TW201612242A - Photosensitive thermosetting resin composition, dry film and printed circuit board - Google Patents
Photosensitive thermosetting resin composition, dry film and printed circuit boardInfo
- Publication number
- TW201612242A TW201612242A TW104120170A TW104120170A TW201612242A TW 201612242 A TW201612242 A TW 201612242A TW 104120170 A TW104120170 A TW 104120170A TW 104120170 A TW104120170 A TW 104120170A TW 201612242 A TW201612242 A TW 201612242A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printed circuit
- resin composition
- thermosetting resin
- photosensitive thermosetting
- Prior art date
Links
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polyurethanes Or Polyureas (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-138610 | 2014-07-04 | ||
JP2014138610 | 2014-07-04 | ||
JP2015-100741 | 2015-05-18 | ||
JP2015100741A JP6568715B2 (ja) | 2014-07-04 | 2015-05-18 | 感光性熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612242A true TW201612242A (en) | 2016-04-01 |
TWI678397B TWI678397B (zh) | 2019-12-01 |
Family
ID=55352775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104120170A TWI678397B (zh) | 2014-07-04 | 2015-06-23 | 感光性熱硬化性樹脂組成物、乾薄膜及印刷電路板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6568715B2 (zh) |
KR (1) | KR102434678B1 (zh) |
TW (1) | TWI678397B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI692999B (zh) * | 2016-06-06 | 2020-05-01 | 大陸商寧波舜宇光電信息有限公司 | 攝像模組的模塑電路板及其製造設備和製造方法 |
CN115777003A (zh) * | 2020-06-29 | 2023-03-10 | 日本化药株式会社 | 异氰酸酯改质聚酰亚胺树脂、树脂组合物及其硬化物 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170125352A (ko) * | 2015-03-06 | 2017-11-14 | 도레이 카부시키가이샤 | 감광성 수지 조성물 및 전자 부품 |
JP6869078B2 (ja) * | 2017-03-31 | 2021-05-12 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品 |
JP6951132B2 (ja) * | 2017-06-20 | 2021-10-20 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、積層構造体、その硬化物および電子部品 |
JP6987011B2 (ja) * | 2018-03-30 | 2021-12-22 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JPWO2022202081A1 (zh) * | 2021-03-25 | 2022-09-29 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62263692A (ja) | 1986-05-12 | 1987-11-16 | ニツポン高度紙工業株式会社 | 耐熱性フレキシブルプリント配線板 |
JPS63110224A (ja) | 1986-10-27 | 1988-05-14 | Dainippon Printing Co Ltd | フレキシブルオ−バ−レイフイルム |
CN101522744B (zh) * | 2006-10-04 | 2012-02-22 | 日立化成工业株式会社 | 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板 |
CN101652714A (zh) * | 2007-04-10 | 2010-02-17 | 日本化药株式会社 | 感光性树脂组合物 |
KR101102256B1 (ko) * | 2007-12-14 | 2012-01-03 | 주식회사 엘지화학 | 폴리이미드계 고분자 화합물 및 이를 포함하는 포지티브형폴리이미드 감광성 수지 조성물 |
JP5365899B2 (ja) | 2008-06-04 | 2013-12-11 | 日立金属株式会社 | ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線 |
EP2366751A3 (en) * | 2008-08-27 | 2012-01-18 | Hitachi Chemical Co., Ltd. | Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
-
2015
- 2015-05-18 JP JP2015100741A patent/JP6568715B2/ja active Active
- 2015-06-23 TW TW104120170A patent/TWI678397B/zh active
- 2015-07-01 KR KR1020150093868A patent/KR102434678B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI692999B (zh) * | 2016-06-06 | 2020-05-01 | 大陸商寧波舜宇光電信息有限公司 | 攝像模組的模塑電路板及其製造設備和製造方法 |
CN115777003A (zh) * | 2020-06-29 | 2023-03-10 | 日本化药株式会社 | 异氰酸酯改质聚酰亚胺树脂、树脂组合物及其硬化物 |
Also Published As
Publication number | Publication date |
---|---|
JP6568715B2 (ja) | 2019-08-28 |
KR102434678B1 (ko) | 2022-08-22 |
KR20160004942A (ko) | 2016-01-13 |
JP2016027373A (ja) | 2016-02-18 |
TWI678397B (zh) | 2019-12-01 |
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