KR101713813B1 - Method for forming film and apparatus for forming the same - Google Patents

Abstract

Provided is a film forming method which makes it difficult for the inclination of the side to be gentle even if the film is made thick.
The film material is applied by dropletization along the edge of the area to be coated to which the film material is to be applied on the surface of the substrate and is cured to form the outer edge portion first and then the film material is dripped And forming a deep layer portion by curing, thereby forming a unit layer formed of an outer edge portion and a deep layer portion and having an upper surface deflected. Another unit layer, each of which is composed of an outer edge part and a deep layer part, is laminated on the unit layer while maintaining the shape of the top surface of the uppermost unit layer being depressed.

Description

TECHNICAL FIELD The present invention relates to a film forming method and a film forming apparatus,

The present application claims priority based on Japanese Patent Application No. 2014-047088 filed on March 11, 2014. The entire contents of which are incorporated herein by reference.

The present invention relates to a film forming method and a film forming apparatus by applying a film material that has been liquidized on a substrate and curing the film material.

There is known a technique of ejecting a liquid thin film material from a nozzle head (inkjet head) to form a thin film on the surface of the substrate (for example, Patent Document 1). As the thin film material, a photo-curable resin (for example, an ultraviolet ray curable resin) is used. A thin film is formed by curing the thin film material by irradiating the thin film material adhered to the substrate with curing light.

In the method disclosed in Patent Document 2, first, an edge pattern is formed by depositing a dropletized thin film material on the edge of a region where a thin film is to be formed. After forming an edge pattern, a thin film material is deposited on the inner side of a region where a thin film is to be formed, thereby covering a region where a thin film is to be formed with a liquid thin film material. Thereafter, the thin film material is cured by irradiating the liquid thin film material with curing light.

The edge pattern prevents the flow of the liquid thin film material. In the inside of the region where the thin film should be formed, the thin film material adhering to the substrate surface is continuous in the transverse direction and a liquid film having a flat surface is formed. Since the thin film material is cured after the surface becomes flat, a thin film having a flat surface can be formed.

Prior art literature

(Patent Literature)

Patent Document 1: Japanese Patent Publication No. 3544543

Patent Document 2: International Publication No. 2013/011775

The thickness of the copper film of the thick copper substrate for high current is about 50 mu m to 2 mm. In order to form a copper film of a thick copper substrate, the insulating film must also be thickened to the same degree. In the thin film forming method using the conventional nozzle head, when such a thick film is formed, the side surface of the film is inclined, and the inclined surface becomes gentle. SUMMARY OF THE INVENTION An object of the present invention is to provide a film forming method and a film forming apparatus in which the inclination of the side surface is difficult to be gentle even if the film is made thick.

According to one aspect of the present invention,

The film material is applied on the surface of the substrate along the edge of the area to be coated to which the film material is to be applied and is then applied and cured to form the outer edge portion first and then the inner side of the outer edge portion, Forming a unit layer formed by the outer edge portion and the deep layer portion and having an upper surface deflected by forming a deep portion by applying a liquid droplet,

There is provided a film forming method comprising a step of stacking, on the unit layer, another unit layer comprising the outer edge portion and the deep layer portion, while keeping the top surface of the uppermost unit layer in a depressed form.

According to another aspect of the present invention,

A stage for supporting the substrate,

A nozzle head having a plurality of nozzle holes for ejecting a photo-curable film material by droplet ejection, the nozzle head being opposed to the substrate supported on the stage,

A light source for irradiating the film material coated on the substrate with curing light;

A moving mechanism for relatively moving the substrate relative to the nozzle head and the light source,

And a control device for controlling the nozzle head and the moving mechanism,

Wherein the control device controls the nozzle head and the moving mechanism,

The film material is applied by dropletization along the edge of the substrate to be coated on the surface of the substrate and is cured to form the outer edge portion first and then the film material is applied on the inner side of the outer edge portion by dropletization And forming a deep layer portion by curing the outer layer portion and the deep layer portion to form a unit layer in which the upper surface is punched,

There is provided a film forming apparatus for forming a laminated structure on an upper surface of a unit layer of an uppermost layer while maintaining another unit layer composed of the outer edge portion and the deep layer portion on top of the unit layer.

By forming the deep layer portion after forming the outer edge portion, the film material applied at the time of forming the deep layer portion does not flow out to the outer side of the outer edge portion. Since the upper surface of the unit layer is recessed, when the outer edge portion is formed on the unit layer, the outflow amount of the film material to the outside can be reduced. Thus, even if the film is made thick, it is possible to suppress the gentle side of the film.

1 is a schematic view of a film forming apparatus according to an embodiment.
2 (a) is a perspective view of a nozzle unit including a nozzle head of the film forming apparatus according to the embodiment, and Fig. 2 (b) is a bottom view of the nozzle unit.
3 is a plan view of a stage and a nozzle unit of the film forming apparatus according to the embodiment.
4 (a) is a plan view showing a planar part of a region (coated region) to which a film material should be applied when forming a film, and Fig. 4 (b) Fig. 5 is a diagram showing a part of image data defining a shape. Fig.
5 (a) is a view showing a pixel to which a film material is to be applied at the time of forming an outer edge portion, and FIGS. 5 (b) to 5 (d) And a cross-sectional view of the substrate and the outer edge after formation.
6 (a) is a view showing a pixel to which a film material is to be applied in forming a deep layer portion, and Figs. 6 (b) to 6 (c) And a cross-sectional view of the substrate, the outer edge portion, and the deep portion after formation.
In Fig. 7, Figs. 7 (a) to 7 (d) are a step in the middle of the step of forming a film and a cross-sectional view of the substrate and the film after formation.
In Fig. 8, Figs. 8A to 8F are cross-sectional views of the substrate and the film in the middle step of the film formation for explaining the effect of the film formation method according to the embodiment.
In Fig. 9, Figs. 9A and 9B are cross-sectional views of a thick copper substrate in a step during manufacture to explain a method of manufacturing a thick copper substrate.

1 is a schematic view of a film forming apparatus according to an embodiment. A stage 12 is supported on a base 10 through a moving mechanism 11. [ defines an xyz orthogonal coordinate system in which the x- and y-axes are oriented horizontally and the z-axis is oriented vertically upward. The moving mechanism 11 is controlled by the control device 30 to move the stage 12 in the x direction and the y direction.

On the upper surface (support surface) of the stage 12, a substrate 50 on which a film is to be formed is supported. The substrate 50 is fixed to the stage 12 by, for example, a vacuum chuck. A nozzle head 20 is supported above the stage 12 so as to be movable up and down. The nozzle head 20 has a plurality of nozzle holes opposed to the substrate 50. A film material of photo-curability (for example, ultraviolet ray curable) is jetted from the respective nozzle holes toward the surface of the substrate 50 and is discharged. The ejection of the thin film material is controlled by the control device 30.

1 shows an example in which the nozzle head 20 is stopped with respect to the base 10 to move the base plate 50. Conversely, the base plate 50 is stopped with respect to the base 10, (20) may be moved. In this manner, one of the substrate 50 and the nozzle head 20 can be moved relative to the other.

2 (a) shows a perspective view of the nozzle unit 21 including the nozzle head 20. As shown in Fig. A plurality of, for example, two nozzle heads 20 are mounted on the base plate 22 in the y direction. Each of the nozzle heads 20 has a plurality of nozzle holes 23 arranged in the x direction. a curing light source 24 is mounted between two nozzle heads 20 adjacent to each other in the y direction and further outward than the nozzle heads 20 at both ends. The curing light source 24 irradiates curing light (e.g., ultraviolet light) to the film material applied to the substrate 50 (Fig. 1).

Fig. 2 (b) is a bottom view of the nozzle unit 21. Fig. Two nozzle heads 20 are arranged in the y direction. A curing light source 24 is disposed between the two nozzle heads 20 and further outside the nozzle head 20 at the outermost position. Each of the nozzle holes 23 of the nozzle head 20 is arranged in a staggered manner in the x direction. Paying attention to one nozzle head 20, as an example, the nozzle holes 23 are arranged at a pitch corresponding to 300 dpi in the x direction. One of the nozzle heads 20 is arranged to be shifted in the x direction by half the nozzle pitch with respect to the other nozzle head 20. Due to this, the nozzle holes 23 of the two nozzle heads 20 are arranged as a whole with a pitch corresponding to 600 dpi with respect to the x direction.

Fig. 3 shows a top view of the stage 12, the substrate 50, and the nozzle unit 21. And the substrate 50 is supported on the support surface of the stage 12. [ And the nozzle unit 21 is supported above the substrate 50. [ The nozzle head 20 and the curing light source 24 are mounted on the base plate 22 of the nozzle unit 21. [ The moving mechanism 11 is controlled by the controller 30 to move the stage 12 in the x direction and the y direction.

The control device 30 stores image data defining a plane shape of a film to be formed. The image data includes, for example, a plurality of pixels arranged in two dimensions. The control device (30) controls the ejection timing of the film material from the nozzle head (20) based on the image data.

The film material is ejected by ejecting the film material from the nozzle hole 23 (FIG. 2 (b)) while moving the substrate 50 in the y direction, . The film material applied to the substrate 50 is cured by the light emitted from the curing light source 24 located in front of the moving direction of the substrate 50. The process of dropletizing and discharging the film material from the nozzle hole 23 while moving the substrate 50 in the y direction will be referred to as " scanning of the substrate ". The substrate 50 is scanned four times by shifting the substrate 50 in the x direction by 1/4 of the interval corresponding to 600 dpi so that the film material can be applied to the substrate 50 at a resolution of 2,400 dpi with respect to the x direction have. In the scanning of the four substrates, the unidirectional scanning may be performed or the reciprocating scanning may be performed.

An area where the film material can be applied by scanning of four substrates is referred to as one path (pass). When the width of one path in the x direction is narrower than the dimension of the substrate 50 in the x direction, the surface of the substrate 50 is divided into a plurality of paths so that the film material can be applied over the entire area of the substrate 50 have.

When the resolution required for the film to be formed is 600 dpi, the processing of one path can be completed by scanning the substrate one time. Further, by using the nozzle head 20 having a nozzle pitch corresponding to 2400 dpi, it is possible to complete the processing of one path by scanning one substrate.

Fig. 4 (a) shows a planar portion of a region (coated region) to which a film material should be applied when a film is formed. On the surface of the substrate 50, a plurality of areas to be coated 52 extending in the y direction are defined. By applying a film material to the applied area 52 and curing it, a film is formed. However, the area to be coated 52 may be a stripe shape extending in the x direction or a stripe shape extending in the oblique direction with respect to the x direction and the y direction, or may be a stripe shape along the curve or a pseudo shape.

Fig. 4 (b) shows an example of image data defining the area to be coated 52. Fig. This image data is composed of a plurality of pixels 53 arranged in two dimensions (x direction and y direction). A plurality of pixels 53 are divided into a pixel to be coated with a film material and a pixel to be coated. In Fig. 4 (b), hatching is included in the pixel 53 to be coated with the film material. The area to be coated 52 is defined by the set of pixels 53 having hatching in FIG. 4 (b).

A film forming method according to the embodiment will be described with reference to Figs. 5 (a) to 7 (d). In the film forming method according to the embodiment, a film having a thickness of about 50 to 2 mm is formed by laminating unit layers having the same planar shape. This thickness belongs to a so-called " thick film ". In each step of forming the unit layer, the outer edge portion is first formed, and then the deep portion is formed. Figs. 5A to 6C show a step of forming one unit layer, and Figs. 5A to 5D show the steps of forming the outer edge portion And FIGS. 6 (a) to 6 (c) show steps of forming a deep layer portion. 7 (a) to 7 (d) show steps of forming a unit layer after the second layer.

Fig. 5 (a) shows a pixel 53a to be coated with a film material when forming the outer edge portion. In Fig. 5A, hatching is included in the pixel 53a to be coated. At the time of forming the outer edge portion, a row of pixels 53a along the edge of the area to be coated 52 is selected as an object to be coated. However, a plurality of adjacent pixels 53 may be selected as a coating target.

As shown in Fig. 5B, by scanning the substrate 50, the film material is applied and cured to the pixel 53a to be coated as shown in Fig. 5A. Thereby, a portion 55a of the lower layer of the outer edge portion is formed. The number of times of scanning of the substrate 50 is determined based on the pitch of the nozzle hole 23 (Fig. 2 (b)) and the pitch of the pixel 53a to be coated.

As shown in Fig. 5 (c), the film material is further coated on the portion 55a of the outer edge portion and cured to increase the portion 55a of the outer edge portion. The pixel 53a to be coated at the time of scanning of the substrate 50 shown in Fig. 5B and the pixel 53a to be coated at the time of scanning of the substrate 50 shown in Fig. same. That is, just above the portion 55a of the outer edge, a new film material is applied.

As shown in Fig. 5 (d), the scanning of the substrate 50 is further repeated to raise the portion 55a of the outer edge portion to form the outer edge portion 55 of the target height.

Fig. 6A shows a pixel 53b to which a film material is to be applied in forming a deep portion. In Fig. 6A, hatching is included in the pixel 53b to be coated. The pixel 53b on the inner side of the row of the pixel 53a to be coated at the time of forming the outer edge portion 55 is selected as an object to be coated.

As shown in Fig. 6B, by scanning the substrate 50, the film material is applied to the pixel 53b to be coated, which is shown in Fig. 6A, and is cured. Thereby, a portion 56a of the lower layer of the deep layer is formed. The number of times of scanning of the substrate 50 is determined based on the pitch of the nozzle hole 23 (Fig. 2 (b)) and the pitch of the pixel 53b to be coated.

As shown in Fig. 6 (c), the film material is further coated on the portion 56a of the deep portion and hardened, thereby thickening the portion 56a of the deep portion. The pixel 53b to be coated at the time of scanning of the substrate 50 shown in Fig. 6B and the pixel 53b to be coated at the time of scanning of the substrate 50 shown in Fig. same. By repeating the scanning of the substrate 50, the portion 56a of the deep portion is thickened to the target thickness, and the deep portion 56 is formed. The unit layer 57 is constituted by the outer edge portion 55 and the deep portion 56. The thickness of the deep layer portion 56 and the height of the outer edge portion 55 are adjusted so that the upper surface of the unit layer 57 is depressed. More specifically, the number of times of scanning of the substrate 50 at the time of forming the deep portion 56 is made smaller than the number of times of scanning of the substrate 50 at the time of forming the outer edge portion 55, ) Can be formed.

As shown in Fig. 7 (a), an outer edge portion 55 is further formed on the unit layer 57 of the first layer. The method of forming the outer edge portion 55 is the same as the method of forming the outer edge portion 55 of the first layer unit layer 57 shown in Figs. 5B to 5D. However, the height of the outer edge portion 55 may not be the same. That is, the number of scanning times of the substrate 50 when forming the outer edge portion 55 may not be the same.

As shown in Fig. 7 (b), the deep layer portion 56 of the second layer is formed on the first layer unit layer 57. The method of forming the deep layer portion 56 of the second layer is the same as the method of forming the deep layer portion 56 of the first layer unit layer 57 shown in Figs. 6B to 6C. However, the thickness of the deep portion 56 may not be the same. That is, the number of scanning times of the substrate 50 when forming the deep portion 56 may not be the same. Thereby, the unit layer 57 of the second layer made of the outer edge portion 55 and the deep layer portion 56 formed on the first unit layer 57 is formed. The upper surface of the unit layer 57 of the second layer is also covered. The thickness of the deep portion 56 of the second layer may be substantially equal to the height of the outer edge 55 of the second layer because the upper surface of the unit layer 57 of the first layer is recessed.

The outer layer portion 55 and the deep layer portion 56 of the third layer are formed on the unit layer 57 of the second layer to form the unit layer 57 of the third layer as shown in Fig. .

As shown in Fig. 7 (d), another unit layer 57 is laminated on the unit layer 57 already formed. At this time, the unit layer 57 is laminated while maintaining the upper surface of the uppermost unit layer 57 in a depressed state. After the plurality of unit layers 57 are stacked to the target height, the planarization layer 58 having a substantially planar upper surface is formed by filling the grooves on the upper surface of the uppermost unit layer 57 with the film material. By this process, a film 60 composed of a plurality of stacked unit layers 57 and a planarizing layer 58 is formed.

The effects of the above embodiment will be described with reference to Figs. 8 (a) to 8 (d). Fig. 8A shows the substrate 50 at the time when the formation of the deep layer portion 56 (Fig. 6B) of the first layer is started after the outer edge portion 55 of the first layer is formed, Fig.

Since the droplet of the film material applied to the surface of the substrate 50 is widened in the in-plane direction of the substrate 50, the width of the outer edge portion 55 becomes an object to be coated Is wider than the width of the pixel column made up of the pixel 53a (Fig. 5 (a)). The dropletized film material 61 applied to the outermost pixel 53b of the pixel 53b (FIG. 6 (a)) to be coated at the time of forming the deep portion 56 is the outer layer of the first layer And overlaps the inside of the area to be coated 52 with respect to the top of the outer edge part 55. In addition,

As shown in Fig. 8 (b), the film material 61 deposited on the inner side of the top of the outer edge portion 55 flows downward. That is, the film material 61 flows toward the inside of the area to be coated 52. The film material 61 hardly flows out to the side surface outside the outer edge portion 55.

6 (c)), the dropletized film material 61 is prevented from being peeled off from the top of the outer edge portion 55 even in the step of thickening the portion 56a of the deep portion as shown in Fig. 8 (c) . 8 (d), the film material 61 flows from the top of the outer edge portion 55 toward the inside of the region 52 to be coated.

6 (c)), the film material does not flow out to the side of the outside of the outer edge portion 55, as described above. This can suppress the slope of the side surface of the film 60 (Fig. 7 (d)) from becoming gentle.

8 (e), in the step of laminating the unit layer 57, the outer edge portion 55 of the uppermost unit layer 57 at the present time, The film material 61 for forming the film 55 is landed. The film material 61 for forming the outer edge portion 55 is formed to extend from the top of the outer edge portion 55 below the outer edge portion 55 as shown in Figure 8 (f) Not only the outer side but also the inner side. In the case where the upper surface of the unit layer 57 is not dented, most of the applied film material flows outward when the outer edge portion is formed thereon. 7 (a)), the film 60 (Fig. 7 (d)) is formed even when the outer edge portion 55 (Fig. 7 Can be reduced. Thereby, it is possible to suppress the slope of the side surface of the film 60 (Fig. 7 (d)) from becoming gentle.

A method of manufacturing a thick copper substrate using the film 60 (FIG. 7 (d)) formed by the method according to the above embodiment will be described with reference to FIGS. 9 (a) and 9 (b)

9A, the film 60 is formed on the surface of the substrate 50 in a region other than the region 63 where the thick copper is disposed, by the method according to the above-described embodiment. As shown in FIG. 9 (b), copper is filled in the region 63 where the film 60 is not formed, thereby forming the thick copper 64.

In the above embodiment, by laminating the unit layer 57 (Fig. 7 (d)), the film 60 can be thickened to about 50 m to 2 mm. As a result, a thick copper 64 having a thickness of about 50 to 2 mm can be formed. In addition, since the inclination of the side surface of the film 60 can be made steep, the cross-sectional area of the thick copper 64 can be increased. Thereby, a thick copper 64 suitable for a purpose of flowing a large current is obtained.

While the present invention has been described with reference to the above embodiments, the present invention is not limited thereto. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like are possible.

10 Expectations
11 Moving mechanism
12 stages
20 nozzle head
21 nozzle unit
22 base plate
23 nozzle hole
24 Light source for curing
30 control device
50 substrate
52 Application area
53 pixels
53a < / RTI >
53b The pixel to be coated at the time of forming the deep-
55 Outer part
55a A portion of the outer margin
56 Deep part
56a part of the deep
57 unit layer
58 planarization layer
60 membrane
61 Membrane material
63 Area to place thick copper
64 thick copper

Claims (6)

The film material is applied by dropletization along the edge of the area to be coated to which the film material on the surface of the substrate is to be applied and is cured to form the outer edge portion first and then the film material is dropletized on the inner side of the outer edge portion A step of forming a deep layer portion by applying and curing the outer layer portion to form a unit layer formed by the outer edge portion and the deep layer portion and the outer edge portion being formed higher than the deep portion portion,
Further comprising the step of laminating on the unit layer a different unit layer consisting of the outer edge portion and the deep layer portion while maintaining the shape of the top surface of the uppermost unit layer being depressed. The method according to claim 1,
The step of forming the outer edge of one of the unit layers includes the step of forming a part of the outer periphery by applying and hardening the film material along the edge of the area to be coated to form a part of the outer periphery, Wherein the film material is subjected to droplet application and curing to raise a portion of the outer edge portion to form the outer edge portion. 3. The method of claim 2,
Wherein the shape of the area to be coated is defined by image data composed of a plurality of pixels,
Wherein a portion of the outer edge portion is made to be higher by applying the film material to a portion of the outer edge portion with the same pixel as that of the pixel to which the film material is applied when forming a portion of the lower outer edge portion / RTI > A stage for supporting the substrate,
A nozzle head having a plurality of nozzle holes for ejecting a photo-curable film material by droplet ejection, the nozzle head being opposed to the substrate supported on the stage,
A light source for irradiating the film material coated on the substrate with curing light;
A moving mechanism for relatively moving the substrate relative to the nozzle head and the light source,
And a control device for controlling the nozzle head and the moving mechanism,
Wherein the control device controls the nozzle head and the moving mechanism,
The film material is applied by dropletization along the edge of the substrate to be coated on the surface of the substrate and cured to form the outer edge portion first and then the film material is dripped on the inner side of the outer edge portion to be applied and cured Wherein the outer layer is formed to have a height higher than the depth of the outer layer and the upper layer is formed on the outer layer,
And the other unit layer including the outer edge portion and the deep layer portion is formed on the unit layer while maintaining the shape of the top surface of the uppermost unit layer being depressed. 5. The method of claim 4,
The control device controls the nozzle head and the moving mechanism to form the outer periphery of one of the unit layers by applying droplets of the film material along the edge of the area to be coated and applying and curing Wherein the outer periphery is formed by forming a part of the outer periphery and further applying a liquid material on the part of the outer periphery and applying and hardening the film material to heighten a part of the outer periphery. 6. The method of claim 5,
Wherein the control device stores the shape of the area to be coated defined by image data composed of a plurality of pixels,
Wherein a portion of the outer edge portion is made to be higher by applying the film material to a portion of the outer edge portion with the same pixel as that of the pixel to which the film material is applied when forming a portion of the lower outer edge portion Forming device.

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