TW201615780A - Composition and disassembling method - Google Patents

Abstract

Provided is a composition which has excellent heat resistance and low outgas properties. A composition which contains components (A)-(D) described below and has a mass ratio (A)/(C) of from 3/1 to 8/1. (A) a polyfunctional (meth)acrylate such as a diene-based (meth)acrylate (B) (B1) a phenoxy (poly)alkylene oxide (meth)acrylate having an alkylene oxide chain and/or (B2) an alkyl (meth)acrylate having an alkyl group with 8-20 carbon atoms (C) a polyfunctional (meth)acrylate such as pentaerythritol tri(meth)acrylate (D) a radical photopolymerization initiator.

Description

Composition and disintegration method

The present invention is directed to a composition. The present invention relates to a (meth)acrylic resin composition, for example. Moreover, the present invention relates to an adhesive, a covering agent, and an easily disintegrable composition. Further, the present invention relates to a method of disintegration of a composite.

Conventionally, in the production of various electronic components, optical components, and optical devices, a photocurable resin composition such as ultraviolet curable or visible light curable has been used. The form to be used is various forms such as adhesion, infusion, coating, sealing, and molding. The composition to be used is known as a (meth)acrylic, epoxy, oxetane, polyethylene, polyene/polythiol system. In particular, (meth)acrylic acid is used, and a urethane (meth)acrylate type, an epoxy (meth)acrylate type, a polyester (meth)acrylate type, etc. are used depending on the use. In addition, when it is limited to the bonding of an optical component or an optical device, a (meth)acrylic-type and a polyene/polythiol type, such as a urethane (meth)acrylate type, are used.

However, in recent years, with the development of the high functionality of optical components or optical devices, the performance and quality required for the photocurable resin composition are various and required to be high, and the previous photocurable resin composition gradually becomes insufficient. Therefore, the status quo is conducting various studies. The properties and qualities required for the photocurable resin composition include, for example, viscosity suitable for use, low odor, low outgassing, high transparency, high adhesion, and high heat resistance.

In recent years, particularly necessary properties are listed as heat resistance at the time of production. For example, in the surface treatment or partial coating of an optical component or an optical device, a vapor deposition treatment such as a high temperature exceeding 200 ° C or a high-temperature burn-coating may be performed. In addition, in addition to IC (Integrated Circuit), electronic components such as resistors and inductors, optical components such as image sensors are also applied to the surface mounting of circuit boards. In this case, high-temperature reflow is required. In recent years, especially with the lead-free solder, the temperature conditions for reflow have become strict. In such a production step, in order to improve the quality of the optical component or the optical device, or to improve productivity or production yield, it is required that the use portion of the photocurable resin composition is sufficiently resistant to high-temperature heat treatment. For example, it is necessary to prevent peeling, foaming, cracking, discoloration, and the like from occurring in the high-temperature heat treatment.

In addition, there is a case where localized contamination of parts and devices occurs due to outgas generated during the high-temperature heat treatment, or the characteristics of parts and devices are degraded due to the post-manufacturing step or the outgas generated during use. In particular, with the miniaturization and precision of optical components and optical devices in recent years, the problem of degraded characteristics caused by outgassing has become remarkable.

In view of this status quo, it is revealed that there is a heat resistance and low gas release property. The photocurable acrylic adhesive is a polybutadiene compound, a monofunctional (meth) acrylate having an alicyclic group or a chain aliphatic group, and a monofunctional group having a hydroxyl group and/or a cyclic ether bond. The (meth) acrylate and the monofunctional acrylamide compound are used, and it is difficult to provide sufficient heat resistance and low outgassing property (see Patent Document 1). Patent Document 1 does not disclose the knowledge of the component (C) of the present invention to be described later, and the components (A) and (C) of the present invention described below are not described or suggested to be (A)/(C). The mass ratio is set to (3~8)/1.

In addition, the heat-resistant adhesive is a polyimide-based adhesive which is excellent in peeling strength. However, since it is heat-hardened, it takes time to harden, and productivity is inferior (refer patent document 2).

Further, there is disclosed a two-liquid main-type heat-resistant acrylic adhesive comprising methacrylic acid, isodecyl (meth)acrylate, and a liquid rubber having a polymerizable unsaturated double bond at the end, but heat resistance It is difficult to say that the low outgassing property is sufficient (refer to Patent Document 3).

Further, there is disclosed an energy ray-curable resin composition characterized in that the main chain skeleton is at least one selected from the group consisting of polybutadiene, polyisoprene, and the hydrides thereof, and a terminal end or side chain of the main chain skeleton having at least one (meth)acryl fluorenyl group and having a molecular weight of 500 to 5000 (meth) acrylate; and a monomer having an unsaturated hydrocarbon group having 2 to 8 carbon atoms via an ester bond Functional (meth) acrylate; hydroxyl-containing (A) Acrylate; polyfunctional (meth) acrylate; photopolymerization initiator; and antioxidant, but there is no description about heat resistance (see Patent Document 4). Further, Patent Document 4 does not describe the component (B) of the present invention to be described later.

Further, there is disclosed an adhesive composition comprising a polyfunctional (meth) acrylate, a monofunctional (meth) acrylate, and a photopolymerization initiator, and a glass transition of the hardened body obtained from the adhesive composition The temperature is -50 ° C to 40 ° C, but it is not described that the glass transition temperature of the hardened body is increased and sufficient heat resistance is obtained (refer to Patent Document 5). In Patent Document 5, the components (A) and (C) of the present invention described later are not described or suggested to have a mass ratio of (A)/(C) of (3-8)/1.

Further, a (meth)acrylic resin composition containing a polyfunctional (meth) acrylate and having a heating mass reduction rate of 15 masses when heated at a temperature rising rate of 10 ° C/min from 30 ° C at 250 ° C under a nitrogen gas flow rate is disclosed. In the case of the photopolymerization initiator of the present invention, the glass transition temperature of the cured product obtained from the composition is 250 ° C or higher, but the component (B) of the present invention to be described later is not described (see Patent Document 6). As will be described later, the present invention finds a design that withstands the expansion and contraction of the adherend, for example, in a high-temperature reliability test.

Further, a (meth)acrylic resin composition containing 100 parts by mass of a (meth) acrylate and 25 parts by mass to 100 parts by mass of a photopolymerization initiator is disclosed, but heat resistance is not described (refer to the patent literature). 7). In Patent Document 7, it is not suggested that all of the component (A), the component (B), and the component (C) are blended, and the blending ratio of the component (A) and the component (C) of the present invention is not implied.

Further, a method for disassembling a bonding body is disclosed, comprising the step of irradiating the following bonding body with excimer light having a center wavelength of 1 nm to 300 nm, and at least one substrate is transparent to the excimer light, and the foregoing system is The base material is bonded to each other by using an adhesive composition containing one or more kinds of (meth) acrylate groups having one or more (meth) acrylonitrile groups, and the adhesive composition is cured to form However, there is no suggestion that all of the components (A), (B) and (C) are blended, and the blending ratio of the component (A) and the component (C) of the present invention is not implied (see Patent Document 8). In the present invention, peeling can be performed even if excimer light having high energy is not used in the peeling method.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2006-342222

Patent Document 2: Japanese Patent No. 3014526

Patent Document 3: Japanese Patent No. 3934701

Patent Document 4: International Publication No. 2006/129678

Patent Document 5: International Publication No. 2008/018252

Patent Document 6: International Publication No. 2011/049138

Patent Document 7: Japanese Patent Laid-Open Publication No. 2010-248353

Patent Document 8: International Publication No. 2011/158654

In order to solve the problem of improving heat resistance and outgassing, for example, the present invention has been studied in various ways, and as a result, it has been completed.

One aspect of the present invention is a composition comprising the following (A) to (D), and the mass ratio of (A)/(C) is (3-8)/1.

(A) is selected from the group consisting of a diene-based (meth) acrylate, a polyester urethane (meth) acrylate, and a polyether urethane (meth) acrylate. 1 or more polyfunctional (meth) acrylates; (B) (B1) phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain and/or (B2) having carbon a (meth)acrylic acid alkyl ester having 8 to 20 alkyl groups; (C) selected from 1,3-adamantyl dimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate , iso-cyanuric acid ethylene oxide modified di(meth)acrylate, iso-cyanuric acid ethylene oxide modified tri(meth)acrylate, neopentyl alcohol tri(meth)acrylate , neopentyl alcohol tetra (meth) acrylate, dimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate One or more polyfunctional (methyl) groups of esters Acrylate; (D) photoradical polymerization initiator.

In one embodiment of the composition of the present invention, (B) is (B1) a phenoxy (poly)alkylene oxide (meth)acrylate having an alkylene oxide chain.

In another embodiment of the composition of the present invention, (B) is (B2) an alkyl (meth)acrylate having an alkyl group having 8 to 20 carbon atoms.

In another embodiment of the composition of the present invention, (A) 45 parts by mass to 75 parts by mass, and (B) 10 parts by mass to 50% by mass of 100 parts by mass of (A) to (C). Parts, (C) 1 part by mass to 20 parts by mass.

In another embodiment of the composition of the present invention, the amount of the (D) photoradical polymerization initiator used is 0.01 parts by mass to 5 parts by mass based on 100 parts by mass of the total of (A) to (C). .

In another embodiment of the composition of the present invention, the (D) photoradical polymerization initiator is selected from the group consisting of 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionamidine). -benzyl]-phenyl}-2-methyl-propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butanone-1 2-Dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, bis(2,4, 6-trimethyl benzhydryl)phenylphosphine oxide, 2,4,6-trimethylbenzylidene Phenylphosphine oxide, oxy-phenyl-acetic acid 2-[2-oxy-2-phenyl-ethoxycarbonyl-ethoxy]-ethyl ester, oxy-phenyl-acetic acid 2-[2- One or more of the group consisting of hydroxy-ethoxy]-ethyl ester.

In another embodiment of the composition of the present invention, the (D) photoradical polymerization initiator is heated from 30 ° C to 250 ° C at a temperature increase rate of 10 ° C / min under a nitrogen stream, and the heating mass reduction rate is 15% by mass. the following.

In another embodiment of the composition of the present invention, the (D) photoradical polymerization initiator is heated from 30 ° C to 250 ° C at a temperature increase rate of 10 ° C / min under a nitrogen stream, and the heating mass reduction rate is 50% by mass. the above.

In another embodiment of the composition of the present invention, the polymerization inhibitor is further contained.

In another embodiment of the composition of the present invention, the infrared absorbing agent is further contained.

Another aspect of the invention is an adhesive comprising the composition of the invention.

Another aspect of the invention is a covering agent comprising the composition of the invention.

Another aspect of the present invention is an easily disintegrable composition of the present invention.

Another aspect of the present invention is a composite obtained by adhering or covering a substrate to a substrate using the composition of the present invention.

Another aspect of the present invention is a method of producing a composite comprising using a composition of the present invention to adhere or cover a substrate to each other.

In one embodiment of the method for producing a composite of the present invention, the composition of the present invention is irradiated with visible light or ultraviolet light to adhere the substrate to each other or to cover the substrate.

Another aspect of the present invention is a method of disintegrating a binder, comprising: bonding a substrate to each other using the composition of the present invention, and then peeling off the obtained laminate.

In one embodiment of the method for disassembling the adherend of the present invention, the obtained extrudate is peeled off by applying an external force.

In one embodiment of the method for disassembling the adherend of the present invention, the peeling of the adherend obtained by irradiating visible light or ultraviolet light is included.

In one embodiment of the method of disintegration of the covering of the present invention, the coated body is peeled off after covering the substrate with the composition of the present invention.

In one embodiment of the method for dissolving the covering of the present invention, the composition is peeled off from the obtained covering by applying an external force.

In one embodiment of the method of disintegrating the covering of the present invention, the covering is obtained by peeling off the composition from a cover obtained by irradiating visible light or ultraviolet rays.

According to the composition of the present invention, a cured product excellent in heat resistance and low outgassing property can be obtained.

The component (A) is selected from the group consisting of a diene (meth) acrylate, a polyester urethane (meth) acrylate, and a polyether urethane (meth) acrylate. One or more polyfunctional (meth) acrylates. The component (A) is exemplified by two or more (meth)acrylonitrile groups at the oligomer/polymer terminal or side chain. A (meth) acrylate oligomer/polymer. The polyfunctional (meth) acrylate means a compound having two or more (meth) acrylonitrile groups.

The diene (meth) acrylate means a (meth) acrylate having a diene skeleton. Examples of the diene-based (meth) acrylate include 1,2-polybutadiene terminal urethane (meth) acrylate (for example, "TE-2000" manufactured by Nippon Soda Co., Ltd., "TEA- 1000"), polyisoprene terminal (meth) acrylate, maleic anhydride adduct of isoprene polymer and esterified oligomer of 2-hydroxyethyl (meth) acrylate ( For example, "UC-203" and "UC-102" manufactured by Kuraray Co., Ltd., etc.). Among the diene (meth) acrylates, preferred are 1,2-polybutadiene terminal urethane (meth) acrylates, and maleic anhydride addition of isoprene polymers. One or more of the group consisting of esterified oligomers of 2-hydroxyalkyl (meth)acrylate.

The polyester urethane (meth) acrylate means a (meth) acrylate having a polyester skeleton. Examples of the polyester urethane (meth) acrylate include "UV-2000B", "UV-3000B", "UV-7000B" manufactured by Nippon Synthetic Co., Ltd., and "KHP-" manufactured by Kokusai Industrial Co., Ltd. 11", "KHP-17", etc. The polyether urethane (meth) acrylate means a (meth) acrylate having a polyether skeleton.

Examples of the polyether urethane (meth) acrylate include "UV-3700B" and "UV-6100B" manufactured by Nippon Synthetic Co., Ltd., and the like. Among the components (A), a diene-based (meth) acrylate is preferred because the effect is preferred.

The 1,2-polybutadiene terminal urethane (meth) acrylate is preferably represented by the following formula (1).

(wherein R' represents a hydrogen atom or a methyl group, and n represents a positive integer)

The esterified oligomer of the maleic anhydride adduct of the isoprene polymer and the 2-hydroxyalkyl (meth)acrylate is preferably represented by the following formula (2).

(wherein R represents a hydrogen atom or a methyl group, and Y represents an alkylene group. m and n are arbitrary positive integers, and n is preferably 1 to 10)

Here, the urethane (meth) acrylate means a polyol compound (hereinafter referred to as X), a polyisocyanate compound (hereinafter referred to as Y), and a (meth)acrylic acid hydroxy ester (hereinafter referred to as Z). A urethane (meth) acrylate having a urethane bond in a molecule obtained by carrying out a reaction (for example, a polycondensation reaction).

Examples of the polyol compound (X) include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, and 1,4. -butanediol, polytetramethylene glycol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5 - pentanediol, 2,4-diethyl-1,5-pentanediol, 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylolethane, trimethylolpropane, polytrimethylolpropane, neopentyl alcohol, poly new Polyols such as pentaerythritol, sorbitol, mannitol, glycerol, polyglycerol, polytetramethylene glycol; or polyethylene oxide, polypropylene oxide, ethylene oxide/epoxy a polyether polyol of at least one structure of a block of propane or a random copolymerization; the aforementioned polyol or polyether polyol with maleic anhydride, maleic acid, fumaric acid, and itaconic anhydride, Polyester polyols of condensates of polyacids such as itaconic acid, adipic acid, and isophthalic acid; caprolactone-modified polyols such as caprolactone-modified polytetramethylene polyol; polyolefin-based polyols Polycarbonate-based polyol; polydiene polyol such as polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol; polydimethylene A polyoxyl polyol such as a oxyalkylene polyol or the like. In the above, one or more of the group consisting of a polydiene polyol, a polyether polyol, and a polyester polyol is preferable, and a polydiene polyol is more preferable. Among the polydiene polyols, polybutadiene polyols are preferred.

Here, the polyol compound (X) used as the 1,2-polybutadiene terminal urethane (meth) acrylate can be, for example, a polybutadiene polyol as a polyester amine. The polyol compound (X) used for the carbamic acid ester (meth) acrylate can be, for example, a polyester polyol, and a polyol compound used as a polyether urethane (meth) acrylate. (X) can be, for example, a polyether polyol.

The polyisocyanate compound (Y) is not particularly limited, and for example, an aromatic, aliphatic or alicyclic polyisocyanate can be used. Among them, toluene diisocyanate (TDI) and diphenylmethane diisocyanate are suitably used. Acid ester (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (natural MDI), modified diphenylmethane diisocyanate (modified MDI), hydrogenated xylene diisocyanate ( H-XDI), xylene diisocyanate (XDI), hexamethylene diisocyanate (HMDI), trimethylhexamethylene diisocyanate (TMXDI), tetramethyl xylene diisocyanate (m-TMXDI), different a polyisocyanate such as phorone diisocyanate (IPDI), norbornene diisocyanate (NBDI), 1,3-bis(isocyanatemethyl)cyclohexane (H6XDI) or a terpolymer compound of such polyisocyanates; A reaction product of a polyisocyanate and a polyhydric alcohol. Among these, it is preferably one or more selected from the group consisting of toluene diisocyanate (TDI), hydrogenated xylene diisocyanate (H-XDI), and isophorone diisocyanate (IPDI), more preferably toluene diisocyanate. (TDI).

Examples of the (meth)acrylic acid hydroxyester (Z) include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. Hydroxyalkyl (meth) acrylate such as 4-hydroxybutyl methacrylate; 2-hydroxyethyl (meth) acryloyl phthalate, 2-(methyl) propylene methoxyethyl phthalate 2-hydroxypropyl ester, glycerol di(meth) acrylate, 2-hydroxy-3-(methyl) propylene methoxy propyl (meth) acrylate, caprolactone modified (meth) acrylate 2 - hydroxyethyl ester, neopentyl alcohol tri(meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone modified 2-hydroxyethyl (meth) acrylate, and the like. Among these, a hydroxyalkyl (meth)acrylate is preferred. (methyl) The hydroxyalkyl acrylate is preferably one or more selected from the group consisting of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. More preferably, it is 2-hydroxyethyl (meth)acrylate.

The number average molecular weight of the component (A) is preferably from 4,000 to 60,000, more preferably from 5,000 to 40,000. The number average molecular weight is a solvent using tetrahydrofuran under the following conditions, and a GPC (Gel Permeation Chromatography) system (SC-8010 manufactured by Tosoh Corporation) or the like is used, and a commercially available standard is used. Polystyrene was prepared by making a calibration curve. The measurement conditions used in the experimental examples are shown below.

Flow rate: 1.0 ml/min.

Set temperature: 40 °C.

Pipe column configuration: "TSK guardcolumn MP (×L)" manufactured by Hokusto Co., Ltd., one piece of 6.0 mm ID × 4.0 cm, and "TSK-GELMULTIPOREHXL-M" manufactured by Hokusto Co., Ltd. 7.8 mmID × 30.0 cm (the number of theoretical stages is 2 of the 16,000 paragraphs, a total of 3 (the total theoretical number of segments is 32,000).

Sample injection amount: 100 μl (sample solution concentration: 1 mg/ml).

Feeding pressure: 39 kg/cm ² .

Detector: RI detector.

(A) contains a diene (meth) acrylate, a polyester urethane (meth) acrylate, and a polyether urethane (meth) propylene The total amount of the polyfunctional (meth) acrylate used in the group consisting of the acid esters is preferably 45 mass% in a total amount of 100 parts by mass of (A) to (C). The fraction is -75 parts by mass, more preferably 50 parts by mass to 70 parts by mass. When it is 45 parts by mass or more, good heat resistance can be obtained, and if it is 75 parts by mass or less, good curability can be obtained.

The component (B) is (B1) a phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain and/or (B2) a (meth)acrylic acid having an alkyl group having 8 to 20 carbon atoms. Alkyl ester. As the component (B), a monofunctional (meth) acrylate is preferred. Monofunctional (meth) acrylate means a compound having one (meth) acryl fluorenyl group.

The (B1) phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain is preferably a (meth) acrylate of the following formula (3). Where n represents a positive integer.

R ¹ represents a hydrogen atom or a methyl group, preferably a hydrogen atom. R ² represents an alkylene group, preferably an alkylene group having 2 to 3 carbon atoms, most preferably an ethyl group having a carbon number of 2. R ³ represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 20 carbon atoms, still more preferably an alkyl group having 6 to 12 carbon atoms, most preferably Good for the carbon number 9 sulfhydryl. n is preferably from 1 to 15, more preferably from 1 to 3, most preferably 1. These (meth)acrylates may be used alone or in combination of two or more. R ^{3 is} preferably a saturated aliphatic hydrocarbon group.

Examples of the (meth) acrylate in which (B1) R ³ is a fluorenyl group include nonyl phenol ethylene oxide modified (meth) acrylate and nonyl phenol (ethylene oxide 4 molar modified). (Meth) acrylate, nonylphenol (ethylene oxide 8 molar modified) (meth) acrylate, nonyl phenol (propylene oxide 2.5 molar modified) (meth) acrylate, and the like.

As the (B2) alkyl (meth)acrylate having an alkyl group having 8 to 20 carbon atoms, a (meth) acrylate of the following formula (4) is preferred.

Formula (4) ZOR ⁴

Z represents a (meth) acrylonitrile group. R ⁴ represents a linear or branched alkyl group having 8 to 20 carbon atoms, more preferably an alkyl group having 10 to 16 carbon atoms, more preferably an alkyl group having 11 to 14 carbon atoms, most preferably a carbon number of 12 alkyl. These (meth)acrylates may be used alone or in combination of two or more. R ^{4 is} preferably a saturated aliphatic hydrocarbon group.

Examples of the (B2) alkyl (meth)acrylate having an alkyl group having 8 to 20 carbon atoms include octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and (meth)acrylic acid. Anthracene ester, isodecyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (methyl) propyl Stearyl enoate, isostearyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, (meth) acrylate Pentaalkyl ester, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, pentadecanyl (meth) acrylate, (meth) acrylate A (meth) acrylate having a linear or branched alkyl group such as a decamethyl ester.

(B) (B1) phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain and/or (B2) alkyl (meth) acrylate having an alkyl group having 8 to 20 carbon atoms The total amount of the monofunctional (meth) acrylate used is preferably 10 parts by mass to 50 parts by mass, more preferably 20 parts by mass, per 100 parts by mass of the total of (A) to (C). 45 parts by mass. When it is 10 parts by mass or more, good curability is obtained, and when it is 50 parts by mass or less, there is no possibility of deterioration in heat resistance.

The component (C) is selected from the group consisting of 1,3-adamantyl dimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, and iso-cyanuric acid ethylene oxide modified di(II) Methyl) acrylate, iso-cyanuric acid ethylene oxide modified tri(meth) acrylate, neopentyl alcohol tri (meth) acrylate, neopentyl alcohol tetra (meth) acrylate, two One or more of a group consisting of methylolpropane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate Functional (meth) acrylate. Among these, it is preferably selected from the group consisting of 1,3-adamantyl dimethanol di(meth)acrylate and pentaerythritol tri(meth)acrylic acid. One or more selected from the group consisting of esters and pentaerythritol tetra(meth)acrylate, more preferably selected from neopentyl alcohol tri(meth)acrylate and pentaerythritol tetra(meth)acrylic acid. One or more of the group consisting of esters is preferably a combination of pentaerythritol tri(meth)acrylate and pentaerythritol tetra(meth)acrylate. When pentaerythritol tri(meth)acrylate and neopentyltetrakis(meth)acrylate are used together, pentaerythritol tri(meth)acrylate and neopentyltetrakis(meth)acrylate The content ratio is preferably 100 parts by mass of neopentyl alcohol tris(meth)acrylate and neopentyl alcohol tetra(meth)acrylate, and is a mass ratio of neopentyl alcohol tris(methyl). Acrylate: neopentyl alcohol tetra (meth) acrylate = 40 ~ 80: 20 ~ 60, more preferably 50 ~ 70: 30 ~ 50.

The total amount of the components (C) is preferably from 1 part by mass to 20 parts by mass, more preferably from 2 parts by mass to 15 parts by mass, per 100 parts by mass of the total of (A) to (C). When it is 1 part by mass or more, good peelability can be obtained, and if it is 20 parts by mass or less, there is no possibility of deterioration in heat resistance.

In the present invention, the quality of (A)/(C) is preferably (3~8)/1, more preferably (4~7)/1, and even more preferably (5~6.8)/1, and the best is (5.5~6.5)/1. When the mass ratio of (A)/(C) is 3/1 or more, heat resistance is obtained. When the mass ratio of (A)/(C) is 8/1 or less, it has peelability.

(D) The photopolymerization initiator is a photoradical polymerization initiator. In the case of heat resistance and low outgassing property, when the photopolymerization initiator is heated from 30 ° C to 250 ° C at a temperature increase rate of 10 ° C /min under a nitrogen gas flow, the heating mass reduction rate is preferably 15% by mass or less, more preferably It is 8 mass% or less, and most preferably 6% by mass or less. In terms of economy, the heating mass reduction rate is preferably 0.1% by mass or more, and more preferably 4% by mass or more.

The (D) photopolymerization initiator which is a heating mass reduction rate of 15% by mass or less is preferably 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propenyl) -benzyl]-phenyl}-2-methyl-propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butanone-1, 2 -Dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, bis(2,4,6- Trimethyl benzhydryl)phenylphosphine oxide, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, oxy-phenyl-acetic acid 2-[2-oxy-2-benzene One or two or more of the group consisting of ketoethoxy-ethoxy]-ethyl ester and oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]-ethyl ester. One or two or more of these may be used.

Among these, in terms of heat resistance and low outgassing property, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butanone-1, 2-di is more preferred. Methylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, bis(2,4,6-trimethyl) One or more of the group consisting of phenyl benzhydryl)phenylphosphine oxide and 2,4,6-trimethylbenzhydryldiphenylphosphine oxide Is 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one.

Further, regarding the heating mass reduction rate of the photopolymerization initiator caused by the heating, for example, a photopolymerization initiator can be heated from a temperature of 30 ° C to a temperature increase rate of 10 ° C / min under a nitrogen gas flow to a temperature At 250 ° C, the mass reduction rate (% by mass) of the mass of the photopolymerization initiator at 250 ° C to 30 ° C is expressed.

(D) The amount of use of the photopolymerization initiator is preferably from 0.01 part by mass to 5 parts by mass based on 100 parts by mass of the total of (A) to (C). When it is 0.01 part by mass or more, sufficient curability is obtained, and when it is 5 parts by mass or less, it is excellent in low outgassing property and heat resistance. The curability, low outgassing property, and heat resistance are preferably 0.02 parts by mass to 3 parts by mass, more preferably 0.03 parts by mass to 2 parts by mass.

When the photopolymerization initiator was heated from a temperature of 30 ° C to 250 ° C under a nitrogen gas flow at a temperature increase rate of 10 ° C /min, the photopolymerization initiation caused by heating at 250 ° C with respect to the mass of the photopolymerization initiator at 30 ° C The mass reduction rate of the agent is preferably 15% by mass or less. When it is 15% by mass or less, it is excellent in low outgassing property and heat resistance. When the mass reduction rate of the photopolymerization initiator is 15% by mass or less, the mass reduction rate is 15% by mass or less (D) the amount of the photopolymerization initiator used, and the total amount of (A) to (C) 100 quality The portion is preferably 0.02 parts by mass to 3 parts by mass, more preferably 0.03 parts by mass to 0.7 parts by mass.

However, even when the photopolymerization initiator was heated from 30 ° C to 250 ° C at a temperature increase rate of 10 ° C / min under a nitrogen stream, even at a temperature of 30 ° C, the quality of the photopolymerization initiator was caused by heating at 250 ° C. When the mass reduction rate of the photopolymerization initiator is more than 15% by mass, or more preferably 50% by mass or more, it can be applied to the composition of the present invention. The amount of the (D) photopolymerization initiator to be used in the mass reduction rate of 50% by mass or more is preferably 0.01 parts by mass to 3 parts by mass, based on 100 parts by mass of the total of (A) to (C). Preferably, it is 0.8 parts by mass to 2 parts by mass. Examples of the photopolymerization initiator of more than 15% by mass include 1-hydroxycyclohexyl phenyl ketone or diphenylethylenedione dimethyl ketal.

In order to improve the storage stability of the composition of the present invention, a polymerization inhibitor can be used. Examples of the polymerization inhibitor include methyl hydroquinone, hydroquinone, 2,2-methylene-bis(4-methyl-6-tert-butylphenol), catechol, and Hydroquinone monomethyl ether, mono-tert-butyl hydroquinone, 2,5-di-t-butyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5 - di-tert-butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tert-butyl catechol, 2-butyl-4-hydroxyanisole and 2,6-di-third Base-p-cresol and the like. Among these, 2,2-methylene-bis(4-methyl-6-tert-butylphenol) is preferred. One or two or more of these may be used.

The amount of the polymerization inhibitor to be used is preferably 0.001 part by mass to 3 parts by mass, more preferably 0.01 part by mass to 1 part by mass, per 100 parts by mass of the total of (A) to (C). When it is 0.001 part by mass or more, storage stability can be ensured, and if it is 3 parts by mass or less, good adhesion can be obtained and uncured.

The composition of the present invention can be used in order to improve the peeling property by irradiation of light having a wavelength of 750 nm or more and 2000 nm or less, and an infrared ray absorbing agent can be used. As the infrared absorbing agent, a monomer or a compound having a strong absorption in the range of 750 nm to 2000 nm is usually used. Examples of the above include inorganic pigments such as carbon black, graphite, copper chromite, and chromium oxide; and pigments such as polyphthalocyanine compounds, cyanine dyes, croconium pigments, and metal thiolate pigments. Classes, etc. One or two or more of these may be used. Among these, carbon black is preferred in terms of improving heat resistance. Among the carbon blacks, acetylene black is preferred.

The amount of the infrared absorbing agent used is preferably 0.001 parts by mass to 3 parts by mass, more preferably 0.1 parts by mass to 1 part by mass, per 100 parts by mass of the total of (A) to (C). When the amount is 0.001 parts by mass or more, the peeling property by light having a wavelength of 750 nm or more and 2000 nm or less is improved, and when it is 3 parts by mass or less, good adhesion is obtained and uncured.

The composition of the present invention may also be used in various elastomers, inorganic fillers, such as acrylic rubber, urethane rubber, acrylonitrile-butadiene-styrene rubber, and the like, which are generally used within the scope of the object of the present invention. One or more of a solvent, a bulk material, a reinforcing material, a plasticizer, a tackifier, a dye, a pigment, a flame retardant, a decane coupling agent, and a surfactant.

In an embodiment of the composition of the present invention, the total mass ratio of (A) to (D) in the entire composition can be made 90% by mass or more from the viewpoint of the effect of the present invention. The amount is preferably 95% by mass or more, more preferably 98% by mass or more, and still more preferably 99% by mass or more, and for example, 90% by mass to 99.9% by mass.

The composition of the present invention can be used as an adhesive or a covering agent. The composition of the present invention can be used as a composition of a readily disintegrable (meth)acrylic resin. When using the present invention is easy disintegration of acrylic (meth) Next the base resin composition from each other, preferably to a value of 1mJ / cm ² ~ 8000mJ / cm irradiated with visible light or ultraviolet energy in the range of ² of the 365nm wavelength . When the energy value is 1 mJ/cm ² or more, sufficient adhesiveness can be obtained, and when it is 8000 mJ/cm ² or less, productivity is excellent, and decomposition products are not easily generated from the photopolymerization initiator, and generation of outgassing can be suppressed. . In terms of productivity, adhesion, and low outgassing, it is more preferably in the range of 100 mJ/cm ² to 4000 mJ/cm ² .

The substrate to be adhered or covered by the easily disintegrable (meth)acrylic resin composition of the present invention is not particularly limited, but at least one of the substrates is preferably a light transmissive substrate through which light is transmitted. Good for transparent substrates. Examples of the transparent substrate include inorganic substrates such as crystal, glass, quartz, and calcium fluoride, and organic substrates such as plastics. In the above, it is preferable to use one or more of a group consisting of glass and quartz in order to obtain versatility and obtain a large effect.

The easily disintegrable (meth)acrylic resin composition of the present invention is photocurable in one embodiment, and the cured body can have excellent heat resistance. In one embodiment, the hardened body of the easily disintegrable (meth)acrylic resin composition of the present invention has a small amount of outgassing even when exposed to a high temperature environment, and is suitable for bonding various optical parts or optical devices and electronic parts. , sealed, coated.

The cured body of the easily disintegrable (meth)acrylic resin composition of the present invention can be preferably used at a high temperature of 200 ° C or higher, more preferably 250 ° C or higher, and most preferably 300 ° C or higher. The cured body of the easily disintegrable (meth)acrylic resin composition of the present invention can be preferably used at 500 ° C or lower, more preferably 400 ° C or lower, and most preferably 350 ° C or lower.

Further, in an embodiment of the present invention, peeling can be performed by applying an external force to a composite obtained by using the composition of the present invention or covering a substrate. For example, peeling can be performed by inserting a sheet or a wire. The material of the inserted sheet or wire is not particularly limited, but may be exemplified by polyethylene terephthalate. Diester (PET), polybutylene terephthalate (PBT), polyethylene naphthalate, polyethylene, polypropylene, celecoxib, diethyl phthalocyanine, triacetyl cellulose, acetamidine Cellulose butyrate, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl acetate copolymer, polystyrene, polycarbonate, polymethylpentene, polyfluorene, polyetheretherketone, Polyether oxime, polyether oximine, polyimine, nylon, acrylic resin, and the like.

Further, in one embodiment of the present invention, the composite obtained by using the composition of the present invention or covering the substrate can be irradiated with light having a wavelength of 750 nm or more and 2000 nm or less. Examples of the light having a wavelength of 750 nm or more and 2000 nm or less include semiconductor laser light of 750 nm to 880 nm, and Nd-YAG laser light of 1060 nm.

Further, in one embodiment of the present invention, the composite obtained by adhering or covering the substrate with the composition of the present invention may be immersed in a solution to be peeled off. The solution is preferably at least 40 °C. As the solution, for example, water can be suitably used.

[Examples]

The present invention will be described in more detail below by way of experimental examples, but the invention is not limited thereto.

(Experimental example)

The experiment was carried out at 23 ° C unless otherwise specified. The resin compositions of the compositions shown in Tables 1 and 2 were prepared and evaluated. The results are shown in Tables 1 and 2.

The following compounds were selected for each component in the resin composition described in the experimental examples.

a group consisting of a diene-based (meth) acrylate, a polyester urethane (meth) acrylate, and a polyether urethane (meth) acrylate as the component (A) One or two or more kinds of polyfunctional (meth) acrylates are selected from the following compounds.

(A-1) 1,2-polybutadiene oligomer ("TE-2000" manufactured by Japan Soda Co., Ltd., the structure is referred to the following formula (5)) (quantitative molecular weight by polystyrene conversion by GPC) For 5300).

(A-2) Isoprene oligomer ("UC-102" manufactured by Kuraray Co., Ltd.) (the number average molecular weight by polystyrene conversion of GPC is 17,000, and the butylene of the isoprene polymer) An esterified oligomer of a dianhydride adduct with 2-hydroxyethyl methacrylate, wherein Y is an exoethyl group and R is a methyl group in the formula (2).

(Comparative A-3) bisphenol A propylene oxide 2 molar addition digoxime Acrylic acid adduct of oleyl ether ("Epoxy Ester 3002A" manufactured by Kyoeisha Chemical Co., Ltd., hereinafter abbreviated as "3002A").

As the phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain as the component (B1), the following compounds were selected.

(B-1) Nonylphenol Ethylene Oxide Modified Acrylate (M-111) manufactured by Toagosei Co., Ltd., in the formula (3), R ¹ is a hydrogen atom, R ² is an exoethyl group, and R ³ is an anthracene. Base, n is 1).

The (meth)acrylic acid alkyl ester having an alkyl group having 8 to 20 carbon atoms as the component (B2) is selected from the following compounds.

(B-2) Lauryl Acrylate ("LA" manufactured by Osaka Organic Co., Ltd.).

(Comparative B-3) 2-hydroxybutyl methacrylate ("HOB (N)" manufactured by Kyoeisha Chemical Co., Ltd.).

As the component (C), 1,3-adamantyl dimethanol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, iso-cyanuric acid ethylene oxide modified di(II) Methyl) acrylate, iso-cyanuric acid ethylene oxide modified tri(meth) acrylate, neopentyl alcohol tri (meth) acrylate, neopentyl alcohol tetra (meth) acrylate, two One or more of a group consisting of methylolpropane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate The polyfunctional (meth) acrylate is selected from the following compounds.

(C-1) a mixture of pentaerythritol triacrylate/neopentitol tetraacrylate (55 mass% to 63 mass%/37 mass% to 45% by mass) A mixture of the compounds ("Aronix M-305" manufactured by Toagosei Co., Ltd.).

(C-2) 1,3-adamantyl dimethanol diacrylate ("Adamantate A-201" manufactured by Idemitsu Kosan Co., Ltd.).

(C-3) Iso-cyanuric acid ethylene oxide-modified di(meth)acrylate ("M-215" manufactured by Toagosei Co., Ltd.).

As the photopolymerization initiator of the component (D), the following compounds were selected.

(D-1) 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one (Ciba Japan "Irgacure379" manufactured by the company, hereinafter abbreviated as "I-379").

(D-2) 1-hydroxycyclohexyl phenyl ketone ("Irgacure 184" manufactured by BASF Corporation, hereinafter abbreviated as "I-184").

(D-3) 2,4,6-trimethylbenzimidyldiphenylphosphine oxide ("Lucirin TPO" manufactured by BASF Corporation, hereinafter abbreviated as "TPO").

(D-4) Diphenylethylenedione dimethyl ketal ("IRGACURE651" manufactured by BASF Corporation, hereinafter abbreviated as "BDK").

As a polymerization inhibitor, the following compounds were selected.

2,2-methylene-bis(4-methyl-6-tert-butylphenol) (Sumilizer MDP-S, manufactured by Sumitomo Chemical Industries, Ltd., hereinafter abbreviated as "MDP").

As the infrared ray absorbing agent, the following compounds were selected.

Acetylene black ("Denka Black" manufactured by Electric Chemical Industry Co., Ltd.).

The heating mass reduction rate of the photopolymerization initiator ("heating mass reduction rate of photopolymerization initiator" in the table): Photopolymerization using a differential thermal/thermal mass simultaneous measurement device "TG-DTA2000SA" manufactured by Bruker AXS 10 mg of the initiator was heated from 30 ° C to 250 ° C at a temperature elevation rate of 10 ° C / min under a nitrogen stream, and the heating mass reduction rate of the photopolymerization initiator was measured.

The heating mass reduction rate of the hardened body ("heating mass reduction rate of the hardened body" in the table): A 5 μm thick mat was used as a separator, and the produced resin composition was sandwiched in the PET film. Using a black light, the resin composition was cured from the upper surface under the condition that the integrated light amount at a wavelength of 365 nm was 2000 mJ/cm ² , and then a cured body of the resin composition having a thickness of 5 μm was produced. 10 mg of the obtained hardened body was placed under a helium gas flow at 300 ° C for 10 minutes using a differential heat/thermal mass simultaneous measurement apparatus "TG-DTA2000SA" manufactured by Bruker AXS Co., Ltd., and the obtained heat-hardened mass reduction rate was measured. The temperature increase rate until standing at 300 ° C for 10 minutes was set to 10 ° C / min.

Tensile shear strength ("Bottom strength"): using a blue plate glass (25 mm × 25 mm × thickness 0.5 mm), the subsequent portion was set to 25 mm × 25 mm, and two green plates were used using the resin composition produced. The glass was bonded, and the black light was hardened under the condition that the integrated light amount at a wavelength of 365 nm was 2000 mJ/cm ² ("accumulated light amount"), and a tensile shear strength test piece was produced. For the test piece to be produced, the tensile shear strength was measured at a tensile speed of 10 mm/min in an environment of a temperature of 23 ° C and a humidity of 50% in accordance with JIS K 6850 using a universal testing machine.

Tensile shear strength after heat resistance test at 250 ° C ("Bottom strength after heat resistance test at 250 ° C"): Using a slab glass (25 mm × 25 mm × thickness 0.5 mm), the subsequent portion was set to 25 mm × 25 mm, two sheets of green glass were bonded together by the resin composition produced, and the black light was hardened under the condition that the integrated light amount at a wavelength of 365 nm was 2000 mJ/cm ² ("accumulated light amount"). Test pieces were prepared by exposing them to an oven at 250 ° C for 10 minutes. For the test piece to be produced, the tensile shear strength was measured at a tensile speed of 10 mm/min in an environment of a temperature of 23 ° C and a humidity of 50% in accordance with JIS K 6850 using a universal testing machine.

Tensile shear strength after 300 ° C heat resistance test ("Standard strength after 300 ° C heat resistance test"): Using a slab glass (25 mm × 25 mm × thickness 0.5 mm), the subsequent portion was set to 25 mm × 25 mm, two sheets of green glass were bonded together by the resin composition produced, and the black light was hardened under the condition that the integrated light amount at a wavelength of 365 nm was 2000 mJ/cm ² ("accumulated light amount"). Test pieces were prepared by exposing them to an oven at 300 ° C for 10 minutes. For the test piece to be produced, the tensile shear strength was measured at a tensile speed of 10 mm/min in an environment of a temperature of 23 ° C and a humidity of 50% in accordance with JIS K 6850 using a universal testing machine.

Peeling/disintegration test (1) ("(1) peeling")

A test piece having the same tensile strength and strength evaluation as described above was prepared, and the obtained test piece was exposed to an oven heated to 300 ° C for 10 minutes, and then a PET sheet was inserted between the obtained test pieces to evaluate the peelability. When the green sheet glass was peeled off, it was evaluated as "peelable", and when the green sheet glass was not peeled off, it was evaluated as "not peelable". The evaluation results are shown in Table 1.

Peeling/disintegration test (2) ("(2) Infrared irradiation peeling")

A test piece having the same tensile strength and strength evaluation as described above was prepared, and the obtained test body was exposed to an oven heated to 300 ° C for 10 minutes, and then an infrared laser was used (using device: Fine Device Co., Ltd. / laser fine processing systems MWL-WSO05T), from lime glass plate side at a wavelength of 1100nm, the illuminance of 25W / cm ² irradiated for 5 minutes, and peeling the test specimen evaluation. When the green sheet glass was peeled off, it was evaluated as "peelable", and when the green sheet glass was not peeled off, it was evaluated as "not peelable". The evaluation results are shown in Table 1.

The resin composition of the present invention can attain an effect of high heat resistance and adhesion. With regard to the adhesion between the substrates which are followed by the use of the resin composition of the present invention, it is possible to obtain an effect that the adhesion does not decrease even when used in an environment of 250 ° C or higher. The cured product of the resin composition of the present invention can obtain an effect of less outgassing even when exposed to 300 °C. On the other hand, the resin composition of the present invention also has practical peelability.

When a compound having a large heating mass reduction rate was used as the (D) photopolymerization initiator, the adhesion strength after the heat resistance test was small (Experimental Example 8, Experimental Example 14, Experimental Example 16).

According to the comparison between Experimental Example 2 and Experimental Example 5, when acetylene black is used, Heat resistance is improved.

When the component (A) was not used, when the component (B) was not used, and when the component (C) was not used, the test body could not be peeled off and disintegrated (Experimental Examples 9 to 11 and Experimental Example 17).

When the mass ratio of (A)/(C) was 2.3/1, the heat resistance was not obtained, and the test piece peeled off after the heat resistance test, and the test piece could not be temporarily fixed (Experimental Example 12). When the mass ratio of (A)/(C) is 9/1, even if the test piece is peeled off, part of the adhesive composition remains on the test piece (residue), and the resin composition cannot be uniformly peeled off from the test piece ( Experimental Example 13). The acrylic adhesive proposed in Japanese Laid-Open Patent Publication No. 2006-342222 is difficult to peel off (Experimental Example 17).

[Industrial availability]

In the manufacture of various electronic parts, optical parts, or optical devices, the composition of the present invention easily exhibits strong adhesion by irradiation of ultraviolet rays or visible rays, and thus is excellent in workability and productivity. The hardened body of the composition of the present invention does not further decrease in adhesion at a high temperature of 250 ° C, and the amount of outgas at such a high temperature is also extremely small. Therefore, various electronic parts, optical parts, or optical devices which are followed by the composition of the present invention can be applied even when performing vapor deposition treatment at a high temperature exceeding 200 ° C or baking coating at a high temperature.

In addition, in addition to ICs, electronic components such as resistors and inductors, optical components such as image sensors are also suitable for surface mounting of circuit boards. In the case of shape, it is necessary to pass the high temperature reflow. In recent years, especially with the lead-free solder, the temperature conditions for reflow have become strict. In such a production step, in order to improve the quality of the optical component or the optical device, or to improve the productivity or the production yield, it is required that the use portion of the photocurable resin composition can sufficiently withstand the high-temperature heat treatment. The optical component or optical device manufactured by using the composition of the present invention can sufficiently withstand the aforementioned high-temperature heat treatment, and thus is very useful industrially.

Claims (22)

A composition comprising the following (A) to (D), and the mass ratio of (A)/(C) is (3-8)/1; (A) polyfunctional (meth) acrylate, selected One or two of a group consisting of a diene-based (meth) acrylate, a polyester urethane (meth) acrylate, and a polyether urethane (meth) acrylate (B) (B1) phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain and/or (B2) (methyl) having an alkyl group having 8 to 20 carbon atoms An alkyl acrylate; (C) a polyfunctional (meth) acrylate selected from the group consisting of 1,3-adamantyl dimethanol di(meth) acrylate, trimethylolpropane tri(meth) acrylate, and different Cyanuric acid ethylene oxide modified di(meth) acrylate, iso-cyanuric acid ethylene oxide modified tri(meth) acrylate, neopentyl alcohol tri(meth) acrylate, new Pentaerythritol tetra(meth)acrylate, dimethylolpropane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate One or more of the group consisting of; (D) a photoradical polymerization initiator. The composition according to claim 1, wherein (B) is (B1) a phenoxy (poly)alkylene oxide (meth) acrylate having an alkylene oxide chain. The composition according to claim 1 or 2, wherein (B) is (B2) an alkyl (meth)acrylate having an alkyl group having 8 to 20 carbon atoms. The composition as recited in claim 1 or 2 is attached to (A) to (C) In a total amount of 100 parts by mass, (A) 45 parts by mass to 75 parts by mass, (B) 10 parts by mass to 50 parts by mass, and (C) 1 part by mass to 20 parts by mass. The composition according to claim 1 or 2, wherein the amount of the (D) photoradical polymerization initiator used is 0.01 parts by mass to 5 parts by mass based on 100 parts by mass of the total of (A) to (C). . The composition according to claim 1 or 2, wherein the (D) photoradical polymerization initiator is selected from the group consisting of 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionamidine) -benzyl]-phenyl}-2-methyl-propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butanone-1 2-Dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, bis(2,4, 6-trimethylbenzimidyl)phenylphosphine oxide, 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, oxy-phenyl-acetic acid 2-[2-oxy-2 One or more of the group consisting of -phenyl-acetoxy-ethoxy]-ethyl ester and oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]-ethyl ester. The composition according to claim 1 or 2, wherein the (D) photoradical polymerization initiator is heated to a temperature of 30 ° C / min from 30 ° C to 250 ° C under a nitrogen stream, the heating mass reduction rate is 15 mass %the following. The composition according to claim 1 or 2, wherein the (D) photoradical polymerization initiator is heated to 30 ° C at a temperature increase rate of 10 ° C / min from 30 ° C to 250 ° C, the heating mass reduction rate is 50 mass %the above. The composition as recited in claim 1 or 2 further contains an aggregate Inhibitor. The composition according to claim 1 or 2 further contains an infrared ray absorbing agent. An adhesive comprising the composition according to any one of claims 1 to 10. A covering agent comprising the composition according to any one of claims 1 to 10. An easily disintegrable composition comprising the composition according to any one of claims 1 to 10. A composite obtained by adhering or covering a substrate to each other using the composition according to any one of claims 1 to 10. A method of producing a composite, comprising the step of adhering or covering a substrate to each other using the composition according to any one of claims 1 to 10. The method for producing a composite according to claim 15 includes the step of irradiating visible light rays or ultraviolet rays to the substrate according to any one of claims 1 to 10 to adhere the substrates to each other or to cover the substrate. A method of disassembling a bonding body, comprising the step of bonding the substrates to each other using the composition according to any one of claims 1 to 10, and then peeling off the obtained adherend. The method of disassembling the adherend described in claim 17 includes the step of peeling off the obtained adherend by applying an external force. The method for disassembling the adherend as recited in claim 17 includes peeling off the adherend obtained by irradiating visible light or ultraviolet rays. step. A method of dissolving a covering body, comprising the step of peeling off the obtained covering body after covering the substrate with the composition according to any one of claims 1 to 10. The method for dissolving the covering body as claimed in claim 20 includes the step of peeling off the composition from the obtained covering body by applying an external force. The method for dissolving the covering according to claim 20 includes the step of peeling off the composition from a cover obtained by irradiating visible light or ultraviolet rays.