CN202839572U - Positioning device of semiconductor package device - Google Patents
Positioning device of semiconductor package device Download PDFInfo
- Publication number
- CN202839572U CN202839572U CN 201220455431 CN201220455431U CN202839572U CN 202839572 U CN202839572 U CN 202839572U CN 201220455431 CN201220455431 CN 201220455431 CN 201220455431 U CN201220455431 U CN 201220455431U CN 202839572 U CN202839572 U CN 202839572U
- Authority
- CN
- China
- Prior art keywords
- packaging structure
- semiconductor packaging
- positioner
- briquetting
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a positioning device of a semiconductor package structure. The positioning device of the semiconductor package structure comprises a base with a rotating shaft, a pressing block which is sheathed on the rotating shaft and is in rotating cooperation with the rotating shaft, and four positioning sheets which are respectively connected with the base through a first elastic unit. The pressing block, the positioning sheets and the first elastic unit form a linkage device. The pressing block can move along the direction of the rotating shaft and enables the first elastic unit to stretch, so that an angle formed between the positioning sheets and the pressing block is changed and the semiconductor package structure is positioned on the pressing block.
Description
Technical field
The utility model relates to the positioner of semiconductor packaging structure, particularly relevant for a kind of positioner with semiconductor packaging structure of positioning function.
Background technology
Electronics industry is the fastest industry of development in recent years, its main electronic component that uses all with semiconductor packages (Semiconductor Packaging) as main flow, in order to reach compact trend, various high density, high performance semiconductor packaging structure also just in response to and give birth to, quad flat non-leaded chip package (Quad Flat Non-lead for example wherein, QFN) and BGA Package (Ball Grid Array, BGA) etc. be all the main product of present semiconductor packaging structure.
Be encapsulated as example with QFN, usually with the bearing part (Carrier) of conductive metal frames (Leadframe) as chip, and chip configuration is on bearing part, and the electric signal of chip can be passed to extraneous electronic installation by the pin on the bearing part (Pin).
Generally speaking, after the package fabrication process of finishing chip and bearing part, can test for the product that encapsulation is finished, to detect the semiconductor packages finished product that does not meet quality requirement.Wherein need semiconductor is packaged into electrically testing of product, detect its Electronic Performance and whether meet the requirements.Generally comprise functional test (Function Test) and open circuit/short-circuit test (Open/Short Test).Hereinafter be described further for the testing apparatus of existing semiconductor packaging structure and the positioner before the test thereof.
Existing positioner generally comprises a fixing pedestal, is placed with briquetting at pedestal, and briquetting has a smooth upper surface and is used for placing semiconductor packaging structure to be tested.Existing positioner in addition collocation uses a testboard, and described testboard has a plurality of holes, has placed probe in the hole, and described probe is matrix form and arranges.In the process of test, semiconductor packaging structure at first is placed on the briquetting, be rotated, to determine the direction of semiconductor packaging structure, semiconductor packaging structure is placed on the testboard more afterwards, probe stretches out the pin of the semiconductor packaging structure of hole contact measured examination, thereby by the loop that test circuit, probe and semiconductor packaging structure consist of semiconductor packaging structure is carried out testing electrical property.Before semiconductor packaging structure is positioned over briquetting, at first pass through the fixedly position of pin of an image detection system one, general this pin is defined as the first pin (Pin 1), detection signal can reflect the position of the first pin, image detection system is determined the angle of semiconductor packaging structure needs rotation according to the position signalling that detects, and this angle signal is sent to the angle corresponding to controlling organization control briquetting rotation of briquetting, to determine the in the right direction of semiconductor packaging structure.But in this process only for the direction of semiconductor packaging structure proofread and correct, but the up and down inaccurate situation that causes pin and probe contraposition to be forbidden of position of semiconductor packaging structure also may appear, so then may cause test result inaccurate, the problem that defective products increases.
At present more existing manufacturers have developed the positioner of head it off, but all need to adopt the controlling organization such as motor to position function, and cost is expensive, and mounting cost higher also being difficult for changed and safeguard.
Therefore, be necessary to provide a kind of semiconductor packaging structure test front positioner, to solve the existing problem of prior art.
The utility model content
In view of this, the utility model provides a kind of positioner of semiconductor packaging structure, to solve the front problem that contraposition is inaccurate, positioning result is inaccurate and cost is higher of the existing semiconductor packaging structure test of prior art.
Main purpose of the present utility model is to provide a kind of positioner of semiconductor packaging structure, automatic location before it can be tested semiconductor packaging structure by mechanical structure, improve the accuracy of test, owing to need not to use the controlling organization such as motor, thereby cost is lower.
For reaching aforementioned purpose of the present utility model, the utility model provides a kind of positioner of semiconductor packaging structure, and the positioner of wherein said semiconductor packaging structure comprises: a pedestal, a briquetting and four spacers.Described pedestal has a rotating shaft.Described briquetting is sheathed in the described rotating shaft and with described rotating shaft and is rotatably assorted.Described four spacers are connected to described pedestal by one first Flexible element respectively.Described briquetting, described spacer and described the first Flexible element consist of a linkage, described briquetting can move and makes described the first Flexible element flexible along described rotor shaft direction, thereby so that a corner dimension that forms between described spacer and the described briquetting changes, to be used for location semiconductor packaging structure in described briquetting.
Compared with prior art, the positioner of semiconductor packaging structure of the present utility model not only can improve the contraposition accuracy before the semiconductor packaging structure test, improves the accuracy of positioning result, and cost low being easy to realize.
Description of drawings
Fig. 1 is the cutaway view of the positioner of the utility model one embodiment semiconductor packaging structure.
Fig. 2 is the top view of the positioner of the utility model one embodiment semiconductor packaging structure.
Fig. 3 is the work schematic diagram of the positioner of the utility model one embodiment semiconductor packaging structure.
Fig. 4 is another work schematic diagram of the positioner of the utility model one embodiment semiconductor packaging structure.
Embodiment
For allowing the utility model above-mentioned purpose, feature and advantage become apparent, the utility model preferred embodiment cited below particularly, and cooperation accompanying drawing are described in detail below.Moreover, the direction term that the utility model is mentioned, such as " on ", D score, 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side " etc., only be the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the utility model, but not in order to limit the utility model.
Fig. 1 and Fig. 2 are respectively cutaway view and the top views of the utility model one embodiment, please refer to Fig. 1 and shown in Figure 2, the positioner 100 of the semiconductor packaging structure of the utility model one embodiment mainly comprises pedestal 110, briquetting 120, spacer 130, the first Flexible element 140, the second Flexible element 150.
In the present embodiment, pedestal 110 has a rotating shaft 111, and briquetting 120 is sheathed in the rotating shaft 111, and spacer 130 is connected to pedestal 110 by the first Flexible element 140, and briquetting 120, spacer 130 and the first Flexible element 140 form a link gear.
In the present embodiment, rotating shaft 111 can rotate and can move up and down along axis, has a sealing ring 112 around rotating shaft 111 belows and is used for sealing.Rotating shaft 111 is located in the central axis hole (not indicating) of briquetting 120, and sealing ring 112 breaks away from central axis hole in order to prevent rotating shaft 111.Thereby can rotating along axis synchronously with rotating shaft 111, briquetting 120 can realize controlling the function that semiconductor packaging structure rotates in the location.
In the present embodiment, briquetting 120 has an end difference 121, and having a protuberance 131, spacer 130 is equipped with end difference 121 belows in briquetting 120, protuberance 131 can form a circular arc lead angle with the corner position of end difference 121 butts, in case fastening bit slice 130 is stuck with briquetting 120.And protuberance 131 has an assembly hole 132.The first Flexible element 140 parts are located in the assembly hole 132, and an end is fixed on the spacer 130 by assembly hole 132, the other end be fixed on the pedestal 110 or another assembly hole (not illustrating) of its formation in.
In the present embodiment, spacer 130 can be designed to be positioned at around the briquetting 120, thereby better semiconductor packaging structure is positioned.And spacer 130 is L-shaped, has lead angle 133 in the bending place.Lead angle 133 is elongated slots, and it is so that stuck in order to prevent spacer 130 and briquetting 120 in the open closed process of spacer 130.
In the present embodiment, briquetting 120 also can be connected on the bottom surface 113 of pedestal 110 by the second Flexible element 150, and the second Flexible element 150 can play the effect of buffering in the process that briquetting 120 moves up and down along rotating shaft 111.
In the present embodiment, the first Flexible element 140 and the second Flexible element 150 are helical spring, but the invention is not restricted to this, also can be the structure that other have elasticity, such as shell fragment, elastic gel etc.
Fig. 3 and Fig. 4 are the work schematic diagram of the utility model one embodiment, introduce the working method of the present embodiment hereinafter with reference to Fig. 3 and Fig. 4.
Please refer to shown in Figure 3ly, when carrying out pre-determined bit before semiconductor packaging structure test, adsorbent equipment 200 moves to positioner 100 tops after semiconductor packaging structure 300 is picked up.Adsorbent equipment 200 comprises depression bar 210 and suction nozzle 220.In the present embodiment, suction nozzle 220 is that mode by vacuum suction is adsorbed on semiconductor packaging structure 300 on the adsorbent equipment 200.
Before semiconductor packaging structure 300 is positioned on the positioner 100, has certain height H between briquetting 120 and the bottom surface 113
1, have certain angle θ between spacer 130 and the briquetting 120
1This moment, spacer 130 was in open mode, owing to having certain angle θ between spacer 130 and the briquetting 120
1, so semiconductor packaging structure 300 has larger space and can guarantee to be placed on the briquetting 120, that is fault-tolerance is higher.
Please refer to Fig. 4 described, after adsorbent equipment 200 is placed on semiconductor packaging structure 300 on the briquetting 120, exert pressure downwards again.Briquetting 120 moves down along rotating shaft 111, compresses the second Flexible element 150, so that the height between briquetting 120 and the bottom surface 113 is reduced to H
2, H
2Can level off to 0.Because briquetting 120 moves down, so the lug boss 131 of 121 pairs of spacers 130 of end difference exerts pressure, thereby the first Flexible element 140 is compressed, so the angle between spacer 130 and the briquetting 120 diminishes and is θ
2Thereby four limits of semiconductor packaging structure 300 are locates after the sheet 130 that is positioned clamps.
H in the present embodiment
2Be zero, that is briquetting 120 close proximity to grounds 113, the stroke of semiconductor packaging structure is H
1But the present invention is not limited to this, as long as probe 160 stretches out in hole 121 and the pin of contact semiconductor packaging structure 300, general semiconductor packaging structure 300 required strokes are about 0.2 millimeter to 0.25 millimeter.Semiconductor packaging structure 300 for example is quad flat non-leaded chip package (Quad Flat Non-lead, QFN) and BGA Package (Ball Grid Array, BGA), but the present invention is not limited to this.
θ in the present embodiment
2Be zero, that is spacer 130 is adjacent to briquetting 120, but the present invention also is not limited to this, θ
2Size generally determined by the size of projection 120 with semiconductor packaging structure 300, if the area of semiconductor packaging structure 300 is greater than the area of projection 120, then θ
2Non-vanishing, in other words, can adjust according to the size of semiconductor packaging structure to be tested 300 size of briquetting 120, also can adopt same briquetting 120 and adjust pressure or the stroke size that adsorbent equipment 200 presses down semiconductor packaging structure 300, thereby so that spacer 130 can clamp semiconductor packaging structure 300, play the effect of location.
In addition, the positioner 100 of described semiconductor packaging structure more can be arranged in pairs or groups and be used a detection system and a testboard (not shown), wherein before semiconductor packaging structure is put into the briquetting 120 of described positioner 100, utilizing first described detection system that semiconductor packaging structure 300 is carried out image detects, detect the direction (orientation) of described semiconductor packaging structure 300, and sending an angle signal for controlling described briquetting 120 rotations, the direction of semiconductor packaging structure 300 first pins (not shown) is adjusted in the angle signal rotation that briquetting 120 sends according to detection system.After the direction of semiconductor packaging structure 300 and position all are determined, adsorbent equipment 200 moves to described testboard with semiconductor packaging structure 300 and carries out testing electrical property, described testboard has a plurality of holes, placed probe (probe) in the hole, described probe is matrix form and arranges, the pin of the semiconductor packaging structure 300 of the extended hole contact measured examination of probe, thus by the loop that test circuit, probe and semiconductor packaging structure 300 consist of semiconductor packaging structure 300 is carried out testing electrical property.
As mentioned above, though the positioner compared to existing semiconductor packaging structure can reach required positioning function, the shortcomings such as positional accuracy is low are forbidden to cause in the location between Chang Yinwei semiconductor packaging structure and the positioner also, the positioner of semiconductor packaging structure of the present utility model is by having increased spacer, so that spacer and briquetting and the first Flexible element form link gear, its really can the Effective Raise semiconductor packaging structure and positioner between positional accuracy, thereby the accuracy of the location of improving, and owing to all adopt mechanical structure and without other control device, so cost is also lower.
The utility model is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present utility model.Must be pointed out that, published embodiment does not limit scope of the present utility model.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in the scope of the present utility model.
Claims (10)
1. the positioner of a semiconductor packaging structure, it is characterized in that: the positioner of described semiconductor packaging structure comprises:
One pedestal has a rotating shaft;
One briquetting is sheathed in the described rotating shaft and with described rotating shaft and is rotatably assorted; And
Four spacers are connected to described pedestal by one first Flexible element respectively;
Wherein said briquetting, described spacer and described the first Flexible element consist of a link gear, described briquetting is in order to move along described rotor shaft direction and to make described the first Flexible element flexible, thereby so that a corner dimension that forms between described spacer and the described briquetting changes, to be used for location semiconductor packaging structure in described briquetting.
2. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: described spacer has a protuberance, and described the first Flexible element is connected between described protuberance and the described pedestal.
3. the positioner of semiconductor packaging structure as claimed in claim 2, it is characterized in that: described briquetting has an end difference, described end difference cooperates described protuberance setting, when described briquetting moves along described rotor shaft direction to described protuberance, compress described the first Flexible element thereby oppress described protuberance by described end difference.
4. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: described briquetting is connected in described pedestal by one second Flexible element.
5. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: described spacer is a L shaped spacer, described L shaped spacer bending place comprises a lead angle.
6. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: described spacer comprises an assembly hole, and described the first Flexible element is fixed on the described spacer by described assembly hole.
7. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: described spacer is positioned at around the described briquetting.
8. the positioner of semiconductor packaging structure as claimed in claim 1, it is characterized in that: the positioner of described semiconductor packaging structure is more arranged in pairs or groups and is used a detection system, for detection of the direction of described semiconductor packaging structure, and send an angle signal for controlling described briquetting rotation.
9. the positioner of semiconductor packaging structure as claimed in claim 1 is characterized in that: the positioner of described semiconductor packaging structure is more arranged in pairs or groups and is used a testboard, described testboard to have several probes to be used for testing described semiconductor packaging structure.
10. the positioner of semiconductor packaging structure as claimed in claim 9, it is characterized in that: described probe is matrix form and arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220455431 CN202839572U (en) | 2012-09-07 | 2012-09-07 | Positioning device of semiconductor package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220455431 CN202839572U (en) | 2012-09-07 | 2012-09-07 | Positioning device of semiconductor package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839572U true CN202839572U (en) | 2013-03-27 |
Family
ID=47951214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220455431 Expired - Fee Related CN202839572U (en) | 2012-09-07 | 2012-09-07 | Positioning device of semiconductor package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202839572U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105319492A (en) * | 2014-07-08 | 2016-02-10 | 京元电子股份有限公司 | Semiconductor element sidelining positioning mechanism and test device thereof |
| TWI547792B (en) * | 2014-09-11 | 2016-09-01 | Motech Taiwan Automatic Corp | Electronic device test module of the opening and closing device (a) |
| CN106269547A (en) * | 2015-12-31 | 2017-01-04 | 桂林斯壮微电子有限责任公司 | A kind of device positioning seat of testing, sorting machine |
| CN107238785A (en) * | 2016-03-25 | 2017-10-10 | 联芯科技有限公司 | Chip testing pedestal |
-
2012
- 2012-09-07 CN CN 201220455431 patent/CN202839572U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105319492A (en) * | 2014-07-08 | 2016-02-10 | 京元电子股份有限公司 | Semiconductor element sidelining positioning mechanism and test device thereof |
| CN105319492B (en) * | 2014-07-08 | 2018-08-28 | 京元电子股份有限公司 | Semiconductor element keeps to the side detent mechanism and its test device |
| TWI547792B (en) * | 2014-09-11 | 2016-09-01 | Motech Taiwan Automatic Corp | Electronic device test module of the opening and closing device (a) |
| CN106269547A (en) * | 2015-12-31 | 2017-01-04 | 桂林斯壮微电子有限责任公司 | A kind of device positioning seat of testing, sorting machine |
| CN107238785A (en) * | 2016-03-25 | 2017-10-10 | 联芯科技有限公司 | Chip testing pedestal |
| CN107238785B (en) * | 2016-03-25 | 2020-12-29 | 联芯科技有限公司 | Chip testing base |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202839572U (en) | Positioning device of semiconductor package device | |
| CN201955420U (en) | Short circuit tester for capacitance touch screen | |
| CN209028108U (en) | A kind of wafer is same to survey probe card | |
| CN102095946B (en) | General electrical testing device for packaging structures | |
| CN110045160B (en) | Test seat that top of BGA encapsulation usefulness was got and is put | |
| CN104914374B (en) | Device for the detection of acceleration transducer electrical property | |
| WO2018028033A1 (en) | Semi-finished touchscreen tester based on magnetic switches | |
| CN102435798B (en) | Probe card and test method | |
| CN205263129U (en) | Microwave power distributor test seat | |
| CN109449176A (en) | Applied to cmos image sensor ceramics PGA adjustable sealing clamps | |
| CN207070361U (en) | Microphone test fixture | |
| CN202420981U (en) | Detecting device used for detecting compression resistance of chip | |
| CN209132315U (en) | Based on the probe card in pattern technology for simultaneously survey technology | |
| CN205786873U (en) | The detection fixture of antenna for mobile phone | |
| CN108152544A (en) | Probe card for testing integrated circuit | |
| CN203325844U (en) | Turret type detection platform | |
| CN105388413A (en) | Chip failure analysis instrument | |
| CN209296871U (en) | Semiconductor chip detection device | |
| CN207528869U (en) | A kind of semiconductor die testing instrument | |
| CN209296872U (en) | Chip-detecting apparatus | |
| CN203287491U (en) | Device and system for testing chip | |
| CN103730376A (en) | Packaging test method | |
| CN215812029U (en) | Laser receiving and transmitting integrated component compression resistance testing device | |
| CN221100923U (en) | Electronic component detection device | |
| CN205981634U (en) | Circuit breaker mechanical property test fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20200907 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |