TW201633388A - Wafer processing tape - Google Patents

Abstract

The object of the present invention is to provide wafer processing tape capable of reducing the occurrence of a label trace, selecting a support member without reference to the thickness of an adhesive layer, and reducing the occurrence of entangling of air between an adhesive layer and an adhesive film. The present invention has the feature that the wafer processing tape comprises: a long mold releasing film (11); an adhesive layer (12) having a prescribed planar shape and provided on a first surface of the mold releasing film (11); an adhesive film (13) comprising a label part (13a) and a peripheral part (13b) surrounding the outside of the label part (13a), wherein the label part (13a) is configured to cover the adhesive layer (12) and provided in a manner of contacting with the mold releasing film (11) around the adhesive layer (12), and has the prescribed planner shape; and a support member (14) provided along a longitudinal edge direction of the mold releasing film (11) in the region including the portion corresponding to the adhesive layer (12) and not including the portion corresponding to the end in a short edge direction of the mold releasing film (11) of the label part (13a) on a second surface opposite to a first surface of the mold releasing film (11).

Description

Wafer processing tape

The present invention relates to a tape for wafer processing, and more particularly to a tape for wafer processing having two functions of a dicing tape and a die bond film.

Recently, a die-die bonding tape is being developed which combines a dicing tape for fixing a semiconductor wafer when the semiconductor wafer is cut and diced into individual wafers, and is used to follow the cut semiconductor wafer. A lead frame, a package substrate, or the like, or two functions of a die bond film (also referred to as a die attach film) for laminating semiconductor wafers on each other in a stacked package.

As such a dicing die-bonding tape, pre-cut processing may be performed in consideration of workability such as adhesion to a wafer or attachment to a ring frame at the time of dicing.

An example of a cut-die bond tape after pre-cut processing is shown in FIGS. 4 and 5. 4 is a view showing a state in which a dicing die-bonding tape is wound into a roll shape, FIG. 5(a) is a plan view of a dicing die bonding tape, and FIG. 5(b) is a view based on FIG. 5(a). A cross-sectional view of line BB. Cutting - The die bond tape 50 is composed of a release film 51, an adhesive layer 52, and an adhesive film 53. The subsequent agent layer 52 is a circular shape processed to correspond to the shape of the wafer, and has a circular label shape. The adhesive film 53 is a peripheral region in which a circular portion corresponding to the shape of the ring frame for cutting is removed, and as shown in the figure, has a circular label portion 53a and a peripheral portion 53b surrounding the outer side thereof. The adhesive layer 52 and the circular label portion 53a of the adhesive film 53 are laminated so as to be aligned with the center thereof, and the circular label portion 53a of the adhesive film 53 covers the adhesive layer 52 and is in contact with the release film 51 around the adhesive layer 51.

When the wafer is diced, the release film 51 is peeled off from the adhesive layer 52 and the adhesive film 53 in a laminated state, and as shown in FIG. 6, the back surface of the semiconductor wafer W is adhered to the adhesive layer 52, and the film is adhered to the film 53. A cutting ring frame R is adhered to the outer peripheral portion of the label portion 53a. In this state, the semiconductor wafer W is cut, and then the adhesive film 53 is subjected to a curing treatment such as ultraviolet irradiation or the like, and then the semiconductor wafer is picked up. At this time, since the adhesive film 53 is weakened by the curing treatment, it is easy to peel off from the adhesive layer 52, and the semiconductor wafer is picked up while the adhesive layer 52 is adhered to the back surface. The adhesive layer 52 attached to the back surface of the semiconductor wafer has a function of a die-bonding film when the semiconductor wafer is subsequently attached to a lead frame, a package substrate, or other semiconductor wafer.

However, as in the wafer dicing-wafer bonding tape 50 as described above, the portion where the adhesive layer 52 and the circular label portion 53a of the adhesive film 53 are laminated is thicker than the peripheral portion 53b of the adhesive film 53. Therefore, when the product is wound into a roll shape, the height difference between the adhesive layer 52 and the laminated portion of the circular label portion 53a of the adhesive film 53 and the peripheral portion 53a of the adhesive film 53 The mutual overlap causes a phenomenon in which the height difference is transferred to the surface of the soft adhesive layer 52, that is, a transfer mark (also referred to as a label mark, a wrinkle, or a winding trace) as shown in FIG. The occurrence of such a transfer mark is remarkable particularly in the case where the adhesive layer 52 is formed of a soft resin, the case where the thickness is present, and the case where the number of windings of the tape 50 is large. Then, if a transfer mark is generated, there is a possibility that a defect occurs in the processing of the wafer due to a defect in the adhesion between the adhesive layer and the semiconductor wafer.

In order to solve such a problem, a tape for wafer processing has been developed in which the release film is on the second surface opposite to the first surface on which the adhesive layer and the adhesive film are provided, and the short side direction of the release film. A support member is provided at both end portions (for example, refer to Patent Document 1). Since such a wafer processing tape is provided with a support member, when the wafer processing tape is wound into a roll shape, the winding pressure applied to the tape can be dispersed or concentrated on the support member, thereby suppressing Formation of a transprint of the adhesive layer.

Prior art literature Patent literature

Patent Document 1: Japanese Patent No. 4360653

However, in the tape for wafer processing described in Patent Document 1, in order to sufficiently suppress the formation of the transfer of the adhesive layer, it is necessary to support the tape. The thickness of the bearing member is set to be greater than the thickness of the adhesive layer, so there is a problem that there is a limitation in the selection of the supporting member. Further, the adhesive film covers the adhesive layer and is in contact with the release film around the adhesive film. However, depending on the thickness of the adhesive layer, extremely small voids and residual air may be generated between the release film and the adhesive film. In the tape for processing a wafer according to the above-mentioned Patent Document 1, since the support member is provided at both end portions in the short-side direction of the release film, the label portion is in a state in which the wafer processing tape is wound into a roll shape. There is a problem that a hollow structure is formed between the release film wound thereon, and thus there is a possibility that the above air moves to invade between the adhesive layer and the adhesive film. The air invaded between the adhesive layer and the adhesive film is also called void, which has a poor bonding to the semiconductor wafer W, causing subsequent cutting of the semiconductor wafer W or wafer pick-up. The possibility of a decrease in the yield of engineering and joining works.

Accordingly, an object of the present invention is to provide a tape for wafer processing which can reduce the occurrence of label marks, and can select a support member regardless of the thickness of the adhesive layer, and can reduce the roll between the adhesive layer and the adhesive film. Into the air (air).

In order to solve the above problems, the tape for wafer processing according to the present invention includes: a long release film; and an adhesive layer provided on the first surface of the release film and having a predetermined planar shape; An adhesive film having a label portion and a peripheral portion surrounding an outer side of the label portion, the aforementioned The label portion is provided to cover the adhesive layer and is in contact with the release film around the adhesive layer, and has a predetermined planar shape; and a support member provided on the release film and provided with the aforementioned a second surface opposite to the first surface of the adhesive film, and including a portion corresponding to the adhesive layer, and not including an end portion of the label portion in the short side direction of the release film In the region of the corresponding portion, it is disposed along the longitudinal direction of the release film.

Further, in the above-mentioned tape for semiconductor processing, it is preferable that the support member is provided at a central portion in the short-side direction of the release film.

Further, in the above-mentioned support member, the tape for semiconductor processing preferably has a width in the short-side direction of the release film of 10 to 50 mm.

According to the present invention, the generation of the label trace can be reduced, and the support member can be selected regardless of the thickness of the adhesive layer, and the entrapment of air between the adhesive layer and the adhesive film can be reduced.

10‧‧‧ Wafer processing tape

11‧‧‧ release film

12‧‧‧ adhesive layer

13‧‧‧Adhesive film

13a‧‧‧Circular label

13b‧‧‧ peripherals

14, 14', 14" ‧ ‧ support members

Fig. 1(a) is a plan view showing a tape for wafer processing according to an embodiment of the present invention, and Fig. 1(b) is a cross-sectional view taken along line A-A of (a).

2 is a cross-sectional view showing a tape for wafer processing according to another embodiment of the present invention.

3 is a cross-sectional view showing a tape for wafer processing according to still another embodiment of the present invention.

4 is a perspective view of a conventional tape for wafer processing.

Fig. 5 (a) is a plan view of a conventional tape for wafer processing, and Fig. 5 (b) is a cross-sectional view taken along line B-B of (a).

6 is a cross-sectional view showing a state in which a tape for wafer processing is bonded to a ring frame for dicing.

FIG. 7 is a schematic view for explaining a problem of the conventional wafer processing tape.

Embodiments of the present invention will be described in detail below based on the drawings. Fig. 1(a) is a plan view showing a tape for processing a wafer (cut-die bonding tape) according to an embodiment of the present invention, and Fig. 1(b) is a cross-sectional view taken along line A-A of Fig. 1(a).

As shown in FIGS. 1(a) and 1(b), the wafer processing tape 10 has a long release film 11, an adhesive layer 12, an adhesive film 13, and a support member 14.

The subsequent agent layer 12 is provided on the first surface of the release film, and has a circular label shape corresponding to the shape of the wafer. The adhesive film 13 has a circular label portion 13a and a peripheral portion 13b surrounding the outer side of the circular label portion 13a, and the circular label portion 13a covers the adhesive layer 12 and is in contact with the release film around the adhesive layer 12. Way to set. The peripheral portion 13b includes a form in which the outer side of the circular label portion 13a is completely surrounded, and a form that is not completely surrounded as shown in the drawing. The circular label portion 13a has a shape corresponding to the ring frame for cutting. Moreover, the support member 14 is disposed on the release film 11 The second surface 11b opposite to the first surface 11a of the adhesive film 12 and the adhesive film 13 is provided, and includes a portion corresponding to the adhesive layer 12 and does not include a short portion of the circular label portion 13a on the release film 11. A region r of a portion corresponding to the end portion in the side direction.

Hereinafter, each component of the wafer processing tape 10 of the present embodiment will be described in detail.

(release film)

As the release film 11 used in the wafer processing tape 10 of the present invention, polyester (PET, PBT, PEN, PBN, PTT), polyolefin (PP, PE), and copolymer (EVA, EEA) can be used. , EBA), or a film that replaces a part of these materials to further improve adhesion and mechanical strength. Further, it may be a laminate of these films.

The thickness of the release film is not particularly limited and can be appropriately set, and 25 to 50 μm is preferable.

(adhesive layer)

As described above, the adhesive layer 12 of the present invention has a circular label shape formed on the first surface 11a of the release film 11 and corresponding to the shape of the wafer.

After the semiconductor wafer or the like is pasted and diced, the adhesive layer 12 is used as an adhesive when it is attached to the back surface of the wafer and the wafer is fixed to the substrate or the lead frame. As the adhesive layer 12, it is preferable to use a resin selected from the group consisting of an epoxy resin, an acrylic resin, and a phenol resin. At least one of the adhesives and the like. In addition to this, a polyimide-based resin or an anthrone-based resin can also be used. The thickness can be appropriately set, but it is preferably about 5 to 100 μm.

(adhesive film)

As described above, the adhesive film 13 of the present invention has a circular label portion 13a corresponding to the shape of the ring frame for dicing and a peripheral portion 13b surrounding the outer side thereof. Such an adhesive film can be formed by removing the peripheral region of the circular label portion 13a from the film-like adhesive by pre-cut processing.

The adhesive film 13 is not particularly limited as long as it has sufficient adhesion to prevent the wafer from being peeled off when the wafer is diced, and exhibits a low adhesion which can be easily peeled off from the adhesive layer when the wafer is picked up after dicing. . For example, an adhesive film in which an adhesive layer is provided on a substrate film can be suitably used.

The base film of the adhesive film 13 is not particularly limited as long as it is a conventionally known base film. However, when a radiation curable material is used as an adhesive layer to be described later, it is preferred to use a radiation-transmitting property. .

For example, examples of the material thereof include polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-1, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid B. a homopolymer or copolymer of an α-olefin of an ester copolymer, an ethylene-methyl acrylate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, or the like, a mixture thereof, a polyurethane, a styrene-ethylene-butene or a pentane Thermoplastic bombs such as olefin copolymers and polyamine-polyol copolymers Sex, and mixtures of these. Further, the base film may be a mixture of two or more materials selected from the group, and these may be a single layer or a multilayer.

The thickness of the base film is not particularly limited and may be appropriately set, but 50 to 200 μm is preferable.

The resin to be used for the adhesive layer of the adhesive film 13 is not particularly limited, and a known chlorinated polypropylene resin, an acrylic resin, a polyester resin, a urethane resin, an epoxy resin or the like which is used for the adhesive can be used.

It is preferred to appropriately mix an acrylic pressure-sensitive adhesive, a radiation polymerizable compound, a photopolymerization initiator, a curing agent, and the like in the resin of the pressure-sensitive adhesive layer 13 to prepare an adhesive. The thickness of the adhesive layer 13 is not particularly limited and can be appropriately set, but 5 to 30 μm is preferable.

The radiation polymerizable compound is mixed with the adhesive layer, and can be easily peeled off from the adhesive layer by radiation curing. As the radiation polymerizable compound, for example, a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in the molecule which can be three-dimensionally networked by light irradiation can be used.

Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butene glycol diacrylate can be applied. Ester, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate or oligoester acrylate, and the like.

Further, in addition to the acrylate-based compound as described above, a urethane acrylate-based oligomer may be used. Ethyl urethane The enoate oligomer can be a polyol compound such as a polyester or a polyether, and a polyvalent isocyanate compound (for example, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3) a terminal isocyanate urethane prepolymer obtained by reacting - benzene dimethylene diisocyanate, 1,4-benzene dimethylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc. A hydroxy acrylate or methacrylate (for example, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethyl b It is obtained by reacting a glycol acrylate, polyethylene glycol methacrylate or the like.

In the adhesive layer, two or more selected from the above resins are also mixed.

When a photopolymerization initiator is used, for example, isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecyl thioxanthone, and the like can be used. Methyl thioxanthone, diethyl thioxanthone, benzoin dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethyl phenylpropane, and the like. The amount of the photopolymerization initiator to be mixed is preferably 0.01 to 5 parts by mass based on 100 parts by mass of the acrylic copolymer.

(support member)

The support member 14 is provided on the second surface 11b of the release film 11 opposite to the first surface 11a on which the adhesive 12 and the adhesive film 13 are provided, and includes a portion corresponding to the adhesive layer 12, and does not include a circle a portion of the label portion 13a corresponding to the end portion of the release film 11 in the short-side direction The region r is disposed along the longitudinal direction of the release film 11. When the wafer processing tape 10 is wound into a roll shape so as to provide the support member 14 as described above, since pressure is applied to the portion where the support member 14 is present, the following situation does not occur: the adhesive layer The height difference between the laminated portion of the circular label portion 13a of the adhesive film 13 and the peripheral portion 13a of the adhesive film 13 overlaps with each other, and the height difference is transferred to the surface of the adhesive layer 12 as a label mark. In the state in which the wafer processing tape 10 is wound into a roll shape, the end of the circular label portion 13a in the short side direction of the release film 11 is applied to the portion where the support member 14 is present. Since the portion is not restrained, the air remaining in the gap between the release film 11 and the circular label portion 13a is discharged to the outside of the circular label portion 13a by the thickness of the adhesive layer 12.

The position at which the support member 14 is provided may be in the region r, and may be provided in the entire region r of the region r as shown in FIG. 1 or at any position in one portion of the region r. When it is provided in a part of the region r, as shown in Figs. 2 and 3, it is preferable to provide the support members 14' and 14" at the central portion in the short-side direction of the release film. Further, a support member is provided in a portion of the region r. At 1400, the transfer mark of the support member 14 is generated in the adhesive layer 12, but the transfer mark at this time is linearly formed in the longitudinal direction of the release film 11, so that even when the wafer is bonded In the case of the pores, it is also pressed by the bonding rolls, and the pores are discharged to the outside of the label, so that unlike the randomly generated label marks, it does not become a problem.

Further, the region r may include the outer side, as shown in FIG. 1, to the short side of the release film 11 up to the circular label portion 13a. The vicinity of the portion corresponding to the end portion is made to make the air remaining in the gap between the release film 11 and the circular label portion 13a faster and easier to round by the thickness of the adhesive layer 12. It is preferable that the outer side of the label portion 13a is discharged without excessively moving away from the adhesive layer 12.

The width of the release film in the short-side direction is not particularly limited as long as it is equivalent to the inside of the region r, but 10 to 50 mm is preferable.

The thickness of the support member 14 does not need to be the same as the thickness of the laminated portion corresponding to the circular label portion 13a of the adhesive layer 12 and the adhesive film 13 or the peripheral portion 13b of the adhesive film 13, that is, the adhesive layer 12 is the same or Large, you can choose as appropriate. The wafer processing tape 10 is pressed against the portion where the support member 14 is present when being wound into a roll shape, so that the label portion that is not in contact with the support member 14 is not in pressure and is in a hollow state. The thickness of the layer 12 is then prevented to prevent label marks. However, it may be provided to have the same thickness as or higher than the adhesive layer 12. Further, as shown in FIG. 3, a support member 14" in which a thin adhesive tape is laminated may be provided.

The support member 14 is provided intermittently or continuously along the longitudinal direction of the release film 11, but is continuously disposed along the longitudinal direction of the base film 11 from the viewpoint of more effectively suppressing generation of transfer marks. It is better.

Moreover, it is preferable that the support member 14 has a material having a certain coefficient of friction with respect to the adhesive film 13 from the viewpoint of preventing the winding offset of the wafer processing tape 10 . Thereby, it is possible to prevent the winding deviation of the wafer processing tape 10, and it is possible to obtain an effect that the winding can be performed at a high speed and the number of windings can be increased.

Static friction between the support member 14 and the substrate film of the adhesive film 13 The coefficient is preferably 0.2 to 2.0, and more preferably 0.6 to 1.6. When the wafer processing tape is wound into a roll shape, the circular label portion 13a of the adhesive film 13 provided on the first surface 11a side of the release film 11 and the second surface 11b side provided on the release film 11 are provided. The support member 14 is in contact with each other, and therefore, when the coefficient of static friction between the support member 14 and the base film of the adhesive film 13 is as small as less than 0.2, the winding deviation is liable to occur at the time of manufacture or use, and operability occurs. deterioration. On the other hand, when it is more than 2.0, the resistance between the base film of the adhesive film 13 and the support member 14 is excessively large, which deteriorates the operability in the manufacturing process, or causes a meandering during high-speed winding. Therefore, by setting the static friction coefficient between the two to the above range, the winding deviation of the wafer processing tape 10 can be prevented, and the effect of being able to be wound at a high speed and increasing the number of windings can be obtained.

In the present invention, the coefficient of static friction between the support member 14 and the base film of the adhesive film 13 can be obtained by the following measurement method in accordance with JIS K7125.

The base film of each of the adhesive films 13 cut into 25 mm (width) × 100 mm (length) was superposed on the two film samples of the support member 14, and the film on the lower side was fixed. Next, a weight of 200 g was placed on the laminated film as a load W, and the film on the upper side was stretched at a speed of 200 mm/min, and the force Fd (g) at the time of slipping was measured, and the following formula was used. Static friction coefficient (μd).

Dd=Fd/W

As the supporting member 14, for example, a resin film can be suitably used. The substrate is coated with an adhesive adhesive tape. The adhesive tape 10 of the present embodiment can be formed by adhering such an adhesive tape to a predetermined position of the second surface 11b of the release film 11.

The base resin of the adhesive tape is not particularly limited as long as it satisfies the range of the linear expansion coefficient and can withstand the winding pressure, but from the viewpoints of heat resistance, smoothness, and easy availability, from the viewpoint of polyethylene terephthalate Ethylene glycolate (PET), polypropylene and high density polyethylene are preferred.

The composition and physical properties of the adhesive for adhering the adhesive tape are not particularly limited, and may be removed from the release film 11 during the winding and storage of the wafer processing tape 10 .

Further, as the support member 14, a colored support member may be used. By using such a colored support member, when the wafer processing tape is wound into a roll shape, the type of the tape can be clearly recognized. For example, by changing the color of the coloring support member 14 depending on the type or thickness of the tape for wafer processing, the type or thickness of the tape can be easily recognized, and the occurrence of human error can be suppressed and prevented.

Example

Next, embodiments of the invention will be described, but the invention is not limited to the embodiments.

(1) Production of adhesive film (Adhesive film 1A)

In 400 g of the solvent toluene, the amount of dropwise addition was appropriately adjusted, and 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl methacrylate, and 1.5 g of methacrylic acid were added, and peroxidation as a polymerization initiator was added. A mixed solution of benzamidine, the reaction temperature and the reaction time are adjusted, thereby obtaining a solution of the compound (1) having a functional group.

Then, in the polymer solution, the amount of the dropwise addition is appropriately adjusted, and methacrylic acid-2 synthesized by methacrylic acid and ethylene glycol as the compound (2) having a radiation-curable carbon-carbon double bond and a functional group is added. 2.5 g of hydroxyethyl ester, hydroquinone as a polymerization inhibitor, and the reaction temperature and reaction time were adjusted to obtain a solution of the compound (A) having a radiation curable carbon-carbon double bond. Next, in the solution of the compound (A), 100 parts by mass of the compound (A) in the compound (A) is added in an amount of 1 part by mass of a polyisocyanate (B) manufactured by Nippon Polyurethane Co., Ltd.: coronate L, as photopolymerization The initiator was prepared by Japan CHIBAGAIGI Co., Ltd.: Irgacure-1840.5 parts by mass and 150 parts by mass of ethyl acetate as a solvent, and mixed to prepare a radiation curable adhesive composition.

Next, the prepared adhesive layer composition was applied to an ethylene-vinyl acetate copolymer base film having a thickness of 100 μm so as to have a dry film thickness of 20 μm, and dried at 110 ° C for 3 minutes to form an adhesive film 1A.

(2) release film

The release film 2A shown below was used.

Release film 2A: release-treated polyethylene terephthalate film having a thickness of 38 μm

(3) Formation of an adhesive layer (adhesive layer 3A)

50 parts by mass of cresol novolac type epoxy resin (epoxy equivalent 197, molecular weight 1200, softening point 70 ° C) as an epoxy resin, and 1.5 parts by mass of γ-mercaptopropyltrimethoxydecane as a decane coupling agent A composition comprising 3 parts by mass of γ-ureidopropyltriethoxysilane and 30 parts by mass of a cerium oxide filler having an average particle diameter of 16 nm, cyclohexanone was added thereto, stirred and mixed, and further kneaded using a bead mill. 90 minutes.

100 parts by mass of an acrylic resin (mass average molecular weight: 800,000, glass transition temperature - 17 ° C), 5 parts by mass of dipentaerythritol hexaacrylate as a 6-functional acrylate monomer, and hexamethylene as a curing agent 0.5 parts by mass of an adduct of diisocyanate and 2.5 parts by mass of Curezol 2PZ (trade name of Shikoku Kasei Co., Ltd., 2-phenylimidazole) were stirred and mixed, and vacuum degassed to obtain an adhesive.

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 20 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive was formed on the release film 2A. Layer 3A is stored in a refrigerator.

(adhesive layer 3B)

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 60 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive was formed on the release film 2A. Layer 3B is stored in a refrigerator.

(adhesive layer 3C)

The above-mentioned adhesive was applied onto the release film 2A, and dried by heating at 110 ° C for 1 minute to form a coating film having a film thickness of 120 μm in a B-stage state (solidified state of the thermosetting resin), and an adhesive layer was formed on the release film 2A. 3C, and keep it in a safe place.

(4) Production of supporting members (support member 4A)

100 parts by mass of a mixed acrylic resin (mass average molecular weight: 600,000, glass transition temperature: -20 ° C), and 10 parts by mass of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., trade name: coronate L) as a curing agent Composition.

The adhesive composition was applied to a low-density polyethylene film having a thickness of 40 μm so as to have a dry film thickness of 20 μm, dried at 110 ° C for 3 minutes, and the obtained adhesive tape was cut into a width of 10 mm to prepare a support member. 4A.

(support member 4B)

The adhesive composition was applied to a polyethylene terephthalate film having a thickness of 100 μm so as to have a dry film thickness of 30 μm, dried at 110 ° C for 3 minutes, and the obtained adhesive tape was cut into a width of 25 mm. A support member 4B was produced.

(support member 4C)

The support member 4C was produced in the same manner as the support member 4A except that the obtained adhesive tape was cut into a width of 25 mm.

(support member 4D)

The support member 4D was produced in the same manner as the support member 4A except that the obtained adhesive tape was cut into a width of 50 mm.

(Example 1)

The release film 2A in which the adhesive layer 3A for refrigerating storage is formed is returned to normal temperature, and the cutting depth of the release film is adjusted to 10 μm or less for the adhesive layer, and a circular pre-cutting process of 220 mm in diameter is performed. Thereafter, the unnecessary portion of the adhesive layer is removed, and the release film 1A is layered at room temperature by bringing the adhesive film 1 into contact with the adhesive layer. Then, with respect to the adhesive film 1A, the depth of cut of the release film was adjusted to 10 μm or less, and a circular pre-cut process of 290 mm in diameter was performed concentrically with the adhesive layer. Then, the support member 4A is bonded to the second surface of the release film 2A opposite to the first surface on which the adhesive layer and the adhesive film are provided, and the center portion in the short-side direction of the release film 2A is bonded to the release film 2A. The wafer processing tape of Example 1 of the configuration shown.

(Example 2) A wafer processing tape of Example 2 was produced in the same manner as in Example 1 except that the support member 4B was used instead of the support member 4A.

(Example 3)

The wafer processing tape of Example 3 was produced in the same manner as in Example 1 except that the adhesive layer 3B was used instead of the adhesive layer 3A.

(Example 4)

The wafer processing tape of Example 4 was produced in the same manner as in Example 2 except that the adhesive layer 3B was used instead of the adhesive layer 3A.

(Example 5)

The wafer processing tape of Example 5 was produced in the same manner as in Example 1 except that the adhesive layer 3C was used instead of the adhesive layer 3A.

(Example 6)

The wafer processing tape of Example 6 was produced in the same manner as in Example 2 except that the adhesive layer 3C was used instead of the adhesive layer 3A.

(Example 7)

The wafer processing tape of Example 7 was produced in the same manner as in Example 3 except that the support member 4C was used instead of the support member 4A.

(Example 8)

The wafer processing tape of Example 8 was produced in the same manner as in Example 7 except that the support member 4D was used instead of the support member 4C.

(Comparative Example 1)

The release film 2A in which the adhesive layer 3A having the refrigerated storage is formed is returned to normal temperature, and the depth of cut of the release film is adjusted to 10 μm or less with respect to the adhesive layer, and a circular pre-cut process of 220 mm in diameter is performed. Thereafter, the unnecessary portion of the adhesive layer is removed, and the release film 1A is layered at room temperature by bringing the adhesive film 1 into contact with the adhesive layer. Then, with respect to the adhesive film 1A, the depth of cut-in of the release film is adjusted to 10 μm or less, and a circular pre-cut process of 290 mm in diameter is performed concentrically with the adhesive layer, leaving a circular label portion and a peripheral portion. Removed other unwanted parts. Then, the support member 4A is bonded to the second surface of the release film 2A opposite to the first surface on which the adhesive layer and the adhesive film are provided, and at both end portions in the short-side direction of the release film 2A, and the conventional patent is produced. The tape for wafer processing of Comparative Example 1 having the structure shown in Fig. 1 of Document 1.

(Comparative Example 2)

A wafer processing tape of Comparative Example 2 was produced in the same manner as in Comparative Example 1, except that the support member 4B was used instead of the support member 4A.

(Comparative Example 3)

A wafer processing tape of Comparative Example 3 was produced in the same manner as in Comparative Example 1, except that the adhesive layer 3B was used instead of the adhesive layer 3A.

(Comparative Example 4)

A wafer processing tape of Comparative Example 4 was produced in the same manner as in Comparative Example 3, except that the support member 4B was used instead of the support member 4A.

(Comparative Example 5)

A wafer processing tape of Comparative Example 5 was produced in the same manner as in Comparative Example 2, except that the adhesive layer 3C was used instead of the adhesive layer 3A.

(Comparative Example 6)

A wafer processing tape of Comparative Example 6 was produced in the same manner as in Comparative Example 3 except that the support member was not provided.

(Comparative Example 7)

A wafer processing tape of Comparative Example 7 was produced in the same manner as in Comparative Example 5 except that the support member was not provided.

[Evaluation of the inhibition of label marks]

The wafer processing tapes of the examples and the comparative examples were wound into a roll shape so that the number of the adhesive films having a circular shape was 300, and a tape roll for wafer processing was produced. The obtained wafer processing tape roll was stored in a refrigerator (5 ° C) for one month. After that, the wafer processing tape roll was returned to room temperature, and the roll was unwound, and the presence or absence of the label mark was visually observed. The wafer processing tape was evaluated in three levels of ○, Δ, and × based on the following evaluation criteria. The inhibition of the transfer marks. The results are shown in Tables 1 and 2.

○ (good): It is impossible to confirm the label trace even if it is visually observed from various angles.

△ (allowable product): Although it is possible to confirm the label trace, it is not sufficient to affect the processing of the semiconductor device.

× (defective product): Label traces that affect the processing of semiconductor devices can be confirmed

[Evaluation of inhibition of air entrapment]

The wafer processing tapes of the examples and the comparative examples were wound into a roll shape so that the number of the adhesive films having a circular shape was 200, and a tape roll for wafer processing was produced. The obtained roll of the wafer processing tape was placed in a packaging bag, stored in a refrigerator (5 ° C) for one month, and then stored in a dry ice environment at -50 ° C for 3 days. After that, the wafer processing tape roll is returned to normal temperature, the package bag is unsealed, and the roll is unwound to visually observe whether or not air is caught between the adhesive layer and the circular label portion of the adhesive film. Air enrollment is evaluated as ○ (good) and will be available The evaluation of the intrusion of the gas was evaluated as × (defective product), and the suppression of the entrapment of the air of the tape for the wafer processing was performed. The results are shown in Tables 1 and 2.

As shown in Table 1, the tape for wafer processing according to Examples 1 to 8 is based on the second surface opposite to the first surface of the release film, and includes a portion corresponding to the adhesive layer, and does not include In the region of the portion of the label portion corresponding to the end portion in the short-side direction of the release film, the support member is provided along the longitudinal direction of the release film, so that the label trace is suppressed and the air is entangled. The inhibitory aspects are excellent results.

On the other hand, in the wafer processing tapes of Comparative Examples 1 to 4 in which the support members were provided at both end portions of the release film, as shown in Table 2, the suppression of the entrapment of air was poor. The tape for wafer processing according to Comparative Examples 6 and 7 in which the support member is not provided is excellent in the suppression of the entrapment of air, but the result of the suppression of the label trace is poor.

Further, it was confirmed that the tape for wafer processing according to Comparative Example 3 in which the thickness of the adhesive layer and the support member are the same is insufficient for the semiconductor device. The processing engineering caused a trace of the extent of the impact of the label. On the other hand, in the tape for wafer processing according to the third embodiment, even if the thickness of the adhesive layer and the support member are the same, no label trace is generated.

10‧‧‧ Wafer processing tape

11‧‧‧ release film

11a‧‧‧1st

11b‧‧‧2nd

12‧‧‧ adhesive layer

13‧‧‧Adhesive film

13a‧‧‧Circular label

13b‧‧‧ peripherals

14‧‧‧Support members

R‧‧‧ area

Claims (3)

A tape for processing a wafer, comprising: a long release film; an adhesive layer disposed on a first surface of the release film and having a predetermined planar shape; and an adhesive film having a label portion and surrounding a peripheral portion of the outer side of the label portion, wherein the label portion is provided so as to cover the adhesive layer and is in contact with the release film around the adhesive layer, and has a predetermined planar shape; and the support member is as described above a second surface of the release film opposite to the first surface on which the adhesive layer and the adhesive film are provided, and a portion corresponding to the adhesive layer and not including the release film of the label portion The region corresponding to the end portion in the short-side direction is provided along the longitudinal direction of the release film. The tape for wafer processing according to the first aspect of the invention is characterized in that the support member is provided at a central portion in the short-side direction of the release film. The tape for wafer processing according to the first or second aspect of the invention is characterized in that, in the support member, the width of the release film in the short-side direction is 10 to 50 mm.