CN116967480A - Metal multi-material powder selective laying method and laser printing device - Google Patents
Metal multi-material powder selective laying method and laser printing device Download PDFInfo
- Publication number
- CN116967480A CN116967480A CN202310953291.5A CN202310953291A CN116967480A CN 116967480 A CN116967480 A CN 116967480A CN 202310953291 A CN202310953291 A CN 202310953291A CN 116967480 A CN116967480 A CN 116967480A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- laser
- vacuum adsorption
- powder
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 74
- 239000000463 material Substances 0.000 title claims abstract description 49
- 238000007648 laser printing Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 133
- 238000001179 sorption measurement Methods 0.000 claims abstract description 75
- 230000008018 melting Effects 0.000 claims abstract description 37
- 238000002844 melting Methods 0.000 claims abstract description 37
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 41
- 239000011148 porous material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 6
- 230000007480 spreading Effects 0.000 abstract description 4
- 238000003892 spreading Methods 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 3
- 230000000996 additive effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Analytical Chemistry (AREA)
- Automation & Control Theory (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
The application provides a selective laying method of metal multi-material powder and a laser printing device, relates to the technical field of metal additive manufacturing, and solves the technical problem that in the prior art, selective laying and powder suction by adopting multiple spray heads have low laying efficiency. The device comprises a photoresist coating system, a vacuum adsorption system, a picosecond laser control system, a selective laser melting system and a transmission system, wherein the vacuum adsorption system is arranged above the photoresist coating system, the picosecond laser control system and the selective laser melting system; the bottom of the vacuum adsorption system is distributed with a plurality of micropores, the photoresist coating system is used for providing photoresist for the vacuum adsorption system and solidifying the photoresist in the micropores, and the picosecond laser control system is used for removing part of the microporous photoresist according to the slicing model so as to be used for adsorbing the powder of the storage bin. According to the device provided by the application, the same materials of each layer of the model slice can be simultaneously placed on the printing platform substrate through the vacuum adsorption system, so that quick powder spreading can be realized.
Description
Technical Field
The application relates to the technical field of metal additive manufacturing, in particular to a metal multi-material powder selective laying method and a laser printing device.
Background
Selective laser melting is one of the main technological approaches in additive manufacturing of metallic materials. The technology selects laser as an energy source, scans the metal powder bed layer by layer according to a planned path in the three-dimensional CAD slice model, and melts and solidifies the scanned metal powder to achieve the metallurgical bonding effect, so as to finally obtain the metal part designed by the model.
The present inventors found that there are at least the following technical problems in the prior art:
when the existing multi-material printing is carried out by using a laser selective melting technology, multiple spray heads are adopted to carry out selective powder paving and powder absorbing, when a material A is paved, the spray heads A are used for paving a material A powder area in a pass-by-pass mode along a design path, then the spray heads B are used for paving a material B powder area in a pass-by-pass mode along the design path, and so on. The problem with laying powder like this is that inefficiency, and powder laying precision is low (the precision relies on the size of nozzle), can't accomplish the accurate control of powder in each material region.
Disclosure of Invention
The application aims to provide a metal multi-material powder selective laying method and a laser printing device, which aim to solve the technical problem that the existing multi-material printing technology using a laser selective melting technology has low powder laying efficiency when multi-spray heads are used for selectively laying and sucking powder 。 The preferred technical solutions of the technical solutions provided by the present application can produce a plurality of technical effects described below.
In order to achieve the above purpose, the present application provides the following technical solutions:
the application provides a laser printing device, which comprises a photoresist coating system, a vacuum adsorption system, a picosecond laser control system, a laser melting system and a transmission system, wherein the laser melting system comprises more than one bin, the photoresist coating system, the picosecond laser control system, the bin and the laser melting system are sequentially arranged, the vacuum adsorption system is arranged above the photoresist coating system, the picosecond laser control system and the laser melting system, and the transmission system is connected with the vacuum adsorption system to drive the vacuum adsorption system to move; the vacuum adsorption system is characterized in that a plurality of micropores are distributed at the bottom of the vacuum adsorption system, the photoresist coating system is used for providing photoresist for the vacuum adsorption system and solidifying photoresist in the micropores and blocking the photoresist in the micropores, and the picosecond laser control system is used for removing part of the photoresist in the micropores according to a slicing model so as to be used for adsorbing powder of the storage bin.
Further, the photoresist coating system comprises a photoresist curing platform and a photoresist supplying device, wherein the photoresist supplying device comprises a photoresist nozzle, and the photoresist nozzle is used for spraying photoresist to the photoresist nozzle.
Further, the length of the photoresist nozzle is not less than that of the photoresist curing platform, the photoresist nozzle is arranged above the photoresist curing platform and is connected with a driving guide rail structure, and the driving guide rail structure can drive the photoresist nozzle to move along the width direction of the photoresist curing platform.
Further, the material of photoresist solidification platform is transparent material, the below of photoresist solidification platform sets up the photosensitive light source.
Further, the vacuum adsorption system comprises a vacuum bin and an array micro-pore plate, wherein the array micro-pore plate is arranged at the bottom opening position of the vacuum bin, and the vacuum bin is connected with a vacuum device through a vacuum tube.
Further, each bin corresponds to a scraper, and the scraper is used for scraping powder adsorbed on the vacuum bin structure.
Further, the laser printing device further comprises a supporting table, the photoresist coating system, the picosecond laser control system and the laser melting system are sequentially arranged on the supporting table, and the scraper is arranged on the supporting table and is located between the two storage bins or between the storage bins and the laser melting system.
Further, the laser melting system comprises a substrate, a laser device and a lifting device connected with the substrate.
Further, the transmission system comprises a vertical driving mechanism and a horizontal driving mechanism, the vacuum adsorption system is connected with the vertical driving mechanism, the vertical driving mechanism is used for driving the vacuum adsorption system to move along the height direction, the vertical driving mechanism is connected with the horizontal driving mechanism, and the horizontal driving mechanism is used for driving the horizontal driving mechanism to move along the horizontal direction.
The application provides a metal multi-material powder selective paving method of a laser printing device, which is characterized by comprising the following steps:
the micropores of the vacuum adsorption system enter photosensitive resin,
curing the photoresist in the micropores;
moving the vacuum adsorption system to the position above the picosecond laser control system, wherein the picosecond laser control system evaporates the photosensitive resist in the micropores of the area where the powder material is required to be paved by utilizing laser energy according to a slicing pattern path of a design model;
the vacuum adsorption system moves to a storage bin and adsorbs materials;
and placing the material absorbed by the vacuum absorption system on a substrate of the laser melting system.
The preferred technical scheme of the application at least has the following technical effects: the laser printing device provided by the application is used for slicing the picosecond laser control system according to the design model, and the photosensitive resin in the micropores of the powder region required to be adsorbed on the vacuum adsorption system is evaporated by utilizing laser energy, so that the micropore gas path is smooth, and powder particles can be adsorbed by utilizing negative pressure.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a laser printing apparatus according to the present application;
FIG. 2 is a schematic diagram of a vacuum adsorption system according to the present application;
FIG. 3 is a schematic diagram of the structure of an array microplate provided by the present application;
FIG. 4 is a schematic view of the structure of a silo in the laser melting system provided by the application;
fig. 5 is a schematic structural diagram of a photoresist coating system provided by the present application.
1, a photoresist coating system; 101. a photosensitive adhesive curing platform; 102. a photoresist nozzle; 103. a glue-sensitive light source; 2. a vacuum adsorption system; 201. micropores; 202. a vacuum bin; 203. an array microplate; 3. a picosecond laser control system; 4. a storage bin; 5. a laser melting system; 6. a transmission system; 7. a scraper; 8. a support table; 9. a substrate; 10. a laser device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, based on the examples herein, which are within the scope of the application as defined by the claims, will be within the scope of the application as defined by the claims.
The application provides a laser printing device, which comprises a photoresist coating system 1, a vacuum adsorption system 2, a picosecond laser control system 3, a laser melting system 5 and a transmission system 6, wherein the laser melting system 5 comprises more than one stock bin 4, the photoresist coating system 1, the picosecond laser control system 3 and the laser melting system 5 are sequentially arranged, the vacuum adsorption system 2 is arranged above the photoresist coating system 1, the picosecond laser control system 3 and the laser melting system 5, and the transmission system 6 is connected with the vacuum adsorption system 2 to drive the vacuum adsorption system 2 to move; the bottom of the vacuum adsorption system 2 is distributed with a plurality of micropores 201, the photoresist coating system 1 is used for providing photoresist for the vacuum adsorption system 2 and solidifying the photoresist in the micropores 201, and the picosecond laser control system 3 is used for removing part of the photoresist of the micropores 201 according to a slicing model so as to be used for adsorbing the powder of the storage bin 4.
According to the laser printing device provided by the application, the vacuum adsorption system 2 is firstly moved to the upper part of the photoresist coating system 1 under the drive of the transmission system 6, the photoresist coating system 1 provides photoresist, the photoresist provided by the photoresist coating system 1 can block the micropores 201 on the vacuum adsorption system 2, meanwhile, the photoresist coating system 1 can solidify the photoresist on the micropores 201, when all the micropores 201 on the vacuum adsorption system 2 are blocked by the solidified photoresist, the transmission system 6 is controlled to move the vacuum adsorption system 2 to the upper part of the picosecond laser control system 3, the picosecond laser control system 3 is responsible for slicing according to a design model, and the photoresist in the micropores of a powder area required to be adsorbed on the vacuum adsorption system 2 is evaporated by utilizing laser energy, so that the micropores are smooth in gas path, and powder particles can be adsorbed by utilizing negative pressure. Then the vacuum adsorption system 2 is moved to the upper part of the stock bin 4, powder particles are adsorbed through the micropores 201 which are not blocked on the vacuum adsorption system 2, after the completion, the control transmission system 6 drives the vacuum adsorption system 2 to move to the upper part of the laser melting system 5, and when the atmosphere pressure in the vacuum adsorption system 2 is restored, the adsorbed powder particles drop onto a printing platform substrate of the laser melting system 5, so that the selective adsorption of metal powder can be realized, and the metal powder is transferred onto the substrate for laying. The number of the bins 2 can be more than two, and powder of different bins is adsorbed according to control so as to finish powder spreading of each layer.
By adopting the laser printing device provided by the application, the same material of each layer of the model slice can be simultaneously placed on the printing platform substrate through the vacuum adsorption system 2, so that the rapid powder spreading can be realized, and the powder spreading efficiency is improved.
Regarding the photoresist coating system 1, the specific structure is preferably as follows: the photoresist coating system 1 comprises a photoresist curing platform 101 and a photoresist supply device, wherein the photoresist supply device comprises a photoresist nozzle 102, and the photoresist nozzle 102 is used for spraying photoresist to the photoresist nozzle 102.
Referring to fig. 1, a photoresist curing platform 101 is schematically shown, when the micropores on the vacuum adsorption system 2 are required to adsorb photoresist, a layer of photoresist is sprayed to the photoresist curing platform 101 through a photoresist nozzle 102, and then the transmission system 6 is controlled to slowly move down the vacuum adsorption system 2, so that the micropores on the vacuum adsorption system 2 are immersed in the photoresist.
Referring to fig. 1, the arrangement of the photoresist nozzle 102 is schematically shown, the length of the photoresist nozzle 102 is not less than that of the photoresist curing platform 101, the photoresist nozzle 102 is arranged above the photoresist curing platform 101 and is connected with a driving guide rail structure, and the driving guide rail structure can drive the photoresist nozzle 102 to move along the width direction of the photoresist curing platform 101. Namely, the photoresist nozzle 102 can be controlled to horizontally move from one side to the opposite side under the drive of the driving guide rail structure, so that a layer of photoresist is sprayed on the photoresist curing platform 101.
Regarding the driving rail structure, the prior art is adopted. For example, the driving guide rail structure comprises a driving motor and a screw rod mechanism, the driving motor is connected with the screw rod mechanism, a sliding block of the screw rod mechanism is connected with the photoresist nozzle 102, and the sliding block horizontally moves along the length direction of the screw rod when the driving motor acts, so that the photoresist nozzle 102 is driven to move along the horizontal direction.
Regarding "the photoresist coating system 1 can cure the photoresist in the micropores 201", the specific structure is as follows: the photoresist curing platform 101 is made of transparent material, and a photoresist light source 103 is arranged below the photoresist curing platform 101. When the vacuum adsorption system 2 vacuum adsorbs the photoresist on the photoresist curing stage 101, the photoresist fills all the micropores 201. Then the photoresist light source 103 is turned on to emit light with specific wavelength, so that the photoresist in the micropores 201 is solidified, and all the micropores are blocked by the photoresist.
The application sets the material of the photosensitive glue curing platform 101 as transparent material and the photosensitive glue light source 103, has reasonable layout and is convenient for curing the photosensitive glue in the micropores.
Referring to fig. 1 and 2, the vacuum adsorption system 2 includes a vacuum chamber 202 and an array microplate 203, the array microplate 203 is disposed at an opening position at the bottom of the vacuum chamber 202, and the vacuum chamber 202 is connected to a vacuum device through a vacuum tube.
The vacuum device may be a vacuum device according to the prior art, and will not be described in detail here. Air within the chamber 202 may be evacuated by a vacuum device and a vacuum tube to facilitate the formation of a vacuum-adsorbed powder.
Referring to fig. 3, an array microplate 203 is schematically shown, and a plurality of microwells 201 are distributed on the array microplate 203. The micropores 201 have a diameter on the order of microns.
Preferably, each silo 4 corresponds to a scraper 7, which scraper 7 is intended to scrape off the powder structurally adsorbed by the vacuum silo 202. Referring to fig. 1, a doctor blade 7 is schematically shown. The scraper is used for scraping the powder layer adsorbed by the vacuum adsorption system 2, so that the powder layer with uniform thickness is formed.
The specific structure of the doctor blade 7 is not limited, and the above-described functions may be realized; regarding the length of the blade 7, it is not smaller than the width of the array microplate 203, wherein the front-back direction of the array microplate 203 in fig. 1 is defined as the width direction.
Regarding the picosecond laser control system 3, the picosecond laser control system 3 includes a picosecond laser and a control element, and the picosecond laser is responsible for slicing according to a design model, and evaporating photoresist inside a microwell of a region of the array microwell plate to be adsorbed with laser energy.
The laser melting system 5 may be of a conventional structure. The prior art laser melting system 5 generally comprises a substrate 9, a laser device 10, and a lift device connected to the substrate 9. After the vacuum adsorption system 2 transfers the metal powder onto the forming bin substrate 9, the laser device selectively sinters according to the model slicing path, the forming bin screw (lifting device) descends by one layer thickness, then powder laying and laser sintering are repeated, and finally the forming component is printed.
In addition, referring to fig. 1, the laser printing apparatus further includes a support table 8, and the photoresist coating system 1, the picosecond laser control system 3, and the laser melting system 5 are sequentially disposed on the support table 8, and the doctor blade 7 is disposed on the support table 8 and the doctor blade 7 is disposed between the two bins 4 or between the bins 4 and the substrate 9.
With respect to the transmission system 6, the specific structure is preferably as follows: the transmission system 6 comprises a vertical driving mechanism and a horizontal driving mechanism, the vacuum adsorption system 2 is connected with the vertical driving mechanism, the vertical driving mechanism is used for driving the vacuum adsorption system 2 to move along the height direction, the vertical driving mechanism is connected with the horizontal driving mechanism, and the horizontal driving mechanism is used for driving the horizontal driving mechanism to move along the horizontal direction.
Referring to fig. 1, a transmission system 6 is schematically shown, and a vertical driving mechanism and a horizontal driving mechanism of the transmission system 6 are all of the prior art. For example, the vertical driving mechanism may include a driving motor and a screw mechanism, the driving motor is connected with the screw mechanism, a slider of the screw mechanism is connected with the vacuum adsorption system 2 through a frame body, and the vacuum adsorption system 2 is driven to move along the height direction by the action of the driving motor. Regarding the horizontal driving mechanism, similarly, a driving motor and a screw mechanism may be adopted, and the two long rod structures illustrated in fig. 1 may be guide rails matched with the slide blocks of the screw mechanism, in the horizontal driving mechanism, the slide block structure of the screw mechanism is connected with the vertical driving mechanism, and the horizontal driving mechanism may drive the vertical driving mechanism and the vacuum adsorption system 2 to move together in the horizontal direction. The horizontal moving direction is consistent with the trend of the position arrangement of the photoresist coating system 1, the picosecond laser control system 3 and the laser melting system 5.
Referring to fig. 1, the specific usage flow of the laser printing device provided by the application is as follows:
1. the vacuum adsorption system 2 is positioned above the photosensitive adhesive curing platform 101; in the figure, the bin on the right side is a material A powder bin, the bin on the left side is a material B powder bin, the material A powder bin is filled with powder A, and the material B powder bin is filled with powder B.
2. The photoresist nozzle 102 moves from one side of the working platform to the other side along the guide rail at a uniform speed, and when the photoresist moves to the photoresist curing platform 101, the photoresist nozzle uniformly sprays out photoresist, and a photoresist layer with uniform thickness (about 0.5mm thick) is formed on the photoresist curing platform 101.
3. The vacuum adsorption system 2 slowly descends onto the curing platform from above the photoresist curing platform 101, so that the array micro-pore plate 203 is immersed into the photoresist, and at this time, the photoresist fills all the micro-pores due to the effect of vacuum adsorption pressure. Then the photoresist (curing) light source is turned on to emit light with specific wavelength, so that the photoresist is cured, and the aim that all micropores on the array micropore plate 203 are blocked by using the photoresist, and gas cannot pass through the array micropore plate is fulfilled.
4. The vacuum adsorption system 2 is lifted from the photoresist curing stage 101 and moved to a focal plane height above the picosecond laser. And then the picosecond laser evaporates the photoresist in the micropores of the area needing to be paved with the powder material A by utilizing laser energy according to a slicing pattern path of the design model, and opens the micropores of the area so as to ensure that the gas path is smooth.
5. The vacuum adsorption system 2 moves from the picosecond laser to the powder bin of the material A, then the vacuum pump is started to enable negative pressure to be formed in the vacuum tube and the vacuum bin, micropores of the area where the powder material A needs to be paved are connected with the vacuum bin because the photoresist is evaporated by the picosecond laser, and the gas circuit is smooth, negative pressure is formed in the micropores, the powder of the material A is adsorbed by utilizing the negative pressure adsorption force, and the unsmooth micropores cannot adsorb the powder of the material A, so that the purpose of selectively adsorbing the metal powder in the area is achieved.
6. After the vacuum adsorption system 2 adsorbs the powder of the material A, the adsorbed powder A layer is scraped by a scraper 7 in front of a powder bin of the material A to form a powder layer with uniform thickness.
7. Then the powder A with the specific shape and uniform thickness carried by the vacuum adsorption system 2 moves onto the substrate of the laser melting system, the vacuum pump stops working, the negative pressure of the vacuum chamber disappears, and the powder A of the material falls onto the substrate from the array micro-pore plate 203 due to gravity, so that the purpose of paving the powder A of the material in the selective area is achieved.
8. And the laser device above the base plate of the forming bin melts the powder A of the material on the base plate according to a designed path, and the process of converting the powder material into a workpiece is completed.
9. Repeating the steps 1-8, transferring the powder B of the material from the powder bed of the material B to the substrate by the vacuum adsorption system 2, and then laser melting the powder B by laser, so that the selective laying and melt forming of the powder B of the two materials are completed in the same layer A, B, and according to the principle, the device works layer by layer, and finally, the printing forming of heterogeneous materials based on a laser selective melting technology (SLM) can be realized.
The application provides a metal multi-material powder selective paving method of a laser printing device, which comprises the following steps:
the micropores 201 of the vacuum adsorption system 2 are filled with photoresist,
curing the photoresist in the micro-holes 201;
moving the vacuum adsorption system 2 to the position above the picosecond laser control system 3, and evaporating the photosensitive resin in the micropores 201 of the powder material area to be paved by using laser energy according to a slicing pattern path of the design model by the picosecond laser control system 3;
the vacuum adsorption system 2 moves to the stock bin 4 and adsorbs materials;
the material adsorbed by the vacuum adsorption system 2 is placed on the substrate 9 of the laser melting system 5.
The method for selective laying of metal multi-material powders has been described in detail in relation to the embodiments of the apparatus, and will not be described in detail here.
In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", etc., refer to an orientation or positional relationship based on that shown in the drawings, and are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
In the description of the present specification, a description of the terms "one embodiment," "some embodiments," "examples," "specific examples," or "one example" and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A laser printing device is characterized by comprising a photoresist coating system (1), a vacuum adsorption system (2), a picosecond laser control system (3), a laser melting system (5) and a transmission system (6), wherein,
the laser melting system (5) comprises more than one bin (4), the photoresist coating system (1), the picosecond laser control system (3), the bin (4) and the laser melting system (5) are sequentially arranged, the vacuum adsorption system (2) is arranged above the photoresist coating system (1), the picosecond laser control system (3) and the laser melting system (5), and the transmission system (6) is connected with the vacuum adsorption system (2) to drive the vacuum adsorption system (2) to move;
the bottom of vacuum adsorption system (2) distributes and has a plurality of micropores (201), photosensitive gum coating system (1) are used for vacuum adsorption system (2) provides photosensitive gum and solidification blocks up the photosensitive gum in micropore (201), picosecond laser control system (3) are used for getting rid of partial photosensitive gum of micropore (201) in order to be used for adsorbing the powder of feed bin (4) according to the section model.
2. The laser printing device according to claim 1, characterized in that the photoresist coating system (1) comprises a photoresist curing platform (101) and a photoresist supply device, the photoresist supply device comprising a photoresist nozzle (102), the photoresist nozzle (102) being adapted to spray photoresist to the photoresist nozzle (102).
3. The laser printing device according to claim 2, wherein the length of the photoresist nozzle (102) is not less than that of the photoresist curing platform (101), the photoresist nozzle (102) is arranged above the photoresist curing platform (101) and is connected with a driving guide rail structure, and the driving guide rail structure can drive the photoresist nozzle (102) to move along the width direction of the photoresist curing platform (101).
4. The laser printing device according to claim 2, wherein the photoresist curing platform (101) is made of transparent material, and a photoresist light source (103) is arranged below the photoresist curing platform (101).
5. The laser printing device according to claim 1, characterized in that the vacuum adsorption system (2) comprises a vacuum chamber (202) and an array micro-pore plate (203), the array micro-pore plate (203) is arranged at the bottom opening position of the vacuum chamber (202), and the vacuum chamber (202) is connected with the vacuum device through a vacuum tube.
6. The laser printing device according to claim 1, characterized in that each silo (4) corresponds to a scraper (7), which scraper (7) is intended to scrape off the powder structurally adsorbed by the vacuum silo (202).
7. The laser printing device according to claim 6, characterized in that the laser printing device further comprises a support table (8), the photoresist coating system (1), the picosecond laser control system (3) and the laser melting system (5) are sequentially arranged on the support table (8), the doctor blade (7) is arranged on the support table (8) and the doctor blade (7) is positioned between two bins (4) or between the bins (4) and the laser melting system (5).
8. The laser printing device according to claim 1, characterized in that the laser melting system (5) comprises a substrate (9), a laser device (10) and a lifting device connected to the substrate (9).
9. The laser printing device according to claim 1, characterized in that the transmission system (6) comprises a vertical driving mechanism and a horizontal driving mechanism, the vacuum adsorption system (2) is connected with the vertical driving mechanism, the vertical driving mechanism is used for driving the vacuum adsorption system (2) to move along the height direction, the vertical driving mechanism is connected with the horizontal driving mechanism, and the horizontal driving mechanism is used for driving the horizontal driving mechanism to move along the horizontal direction.
10. A method of selectively laying a metal multi-material powder for a laser printing device according to any one of claims 1 to 9, comprising the steps of:
the micropores (201) of the vacuum adsorption system (2) are filled with photosensitive resin,
curing the photoresist in the micropores (201);
moving the vacuum adsorption system (2) to the position above the picosecond laser control system (3), and evaporating photoresist in micropores (201) of a region where powder materials need to be paved by using laser energy according to a slicing pattern path of a design model by the picosecond laser control system (3);
the vacuum adsorption system (2) moves to a storage bin (4) and adsorbs materials;
the material absorbed by the vacuum absorption system (2) is placed on a substrate (9) of the laser melting system (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310953291.5A CN116967480A (en) | 2023-07-31 | 2023-07-31 | Metal multi-material powder selective laying method and laser printing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310953291.5A CN116967480A (en) | 2023-07-31 | 2023-07-31 | Metal multi-material powder selective laying method and laser printing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116967480A true CN116967480A (en) | 2023-10-31 |
Family
ID=88477775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310953291.5A Pending CN116967480A (en) | 2023-07-31 | 2023-07-31 | Metal multi-material powder selective laying method and laser printing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116967480A (en) |
-
2023
- 2023-07-31 CN CN202310953291.5A patent/CN116967480A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6946319B2 (en) | Manufacturing method and manufacturing equipment | |
| ES2874097T3 (en) | Method and apparatus for additive manufacturing with powder material | |
| KR102317567B1 (en) | Additive Manufacturing Using Powder Dispensing | |
| CN102905876B (en) | A kind of method and apparatus making threedimensional model | |
| KR20160132498A (en) | Device for constructing models in layers | |
| CN103009630A (en) | Three-dimensional shaping apparatus | |
| GB2532518A (en) | Manufacturing method and manufacturing apparatus | |
| JP6641909B2 (en) | Method for manufacturing three-dimensional object and three-dimensional object | |
| CN116967480A (en) | Metal multi-material powder selective laying method and laser printing device | |
| CN113618087B (en) | Metal powder paving device for 3D double-laser metal printer | |
| CN210590588U (en) | Large-scale powder bed hydrojet bonding formula 3D printer | |
| US11980941B2 (en) | Method and apparatus for additive manufacturing with powder material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |