TW201623681A - 氣體噴淋頭及沉積裝置 - Google Patents

氣體噴淋頭及沉積裝置 Download PDF

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Publication number
TW201623681A
TW201623681A TW104128014A TW104128014A TW201623681A TW 201623681 A TW201623681 A TW 201623681A TW 104128014 A TW104128014 A TW 104128014A TW 104128014 A TW104128014 A TW 104128014A TW 201623681 A TW201623681 A TW 201623681A
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TW
Taiwan
Prior art keywords
gas
cooling
cooling plate
shower head
venting
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TW104128014A
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English (en)
Chinese (zh)
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TWI563115B (https=
Inventor
Haruhisa Takiguchi
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Advanced Micro Fab Equip Inc
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Priority claimed from CN201410838723.9A external-priority patent/CN105779970B/zh
Application filed by Advanced Micro Fab Equip Inc filed Critical Advanced Micro Fab Equip Inc
Publication of TW201623681A publication Critical patent/TW201623681A/zh
Application granted granted Critical
Publication of TWI563115B publication Critical patent/TWI563115B/zh

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  • Chemical Vapour Deposition (AREA)
TW104128014A 2014-12-26 2015-08-26 氣體噴淋頭及沉積裝置 TW201623681A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410838723.9A CN105779970B (zh) 2014-12-26 气体喷淋头和沉积装置

Publications (2)

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TW201623681A true TW201623681A (zh) 2016-07-01
TWI563115B TWI563115B (https=) 2016-12-21

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TW104128014A TW201623681A (zh) 2014-12-26 2015-08-26 氣體噴淋頭及沉積裝置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI891135B (zh) * 2022-12-21 2025-07-21 大陸商中微半導體設備(上海)股份有限公司 噴淋頭加熱裝置、氣相沉積設備及噴淋頭控溫方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309334B1 (ko) * 2004-08-02 2013-09-16 비코 인스트루먼츠 인코포레이티드 화학적 기상 증착 반응기용 멀티 가스 분배 인젝터
CN102345112B (zh) * 2011-09-22 2013-08-21 中微半导体设备(上海)有限公司 一种半导体处理设备及其气体喷淋头冷却板
CN103334092B (zh) * 2013-06-13 2015-04-22 中国电子科技集团公司第四十八研究所 一种用于金属有机化学气相沉积反应器的管道冷却式气体分布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI891135B (zh) * 2022-12-21 2025-07-21 大陸商中微半導體設備(上海)股份有限公司 噴淋頭加熱裝置、氣相沉積設備及噴淋頭控溫方法

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Publication number Publication date
CN105779970A (zh) 2016-07-20
TWI563115B (https=) 2016-12-21

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