CN105779970B - 气体喷淋头和沉积装置 - Google Patents
气体喷淋头和沉积装置 Download PDFInfo
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- CN105779970B CN105779970B CN201410838723.9A CN201410838723A CN105779970B CN 105779970 B CN105779970 B CN 105779970B CN 201410838723 A CN201410838723 A CN 201410838723A CN 105779970 B CN105779970 B CN 105779970B
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- 210000002381 Plasma Anatomy 0.000 description 1
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- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 1
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- JMASRVWKEDWRBT-UHFFFAOYSA-N gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- KLGZELKXQMTEMM-UHFFFAOYSA-N hydride Chemical compound [H-] KLGZELKXQMTEMM-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (19)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410838723.9A CN105779970B (zh) | 2014-12-26 | 气体喷淋头和沉积装置 | |
TW104128014A TW201623681A (zh) | 2014-12-26 | 2015-08-26 | 氣體噴淋頭及沉積裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410838723.9A CN105779970B (zh) | 2014-12-26 | 气体喷淋头和沉积装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105779970A CN105779970A (zh) | 2016-07-20 |
CN105779970B true CN105779970B (zh) | 2018-02-09 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101322226A (zh) * | 2006-03-31 | 2008-12-10 | 东京毅力科创株式会社 | 基板处理装置以及处理气体喷出机构 |
CN101501244A (zh) * | 2006-08-04 | 2009-08-05 | 东京毅力科创株式会社 | 气体供给装置以及基板处理装置 |
CN102345112A (zh) * | 2011-09-22 | 2012-02-08 | 中微半导体设备(上海)有限公司 | 一种半导体处理设备及其气体喷淋头冷却板 |
CN102418086A (zh) * | 2011-11-16 | 2012-04-18 | 上海卓锐材料科技有限公司 | 一种实现气体隔离和均匀化的喷淋头装置 |
JP3175346U (ja) * | 2011-01-06 | 2012-05-10 | ラム リサーチ コーポレーション | カムロック式シャワーヘッド電極及び組立体 |
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101322226A (zh) * | 2006-03-31 | 2008-12-10 | 东京毅力科创株式会社 | 基板处理装置以及处理气体喷出机构 |
CN101501244A (zh) * | 2006-08-04 | 2009-08-05 | 东京毅力科创株式会社 | 气体供给装置以及基板处理装置 |
JP3175346U (ja) * | 2011-01-06 | 2012-05-10 | ラム リサーチ コーポレーション | カムロック式シャワーヘッド電極及び組立体 |
CN102345112A (zh) * | 2011-09-22 | 2012-02-08 | 中微半导体设备(上海)有限公司 | 一种半导体处理设备及其气体喷淋头冷却板 |
CN102418086A (zh) * | 2011-11-16 | 2012-04-18 | 上海卓锐材料科技有限公司 | 一种实现气体隔离和均匀化的喷淋头装置 |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160720 Assignee: Nanchang Medium and Micro Semiconductor Equipment Co., Ltd. Assignor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Contract record no.: 2018990000345 Denomination of invention: Gas spraying head and deposition device Granted publication date: 20180209 License type: Exclusive License Record date: 20181217 |
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CP01 | Change in the name or title of a patent holder |
Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |