TW201631686A - Substrate processing device, substrate processing system, and substrate process method - Google Patents

Abstract

The object of the present invention is to provide a substrate processing device with low processing cost. The solution is a substrate process device comprising: a first mask (211) having a plurality of holes (h1) respectively corresponding to each of electrodes (Q) in a plurality of regions (R1~R4) arranged on a substrate (B) in a plane view; a solder ball filling means configured to fill each hole (h1) of the first mask (211) with a solder ball; and a solder ball mounting means having a second mask (25) provided with a plurality of holes (h2) corresponding to each of the electrodes (Q) in the aforementioned regions, wherein the solder ball mounting means is configured to, for each aforementioned region, repeat the process of sucking the solder balls, which are respectively filled in each hole (h1) of the first mask (211) by the solder ball filling means, through each hole (h2) of the second mask (25). Also, the sucked solder balls are mounted onto each of the electrodes (Q) in the aforementioned regions.

Description

Substrate processing apparatus, substrate processing system, and substrate processing method

The present invention relates to a substrate processing apparatus and the like for processing a substrate.

Surface-mounted electronic components such as BGA (Ball Grid Array) or CSP (Chip Size Package) are installed in computers, mobile phones, and digital home appliances. On the back surface of such an electronic component, a plurality of hemispherical bumps (projecting terminals) are formed. By providing bumps on the back surface of the electronic component, the number of contacts between the substrate and the electronic component is greatly increased, and the electronic component is reduced in size and density.

Further, in correspondence with the bump provided on the back surface of the electronic component, a large number of bumps are formed on the substrate on which the electronic component is mounted. As a method of forming a bump on a substrate, for example, a ball deposit method is known. The ball depositing method is a method of depositing solder balls on a substrate (falling in and mounting) through a plurality of fine holes provided in the mask, and has the advantage of being able to form bumps having a very narrow pitch with high precision.

For example, Patent Document 1 discloses a technique in which a flux is applied to each electrode of a mask through an electrode of a mask, and a solder ball is mounted on each of the electrodes of the other mask on the electrode to which the flux is applied.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-177015

When the above-described ball depositing method is used, a substrate having a relatively large area (for example, 450 mm × 600 mm) is cut into a plurality of pieces, and solder balls are mounted on the divided substrates. If the area of the substrate is too large, the displacement of each electrode of the substrate and the hole of the mask exceeds the allowable range due to the displacement at the time of printing the circuit pattern on the substrate by stepwise exposure or the shrinkage deformation of the resin substrate. . Further, as the protrusions provided on the substrate are made finer or the pitch between the bumps is narrowed, such displacement is likely to occur.

Therefore, in general, the substrate is cut and washed, and the solder ball is mounted by the technique of Patent Document 1, and the substrate is cut and washed to mount the electronic component. In other words, in the technique described in Patent Document 1, since the cutting and cleaning of the substrate are performed at least twice, there is a problem that the cost required for the series of processes is increased. It is preferable to solve the above-mentioned problem of displacement, and to save the process of cutting and cleaning once, and to reduce the processing cost of the substrate.

Accordingly, the present invention has been made in an effort to provide a substrate processing apparatus and the like which are inexpensive to handle.

In order to solve the above problems, the substrate processing apparatus of the present invention is characterized in that the first mask includes a substrate having a plurality of fields in a plan view, and a plurality of holes corresponding to the respective electrodes in the field; The ball filling means is characterized in that each of the holes of the first mask is filled with one solder ball; and the solder ball mounting means has a second mask provided with a plurality of holes corresponding to the respective electrodes in the field. Repeating for each of the above-mentioned fields: the solder balls filled in the respective holes of the first mask by the solder ball filling means are adsorbed through the respective holes of the second mask, and the solder balls after the adsorption are mounted on Treatment of each electrode in the aforementioned fields.

According to the present invention, it is possible to provide a substrate processing apparatus or the like which is inexpensive to handle.

S‧‧‧Substrate processing system

1‧‧‧Solder printing device (flux coating method)

2‧‧‧Substrate processing unit

21,22,21A,22A,21B,22B‧‧‧Ball fill unit

211,211A‧‧‧1st mask

215, 215B‧‧‧ solder ball filling means

215c‧‧‧ slit body

24‧‧‧Mobile institutions (solder ball loading means)

25,25A‧‧‧2nd mask (welding ball mounting means)

26‧‧‧Heading head (solder ball loading means)

27‧‧‧ Camera (camera means)

29‧‧‧Recovery nozzle (recovery means)

30,30A‧‧‧Control device

32,32A‧‧‧Filling Control Department (Ball Filling Means)

33, 33A‧‧‧ Mounting control unit (solder ball mounting means)

34‧‧‧Inspection Department (inspection means)

35‧‧‧Restoration Control Department (Recovery Means)

41‧‧‧3rd mask moving motor (3rd mask moving means)

42‧‧‧4th cover movement motor (4th cover moving means)

a3‧‧‧The convex part of the 3rd mask

a4‧‧‧The convex part of the 4th mask

B‧‧‧Substrate

H1‧‧‧ hole of the first mask

H2‧‧‧ hole of the second mask

M3‧‧‧3rd mask

M4‧‧‧4th mask

R1, R2, R3, R4‧‧‧ fields

T‧‧‧ gap

Q‧‧‧electrode

Fig. 1 is an explanatory view of a substrate processing system according to a first embodiment of the present invention.

2 is a schematic plan view of a substrate.

3 is a longitudinal sectional view of a flux printing device.

4 is a perspective view of a substrate processing apparatus.

Figure 5 is a longitudinal sectional view of the solder ball filling unit.

Fig. 6(a) is a developed view of the slit-shaped body, and Fig. 6(b) is a partially enlarged view of the range K shown in (a).

Fig. 7 is a functional block diagram of a control device provided in the substrate processing apparatus.

Fig. 8 is a flow chart showing a process of filling a solder ball in each hole of the first mask.

(a) of FIG. 9 is an explanatory view showing a state in which the solder balls are filled in the respective holes of the first mask, and (b) is an explanatory view showing a state in which the solder balls are attracted through the respective holes of the second mask, (c) ) is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes in one field in the substrate.

FIG. 10 is an explanatory view showing a flow of an operation of the substrate processing apparatus.

FIG. 11 is a flowchart of a process of mounting a solder ball on each electrode of a substrate.

Fig. 12 is a flow chart showing the inspection processing and the recovery processing.

Figure 13 is a cross-sectional view showing a substrate processing system according to a second embodiment of the present invention, wherein (a) is a schematic cross-sectional view including a second mask and a fourth mask, and (b) is a first mask and A schematic cross-sectional view of the third mask.

Fig. 14 is a functional block diagram of a control device provided in the substrate processing apparatus.

Fig. 15 is a flowchart showing a process of mounting a solder ball on each electrode of a substrate.

Fig. 16 (a) shows the shape in which the solder balls are filled in the respective holes of the first mask. (b) is an explanatory view showing a state in which the solder ball is pushed up by the third mask, and (c) is an explanatory view showing a state in which the mounting head is moved right above the target region. d) is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes in one field in the substrate.

Fig. 17 is a longitudinal sectional view showing a solder ball filling unit included in a substrate processing system according to a modification of the present invention.

≪First Embodiment≫ <Configuration of Substrate Processing System>

Fig. 1 is an explanatory view of a substrate processing system S according to the first embodiment. In addition, the arrow shown in FIG. 1 is the direction which the board|substrate B was conveyed. Also, the x, y, and z directions are defined as shown in FIG.

The substrate processing system S is a system in which a flux is applied to each electrode Q (see FIG. 2 ) of the substrate B, and solder balls are mounted to form bumps (protrusive terminals).

The substrate processing system S includes a flux printing device 1 and a substrate processing device 2.

As shown in FIG. 1, the flux printing apparatus 1 and the substrate processing apparatus 2 are arranged in order to the downstream side, and the board|substrate B is conveyed sequentially by the conveyance body P. Further, the plate-shaped conveying body P is movable in the x direction, and after adsorbing the substrate B on the lower side thereof, the adsorption is released at a predetermined position in the x direction.

Here, the composition of the substrate processing system S is briefly described The substrate B related to the object to be processed.

FIG. 2 is a schematic plan view of the substrate B. The substrate B is a plate-like body to which an electronic component (not shown) is mounted, and has four fields R1 to R4 in plan view. A plurality of electrode groups (not shown) in which the electrodes Q are densely formed are provided in the adjacent rectangular regions R1 to R4. Further, the arrangement of the electrodes Q in the fields R1 to R4 is set to be substantially the same.

The details will be described later. In the fields R1 to R4, the solder balls are individually mounted by the mounting head 26 (see FIG. 4).

The fields R1 to R4 shown in Fig. 2 are set such that even if the substrate B made of resin shrinks and deforms, the displacement of the solder balls and the electrodes Q will be within a predetermined allowable range.

Further, in the substrate B, a predetermined circuit pattern is printed by stepwise exposure. Further, the fields R1 to R4 are set to be included in each exposure range. Thereby, even when displacement occurs between the respective exposure ranges at the time of stepwise exposure printing, the case where the solder balls are mounted together across the plurality of exposure ranges is lost, so that the displacement of the electrodes Q and the solder balls can be suppressed.

(flux printing device)

The flux printing apparatus 1 applies a flux to each electrode Q (see FIG. 2) of the substrate B disposed under the mask 11 via a plurality of holes (not shown) formed in the mask 11 for flux application. s installation. The above-mentioned "flux" is a liquid for adhering the solder ball to the substrate B by the viscosity thereof, or preventing oxidation or the like when the solder ball is melted.

3 is a longitudinal sectional view of the flux printing apparatus 1.

The flux printing apparatus 1 includes a mask 11, a frame 12, a camera 13, a printing platform 14, and a blade head 15. The mask 11 is a metal mask in which a plurality of holes corresponding to the respective electrodes Q of the substrate B are formed, and is disposed in parallel with the xy plane (horizontal plane).

The frame 12 is a frame having a rectangular frame shape for fixing the mask 11, and is provided at a peripheral portion of the mask 11. In addition, the example shown in FIG. 2 is that the position of the frame 12 in the z direction is fixed.

The camera 13 is a two-view camera that images the upper and lower sides of the camera 13 and is movable in the x and y directions. The camera 13 picks up the alignment marks (two or more; not shown) printed on the lower surface of the mask 11 and the alignment marks (two or more; not shown) printed on the upper surface of the substrate B, respectively. The imaging result is output to a control device (not shown) of the printing platform 14.

The printing platform 14 is a device that adjusts the position of the substrate B in the x, y direction and the θ direction (rotation direction on the xy plane), and adjusts the distance between the substrate B and the mask 11 in the z direction by the elevating mechanism 14a. The printing platform 14 adjusts the position of the substrate B such that the position of each hole of the mask 11 matches the position of each electrode Q (see FIG. 2) of the substrate B in a plan view in accordance with the imaging result of the camera 13.

Further, when the flux is applied to the substrate B, the printing platform 14 is raised in a state where the camera 13 is retracted, and the substrate B is brought close to the mask 11 (the distance between the two is formed into a predetermined screen gap).

The doctor blade 15 is a blade that applies a flux to each electrode Q (see FIG. 2) of the substrate B through each hole of the mask 11. (scraper) 15a and scraper 15b. When the flux is applied to the substrate B, the blade head 15 is reciprocated in the x direction so that the substrate B can be coated with a flux.

Specifically, after the squeegee 15a is lowered, the squeegee 15a is pushed to the upper surface of the mask 11, and moved to the left direction of the paper. Then, the squeegee 15a is raised, the blade 15b is lowered, and the blade 15b is moved to the right direction of the paper. Thus, the squeegee 15a and the blade 15b are alternately used in accordance with the direction in which the blade head 15 moves.

(substrate processing device)

The substrate processing apparatus 2 shown in FIG. 1 is a device in which solder balls are mounted on each electrode Q (see FIG. 2) of the substrate B to which the flux is applied. In addition, the substrate processing apparatus 2 also has a function of inspecting whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B, and re-loading the solder balls on the electrodes on which the solder balls are not properly mounted.

FIG. 4 is a perspective view of the substrate processing apparatus 2. The substrate processing apparatus 2 includes solder ball filling units 21 and 22, a mounting table 23, a moving mechanism 24, a second mask 25, a mounting head 26, cameras 27 and 28, a recovery nozzle 29, and a control device 30 ( Refer to Figure 7).

The solder ball filling unit 21 fills the solder balls (the solder balls are arranged neatly) via a plurality of holes h1 (see FIG. 5) provided in the first mask 211.

FIG. 5 is a longitudinal sectional view of the solder ball filling unit 21.

The ball filling unit 21 includes a first mask 211, a frame 212, a filling table 213, an air pressure adjuster 214 (see FIG. 7), and a solder ball charge. Fill in the means 215.

The first mask 211 is a mask provided with a plurality of holes h1 corresponding to the respective electrodes Q of one field (any one of the fields R1 to R4; see FIG. 4) of the substrate B. In other words, the arrangement of the holes h1 provided in the field U1 of the first mask 211 (in the frame of the one-point lock line shown in FIG. 4) is the same as the arrangement of the electrodes Q of any one of the fields R1 to R4. .

The frame 212 shown in FIG. 5 is a frame in which the first mask 211 is fixed to the filling table 213, and is provided on the peripheral edge portion of the first mask 211 (not shown in FIG. 4). The filling station 213 is a stage on which the first mask 211 is placed. The filling station 213 is a communication path D1 having the respective holes h1 that are connected to the first mask 211.

The air pressure regulator 214 (see Fig. 7) is a device that generates a negative pressure or releases the negative pressure in accordance with an instruction from the filling control unit 32, which will be described later. The generation of the negative pressure of the air pressure regulator 214 is performed when the solder balls are filled in the respective holes h1 of the first mask 211.

The solder ball filling means 215 shown in FIG. 5 is one in which each solder ball is filled in each hole h1 of the first mask 211. The solder ball filling means 215 includes a solder ball supply portion 215a, a mounting frame 215b, a slit-like body 215c, a vibration damper 215d, and a motor 215e (only the mounting frame 215b and the slit-shaped body 215c are shown in Fig. 4).

The solder ball supply portion 215a is an appropriate amount of solder balls supplied to the slit-shaped body 215c. When the solder ball is supplied, the solder ball supply unit is rotated around the rotation axis G so that the opening H faces the slit-like body 215c. 215a. Thereby, the solder ball falls through the opening H, and the solder ball is supplied to the slit-like body 215c.

The mounting frame 215b is a frame in which the slit-like body 215c is attached, and has a rectangular frame shape in the y direction (see FIG. 4). The slit-shaped body 215c is a slit T (see FIG. 6(b)) having a plurality of solder balls movable, and is in contact with the first mask 211 in a state in which the first mask 211 is curved in a convex shape. Mode configuration.

Fig. 6(a) is a developed view of the slit-shaped body 215c. The slit-shaped body 215c is provided with a pair of mounting portions c1 extending in parallel and a plurality of linear bodies c2 having a predetermined angle with respect to the mounting portion c1. The slit-shaped body 215c is fixed to the mounting frame 215b in a state in which the mounting portions c1 and c1 are respectively pushed to the pair of inner wall surfaces in the x direction in the mounting frame 215b (see FIG. 5).

Fig. 6(b) is a partially enlarged view of the range K shown in Fig. 6(a).

The slit T provided in the slit-like body 215c is a gap between the adjacent linear bodies c2. In addition, the distance L of the adjacent linear body c2 may be equal to or larger than the diameter of the solder ball, or may be the diameter of the solder ball not full, as long as the gap T becomes wider when the vibration generated by the vibrator 215d is widened. .

Further, the slit-like body 215c is formed at a predetermined angle θ (0 < θ < 45°) at an angle formed by the attachment portion c1 and the linear body c2. This is because when the slit-shaped body 215c vibrates in the x direction by the vibrator 215d (see FIG. 5) which will be described later, the solder ball is rotated and dispersed.

The vibration damper 215d shown in Fig. 5 is a slit as described above. The body 215c vibrates in the x direction and is disposed in the mounting frame 215b. When the slit-shaped body 215c is vibrated in the x direction by the vibrator 215d, the solder balls existing inside or outside the slit-like body 215c are rotated by contact with the linear body c2. Thereby, the solder balls are dispersed, and one solder ball can be filled in each of the holes h1 (see FIG. 5) of the first mask 211.

The motor 215e is a drive source for moving the slit-shaped body 215c or the like in the x direction. When the ball screw shaft (not shown) is rotated by the motor 215e, the solder ball supply portion 215a, the mounting frame 215b, the slit-like body 215c, and the vibrator 215d are integrally moved in the x direction. As described above, the slit-like body 215c that is in contact with the first mask 211 moves in the x direction while vibrating, and the solder ball that has fallen through the slit T (see FIG. 6(b)) is filled in the first cover. Each hole h1 of the cover 211.

Although not shown in FIG. 5, a sweeper that removes the solder balls remaining on the mask 11 and cleans it after the completion of the filling of the solder balls is actually provided.

The solder ball filling unit 22 shown in FIG. 4 has the same configuration as the solder ball filling unit 21 described above. The reason why the two solder ball filling units 21, 22 are provided in this way is because the time required for each filling of the solder balls is longer than the time required for each of the electrodes Q of the substrate B to be mounted.

The mounting table 23 shown in FIG. 4 is a stage on which the substrate B is placed. In the example shown in FIG. 4, the substrate B is transported to the right side of the paper by the transport body P, and is placed on the mounting table 23.

The moving mechanism 24 moves the mounting head 26, which will be described later, to the x, y, and z sides. The direction of the direction and the direction of θ (the direction of rotation on the x, y plane). In the example shown in FIG. 4, the configuration of the moving mechanism 24 includes a pair of support bodies 241a and 241b, a crane frame 242, a plate-like body 243, an installed body 244, and motors 245 and 246.

The gantry 241 is movable in the y direction along the rails E1, E1 provided on the pair of support bodies 241a, 241b. The plate-like body 243 is movable in the x direction along the rails E2, E2 provided on the gantry frame 241. The body 244 is movable in the z direction along the tracks E3, E3 provided in the plate-like body 243. The motor 245 is a drive source that moves the set body 244 in the z direction. The motor 246 is a drive source that rotates the mounting head 26 with respect to the set body 244 in the θ direction.

These motors 245 and 246 are driven in accordance with an instruction from a mounting control unit 33 (see FIG. 7) which will be described later. Further, a motor that moves the gantry 241 in the y direction and a motor that moves the plate-shaped body 243 in the x direction are not shown. Further, the moving mechanism 24 shown in FIG. 4 is an example, and the mounting head 26 can be moved in the x, y, z, and θ directions.

The second mask 25 is a mask provided with a hole h2 (see FIG. 9( a )) corresponding to a plurality of electrodes Q of one field (any one of the fields R1 to R4 ) of the substrate B, and is disposed at The lower surface of the head 26 is mounted.

The mounting head 26 sucks the solder balls through the holes h2 of the second mask 25 (see FIG. 9( a )), and mounts the adsorbed solder balls on the respective electrodes Q of the substrate B. The mounting head 26 is provided to communicate with the second mask 25 The communication path D2 of each hole h2 (see FIG. 9(a)) and the air pressure regulator 261 (see FIG. 7) for generating/disabling the negative pressure via the communication path D2.

The camera 27 has a function of picking up a registration mark (not shown) printed on the first mask 211 when the first mask 211 and the second mask 25 are aligned (see FIG. 9( a )). Can be moved in the x, y direction.

Further, the camera 27 also has a function of capturing the alignment mark of the field to be printed on the object when the second mask 25 is aligned with any of the fields R1 to R4 of the substrate B (see FIG. 9(c)). .

Further, the camera 27 has a function of capturing the image information of the substrate B when the solder balls are properly mounted on the respective electrodes Q of the substrate B, and acquiring image information.

The camera 28 is mounted on the substrate B of a circuit pattern different from the previous one (that is, when the first masks 211 and 221 and the second mask 25 are replaced), and is stored in the memory unit 31 for correction (see FIG. 7). The coordinate system is ingested, and the alignment mark printed on the second mask 25 is taken.

In the recovery nozzle 29, in accordance with a command from the recovery control unit 35 (see FIG. 7) to be described later, the solder ball is removed or remounted for each electrode Q, and is movable in the x, y, and z directions.

FIG. 7 is a functional block diagram of the control device 30 included in the substrate processing apparatus 2.

The control device 30 performs a process of filling the solder ball, a process of mounting, and an inspection process of whether the solder ball is properly filled, and according to the inspection process. The recovery of the results of the processing. Although the control device 30 is not shown, the actual configuration includes an electronic circuit such as a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and various interfaces. Further, the program stored in the ROM is read and expanded in the RAM to enable the CPU to perform various processes.

As shown in FIG. 7, the control device 30 includes a storage unit 31, a filling control unit 32, a mounting control unit 33, an inspection unit 34, and a recovery control unit 35.

The memory unit 31 is, for example, a semiconductor memory device. The memory unit 31 stores the imaging result of the cameras 27 and 28, the result of the inspection process by the inspection unit 34, the result of the restoration process by the restoration control unit 35, and the like.

The filling control unit 32 includes the generation/deactivation of the negative pressure of the air pressure adjuster 214, the vibration of the slit-like body 215c (see FIG. 5) of the vibrator 215d, and the movement of the slit-like body 215c of the motor 215e. Function.

The mounting control unit 33 has a function of generating/disabling the negative pressure of the air pressure adjuster 261 or moving the mounting head 26 of the moving mechanism 24 .

The inspection unit 34 has a function of checking whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B by pattern matching based on the image information acquired by the camera 27.

The recovery control unit 35 has a function of adjusting the position of the recovery nozzle 29, etc., so that the solder ball can be remounted by the electrode which is determined to be improperly mounted by the inspection unit 34.

<Operation of Substrate Processing System>

FIG. 8 is a flowchart showing a process of filling a solder ball in each hole h1 of the first mask 211.

In step S101, the control device 30 generates a negative pressure via the communication passage D1 of the filling station 213 by the air pressure regulator 214 (see FIG. 7). Further, the generation of the negative pressure may be started immediately after the filling of the solder balls described later.

In step S102, the control device 30 fills each of the holes h1 of the first mask 211 with one solder ball by the solder ball filling means 215 (see FIG. 5). In other words, the control device 30 moves the slit-like body 215c in the x direction while vibrating the slit-shaped body 215c by the vibration damper 215d (see FIG. 5).

(a) of FIG. 9 is an explanatory view showing a state in which the solder balls are filled in the respective holes h1 of the first mask 211. The solder balls each filled in each hole h1 of the mask 211 are attracted via the communication path D1 (S101, S102). On the other hand, although the flux is applied to each electrode Q of the substrate B, the solder balls are not mounted in the fields R1 to R4.

In step S103 of FIG. 8, the control device 30 determines whether or not the mounting head 26 is close to the first mask 211. When the mounting head 26 does not approach the first mask 211 (S103: No), the control device 30 repeats the processing of step S103. On the other hand, when the mounting head 26 approaches the first mask 211 (S103: Yes), the processing of the control device 30 proceeds to step S104.

In step S104, the control device 30 cancels the negative pressure generated by the air pressure regulator 214. Further, instead of the release of the negative pressure, a positive pressure for pushing up the solder ball may be applied via the communication path D1.

In step S105, the control device 30 determines whether or not the mounting head 26 that adsorbs the solder balls leaves the first mask 211. When the mounting head 26 has not left the first mask 211 (S105: No), the control device 30 repeats the processing of step S105. On the other hand, when the mounting head 26 leaves the first mask 211 (S105: Yes), the processing of the control device 30 returns to "START" (RETURN).

In this manner, the control device 30 repeats the process of filling the first mask 211 with the solder balls in accordance with each field of the substrate B. In addition, the "ball filling process" in which one solder ball is filled in each hole h1 of the first mask 211 is a process including steps S101 to S105.

Next, the timing of starting the filling of the solder balls by the two solder ball filling units 21, 22 (refer to FIG. 4) will be described.

FIG. 10 is an explanatory diagram showing a flow of an operation of the substrate processing apparatus 2.

The horizontal axis of FIG. 10 is an elapsed time (1 scale: 0.5 second) after the mounting head 26 starts moving toward the first mask 211. The upper range N1 is a series of flows in which the solder balls are filled in the holes h1 of the first mask 211 by one of the solder ball filling units 21 (see FIG. 4), and the solder balls are mounted on the substrate B. The lower range N2 is a series of rows in which the solder balls are filled in the holes h1 of the first mask 221 by the other solder ball filling unit 22 (see FIG. 4), and the solder balls are placed on the substrate B. Process.

In the example shown in FIG. 10, the mounting head 26 moves to the upper surface (0 to 1 second) of the first mask 211, and the mounting head 26 sucks the solder ball (1 second to 2.5 seconds), and after the mounting head 26 rises (2.5) Seconds to 3.5 seconds), the filling of the solder balls starts (S105: Yes, RETURN, S101, S102).

Moreover, in the example shown in FIG. 10, when the waiting time (3.5 seconds) of the mounting head 26 in the vicinity of the first mask 211 is included, the filling of the solder ball takes 16 seconds (range N1: 0 second to 16 seconds). Similarly, when the solder ball is filled by the solder ball filling unit 22, it takes 16 seconds (range N2: 8 seconds to 24 seconds).

As will be described in detail later, the operation of mounting the solder balls on the respective electrodes Q of the substrate B after the mounting head 26 faces the first mask 211 is completed in 8 seconds of, for example, 0 seconds to 8 seconds. That is, each time the solder ball is mounted is half of the filling time of each time. Therefore, in the present embodiment, the solder ball filling units 21 and 22 start the filling of the solder balls by shifting the timing by 8 seconds, and the first masks 211 and 221 (see FIG. 4) are filled in, and the mounting head 26 is used. Adsorb the solder balls. Thereby, the filling of the solder balls is eliminated, and the waiting time at the time of mounting is eliminated, and a large number of substrates B can be processed per unit time.

FIG. 11 is a flowchart showing a process of mounting a solder ball on each electrode Q of the substrate B.

In step S201, the control device 30 determines whether or not the solder ball is filled by any one of the solder ball filling units 21, 22 (i.e., the solder balls are filled). When the solder ball filling units 21, 22 are all filled with solder balls (S201: No), the control device 30 repeats the processing of step S201. On the other hand, when any one of the solder ball filling units 21, 22 is filled with the solder ball (that is, the solder ball is filled) (S201: Yes), the processing of the control device 30 proceeds to step S202.

In step S202, the control device 30 moves the mounting head 26 to the front surface of the first mask 211 by the moving mechanism 24 (see FIG. 4) (FIG. 9(a), FIG. 10, 0 second to 1 second) . In other words, the control device 30 moves the mounting head 26 so that the position of each hole h1 of the first mask 211 and the position of each hole h2 of the second mask 25 can be aligned in plan view.

In step S203, the control device 30 generates a negative pressure by the air pressure regulator 261 (see FIG. 7), and sucks the solder ball through each hole h2 of the second mask 25 (1 second to 2.5 seconds in FIG. 10). ).

In step S204, the control device 30 moves the mounting head 26 to the front side of the target area (any one of the fields R1 to R4) of the substrate B by the moving mechanism 24 (see FIG. 4). In other words, the control device 30 raises the mounting head 26 (2.5 seconds to 3.5 seconds in FIG. 10), and recognizes the alignment mark of the substrate B and the movement of the mounting head 26 based on the imaging result of the camera 27. (FIG. 10) 3.5 seconds to 5 seconds).

(b) of FIG. 9 is an explanatory view showing a state in which the solder balls are adsorbed to the respective holes h2 of the second mask 25. The control device 30 is in a state in which the solder balls are held by the respective holes h2 of the second mask 25, and the position of each electrode Q in the target region and the position of each hole h2 of the second mask 25 can be aligned in plan view. The method moves the mounting head 26.

In step S205 of Fig. 11, the control device 30 is at the base Solder balls are mounted on the respective electrodes Q of the board B. That is, the control device 30 releases the negative pressure of the air pressure adjuster 261, and mounts the solder balls on the respective electrodes Q of the substrate B. Further, when the solder ball is mounted, a positive pressure for pushing the solder ball toward the substrate B may be applied through the holes h2 of the communication path D2 and the second mask 25.

(c) of FIG. 9 is an explanatory view showing a state in which the solder balls are mounted on the respective electrodes Q in one field in the substrate B. The example shown in FIG. 9(c) is a field in which a solder ball is not mounted (a field on the right side of the paper).

In step S206 of FIG. 11, the control device 30 determines whether or not there is a field in which the solder ball is not mounted on the substrate B. When there is a field in which the solder ball is not mounted (S206: Yes), the processing of the control device 30 returns to step S201. On the other hand, when all of the fields R1 to R4 of the substrate B are mounted with solder balls (S206: No), the control device 30 ends the processing (END).

In addition, the "bump ball mounting process" in which the process of mounting the solder balls on each electrode Q of the substrate B is repeated for each field includes the processes of steps S201 to S206.

Fig. 12 is a flow chart showing the inspection processing and the recovery processing.

Further, at the time point "START" shown in FIG. 12, the solder balls are mounted on all of the fields R1 to R4 of the substrate B.

In step S301, the control device 30 executes the inspection process by the inspection unit 34 (see Fig. 7). That is, the control device 30 checks whether or not the solder balls are appropriately mounted on the respective electrodes Q of the substrate B by pattern matching, for example. Then, the control device 30 stores the result of the inspection process in the storage unit 31.

In step S302, the control device 30 is from the memory unit 31. The result of the inspection process is read, and it is determined whether or not there is an electrode on which the solder ball is mounted. When an improper electrode is not mounted on the solder ball (S302: No), the control device 30 ends the processing (END). On the other hand, when an improper electrode is mounted on the solder ball (S302: Yes), the process of the control device 30 proceeds to step S303.

In step S303, the control device 30 executes the restoration processing by the restoration control unit 35 (see Fig. 7). For example, in the control device 30, when the mounting position of the solder ball is shifted from the electrode of the substrate B, or when a plurality of solder balls are mounted on one electrode, the electrode removes the solder ball. Then, the control device 30 mounts a new solder ball with a flux on this electrode. Further, when there is an electrode on which the solder ball is not mounted, the control device 30 mounts a new solder ball with a flux on the electrode.

In step S304, the control device 30 determines whether or not there is an electrode on which another solder ball is mounted. When an improper electrode is mounted on another solder ball (S304: Yes), the processing of the control device 30 returns to step S303. On the other hand, when an improper electrode is not mounted on the solder ball (S304: No), the control device 30 ends the processing (END).

<effect>

According to the present embodiment, since the solder balls are individually mounted on the regions R1 to R4 of the substrate B (see FIG. 2), even if the area of the substrate B is relatively large, the substrate B can be deformed by shrinkage or the like. The resulting displacement pressure is within the allowable range.

In addition, a mask (not shown) provided with a plurality of holes is placed on the substrate. In the conventional method of mounting a solder ball at a time, in order to press the displacement of each hole of the mask and each electrode of the substrate within an allowable range, the substrate having a relatively large area is cut and washed, and then the respective substrates are soldered. The ball is mounted.

On the other hand, in the case of the substrate B having a relatively large area, since the solder balls are individually mounted in the fields R1 to R4, the cutting of the substrate B before the mounting of the solder balls or the like can be omitted. net. Therefore, according to the present embodiment, the cost required for a series of processes can be significantly reduced as compared with the prior art.

Further, by vibrating the slit-shaped body 215c (see FIG. 5) disposed in contact with the first mask 211, as described above, the solder balls are dispersed, and one solder ball can be mounted on each of the electrodes Q of the substrate B. Therefore, the time required for the recovery process (S303; see FIG. 12) can be shortened, and more substrates B can be processed per unit time.

Further, the substrate processing apparatus 2 is configured to perform post-inspection processing and recovery processing in addition to charging of the solder balls. Therefore, in comparison with the case where the inspection ‧ recovery device (not shown) is separately provided, the manufacturing cost of the substrate processing apparatus 2 can be reduced, and the lateral width of the entire apparatus including the flux printing apparatus 1 can be reduced.

≪Second embodiment≫

In the second embodiment, the fourth mask M4 disposed on the upper side of the second mask 25A (see FIG. 13(a)) and the lower side of the first mask 211A (see FIG. 13(b)) are provided. The point of the third mask M3 is different from that of the first embodiment. In addition, regarding other points (flux printing device) 1. The moving mechanism 24, the cameras 27, 28, the recovery nozzle 29, and the like; and Figs. 1 and 4) are the same as in the first embodiment. Therefore, the differences from the first embodiment will be described, and the description of the overlapping portions will be omitted.

Fig. 13 (a) is a schematic cross-sectional view including the second mask 25A and the fourth mask M4. The second mask 25A includes a mask portion 25a in which a plurality of holes h1 are provided, and a sliding portion 25b in which the peripheral edge portion of the mask portion 25a extends upward. The sliding portion 25b is slidably attached to the peripheral wall surface of the mounting head 26.

The fourth mask M4 is a convex portion a4 having electrodes Q corresponding to one field (any one of the fields R1 to R4; see FIG. 2) corresponding to the substrate B, and is fixed to the mounting head 26. The respective convex portions a4 protrude to the lower side and face the respective holes h2 of the second mask 25A. In other words, the fourth mask M4 is disposed on the upper side of the second mask 25A so that the convex portion a4 and the hole h2 overlap each other in the vertical direction.

As described above, since the sliding portion 25b is slidably attached to the peripheral wall surface of the mounting head 26, the space between the second mask 25A and the fourth mask M4 is substantially sealed. Further, although not shown in FIG. 13(a), a plurality of holes are actually provided in the fourth mask M4, and the negative pressure/positive pressure acts via the communication path D2 of the mounting head 26.

Fig. 13 (b) is a schematic cross-sectional view including the first mask 211A and the third mask M3. The first mask 211A includes a mask portion 211a in which a plurality of holes h1 are provided, and a sliding portion 211b in which a peripheral edge portion of the mask portion 211a extends downward. The sliding portion 211b is slidably connected to the filling station The wall surface of 213.

The third mask M3 is a convex portion a3 having a plurality of electrodes Q corresponding to one field (any one of the fields R1 to R4; see FIG. 2) corresponding to the substrate B, and is fixed to the filling table 213. The respective convex portions a3 are protruded upward to face the respective holes h1 of the first mask 211A. In other words, the third mask M3 is disposed on the lower side of the first mask 211A so that the convex portion a3 and the hole h1 overlap each other in the vertical direction.

As described above, since the sliding portion 211b is slidably attached to the peripheral wall surface of the filling table 213, the space between the first mask 211A and the third mask M3 is substantially sealed. Further, although not shown in FIG. 13(b), a plurality of holes are actually provided in the third mask M3, and the negative pressure/positive pressure acts via the communication path D1 of the filling table 213.

Further, the other solder ball filling unit 22A (not shown) also has the same configuration as the solder ball filling unit 21A shown in FIG. 13(b).

FIG. 14 is a functional block diagram of the control device 30A included in the substrate processing apparatus 2.

The third mask moving motor 41 shown in FIG. 14 is a driving source that closes and separates the first mask 211A (see FIG. 13(b)) and the third mask M3 by, for example, a ball screw shaft. The fourth mask moving motor 42 is a driving source that closes and separates the second mask 25A (see FIG. 13( a )) and the fourth mask M4 by, for example, a ball screw shaft.

The filling control unit 32A has a third mask M3 from the third mask moving motor 41 when the solder balls are filled in the holes h1 of the first mask 211A (see FIG. 13(b)). 1 mask 211A away Open function.

When the negative pressure is generated (adsorbing the solder ball) via the respective holes h2 of the second mask 25A (see FIG. 13(a)), the mounting control unit 33A is provided by the third mask moving motor 41. 3 The function of the mask M3 approaching the first mask 211A and the fourth mask moving motor 42 to move the fourth mask M4 away from the second mask 25A.

Further, the mounting control unit 33A also has a fourth mask moving motor 42 for the fourth mask when the solder balls sucked through the holes h2 of the second mask 25A are mounted on the electrodes Q of the substrate B. M4 is close to the function of the second mask 25A.

FIG. 15 is a flowchart showing a process of mounting a solder ball on each electrode Q of the substrate B. In addition, the same step numbers are attached to the portions overlapping with the flowchart of Fig. 11 described in the first embodiment.

In step S202, the control device 30A moves the mounting head 26 to the upper surface of the first mask 211A. At this time, as shown in FIG. 16( a ), since the negative pressure acts via the communication path D1 , the solder balls filled in the holes h1 of the first mask 211A are attracted to the lower side.

In step S203a, the control device 30A raises the third mask M3 by the third mask moving motor 41, and pushes the solder ball by the convex portion a3. Further, the control device 30A applies a negative pressure via the communication path D2, and sucks the solder balls through the respective holes h2 of the second mask 25A. Further, before the process of step S203a is performed, the negative pressure acting via the communication path D1 of the filling station 213 is released.

As shown in Fig. 16 (b), the welding is pushed up by the convex portion a3 The balls, which are filled in the holes h1 of the first mask 211A, are easily attracted by the mounting head 26. Therefore, it is possible to prevent the solder ball from remaining in the hole h1 of the first mask 211A.

In step S204, the control device 30A moves the mounting head 26 to the upper side of the target area. In other words, as shown in FIG. 16(c), the control device 30A moves the mounting head 26 to the front surface of the predetermined region of the substrate B while the negative pressure is applied via the communication path D2.

In step S205a, the control device 30A lowers the fourth mask M4 by the fourth mask moving motor 42, and pushes the solder ball by the convex portion a4. As shown in FIG. 16(d), the solder balls are pushed down by the convex portions a4, and the solder balls adsorbed to the respective holes h2 of the second mask 25A are easily mounted on the electrodes Q of the substrate B. Further, the control device 30A performs a positive pressure action of pushing down the solder ball via the communication path D2, and mounts the solder ball in a predetermined area of the substrate B.

The control device 30A repeats the mounting of the solder balls in accordance with each field of the substrate B (S206: Yes, RETURN).

<effect>

According to the present embodiment, when the solder ball is sucked through each hole h2 of the second mask 25A, the control device 30A pushes up the solder ball by the convex portion a3 of the third mask M3 (S203a). In the control device 30A, when the solder balls are mounted on the respective electrodes Q of the substrate B, the solder balls are pushed down by the convex portions a4 of the fourth mask M4 (S205a). Thereby, it is possible to prevent the solder ball from remaining in the hole h1 of the first mask 211A or the hole of the solder ball remaining in the second mask 25A. H2. As a result, the electrode which is determined to be "no solder ball" in the inspection process is almost absent, so that the time required for the recovery process can be shortened, and more substrates B can be processed per unit time.

≪ ≫ ≫

The substrate processing system S according to the present invention has been described above, but the present invention is not limited to the respective embodiments, and may be appropriately changed without departing from the scope of the invention.

For example, in each of the embodiments, the case where the solder ball filling means 215 (see FIG. 5) includes one slit-like body 215c (see FIGS. 5 and 6) will be described, but the present invention is not limited thereto.

FIG. 17 is a longitudinal cross-sectional view of the ball filling unit 21B included in the substrate processing system S according to a modification of the present invention. The solder ball filling means 215B provided in the solder ball filling unit 21B will be described below, and the other configurations are omitted.

The ball filling means 215B includes a rotating body 215f, eight slit-shaped bodies 215c, and a cover 215g.

The rotating body 215f has a positive polygonal shape in cross section (a positive octagonal shape in FIG. 17), and is formed to rotate around a rotation axis y1 extending in the y direction. The slit-shaped body 215c has the same configuration as that described in the first embodiment (see FIGS. 5 and 6), and one cross section is provided on each side of the rotating body 215f. Further, one of the eight slit-shaped bodies 215c having the height of the rotation axis y1 of the rotating body 215f (located at the lowermost side) is set to be in contact with the first mask 211.

The cover 215g is a case in which the rotating body 215f and the slit-shaped body 215c are accommodated. An opening h3 for blowing air into the cover 215g is provided in the vicinity of the lower end of the cover 215g. Thereby, it is possible to prevent the solder ball from remaining on the first mask 211. The ball filling means 215B including the rotating body 215f, the slit-like body 215c, and the cover 215g is moved in the x direction when the respective holes of the first mask 211 are filled with the solder balls.

Since a plurality of slits T are provided in the slit-like body 215c (see FIG. 6(b)), the solder balls in the cover 215g are dispersed by the rotation of the rotating body 215f, and the dispersed solder balls are filled one by one. Each hole h1 of the first mask 211.

Further, in each of the embodiments, the case where the substrate B has four fields R1 to R4 (see FIG. 2) and the solder balls are sequentially mounted in the fields R1 to R4 will be described, but the present invention is not limited thereto. That is, the number of fields may be appropriately set depending on the diameter of the solder ball, the area of the substrate B, the pitch between the bumps (that is, the electrode Q of the substrate B), and the like.

Further, in each of the embodiments, the case where the substrate processing apparatus 2 includes the two ball filling units 21 and 22 (see FIG. 4) will be described, but the invention is not limited thereto. In other words, it is also possible to form a configuration including one solder ball filling unit or a configuration in which three or more solder ball filling units are formed, depending on the time required for the solder ball to be filled and mounted.

Further, in each of the embodiments, the case where the substrate processing apparatus 2 includes one mounting head 26 will be described, but the present invention is not limited thereto. In other words, a plurality of mounting heads 26 provided with the second mask 25 may be provided. In this case, the control device 30 is a method in which the solder ball is filled and the rest is carried out without rest. The solder ball is adsorbed by the mounting head 26 from the first mask 211 in which the solder balls are filled.

In addition, each of the embodiments describes the case where the substrate processing apparatus 2 performs the inspection process (S301; see FIG. 12) and the recovery process (S303; FIG. 12) regarding the solder ball, but the present invention is not limited thereto. In other words, it is also possible to perform inspection of the inspection process and the recovery process, and a recovery device (not shown) on the downstream side of the substrate processing apparatus mounted on the substrate. Further, the substrate processing system S may be configured to include a flux printing device 1 that performs printing of a flux, and a substrate processing device that performs only the filling of the solder balls.

In the second embodiment, the fourth mask M4 is placed on the upper side of the second mask 25A (see FIG. 13(a)), and the first mask 211A (see FIG. 13(b)) is placed on the lower side. The configuration of the mask M3 will be described, but it is not limited thereto. One of the third mask M3 and the fourth mask M4 may be omitted from the second embodiment.

Further, the substrate B described in each embodiment may be a printed circuit board or a semiconductor wafer or the like, and other circuit components.

Further, each embodiment is described in detail for easy understanding of the present invention, but it is not limited to all of the configurations described above. Further, it is possible to add, remove, and replace other components for a part of the configuration of each embodiment.

Further, each of the above-described configurations, functions, processing units, processing means, and the like may be implemented in a part or all of the hardware by, for example, an integrated circuit design. Moreover, the organization or composition is necessary for display instructions, and the products are different. Display all the institutions or components.

23‧‧‧ mounting table

25‧‧‧2nd mask (welding ball mounting means)

26‧‧‧Heading head (solder ball loading means)

211‧‧‧1st mask

213‧‧‧ Filling station

B‧‧‧Substrate

D1, D2‧‧‧Connected Road

H1‧‧‧ hole of the first mask

H2‧‧‧ hole of the second mask

Q‧‧‧electrode

R1~R4‧‧‧ Field

Claims (9)

A substrate processing apparatus characterized by comprising: a first mask which is provided with a plurality of holes corresponding to a plurality of fields in a plan view; and a solder ball filling means attached to the solder ball filling means Each of the holes of the first mask is filled with one solder ball; and the solder ball mounting means has a second mask provided with a plurality of holes corresponding to the respective electrodes in the field, and is repeated for each of the above fields: The solder balls filled in the respective holes of the first mask by the solder ball filling means are adsorbed through the respective holes of the second mask, and the solder balls after the adsorption are mounted on the respective electrodes in the field. . The substrate processing apparatus according to claim 1, wherein the solder ball filling means includes a slit-shaped body having a plurality of slits in which the solder balls are movable, and capable of being bent into the first mask In a state of being in contact with the first mask. The substrate processing apparatus according to the first aspect of the invention, further comprising: an imaging device that images the solder balls mounted on the plurality of substrates in the field to obtain image information; and the inspection means is based on the The image information obtained by the imaging means is used to check whether or not the solder balls are properly mounted on the respective electrodes of the substrate; and the recovery means is determined by the inspection means to determine that the solder balls are mounted on the electrodes to be improperly mounted. ball. The substrate processing apparatus according to claim 1, further comprising: a third mask having a plurality of convex portions corresponding to respective electrodes in the field, and the plurality of convex portions and the first mask The holes of the cover are disposed on the lower side of the first mask so as to overlap in the vertical direction, and the third mask moving means is configured to approach or separate the third mask from the first mask. In the third mask moving means, when the solder ball is filled in each hole of the first mask by the solder ball filling means, the third mask is separated from the first mask, and the soldering is performed by the soldering When the ball mounting means sucks the solder balls through the respective holes of the second mask, the third mask is brought close to the first mask, and the solder balls are pushed up by the convex portions. The substrate processing apparatus according to claim 1, further comprising: a fourth mask having a plurality of convex portions corresponding to respective electrodes in the field, and the plurality of convex portions and the second mask The fourth mask is disposed on the upper side of the second mask so as to be overlapped in the vertical direction, and the fourth mask moving means is configured to approach or separate the fourth mask from the second mask. The fourth mask moving means is configured to pass through the holes of the second mask by the solder ball mounting means When the solder ball is adsorbed, the fourth mask is separated from the second mask, and when the solder balls adsorbed through the respective holes of the second mask are mounted on the respective electrodes of the substrate by the solder ball mounting means, The fourth mask is brought close to the second mask, and the solder ball is pushed down by the convex portion. The substrate processing apparatus according to any one of claims 1 to 5, further comprising a plurality of solder ball filling units including the first mask and the solder ball filling means, each of which is The solder ball filling unit starts the solder ball filling by shifting the timing, and the solder ball mounting means is the first mask of the solder ball filling unit filled with the solder balls from the plurality of solder ball filling units. The hole of the second mask absorbs the solder ball. The substrate processing apparatus according to any one of claims 1 to 5, further comprising: a plurality of solder ball filling units; and a plurality of solder ball loading means, wherein the solder ball filling unit has the foregoing In the first mask and the solder ball filling means, each of the solder ball filling units starts filling the solder balls in a staggered sequence, and each of the solder ball mounting means passes through a plurality of solder ball filling units. The hole of the second mask of the filled solder ball filling unit is used to adsorb the solder ball. A substrate processing system characterized by comprising: a flux coating means for applying a flux to each electrode of a substrate having a plurality of fields in a plan view; a first mask provided with a plurality of holes corresponding to respective electrodes in the above-mentioned field; and a solder ball filling means for filling one solder ball in each hole of the first mask; and a solder ball mounting means, The solder ball is mounted on each of the electrodes of the substrate to which the flux is applied by the flux coating means, and the solder ball mounting means includes a second mask provided with a plurality of holes corresponding to the respective electrodes in the field. Repeating for each of the above-mentioned fields: the solder balls filled in the respective holes of the first mask by the solder ball filling means are adsorbed through the respective holes of the second mask, and the solder balls after the adsorption are mounted. The treatment of each electrode in the aforementioned fields. A substrate processing method, comprising: a solder ball filling process, which is a substrate having a plurality of fields in a plan view, and a plurality of holes of a first mask that can be formed to correspond to respective electrodes in the field Each of the solder balls is filled with a solder ball; and the solder ball mounting process is repeated for each of the above-mentioned fields: the filling is performed by the aforementioned solder balls through a plurality of holes formed by the second mask corresponding to the electrodes in the above-mentioned field. The solder balls are filled in the respective holes of the first mask, and the solder balls after the adsorption are mounted on the respective electrodes in the above-described field.