JPH07212023A - Solder ball feeding method and solder ball feeding jig used for the method - Google Patents
Solder ball feeding method and solder ball feeding jig used for the methodInfo
- Publication number
- JPH07212023A JPH07212023A JP725494A JP725494A JPH07212023A JP H07212023 A JPH07212023 A JP H07212023A JP 725494 A JP725494 A JP 725494A JP 725494 A JP725494 A JP 725494A JP H07212023 A JPH07212023 A JP H07212023A
- Authority
- JP
- Japan
- Prior art keywords
- solder ball
- solder
- push
- jig
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、 BGA（ボール・グリッ
ド・アレイ）の電極となる半田ボールの供給方法及びそ
の半田ボールの供給方法に用いる半田ボール供給治具に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of supplying solder balls to be electrodes of a BGA (ball grid array) and a solder ball supplying jig used in the method of supplying solder balls.
【０００２】[0002]
【従来の技術】BGA（ボール・グリッド・アレイ）等の
半導体素子において、電極となる半田ボールを BGAのパ
ッケージ（ BGA本体）に供給する際、転写治具にて半田
ボールを吸着して供給する方法がある。その半田ボール
供給方法の一例を図３の断面図に示す。まず、（ａ）に
示すように、半田ボール１を大量に蓄えた容器２内に吸
着穴３ａを有する転写治具３を移動させ、転写治具３内
部の空洞部３ｂを介して吸着穴３ａに真空吸着力を発生
させ半田ボール１を吸着穴３ａに吸着させる。この吸着
穴３ａは転写治具３において BGAに形成しようとする半
田ボール電極に対応した位置に穿設されている。2. Description of the Related Art In a semiconductor element such as a BGA (ball grid array), when a solder ball to be an electrode is supplied to a BGA package (BGA body), the solder ball is sucked and supplied by a transfer jig. There is a way. An example of the solder ball supply method is shown in the sectional view of FIG. First, as shown in (a), the transfer jig 3 having the suction holes 3a is moved into a container 2 in which a large amount of solder balls 1 are stored, and the suction holes 3a are inserted through a cavity 3b inside the transfer jig 3. A vacuum suction force is generated to suck the solder ball 1 into the suction hole 3a. The suction holes 3a are formed in the transfer jig 3 at positions corresponding to the solder ball electrodes to be formed on the BGA.
【０００３】次に、（ｂ）に示すように、転写治具３に
半田ボール１を吸着させた状態で、転写治具３をフラッ
クス４を蓄えた容器５内に移動させて、半田ボール１の
下部にフラックス４を付着させる。Next, as shown in (b), the transfer jig 3 is moved into the container 5 in which the flux 4 is stored while the solder ball 1 is adsorbed by the transfer jig 3, and the solder ball 1 Flux 4 is attached to the lower part of.
【０００４】一方、（ｃ）において、６は半田ボール電
極を形成する BGA本体で、回路基板７、金属パッド８、
レジスト層９、回路パターン、実装部品等で構成されて
いる。但し、以降の図では、本発明に関連する部分のみ
を図示することとし、その他の部分については図示及び
詳細な説明を省略する。回路基板６上には、半田ボール
電極形成位置に金属パッド７が形成されており、金属パ
ッド７の周囲にはレジスト層８が形成されている。レジ
スト層８は電気絶縁性を有する材料で、かつ、半田濡れ
性（半田接合性）の無い、または、非常に低い材料で構
成されている。通常、 BGA本体６は、回路基板６の半田
ボール電極を形成する面の全面にレジスト層８を形成し
ておき、半田ボール電極を形成する箇所のみレジスト層
８を平面視略円形に除去して金属パッド１０を露出させ
ることによって形成される。また、露出させた金属パッ
ド８上には予めフラックス４を供給しておく。On the other hand, in (c), 6 is a BGA body forming a solder ball electrode, which is a circuit board 7, a metal pad 8,
It is composed of a resist layer 9, a circuit pattern, mounted parts and the like. However, in the following figures, only the part related to the present invention will be shown, and the other parts will not be shown and described in detail. A metal pad 7 is formed on the circuit board 6 at the solder ball electrode formation position, and a resist layer 8 is formed around the metal pad 7. The resist layer 8 is made of a material having an electric insulation property and having no solder wettability (solder bondability) or a very low material. Normally, the BGA body 6 has a resist layer 8 formed on the entire surface of the circuit board 6 on which the solder ball electrodes are formed, and the resist layer 8 is removed in a substantially circular shape in plan view only at the portions where the solder ball electrodes are formed. It is formed by exposing the metal pad 10. Further, the flux 4 is previously supplied onto the exposed metal pad 8.
【０００５】次に、金属パッド８上に転写治具３によっ
て半田ボール１を移動させ真空吸着力を消滅させると、
半田ボール１はフラックス４の粘着力で金属パッド８上
に供給されることになる。さらに、リフロー等にて加熱
し半田ボール１を溶融させ、金属パッド８に溶融接合さ
せることによって、（ｄ）に示すように、半田ボール電
極１０を形成することができる。Next, when the solder ball 1 is moved onto the metal pad 8 by the transfer jig 3 to eliminate the vacuum suction force,
The solder balls 1 are supplied onto the metal pads 8 by the adhesive force of the flux 4. Further, by heating by reflow or the like to melt the solder ball 1 and melt-bonding it to the metal pad 8, the solder ball electrode 10 can be formed as shown in (d).
【０００６】[0006]
【発明が解決しようとする課題】ところが、上記方法で
は、転写治具３に穿設された吸着穴３ａに半田ボール１
を吸着させる際、一度に吸着する半田ボール１の個数
（ BGAの電極数）の増加に伴い、吸着ミスが発生しやす
くなり歩留りが低下するという問題点があった。However, in the above method, the solder ball 1 is inserted into the suction hole 3a formed in the transfer jig 3.
In adsorbing, the number of solder balls 1 that are adsorbed at one time (the number of BGA electrodes) increases, so that an adsorption error easily occurs and the yield decreases.
【０００７】本発明は上記課題に鑑みなされたもので、
その目的とするところは、吸着ミスの発生を防止するこ
とができ、歩留りの低下を防止することができる半田ボ
ール供給方法及びその半田ボール供給方法に用いる半田
ボール供給治具の構造を提供することにある。The present invention has been made in view of the above problems,
It is an object of the present invention to provide a solder ball supply method capable of preventing the occurrence of a suction error and a decrease in yield, and a structure of a solder ball supply jig used in the solder ball supply method. It is in.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、請求項１記載の半田ボール供給方法は、半田ボール
を転写治具の吸着穴に吸着させて回路基板の半田ボール
電極形成位置に供給する半田ボール供給方法において、
前記吸着穴に対応する半田ボール押し出し孔を備えた治
具本体と、前記半田ボール押し出し孔の下方開口から押
し出し棒部を挿入し上方開口から前記半田ボールを押し
出す押し出し部とを備えた半田ボール供給治具を用い、
前記半田ボール押し出し孔に前記半田ボールを収納し、
前記上方開口から半田ボールを一組ずつ押し出して前記
吸着穴に前記半田ボールを吸着させることを特徴とする
ものである。In order to achieve the above object, a solder ball supplying method according to a first aspect of the present invention supplies a solder ball to a solder ball electrode forming position of a circuit board by adsorbing the solder ball to a suction hole of a transfer jig. In the solder ball supply method,
Solder ball supply including a jig main body having a solder ball extrusion hole corresponding to the suction hole, and an extrusion portion for inserting an extrusion rod portion from a lower opening of the solder ball extrusion hole and extruding the solder ball from an upper opening Using a jig,
The solder balls are stored in the solder ball extrusion holes,
The solder balls are pushed out one by one from the upper opening to suck the solder balls in the suction holes.
【０００９】また、請求項２記載の半田ボール供給方法
は、半田ボールを転写治具の吸着穴に吸着させて回路基
板の半田ボール電極形成位置に供給する半田ボール供給
方法において、前記吸着穴に対応する半田ボール押し出
し孔を備えた治具本体と、前記半田ボール押し出し孔の
下方開口から押し出し棒部を挿入し上方開口から前記半
田ボールを押し出す押し出し部とを備えた半田ボール供
給治具を用い、前記半田ボール押し出し孔に前記半田ボ
ールを収納し、前記上方開口から半田ボールを一組ずつ
押し出して前記吸着穴に前記半田ボールを吸着させた
後、前記吸着穴に対応する孔を穿設したスリットを介し
てフラックスを前期半田ボールに局所的に付着させるこ
とを特徴とするものである。According to a second aspect of the present invention, there is provided a solder ball supplying method, wherein the solder ball is sucked into a suction hole of a transfer jig and is supplied to a solder ball electrode forming position of a circuit board. A solder ball supply jig including a jig main body having a corresponding solder ball extrusion hole and an extrusion portion for inserting an extrusion rod portion from a lower opening of the solder ball extrusion hole and extruding the solder ball from an upper opening is used. The solder balls are housed in the solder ball push-out holes, the solder balls are pushed out one by one from the upper opening to suck the solder balls in the suction holes, and then holes corresponding to the suction holes are formed. The feature is that flux is locally adhered to the solder balls through the slits.
【００１０】さらに、請求項３記載の半田ボール供給治
具は、請求項１または請求項２記載の半田ボール形成方
法に用いる治具であって、前記吸着穴に対応する半田ボ
ール押し出し孔を備えた治具本体と、前記半田ボール押
し出し孔の下方開口から押し出し棒部を挿入し上方開口
から前記半田ボールを押し出す押し出し部とを備えたこ
とを特徴とするものである。Further, a solder ball supplying jig according to a third aspect is a jig used in the solder ball forming method according to the first or second aspect, and is provided with a solder ball pushing hole corresponding to the suction hole. And a push-out portion for inserting the push-out rod portion from the lower opening of the solder ball push-out hole and pushing out the solder ball from the upper opening.
【００１１】[0011]
【作用】図１に示すように、請求項３記載の半田ボール
供給治具１１は、転写治具１２の所定位置に設けられた
吸着穴１２ａに対応する半田ボール押し出し孔１３ａを
備えた治具本体１３と、半田ボール押し出し孔１３ａ内
に収納された半田ボール１４を半田ボール押し出し孔１
３ａの上方開口より押し出す押し出し棒１５ａを備えた
押し出し部１５とで構成されている。As shown in FIG. 1, a solder ball supply jig 11 according to a third aspect of the present invention is a jig having a solder ball pushing hole 13a corresponding to a suction hole 12a provided at a predetermined position of a transfer jig 12. The main body 13 and the solder balls 14 housed in the solder ball extrusion holes 13a are attached to the solder ball extrusion holes 1
3a and a push-out portion 15 provided with a push-out rod 15a pushed out from the upper opening.
【００１２】半田ボール押し出し孔１３ａのそれぞれに
は20〜30個程度の半田ボール１４を収納しておき、吸着
穴１２ａに半田ボール１４を吸着させる際、押し出し部
１５を上方に移動させ半田ボール押し出し孔１３ａの上
方開口より一組分の半田ボール１４を半田ボールの半径
程度、治具本体１３の上面に突出させる。これにより、
治具本体１３の上面に一組分の半田ボールを不足なく所
定の位置に配置することができるので、突出させた半田
ボールの上方に吸着穴１２ａが位置するように転写治具
を移動させ真空吸着力を発生させれば、半田ボール電極
数が増加しても半田ボールの吸着ミスを防止することが
できる。About 20 to 30 solder balls 14 are housed in each of the solder ball pushing holes 13a, and when the solder balls 14 are sucked into the suction holes 12a, the pushing portion 15 is moved upward to push the solder balls. A set of solder balls 14 is projected from the upper opening of the hole 13a to the upper surface of the jig body 13 by about the radius of the solder balls. This allows
Since one set of solder balls can be arranged at a predetermined position on the upper surface of the jig body 13 without any shortage, the transfer jig is moved so that the suction holes 12a are located above the projecting solder balls. If the suction force is generated, it is possible to prevent a solder ball suction error even if the number of solder ball electrodes is increased.
【００１３】また、図２に示すように、請求項２記載の
半田ボール供給方法に用いるスリット１６は、転写治具
１２の吸着穴１２ａに対応する孔１６ａを備えているの
で、転写治具１２の吸着穴１２ａに吸着されている半田
ボール１４の直下に孔１６ａが位置するようにスリット
１６を配置し、孔１６ａを介して半田ボール１４にフラ
ックス１７をスプレー１８にて吹きつけることによって
半田ボール１４の下部にのみフラックス１６を付着させ
ることができる。これにより、半田ボール１４にフラッ
クス１６を付着させる際に、転写治具１２へのフラック
ス１６の付着を防止できるので、転写治具１２に半田ボ
ール１４がフラックス１６の粘着力によって付着するこ
とによる転写ミスを防止することができる。Further, as shown in FIG. 2, since the slit 16 used in the solder ball supplying method according to the second aspect is provided with the hole 16a corresponding to the suction hole 12a of the transfer jig 12, the transfer jig 12 is provided. The slit 16 is arranged so that the hole 16a is located immediately below the solder ball 14 adsorbed in the adsorption hole 12a of the solder ball 14, and the flux 17 is sprayed onto the solder ball 14 through the hole 16a by the spray 18 to form the solder ball. The flux 16 can be attached only to the lower part of 14. As a result, when the flux 16 is attached to the solder balls 14, it is possible to prevent the flux 16 from adhering to the transfer jig 12, so that the solder balls 14 are attached to the transfer jig 12 by the adhesive force of the flux 16. You can prevent mistakes.
【００１４】[0014]
【実施例】本発明の半田ボール供給方法は、図１に示し
た半田ボール供給治具１１を用いて転写治具１２に半田
ボール１４を吸着させ、 BGA（ボール・グリッド・アレ
イ）本体に半田ボール１４を供給することを特徴とする
ものである。図１に示すように、半田ボール供給治具１
１は、半田ボール１４を複数個、縦方向に積み重ねて収
納する半田ボール押し出し孔１３ａを備えた治具本体１
３と、半田ボール押し出し孔１３ａの下方開口１３ｂか
ら押し出し棒１５ａを挿入し半田ボール１４を半田ボー
ル押し出し孔１３ａの上方開口１３ｃから押し出せるよ
う上下方向に移動可能に構成された押し出し部１５とで
構成されている。但し、押し出し部１５を上下に移動さ
せる機構部分は図示省略することとする。EXAMPLE A solder ball supply method according to the present invention uses a solder ball supply jig 11 shown in FIG. 1 to attract a solder ball 14 to a transfer jig 12 and solder it to a BGA (ball grid array) body. The ball 14 is supplied. As shown in FIG. 1, the solder ball supply jig 1
Reference numeral 1 denotes a jig body 1 having a solder ball extrusion hole 13a for accommodating a plurality of solder balls 14 which are vertically stacked.
3 and the push-out portion 15 configured to be vertically movable so that the push-out rod 15a can be inserted from the lower opening 13b of the solder ball push-out hole 13a and the solder ball 14 can be pushed out from the upper opening 13c of the solder ball push-out hole 13a. It is configured. However, a mechanical portion for moving the pushing portion 15 up and down is omitted in the drawing.
【００１５】半田ボール押し出し孔１３ａは、転写治具
１２の所定位置に形成された吸着穴１２ａに対応するよ
う、治具本体１３を上下方向に貫通するように形成され
ている。半田ボール押し出し孔１３ａは、吸着穴１２ａ
にスムーズに半田ボール１２を吸着させることができる
よう、吸着穴１２ａの位置精度を考慮して、その形状及
び位置を決定する。The solder ball pushing hole 13a is formed so as to vertically penetrate the jig body 13 so as to correspond to the suction hole 12a formed at a predetermined position of the transfer jig 12. The solder ball extrusion hole 13a is a suction hole 12a.
The shape and position of the suction hole 12a are determined in consideration of the positional accuracy of the suction hole 12a so that the solder ball 12 can be sucked smoothly.
【００１６】押し出し部１５には、半田ボール押し出し
孔１３ａの下方開口１３ｂから挿入して半田ボール１４
を治具本体１３の上方開口１３ｃから押し出す押し出し
棒１５ａが、半田ボール押し出し孔１３ａに対応して形
成されている。図に示す例では、全ての押し出し棒１５
ａは、押し出し部１５の本体部分に連結されており、押
し出し部１５の本体部分の上下動に合わせて同時に上下
移動するように構成されているが、押し出し棒１５ａ
を、個々に独立して、または、所定の組み合わせで上下
移動するように構成しておき、 BGAの電極数及び電極位
置に合わせて所望の押し出し棒１５ａが上下に移動する
ように構成してもよい。The solder ball 14 is inserted into the pushing portion 15 through the lower opening 13b of the solder ball pushing hole 13a.
A push-out rod 15a for pushing out the solder ball from the upper opening 13c of the jig body 13 is formed corresponding to the solder ball push-out hole 13a. In the example shown in the figure, all the push rods 15
a is connected to the main body portion of the push-out portion 15 and is configured to move up and down at the same time as the main body portion of the push-out portion 15 moves up and down.
May be configured to move up and down individually or in a predetermined combination, and the desired push-out bar 15a may move up and down according to the number of BGA electrodes and the electrode positions. Good.
【００１７】以上に示すように構成された半田ボール供
給治具１１を用いて BGA等の回路基板に半田ボール１４
を供給する方法について説明する。まず、押し出し部１
５を下方に移動させ押し出し棒１５ａが半田ボール押し
出し孔１３ａの下方に位置するようにする。次に、治具
本体１３の上面に大量の半田ボール１４を流し、治具本
体１３の上面まで各半田押し出し孔１３ａに半田ボール
１４を入れる。実際の工程では、半田ボール供給治具１
１を複数個設けておき、１つの半田ボール供給治具１１
に収納した半田ボール１４がなくなれば、半田ボール供
給治具１１を交換できるように構成しておき、半田ボー
ル１４を BGA等の回路基板に供給する作業と、半田ボー
ル供給治具１１に半田ボール１４を収納する作業を平行
して行うように構成しておく。Using the solder ball supply jig 11 configured as described above, solder balls 14 are attached to a circuit board such as BGA.
A method of supplying the electric field will be described. First, the extrusion unit 1
5 is moved downward so that the pushing bar 15a is located below the solder ball pushing hole 13a. Next, a large amount of solder balls 14 are poured onto the upper surface of the jig body 13, and the solder balls 14 are put into the respective solder extrusion holes 13 a up to the upper surface of the jig body 13. In the actual process, the solder ball supply jig 1
1 is provided in plural and one solder ball supply jig 11
If the solder balls 14 housed in are lost, the solder ball supply jig 11 is configured to be exchangeable, and the work of supplying the solder balls 14 to a circuit board such as BGA and the solder ball supply jig 11 are performed. It is configured such that the work of storing 14 is performed in parallel.
【００１８】次に、転写治具１２を治具本体１３の上面
近傍に移動させ半田ボール押し出し孔１３ａの上方に吸
着穴１２ａが位置するように位置決めして吸着穴１３ａ
の箇所に真空吸着力を発生させると、治具本体１３の半
田押し出し孔１１ａの最上部分に収納された半田ボール
１４が吸着穴１２ａに吸着される。この時、予め、半田
押し出し孔１３ａに収納された半田ボール１２のうち、
最上に位置する半田ボール１２をその半径程度、治具本
体１３の上面に押し出しておき、転写治具１２をその半
田ボール１２に近接または密着させて半田ボール１４を
吸着するようにしてもよい。Next, the transfer jig 12 is moved to the vicinity of the upper surface of the jig body 13 and positioned so that the suction hole 12a is located above the solder ball extrusion hole 13a, and the suction hole 13a is positioned.
When the vacuum suction force is generated at the position, the solder ball 14 housed in the uppermost portion of the solder push-out hole 11a of the jig body 13 is sucked into the suction hole 12a. At this time, of the solder balls 12 previously stored in the solder extrusion holes 13a,
The uppermost solder ball 12 may be pushed out to the upper surface of the jig body 13 by about the radius thereof, and the transfer jig 12 may be brought close to or in close contact with the solder ball 12 to attract the solder ball 14.
【００１９】さらに、回路基板上に転写治具１２を移動
させ金属パッド上に吸着穴１２ａが位置するように位置
決めし真空吸着力を低下させると、フラックスの粘着力
で金属パッド上に半田ボール１４が供給される。Further, when the transfer jig 12 is moved onto the circuit board so that the suction holes 12a are positioned on the metal pad to reduce the vacuum suction force, the solder ball 14 is placed on the metal pad by the adhesive force of the flux. Is supplied.
【００２０】フラックスは従来の方法と同様に転写治具
１２に半田ボール１４を吸着させた状態で、半田ボール
１４の下部を容器に満たしたフラックスに浸しフラック
スを半田ボール１４に付着させてフラックスを供給する
ようにしてもよいが、この方法では半田ボール１４が直
径 500〜 700μm 程度の微小球であるため、フラックス
が転写治具１２にも付着し、半田ボール１４がフラック
スの粘着力によって転写治具１２に付着して転写ミスが
発生するという問題点が発生し易くなる。転写治具１２
へのフラックス付着を防止するためには、例えば、図２
に示すようなスリット１６を用いて半田ボール１４にフ
ラックスを付着させるようにすればよい。スリット１６
は平板に吸着穴１３ａの位置に対応する孔１６ａを穿設
したもので、転写治具１２に半田ボール１４を吸着させ
た状態でこのスリット１６を半田ボール１４の下方に配
置して、孔１６ａを介して半田ボール１４にフラックス
１７をフラックス噴射装置１８から吹きつけることによ
って半田ボール１４の下部にのみ、フラックス１６を付
着させればよい。この時、半田ボール１４の下部にのみ
フラックスが付着するように孔１６ａの形状を決定す
る。In the same manner as in the conventional method, the flux is absorbed by the transfer jig 12 with the solder balls 14 soaked in the flux filling the lower portion of the solder balls 14 in the container to adhere the flux to the solder balls 14 to form the flux. Although it may be supplied, in this method, since the solder balls 14 are minute spheres having a diameter of about 500 to 700 μm, the flux adheres to the transfer jig 12, and the solder balls 14 are transferred and cured by the adhesive force of the flux. A problem that a transfer error occurs due to attachment to the tool 12 is likely to occur. Transfer jig 12
In order to prevent the adhesion of flux to the
The flux may be attached to the solder balls 14 by using the slits 16 as shown in FIG. Slit 16
Is a flat plate having holes 16a corresponding to the positions of the suction holes 13a. The slits 16 are arranged below the solder balls 14 while the solder balls 14 are being sucked by the transfer jig 12, and the holes 16a are formed. The flux 17 may be adhered only to the lower part of the solder ball 14 by spraying the flux 17 from the flux injecting device 18 onto the solder ball 14 via the. At this time, the shape of the hole 16a is determined so that the flux adheres only to the lower part of the solder ball 14.
【００２１】[0021]
【発明の効果】以上に説明したように、請求項１または
請求項２記載の半田ボール供給方法によれば、吸着穴に
確実に半田ボールを吸着させることができるので、半田
ボール吸着ミスを防止することができ歩留りの低下を防
止することができる。As described above, according to the solder ball supply method of the first or second aspect, the solder balls can be surely sucked into the suction holes, so that the solder ball suction error can be prevented. Therefore, it is possible to prevent a decrease in yield.
【００２２】また、請求項２記載の半田ボール供給方法
によれば、スリットに穿設された孔を介してフラックス
を半田ボールに付着させるので、転写治具へのフラック
ス付着を防止することができ、金属パッド上への転写ミ
スを防止することができる。Further, according to the solder ball supplying method of the second aspect, since the flux is attached to the solder ball through the hole formed in the slit, it is possible to prevent the flux from attaching to the transfer jig. , It is possible to prevent a transfer error on the metal pad.
【００２３】さらに、請求項３記載の半田ボール供給治
具によれば請求項１または請求項２記載の半田ボール供
給方法を実施する際、転写治具に穿設された吸着穴に確
実に半田ボールを吸着させることができるので、転写治
具への半田ボール吸着ミスを防止することができ、歩留
りの低下を防止することができる。Further, according to the solder ball supply jig of the third aspect, when the solder ball supply method of the first aspect or the second aspect is carried out, the solder is surely soldered in the suction hole formed in the transfer jig. Since the balls can be adsorbed, it is possible to prevent the solder balls from being improperly adsorbed to the transfer jig, and to prevent the yield from decreasing.
【図１】本発明に係る半田ボール供給方法の一実施例を
示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a solder ball supply method according to the present invention.
【図２】本発明に係る半田ボール供給方法の異なる実施
例を示す断面図である。FIG. 2 is a cross-sectional view showing a different embodiment of the solder ball supply method according to the present invention.
【図３】従来の半田ボール供給方法の一例を示す工程図
である。FIG. 3 is a process chart showing an example of a conventional solder ball supply method.
１０ 半田ボール電極 １１ 半田ボール供給治具 １２ 転写治具 １２ａ 吸着穴 １３ 治具本体 １３ａ 半田ボール押し出し孔 １３ｂ 下方開口 １３ｃ 上方開口 １４ 半田ボール １５ 押し出し部 １５ａ 押し出し棒部 １６ スリット １６ａ 孔 １７ フラックス 10 Solder Ball Electrode 11 Solder Ball Supply Jig 12 Transfer Jig 12a Suction Hole 13 Jig Body 13a Solder Ball Extrusion Hole 13b Lower Opening 13c Upper Opening 14 Solder Ball 15 Extruding Part 15a Extruding Rod Part 16 Slit 16a Hole 17 Flux
Claims (3)
せて回路基板の半田ボール電極形成位置に供給する半田
ボール供給方法において、前記吸着穴に対応する半田ボ
ール押し出し孔を備えた治具本体と、前記半田ボール押
し出し孔の下方開口から押し出し棒部を挿入し上方開口
から前記半田ボールを押し出す押し出し部とを備えた半
田ボール供給治具を用い、前記半田ボール押し出し孔に
前記半田ボールを収納し、前記上方開口から半田ボール
を一組ずつ押し出して前記吸着穴に前記半田ボールを吸
着させることを特徴とする半田ボール供給方法。1. A solder ball supply method for sucking a solder ball into a suction hole of a transfer jig and supplying the solder ball to a solder ball electrode forming position of a circuit board, the jig including a solder ball pushing hole corresponding to the suction hole. Using a solder ball supply jig including a main body and a push-out portion that inserts a push-out rod portion from the lower opening of the solder ball push-out hole and pushes out the solder ball from the upper opening, insert the solder ball into the solder ball push-out hole. A solder ball supplying method, characterized in that the solder balls are housed and pushed out one by one from the upper opening to suck the solder balls into the suction holes.
せて回路基板の半田ボール電極形成位置に供給する半田
ボール供給方法において、前記吸着穴に対応する半田ボ
ール押し出し孔を備えた治具本体と、前記半田ボール押
し出し孔の下方開口から押し出し棒部を挿入し上方開口
から前記半田ボールを押し出す押し出し部とを備えた半
田ボール供給治具を用い、前記半田ボール押し出し孔に
前記半田ボールを収納し、前記上方開口から半田ボール
を一組ずつ押し出して前記吸着穴に前記半田ボールを吸
着させた後、前記吸着穴に対応する孔を穿設したスリッ
トを介してフラックスを前期半田ボールに局所的に付着
させることを特徴とする半田ボール供給方法。2. A solder ball supply method for supplying a solder ball to a solder ball electrode forming position of a circuit board by sucking a solder ball into a suction hole of a transfer jig, and a jig having a solder ball pushing hole corresponding to the suction hole. Using a solder ball supply jig including a main body and a push-out portion that inserts a push-out rod portion from the lower opening of the solder ball push-out hole and pushes out the solder ball from the upper opening, insert the solder ball into the solder ball push-out hole. After storing and pushing out the solder balls one by one from the upper opening to suck the solder balls into the suction holes, the flux is locally applied to the solder balls through a slit having holes corresponding to the suction holes. A method of supplying solder balls, characterized in that the solder balls are adhered to each other.
ル形成方法に用いる治具であって、前記吸着穴に対応す
る半田ボール押し出し孔を備えた治具本体と、前記半田
ボール押し出し孔の下方開口から押し出し棒部を挿入し
上方開口から前記半田ボールを押し出す押し出し部とを
備えたことを特徴とする半田ボール供給治具。3. A jig used in the solder ball forming method according to claim 1 or 2, wherein the jig main body has a solder ball extrusion hole corresponding to the suction hole, and the solder ball extrusion hole. A solder ball supply jig, comprising: a push-out portion for inserting a push-out rod portion from a lower opening and pushing out the solder ball from an upper opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP725494A JPH07212023A (en) | 1994-01-26 | 1994-01-26 | Solder ball feeding method and solder ball feeding jig used for the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP725494A JPH07212023A (en) | 1994-01-26 | 1994-01-26 | Solder ball feeding method and solder ball feeding jig used for the method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07212023A true JPH07212023A (en) | 1995-08-11 |
Family
ID=11660901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP725494A Withdrawn JPH07212023A (en) | 1994-01-26 | 1994-01-26 | Solder ball feeding method and solder ball feeding jig used for the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07212023A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6412685B2 (en) * | 1997-01-28 | 2002-07-02 | Galahad, Co. | Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
| US6533160B1 (en) | 1998-10-27 | 2003-03-18 | Societe Novatec S.A. | Device for providing balls or preforms for making flip-chip connections |
| US6641030B1 (en) * | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
| CN103080568A (en) * | 2010-05-03 | 2013-05-01 | 阿雷蒙公司 | Pick and bond method and apparatus for transferring adhesive element to substrate |
| JP2016154193A (en) * | 2015-02-20 | 2016-08-25 | 株式会社日立製作所 | Board processing device, board processing system, and board processing method |
| CN110534451A (en) * | 2018-05-25 | 2019-12-03 | 唐虞企业股份有限公司 | A kind of conductive terminal sets part equipment and its conductive terminal sets part method |
-
1994
- 1994-01-26 JP JP725494A patent/JPH07212023A/en not_active Withdrawn
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6412685B2 (en) * | 1997-01-28 | 2002-07-02 | Galahad, Co. | Method and apparatus for release and optional inspection for conductive preforms placement apparatus |
| US6641030B1 (en) * | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
| US6533160B1 (en) | 1998-10-27 | 2003-03-18 | Societe Novatec S.A. | Device for providing balls or preforms for making flip-chip connections |
| CN103080568A (en) * | 2010-05-03 | 2013-05-01 | 阿雷蒙公司 | Pick and bond method and apparatus for transferring adhesive element to substrate |
| JP2013535092A (en) * | 2010-05-03 | 2013-09-09 | ア レイモン エ シー | Method and apparatus for picking and bonding to carry an adhesive element to a substrate |
| JP2013537488A (en) * | 2010-05-03 | 2013-10-03 | ア レイモン エ シー | Method and apparatus for placing adhesive elements on a matrix |
| JP2016026120A (en) * | 2010-05-03 | 2016-02-12 | ア レイモン エ シーＡ． Ｒａｙｍｏｎｄ Ｅｔ Ｃｉｅ | Process and apparatus for arranging adhesion element on matrix |
| EP2567105B1 (en) * | 2010-05-03 | 2016-11-30 | A. Raymond et Cie | Pick and bond method and apparatus for transferring adhesive element to substrate |
| JP2016154193A (en) * | 2015-02-20 | 2016-08-25 | 株式会社日立製作所 | Board processing device, board processing system, and board processing method |
| CN110534451A (en) * | 2018-05-25 | 2019-12-03 | 唐虞企业股份有限公司 | A kind of conductive terminal sets part equipment and its conductive terminal sets part method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010403 |