TW201628984A - Method for severing brittle substrate - Google Patents

Abstract

A trench line (TL) is formed by moving a cutting edge (51) over an upper surface (SF1) and causing plastic deformation. The process of forming the trench line (TL) is performed such that a state of cracklessness is obtained. The process of forming the trench line (TL) includes a process of forming a low load region (LR) and a high load region (HR). The load applied to the cutting edge (51) in the process of forming the high load region (HR) is higher than the load used in the process of forming the low load region (LR). A crack line is formed along a portion of the trench line (TL) by extending a crack only in the high load region (HR) of the trench line (TL). A glass substrate (11) is severed along the trench line (TL). The process of severing the glass substrate (11) includes a process of extending the crack along the low load region (LR) with the crack line being a starting point.

Description

Fragmentation method of brittle substrate

The present invention relates to a method of breaking a brittle substrate.

In the manufacture of an electric device such as a flat panel display panel or a solar cell panel, it is often necessary to separate a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and secondly, the substrate is separated along the scribe line. The scribing can be formed by machining the substrate using a tip. A vertical crack is formed directly under the groove while the groove is formed by plastic deformation on the substrate by sliding or rotating the blade edge on the substrate. Thereafter, stress imparting commensurate with the breaking step is performed. Thereby, the substrate is separated by completely progressing the vertical crack in the thickness direction.

The step of breaking the substrate is usually performed immediately after the step of forming the scribe line on the substrate. However, a step of processing the substrate between the step of forming the scribe line and the step of breaking is also proposed.

For example, according to the technique of the international publication No. 2002/104078, in the manufacturing method of the organic EL display, a scribe line is formed on the glass substrate for each region of each of the organic EL displays before the sealing cover is mounted. Therefore, it is possible to avoid contact between the sealing cover which is a problem when the scribing is formed on the glass substrate after the sealing cover is provided, and the glass cutter.

Further, for example, according to the technique of the international publication No. 2003/006391, in the method of manufacturing a liquid crystal display panel, two glass substrates can be bonded together after forming a scribe line. Thereby, the two brittle substrates can be simultaneously divided in one step.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2002/104078

[Patent Document 2] International Publication No. 2003/006391

According to the above prior art, the processing of the brittle substrate is performed after the scribe line is formed, and the breaking step is performed by the subsequent stress imparting. This point means that there is already a vertical crack along the scribe line when processing the brittle substrate. Therefore, the vertical crack may be further extended in the thickness direction due to accidental processing during processing, and the brittle substrate which should be integrated in the process is separated. Further, even in the case where the substrate processing step is not performed between the step of forming the scribe line and the step of dividing the substrate, it is usually necessary to carry out the substrate transfer or storage after the step of forming the scribe line and before the step of dividing the substrate. At this time, the substrate may be accidentally broken.

The inventors have developed a separate breaking technique to solve the above problems. According to this technique, as a line defining a position at which the brittle substrate is broken, first, a groove line having no crack is formed directly under the line. By forming the groove line, it is defined as a position to break the brittle substrate. Thereafter, as long as the state in which no crack exists immediately below the groove line is maintained, the break along the groove line is less likely to occur. By using this state, even if the position at which the brittle substrate is separated is predetermined, it is possible to prevent the brittle substrate from being accidentally broken before the point to be broken.

The formation of the above groove line is performed by machining using a tip. The tool tip is damaged during this machining and is no longer suitable for use. Therefore, the tip must be replaced at an appropriate time, which is burdened by the breaking step. According to the study by the present inventors, the formation of the groove line is less likely to cause damage to the tip of the blade than the formation of the usual scribe line. However, in order to further reduce the above-mentioned work load, it is desirable to develop a method of breaking the damage to the tip.

The present invention has been made to solve the above problems, and an object of the invention is to provide a method for breaking a brittle substrate which can reduce damage to a blade edge which is subjected to processing for specifying a position at which a brittle substrate is cut.

The breaking method of the brittle substrate has the following steps.

A brittle substrate having a first surface and a second surface opposite to the first surface and having a thickness direction perpendicular to the first surface is prepared. Then, the blade tip is pressed against the first surface of the brittle substrate, and the blade edge is moved on the first surface to cause plastic deformation on the first surface of the brittle substrate to form a groove line. The step of forming the groove line is performed in such a manner that the brittle substrate directly under the groove line is continuously connected in a direction intersecting the groove line, that is, in a crack-free state. The step of forming the groove line includes the steps of forming a low load section as part of the groove line and forming a high load section as a part of the groove line. The load applied to the tool tip in the step of forming the high load interval is higher than the load used in the step of forming the low load interval. Next, a crack line is formed along a portion of the groove line by causing the crack of the brittle substrate in the thickness direction to extend along the groove line only in the high load interval in the groove line. After the step of forming the crack line, the brittle substrate is broken along the groove line. The step of breaking the brittle substrate includes a step of stretching the crack along the crack line starting from the crack line by applying stress to the brittle substrate.

According to the present invention, when the groove line for defining the position at which the brittle substrate is cut is formed, the load applied to the blade edge can be reduced in the low load interval as compared with the high load interval. Thereby, damage to the tip can be reduced.

11‧‧‧Glass substrate (brittle substrate)

50‧‧‧Scribe tool

50R‧‧‧ marking tool

50v‧‧‧ marking tool

51‧‧‧Tool tip

51R‧‧‧marking wheel

51v‧‧‧ pointed

52‧‧‧Knife

52R‧‧‧ Keeper

53‧‧ ‧ sales

61‧‧‧breaking rolls

62‧‧‧Auxiliary roller

70‧‧‧ conveyor belt

80‧‧‧Workbench

81‧‧‧ cushion

85‧‧‧Parts

AL‧‧‧Auxiliary line

AX‧‧‧ axis direction

BL‧‧‧Disconnection

BM‧‧‧ broken line

CL‧‧‧crack line

CM‧‧‧crack line

CP‧‧‧ gap

DT‧‧‧ thickness direction

F‧‧‧load

Fi‧‧‧Inside ingredients

Fp‧‧‧ vertical component

HR‧‧‧High load range

LR‧‧‧low load range

MS‧‧‧ surface shape

Starting point for N1‧‧

N2‧‧‧ halfway point

N3‧‧‧ end point

PF‧‧‧ outer perimeter

PP‧‧‧ Protrusion

PPv‧‧‧ Protrusion

PS‧‧‧ side

PSv‧‧‧ side

Starting point of Q1‧‧

Q2‧‧‧ halfway point

Q3‧‧‧ End

RX‧‧‧Rotary axis

S1‧‧‧ endpoint

S2‧‧‧ halfway point

S3‧‧‧ endpoint

SC‧‧‧Conical surface

SD1‧‧‧ top surface

SD2‧‧‧ side

SD3‧‧‧ side

SF1‧‧‧ upper surface

SF2‧‧‧ lower surface

SF2C‧‧‧ opposite part

TL‧‧‧ slot line

TM‧‧‧ cross slot line

Fig. 1 is a flow chart schematically showing a method of dividing a brittle substrate according to a first embodiment of the present invention.

Fig. 2 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the first embodiment of the present invention.

Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2 .

4 is a schematic cross-sectional view (A) taken along line IVA-IVA of FIG. 2, and a schematic cross-sectional view (B) taken along line IVB-IVB of FIG. 2.

Fig. 5 is a plan view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Figure 6 is a schematic cross-sectional view taken along line VI-VI of Figure 5.

Figure 7 is a schematic cross-sectional view taken along line VII-VII of Figure 5.

Fig. 8 is a plan view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Figure 9 is a schematic cross-sectional view taken along line IX-IX of Figure 8.

Figure 10 is a schematic cross-sectional view taken along line X-X of Figure 8.

Fig. 11 is a plan view schematically showing one step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 12 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 13 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Figure 14 is a schematic side view of a field of view corresponding to arrow XIV of Figure 13 .

Fig. 15 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 16 is a cross-sectional view schematically showing a step of a method of dividing a brittle substrate according to the first embodiment of the present invention.

Fig. 17 is a side view (A) showing the configuration of the scribing tool used in the breaking method of the brittle substrate according to the first embodiment, and the cutting edge according to the field of view corresponding to the arrow XVII of Fig. 17(A). Bottom view (B).

FIG. 18 is a plan view schematically showing one step of a method of dividing a brittle substrate according to a first modification of the first embodiment of the present invention.

Fig. 19 is a plan view showing a step of a method of dividing a brittle substrate according to a second modification of the first embodiment of the present invention.

Fig. 20 is a plan view showing a step of a method of dividing a brittle substrate according to a third modification of the first embodiment of the present invention.

FIG. 21 is a side view (A) showing a configuration of a scribing tool used in the breaking method of the brittle substrate according to the fourth modification of the first embodiment of the present invention, and according to FIG. 21(A). The bottom view of the tip of the arrow XXI (B).

Fig. 22 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 23 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 24 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 25 is a plan view showing a step of a method of dividing a brittle substrate according to a first modification of the second embodiment of the present invention.

Fig. 26 is a plan view showing a step of a method of dividing a brittle substrate according to a first modification of the second embodiment of the present invention.

Fig. 27 is a plan view showing a step of a method of dividing a brittle substrate according to a second modification of the second embodiment of the present invention.

Fig. 28 is a plan view showing a step of a method of dividing a brittle substrate according to a third modification of the second embodiment of the present invention.

Fig. 29 is a side view schematically showing the configuration of a scribing tool used in the breaking method of the brittle substrate according to the second embodiment of the present invention.

Fig. 30 is a front view (A) showing the configuration of the scribing wheel and the pin of Fig. 29, and a partially enlarged view (B) of Fig. 30 (A).

Fig. 31 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the third embodiment of the present invention.

Figure 32 is a view schematically showing a method of dividing a brittle substrate according to a third embodiment of the present invention; A top view of a step.

Fig. 33 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 34 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 35 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 36 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 37 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fourth embodiment of the present invention.

Fig. 38 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 39 is a plan view schematically showing one step of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 40 is a plan view schematically showing one of the steps of the breaking method of the brittle substrate according to the fifth embodiment of the present invention.

Fig. 41 is a partial plan view (A) to (D) showing a step of the breaking method of the brittle substrate according to the sixth embodiment of the present invention.

Figure 42 is a schematic partial cross-sectional view (A) taken along the line XLIIA-XLIIA of Figure 41 (A), a schematic partial cross-sectional view (B) along the line XXLIB-XLIIB of Figure 41 (B), along the line XLIIC of Figure 41 (C) - A schematic partial cross-sectional view (C) of XLIIC, and a schematic partial cross-sectional view (D) of XLIID-XLIID along the line of Fig. 41(D).

Hereinafter, a method of dividing a brittle substrate according to each embodiment of the present invention will be described based on the drawings. In the following figures, the same reference sequence is marked in the same or equivalent parts. No. and the description is not repeated.

(Embodiment 1)

The method of dividing the glass substrate 11 (brittle substrate) of the present embodiment will be described below with reference to a flowchart (Fig. 1).

Referring to Fig. 2 to Fig. 4, a glass substrate 11 is prepared (Fig. 1: step S10). The glass substrate 11 has an upper surface SF1 (first surface) and a lower surface SF2 (second surface opposite to the first surface). Further, the glass substrate 11 has a thickness direction DT perpendicular to the upper surface SF1.

Also, a scribing tool having a blade tip is prepared. Details of the scribing tool will be described later.

Next, the blade edge is pressed against the upper surface SF1 of the glass substrate 11, and the blade edge 51 is moved from the starting point N1 to the end point N3 from the starting point N1 on the upper surface SF1. Thereby, plastic deformation can be caused on the upper surface SF1 of the glass substrate 11. Thereby, on the upper surface SF1, a groove line TL extending from the starting point N1 to the end point N3 via the intermediate point N2 is formed (FIG. 1: Step S20). In Fig. 2, three TLs are formed by the movement of the blade edge in the direction DA.

The step of forming the groove line TL includes a step of forming a low load section LR as a part of the groove line TL (FIG. 1: step S20L), and a step of forming a high load section HR as a part of the groove line TL (FIG. 1: Step S20H). In FIG. 2, a low load section is formed from the starting point N1 to the midway point N2, and a high load section is formed from the midway point N2 to the end point N3. The load applied to the cutting edge 51 in the step of forming the high load section HR is higher than the load used in the step of forming the low load section LR. Conversely, the load applied to the cutting edge 51 in the step of forming the low load section LR is lower than the load used in the step of forming the high load section HR, for example, about 30 to 50% of the load of the high load section HR. Therefore, the width of the groove line of the high load section HR is larger than the width of the low load section LR. For example, the high load interval HR has a width of 10 μm, and the low load interval LR has a width of 5 μm. Further, the depth of the high load section HR is greater than the depth of the low load section LR. The cross section of the groove line TL has a V shape of, for example, an angle of about 150°.

In addition, since a high load is applied to the cutting edge 51 in the high load section HR, The life of the tool tip 51 is preferably smaller in the high load interval HR. Further, in the case where the load is changed in the formation of the groove line TL, the load of the high load section HR is set to be sufficiently large for a smaller distance, and the scribing speed is set smaller for the high load section HR. Preferably. In other words, since it is difficult to perform the control for instantaneously increasing the load of the blade edge 51, the line is actually scribed by using the position N2 as a starting point and increasing the load to a predetermined load in the fixed section. Therefore, by reducing the speed in the high load section HR, a smaller load can be set as a high load, and the distance of the entire high load section HR can be reduced.

The step of forming the groove line TL is a state in which the glass substrate 11 directly under the groove line TL is continuously connected in a direction DC (Fig. 4 (A) and (B)) intersecting the groove line TL, that is, a crack-free state. get on. Therefore, the load applied to the blade tip is set to such an extent that the glass substrate 11 is plastically deformed to such an extent that cracks starting from the plastic deformation portion are not generated.

Next, a crack line can be formed as follows (FIG. 1: Step S30).

Referring to FIGS. 5 to 7, first, an auxiliary line AL crossing the high load section HR is formed on the upper surface SF1 of the glass substrate 11. The auxiliary line AL is a crack that penetrates in the thickness direction of the glass substrate 11. The auxiliary line AL can be formed by a usual scribing method.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual breaking step. With this separation as the beginning, the crack of the glass substrate 11 in the thickness direction is extended only along the groove line TL in the high load section HR in the groove line TL.

Referring to FIGS. 8 and 9, by the above, the crack line CL is formed along one portion of the groove line TL. Specifically, in the high load section HR, the crack line CL is formed in a portion between the newly generated side and the midway point N2. The direction in which the crack line CL is formed is opposite to the direction DA (Fig. 2) in which the groove line TL is formed. Further, the crack line CL is less likely to be formed in the portion between the side newly formed by the separation and the end point N3. This direction dependence is caused by the state of the blade edge when the high load section HR is formed, and details will be described later.

Referring to FIG. 10, the crack line CL is directly below the high load section HR of the groove line TL. The glass substrate 11 is continuously connected in a direction DC which intersects with the extending direction of the groove line TL. Here, the term "continuously connected" means that the cracks are not connected by cracks. Further, in a state in which the continuous cutting is performed as described above, the cracks of the crack line CL may be interposed to bring the portions of the glass substrate 11 into contact with each other.

Next, a breaking step of dividing the glass substrate 11 along the groove line TL is performed (FIG. 1: Step S40). At this time, by applying stress to the glass substrate 11, the crack is stretched along the low load section LR with the crack line CL as a starting point. The direction in which the crack extends (arrow PR of Fig. 11) is opposite to the direction DA (Fig. 2) formed by the groove line TL.

Next, the details of the above-described breaking steps are explained below.

Referring to Fig. 12, the glass substrate 11 (Fig. 9) on which the crack line CL is formed is placed on the table by interposing the spacer 81 on the upper surface SF1 of the glass substrate 11 so as to face the stage 81. 80. The spacer 81 includes a material that is more deformable than the material of the glass substrate 11 and the table 80.

Referring to Figures 13 and 14, the breaking rod 85 is prepared. The breaking bar 85 preferably has a shape that protrudes so as to partially press the surface of the glass substrate 11 as shown in FIG. 14, and has a substantially V-shape in FIG. As shown in Fig. 13, the protruding portion extends linearly.

Next, the breaking bar 85 is brought into contact with a portion of the lower surface SF2 of the glass substrate 11. The contact portion is away from the opposing portion SF2C opposed to the crack line CL in the thickness direction (the longitudinal direction of FIG. 13) of the lower surface SF2.

Next, as indicated by the arrow CT1, the contact portion is expanded along the low load section LR of the groove line TL, and approaches toward the opposite portion SF2C side. By the expansion of the contact portion at the first contact or the contact portion thereof, the portion of the breaking bar 85 contacting the opposite low load region LR on the lower surface SF2 is generated, and the self-aligned high load interval is generated. The part of HR is far from the state.

Referring to Fig. 15, as indicated by an arrow CT2, the above-mentioned contact portion reaches the opposite portion SF2C. In other words, the breaking bar 85 first has a low load on the crack line CL by the above-described steps. The section LR applies a stress, and thereafter, stress is simultaneously applied to the crack line CL. By this stress, the crack propagates from the crack line CL (Fig. 15) along the low load section LR (refer to the arrow PR of Fig. 16).

The breaking of the glass substrate is carried out by the above breaking step (Fig. 11).

Referring to Fig. 17 (A) and (B), a scribing tool 50 which is applied to the above-described groove line TL will be described. The scribing tool 50 is relatively moved with respect to the glass substrate 11 by being attached to a scribing head (not shown), thereby performing scribing on the glass substrate 11. The scribing tool 50 has a blade tip 51 and a shank 52. The blade tip 51 is held by the shank 52.

The blade tip 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of faces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and the SD3 face each other in different directions and are adjacent to each other. The blade edge 51 has a vertex where the top surface SD1, the side surfaces SD2, and SD3 meet, and the protrusion PP of the blade edge 51 is formed by the vertex. Further, the side faces SD2 and SD3 form a ridge line constituting the side portion PS of the blade edge 51. The side portion PS extends linearly from the protrusion PP. Further, since the side portion PS is ridged as described above, it has a convex shape extending linearly.

The tip 51 is preferably a diamond pen. That is, the tip 51 is preferably made of diamond. In this case, the hardness can be easily increased and the surface roughness can be reduced. More preferably, the tip 51 is made of single crystal diamond. In particular, in terms of crystallography, the top surface SD1 is a {001} plane, and the side surfaces SD2 and SD3 are each a {111} plane. In this case, although the side faces SD2 and SD3 have different directions, they are crystallographically equivalent to each other.

Further, a non-single crystal diamond may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemi-cal Vapor Deposition) method may also be used. Alternatively, a polycrystalline diamond sintered from particulate graphite or non-graphite carbon, a binder other than an iron group element, or a sintered diamond in which diamond particles are bonded by a binder such as an iron group element may be used.

The shank 52 extends in the axial direction AX. The tip 51 is preferably larger in the normal direction of the top surface SD1 The shank 52 is attached to the axial direction AX.

In the formation of the groove line TL using the scribing tool 50, the blade edge 51 is first pressed against the upper surface SF1 of the glass substrate 11. Specifically, the protrusion PP and the side portion PS of the blade edge 51 are pressed toward the thickness direction DT of the glass substrate 11 .

Next, the pressed blade tip 51 is slid in the direction DA on the upper surface SF1. The direction DA is projected on the upper surface SF1 from the direction in which the protrusion PP extends in the side portion PS, and substantially corresponds to the direction in which the axial direction AX is projected onto the upper surface SF1. When sliding, the blade tip 51 is dragged by the shank 52 on the upper surface SF1. By this sliding, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. The groove line TL is formed by the plastic deformation.

Further, in the formation of the groove line TL from the starting point N1 to the end point N3 in the present embodiment, when the blade edge 51 is moved in the direction DB, in other words, the posture of the blade edge 51 is oriented with respect to the moving direction of the blade edge 51. Tilting in the reverse direction makes it easier to form the crack line CL shown in Fig. 9 and the travel of the crack shown in Fig. 16 as compared with the case where the direction DA is employed. More generally, in the groove line TL formed by the blade edge 51 moving in the direction DA, the crack easily spreads in the opposite direction to the direction DA. On the other hand, in the groove line TL formed by the movement of the blade edge 51 in the direction DB, the crack easily spreads in the same direction as the direction DB. Such a direction dependency is presumably associated with a stress distribution generated in the glass substrate 11 due to plastic deformation generated when the groove line TL is formed.

According to the present embodiment, when the groove line TL (Figs. 2 and 3) for defining the position at which the glass substrate 11 is cut is formed, the tool tip can be reduced in the low load section LR as compared with the high load section HR. 51 (Fig. 17(A)) The applied load. Thereby, the damage to the blade tip 51 can be reduced.

Further, when the low load section LR in the low load section LR and the high load section HR is in a crack-free state (Figs. 8 and 9), the crack at the starting point for breaking the glass substrate 11 is not in the low load section LR. presence. Therefore, in the case where the glass substrate 11 is arbitrarily processed in this state, even if an unexpected stress is applied to the low load section LR, the glass substrate 11 is not easily broken. Therefore, the above processing can be performed stably.

Further, when both the low load section LR and the high load section HR are in a crack-free state ( FIGS. 2 and 3 ), the crack at the starting point for breaking the glass substrate 11 does not exist in the groove line TL. Therefore, in the case where the glass substrate 11 is subjected to arbitrary treatment in this state, even if an unexpected stress is applied to the groove line TL, the glass substrate 11 is not easily broken. Therefore, the above processing can be performed more stably.

Further, the groove line TL is formed before the auxiliary line AL is formed. Thereby, it is possible to avoid the influence of the auxiliary line AL when the groove line TL is formed. In particular, it is possible to avoid the formation of an abnormality which occurs immediately after the cutting edge 51 passes through the auxiliary line AL in order to form the groove line TL.

Next, a modification of the first embodiment will be described below.

Referring to Fig. 18, the auxiliary line AL may be intersected with the groove line TL as an open end to form a crack line CL. This phenomenon may occur when the stress applied to the glass substrate 11 at the time of formation of the auxiliary line AL is large.

Referring to Fig. 19, an auxiliary line AL may be formed first on the upper surface SF1 of the glass substrate 11, and a groove line TL (not shown in Fig. 19) may be formed thereafter.

Referring to Fig. 20, the auxiliary line AL may be formed on the lower surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar layout. Thereby, both the auxiliary line AL and the groove line TL can be formed without affecting each other.

Referring to Figs. 21(A) and (B), instead of the scribing tool 50 (Figs. 17(A) and (B)), the scribing tool 50v may be used. The blade tip 51v has a conical shape including a vertex and a conical surface SC. The protrusion PPv of the blade edge 51v is constituted by a vertex. The side portion PSv of the blade edge is formed along an imaginary line (dashed line in Fig. 21(B)) extending from the apex on the conical surface SC. Thereby, the side portion PSv has a convex shape that extends linearly.

(Embodiment 2)

Referring to Fig. 22, first, the glass substrate 11 is prepared. Also, a scribing tool having a blade tip is prepared. Details of the scribing tool will be described later.

Next, by the movement of the blade edge toward the direction DB on the upper surface SF1 of the glass substrate 11, On the upper surface SF1, an auxiliary line AL crossing the high load section HR (FIG. 23) to be described later is formed.

Referring to Fig. 23, the groove line TL is formed on the upper surface SF1 of the glass substrate 11 from the starting point Q1 via the intermediate point Q2 to the end point Q3 by the movement of the blade edge in the direction DB. The groove line TL from the starting point Q1 to the halfway point Q2 is formed as a high load section HR. The groove line TL from the intermediate point Q2 to the end point Q3 is formed as a low load section LR.

Next, the glass substrate 11 is separated along the auxiliary line AL. This separation can be carried out by a usual breaking step. With this separation as the beginning, the crack of the glass substrate 11 in the thickness direction is extended only along the groove line TL in the high load section HR in the groove line TL.

Referring to Fig. 24, a crack line CL is formed along a portion of the groove line TL by the above-described crack extension. Specifically, in the high load section HR, the crack line CL is formed by separating the portion between the newly generated side and the intermediate point Q2. The direction in which the crack line CL is formed is the same as the direction DB (FIG. 23) in which the groove line TL is formed. Further, the crack line CL is less likely to be formed in the portion between the newly generated side and the halfway point Q2. This direction dependence is caused by the state of the blade edge when the high load section HR is formed, and details will be described later.

Then, in the same breaking step (Figs. 12 to 16) as in the first embodiment, a breaking step is performed in which the crack is extended from the intermediate point Q2 toward the end point Q3 along the groove line TL with the crack line CL as a starting point. Thereby, the brittle substrate 11 is separated.

Referring to Fig. 25 and Fig. 26, as a first modification, the groove line TL may be formed first, and then the auxiliary line AL may be formed. Referring to Fig. 27, as a second modification, the formation of the auxiliary line AL may be used as the opening end to form the crack line CL. Referring to Fig. 28, the auxiliary line AL may be formed on the lower surface SF2 of the glass substrate 11 so as to intersect the high load section HR in the planar layout. Further, in the present embodiment, the high load section HR is formed from the starting point Q1, but the high load section HR may be formed in a portion intersecting the auxiliary line AL. For example, a low load section LR may be formed from the starting point Q1 to a portion intersecting the auxiliary line AL, and may continue to form a high load section HR so as to intersect the auxiliary line AL.

A scribing tool 50R to which the groove line TL of the present embodiment is formed will be described with reference to Fig. 29 . The scribing tool 50R has a scribing wheel 51R, a retainer 52R, and a pin 53. The scribing wheel 51R has a substantially disk shape and its diameter is typically about several mm. The scribing wheel 51R is a spacer pin 53 that is rotatably held by the holder 52R about the rotation axis RX.

The scribing wheel 51R has a peripheral portion PF to which the blade tip is provided. The outer peripheral portion PF extends annularly around the rotation axis RX. As shown in Fig. 30(A), the outer peripheral portion PF is cut into a ridge shape by a visual degree, thereby forming a blade edge including a ridge line and an inclined surface. On the other hand, at the microscope level, as shown in Fig. 30(B), the portion that effectively acts by intruding into the upper surface SF1 by the scribing wheel 51R (below the two-point chain line of Fig. 30(B)) The ridgeline of the outer peripheral portion PF has a minute surface shape MS. The surface shape MS is preferably in front view (Fig. 30(B)) and has a curved shape having a finite radius of curvature. The scribing wheel 51R is formed using a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. The scribing wheel 51R may also be entirely made of single crystal diamond from the viewpoint of reducing the surface roughness of the ridge line and the inclined surface described above.

The groove line TL of the scribing tool 50R is formed by rotating the scribing wheel 51R on the upper surface SF1 of the glass substrate 11 (FIG. 29: arrow RT), and traveling toward the upper surface SF1 by the scribing wheel 51R. The DB proceeds and proceeds. By the application of the rotation F, the outer peripheral portion PF of the scribing wheel 51R is pressed against the upper surface SF1 of the glass substrate 11 by applying a load F to the scribing wheel 51R. Thereby, the groove line TL having the groove shape is formed by plastically deforming the upper surface SF1 of the glass substrate 11. The load F has a vertical component Fp parallel to the thickness direction DT of the glass substrate 11, and an in-plane component Fi parallel to the upper surface SF1. The traveling direction DB is the same as the in-plane component Fi.

Alternatively, the groove line TL may be formed by using a scribing tool 50 (Figs. 17(A) and (B)) or 50v (Fig. 21 (A) and (B)) moving in the direction DB instead of moving in the direction DB. Line tool 50R.

In addition, the configuration other than the above is substantially the same as the configuration of the first embodiment. In the same way, the same or corresponding elements are marked with the same symbol, and the description thereof is not repeated.

According to this embodiment, substantially the same effects as those of the first embodiment can be obtained. Further, in the present embodiment, since the groove line TL can be formed using the rotating blade tip instead of the fixed blade edge, the life of the blade edge can be extended.

(Embodiment 3)

Referring to Fig. 31, first, a glass substrate 11 and a scribing tool having a blade edge are prepared. The groove line TL is formed between the points R1 and R6 on the upper surface SF1 of the glass substrate 11 by the movement of the blade edge. The groove line TL between the point R1 and the point R2, between the point R3 and the point R4, and between the point R5 and the point R6 is formed as a high load section HR. The groove line TL between the point R2 and the point R3 and between the point R4 and the point R5 is formed as a low load section LR. The method of forming the groove line TL can be any of the above-described first or second embodiment (including variations of the above).

Next, the glass substrate 11 is separated by a plurality of broken lines BL which cross each other in the high load interval HR. The formation of the breaking line BL may be performed by any of the usual steps of scribing or the step of generating a vertical crack from the groove line TL, and the separation of the breaking line BL may be performed by a usual breaking step.

Referring to Fig. 32, a crack line CL is formed in a portion between the side newly formed by separation and one of the pair of midway points through which the separation occurs, with the separation of the glass substrate 11 as described above. When the direction of the crack line CL is formed, when the groove line TL is formed in the direction DA (Fig. 17(A) or Fig. 21(A)), it is opposite to the direction DA, and is in the direction DB (Fig. 17(A), Fig. 21(A) or FIG. 29) is the same as the direction DB when the groove line TL is formed.

Next, by the same breaking step (Figs. 12 to 16) as in the first embodiment, a breaking step of stretching the crack along the groove line TL starting from the crack line CL is performed. Thereby, the brittle substrate 11 is separated.

According to the present embodiment, the position at which the glass substrate 11 is separated can be defined by the plurality of groove lines TL and the plurality of broken lines BL intersecting therewith.

(Embodiment 4)

Referring to Fig. 33, the blade edge 51 is moved in the direction DA (see Fig. 17(A)), and a groove line is formed in the direction DL between the end points S1 and S3 on the upper surface SF1 of the glass substrate 11. The groove line TL between the end point S1 and the intermediate point S2 is formed as a low load section LR. The groove line TL between the halfway point S2 and the end point S3 is formed as a high load section HR.

Referring to Fig. 34, the blade edge 51 is moved in the direction DA (Fig. 17(A)) on the upper surface SF1 of the glass substrate 11 while pressing the blade edge 51 onto the upper surface SF1 of the glass substrate 11. On the upper surface SF1, the intersecting groove line TM intersecting the low load section LR of the groove line TL is formed on the upper surface SF1 in the upper surface SF1. The step of forming the intersecting groove line TM is performed in the same manner as the groove line TL in such a manner that a crack-free state can be obtained. That is, the step of forming the intersecting groove line TM is performed in such a manner that the glass substrate 11 directly under the intersecting groove line TM is continuously connected in a direction intersecting the intersecting groove line TM, that is, in a crack-free state.

Next, the glass substrate 11 is separated along the breaking line BM crossing the intersecting groove line TM. This separation can be carried out by a usual scribing step and a breaking step. The breaking line BM intersects the intersecting groove line TM at a point where the intersection of the intersecting groove line TM and the groove line TL is shifted in the direction DM. At the beginning of the separation, along the intersecting groove line TM, a crack line CM (Fig. 35) which is accompanied by a crack in which the glass substrate 11 penetrates in the thickness direction is formed.

Next, the glass substrate 11 is separated along the break line BL which intersects the high load section HR of the groove line TL. This separation can be carried out by a usual scribing step and a breaking step. Starting from this separation, a crack line CL (Fig. 36) accompanying cracks in the thickness direction of the glass substrate 11 is formed along the high load section HR.

Next, by the same breaking step (Figs. 12 to 16) as in the first embodiment, a breaking step of stretching the crack along the groove line TL starting from the crack line CL is performed. Thereby, the brittle substrate 11 is separated along the groove line TL (Fig. 37). Thereafter, the breaking step is performed along the crack line CM to further divide the brittle substrate 11.

According to this embodiment, the slot line TL and the cross slot line TM crossing the same can be used. The position at which the glass substrate 11 is separated is determined.

Alternatively, instead of the blade edge 51 (Fig. 17(A)), the blade edge 51v may be used (Fig. 21(A)). Further, the groove line TL may be formed in the opposite direction to the direction DL (Fig. 33). In this case, the blade edge 51 (Fig. 17(A)) is moved in the direction DB. Similarly, the formation of the intersecting groove line TM may be performed in the opposite direction to the direction DM (Fig. 34). In this case, the blade edge 51 (Fig. 17(A)) is moved in the direction DB. In the case where the blade edge is moved in the direction DB, the blade edge 51 can be used instead of the blade edge 51, and the blade edge of the scribing wheel 51R (Fig. 29) can be used.

(Embodiment 5)

Referring to Fig. 38, the blade edge of the scribing wheel 51R (Fig. 29) is pressed against the upper surface SF1 of the glass substrate 11 by applying a load, and the blade edge is moved in the direction DB (Fig. 29) on the upper surface SF1. Thereby, plastic deformation occurs on the upper surface SF1 of the glass substrate 11. As a result, the intersecting groove line TM is formed on the upper surface SF1 in the direction DM (Fig. 38). When the formation of the intersecting groove line TM is started, the operation of the blade edge of the scribing wheel 51R (Fig. 29) over the edge of the glass substrate 11 is performed. At this time, a minute notch CP is generated at the edge of the glass substrate 11. As a result, a notch CP located on the edge of the glass substrate 11 is provided at one side end of the intersecting groove line TM.

Referring to Fig. 39, second, a groove line TL is formed on the upper surface SF1 between the points T1 and T6 by moving the blade edge on the upper surface SF1. The groove line TL between the point T1 and the point T2, between the point T3 and the point T4, and between the point T5 and the point T6 is formed as a high load section HR. The groove line TL between the point T2 and the point T3 and between the point T4 and the point T5 is formed into the low load section LR. The intersecting groove line TM intersects the high load section HR on the upper surface SF1. Further, the method of forming the groove line TL may be any of the above-described first or second embodiments (including variations thereof).

Next, the crack is stretched along the intersecting groove line TM starting from the notch CP. Thereby, the glass substrate 11 is separated along the intersecting groove line TM (Fig. 40). At the beginning of the separation, a crack line CL is formed in the high load section HR in a portion between the side newly formed by the separation and one of the pair of intermediate points passing through the side.

Next, by the same breaking step (Fig. 12 to Fig. 16) as in the first embodiment, The crack line CL is a breaking step in which the crack is extended along the groove line TL. Thereby, the brittle substrate 11 is separated.

According to this embodiment, substantially the same effects as those of the fourth embodiment can be obtained. Further, according to the present embodiment, the notch CP is used as a starting point for causing cracks in the intersecting groove line TM. Therefore, the breaking step along the breaking line BM (Fig. 34) crossing the intersecting groove line TM can be omitted. Further, the blade tip that is straddles the edge of the glass substrate 11 is the scribing wheel 51R (Fig. 29), and the blade tip 51 (Fig. 17(A)) or 51v (Fig. 21 (A) is used instead of the fixed blade edge. In the case of )), it is possible to suppress the damage applied to the blade tip by the straddle. Further, in the case where the damage hardly becomes a problem, the blade edge 51 or the blade edge 51v may be used instead of the blade edge of the scribing wheel 51R (Fig. 29).

(Embodiment 6)

Referring to Fig. 41 (A) and Fig. 42 (A), first, a breaking device of the glass substrate 11 of the present embodiment will be described. The breaking device has a scribing tool 50 (see also FIG. 17(A)), a conveyor belt 70, a breaking roller 61, and an auxiliary roller 62. The conveyor belt 70 conveys the glass substrate 11 in the direction CV while exposing the upper surface SF1 of the glass substrate 11. The scribing tool 50 is fixed to a scribing head (not shown), and is lined with the glass substrate 11 moved by the conveyor belt 70 to scribe the upper surface SF1 of the glass substrate 11. The breaking roller 61 is a member that partially presses the lower surface SF2 of the glass substrate 11 in order to perform the breaking step. The auxiliary roller 62 is in contact with the roller of the glass substrate 11 on the opposite surface, that is, the upper surface SF1, so as to be pressed against the lower surface SF2 by the breaking roller 61. The auxiliary roller 62 is disposed at a position different from the breaking roller 61 in a planar layout (in FIG. 41(A)) so that the glass substrate 11 can be stably bent by the pressing of the breaking roller 61, and It is preferable to arrange in such a manner that the breaking roller is held in the direction of the rotation axis (the longitudinal direction of Fig. 41 (A)).

Further, in Fig. 41 (A) and Fig. 42 (A), the conveyor belt 70 is schematically shown by a two-dot chain line for the sake of convenience of viewing. The same is true for other figures.

Next, the breaking method using the above-described breaking device will be described below.

The glass substrate 11 is transported to the transport side as the transport belt 70 moves in the transport direction CV. Transfer to CV. Thereby, the blade edge 51 of the scribing tool 50 (see also FIG. 17) straddles the upper surface SF1 from the right edge of the glass substrate 11. By this straddle, a notch CP is formed on the right edge of the glass substrate 11.

The blade edge 51 on the upper surface SF1 moves in the direction opposite to the transport direction CV with respect to the upper surface SF1 of the glass substrate 11 by the movement of the glass substrate 11 in the transport direction CV. The relative movement direction of the blade edge 51 with respect to the upper surface SF1 is set to correspond to the direction DB (FIG. 17(A)). In this movement, a high load section HR of the groove line TL is formed on the upper surface SF1 by applying a load to the blade edge 51.

41(B) and 42(B), after the glass substrate 11 is further conveyed, the load applied to the blade edge 51 is set to be smaller than the high load section HR, and the low load section LR of the groove line TL is started. Formation.

Referring to FIGS. 41(C) and 42(C), the glass substrate 11 is further conveyed, and the breaking roller 61 and the auxiliary roller 62 are used to apply stress to the high load section HR in which the notch CP is provided. Thereby, the crack propagates from the notch CP, and as a result, the crack line CL is formed in the high load section HR. In FIG. 42(C), the crack line CL penetrates the glass substrate 11 in the thickness direction and reaches the lower surface SF2.

Referring to FIGS. 41(D) and 42(D), by further transporting the glass substrate 11, stress application to the low load section LR by the breaking roller 61 and the auxiliary roller 62 is started. The crack extends from the crack line CL described above to a portion of the low load section LR that is subjected to stress application. Thereafter, as the glass substrate 11 is conveyed, the crack propagates in the low load section LR. When the crack is stretched, the low load section LR is extended by forming the low load section LR by the scribing tool 50. Thereby, the glass substrate 11 is separated in accordance with the length of the extension while extending the low load section LR of the groove line TL. That is, the continuous division of the glass substrate 11 is performed.

According to this embodiment, the glass substrate 11 can be continuously separated. Thereby, the glass substrate 11 can be cut without being restricted by the length of the glass substrate 11.

Moreover, in the low load section LR different from the high load section HR, the crack is not easily stretched. It has not been subjected to the stress applied by the breaking roller 61. Therefore, in the continuous breaking step shown in Fig. 42 (D), it is possible to prevent the crack from reaching the blade edge 51 or further extending beyond the blade edge 51. Thereby, the continuous division of the glass substrate 11 can be performed stably.

Further, in the present embodiment, the notch CP at the edge of the glass substrate 11 is used to generate the crack line CL, but the other end may be used to form the crack line CL. Further, instead of the scribing tool 50, a scribing tool 50v (Fig. 21) or 50R (Fig. 29) may be used.

The breaking method of the brittle substrate of each of the above embodiments is particularly preferably applied to a glass substrate, but the brittle substrate may be made of a material other than glass. For example, as a material other than glass, ceramics, ruthenium, compound semiconductors, sapphire, or quartz can also be used.

11‧‧‧Glass substrate (brittle substrate)

HR‧‧‧High load range

LR‧‧‧low load range

Starting point for N1‧‧

N2‧‧‧ halfway point

N3‧‧‧ end point

SF1‧‧‧ upper surface

TL‧‧‧ slot line

Claims (7)

A method for breaking a brittle substrate, comprising: preparing a step of having a first surface and a second surface opposite to the first surface and having a fragile substrate perpendicular to a thickness direction of the first surface; and a step of forming a groove line by causing the blade edge to move toward the first surface of the brittle substrate while moving the blade edge on the first surface to form a groove on the first surface of the brittle substrate; The step of forming the groove line is performed in a state in which the brittle substrate is continuously connected in a direction intersecting the groove line, that is, in a crack-free state, directly under the groove line, and the step of forming the groove line includes: Forming a low load section as a portion of the slot line; and forming a high load section as a portion of the slot line; and applying a load to the tip in the step of forming the high load section is higher than forming the low load a load used in the step of the interval; and the breaking method of the brittle substrate further includes: causing the crack of the brittle substrate in the thickness direction to be along the groove line only a step of extending the high load section in the groove line to form a crack line along a portion of the groove line; and a step of dividing the fragile substrate along the groove line after the step of forming the crack line; and dividing the above The step of brittle the substrate includes a step of stretching the crack along the low load section starting from the crack line by applying stress to the brittle substrate. The method for breaking a brittle substrate according to claim 1, wherein the step of forming the crack line comprises: forming the crack on the first surface of the brittle substrate along with the crack in the thickness direction of the brittle substrate; The step of crossing the auxiliary line of the high load interval. The method for breaking a brittle substrate according to claim 2, wherein the step of forming the crack line comprises the step of separating the fragile substrate along the auxiliary line. The method for breaking a brittle substrate according to claim 1, further comprising: a step of forming an auxiliary line on the second surface of the brittle substrate; and the auxiliary line intersecting the high load section in a planar layout; The step of cracking the line includes the step of separating the fragile substrate along the auxiliary line. The breaking method of the brittle substrate according to any one of claims 1 to 4, further comprising: after the step of forming the groove line, pressing the blade edge on the first surface of the brittle substrate The first surface of the brittle substrate is formed by moving the blade edge and plastically deforming the first surface of the brittle substrate, thereby forming an intersection with the low load region of the groove line on the first surface. a step of forming the intersecting groove line; and the step of forming the intersecting groove line is performed in a state in which the brittle substrate is continuously connected in a direction intersecting the intersecting groove line, that is, in a non-crack state, directly under the intersecting groove line; The breaking method of the brittle substrate further includes a step of forming a crack line accompanying the crack in the thickness direction of the brittle substrate along the intersecting groove line. The breaking method of the brittle substrate according to claim 1, further comprising: before the step of forming the groove line, pressing the blade edge on the first surface of the brittle substrate by applying a load to the first surface Forming a step of moving the blade tip on the first surface of the brittle substrate to form a cross-groove line intersecting the high-load section of the groove line on the first surface; and forming The step of intersecting the groove line is obtained by the above intersecting groove line Directly below the brittle substrate is continuously connected to the intersecting groove line in a state of no crack, and the step of forming the crack line is to separate the fragile substrate by stretching the crack along the intersecting groove line. And proceed. The breaking method of the brittle substrate according to claim 1, wherein the step of stretching the crack is performed to extend the low load section by the step of forming the low load section.