TW201622963A - Manufacturing method and manufacturing apparatus - Google Patents

Manufacturing method and manufacturing apparatus Download PDF

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Publication number
TW201622963A
TW201622963A TW104138541A TW104138541A TW201622963A TW 201622963 A TW201622963 A TW 201622963A TW 104138541 A TW104138541 A TW 104138541A TW 104138541 A TW104138541 A TW 104138541A TW 201622963 A TW201622963 A TW 201622963A
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Taiwan
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deposition
bonding
unit
layer
construction
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TW104138541A
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Chinese (zh)
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漢斯 欣布拉德
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數位金屬公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10Formation of a green body
    • B22F10/14Formation of a green body by jetting of binder onto a bed of metal powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/50Means for feeding of material, e.g. heads
    • B22F12/55Two or more means for feeding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/042Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/165Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00Auxiliary operations or equipment, e.g. for material handling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22Driving means
    • B22F12/224Driving means for motion along a direction within the plane of a layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/60Planarisation devices; Compression devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28BSHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00Producing shaped prefabricated articles from the material
    • B28B1/001Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

An additive manufacturing apparatus is provided. The apparatus comprises a build region. The apparatus comprises a construction material deposition unit arranged for relative reciprocating movement in at least a first direction across the build region for depositing a construction material incrementally in layers on the build region from a construction material deposition position on the construction material deposition unit. The apparatus comprises a first binding unit arranged for relative reciprocating movement in at least the first direction across the build region for binding construction material selectively at positions on the layers of construction material deposited on the build region from a first binding position on the first binding unit. The apparatus comprises a second binding unit arranged for relative reciprocating movement in at least the first direction across the build region for binding construction material selectively at positions on the layers of construction material deposited on the build region from a second binding position on the second binding unit. The first binding position, the construction material deposition position and the second binding position are arranged in order in the first direction. Also disclosed is a configuration having two deposition positions arranged either side of a binding position, as well as manufacturing methods implementable using the apparatus.

Description

製造方法以及製造裝置 Manufacturing method and manufacturing device

本發明係關於製造一物體之方法,以及特別關於製造一物體之方法,其中該物體係由一系列的構築材料之層所構築,於沉積該層的期間或沉積該層之後,且於沉積一相繼之層之前,每一層之區域係選擇性地被結合在一起。本發明亦關於適合用於實現該等方法之製造裝置。 The present invention relates to a method of manufacturing an object, and in particular to a method of manufacturing an object, wherein the object system is constructed from a series of layers of building material, during or after deposition of the layer, and depositing a layer Prior to successive layers, the regions of each layer are selectively bonded together. The invention also relates to a manufacturing apparatus suitable for use in implementing such methods.

三維列印係為一種加法製造技術,其中連續的材料層係被沉積至一建構區域,每一層的部分被彼此結合,藉由該等連續的層被結合的部分,構築一所欲形成之物體。 Three-dimensional printing is an additive manufacturing technique in which a continuous layer of material is deposited into a construction area, and portions of each layer are bonded to each other, and an object to be formed is constructed by the combined portions of the continuous layers. .

一三維列印技術應用一程序,其係自於一建構區域之上通過及橫越該建構區域的一列印頭,將連續的顆粒材料(例如:一粉末)之層沉積於該建構區域。於沉積該層的期間或於沉積該層之後,該構築材料之部分係選擇性的結合在一起。舉例來說,使用與噴墨列印類似的技術,一液態結合劑可自該列印頭噴射至該粉末之上。此一結合劑可為隨著時間固化或硬化的一接著劑,藉此將該顆粒材料的顆粒結合在一起,例如:在使用一空氣乾燥接著劑的情況下,藉由與空氣接觸而固化或硬化;亦可事後固化,例如:在使用一紫外光固化接著劑的情況下,使用紫外光固化。或者,放射線可被選擇性的施加至每一層的 部分,以局部的將該層的區域結合在一起,例如:施加一合適的高強度雷射光束或經聚焦的紅外光。 A three-dimensional printing technique employs a process for depositing a layer of continuous particulate material (e.g., a powder) in a structured region from a row of printheads passing over and over the construction region. Portions of the build material are selectively bonded together during deposition of the layer or after deposition of the layer. For example, using a technique similar to ink jet printing, a liquid binder can be sprayed onto the powder from the printhead. The bonding agent may be an adhesive that cures or hardens over time, thereby bonding the particles of the particulate material together, for example, by using an air drying adhesive, by curing with contact with air or Hardening; it can also be cured afterwards, for example, in the case of using an ultraviolet curing adhesive, using UV curing. Alternatively, radiation can be selectively applied to each layer In part, the regions of the layer are partially joined together, for example by applying a suitable high intensity laser beam or focused infrared light.

該被沉積的粉末的層係以充分的薄度製造,藉此當沉積相繼之粉末層,具有選擇性地結合在一起的區域時,每一層的該結合部分自與下面一層的邊界延伸通過該層,以形成一延伸通過該等層的連續的三維結構。 The layer of deposited powder is manufactured with sufficient thinness whereby when the successive powder layers are deposited with selectively bonded regions, the bonded portion of each layer extends from the boundary with the underlying layer The layers are formed to form a continuous three-dimensional structure extending through the layers.

為了使三維列印相較於其他製造程序具有競爭力,三維列印必須能夠快速地製造所欲形成的物體。 In order to make 3D printing competitive with other manufacturing processes, 3D printing must be able to quickly create the object to be formed.

根據本發明之第一態樣,其係提供一種加法製造裝置。該裝置包含一建構區域。該裝置包含一構築材料沉積單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該構築材料沉積單元上的構築材料沉積部位,逐層地沉積一構築材料。該裝置包含一第一結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以自該第一結合單元上的第一結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料。該裝置包含一第二結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以自該第二結合單元上的第二結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料。該第一結合部位、該構築材料沉積部位及該第二結合部位係依序地沿該第一方向配置。 According to a first aspect of the invention, there is provided an additive manufacturing apparatus. The device includes a construction area. The apparatus includes a build material deposition unit configured to relatively reciprocate across the build region in at least a first direction over the build region from a build material on the build material deposition unit At the deposition site, a building material is deposited layer by layer. The apparatus includes a first coupling unit configured to reciprocate relative to the construction region at least in a first direction to selectively engage the first bonding site on the first bonding unit The portion deposited on the layer of the building material on the construction region is combined with the construction material. The apparatus includes a second coupling unit configured to relatively reciprocate across the construction region in at least a first direction to selectively engage the second attachment site on the second coupling unit The portion deposited on the layer of the building material on the construction region is combined with the construction material. The first bonding portion, the deposition material deposition portion, and the second bonding portion are sequentially disposed along the first direction.

根據本發明之第二態樣,其係提供一種加法製造裝置。該裝置包含一建構區域。該裝置包含一第一構築材料沉積單元,其係被設置用於至少 在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該第一構築材料沉積單元上的構築材料沉積部位,逐層地沉積一第一構築材料。該裝置包含一結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,自該結合單元上的結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料。該裝置包含一第二構築材料沉積單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該第二構築材料沉積單元上的第二構築材料沉積部位,逐層地沉積一第二構築材料。該第一構築材料沉積部位、該結合部位、及該第二構築材料沉積部位係依序地沿該第一方向配置。 According to a second aspect of the invention, there is provided an additive manufacturing apparatus. The device includes a construction area. The device includes a first build material deposition unit that is configured to at least In a first direction, the construction area is relatively reciprocated across the construction area, and a first construction material is deposited layer by layer from the deposition material deposition site on the first construction material deposition unit. The apparatus includes a coupling unit configured to relatively reciprocate across the construction region in at least a first direction, the attachment portion from the bonding unit being selectively deposited on the construction region The part on the layer of the construction material is combined with the construction material. The apparatus includes a second build material deposition unit configured to relatively reciprocate across the build region in at least a first direction to over the build region from the second build material deposition unit A second structuring material deposition site deposits a second structuring material layer by layer. The first structuring material deposition site, the bonding site, and the second structuring material deposition site are sequentially disposed along the first direction.

在一實施方式中,該沉積及結合單元係設置於一共同載體之上,該共同載體係被設置用於在該第一方向進行往復運動。 In one embodiment, the deposition and bonding unit is disposed on a common carrier that is configured to reciprocate in the first direction.

在一實施方式中,該沉積及結合單元係設置於各自獨立的載體之上,每一載體係被設置用於在該第一方向進行往復運動。 In one embodiment, the deposition and bonding units are disposed on separate carriers, each carrier being configured to reciprocate in the first direction.

在一實施方式中,一平滑元件係依序地被設置於該等沉積及結合部位的每一沉積及結合部位之間,以及該等沉積及結合部位與下一個該等沉積或結合部位之間。 In one embodiment, a smoothing element is disposed between each of the deposition and bonding sites of the deposition and bonding sites, and between the deposition and bonding sites and the next one of the deposition or bonding sites. .

在一實施方式中,每一結合單元係一結合劑沉積單元,其係被設置用於選擇性地於先前沉積的構築材料上的部位,沉積結合劑材料,藉此選擇性地結合該構築材料。 In one embodiment, each bonding unit is a binder deposition unit that is configured to selectively deposit a binder material at a location on a previously deposited build material, thereby selectively incorporating the build material .

在一實施方式中,該等構築材料沉積單元係被設置用於自一共同儲存器獲得構築材料。 In one embodiment, the build material deposition units are configured to obtain a build material from a common reservoir.

根據本發明之第三態樣,其係提供一種加法製造方法。該方法 包含一程序,其係自一構築材料沉積單元上的構築材料沉積部位,於一建構區域上的第一層之中,沉積構築材料,其中該構築材料沉積單元係至少在一第一方向,橫越該建構區域相對地運動。該方法包含一程序,其係自一第一結合單元上的一第一結合部位,結合該構築材料的第一層上的選擇部位,其中該第一結合單元係至少在該第一方向,橫越該建構區域相對地運動。該第一結合部位係被設置於該構築材料沉積部位的一第一側。該第一側係為位於與該第一方向相反之方向的一側。該方法包含一程序,其係自一構築材料沉積單元上的構築材料沉積部位,於該第一層上的第二層之中,沉積構築材料,其中該構築材料沉積單元係在與該第一方向相反之方向,橫越該建構區域相對地運動。該方法包含一程序,其係自一第二結合單元上的一第二結合部位,結合該構築材料的第二層上的選擇部位,其中該第二結合單元係在該第一方向,橫越該建構區域相對地運動。該第二結合部位係被設置於該構築材料沉積部位的一第二側。該第二側係為位於該第一方向的一側。 According to a third aspect of the invention, there is provided an additive manufacturing method. this method The invention comprises a process for depositing a construction material from a deposition material on a deposition unit of a construction material, and depositing a construction material in a first layer on a construction area, wherein the deposition material deposition unit is at least in a first direction, horizontally The more the construction area moves relatively. The method includes a program from a first bonding site on a first bonding unit, coupled to a selected portion of the first layer of the building material, wherein the first bonding unit is at least in the first direction The more the construction area moves relatively. The first bonding site is disposed on a first side of the deposition site of the structuring material. The first side is a side located in a direction opposite to the first direction. The method includes a process for depositing a build material from a build material deposition unit, and depositing a build material in the second layer on the first layer, wherein the build material deposition unit is associated with the first In the opposite direction, the transverse movement of the construction area. The method includes a program from a second bonding site on a second bonding unit, coupled to a selected portion of the second layer of the building material, wherein the second bonding unit is in the first direction, traversing The construction area moves relatively. The second bonding site is disposed on a second side of the deposition site of the structuring material. The second side is a side located in the first direction.

根據本發明之第四態樣,其係提供一種加法製造方法。該方法包含一程序,其係自一第一構築材料沉積單元上的第一構築材料沉積部位,於一建構區域上的第一層之中,沉積構築材料,其中該第一構築材料沉積單元係在一第一方向,橫越該建構區域相對地運動。該方法包含一程序,其係自一結合單元上的一結合部位,結合該構築材料的第一層上的選擇部位,其中該結合單元係在該第一方向,橫越該建構區域相對地運動。該第一構築材料沉積部位係被設置於該結合部位的一第一側。該第一側係為位於與該第一方向相反之方向的一側。該方法包含一程序,其係自一第二構築材料沉積單元上的第二構築材料沉積部位,於該第一層上的第二層之中,沉積構築材料,其中該構築材料 沉積單元係在與該第一方向相反之方向,橫越該建構區域相對地運動。該第二構築材料沉積部位係被設置於該結合部位的一第二側。該第二側係為位於該第一方向的一側。該方法包含一程序,其係自該結合單元上的該結合部位,結合該第二層上的選擇部位,其中該結合單元係與該第一方向相反之方向,橫越該建構區域相對地運動。 According to a fourth aspect of the invention, there is provided an additive manufacturing method. The method includes a process of depositing a build material from a first build material deposition site on a first build material deposition unit, wherein the first build material deposition cell system In a first direction, the traversing region is relatively moved. The method includes a program from a binding site on a bonding unit that incorporates a selected portion of the first layer of the building material, wherein the bonding unit is in the first direction and moves relatively transversely across the construction region . The first structuring material deposition site is disposed on a first side of the bonding site. The first side is a side located in a direction opposite to the first direction. The method includes a process of depositing a second build material deposition site on a second build material deposition unit, and depositing a build material in the second layer on the first layer, wherein the build material The deposition unit moves relatively traversing the construction region in a direction opposite to the first direction. The second structuring material deposition site is disposed on a second side of the bonding site. The second side is a side located in the first direction. The method includes a program from the binding site on the bonding unit, coupled to a selected portion of the second layer, wherein the bonding unit is opposite to the first direction and moves relative to the constructed region .

在一實施方式中,該沉積及結合單元係設置於一共同載體之上,該共同載體係被設置用於在該第一方向進行往復運動。 In one embodiment, the deposition and bonding unit is disposed on a common carrier that is configured to reciprocate in the first direction.

在一實施方式中,該沉積及結合單元係設置於各自獨立的載體之上,每一載體係被設置用於在該第一方向進行往復運動。 In one embodiment, the deposition and bonding units are disposed on separate carriers, each carrier being configured to reciprocate in the first direction.

在一實施方式中,該方法包含一程序,其係在沉積每一層的構築材料之後,使用一平滑元件,平滑化構築材料的沉積層,該平滑元件係設置於用於該沉積層的該沉積部位及用於該沉積層的該結合部位之間。 In one embodiment, the method includes a process for smoothing a deposited layer of build material using a smoothing element after depositing each layer of build material, the smoothing element being disposed in the deposit for the deposited layer The portion and the bonding site for the deposited layer.

在一實施方式中,每一結合單元選擇性地於先前沉積的構築材料上的部位,沉積結合劑材料,藉此選擇性地結合該構築材料。 In one embodiment, each bonding unit selectively deposits a binder material at a location on the previously deposited build material, thereby selectively bonding the build material.

在一實施方式中,藉由每一構築材料沉積單元沉積之構築材料係自一共同儲存器獲得。 In one embodiment, the build material deposited by each of the build material deposition units is obtained from a common reservoir.

在一實施方式中,該結合係分別與該第一方向及該第二方向之沉積同時進行。 In one embodiment, the bonding is performed simultaneously with the deposition of the first direction and the second direction.

10‧‧‧三維列印裝置 10‧‧‧Three-dimensional printing device

11‧‧‧桌 11‧‧‧Table

12‧‧‧井 12‧‧‧ Well

13‧‧‧平台 13‧‧‧ platform

15‧‧‧列印頭 15‧‧‧Print head

15a‧‧‧結合單元 15a‧‧‧ combination unit

15b‧‧‧粉末分配器 15b‧‧‧Powder Dispenser

15c‧‧‧結合單元 15c‧‧‧ combination unit

15d‧‧‧滾輪對 15d‧‧‧Roller pair

15e‧‧‧供應管 15e‧‧‧Supply tube

15f‧‧‧墨水噴頭 15f‧‧‧Ink nozzle

15g‧‧‧供應導管 15g‧‧‧ supply conduit

15h‧‧‧葉片閥單元 15h‧‧‧blade valve unit

15i‧‧‧供應口 15i‧‧‧ supply port

15j‧‧‧供應管 15j‧‧‧Supply tube

15k‧‧‧墨水噴頭 15k‧‧‧Ink nozzle

16‧‧‧軌道 16‧‧‧ Track

2a‧‧‧層 2a‧‧ layer

2b‧‧‧層 2b‧‧ layer

20‧‧‧列印裝置 20‧‧‧Printing device

21‧‧‧桌 21‧‧‧Table

22‧‧‧井 22‧‧‧ Well

23‧‧‧支持平台 23‧‧‧Support platform

25a‧‧‧載體 25a‧‧‧ Carrier

25b‧‧‧載體 25b‧‧‧ Carrier

25c‧‧‧載體 25c‧‧‧Vector

26‧‧‧軌道 26‧‧‧ Track

為更進一步了解本發明,以及顯示本發明如何發揮其功效,將伴隨所 附之圖式,僅以示例性的方式,提供參照:〔圖1至3〕係為顯示本發明之一實施例中之步驟的製造裝置示意圖;〔圖4〕係為顯示本發明所使用之列印頭的示意圖;以及〔圖5至7〕係為顯示本發明之另一實施例中之步驟的製造裝置示意圖。 In order to further understand the present invention and to show how the present invention exerts its efficacy, it will be accompanied by BRIEF DESCRIPTION OF THE DRAWINGS The drawings are provided by way of example only. FIG. 1 to FIG. 3 are schematic diagrams showing a manufacturing apparatus showing steps in an embodiment of the present invention; FIG. 4 is a view showing the use of the present invention. A schematic view of a printing head; and [Figs. 5 to 7] are schematic views of a manufacturing apparatus showing steps in another embodiment of the present invention.

本發明係關於一種三維列印技術,其中一物體係由一系列相繼之沉積層所構築,相繼之沉積層的部分係在該層之中被結合在一起,以及與下面一層的部分結合在一起。具體而言,本發明係關於粉末床三維列印,其中粉末之層係被相繼的沉積,每一層的區域係被結合在一起,以於下一相繼之層被沉積前,形成所欲之物體的部分。 The present invention relates to a three-dimensional printing technique in which a material system is constructed by a series of successive deposition layers in which portions of successive deposition layers are bonded together and combined with portions of the underlying layer. . In particular, the present invention relates to three-dimensional printing of a powder bed in which layers of powder are successively deposited, the regions of each layer being bonded together to form the desired object before the next successive layer is deposited. part.

本發明將以與粉末床及墨水噴頭相關的三維列印系統為例,其中結合劑係自一掃描墨水噴頭選擇性地噴射至依先前沉積的粉末床之上。然而,本發明並不限定於此,且在此所揭示之概念係可被應用於其他涉及將先前沉積的粉末層結合在一起的加法製造技術,包含選擇性的雷射燒結以及局部熔化製造。 The present invention will be exemplified by a three-dimensional printing system associated with a powder bed and an ink jet head wherein the bonding agent is selectively sprayed from a scanning ink jet head onto a previously deposited powder bed. However, the invention is not limited thereto, and the concepts disclosed herein can be applied to other additive manufacturing techniques involving the bonding of previously deposited powder layers, including selective laser sintering and local melt fabrication.

圖1係顯示一粉末床及墨水噴頭三維列印裝置10的示意圖。三維列印裝置10具有一列印桌11,井12係深入該列印桌11之上表面而形成。在井12中,係形成可移動的平台13,其係被設置以於井12中,沿一第一方向Z運動,其在圖1的配置中,該第一方向Z係垂直於桌11的表面平面。平台13係藉由可收縮的支座來支撐(圖未示),其係藉由一控制方法來收縮,以有效地降低平台13,深入井12。舉例來說,該可收縮的支座可具有齒狀部分,藉由齒輪 及齒條的傳動,使該支座透過齒狀輪的操作的控制方法來收縮。或者,可收縮的支座可液壓收縮,或藉由其他可能達成所需之方法收縮。 1 is a schematic view showing a three-dimensional printing apparatus 10 of a powder bed and an ink jet head. The three-dimensional printing apparatus 10 has a printing table 11 formed by penetrating the upper surface of the printing table 11. In the well 12, a movable platform 13 is formed which is arranged to move in the well 12 in a first direction Z, which in the configuration of Figure 1, is perpendicular to the table 11 Surface plane. The platform 13 is supported by a collapsible support (not shown) which is contracted by a control method to effectively lower the platform 13 and penetrate the well 12. For example, the collapsible mount can have a toothed portion by means of a gear And the transmission of the rack, the support is contracted by the control method of the operation of the toothed wheel. Alternatively, the collapsible support can be hydraulically contracted or otherwise contracted by other means that may be desired.

裝置10亦包含列印頭15,其係被設置以一第一方向X,橫越井12之上,當其平移時係被支持於該井之上。在圖1的實施方式中,列印頭15係被支持於軌道16上,其係被設置以沿著軌道16運動。舉例來說,列印頭15可藉由一傳動帶、一傳動螺桿、一內置驅動馬達或其他任何適合的方法,以往復方式於井12之上運動。重要地,列印頭15係可橫越井12在X方向的全部範圍。 The apparatus 10 also includes a printhead 15 that is disposed in a first direction X across the well 12 and supported above the well as it translates. In the embodiment of FIG. 1, the printhead 15 is supported on a track 16 that is configured to move along the track 16. For example, the printhead 15 can be moved over the well 12 in a reciprocating manner by a drive belt, a drive screw, a built-in drive motor, or any other suitable method. Importantly, the print head 15 can traverse the full extent of the well 12 in the X direction.

應注意的是,圖1之圖式描繪了X-Z平面的橫斷面,然而,井12具有在一第三方向Y的延伸,該第三方向Y係垂直於該X方向及Z方向,舉例來說,其係延伸到該頁面之外。桌11、井12以及平台13亦具有在此一方向的延伸,但在此方向上的形狀或尺寸,並未進一步具有特別的限制。舉例來說,當沿著該Z方向觀察時,在俯視圖中,井12可具有一長方形或正方形之形狀,但亦可具有其他形狀,包含多邊形或圓形。井12的橫截面在Z方向並未具有變化,然而,平台13具有一平面以緊密貼合井12的垂直牆面。據此,在桌11的平面之下與井12的垂直牆面及平台13之間,存在一空間,於此之中,粉末可被沉積,使得實質上沒有粉末自井12之側及平台13的邊緣之間洩漏。平台13可在每一邊緣具有密封裝置,例如:彈性刮刀,藉此提供一密封。 It should be noted that the diagram of FIG. 1 depicts a cross section of the XZ plane, however, the well 12 has an extension in a third direction Y that is perpendicular to the X and Z directions, for example. Said that its extension extends beyond this page. The table 11, the well 12, and the platform 13 also have an extension in this direction, but the shape or size in this direction is not further limited. For example, when viewed along the Z direction, the well 12 may have a rectangular or square shape in plan view, but may have other shapes, including polygons or circles. The cross section of the well 12 does not change in the Z direction, however, the platform 13 has a plane to closely conform to the vertical wall of the well 12. Accordingly, there is a space between the vertical wall of the well 12 and the platform 13 below the plane of the table 11, in which the powder can be deposited such that there is substantially no powder from the side of the well 12 and the platform 13 Leak between the edges. The platform 13 can have a sealing means at each edge, such as an elastic blade, thereby providing a seal.

列印頭15亦具有在Y方向的延伸,藉此該列印頭15係可於橫越通過井12在X-Y橫截面的全部範圍。這可藉由設置於該井在Y方向的全部長度延伸的列印頭15來達成。或者,這可藉由設置一列印頭15,其一或更多的構件係被設置以於Y方向往復運動,以柵格方式掃描該井的平面,使得當該列印頭在X方向橫越該井時,連續地或逐步地,該列印頭的構件係在Y方向掃描, 橫越通過該井的每一點。 The print head 15 also has an extension in the Y direction whereby the print head 15 is traversable across the entire range of the well 12 in the X-Y cross section. This can be achieved by a print head 15 that is placed over the entire length of the well in the Y direction. Alternatively, this can be accomplished by providing a row of print heads 15 with one or more members configured to reciprocate in the Y direction to scan the plane of the well in a grid such that when the print head traverses in the X direction In the well, continuously or stepwise, the components of the print head are scanned in the Y direction. Cross each point through the well.

如上所述之配置,係常見於該領域所習知的傳統粉末床及墨水噴頭三維列印裝置。 The configuration as described above is a conventional three-dimensional printing apparatus for powder beds and ink jets which are conventionally known in the art.

在圖1的實施方式中,列印頭15包含粉末分配器15b,適用於當列印頭15橫越該井時,分配粉末於井12之上。在本實施方式中,粉末分配器15b可具有一分配口,其係於該井在Y方向的全部寬度範圍延伸,使得當列印頭15橫越井12時,可自該分配口分配一整層的粉末。在另一配置中,該粉末分配器15b可為一掃描構件的形式,其係在Y方向分配連續的粉末排,該等排係被依序地沿X方向配置。列印頭15亦包含二結合單元15a及15c,其係分別配置於粉末分配器15b在X方向的兩側。在本實施方式中,每一結合單元15a及15c包含一墨水噴頭,其係被設置以於列印頭橫越通過井12時,噴射結合劑至井12之上。當該列印頭橫越井12時,藉由選擇性地噴射該結合劑,由粉末分配器15b所分配的粉末的每一層的部分,係被選擇性地結合在一起,以便形成所欲製造之物體的一層。 In the embodiment of Fig. 1, the printhead 15 includes a powder dispenser 15b adapted to dispense powder over the well 12 as the printhead 15 traverses the well. In the present embodiment, the powder dispenser 15b can have a dispensing opening extending over the entire width of the well in the Y direction such that when the print head 15 traverses the well 12, a full layer can be dispensed from the dispensing opening Powder. In another configuration, the powder dispenser 15b can be in the form of a scanning member that dispenses a continuous row of powders in the Y direction, which are sequentially disposed in the X direction. The print head 15 also includes two joining units 15a and 15c which are respectively disposed on both sides of the powder dispenser 15b in the X direction. In the present embodiment, each of the bonding units 15a and 15c includes an ink jet head that is configured to eject the bonding agent onto the well 12 as the print head traverses the well 12. When the print head traverses the well 12, by selectively spraying the bond, portions of each layer of the powder dispensed by the powder dispenser 15b are selectively bonded together to form the desired manufacture. a layer of an object.

列印頭15可額外包含一或多個平滑元件,例如:一刮刀或平滑滾輪,該平滑元件係被設置於列印頭15上,且適用於當列印頭15橫越井12時,整平被分配的粉末層的上表面。舉例來說,該平滑元件可被設置於粉末分配器15b以及結合單元15c之間及/或設置於粉末分配器15b以及結合單元15a之間。該平滑元件可被固定,或者至少在Z方向具有一可調整的位置。 The print head 15 may additionally include one or more smoothing elements, such as a doctor blade or smoothing roller, which is disposed on the print head 15 and is adapted to level when the print head 15 traverses the well 12. The upper surface of the powder layer being dispensed. For example, the smoothing element can be disposed between the powder dispenser 15b and the bonding unit 15c and/or between the powder dispenser 15b and the bonding unit 15a. The smoothing element can be fixed or have an adjustable position at least in the Z direction.

進一步,為了使用需要活性固化(例如:藉由紫外光)的結合劑,列印頭15可包含一固化單元,例如:一紫外光燈,其係伴隨任一結合單元或每一結合單元。該固化單元可分別設置於結合單元的任一側,使得該固化單元固 化剛由該結合單元分配的結合劑,或者將前一層的結合劑固化至本次的列印通過中將分配到結合劑之層。 Further, in order to use a bonding agent that requires active curing (for example, by ultraviolet light), the printing head 15 may include a curing unit such as an ultraviolet lamp, which is accompanied by either or both of the bonding units. The curing unit can be respectively disposed on either side of the bonding unit, so that the curing unit is solid The bonding agent that has just been dispensed by the bonding unit, or the bonding agent of the previous layer is cured to the layer of the bonding agent that will be dispensed in the current printing pass.

在一配置中,每一結合單元15a及15c可被設置作為一掃描墨水噴頭,其係操作以於列印頭在X方向前進之前或前進之時,在Y方向的單一排中,於預定的位置沉積結合劑的液滴,使得該結合劑分配器可於每一連續的排中,選擇性地沉積結合劑。或者,每一結合劑分配器可包含一單一的墨水噴頭,其係延伸至該井在Y方向的全部範圍,以及具有複數個結合劑分配口,其係至少在Y方向配置成一排,當該列印頭15在該X方向橫越井12時,藉由驅動各別的結合劑分配口,使結合劑可被沉積至該井的X-Y平面中被選擇的位置。亦可將這些方案加以結合,其中每一結合劑分配器可被設置於Y方向平移,但亦可包含至少於該Y方向配置的複數分配口。舉例來說,為了使分配口之間在Y方向達成較為鄰近的間距,該列印頭15的該等分配口亦可沿X方向配置成例如一傾斜的線性陣列。 In one configuration, each of the bonding units 15a and 15c can be configured as a scanning ink jet that operates in a single row in the Y direction before or during advancement of the printing head in the X direction, at a predetermined The droplets of the binding agent are deposited at a location such that the binder dispenser selectively deposits the binder in each successive row. Alternatively, each binder dispenser may comprise a single ink jet head extending to the full extent of the well in the Y direction and having a plurality of binder dispensing ports arranged in at least one row in the Y direction, when When the print head 15 traverses the well 12 in the X direction, the bond can be deposited to a selected location in the XY plane of the well by driving the respective binder dispensing ports. These solutions may also be combined, wherein each of the binder dispensers may be disposed to translate in the Y direction, but may also include a plurality of dispensing ports disposed at least in the Y direction. For example, in order to achieve a relatively adjacent spacing between the dispensing openings in the Y direction, the dispensing openings of the printhead 15 may also be arranged in the X direction as, for example, a slanted linear array.

現將描述圖1之實施方式的操作。在圖1中,圖1的實施方式的平台13的上表面係為平坦且平行於該X-Y平面,其係已於桌11的表面之下,收縮一短距離,以提供一建構區域(或建構空間),在此之中可分配一粉末層。該建構區域的深度,以及隨後將被分配於平台13之上之粉末層的深度,可被選擇,以使得該層的所有深度可於特定區域,透過該結合單元的作用,被選擇性地結合,以使一層可被結合至前一層的一結合部分,避免與前一層的實質上的部分非預期的結合在一起。 The operation of the embodiment of Fig. 1 will now be described. In Fig. 1, the upper surface of the platform 13 of the embodiment of Fig. 1 is flat and parallel to the XY plane, which is below the surface of the table 11, contracting a short distance to provide a construction area (or construction) Space), in which a powder layer can be dispensed. The depth of the construction region, and the depth of the powder layer to be subsequently distributed over the platform 13, can be selected such that all depths of the layer can be selectively combined in a particular region through the action of the bonding unit. So that a layer can be bonded to a bonded portion of the previous layer, avoiding unintended integration with a substantial portion of the previous layer.

從圖1所示的配置中,列印頭15在X方向橫越井12,以自該粉末分配器的分配口,沉積一粉末層至平台13表面上的該井之上。以及,當該 列印頭在X方向橫越時,結合劑分配器15a選擇性地沉積結合劑至該沉積層的部分之上,以選擇性地將該層的部分結合在一起。在圖1的配置中,該粉末及結合劑係同時地於同一次通過中分配,在該結合劑分配器可分配結合劑的X方向的位置中,該粉末係被分配至相較於該結合劑分配器相對前進的位置,即便其他的列印模式亦為可行。具體而言,當需要時間以使該粉末在結合劑分配之前安定時,該粉末可在一第一通過中於X方向沉積,其中該結合劑可在一返回通過中於-X方向沉積。 From the configuration shown in Figure 1, the print head 15 traverses the well 12 in the X direction to deposit a powder layer from the dispensing opening of the powder dispenser onto the well on the surface of the platform 13. And when When the print head traverses in the X direction, the bond dispenser 15a selectively deposits a bonding agent onto a portion of the deposited layer to selectively bond portions of the layer together. In the configuration of Figure 1, the powder and the binder are simultaneously dispensed in the same pass, and in a position in the X direction in which the binder dispenser can dispense the binder, the powder is dispensed to the combination The position of the dispenser is relatively advanced, even if other printing modes are possible. In particular, when time is required to stabilize the powder prior to dispensing of the binder, the powder may be deposited in the X direction in a first pass, wherein the binder may be deposited in the -X direction in a return pass.

如圖3所示,一旦層2a係被沉積,平台13係進一步降低,舉例而言,係以下一層所欲之厚度降低,以及該列印頭15在相反(-X)的方向移動,沉積另一層2b於該第一層2a的頂部。為了使該結合劑及粉末在橫越建構區域12的前進或返回的列印方向中,可被於同一次通過中分配,在圖1及圖2之間移動的前進通過中,粉末分配器15b及結合劑分配劑15a係啟動,在在圖2及圖3之間的返回通過中,粉末分配器15b及結合劑分配劑15c係啟動。據此,相較於習知裝置之列印僅可於前進通過中完成,以及於另一層可被沉積及結合之前,習知裝置將浪費列印頭回復至如圖1所示之原始位置的時間,圖1之實施方式可同時利用前進及返回通過來沉積及結合一單一層。據此,使用本發明之實施方式來列印,明顯地較為快速。 As shown in FIG. 3, once the layer 2a is deposited, the platform 13 is further lowered, for example, by the desired thickness of the lower layer, and the print head 15 is moved in the opposite (-X) direction, depositing another A layer 2b is on top of the first layer 2a. In order to make the binder and powder in the printing direction of the advancement or return of the traversing construction region 12, it can be distributed in the same pass, and the advancement of the movement between FIG. 1 and FIG. 2, the powder dispenser 15b The binder dispenser 15a is activated, and in the return passage between FIG. 2 and FIG. 3, the powder dispenser 15b and the binder dispenser 15c are activated. Accordingly, the conventional device will waste the print head returning to the original position as shown in FIG. 1 as compared to the printing of the conventional device, which can only be completed in advancement, and before another layer can be deposited and bonded. Time, the embodiment of Figure 1 can utilize both forward and return passes to deposit and bond a single layer. Accordingly, printing using embodiments of the present invention is significantly faster.

在一些配置中,結合劑可完全不被沉積於桌13上的第一層之上,藉此使得該被列印的物體可被輕易的從桌13的上表面分離。 In some configurations, the bonding agent may not be deposited at all on the first layer on the table 13, thereby allowing the printed object to be easily separated from the upper surface of the table 13.

圖4顯示列印頭15的示意圖,清楚地顯示雙重的結合單元15a及15c以及粉末分配器15b。結合單元15a及15c皆具有一墨水噴頭15f及15k,其係提供一結合劑分配口,該分配口係藉由供應管15e及15j連接至一外部結合 劑儲存器。每一結合劑單元可具有不同的結合劑儲存器,或者該等結合劑單元之間可分享一共同的結合劑儲存器。列印頭15可被連接至一外部儲存器,舉例來說,藉由合適長度的彈性管路。粉末分配器15b係位於結合單元15a及結合單元15c之間,其係藉由供應導管15g連接至一粉末儲存器。粉末儲存器係可被設置支撐於該列印頭15上,或者可位於該列印頭15的外部,以及該粉末可被適當地流體化,可自該外部儲存器輸送至供應管道15g。分配器15b亦包含一葉片閥單元15h,其係用於致動自該供應管道15g透過供應口15i的粉末分配。然而,透過供應口15i的粉末分配,可藉由該領域所習知的其他方法被選擇性地致動。 Figure 4 shows a schematic view of the print head 15 clearly showing the dual bond units 15a and 15c and the powder dispenser 15b. The bonding units 15a and 15c each have an ink jet head 15f and 15k which is provided with a bonding agent dispensing port which is connected to an external combination by supply pipes 15e and 15j. Agent storage. Each binder unit can have a different binder reservoir, or a common binder reservoir can be shared between the binder units. The print head 15 can be attached to an external reservoir, for example, by a flexible tube of suitable length. The powder dispenser 15b is located between the bonding unit 15a and the bonding unit 15c, which is connected to a powder reservoir by a supply conduit 15g. A powder reservoir can be provided to be supported on the printhead 15, or can be external to the printhead 15, and the powder can be suitably fluidized from the external reservoir to the supply conduit 15g. The dispenser 15b also includes a leaf valve unit 15h for actuating the powder distribution from the supply conduit 15g through the supply port 15i. However, the powder distribution through the supply port 15i can be selectively actuated by other methods known in the art.

列印頭15可藉由驅動滾輪對15d,沿著軌道16於該X方向驅動,驅動滾輪對15d係各別成對地夾持軌道16於其中,以及舉例來說,驅動滾輪對15d可被電性驅動,以有效地在X方向前進及返回移動列印頭15。在本發明的實施方式中,列印頭15係被整體包覆於外殼151中,以使得結合單元15a及15c以及粉末分配器15b分享一共同的載體。 The print head 15 can be driven in the X direction along the track 16 by the drive roller pair 15d, in which the drive roller pair 15d is individually held in pairs, and for example, the drive roller pair 15d can be Electrically driven to effectively advance and return to the print head 15 in the X direction. In an embodiment of the invention, the print head 15 is integrally wrapped in the outer casing 151 such that the bonding units 15a and 15c and the powder dispenser 15b share a common carrier.

然而,一實施方式係為可行,舉例而言,其中如圖4所示之列印頭15係被劃分至三個分別的載體,每一載體可配置其各自的驅動裝置,該等載體分別包含結合單元15a、粉末分配器15b及結合單元15c。每一分別的載體於該X方向的驅動可被分別地實現,以及具體而言,可分別地以不同的速度實現。 However, an embodiment is possible, for example, wherein the print head 15 as shown in FIG. 4 is divided into three separate carriers, each carrier being configurable with its respective drive device, the carriers respectively comprising The unit 15a, the powder distributor 15b, and the coupling unit 15c are combined. The driving of the respective carriers in the X direction can be implemented separately and, in particular, can be implemented at different speeds, respectively.

舉例來說,如圖5所示,列印裝置20具有三個載體25a、25b及25c,每一載體係被設置以X方向,於形成於桌21中的井22之上,沿著共同軌道26平移,以便沉積及結合配置於可移動的支持平台23之上的材料層。雖 然載體25a及25c係分別地設置結合單元,載體25b係設置粉末分配器。從圖5所示之配置中,載體25及25c係於X方向橫越井22,藉此一粉末層係自粉末分配器25b沉積,此階段係如圖6所示。如可能期望的,載體25b及25c可以相同的速度並以一鄰接的編隊一同移動,或者結合單元25c可較早出發或可相較於粉末單元25b較為快速的移動。 For example, as shown in FIG. 5, the printing device 20 has three carriers 25a, 25b, and 25c, each of which is disposed in the X direction, above the well 22 formed in the table 21, along a common track. The translation is 26 to deposit and bond the layers of material disposed over the movable support platform 23. although The carriers 25a and 25c are respectively provided with bonding units, and the carrier 25b is provided with a powder dispenser. From the configuration shown in Figure 5, carriers 25 and 25c traverse well 22 in the X direction whereby a powder layer is deposited from powder dispenser 25b, as shown in Figure 6. As may be desired, the carriers 25b and 25c may be moved at the same speed and in an adjacent formation, or the combining unit 25c may be started earlier or may move relatively faster than the powder unit 25b.

從圖6所示之配置中,結合單元25a隨後於X方向移動橫越被沉積的粉末層2a,以選擇性地將層2a的部分結合在一起。在結合單元25a完全通過井22之後,係達成如圖7所示之配置,其中全部的載體25a、25b及25c係被設置於井12之一側。當然地,於結合單元25a開始其移動之前,並不需要等待粉末分配器25b到達井22的另一側。實際上,在一些情況中,舉例來說當粉末分配器25b相較於結合單元25a的移動速度係被減低,例如:為了沉積均勻之層或足夠深度的粉末,對於結合劑單元25a而言,較佳係在分配單元25b完成其移動之前,開始其移動。在此一配置中,可選擇地,結合單元25a可在粉末分配器25b完成其移動的相同時間或在其不久之後,完成其移動。 From the configuration shown in Fig. 6, the bonding unit 25a is then moved across the deposited powder layer 2a in the X direction to selectively bond the portions of the layer 2a together. After the bonding unit 25a has completely passed through the well 22, a configuration as shown in FIG. 7 is achieved in which all of the carriers 25a, 25b, and 25c are disposed on one side of the well 12. Of course, it is not necessary to wait for the powder dispenser 25b to reach the other side of the well 22 before the combining unit 25a begins its movement. In fact, in some cases, for example, when the moving speed of the powder dispenser 25b is reduced compared to the bonding unit 25a, for example, in order to deposit a uniform layer or a powder of sufficient depth, for the bonding unit 25a, Preferably, the movement is initiated before the dispensing unit 25b completes its movement. In this configuration, alternatively, the joining unit 25a may complete its movement at the same time that the powder dispenser 25b has completed its movement or shortly thereafter.

在上述實施方式中,當存在固化單元或平滑單元時,其亦可被設置於獨立的載體上,或可被適合地設置於一或多個結合劑單元或粉末分配器的載體上。 In the above embodiment, when a curing unit or a smoothing unit is present, it may be provided on a separate carrier or may be suitably disposed on one or more of the bonding agent units or the carrier of the powder dispenser.

在一些實施方式中,該列印頭可被配置以使結合單元25a及結合單元25c分配不同的結合劑或使用不同的結合方法。雖然先前所述的揭示內容係關於在一定義該列印區域之上的至少一第一線性方向往復的列印頭,先前所述的揭示內容亦可被應用於一列印頭,其配置係自一建構區域的中心軸徑向延伸,以及掃過圍繞該軸之圓形路徑,以沉積粉末至該圓形建構區域之上,並 選擇性地將該粉末的區域結合在一起。 In some embodiments, the printhead can be configured to dispense different bonding agents or use different bonding methods for bonding unit 25a and bonding unit 25c. Although the foregoing disclosure relates to a printhead that reciprocates at least a first linear direction above the print area, the previously described disclosure can also be applied to a print head, the configuration of which is Radially extending from a central axis of a construction region and sweeping a circular path around the axis to deposit powder onto the circular construction region, and The regions of the powder are selectively bonded together.

雖然先前所述之揭示內容係示例性地關於,二結合單元係設置在該粉末分配器的一往復運動方向上之任一側的情況,先前所述之揭示內容亦可被相同地應用於一配置,其中二粉末分配器係被設置於一單一結合劑單元的任一側。除了元件15a及15c係被作為粉末分配器,而元件15b係被作為一結合單元,例如:被配置以分配一結合劑之外,此一配置可參照圖1所示及其描述來建構。在此一配置中,該等粉末分配器可被配置以分配相同或不同的粉末。在一實施例中,一陶瓷粉末及一金屬粉末可被用來做為二種不同的粉末;或者使用二種不同的陶瓷粉末、二種不同的金屬粉末,或相同材料的二種不同的粉末,例如:具有不同的顆粒尺寸。因此,在一配置中,所有前述之揭示內容可被等效地實施。 Although the foregoing disclosure is exemplarily related to the case where the two bonding unit is disposed on either side of a reciprocating direction of the powder dispenser, the foregoing disclosure may be equally applied to The arrangement wherein the two powder dispensers are disposed on either side of a single binder unit. The configuration can be constructed with reference to Figure 1 and its description, except that elements 15a and 15c are used as a powder dispenser and element 15b is used as a bonding unit, for example, configured to dispense a bonding agent. In this configuration, the powder dispensers can be configured to dispense the same or different powders. In one embodiment, a ceramic powder and a metal powder can be used as two different powders; or two different ceramic powders, two different metal powders, or two different powders of the same material. , for example: have different particle sizes. Thus, in a configuration, all of the foregoing disclosures may be equivalently implemented.

具體而言,除了被特別提及的三維列印技術之外,前述之揭示內容係適合用於各種各樣的三維列印技術,包含使用陶瓷、聚合物及金屬構築材料、反應性、紫外光固化、接觸固化或其他噴射結合劑,或者其他結合技術(例如:雷射或熱結合)的三維列印技術。具體而言,一實施方式係使用一金屬粉末及一聚合物結合劑。在此一實施方式中,於該物體自該列印裝置移出後,可施加一燒結程序於該金屬粉末。 In particular, in addition to the three-dimensional printing techniques specifically mentioned, the foregoing disclosures are suitable for use in a wide variety of three-dimensional printing techniques, including the use of ceramic, polymer and metal construction materials, reactivity, ultraviolet light. Three-dimensional printing technology for curing, contact curing or other jet bonding agents, or other bonding techniques such as laser or thermal bonding. Specifically, one embodiment uses a metal powder and a polymer binder. In this embodiment, after the object is removed from the printing device, a sintering process can be applied to the metal powder.

先前所述之揭示內容係僅為示例性地描述。可被期待地,本發明所屬技術領域中具有通常知識者,可依其所需,在無需過度負擔的情況下,修飾、替代、選擇或變化先前所述之揭示內容,以符合特定之工程上的需求。 The foregoing disclosure is merely illustrative. It is to be expected that a person of ordinary skill in the art to which the invention pertains may modify, substitute, select, or alter the previously disclosed disclosure as needed to conform to a particular engineering. Demand.

10‧‧‧三維列印裝置 10‧‧‧Three-dimensional printing device

11‧‧‧桌 11‧‧‧Table

12‧‧‧井 12‧‧‧ Well

13‧‧‧平台 13‧‧‧ platform

15‧‧‧列印頭 15‧‧‧Print head

15a‧‧‧結合單元 15a‧‧‧ combination unit

15b‧‧‧粉末分配器 15b‧‧‧Powder Dispenser

15c‧‧‧結合單元 15c‧‧‧ combination unit

16‧‧‧軌道 16‧‧‧ Track

Claims (15)

一種加法製造裝置,包含:一建構區域;一構築材料沉積單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該構築材料沉積單元上的構築材料沉積部位,逐層地沉積一構築材料;一第一結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以自該第一結合單元上的第一結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料;以及一第二結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以自該第二結合單元上的第二結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料,該第一結合部位、該構築材料沉積部位及該第二結合部位係依序地沿該第一方向配置。 An additive manufacturing apparatus comprising: a construction area; a construction material deposition unit configured to reciprocate relative to at least a first direction across the construction area to be above the construction area Constructing a deposition site of the structuring material on the material deposition unit, depositing a structuring material layer by layer; a first bonding unit configured to reciprocate relative to the at least one first direction across the construction region a first bonding site on the first bonding unit, selectively bonded to the structuring material at a portion deposited on the layer of the structuring material on the structuring region; and a second bonding unit configured to be used at least a first direction transversely reciprocating across the construction region to selectively construct a portion of the second bonding unit on the second bonding unit selectively deposited on a layer of the building material on the construction region The material, the first bonding portion, the deposition material deposition portion, and the second bonding portion are sequentially disposed along the first direction. 一種加法製造裝置,包含:一建構區域;一第一構築材料沉積單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該第一構築材料沉積單元上的構築材料沉積部位,逐層地沉積一第一構築材料;一結合單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以自該結合單元上的結合部位,選擇性地在沉積於該建構區域上之構築材料之層上的部位,結合構築材料;以及 一第二構築材料沉積單元,其係被設置用於至少在一第一方向,橫越該建構區域相對地往復運動,以於該建構區域之上,自該第二構築材料沉積單元上的第二構築材料沉積部位,逐層地沉積一第二構築材料,該第一構築材料沉積部位、該結合部位、及該第二構築材料沉積部位係依序地沿該第一方向配置。 An additive manufacturing apparatus comprising: a construction area; a first build material deposition unit configured to reciprocate relative to the construction area at least in a first direction over the construction area, Depositing a first structuring material layer by layer from a deposition material deposition site on the first structuring material deposition unit; a bonding unit configured to reciprocate relatively across the construction region at least in a first direction Movement, in combination with a structuring material, at a portion of the structuring material deposited on the structuring region from a bonding site on the bonding unit; a second build material deposition unit configured to relatively reciprocate across the build region in at least a first direction over the build region from the second build material deposition unit And depositing a second structuring material layer by layer, the first structuring material deposition portion, the bonding portion, and the second structuring material deposition portion are sequentially disposed along the first direction. 如請求項1或2所述之加法製造裝置,該等沉積及結合單元係設置於一共同載體之上,該共同載體係被設置用於在該第一方向進行往復運動。 The additive manufacturing apparatus of claim 1 or 2, wherein the deposition and bonding units are disposed on a common carrier, the common carrier being configured to reciprocate in the first direction. 如請求項1、2或3所述之加法製造裝置,其中該等沉積及結合單元係設置於各自獨立的載體之上,每一載體係被設置用於在該第一方向進行往復運動。 The additive manufacturing apparatus of claim 1, 2 or 3, wherein the deposition and bonding units are disposed on respective independent carriers, each carrier being configured to reciprocate in the first direction. 如請求項1至4中任一項所述之加法製造裝置,其中一平滑元件係依序地被設置於該等沉積及結合部位的每一沉積及結合部位之間,以及該等沉積及結合部位與下一個該等沉積或結合部位之間。 The additive manufacturing apparatus according to any one of claims 1 to 4, wherein a smoothing element is sequentially disposed between each deposition and bonding portion of the deposition and bonding sites, and the deposition and bonding Between the site and the next such deposit or bond site. 如請求項1至5中任一項所述之加法製造裝置,其中每一結合單元係一結合劑沉積單元,其係被設置用於選擇性地於先前沉積的構築材料上的部位,沉積結合劑材料,藉此選擇性地結合該構築材料。 The additive manufacturing apparatus according to any one of claims 1 to 5, wherein each of the bonding units is a binder deposition unit which is provided for selectively depositing a portion on the previously deposited building material a material to thereby selectively bind the building material. 如請求項2或附屬於請求項2之請求項3至6中任一項所述之加法製造裝置,其中該等構築材料沉積單元係被設置用於自一共同儲存器獲得構築材料。 The addition manufacturing apparatus according to any one of claims 3 to 6, wherein the construction material deposition unit is provided for obtaining a construction material from a common storage. 一種加法製造方法,包含:自一構築材料沉積單元上的構築材料沉積部位,於一建構區域上的第一層之中,沉積構築材料,其中該構築材料沉積單元係至少在一第一方向,橫越該建構區域相對地運動; 自一第一結合單元上的一第一結合部位,結合該構築材料的第一層上的選擇部位,其中該第一結合單元係至少在該第一方向,橫越該建構區域相對地運動,該第一結合部位係被設置於該構築材料沉積部位的一第一側,該第一側係為位於與該第一方向相反之方向的一側;自一構築材料沉積單元上的構築材料沉積部位,於該第一層上的第二層之中,沉積構築材料,其中該構築材料沉積單元係在與該第一方向相反之方向,橫越該建構區域相對地運動;以及自一第二結合單元上的一第二結合部位,結合該構築材料的第二層上的選擇部位,其中該第二結合單元係在該第一方向,橫越該建構區域相對地運動,該第二結合部位係被設置於該構築材料沉積部位的一第二側,該第二側係為位於該第一方向的一側。 An additive manufacturing method comprising: depositing a construction material from a deposition material on a deposition unit of a construction material, and depositing a construction material in a first layer on a construction area, wherein the deposition material deposition unit is at least in a first direction, Moving across the constructed area relatively; a first bonding portion on a first bonding unit, coupled to a selected portion of the first layer of the building material, wherein the first bonding unit moves relative to the construction region at least in the first direction, The first bonding site is disposed on a first side of the deposition site of the structuring material, the first side is a side located in a direction opposite to the first direction; and a deposition material is deposited from a deposition material deposition unit a portion, in the second layer on the first layer, depositing a build material, wherein the build material deposition unit is in a direction opposite to the first direction, relatively moving across the construction region; and from a second a second bonding portion on the bonding unit, combined with a selected portion on the second layer of the building material, wherein the second bonding unit is in the first direction, and relatively moves across the construction region, the second bonding portion And being disposed on a second side of the deposition site of the structuring material, the second side being a side located in the first direction. 一種加法製造方法,包含:自一第一構築材料沉積單元上的第一構築材料沉積部位,於一建構區域上的第一層之中,沉積構築材料,其中該第一構築材料沉積單元係在一第一方向,橫越該建構區域相對地運動;自一結合單元上的一結合部位,結合該構築材料的第一層上的選擇部位,其中該結合單元係在該第一方向,橫越該建構區域相對地運動,該第一構築材料沉積部位係被設置於該結合部位的一第一側,該第一側係為位於與該第一方向相反之方向的一側;自一第二構築材料沉積單元上的第二構築材料沉積部位,於該第一層上的第二層之中,沉積構築材料,其中該構築材料沉積單元係在與該第一方向 相反之方向,橫越該建構區域相對地運動,該第二構築材料沉積部位係被設置於該結合部位的一第二側,該第二側係為位於該第一方向的一側;以及自該結合單元上的該結合部位,結合該第二層上的選擇部位,其中該結合單元係與該第一方向相反之方向,橫越該建構區域相對地運動。 An additive manufacturing method comprising: depositing a building material from a first building material deposition site on a first building material deposition unit, and depositing a building material in a first layer on a construction region, wherein the first building material deposition unit is a first direction traversing the construction region relative to each other; a bonding portion on a bonding unit, a selected portion on the first layer of the structuring material, wherein the bonding unit is in the first direction, traversing The construction area is relatively moved, and the first construction material deposition portion is disposed on a first side of the joint portion, the first side is located on a side opposite to the first direction; Constructing a second structuring material deposition site on the material deposition unit, depositing a structuring material in the second layer on the first layer, wherein the structuring material deposition unit is in the first direction In a reverse direction, the second construction material deposition portion is disposed on a second side of the joint portion, the second side is a side located in the first direction; and The bonding portion on the bonding unit is coupled to the selected portion on the second layer, wherein the bonding unit is relatively movable in a direction opposite to the first direction across the construction region. 如請求項8或9所述之加法製造方法,其中該沉積及結合單元係設置於一共同載體之上,該共同載體係被設置用於在該第一方向進行往復運動。 The additive manufacturing method according to claim 8 or 9, wherein the deposition and bonding unit is disposed on a common carrier, the common carrier being configured to reciprocate in the first direction. 如請求項8、9或10所述之加法製造方法,其中該沉積及結合單元係設置於各自獨立的載體之上,每一載體係被設置用於在該第一方向進行往復運動。 The additive manufacturing method of claim 8, 9 or 10, wherein the deposition and bonding unit are disposed on respective independent carriers, each carrier being configured to reciprocate in the first direction. 如請求項8至11中任一項所述之加法製造方法,進一步包含:在沉積每一層的構築材料之後,使用一平滑元件,平滑化構築材料的沉積層,該平滑元件係設置於用於該沉積層的該沉積部位及用於該沉積層的該結合部位之間。 The additive manufacturing method according to any one of claims 8 to 11, further comprising: after depositing each layer of the structuring material, smoothing a deposited layer of the structuring material using a smoothing element, the smoothing element being disposed for The deposition site of the deposited layer and the bonding site for the deposited layer. 如請求項8至12中任一項所述之加法製造方法,其中每一結合單元選擇性地於先前沉積的構築材料上的部位,沉積結合劑材料,藉此選擇性地結合該構築材料。 The additive manufacturing method according to any one of claims 8 to 12, wherein each of the bonding units selectively deposits a binder material at a portion on the previously deposited building material, thereby selectively bonding the building material. 如請求項9或附屬於請求項9之請求項10至13中任一項所述之加法製造裝置,其中藉由每一構築材料沉積單元沉積之構築材料係自一共同儲存器獲得。 The additive manufacturing apparatus according to any one of claims 1 to 3, wherein the structuring material deposited by each of the structuring material deposition units is obtained from a common storage. 如請求項8至14中任一項所述之加法製造方法,其中該結合係分別與該第一方向及該第二方向之沉積同時進行。 The additive manufacturing method according to any one of claims 8 to 14, wherein the bonding system is performed simultaneously with the deposition of the first direction and the second direction, respectively.
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