TW201612242A - Photosensitive thermosetting resin composition, dry film and printed circuit board - Google Patents

Photosensitive thermosetting resin composition, dry film and printed circuit board

Info

Publication number
TW201612242A
TW201612242A TW104120170A TW104120170A TW201612242A TW 201612242 A TW201612242 A TW 201612242A TW 104120170 A TW104120170 A TW 104120170A TW 104120170 A TW104120170 A TW 104120170A TW 201612242 A TW201612242 A TW 201612242A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
resin composition
thermosetting resin
photosensitive thermosetting
Prior art date
Application number
TW104120170A
Other languages
English (en)
Other versions
TWI678397B (zh
Inventor
Hidekazu Miyabe
Makoto Hayashi
Yutaka Yokoyama
Naoyuki Koike
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201612242A publication Critical patent/TW201612242A/zh
Application granted granted Critical
Publication of TWI678397B publication Critical patent/TWI678397B/zh

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW104120170A 2014-07-04 2015-06-23 感光性熱硬化性樹脂組成物、乾薄膜及印刷電路板 TWI678397B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-138610 2014-07-04
JP2014138610 2014-07-04
JP2015-100741 2015-05-18
JP2015100741A JP6568715B2 (ja) 2014-07-04 2015-05-18 感光性熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板

Publications (2)

Publication Number Publication Date
TW201612242A true TW201612242A (en) 2016-04-01
TWI678397B TWI678397B (zh) 2019-12-01

Family

ID=55352775

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104120170A TWI678397B (zh) 2014-07-04 2015-06-23 感光性熱硬化性樹脂組成物、乾薄膜及印刷電路板

Country Status (3)

Country Link
JP (1) JP6568715B2 (zh)
KR (1) KR102434678B1 (zh)
TW (1) TWI678397B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692999B (zh) * 2016-06-06 2020-05-01 大陸商寧波舜宇光電信息有限公司 攝像模組的模塑電路板及其製造設備和製造方法
CN115777003A (zh) * 2020-06-29 2023-03-10 日本化药株式会社 异氰酸酯改质聚酰亚胺树脂、树脂组合物及其硬化物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170125352A (ko) * 2015-03-06 2017-11-14 도레이 카부시키가이샤 감광성 수지 조성물 및 전자 부품
JP6869078B2 (ja) * 2017-03-31 2021-05-12 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
JP6951132B2 (ja) * 2017-06-20 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物および電子部品
JP6987011B2 (ja) * 2018-03-30 2021-12-22 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JPWO2022202081A1 (zh) * 2021-03-25 2022-09-29

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
CN101522744B (zh) * 2006-10-04 2012-02-22 日立化成工业株式会社 聚酰胺酰亚胺树脂、粘接剂、挠性基板材料、挠性层叠板及挠性印刷电路板
CN101652714A (zh) * 2007-04-10 2010-02-17 日本化药株式会社 感光性树脂组合物
KR101102256B1 (ko) * 2007-12-14 2012-01-03 주식회사 엘지화학 폴리이미드계 고분자 화합물 및 이를 포함하는 포지티브형폴리이미드 감광성 수지 조성물
JP5365899B2 (ja) 2008-06-04 2013-12-11 日立金属株式会社 ポリアミドイミド樹脂絶縁塗料及びそれを用いた絶縁電線
EP2366751A3 (en) * 2008-08-27 2012-01-18 Hitachi Chemical Co., Ltd. Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692999B (zh) * 2016-06-06 2020-05-01 大陸商寧波舜宇光電信息有限公司 攝像模組的模塑電路板及其製造設備和製造方法
CN115777003A (zh) * 2020-06-29 2023-03-10 日本化药株式会社 异氰酸酯改质聚酰亚胺树脂、树脂组合物及其硬化物

Also Published As

Publication number Publication date
JP6568715B2 (ja) 2019-08-28
KR102434678B1 (ko) 2022-08-22
KR20160004942A (ko) 2016-01-13
JP2016027373A (ja) 2016-02-18
TWI678397B (zh) 2019-12-01

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