TW201612267A - Curable resin composition, dry film, cured article, and printed wiring board - Google Patents

Curable resin composition, dry film, cured article, and printed wiring board

Info

Publication number
TW201612267A
TW201612267A TW104108784A TW104108784A TW201612267A TW 201612267 A TW201612267 A TW 201612267A TW 104108784 A TW104108784 A TW 104108784A TW 104108784 A TW104108784 A TW 104108784A TW 201612267 A TW201612267 A TW 201612267A
Authority
TW
Taiwan
Prior art keywords
curable resin
resin composition
insoluble component
wiring board
printed wiring
Prior art date
Application number
TW104108784A
Other languages
Chinese (zh)
Other versions
TWI540190B (en
Inventor
Ayumu Shimamiya
Kenji Kato
Kosuke Nakajima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201612267A publication Critical patent/TW201612267A/en
Application granted granted Critical
Publication of TWI540190B publication Critical patent/TWI540190B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials Engineering (AREA)

Abstract

Provided are: a curable resin composition which has properties required for compositions, such as storage stability, and properties required for solder resists, such as solder heat resistance, and also has high reflectance; a dry film; a cured article; and a printed wiring board. A curable resin composition comprising (A) a curable resin, (B) a white coloring agent and (C) a surface-treated photoactivatable inorganic filler. A liquid, which is produced by adding 10 g of the curable resin composition that is not cured yet to 50 g of acetone, then removing a primary insoluble component from the resultant mixture, then adding the removed primary insoluble component to 50 g of chloroform, then removing a secondary insoluble component from the resultant mixture, then adding the removed secondary insoluble component to 10 g of pure water and then stirring the resultant mixture at 30 DEG C for 1 week, has a pH value of 6 to 12.
TW104108784A 2014-09-19 2015-03-19 The printed wiring board is made of hardened resin composition, dry film, hardened material and printed wiring board TWI540190B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014191934A JP5797824B1 (en) 2014-09-19 2014-09-19 Curable resin composition for printed wiring board, dry film, cured product, and printed wiring board

Publications (2)

Publication Number Publication Date
TW201612267A true TW201612267A (en) 2016-04-01
TWI540190B TWI540190B (en) 2016-07-01

Family

ID=54348614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104108784A TWI540190B (en) 2014-09-19 2015-03-19 The printed wiring board is made of hardened resin composition, dry film, hardened material and printed wiring board

Country Status (4)

Country Link
JP (1) JP5797824B1 (en)
KR (1) KR101701100B1 (en)
TW (1) TWI540190B (en)
WO (1) WO2016042797A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6674098B2 (en) * 2016-05-31 2020-04-01 富士通株式会社 Photoexcitation material, photochemical electrode, and method for producing photoexcitation material
KR102398123B1 (en) 2020-06-10 2022-05-17 한국다이요잉크 주식회사 Solder resist resin composition, solder resist structure, dry film, and printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09316443A (en) * 1996-05-27 1997-12-09 Nemoto Tokushu Kagaku Kk Surface treatment of luminous fluorescent pigment, surface-treated luminous fluorescent pigment and luminous fluorescent coating material using the same
JP2003268367A (en) * 2002-03-18 2003-09-25 Kasei Optonix Co Ltd Fluorescent substance for forming fluorescent film and slurry thereof
JP4340272B2 (en) 2006-05-30 2009-10-07 太陽インキ製造株式会社 Photocurable / thermosetting solder resist composition and printed wiring board using the same
JP4071821B1 (en) * 2007-04-17 2008-04-02 徹 水上 Luminescent composition for ink and paint and method for producing the same
JP5479821B2 (en) 2009-08-28 2014-04-23 太陽ホールディングス株式会社 Solder resist layer and printed wiring board
JP5513965B2 (en) * 2010-04-21 2014-06-04 互応化学工業株式会社 Solder resist composition and printed wiring board
JP2013135193A (en) * 2011-12-27 2013-07-08 Goo Chemical Co Ltd Printed wiring board
JP5564144B1 (en) * 2013-01-15 2014-07-30 太陽インキ製造株式会社 Curable resin composition, dry film and cured product thereof, and printed wiring board using them

Also Published As

Publication number Publication date
WO2016042797A1 (en) 2016-03-24
TWI540190B (en) 2016-07-01
KR20160042151A (en) 2016-04-18
JP2016063164A (en) 2016-04-25
JP5797824B1 (en) 2015-10-21
KR101701100B1 (en) 2017-01-31

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