby, the reflector of this embodiment can be provided with more excellent heat resistance.

The crosslinking treatment agent has a structure of at least one ring structure having a saturated or unsaturated state, and an allyl group, a methallyl group bonded to at least one of the atoms forming the ring structure, Any allyl group-containing substituent via the allyl group of the linking group and the methallyl group via the linking group.

The resin composition of the present embodiment exhibits excellent electron beam curability by containing a crosslinking treatment agent having such a structure, and has excellent heat resistance.

Examples of the saturated or unsaturated ring structure include a cyclic ring, a hetero ring, and an aromatic ring. The number of atoms forming the ring structure is preferably from 3 to 12, more preferably from 5 to 8, and further preferably a 6-membered ring. The number of ring structures is preferably from 1 to 3, more preferably 1 or 2, and still more preferably 1.

The molecular weight of the crosslinking treatment agent is preferably 1,000 or less, more preferably 500 or less, still more preferably 300 or less. By obtaining a good dispersibility in a resin composition by a molecular weight of 1,000 or less, an effective crosslinking reaction by electron beam irradiation can be caused.

The melting point of the crosslinking treatment agent is preferably not more than the melting point of the polyolefin resin to be used, and is preferably, for example, 200 ° C or lower.

When the crosslinking treatment agent is used, the fluidity at the time of molding is excellent, so that the molding temperature of the resin composition can be lowered to reduce the heat load, reduce the friction during molding, or increase the content of the inorganic filler containing a white pigment.

Examples of the linking group in the crosslinking treatment agent include an ester bond, an ether bond, an alkylene group, and a (hetero) extended aryl group. The atoms in the ring-forming atoms which are not bonded to the allyl-based substituent are in a state in which hydrogen, oxygen, nitrogen, or the like is bonded; or a state in which various substituents are bonded.

In the present embodiment, the crosslinking treatment agent which can be used in the resin composition for a reflector is preferably independently formed on at least two of the atoms of one ring in which the crosslinking agent is formed. The bond has an allyl group substituent. Further, in the case where the ring structure is a 6-membered ring, it is preferably independently bonded to at least two of the atoms forming the ring. The allyl-based substituent, and preferably another allyl-based substituent is bonded to the atom to which one of the allyl-based substituents is bonded.

Further, the crosslinking treatment agent is preferably represented by the following formula (1) or (2).

(In the formula (1), R ¹ to R ³ are each independently an allyl group, a methallyl group, an allyl group via an ester bond, and a methally group via an ester bond. Base substituent)

(In the formula (2), R ¹ to R ³ are each independently an allyl group, a methallyl group, an allyl group via an ester bond, and a methally group via an ester bond. Base substituent)

Examples of the crosslinking treatment agent represented by the above formula (1) include triallyl isocyanurate, methyl diallyl isocyanurate, diallyl monoglycidyl isocyanurate, and Monoallyl diglycidyl cyanurate, trimethylallyl isocyanurate, and the like.

The crosslinking treatment agent represented by the above formula (2) includes diallyl phthalate, diallyl isophthalate, and the like.

Further, in the present embodiment, it is also possible to improve the formability and the object as a reflector. For the purpose of the property, the elastomer is blended with the polyolefin resin as needed.

The elastomeric system has a glass transition temperature of 40 ° C or less, and comprises a usual colloidal polymer and a thermoplastic elastomer. Further, in the case of a block copolymerized colloidal polymer or the like and the glass transition temperature is 2 or more, the glass transition temperature which can be used as the present invention is 40 as long as the minimum glass transition temperature is 40 ° C or lower. Glue polymer below °C.

Examples of the elastomer include an isoprene rubber and a hydrogenated product thereof; a chloroprene rubber, a hydrogenated product thereof; an ethylene-propylene copolymer, an ethylene-α-olefin copolymer, a propylene-α-olefin copolymer, and the like. a saturated polyolefin rubber; a diene copolymer such as an ethylene-propylene-diene copolymer, an α-olefin-diene copolymer, an isobutylene-isoprene copolymer, an isobutylene-diene copolymer, or the like a hydride of a diene polymer or a halide thereof; an acrylonitrile-butadiene copolymer, a hydride thereof; a vinylidene fluoride-trifluoroethylene copolymer, a vinylidene fluoride-hexafluoropropylene copolymer, or a partial Fluororubber such as difluoroethylene-hexafluoropropylene-tetrafluoroethylene copolymer, propylene-tetrafluoroethylene copolymer; urethane rubber, polyoxyethylene rubber, polyether rubber, acrylic rubber, chlorosulfonated polyethylene Special rubber such as rubber, epichlorohydrin rubber, propylene oxide rubber, ethylene acrylic rubber; copolymer of norbornene monomer and ethylene or α-olefin, norbornene monomer, ethylene and α-olefin Meta-copolymer, ring-opening polymer of norbornene-based monomer, norbornene-based single a decene-based colloidal polymer such as a ring-opening polymer hydride; a random or block-styrene-butadiene system such as styrene-butadiene-rubber or high-styrene rubber which is subjected to emulsion polymerization or solution polymerization Copolymer, such hydrides; aromatics such as styrene-butadiene-styrene-rubber, styrene-isoprene-styrene-rubber, styrene-ethylene-butadiene-styrene-rubber Random copolymer of vinyl monomer-conjugated diene, such hydride; styrene-butadiene-styrene-rubber, styrene-isoprene-styrene-rubber, styrene-ethylene - A linear or radial block copolymer of an aromatic vinyl monomer such as butadiene-styrene-rubber or a conjugated diene, or an amine ester represented by a styrene thermoplastic elastomer such as a hydride such as a styrene-based rubber And a thermoplastic elastomer such as a thermoplastic elastomer, a polyamide-based thermoplastic elastomer, a 1,2-polybutadiene-based thermoplastic elastomer, a vinyl chloride-based thermoplastic elastomer, or a fluorine-based thermoplastic elastomer, and the like A thermoplastic resin containing an alicyclic structure is incompatible.

Among these, the copolymer of the aromatic vinyl monomer and the conjugated diene monomer, and the hydrogenated product thereof and the thermoplastic resin containing the alicyclic structure are excellent in dispersibility, which is preferable. The copolymer of the aromatic vinyl monomer and the conjugated diene monomer may be a block copolymer or a random copolymer. In terms of weather resistance, it is more preferable to hydrogenate a part other than the aromatic ring. Specific examples thereof include a styrene-butadiene block copolymer, a styrene-butadiene-styrene-block copolymer, a styrene-isoprene-block copolymer, and a styrene-isoprene. Diene-styrene-block copolymers and such hydrides, styrene-butadiene-random copolymers, and such hydrides.

In the present embodiment, various additives can be contained in the resin composition for a reflector as long as the function of the reflector formed by the resin composition for the reflector is not broken. For example, various whiskers, polyfluorene oxide powders, thermoplastic elastomers, organic synthetic rubbers, fatty acid esters, glycerates, zinc stearate, calcium stearate, etc. can be blended for the purpose of improving the properties of the resin composition. Moulding agent, benzophenone system, salicylic acid system, cyanoacrylate system, isocyanurate system, anilide oxalate system, benzoate system, hindered amine system, benzotriene An additive such as an azole or phenolic antioxidant or a light stabilizer such as a hindered amine or benzoate.

Further, in the resin composition for a reflector, a dispersing agent such as a decane coupling agent may be blended in addition to the above additives. As the decane coupling agent, for example, hexamethyldioxane is exemplified. Dioxazane; cyclic decazane; trimethyl decane, trimethyl chlorodecane, dimethyl dichloro decane, methyl trichloro decane, allyl dimethyl chloro decane, trimethoxy decane, Benzyl dimethyl chlorodecane, methyl trimethoxy decane, methyl triethoxy decane, isobutyl trimethoxy decane, dimethyl dimethoxy decane, dimethyl diethoxy decane, three Methyl methoxy decane, hydroxypropyl trimethoxy decane, phenyl trimethoxy decane, n-butyl trimethoxy decane, n-hexadecyl trimethoxy decane, n-octadecyl trimethoxy decane, a vinyl decane compound such as vinyl trimethoxy decane, vinyl triethoxy decane, γ-methyl propyloxypropyl trimethoxy decane, and vinyl triethoxy decane; γ-aminopropyl Triethoxy decane, γ-(2-aminoethyl)aminopropyltrimethoxydecane, γ-(2-aminoethyl)aminopropylmethyldimethoxydecane, N-benzene 3-aminopropyltrimethoxydecane, N-(2-aminoethyl) 3-aminopropyltrimethoxydecane, and N-β-(N-vinylbenzylaminoethyl )-γ-aminopropyl trimethyl An aminodecane compound such as oxydecane or hexyltrimethoxydecane.

In the present embodiment, the resin composition for a reflector may be melt-kneaded with the polyolefin resin and an inorganic filler containing a white pigment and a fibrous filler to form a granulated product such as pellets. As the melt kneading method, a known melt kneading method such as a melt kneading extruder, a two-roll mill or a three-roll mill, a mixer such as a homogenizer or a planetary mixer, or a melt kneader such as a Polylabo system or a Laboplastomill can be used.

<Content ratio of each component in the resin composition for a reflector>

In the resin composition for a reflector used in the present embodiment, the resin content is preferably 7 mass% or more and 30 mass% or less based on the total mass of the resin composition for a reflector. The lower limit of the content of the resin is more preferably 10% by mass, still more preferably 11% by mass. Moreover, the upper limit of the content of the resin is more preferably 28% by mass, and still more preferably 25% by mass or less. If resin When the content is in the above range, the molded article having excellent heat resistance can be obtained while ensuring moldability in molding the resin composition.

In the present embodiment, the content of the inorganic filler in the resin composition for a reflector is preferably 70% by mass or more, more preferably 72% by mass or more, based on the total mass of the resin composition for a reflector, and more preferably 75 mass% or more. From the viewpoint of moldability, the upper limit of the inorganic filler content is about 90% by mass. When the inorganic filler content is 70% by mass or more, the heat resistance required in the reflow step can be satisfied.

In addition, the content of the white pigment is preferably more than 200 parts by mass and not more than 500 parts by mass based on 100 parts by mass of the resin, from the viewpoint of the product such as the light reflectance, the strength, and the warpage of the warpage. Moreover, it is more preferably 300 parts by mass or more and 480 parts by mass or less, and still more preferably 350 parts by mass or more and 450 parts by mass or less.

When the content of the white pigment exceeds 200 parts by mass based on 100 parts by mass of the resin, sufficient product properties can be obtained in terms of light reflectance, strength, warpage of the formation, and the like of the reflector. In addition, when it is 500 parts by mass or less, deterioration of workability due to a large amount of inorganic components or deterioration of a molded state can be prevented.

In addition, by setting the content of the white pigment in the inorganic filler to the above range, the color tone of the reflector formed by the resin composition for the reflector can be made white, and a light reflectance which is preferable as a reflector can be obtained. .

The content of the fibrous filler in the inorganic filler is preferably 10 parts by mass or more and 300 parts by mass or less, more preferably 30 parts by mass or more and 200 parts by mass or less, and still more preferably 50 parts by mass or more based on 100 parts by mass of the resin. 180 parts by mass or less.

By setting the content of the fibrous filler in the inorganic filler to the above range, it is possible to prevent The illuminator preferably has a light reflectance that satisfies the heat resistance required in the reflow step.

In the present embodiment, when the crosslinking agent is contained in the resin composition for a reflector, the content of the crosslinking treatment agent can be 15 parts by mass or more and 40 parts by mass or less, preferably 100 parts by mass or less of the resin. It is 15 parts by mass or more and 30 parts by mass or less, more preferably 16 parts by mass or more and 20 parts by mass or less. When the crosslinking treatment agent is in the above range, the crosslinking treatment agent can be effectively crosslinked without oozing out from the molded body before crosslinking.

<The ash component after combustion of the resin composition for the reflector>

In the present embodiment, the ash component according to the TG-DTA method of the resin composition for a reflector is required to be 70% by mass or more and 90% by mass or less based on the total mass of the resin composition for a reflector before heating.

Here, the ash component according to the TG-DTA method means that the mass of the resin composition for the reflector is measured by a thermogravimetric/differential thermal synchronization analyzer in the same manner as the above-described conditions, and is 10 ° C in an atmospheric environment. After heating to 600 ° C /min, the mixture was heated at 600 ° C for 30 minutes to leave a residual ash content.

If the ash content of the resin composition for a reflector is less than 70% by mass, the heat resistance required in the reflow step and the required reflectance cannot be satisfied. Further, when the ash content exceeds 90% by mass, the formability of the reflector is lowered.

From the above viewpoint, the lower limit of the ash component is preferably 72% by mass, more preferably 75% by mass. Further, the upper limit of the ash component is preferably 88% by mass, more preferably 85% by mass.

In the present embodiment, when the reflector is molded from the resin composition for a reflector, a molding method such as transfer molding, compression molding, or injection molding can be used. For example, in the case of using the injection molding method, the injection can be performed at a cylinder temperature of 200 to 400 ° C and a mold temperature of 20 to 150 ° C. A molded body which is shaped to obtain a shape of a reflector. In the case where a crosslinking treatment agent is used, the obtained shaped body is subjected to an electron beam irradiation treatment, whereby a further hardened reflector can be obtained. As described above, the heat resistance of the reflector can be further improved by performing the electron beam irradiation treatment.

Further, the resin composition for the reflector before molding may be subjected to electron beam irradiation treatment, or the resin composition for the reflector after the electron beam irradiation treatment may be formed into a shape desired as a reflector.

The accelerating voltage of the electron beam can be appropriately selected depending on the size of the resin composition for the reflector or the thickness of the reflector after molding. For example, in the case of a reflector having a thickness of about 1 mm, the crosslinking treatment agent to be used can be crosslinked and hardened by an acceleration voltage of about 250 to 3000 kV. Further, when the electron beam is irradiated, the higher the acceleration voltage is, the more the transmission ability is increased. Therefore, when the substrate which is deteriorated by the electron beam is used as the substrate, the depth of penetration of the electron beam and the thickness of the molded body are substantially By selecting the accelerating voltage in such a manner as to be equal, it is possible to suppress the irradiation of the excess electron beam to the molded body, and to minimize the deterioration of the molded body due to the excessive electron beam. Further, the absorbed dose when irradiating the electron beam is appropriately set depending on the composition of the resin composition, but it is preferably such that the crosslinking density in the molded body is saturated, and the irradiation dose is preferably 50 to 600 kGy.

Further, the electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockcroft Walton type, a Vande Graft type, a resonant transformer type, an insulated core transformer type, or a linear type, a high frequency high voltage type, and a high frequency type can be used.

[3. Lead frame with reflector]

A lead frame with a reflector according to an embodiment of the present invention includes a reflector having the light reflecting surface, and the light reflecting surface is formed of a resin composition containing the resin and an inorganic filler containing a white pigment and a fibrous filler. The fibrous filler has a radial cross-sectional area of 1 μm ² or more and 100 μm ² or less, and after measuring the mass of the reflector before heating by using a thermogravimetric/differential thermal synchronous analyzer according to the TG-DTA method, After raising the temperature to 600 ° C at 10 ° C / min in an air atmosphere, the ash content remaining at 600 ° C for 30 minutes is 70% by mass or more and 90% by mass or less based on the total mass of the reflector before heating. .

The lead frame with a reflector according to the present embodiment can be manufactured by molding the resin composition for a reflector into a desired reflector shape by injection molding on a lead frame.

Here, the lead frame means a substrate on which a reflector is placed. The lead frame can be used as long as it can be used as a substrate in the field of semiconductor light-emitting devices. Examples of the material of the lead frame include ceramics made of a sintered body such as alumina, aluminum nitride, mullite, or glass. In addition, a flexible resin material such as a polyimide resin may be mentioned. In particular, a substrate for a reflector formed of a metal is referred to as a lead frame. Further, the shape of the terminal portion or the like formed in the lead frame may be formed by half etching.

As the metal material forming the substrate for the reflector, an alloy of aluminum, copper, and copper can be used. Further, in order to increase the reflectance, plating may be performed by a noble metal having a high reflectance such as silver.

Further, the thickness of the lead frame with a reflector of the present embodiment is preferably 0.1 mm or more and 3.0 mm or less.

[4. Semiconductor light-emitting device]

A semiconductor light-emitting device according to an embodiment of the present invention is illustrated in Fig. 1 . The semiconductor light-emitting device of the present embodiment has an optical semiconductor element 10 and a reflector 12 on a substrate 14, and the reflector 12 is provided around the optical semiconductor element 10 and has light from the optical semiconductor element 10. A light reflecting surface that is reflected in a specific direction. The optical semiconductor component 10 is preferably an LED component or an LED package. In the semiconductor light-emitting device, the reflector 12 corresponds to the reflector, and at least a part of the light-reflecting surface (in the case of FIG. 1) is formed of a molded body composed of the resin composition for the reflector.

The optical semiconductor element 10 has an activity of, for example, AlGaAs, AlGaInP, GaP or GaN, which is carried out by n-type and p-type cladding layers to release emitted light (generally, UV or blue light in a white light LED). The semiconductor wafer (light-emitting body) having a double heterostructure of a layer has a shape of a hexahedron having a length of about 0.5 mm on one side. Further, in the case of the wire bonding structure, it is connected to an electrode (connection terminal) (not shown) via the lead wire 16.

The shape of the reflector 12 depends on the shape of the end portion (joining portion) of the lens 18, and is generally cylindrical or circular, such as an angular shape, a circular shape, or an elliptical shape. In the schematic cross-sectional view of FIG. 1, the reflector 12 is a cylindrical body (annular body), and all end faces of the reflector 12 are in contact with and fixed to the surface of the substrate 14.

Further, in order to improve the directivity of light from the optical semiconductor element 10, the inner surface of the reflector 12 may be expanded upward into a tapered shape (see Fig. 1).

Further, when the end portion on the lens 18 side is processed into a shape corresponding to the shape of the lens 18, the reflector 12 can also function as a lens holder.

As shown in Fig. 2, the reflector 12 may have only the light reflecting surface side as the light reflecting layer 12b composed of the resin composition of the present invention. In this case, the thickness of the light-reflecting layer 12b is preferably 500 μm or less, and more preferably 300 μm or less from the viewpoint of lowering the thermal resistance. The member 12a forming the light reflection layer 12b may be composed of a known heat resistant resin.

As described above, the reflector 12 is provided with a lens 18 which is usually made of a resin, and which has various structures and colors depending on the purpose, use, and the like.

The space formed by the substrate 14, the reflector 12, and the lens 18 may be a transparent sealing portion, and may be a void portion as needed. The space portion is usually a transparent sealing portion filled with a material that imparts light transmissivity and insulation, and in the wire bonding structure, electrical defects due to the following conditions can be prevented: force applied by direct contact with the lead wires 16 And the indirect indirect application of vibration, impact, etc., and the lead wire 16 is separated, cut, or short-circuited from the connection portion with the optical semiconductor element 10 and/or the connection portion with the electrode. Further, at the same time, the optical semiconductor element 10 can be protected from moisture, dust, and the like, and reliability can be maintained over a long period of time.

Examples of the material (transparent sealant composition) that imparts the light transmissivity and the insulating property include a polyoxymethylene resin, an epoxy polyoxyn resin, an epoxy resin, an acrylic resin, and a polyimide resin. Polycarbonate resin, etc. Among these, a polyoxyxylene resin is preferable from the viewpoint of heat resistance, weather resistance, low shrinkage, and discoloration resistance.

Hereinafter, an example of a method of manufacturing the semiconductor light-emitting device shown in FIG. 1 will be described.

First, the reflective material resin composition according to the embodiment of the present invention is formed into a specific shape reflection on the substrate 14 by transfer molding, compression molding, injection molding, or the like using a mold having a cavity space having a specific shape. 12 Since the substrate is placed in a mold and a resin is formed thereon, it is also referred to as injection molding. Thereafter, the separately prepared optical semiconductor element 10 and the electrode are fixed to the substrate 14 by an adhesive or a bonding member, and the LED element is connected to the electrode by the lead 16.

Then, a transparent sealant composition containing a polyoxymethylene resin or the like is injected into the concave portion formed by the substrate 14 and the reflector 12, and is cured by heating, drying, or the like to form a transparent sealing portion. Thereafter, the lens 18 is disposed on the transparent sealing portion to obtain the semiconductor light emitting device shown in FIG.

Further, the lens 18 may be removed after the transparent sealant composition is not cured, and the composition may be cured.

The resin composition for a reflector of the present embodiment can be preferably used because it has excellent adhesion to a molded article obtained by molding the resin composition for a reflector, thereby improving the sealing property and improving the life of the semiconductor device. In the manufacture of a lead frame with a reflector having a thickness of 3.0 mm or less, preferably 1.0 mm or less, more preferably 0.8 mm or less, or a reflector for a thin semiconductor light-emitting device package.

[Examples]

The reflector of the embodiment of the present invention will be described in detail using an embodiment. The invention is not limited to the embodiments.

[Resin composition for reflector]

The resin composition for a reflector of the examples and the comparative examples was produced by the following method, and the moldability and ash content were evaluated. The results are shown in the first table.

<Production of Resin Composition for Reflector>

According to the blending formula shown in Table 1, an extruder (Japan Placon Co., Ltd. MAX30: die tip diameter: 3.0 mm) and a granulator (Toyo Seiki Co., Ltd. MPETC1) were mixed to obtain reflections. A resin composition for the device.

‧Polyolefin resin...polymethylpentene resin, weight average molecular weight = 497,000)

‧White pigment...Titanium oxide particles: average particle size is 0.21μm

‧Fibrous filler 1...glass fiber: PF70E-001 (manufactured by Nitto Bose Co., Ltd., glass fiber with an average fiber length of 62 μm and an average cross-sectional area of 104.2 μm ² and a circular cross section)

‧Fibrous filler 2...glass fiber: SS05DE-413SP (made by Ridong Textile Co., Ltd., glass fiber with an average fiber length of 65 μm, an average cross-sectional area of 41.6 μm ² , and a circular cross section)

‧Fibrous filler 3...glass fiber: EFDE50-01 (manufactured by Central Glass Fiber Co., Ltd., average fiber length 55 μm, average cross-sectional area 33.2 μm ² )

‧Fibrous filler 4...glass fiber: MF03JB1-20 (manufactured by Asahi Fiber Glass Co., Ltd., average fiber length 34 μm, average cross-sectional area 81.7 μm ² )

‧Fibrous filler 5...glass fiber: MF03JB1-20 (manufactured by Asahi Fiber Glass Co., Ltd., average fiber length 71 μm, average cross-sectional area 81.7 μm ² )

‧ cross-linking treatment agent... triallyl isocyanurate

‧ decane coupling agent... hexyl trimethoxy decane

‧Antioxidant 1...IRGANOX1010 (manufactured by BASF Japan Co., Ltd.)

‧Antioxidant 2...bis(2,6-ditributyl-4-methylphenyl)neopentitol diphosphite

‧ release agent... zinc stearate

Further, in the fibrous fillers 1 to 5, the average fiber length and the average cross-sectional area were fixed to the SEM observation sample stage by using a carbon ribbon to be mixed with the fibrous filler before the reflector resin composition, by SEM ( Hitachi High-Tech Co., Ltd. S-4800) The value measured by observation. Calculated as an average value of at least 10 fibrous fillers.

<Particle made>

The step of obtaining the above resin composition is carried out by using a screw of an extruder, and the granulated resin composition is stably obtained in this step, and is applied to the extruder. When the load of the screw is large and the granulated resin composition cannot be stably obtained in a state in which continuous operation cannot be achieved, it is considered to be unacceptable.

<formability>

Using the resin composition for the reflector, a lead frame with a reflector was fabricated under the following conditions.

A resin composition (thickness: 700 μm, outer dimension: 35 mm × 35 mm, opening: 2.9 mm ×) was formed on a silver-plated frame (thickness: 250 μm) using an injection molding machine Sodick TR40ER Sodick (Pre-plastic Ziating). 2.9 mm) to obtain a lead frame with a reflector. The conditions of the injection molding machine were set to a cylinder temperature: 270 ° C, a mold temperature: 80 ° C, an injection speed: 100 mm/sec, a holding pressure: 80 MPa, a dwell time: 1 sec, and a cooling time: 8 sec.

After the molding, a short circuit was formed when the resin composition for the reflector was not completely filled in the mold. Moreover, the burrs of the opening of the lead frame with the reflector were measured with a microscope, and the maximum width was 100 μm or more, and burrs were generated. In the case where the case is not satisfied, the formability is good.

<ash component>

After measuring the mass of the resin composition for a reflector by a thermogravimetric/differential thermal synchronous analyzer according to the TG-DTA method, the temperature is raised to 600 ° C at 10 ° C / min in an aluminum atmosphere in an aluminum pan, at 600 The weight of the remaining ash was measured by heating at ° C for 30 minutes, and the ratio of the mass after heating to the mass before heating was determined.

[The cured product of the resin composition for the reflector]

The cured product of the resin composition for a reflector of the examples and the comparative examples was produced by the following method, and the deflection temperature under load was evaluated. The results are shown in the first table.

<Production of cured resin composition for reflector>

The injection molded machine Sodick TR40ER Sodick (preplasticized type) was used to form a resin molded article for a reflector by ASTM using a dumbbell mold. The conditions of the injection molding machine were set to a cylinder temperature: 260 ° C, a mold temperature: 45 ° C, an injection speed: 15 mm/sec, a holding pressure: 55 MPa, a dwell time: 7 sec, and a cooling time: 15 sec. The molded product was irradiated with an electron beam at an acceleration voltage of 800 kV and an irradiation dose of 400 kGy to be cured, thereby obtaining a cured resin composition for a reflector.

<heat distortion temperature>

For the test piece, the temperature at which the predetermined amount of deflection is reached is set as the load deflection temperature (heat distortion temperature) in accordance with ASTM D648.

[Lead frame with reflector]

The lead frames with reflectors of the examples and the comparative examples were produced by the following methods, and the adhesion, reflectance, and durability A were evaluated. The results are shown in the first table.

<Production of Lead Frame with Reflector>

In the following evaluation, a resin composition for a reflector which was produced under the same conditions as those used for the above-mentioned moldability evaluation was irradiated with an electron beam at an acceleration voltage of 800 kV and an irradiation dose of 400 kGy to obtain a lead wire with a reflector. frame.

<tightness>

The adhesion of each test piece to the substrate of the lead frame with the reflector was measured by a red liquid penetration test to determine whether it was acceptable. Specifically, 0.8 μL of red ink ("INK30R" manufactured by PILOT CORPORATION) was dropped into the cavity of the reflector, and the penetration of the ink to the back side after 6 hours was observed by a 50-fold optical microscope. The evaluation criteria are as follows.

No penetration was observed to be acceptable after 6 hours.

The situation of penetration observed after 6 hours was set as unacceptable.

<reflectance>

The light reflectance of the obtained lead frame of the lead frame of the obtained reflector at a wavelength of 230 to 780 nm was measured using a reflectance measuring device MCPD9800 (manufactured by Otsuka Electronics Co., Ltd.). The comparison was made using a reflectance at a wavelength of 450 nm.

<Durability A>

The reflectance of the test piece of the lead frame to which the reflector was attached was measured at 200 ° C for 45 hours. When the reflectance was measured, the measurement was carried out under the same conditions using the above-described reflectance measuring device. The comparison was made using a reflectance at a wavelength of 450 nm.

[Lighting device]

The light-emitting device was fabricated using the lead frames with reflectors of the examples and the comparative examples, and the diameters of the initial light beam and the glass fibers were evaluated. The results are shown in the first table.

The resin composition for a reflector prepared according to the formulation shown in Table 1 was molded into a reflector shape, and the molded body was irradiated with an electron beam at an acceleration voltage of 800 kV and an irradiation dose of 400 kGy to be cured. After hardening, a lead frame with a reflector is obtained. The obtained lead frame of the reflector and the separately prepared LED element and electrode are fixed to the substrate by an adhesive, and the LED element is connected to the electrode by a lead, and then cut and singulated to obtain a semiconductor light-emitting device. (LED package). Solder is placed on the wiring board, and the semiconductor light-emitting device is placed on the solder, and the solder is melted by heating in a reflow furnace to 240 ° C to bond the semiconductor light-emitting device to the wiring board.

<initial beam>

With the instantaneous multi-metering system (wide dynamic range type) MCPD-9800 (Otsuka Electronics Co., Ltd. has Co., Ltd. manufactures a light beam that emits light at a constant current of 200 mA and sets it as an initial light beam.

<Cross-sectional area of fibrous filler>

The cross-sectional area of the fibrous filler was measured as described below.

The reflector of the semiconductor light-emitting device was broken, and the fracture surface was observed by SEM (Hitachi High-Tech Co., Ltd. S-4800). After the fractured section was fixed substantially parallel to the sample stage made of metal, it was observed at a magnification of 2,500 times from the vertical direction of the fractured section.

In the obtained SEM image, the diameter of the fibrous filler present in the cross section of the reflector was measured. When the cross section of the filler is an elliptical shape, the long diameter and the short diameter of the ellipse are measured, and the ratio of the long diameter to the short diameter is 0.8 or more and 1.2 or less.

When the cross-sectional area of the fibrous filler was calculated from the diameter obtained by the measurement, the diameter was measured up to three digits of the effective number. Further, the cross-sectional area is calculated as an average value of 50% of the total number of measurements in the cross section of the fibrous filler from the smaller cross-sectional area. Sampling was performed in such a way that an average of at least 10 sections was obtained.

In other words, when the total number of measurements is 20, the average value of 10 from the smaller cross-sectional area is calculated. The third digit of the calculated value is rounded off to the value of the cross-sectional area.

As shown in the first table, it is understood that the resin composition for a reflector produced by using the formulation of Examples 1-4 can improve the adhesion without deteriorating the properties required for the production of the light-emitting device. In particular, the larger the cross-sectional area of the fibrous filler, the better the reflectance is exhibited. When the cross-sectional area of the fibrous filler was 81.7 μm ² , any of the reflectance and the durability A could be remarkably improved as compared with the comparative example.

The deterioration of the durability A of Comparative Example 3, Comparative Example 4, and Comparative Example 5 in which the ash content was 70% or less was remarkable, and the use to the light-emitting device was unsatisfactory. On the other hand, in Comparative Example 6, the resin composition used in the molding was not obtained, and thus it was not possible to use it as a reflector resin composition.

Claims (19)

A reflector having a light reflecting surface formed by a resin composition containing a resin and an inorganic filler containing a white pigment and a fibrous filler, wherein the fibrous filler has a radial cross-sectional area of 1 μm ² Above 100 μm ² or less, after measuring the mass of the reflector before heating by using a thermogravimetric/differential thermal synchronous analyzer according to the TG-DTA method, the temperature is raised to 600 ° C at 10 ° C /min in an atmospheric environment. The ash component remaining after heating at 600 ° C for 30 minutes is 70% by mass or more and 90% by mass or less based on the total mass of the reflector before heating. The reflector according to claim 1, wherein the fibrous filler has a radial cross-sectional area of 30 μm ² or more and 85 μm ² or less. The reflector according to claim 1 or 2, wherein the fibrous filler is a glass fiber containing 60% by mass or more of ceria. The reflector according to any one of claims 1 to 3, wherein the ash component is 72% by mass or more and 88% by mass or less based on the total mass of the reflector before heating. The reflector according to any one of claims 1 to 4, wherein the content of the white pigment is more than 200 parts by mass and not more than 500 parts by mass based on 100 parts by mass of the resin. The reflector according to any one of the above-mentioned claims, wherein the content of the white pigment is 300 parts by mass or more and 480 parts by mass or less based on 100 parts by mass of the resin. The reflector according to any one of claims 1 to 6, wherein the resin is a polyolefin resin. The reflector of claim 7, wherein the polyolefin resin is at least selected from the group consisting of polyethylene, polypropylene, polyethylene having a cyclic structure, polypropylene having a cyclic structure, and polymethylpentene. 1 species. The reflector according to any one of claims 1 to 8, wherein the white pigment is titanium oxide. The reflector according to any one of claims 1 to 9, wherein the resin composition further contains a crosslinking treatment agent. A reflector according to claim 10, wherein the resin composition is formed into a shape of the reflector, and then irradiated with an electron beam. A lead frame with a reflector, comprising a reflector having a light reflecting surface formed by a resin composition containing a resin and an inorganic filler containing a white pigment and a fibrous filler, the diameter of the fibrous filler The cross-sectional area of the direction is 1 μm ² or more and 100 μm ² or less, and the mass before heating of the reflector is measured using a thermogravimetric/differential thermal synchronous analyzer according to the TG-DTA method, and is 10 ° C/min in an atmosphere. After heating to 600 ° C, the ash content remaining after heating at 600 ° C for 30 minutes is 70% by mass or more and 90% by mass or less based on the total mass of the reflector before heating. The lead frame with a reflector as disclosed in claim 12 has a thickness of 0.1 mm or more and 3.0 mm or less. The lead frame with a reflector according to claim 12 or 13, wherein the resin is a polyolefin resin. A lead frame with a reflector as disclosed in claim 14 wherein the polyolefin tree is The fat is at least one selected from the group consisting of polyethylene, polypropylene, polyethylene having a cyclic structure, polypropylene having a cyclic structure, and polymethylpentene. A semiconductor light-emitting device comprising: an optical semiconductor element; a reflector disposed around the optical semiconductor element and reflecting light from the optical semiconductor element in a specific direction; and a substrate, wherein the optical semiconductor element and the reflector are disposed The reflector is a reflector of any one of claims 1 to 11 on the substrate. A resin composition comprising a resin and an inorganic filler containing a white pigment and a fibrous filler, wherein the fibrous filler has a radial cross-sectional area of 1 μm ² or more and 100 μm ² or less, using a thermal weight according to the TG-DTA method/ The differential thermal synchronization analyzer measures the mass of the resin composition before heating, and then raises the temperature to 600 ° C at 10 ° C / min in an atmospheric environment, and then heats at 600 ° C for 30 minutes to leave a residual ash component, before heating. The total mass of the reflector is 70% by mass or more and 90% by mass or less based on the total mass. The resin composition of claim 17, wherein the resin is a polyolefin resin. The resin composition of claim 18, wherein the polyolefin resin is selected from the group consisting of polyethylene, polypropylene, polyethylene having a cyclic structure, polypropylene having a cyclic structure, and polymethylpentene. At least one.