TW201612364A - Plating method - Google Patents
Plating methodInfo
- Publication number
- TW201612364A TW201612364A TW104119720A TW104119720A TW201612364A TW 201612364 A TW201612364 A TW 201612364A TW 104119720 A TW104119720 A TW 104119720A TW 104119720 A TW104119720 A TW 104119720A TW 201612364 A TW201612364 A TW 201612364A
- Authority
- TW
- Taiwan
- Prior art keywords
- plating method
- copper
- free
- electroplating baths
- deposits
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/319,526 US9809891B2 (en) | 2014-06-30 | 2014-06-30 | Plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612364A true TW201612364A (en) | 2016-04-01 |
TWI557280B TWI557280B (zh) | 2016-11-11 |
Family
ID=53491337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104119720A TWI557280B (zh) | 2014-06-30 | 2015-06-18 | 鍍覆方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9809891B2 (zh) |
EP (1) | EP2963158B1 (zh) |
JP (1) | JP6129242B2 (zh) |
KR (1) | KR101698405B1 (zh) |
CN (1) | CN105316712B (zh) |
SG (1) | SG10201504959UA (zh) |
TW (1) | TWI557280B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102303983B1 (ko) * | 2014-09-22 | 2021-09-23 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법, 및 상기 반도체 장치를 포함하는 반도체 패키지 |
CN109385650A (zh) * | 2017-08-09 | 2019-02-26 | 中南大学 | 一种硅通孔结构、硅通孔结构的制造方法及其装置 |
US20190136397A1 (en) * | 2017-11-08 | 2019-05-09 | Rohm And Haas Electronic Materials Llc | Electroplated copper |
WO2019199614A1 (en) * | 2018-04-09 | 2019-10-17 | Lam Research Corporation | Copper electrofill on non-copper liner layers |
JP6971915B2 (ja) * | 2018-06-05 | 2021-11-24 | 株式会社荏原製作所 | めっき方法、めっき装置、及び限界電流密度を推定する方法 |
US11069570B2 (en) * | 2018-10-31 | 2021-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming an interconnect structure |
JP6899062B1 (ja) * | 2020-05-18 | 2021-07-07 | 深▲せん▼市創智成功科技有限公司 | Icボードのスルーホールを充填するための電気銅めっき液およびその電気めっき方法 |
EP4112729B1 (en) * | 2021-07-02 | 2023-09-06 | AXAGARIUS GmbH & Co. KG | Mixture of branched secondary alcohol ethoxylates for removal of endotoxins in anion exchange chromatography |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3634205A (en) | 1968-09-27 | 1972-01-11 | Bunker Ramo | Method of plating a uniform copper layer on an apertured printed circuit board |
US3770598A (en) | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
DE2204326C3 (de) | 1972-01-26 | 1981-07-09 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und duktilen Kupferüberzügen |
US3956084A (en) | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
US4038161A (en) | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
US4139425A (en) | 1978-04-05 | 1979-02-13 | R. O. Hull & Company, Inc. | Composition, plating bath, and method for electroplating tin and/or lead |
US4374709A (en) | 1980-05-01 | 1983-02-22 | Occidental Chemical Corporation | Process for plating polymeric substrates |
US4376685A (en) | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4555315A (en) | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
US4673469A (en) | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US4545870A (en) * | 1984-08-27 | 1985-10-08 | Columbia Chemical Corporation | Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin |
EP1197587B1 (en) | 2000-10-13 | 2006-09-20 | Shipley Co. L.L.C. | Seed layer repair and electroplating bath |
US6649038B2 (en) | 2000-10-13 | 2003-11-18 | Shipley Company, L.L.C. | Electroplating method |
US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
TW583202B (en) * | 2001-03-16 | 2004-04-11 | Sumitomo Chemical Co | Aqueous emulsion comprising ethylene-vinylester copolymer |
US20030116439A1 (en) * | 2001-12-21 | 2003-06-26 | International Business Machines Corporation | Method for forming encapsulated metal interconnect structures in semiconductor integrated circuit devices |
GB0203956D0 (en) | 2002-02-20 | 2002-04-03 | Appleton Robert P | Drill string member |
EP1422320A1 (en) | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
US20050092611A1 (en) | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7232513B1 (en) | 2004-06-29 | 2007-06-19 | Novellus Systems, Inc. | Electroplating bath containing wetting agent for defect reduction |
TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
WO2008157612A1 (en) | 2007-06-21 | 2008-12-24 | Enthone Inc. | Codeposition of copper nanoparticles in through silicon via filling |
TWI341554B (en) | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
US9217205B2 (en) | 2007-12-11 | 2015-12-22 | Enthone Inc. | Electrolytic deposition of metal-based composite coatings comprising nano-particles |
US7776741B2 (en) | 2008-08-18 | 2010-08-17 | Novellus Systems, Inc. | Process for through silicon via filing |
US20110220512A1 (en) | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8268157B2 (en) | 2010-03-15 | 2012-09-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8262895B2 (en) | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8883701B2 (en) | 2010-07-09 | 2014-11-11 | Air Products And Chemicals, Inc. | Method for wafer dicing and composition useful thereof |
JP5981455B2 (ja) | 2011-01-26 | 2016-08-31 | エンソン インコーポレイテッド | マイクロ電子工業におけるビアホール充填方法 |
KR101705734B1 (ko) * | 2011-02-18 | 2017-02-14 | 삼성전자주식회사 | 구리 도금 용액 및 이것을 이용한 구리 도금 방법 |
JP5363523B2 (ja) | 2011-03-28 | 2013-12-11 | 上村工業株式会社 | 電気銅めっき用添加剤及び電気銅めっき浴 |
US8747643B2 (en) | 2011-08-22 | 2014-06-10 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
US20130178063A1 (en) | 2012-01-11 | 2013-07-11 | United Microelectronics Corp. | Method of manufacturing semiconductor device having silicon through via |
CN103361681B (zh) * | 2013-08-08 | 2016-11-16 | 上海新阳半导体材料股份有限公司 | 能改变tsv微孔镀铜填充方式的添加剂c及包含其的电镀液 |
EP2845928B1 (en) | 2013-09-05 | 2019-11-06 | MacDermid Enthone Inc. | Aqueous electrolyte composition having a reduced airborne emission |
-
2014
- 2014-06-30 US US14/319,526 patent/US9809891B2/en active Active
-
2015
- 2015-06-18 TW TW104119720A patent/TWI557280B/zh active
- 2015-06-19 JP JP2015123706A patent/JP6129242B2/ja active Active
- 2015-06-23 SG SG10201504959UA patent/SG10201504959UA/en unknown
- 2015-06-24 KR KR1020150089918A patent/KR101698405B1/ko active IP Right Grant
- 2015-06-25 EP EP15173908.3A patent/EP2963158B1/en active Active
- 2015-06-29 CN CN201510368373.9A patent/CN105316712B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI557280B (zh) | 2016-11-11 |
EP2963158B1 (en) | 2021-05-26 |
EP2963158A1 (en) | 2016-01-06 |
KR20160002370A (ko) | 2016-01-07 |
KR101698405B1 (ko) | 2017-01-25 |
JP6129242B2 (ja) | 2017-05-17 |
CN105316712B (zh) | 2019-04-30 |
CN105316712A (zh) | 2016-02-10 |
US9809891B2 (en) | 2017-11-07 |
JP2016027196A (ja) | 2016-02-18 |
SG10201504959UA (en) | 2016-01-28 |
US20150376807A1 (en) | 2015-12-31 |
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