TW201610651A - Opening/closing device of electronic component testing module (I) - Google Patents

Opening/closing device of electronic component testing module (I) Download PDF

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Publication number
TW201610651A
TW201610651A TW103131357A TW103131357A TW201610651A TW 201610651 A TW201610651 A TW 201610651A TW 103131357 A TW103131357 A TW 103131357A TW 103131357 A TW103131357 A TW 103131357A TW 201610651 A TW201610651 A TW 201610651A
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Prior art keywords
opening
transfer
test module
electronic component
closing
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TW103131357A
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Chinese (zh)
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TWI547792B (en
Inventor
wei-yan Zheng
zheng-xin Lai
huan-wei Chen
Yan-Wei Chen
zheng-xun Li
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Motech Taiwan Automatic Corp
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Publication of TWI547792B publication Critical patent/TWI547792B/en

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Abstract

An opening/closing device of electronic component testing module (I) is provided. The testing module is provided with a testing base and a cover body covering the testing base. The cover body having a heat dissipation structure is hooked to the buckle portions of the testing base to achieve positioning through a plurality of hooks. The opening/closing device comprises a moving mechanism and an opening/closing unit. The moving mechanism is provided with a moving carrier moving in at least one direction so as to be connected and assembled with the opening/closing unit. The opening/closing unit is provided with at least one driving source for driving two clamping members of at least one clamper to displace relatively such that the two clamping members leaning against or releasing from the two hooks of the cover body of the testing module are disengaged from or hooked to the buckle portions of the testing base to take the cover body out or cover the testing base so as to further open or close the cover body of the testing module. Thus, the testing module can be automatically opened or closed, Not only labor force and cost can be saved, but also the opening/closing time can be shortened, thereby achieving the practical benefits of saving cost and improving the testing capacity.

Description

電子元件測試模組之啟閉裝置(一) Opening and closing device for electronic component test module (1)

本發明係提供一種可自動化啟閉測試模組,不僅縮減人力,並縮短啟閉作業時間,進而節省成本及提升測試產能之啟閉裝置(一)。 The invention provides an opening and closing device capable of automatically opening and closing a test module, which not only reduces manpower, but also shortens the opening and closing operation time, thereby saving cost and improving test productivity (1).

在現今,電子元件於後段封裝完成後,為確保產品品質,係會將電子元件置入測試模組之測試座而進行測試作業,以檢測電子元件於製作過程中是否遭受損壞,以淘汰出不良品,由於電子元件於執行測試作業的過程中,其本身會因執行程式作業而產生自熱,為避免電子元件之自熱溫度超出預設的測試溫度,而影響測試品質,業者係於測試模組之測試座上方裝配有具散熱結構之蓋體,並利用散熱結構與電子元件作冷熱交換,使電子元件之溫度保持於預設之測試溫度範圍內,進而確保電子元件之檢測良率。 Nowadays, after the electronic component is packaged in the back stage, in order to ensure the quality of the product, the electronic component is placed in the test socket of the test module to perform a test operation to detect whether the electronic component is damaged during the manufacturing process, so as to eliminate the Good product, because the electronic components in the process of performing the test operation, it will generate self-heating due to the execution of the program operation. In order to avoid the self-heating temperature of the electronic components exceeding the preset test temperature and affecting the test quality, the manufacturer is in the test mode. The test seat of the group is equipped with a cover body with a heat dissipation structure, and the heat dissipation structure and the electronic components are used for cold heat exchange, so that the temperature of the electronic components is maintained within a preset test temperature range, thereby ensuring the detection yield of the electronic components.

請參閱第1、2圖,複數個測試模組10係裝配於一測試電路板20上,各測試模組10包含有測試座11及蓋體12,該測試座11係設有容置電子元件之容置槽111,並於容置槽111內配置有複數個電性連接測試電路板20之探針112,另於測試座11之兩側凹設有扣合部113,該蓋體12之頂面係設有散熱結構,該散熱結構係設有一凸伸出於蓋體12底面之傳導件121,以接觸傳導電子元件之自熱,並連結位於蓋體12頂面之散熱鯺片122,而散熱鯺片122之上方則裝配有散熱風扇123,另於蓋體12之兩側相對應測試座11之扣合部113位置以樞軸124樞設有卡勾125,各卡勾125之一端與蓋體12間係設有彈簧126,另一端則設有勾部1251,以勾扣於測試座11之扣合部113,使蓋體12蓋置 定位於測試座11上;請參閱第3、4圖,於使用時,工作人員係以手部按壓蓋體12兩側之二卡勾125一端,卡勾125即壓縮彈簧126,並以樞軸124為旋轉中心,使另一端之勾部1251向外擺動而脫離測試座11之扣合部113,進而可開啟取出蓋體12,工作人員再以手動方式將待測之電子元件30置入於測試座11之容置槽111內,接著以手動方式再將蓋體12蓋置於測試座11之上方,並釋放二卡勾125,使二卡勾125利用彈簧126之彈力而復位,並以勾部1251勾扣於測試座11之扣合部113,以關閉測試座11,並令傳導件121接觸傳導電子元件30之自熱,再利用蓋體12頂面之散熱鯺片122及散熱風扇123散熱,以使電子元件30之溫度保持於預設之測試溫度範圍內,進而確保電子元件30之檢測良率;惟,此一手動啟閉測試模組10之使用方式,具有如下缺失: Referring to FIGS. 1 and 2 , a plurality of test modules 10 are mounted on a test circuit board 20 . Each test module 10 includes a test stand 11 and a cover 12 . The test stand 11 is provided with a receiving electronic component. The receiving slot 111 is disposed, and a plurality of probes 112 electrically connected to the test circuit board 20 are disposed in the receiving slot 111, and a fastening portion 113 is recessed on both sides of the test socket 11, and the cover body 12 is The top surface is provided with a heat dissipating structure, and the heat dissipating structure is provided with a conductive member 121 protruding from the bottom surface of the cover body 12 to contact the self-heating of the conductive electronic component, and to connect the heat dissipating fins 122 on the top surface of the cover body 12, A heat dissipating fan 123 is disposed above the heat dissipating fins 122, and a hook 125 is pivotally disposed at a position of the latching portion 113 of the test seat 11 on both sides of the cover body 12, and one end of each of the hooks 125 A spring 126 is disposed between the cover body 12 and a hook portion 1251 is provided at the other end to hook the buckle portion 113 of the test seat 11 to cover the cover body 12 It is located on the test stand 11; please refer to the figures 3 and 4, in use, the staff presses one end of the two hooks 125 on both sides of the cover body 12 by hand, and the hook 125 is a compression spring 126 and is pivoted. 124 is a center of rotation, so that the hook portion 1251 of the other end swings outwardly away from the fastening portion 113 of the test seat 11, so that the cover body 12 can be opened and the staff member manually inserts the electronic component 30 to be tested. In the receiving slot 111 of the test seat 11, the cover 12 is then manually placed over the test seat 11, and the two hooks 125 are released, so that the two hooks 125 are reset by the spring force of the spring 126, and The hook portion 1251 is hooked on the fastening portion 113 of the test seat 11 to close the test socket 11, and the conductive member 121 is in contact with the self-heating of the conductive electronic component 30, and then the heat dissipation fin 122 and the cooling fan on the top surface of the cover 12 are used. The heat is dissipated to maintain the temperature of the electronic component 30 within a preset test temperature range, thereby ensuring the detection yield of the electronic component 30. However, the use of the manual opening and closing test module 10 has the following disadvantages:

1.業者以人工作業方式啟閉測試模組10之蓋體12,若測試模組10數量龐大時,勢必需配置較多人力逐一啟閉蓋體12,造成增加作業成本之缺失。 1. The operator opens and closes the cover 12 of the test module 10 by manual operation. If the number of test modules 10 is large, it is necessary to configure more manpower to open and close the cover 12 one by one, resulting in an increase in operating cost.

2.由於蓋體12上配置有傳導件121、散熱鯺片122及散熱風扇123等元件,導致蓋體12之重量較重,於測試作業時,工作人員必須費力將複數個測試模組10之蓋體12由測試座11上逐一取下,以供電子元件30置入於測試座11,再費力將蓋體12逐一重新蓋置扣合於測試座11上,以致人工啟閉作業不僅耗時費力,亦降低測試產能。 2. Since the cover 12 is provided with components such as the conductive member 121, the heat dissipation fins 122, and the heat dissipation fan 123, the weight of the cover 12 is relatively heavy. During the test operation, the worker must laboriously cover the cover of the plurality of test modules 10. 12 is removed one by one from the test stand 11 for the electronic component 30 to be placed in the test stand 11, and then the cover body 12 is re-attached one by one to the test stand 11, so that the manual opening and closing operation is not only time-consuming and laborious, It also reduces test capacity.

3.當工作人員以手動方式開啟測試模組10之蓋體12後,又需以手動方式逐一於測試座11取放電子元件30,更增加上下料作業時間,進而降低測試產能。 3. After the staff member manually opens the cover 12 of the test module 10, the electronic component 30 needs to be manually and manually placed on the test stand 11 to increase the loading and unloading operation time, thereby reducing the test throughput.

本發明之目的一,係提供一種電子元件測試模組之啟閉裝置(一),其測試模組係設有測試座及一蓋置於測試座上之蓋體,該具散熱結構之蓋體並以複數個卡勾勾扣測試座之扣合部定位,該啟閉裝置包含移載機構及啟閉單元,該移載機構係設有作 至少一方向位移之移載具,以連結裝配啟閉單元,該啟閉單元係設有至少一驅動源,以驅動至少一夾具之二夾持件作相對位移,使二夾持件壓抵或釋放測試模組之蓋體的二卡勾脫離或勾扣於測試座之扣合部,而將蓋體取出或蓋置於測試座,進而開啟或關閉測試模組之蓋體;藉此,可自動化啟閉測試模組,而大幅縮減人力配置,達到節省成本之實用效益。 An object of the present invention is to provide an opening and closing device (1) for an electronic component test module, wherein the test module is provided with a test seat and a cover placed on the test seat, and the cover body having the heat dissipation structure And the plurality of hooks are hooked to the fastening portion of the test seat, and the opening and closing device comprises a transfer mechanism and an opening and closing unit, and the transfer mechanism is provided The at least one direction shifting carrier is coupled to the assembly opening and closing unit, wherein the opening and closing unit is provided with at least one driving source for driving the two clamping members of the at least one clamping member to be relatively displaced, so that the two clamping members are pressed or The two hooks of the cover of the release test module are detached or hooked to the fastening portion of the test seat, and the cover body is taken out or placed in the test seat, thereby opening or closing the cover of the test module; thereby, Automated opening and closing of test modules, and greatly reduced manpower allocation, to achieve cost-effective practical benefits.

本發明之目的二,係提供一種電子元件測試模組之啟閉裝置(一),其中,該移載機構之移載具可帶動啟閉單元之複數個夾具對應於複數個測試模組,該啟閉單元之複數個驅動源即驅動複數個夾具取放複數個蓋體,進而自動化一次啟閉一批次測試模組之蓋體,以大幅縮減啟閉蓋體作業時間,達到提升測試產能之實用效益。 The object of the present invention is to provide an opening and closing device (1) for an electronic component test module, wherein the transfer device of the transfer mechanism can drive a plurality of clamps of the opening and closing unit to correspond to a plurality of test modules, The plurality of driving sources of the opening and closing unit drive a plurality of fixtures to pick up and place a plurality of covers, thereby automatically opening and closing the cover of a batch of test modules, so as to greatly reduce the working time of the opening and closing cover, thereby improving the test capacity. Practical benefits.

本發明之目的三,係提供一種電子元件測試模組之啟閉裝置(一),其中,該啟閉單元係以架板裝配複數個驅動源,並於架板與移載機構之移載具間設有連接結構,該連接結構係於架板與移載具間設有相互配合之具卡掣部的第一連結座及具嵌扣件的第二連結座,於更換整個啟閉單元時,可以氣動方式驅動嵌扣件自動化脫離或卡合卡掣部,即可便利裝拆整個啟閉單元,達到提升使用效能之實用效益。 The third object of the present invention is to provide an opening and closing device (1) for an electronic component test module, wherein the opening and closing unit is configured to assemble a plurality of driving sources by using a shelf plate, and to transfer the carrier to the carrier plate and the transfer mechanism. A connecting structure is provided between the frame plate and the transfer carrier, and a first connecting seat with a locking portion and a second connecting seat with a fastening member are arranged between the frame and the transfer carrier, when the entire opening and closing unit is replaced It can pneumatically drive the embedded fasteners to automatically disengage or snap the card jaws, so that the entire opening and closing unit can be conveniently assembled and disassembled, thereby achieving the practical benefit of improving the use efficiency.

本發明之目的四,係提供一種電子元件測試模組之啟閉裝置(一),其中,該啟閉裝置係設有具至少一拾取器之拾取機構,於啟閉單元自動化開啟測試模組之蓋體後,拾取機構即可以拾取器自動化於測試座取放電子元件,毋需以人工取放,以大幅縮減上下料作業時間,達到提升測試產能之實用效益。 The fourth object of the present invention is to provide an opening and closing device (1) for an electronic component test module, wherein the opening and closing device is provided with a picking mechanism having at least one picker, and the test module is automatically opened in the opening and closing unit. After the cover body, the pick-up mechanism can automatically pick up and place the electronic components in the test stand, and it is not necessary to manually pick and place, so as to greatly reduce the loading and unloading operation time, and achieve the practical benefit of improving the test capacity.

〔習知〕 [study]

10‧‧‧測試模組 10‧‧‧Test module

11‧‧‧測試座 11‧‧‧ test seat

111‧‧‧容置槽 111‧‧‧ accommodating slots

112‧‧‧探針 112‧‧‧Probe

113‧‧‧扣合部 113‧‧‧Withholding department

12‧‧‧蓋體 12‧‧‧ Cover

121‧‧‧傳導件 121‧‧‧Transmission parts

122‧‧‧散熱鯺片 122‧‧‧Heat cooling film

123‧‧‧散熱風扇 123‧‧‧ cooling fan

124‧‧‧樞軸 124‧‧‧ pivot

125‧‧‧卡勾 125‧‧‧ card hook

1251‧‧‧勾部 1251‧‧‧Hook

126‧‧‧彈簧 126‧‧ ‧ spring

20‧‧‧測試電路板 20‧‧‧Test circuit board

30‧‧‧電子元件 30‧‧‧Electronic components

〔本發明〕 〔this invention〕

40‧‧‧啟閉裝置 40‧‧‧Opening and closing device

41‧‧‧移載機構 41‧‧‧Transportation mechanism

411‧‧‧第一移送器 411‧‧‧First Transferr

412‧‧‧第二移送器 412‧‧‧Second transfer

4121‧‧‧馬達 4121‧‧‧Motor

4122‧‧‧傳動組 4122‧‧‧Transmission group

413‧‧‧機架 413‧‧‧Rack

414‧‧‧移載具 414‧‧‧Transfer Vehicle

415‧‧‧第二連結座 415‧‧‧Second joint

4151‧‧‧嵌扣件 4151‧‧‧Inlay fasteners

42‧‧‧啟閉單元 42‧‧‧Opening unit

421‧‧‧架板 421‧‧‧ ‧ boards

422‧‧‧第一連結座 422‧‧‧ first joint

4221‧‧‧卡掣部 4221‧‧‧Card Department

423‧‧‧驅動源 423‧‧‧ drive source

424、425‧‧‧夾持件 424, 425‧‧‧Clamping parts

4241、4251‧‧‧第一墊體 4241, 4251‧‧‧ first cushion

4242、4252‧‧‧第二墊體 4242, 4252‧‧‧ second cushion

43‧‧‧拾取機構 43‧‧‧ picking institutions

431‧‧‧第三移送器 431‧‧‧ Third Transfer

432‧‧‧拾取器 432‧‧‧ Picker

50‧‧‧測試模組 50‧‧‧Test module

51‧‧‧測試座 51‧‧‧ test seat

511‧‧‧容置槽 511‧‧‧ accommodating slots

512‧‧‧探針 512‧‧‧ probe

513、514‧‧‧扣合部 513, 514‧‧‧Deduction Department

52‧‧‧蓋體 52‧‧‧ Cover

521、522‧‧‧樞軸 521, 522‧‧ ‧ pivot

523、524‧‧‧卡勾 523, 524‧‧‧ hooks

5231、5241‧‧‧承壓部 5231, 5241‧‧‧ Pressure Department

5232、5242‧‧‧勾部 5232, 5242‧‧ ‧ hook

525、526‧‧‧彈簧 525, 526‧‧ spring

53‧‧‧測試電路板 53‧‧‧Test circuit board

531‧‧‧傳導件 531‧‧‧Transmission parts

532‧‧‧散熱鯺片 532‧‧‧Hot film

533‧‧‧散熱風扇 533‧‧‧ cooling fan

60‧‧‧電子元件 60‧‧‧Electronic components

第1圖:習知測試模組之示意圖。 Figure 1: Schematic diagram of a conventional test module.

第2圖:習知測試模組之測試座及蓋體的示意圖。 Figure 2: Schematic diagram of the test socket and cover of the conventional test module.

第3圖:習知測試模組之使用示意圖(一)。 Figure 3: Schematic diagram of the use of the conventional test module (1).

第4圖:習知測試模組之使用示意圖(二)。 Figure 4: Schematic diagram of the use of the conventional test module (2).

第5圖:本發明啟閉裝置之示意圖。 Figure 5: Schematic diagram of the opening and closing device of the present invention.

第6圖:本發明啟閉裝置之啟閉單元的示意圖。 Figure 6 is a schematic view of the opening and closing unit of the opening and closing device of the present invention.

第7圖:本發明啟閉裝置之使用示意圖(一)。 Figure 7: Schematic diagram of the use of the opening and closing device of the present invention (1).

第8圖:本發明啟閉裝置之使用示意圖(二)。 Figure 8: Schematic diagram of the use of the opening and closing device of the present invention (2).

第9圖:本發明啟閉裝置之使用示意圖(三)。 Figure 9: Schematic diagram of the use of the opening and closing device of the present invention (3).

第10圖:本發明啟閉裝置之使用示意圖(四)。 Figure 10: Schematic diagram of the use of the opening and closing device of the present invention (4).

第11圖:本發明啟閉裝置之使用示意圖(五)。 Figure 11: Schematic diagram of the use of the opening and closing device of the present invention (5).

第12圖:本發明啟閉裝置之使用示意圖(六)。 Figure 12: Schematic diagram of the use of the opening and closing device of the present invention (6).

第13圖:本發明啟閉裝置之使用示意圖(七)。 Figure 13: Schematic diagram of the use of the opening and closing device of the present invention (7).

第14圖:本發明啟閉裝置之使用示意圖(八)。 Figure 14: Schematic diagram of the use of the opening and closing device of the present invention (8).

第15圖:本發明啟閉裝置之移載機構與啟閉單元的分離示意圖。 Figure 15 is a schematic view showing the separation of the transfer mechanism and the opening and closing unit of the opening and closing device of the present invention.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第5、6圖,本發明啟閉裝置40包含移載機構41及啟閉單元42,該移載機構41係設有至少一移送器,以移送至少一移載具作至少一方向位移,於本實施例中,該移載機構係設有第一移送器411及第二移送器412,該第一移送器411係帶動一裝配有第二移送器412之機架413作第一方向(如X方向)位移,該第二移送器412係設有馬達4121,以驅動傳動組4122作動,該傳動組4122包含皮帶輪組及螺桿螺座組,並以螺桿螺座組之螺座經連結架連結一移載具414,以帶動移載具414作第二方向(如Z方向)位移,該啟閉單元42係設有至少一驅動源,以驅動至少一夾具夾放作動,更進一步,該驅動源可直接裝配於移載具414上,或者裝配於一架板上,再以架板連結移載具414,於本實施例中,啟閉單元42係設有一架板421,並於架板421之頂面與移載機構41之移載具414間設有連接結構,該連接結構係於架板421與移載具414間設有相互配合之具卡掣部的第一連結座及具嵌扣件的第二連結座,以供裝拆啟閉單元42,於本實施例 中,該連接結構係於架板421之頂面設有具卡掣部4221之第一連結座422,該卡掣部4221可為環槽,該移載具414係於底面相對應第一連結座422的位置設有第二連結座415,該第二連結座415係設有複數個可為珠體之嵌扣件4151,並以氣動方式驅動複數個嵌扣件4151卡掣或脫離第一連結座422的卡掣部4221,另於架板421之底面設有複數個可為壓缸之驅動源423,各驅動源423係驅動夾具之二夾持件424、425作相對位移,各夾持件424、425之內側面係分別設有第一墊體4241、4251,並於內頂面設有第二墊體4242、4252,用以緩衝。 In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Referring to Figures 5 and 6, the opening and closing device 40 of the present invention includes a transfer mechanism 41 and The opening and closing unit 42 is provided with at least one transfer device for transferring at least one transfer carrier for at least one direction displacement. In this embodiment, the transfer mechanism is provided with a first transfer device 411 and a second transfer 412, the first transfer device 411 drives a frame 413 equipped with a second transfer device 412 for displacement in a first direction (such as an X direction), and the second transfer device 412 is provided with a motor 4121. The drive transmission group 4122 is actuated. The transmission group 4122 includes a pulley set and a screw base set, and the transfer base 414 is coupled to the transfer carrier 414 by the screw seat of the screw screw set to drive the transfer carrier 414 to the second direction (eg, In the Z direction), the opening and closing unit 42 is provided with at least one driving source for driving at least one clamp to be actuated. Further, the driving source can be directly mounted on the transfer carrier 414 or mounted on a board. And the carrier 414 is connected by a shelf. In this embodiment, the opening and closing unit 42 A plate 421 is disposed, and a connection structure is disposed between the top surface of the shelf plate 421 and the transfer carrier 414 of the transfer mechanism 41. The connection structure is provided between the shelf plate 421 and the transfer carrier 414. a first connecting seat of the latching portion and a second connecting seat having a fastening member for attaching and detaching the opening and closing unit 42 in the embodiment The connecting structure is provided with a first connecting seat 422 having a latching portion 4221 on the top surface of the shelf 421. The latching portion 4221 can be a ring groove, and the transfer carrier 414 is connected to the bottom surface to correspond to the first link. The second connecting seat 415 is provided with a plurality of inserting members 4151 which can be a bead body, and pneumatically drives a plurality of inflating members 4151 to be snapped or disengaged from the first position. The latching portion 4221 of the connecting base 422 is further provided with a plurality of driving sources 423 which are pressurizing cylinders on the bottom surface of the mounting plate 421, and the driving elements 423 are driven by the two holding members 424 and 425 for relative displacement, and the respective clips are respectively The inner side surfaces of the holding members 424 and 425 are respectively provided with first mat bodies 4241 and 4251, and second inner mat bodies 4242 and 4252 are provided on the inner top surface for buffering.

請參閱第7、8、9圖,係為本發明啟閉裝置40應用之測試模組50,複數個測試模組50係配置於測試電路板上,該測試模組50包含測試座51及蓋體52,該測試座51係設有承置電子元件之容置槽511,並於容置槽511內配置有複數個電性連接測試電路板之探針512,另於測試座51之兩側凹設有扣合部513、514,該蓋體52係於相對應測試座51之扣合部513、514位置以樞軸521、522樞設有卡勾523、524,各卡勾523、524一端之承壓部5231、5241與蓋體52間係設有彈簧525、526,另一端則設有勾部5232、5242,以勾扣於測試座51之扣合部513、514,又該蓋體52上係設有輔助電子元件散熱之散熱結構,該散熱結構係設有一凸伸出於蓋體52底面之傳導件531,以接觸傳導電子元件之自熱,並連結位於蓋體52頂面之散熱鯺片532,而散熱鯺片532之上方則裝配有散熱風扇533;於使用啟閉裝置40開啟測試模組50之蓋體52時,該啟閉裝置40之移載機構41的第一移送器411係載送第二移送器412及啟閉單元42作X方向位移至測試模組50之上方,並使複數個夾具對位於複數個蓋體52,接著第二移送器412之馬達4121驅動傳動組4122,並經由傳動組4122之螺座帶動移載具414及啟閉單元42作Z方向下降位 移,使啟閉單元42之各夾具的二夾持件424、425位於各蓋體52之二卡勾523、524側方。 Referring to Figures 7, 8, and 9, the test module 50 is applied to the opening and closing device 40 of the present invention. The plurality of test modules 50 are disposed on the test circuit board. The test module 50 includes the test stand 51 and the cover. The test block 51 is provided with a receiving slot 511 for mounting electronic components, and a plurality of probes 512 electrically connected to the test circuit board are disposed in the receiving slot 511, and are further disposed on both sides of the test socket 51. The recesses 513 and 514 are recessed, and the hooks 523 and 524 are pivoted by the pivots 521 and 522 at the positions of the engaging portions 513 and 514 of the corresponding test seats 51. The hooks 523 and 524 are respectively disposed. Springs 525 and 526 are disposed between the pressure receiving portions 5231 and 5241 of one end and the cover 52, and hook portions 5232 and 5242 are provided at the other end to hook the fastening portions 513 and 514 of the test seat 51. The body 52 is provided with a heat dissipation structure for dissipating heat of the auxiliary electronic component. The heat dissipation structure is provided with a conductive member 531 protruding from the bottom surface of the cover 52 to contact the self-heating of the conductive electronic component, and is connected to the top surface of the cover 52. The heat dissipation fin 532 is disposed above the heat dissipation fin 532, and the heat dissipation fan 533 is mounted thereon; the cover of the test module 50 is opened by using the opening and closing device 40. At 52 o'clock, the first transfer device 411 of the transfer mechanism 41 of the opening and closing device 40 carries the second transfer device 412 and the opening and closing unit 42 for displacement in the X direction above the test module 50, and makes a plurality of clamp pairs The plurality of covers 52 are located, and then the motor 4121 of the second transfer device 412 drives the transmission group 4122, and drives the transfer carrier 414 and the opening and closing unit 42 to rotate in the Z direction via the screw seat of the transmission group 4122. The two holding members 424 and 425 of the respective clamps of the opening and closing unit 42 are placed on the side of the two hooks 523 and 524 of the respective covers 52.

請參閱第10圖,該啟閉單元42之驅動源423係驅動夾具之二夾持件424、425作相對位移,而壓抵蓋體52之二卡勾523、524的承壓部5231、5241,並利用第一墊體4241、4251與承壓部5231、5241相貼合而增加接觸磨擦力,以確實平穩夾持二卡勾523、524,二卡勾523、524之承壓部5231、5241係壓縮彈簧525、526,並以樞軸521、522為旋轉中心而向外擺動,令勾部5232、5242脫離測試座51之扣合部513、514。 Referring to FIG. 10, the driving source 423 of the opening and closing unit 42 drives the two clamping members 424 and 425 of the clamp to be relatively displaced, and presses against the pressure receiving portions 5231 and 5241 of the two hooks 523 and 524 of the cover 52. And the first pad body 4241, 4251 is adhered to the pressure receiving portions 5231, 5241 to increase the contact friction force, so as to smoothly clamp the two hooks 523, 524, the pressure portions 5231 of the two hooks 523, 524. The 5241 is a compression spring 525, 526, and swings outwardly with the pivots 521, 522 as a center of rotation, so that the hook portions 5232, 5242 are disengaged from the engaging portions 513, 514 of the test seat 51.

請參閱第7、11圖,於蓋體52之二卡勾523、524脫離測試座51後,該移載機構41之第二移送器412的馬達4121驅動傳動組4122,並經由傳動組4122之螺座帶動移載具414及啟閉單元42作Z方向上升位移,使啟閉單元42之夾具的二夾持件424、425夾持蓋體52離開測試座51,進而開啟測試模組50之蓋體52,接著第一移送器411係載送第二移送器412及啟閉單元42作X方向反向位移離開測試模組50之上方,以供測試座51進行上料作業。 Referring to FIGS. 7 and 11, after the two hooks 523 and 524 of the cover 52 are separated from the test seat 51, the motor 4121 of the second transfer unit 412 of the transfer mechanism 41 drives the transmission group 4122 and is driven by the transmission group 4122. The screw base moves the transfer carrier 414 and the opening and closing unit 42 to increase the displacement in the Z direction, so that the two clamping members 424 and 425 of the clamp of the opening and closing unit 42 clamp the cover 52 away from the test seat 51, thereby opening the test module 50. The cover 52, then the first transfer 411 carries the second transfer 412 and the opening and closing unit 42 for reverse displacement in the X direction from above the test module 50 for the test stand 51 to perform the loading operation.

請參閱第11、12圖,該上料作業可採人工上料或自動化上料,由於本發明可自動化開啟測試模組50之蓋體52,為使啟閉裝置40一貫自動化作業,毋需以人工取放電子元件,以大幅縮減上下料作業時間,本發明啟閉裝置40更包含設有拾取機構43,該拾取機構43係設有至少一取放電子元件之拾取器,以及設有至少一移送器帶動拾取器作至少一方向位移,於本實施例中,該拾取機構43係設有第三移送器431帶動具有待測電子元件60之拾取器432作X方向位移至測試模組50之測試座51上方,第三移送器431再帶動拾取器432作Z方向位移將待測電子元件60置入於測試座51之容置槽511,使待測電子元件60電性接觸測試座51之探針512,以 完成上料作業,該拾取機構43之第三移送器431再帶動複數個拾取器432作X-Z方向位移離開測試模組50之上方。 Referring to Figures 11 and 12, the loading operation can be manually loaded or automated. Since the present invention can automatically open the cover 52 of the test module 50, in order to automate the operation of the opening and closing device 40, it is necessary to The electronic component is manually picked up and lowered to greatly reduce the loading and unloading operation time. The opening and closing device 40 of the present invention further includes a picking mechanism 43 that is provided with at least one pick-and-place electronic component pick-up device and at least one The pick-up device drives the pick-up device to be displaced in at least one direction. In the embodiment, the pick-up mechanism 43 is provided with a third transporter 431 for driving the pick-up 432 having the electronic component 60 to be tested for X-direction displacement to the test module 50. Above the test stand 51, the third transfer device 431 drives the pick-up 432 to shift the Z-direction to place the electronic component 60 to be tested in the receiving slot 511 of the test stand 51, so that the electronic component 60 to be tested is electrically contacted with the test stand 51. Probe 512 to After the loading operation is completed, the third conveyor 431 of the picking mechanism 43 drives the plurality of pickers 432 to move away from the test module 50 in the X-Z direction.

請參閱第7、13、14圖,該移載機構41之第一移送器411係載送第二移送器412及啟閉單元42作X方向位移至測試模組50之上方,並使複數個夾具之二夾持件424、425夾持複數個蓋體52對位於複數個測試座51,由於二夾持件424、425仍壓抵夾持蓋體52之二卡勾523、524,使得二卡勾523、524保持呈外張狀態,接著第二移送器412之馬達4121驅動傳動組4122,並經由傳動組4122之螺座帶動移載具414及啟閉單元42作Z方向下降位移,使啟閉單元42之夾具的二夾持件424、425將夾持之蓋體52蓋置於測試座51上,令蓋體52之二卡勾523、524對位於測試座51之二扣合部513、514,該啟閉單元42之驅動源423係驅動夾具之二夾持件424、425作反向位移,而釋放蓋體52之二卡勾523、524,二卡勾523、524利用彈簧525、526之復位彈力,以樞軸521、522為旋轉中心而向內擺動,使二卡勾523、524之勾部5232、5242勾扣於測試座51之扣合部513、514,使蓋體52蓋置定位於測試座51上,以關閉測試座51。 Referring to Figures 7, 13, and 14, the first transfer unit 411 of the transfer mechanism 41 carries the second transfer unit 412 and the opening and closing unit 42 for displacement in the X direction above the test module 50, and makes a plurality of The clamping member 424, 425 holds the plurality of cover bodies 52 in a plurality of test seats 51, and the two clamping members 424, 425 are still pressed against the two clamping hooks 523, 524 of the clamping cover 52, so that two The hooks 523 and 524 are kept in an external state, and then the motor 4121 of the second conveyor 412 drives the transmission group 4122, and drives the transfer carrier 414 and the opening and closing unit 42 to perform a Z-direction downward displacement via the screw seat of the transmission group 4122. The two clamping members 424 and 425 of the clamp of the opening and closing unit 42 cover the clamping cover 52 on the test seat 51, so that the two hooks 523 and 524 of the cover 52 are located at the two fastening portions of the test seat 51. 513, 514, the driving source 423 of the opening and closing unit 42 drives the two clamping members 424, 425 of the clamp to reverse displacement, and releases the two hooks 523, 524 of the cover 52, and the two hooks 523, 524 utilize springs. The reset spring force of 525 and 526 is pivoted inward with the pivots 521 and 522 as the center of rotation, so that the hook portions 5232 and 5242 of the two hooks 523 and 524 are hooked on the test seat. The engaging portions 513 and 514 of the 51 position the cover 52 on the test seat 51 to close the test seat 51.

請參閱第7、15圖,該移載機構41之第一移送器411及第二移送器412係帶動啟閉單元42作X-Z方向位移離開測試模組50,由於蓋體52蓋置於測試座51上時,係令傳導件531接觸待測電子元件60,當待測電子元件60於測試座51內執行測試作業且產生自熱時,待測電子元件60之自熱可經由傳導件531傳導至散熱鯺片532散熱,並利用散熱風扇533輔助散熱,使得待測電子元件60保持於預設之測試溫度範圍內,進而確保檢測良率,於測試完畢後,該啟閉裝置40可利用複數個夾具夾持取出蓋體52,進而開啟測試座51以供上下料。 Referring to FIGS. 7 and 15 , the first transfer unit 411 and the second transfer unit 412 of the transfer mechanism 41 drive the opening and closing unit 42 to move away from the test module 50 in the XZ direction, because the cover 52 is placed on the test seat. When 51 is on, the conductive member 531 is contacted with the electronic component 60 to be tested. When the electronic component 60 to be tested performs a test operation in the test socket 51 and generates self-heating, the self-heating of the electronic component 60 to be tested can be conducted via the conductive member 531. The heat dissipation fins 532 radiate heat, and the heat dissipation fan 533 is used to assist heat dissipation, so that the electronic component 60 to be tested is maintained within a preset test temperature range, thereby ensuring the detection yield. After the test is completed, the opening and closing device 40 can utilize the plurality of The clamp grips the cover 52 and opens the test stand 51 for loading and unloading.

請參閱第16圖,本發明之啟閉裝置40可更換啟閉單元42而因應不同型態之測試模組,由於移載機構41之移載具414與啟閉單元42之架板421係利用連接結構之第一連結座422及第二連結座415連結組裝,於更換啟閉單元42時,係以氣動方式驅動第二連結座415的嵌扣件4151內縮退位而脫離第一連結座422之卡掣部4221,使移載具414與架板421分離,即可便利更換啟閉單元42,達到提升使用便利性之實用效益。 Referring to FIG. 16, the opening and closing device 40 of the present invention can replace the opening and closing unit 42 to respond to different types of test modules, and the transfer device 414 of the transfer mechanism 41 and the shelf 421 of the opening and closing unit 42 are utilized. The first connecting seat 422 and the second connecting base 415 of the connecting structure are coupled and assembled. When the opening and closing unit 42 is replaced, the fastening member 4151 of the second connecting seat 415 is pneumatically driven to retract from the first connecting seat 422. The latching portion 4221 separates the transfer carrier 414 from the shelf 421, so that the opening and closing unit 42 can be conveniently replaced, thereby achieving the practical benefit of improving the convenience of use.

41‧‧‧移載機構 41‧‧‧Transportation mechanism

414‧‧‧移載具 414‧‧‧Transfer Vehicle

415‧‧‧第二連結座 415‧‧‧Second joint

4151‧‧‧嵌扣件 4151‧‧‧Inlay fasteners

42‧‧‧啟閉單元 42‧‧‧Opening unit

421‧‧‧架板 421‧‧‧ ‧ boards

422‧‧‧第一連結座 422‧‧‧ first joint

4221‧‧‧卡掣部 4221‧‧‧Card Department

423‧‧‧驅動源 423‧‧‧ drive source

424、425‧‧‧夾持件 424, 425‧‧‧Clamping parts

4241、4251‧‧‧第一墊體 4241, 4251‧‧‧ first cushion

4242、4252‧‧‧第二墊體 4242, 4252‧‧‧ second cushion

Claims (10)

一種電子元件測試模組之啟閉裝置(一),包含:移載機構:係設有至少一移送器,以驅動至少一移載具作至少一方向位移;啟閉單元:係裝配於該移載機構之移載具,並設有至少一驅動源,以驅動至少一夾具壓夾或釋放測試模組之蓋體的二卡勾脫離或勾扣該測試模組之測試座的扣合部,而啟閉測試模組之蓋體。 An opening and closing device (1) for an electronic component test module, comprising: a transfer mechanism: at least one transfer device is provided to drive at least one transfer carrier for at least one direction displacement; and the opening and closing unit is mounted on the shift Carrying the carrier of the carrier, and providing at least one driving source for driving at least one clamp to clamp or release the two hooks of the cover of the test module to detach or hook the fastening portion of the test socket of the test module, And the cover of the test module is opened and closed. 依申請專利範圍第1項所述之電子元件測試模組之啟閉裝置(一),其中,該啟閉裝置之移載機構係設有第一移送器及第二移送器,該第一移送器係帶動至少一裝配該第二移送器之機架作第一方向位移,該第二移送器係帶動該移載具及該啟閉單元作第二方向位移。 The opening and closing device (1) of the electronic component test module according to the first aspect of the invention, wherein the transfer mechanism of the opening and closing device is provided with a first transfer device and a second transfer device, the first transfer The device drives at least one frame equipped with the second transfer device to perform a first direction displacement, and the second transfer device drives the transfer carrier and the opening and closing unit to perform a second direction displacement. 依申請專利範圍第2項所述之電子元件測試模組之啟閉裝置(一),其中,該移載機構之第二移送器係設有馬達,以驅動至少一傳動組作動,該傳動組連結驅動該移載具位移。 The opening and closing device (1) of the electronic component test module according to the second aspect of the patent application, wherein the second transfer device of the transfer mechanism is provided with a motor to drive at least one transmission group to operate, the transmission group The link drives the shifting of the transfer carrier. 依申請專利範圍第1項所述之電子元件測試模組之啟閉裝置(一),其中,該啟閉單元之驅動源係為壓缸。 The opening and closing device (1) of the electronic component test module according to the first aspect of the patent application, wherein the driving source of the opening and closing unit is a pressure cylinder. 依申請專利範圍第1項所述之電子元件測試模組之啟閉裝置(一),其中,該啟閉單元之夾具係具有二夾持件,該驅動源係帶動二該夾持件作相對位移。 The opening and closing device (1) of the electronic component test module according to claim 1, wherein the fixture of the opening and closing unit has two clamping members, and the driving source drives the clamping member to be opposite. Displacement. 依申請專利範圍第5項所述之電子元件測試模組之啟閉裝置(一),其中,該夾具之夾持件的內側面係設有第一墊體,以接觸貼合該測試模組之蓋體的卡勾。 The opening and closing device (1) of the electronic component test module according to claim 5, wherein the inner side of the clamping member of the clamp is provided with a first cushion body for contacting and fitting the test module The hook of the cover. 依申請專利範圍第5項所述之電子元件測試模組之啟閉裝置(一),其中,該夾具之夾持件的內頂面係設有第二墊體,用以緩衝。 The opening and closing device (1) of the electronic component test module according to the fifth aspect of the invention, wherein the inner top surface of the clamping member of the clamp is provided with a second cushion body for buffering. 依申請專利範圍第1項所述之電子元件測試模組之啟閉裝置(一),其中,該啟閉單元係設有至少一架板,並於該架板上 裝配該至少一驅動源。 The opening and closing device (1) of the electronic component test module according to claim 1, wherein the opening and closing unit is provided with at least one plate on the shelf plate The at least one drive source is assembled. 依申請專利範圍第8項所述之電子元件測試模組之啟閉裝置(一),其中,該啟閉單元之架板與該移載機構之移載具間係設有連接結構,該連接結構係於該架板與該移載具間設有相互配合之具卡掣部的第一連結座及具嵌扣件的第二連結座。 The opening and closing device (1) of the electronic component test module according to the eighth aspect of the invention, wherein the shelf of the opening and closing unit and the transfer carrier of the transfer mechanism are provided with a connection structure, the connection The structure is characterized in that a first connecting seat with a locking portion and a second connecting seat with an engaging member are disposed between the shelf and the transfer carrier. 依申請專利範圍第1項所述之電子元件測試模組之啟閉裝置(一),更包含該啟閉裝置設有拾取機構,該拾取機構係設有至少一取放電子元件之拾取器,以及設有至少一移送器帶動該拾取器作至少一方向位移。 The opening and closing device (1) of the electronic component test module according to claim 1, further comprising the pick-up device, wherein the pick-up mechanism is provided with at least one pick-and-place device for picking and placing electronic components. And providing at least one transfer device to drive the picker to be displaced in at least one direction.
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