CN102655102A - Testing arm for testing semi-packaged stack chip - Google Patents
Testing arm for testing semi-packaged stack chip Download PDFInfo
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- CN102655102A CN102655102A CN2012101422853A CN201210142285A CN102655102A CN 102655102 A CN102655102 A CN 102655102A CN 2012101422853 A CN2012101422853 A CN 2012101422853A CN 201210142285 A CN201210142285 A CN 201210142285A CN 102655102 A CN102655102 A CN 102655102A
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Abstract
The invention discloses a testing arm for testing a semi-packaged stack chip. The testing arm is assembled on a semiconductor testing machine to test the semi-packaged stack chip to be tested. A plurality of electric connectors are formed on the upper surface and the opposite lower surface of the semi-packaged stack chip to be tested, the front end of the testing arm is connected with a testing head which is internally provided with a detection chip and is electrically guided and connected from the detection chip, and a plurality of testing probes extend from the upper surface of the semi-packaged stack chip to be tested. Therefore, when the testing arm is pressed downwards to allow the plurality of testing probes of the testing head to push against the electric contacts on the upper surface of the semi-packaged stack chip to be tested on a testing seat, the detection chip, the semi-packaged stack chip to be tested and the testing seat in the testing head are electrically connected with one another to form a testing loop to test the semi-packaged stack chip to be tested.
Description
Technical field
The present invention is about the test arm on a kind of tester table; Especially the test arm front end links has an inside to have the measuring head that detects wafer; So that being electrically connected, inner this detection wafer, half encapsulation stacking wafer to be measured and the test bench of this measuring head form a test loop, to test half encapsulation stacking wafer to be measured.
Background technology
Because the portable electronic product of Smartphone, action counting yield and various consumer products is all pursued with higher semiconductor functionality and the usefulness of least cost under limited footprint area and minimum thickness and weight now; So the integration that has manufacturer to be directed against independent semiconductor wafer is researched and developed, concurrent put on display by stacked wafer or formed one by the stacked die encapsulation pile up many encapsulation assemblies;
Generally be divided into two types and pile up many encapsulation assemblies, a kind of is Package-on-Package (PoP), and another kind is Package-in-Package (PiP).With the PoP assembly structure, industry is at 1cm at present
2Single wafer on spread all over over one hundred contact; Generally double-layer structure next comprised first the encapsulation (top encapsulation) and second the encapsulation (bottom package); And first encapsulation (top encapsulation) is to be stacked in second encapsulation (bottom package); Each package surface all has over one hundred small contact (tin ball) for welding, finally sees through the precision welding connection technology first encapsulation is connected with second encapsulation contact each other.And at present all by manual type to each wafer to be measured estimate one by one, manual test.In the stacked wafer encapsulation; Top wafer and bottom wafer are piled up when integrating each other; Must carry out the test program of final test yield, therefore in the encapsulation of convention stacked wafer, then must other top wafer storing be stacked on other bottom wafer with manual mode; Again test arm is pressed down and contact at the surface that is stacked in the top wafer on the bottom wafer, to carry out final test; But, in case low yield or continuity mistake take place test result when taking place, will be difficult to distinguish to be the problem of top wafer or bottom wafer, if can't distinguish, seek other solution routes and will cause complicated process stepsization.
Therefore; If have an inside to have the measuring head that detects wafer in the binding of test arm front end; And this detection wafer system is the top wafer of normal (Golden Sample); Therefore press down when contacting on the bottom wafer to be detected when test arm, with detection wafer and bottom wafer to be detected are electrically connected, to carry out the detection of a complete stacked wafer; Before the stacked wafer encapsulation, can improve the yield of stacked wafer, and can save human cost by this, so should be a best solution earlier with the bottom wafer classification.
Summary of the invention
The objective of the invention is to, provide a kind of test stacked wafer (it is simple in structure, and is easy to use for Package-on-Package, test arm PoP) (Test Arms), the measuring head of the replaceable different size of arranging in pairs or groups and reach the encapsulation before the classification effect.
For realizing above-mentioned purpose; The invention discloses a kind of test arm that is used to test half encapsulation stacking wafer; It is assemblied in semiconductor test machine station to test half encapsulation stacking wafer to be measured; The upper surface of this half encapsulation stacking wafer to be measured and opposing lower surface have several electrical contacts; It is characterized in that: this test arm front end links the measuring head that an inside has a detection wafer, and this measuring head is electrically conducted from this detection wafer place and extends a plurality of test probes to the upper surface direction of this half encapsulation stacking wafer to be measured.
Wherein, The collocation of this semiconductor test machine station and at least one test bench has the test section that at least one can supply half encapsulation stacking wafer to be measured to plant with formation, and the electrical contact of the lower surface of this half encapsulation stacking wafer to be measured is electrically connected with this test bench formation when test.
Wherein, The electrical contact that a plurality of test probe packings that make this measuring head contact at the upper surface of the half encapsulation stacking wafer to be measured on this test bench is oppressed in the direction start downward vertically of this test arm, this measuring head inner this detection wafer, half encapsulation stacking wafer to be measured and test bench is electrically connected forms a test loop.
Wherein, has one group of heat dissipation element that joins with this detection wafer heat conduction in this measuring head.
Wherein, this group heat dissipation element includes the little fin of a heat radiation at least.
Wherein, this detection wafer is arranged on the loading end, and these a plurality of test probe one ends then are to run through loading end and be electrically connected with this detection wafer, and the other end extends measuring head.
A kind of test arm that is used to test half encapsulation stacking wafer is also disclosed; Be assemblied in semiconductor test machine station to test half encapsulation stacking wafer to be measured; The upper surface of this half encapsulation stacking wafer to be measured and opposing lower surface have several electrical contacts; It is characterized in that: this test arm front end link an inside have one detect wafer measuring head, this measuring head is electrically conducted from this detection wafer place and forms one group of test contacts to the upper surface direction of this half encapsulation stacking wafer to be measured.
Wherein, The collocation of this semiconductor test machine station and at least one test bench has the test section that at least one can supply half encapsulation stacking wafer to be measured to plant with formation, and the electrical contact of the lower surface of this half encapsulation stacking wafer to be measured is electrically connected with this test bench formation when test.
Wherein, The electrical contact that a plurality of test contacts packings that make this measuring head contact at the upper surface of the half encapsulation stacking wafer to be measured on this test bench is oppressed in the direction start downward vertically of this test arm, this measuring head inner this detection wafer, half encapsulation stacking wafer to be measured and test bench is electrically connected forms a test loop.
Through the present invention, realized following technique effect:
1. the invention reside in the binding of test arm front end has an inside to have the measuring head that detects wafer, this measuring head inner this detection wafer, half encapsulation stacking wafer to be measured and test bench is electrically connected forms a test loop.
2. the present invention can get rid of problematic wafer, to improve the yield of stacked wafer in the test in advance of preceding double stacked wafer of stacked wafer encapsulation; And the present invention uses automation to carry out testing process, promotes greatly for production operation output usefulness.
Description of drawings
Figure 1A is a kind of structure chart that is used to test half encapsulation stacking wafer of the present invention;
Figure 1B is used to test the measuring head profile of the test arm of half encapsulation stacking wafer for the present invention is a kind of;
Fig. 2 A be used to test for the present invention is a kind of half encapsulation stacking wafer test arm press down partly section of structure;
Fig. 2 B be used to test for the present invention is a kind of half encapsulation stacking wafer test arm press down partly section of structure; And
Fig. 3 A to Fig. 3 G is used to test the test running sketch map of the test arm of half encapsulation stacking wafer for the present invention is a kind of.
Embodiment
Relevant for aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly appear.
See also Figure 1A and Figure 1B; Be a kind of test arm structure and measuring head profile that is used to test the test arm of half encapsulation stacking wafer of the present invention; This test arm 21 is assemblied in semiconductor test machine station to test half encapsulation stacking wafer 5 to be measured; And these test arm 21 front ends link the measuring head 22 that an inside has a detection wafer 221; Can know that like Fig. 2 A and Fig. 2 B this detection wafer 221 is arranged on the loading end 222, and these measuring head 22 inside have more a plurality of test probes 223; These a plurality of test probe 223 1 ends then are to run through loading end 222 and be electrically connected with this detection wafer 221; The other end then extends to upper surface 51 directions of this half encapsulation stacking wafer 5 to be measured, therefore when this test arm 21 direction start downward vertically, makes a plurality of test probes 223 packings of this measuring head 22 contact at the electrical contact 511 of the upper surface 51 of the half encapsulation stacking wafer 5 to be measured on this test bench 23 compressing; And the electrical contact 521 of the lower surface 52 of this half encapsulation stacking wafer 5 to be measured is electrically connected with test bench 23, so these measuring head 22 inner this detection wafer 221, half encapsulation stacking wafer 5 to be measured and test benches 23 are electrically connected formation one test loop.
These measuring head 22 inner a plurality of test probes 223 can be substituted by alternate manner; For example: connect to detecting wafer 221 through wire rod, electrical conductor one end; And form one group of test contacts that is used to test half encapsulation stacking wafer 5 to be measured to upper surface 51 directions of this half encapsulation stacking wafer 5 to be measured in the other end, perhaps the rubber-like probe is as linking the conductor that detects wafer 221 and half encapsulation stacking wafer 5 to be measured; Mainly detect the purpose that wafer 221, half encapsulation stacking wafer 5 to be measured and test bench 23 are electrically connected formation one test loop in order to reach.
As for test radiator portion of the present invention, below just list and lift enforceable aspect.Can see through in the measuring head 22 about heat radiation and can be provided with one group of heat dissipation element that joins with these detection wafer 221 heat conduction, and this group heat dissipation element includes little fin (not shown) that dispels the heat at least; Also can see through the heat dissipation technology in another patent application of the applicant: the loop circuit cooling recirculation system; The loop circuit cooling recirculation system can directly be attached on the test arm 21; Include pipeline, cooling device, fan and a drive source that comprises an output and an input; This loop circuit cooling recirculation system then can circulate this measuring head of exchange in the heat energy that measured electronic elements produced of packing that test process contacts, and with these fan belt moving air flows this cooling device is carried out heat exchange with dissipation heat energy.
In this preferred embodiment, this test arm 21 sees through the transmission of screw rod, belt pulley set, lets test arm 21 do the start of vertical lift in the top position of test bench 23, presses down seasonal test probe 223 and drops to precalculated position packing half encapsulation stacking wafer 5 to be measured; Measuring head 22 also possesses the function that absorption half encapsulation stacking wafer 5 to be measured is arranged simultaneously, is familiar with field of the present invention personage's know and all can reaches with suction nozzle, negative pressure mode etc.
And the present invention is mainly used in the semiconductor automatically testing machine platform; Therefore provide from charging, test the test running sketch map of discharging at this; By knowing among Fig. 3 A to Fig. 3 C; This X-Y axle pick-up arm 4 is loaded with plural number by feed zone 1 and moves at least one half encapsulation stacking wafer 5 to test section 2 to be measured on half encapsulation stacking wafer, 5 load plates 11 to be measured (this test section 2 has at least one test bench 23 and the test arm 21 that can supply half encapsulation stacking wafer 5 to be measured to plant; And this test bench 23 is to be positioned on the test board 24) after, and in this test section 2, test, shown in Fig. 3 D; This test arm 21 direction start is downward vertically oppressed; So that a plurality of test probes 223 packings of this measuring head 22 contact at the electrical contact 511 of the upper surface 51 of the half encapsulation stacking wafer 5 to be measured on this test bench 23, and the time make these measuring head 22 inner this detections wafer 221, half encapsulation stacking wafer 5 to be measured and test benches 23 be electrically connected formation one test loop, test beginning in test.
Know as being familiar with field personage of the present invention; Detecting board will be because of the different configuration of client demand; Some machine series has four even six test sections simultaneously, also can only have single test section, so this X-Y axle pick-up arm 4 can be with the formula editor; One by one by criticizing or one by one half encapsulation stacking wafer 5 to be measured being placed on different test section 2 one by one, to reach best tested performance.
After test was accomplished, shown in Fig. 3 E to Fig. 3 F, 21 of this test arm can rise, and this is intact surveys half encapsulation stacking wafer 6 and can send from this test section 2 by X-Y axle pick-up arm 4; At last, shown in Fig. 3 G, this X-Y axle pick-up arm 4 will finish survey half encapsulation stacking wafer 6 to be moved to discharge zone 3, then can classify in to the load plate 31 of discharge zone 3 finishing survey half encapsulation stacking wafer 6.
By the detailed description of above preferred embodiment, hope can be known description characteristic of the present invention and spirit more, and is not to come category of the present invention is limited with the above-mentioned preferred embodiment that is disclosed.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (9)
1. test arm that is used to test half encapsulation stacking wafer; It is assemblied in semiconductor test machine station to test half encapsulation stacking wafer to be measured; The upper surface of this half encapsulation stacking wafer to be measured and opposing lower surface have several electrical contacts; It is characterized in that: this test arm front end links the measuring head that an inside has a detection wafer, and this measuring head is electrically conducted from this detection wafer place and extends a plurality of test probes to the upper surface direction of this half encapsulation stacking wafer to be measured.
2. the test arm that is used to test half encapsulation stacking wafer as claimed in claim 1; It is characterized in that; The collocation of this semiconductor test machine station and at least one test bench has the test section that at least one can supply half encapsulation stacking wafer to be measured to plant with formation, and the electrical contact of the lower surface of this half encapsulation stacking wafer to be measured is electrically connected with this test bench formation when test.
3. according to claim 1 or claim 2 the test arm that is used to test half encapsulation stacking wafer; It is characterized in that; The electrical contact that a plurality of test probe packings that make this measuring head contact at the upper surface of the half encapsulation stacking wafer to be measured on this test bench is oppressed in the direction start downward vertically of this test arm, this measuring head inner this detection wafer, half encapsulation stacking wafer to be measured and test bench is electrically connected forms a test loop.
4. the test arm that is used to test half encapsulation stacking wafer as claimed in claim 1 is characterized in that, has one group of heat dissipation element that joins with this detection wafer heat conduction in this measuring head.
5. the test arm that is used to test half encapsulation stacking wafer as claimed in claim 4 is characterized in that, this group heat dissipation element includes the little fin of a heat radiation at least.
6. the test arm that is used to test half encapsulation stacking wafer as claimed in claim 1; It is characterized in that; This detection wafer is arranged on the loading end, and these a plurality of test probe one ends then are to run through loading end and be electrically connected with this detection wafer, and the other end extends measuring head.
7. test arm that is used to test half encapsulation stacking wafer; Be assemblied in semiconductor test machine station to test half encapsulation stacking wafer to be measured; The upper surface of this half encapsulation stacking wafer to be measured and opposing lower surface have several electrical contacts; It is characterized in that: this test arm front end link an inside have one detect wafer measuring head, this measuring head is electrically conducted from this detection wafer place and forms one group of test contacts to the upper surface direction of this half encapsulation stacking wafer to be measured.
8. the test arm that is used to test half encapsulation stacking wafer as claimed in claim 7; It is characterized in that; The collocation of this semiconductor test machine station and at least one test bench has the test section that at least one can supply half encapsulation stacking wafer to be measured to plant with formation, and the electrical contact of the lower surface of this half encapsulation stacking wafer to be measured is electrically connected with this test bench formation when test.
9. like claim 7 or the 8 described test arm that are used to test half encapsulation stacking wafer; It is characterized in that; The electrical contact that a plurality of test contacts packings that make this measuring head contact at the upper surface of the half encapsulation stacking wafer to be measured on this test bench is oppressed in the direction start downward vertically of this test arm, this measuring head inner this detection wafer, half encapsulation stacking wafer to be measured and test bench is electrically connected forms a test loop.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101422853A CN102655102A (en) | 2012-05-10 | 2012-05-10 | Testing arm for testing semi-packaged stack chip |
| CN201310088184.7A CN103219257B (en) | 2012-05-10 | 2013-03-19 | The testing apparatus of stacked wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101422853A CN102655102A (en) | 2012-05-10 | 2012-05-10 | Testing arm for testing semi-packaged stack chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102655102A true CN102655102A (en) | 2012-09-05 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101422853A Pending CN102655102A (en) | 2012-05-10 | 2012-05-10 | Testing arm for testing semi-packaged stack chip |
| CN201310088184.7A Active CN103219257B (en) | 2012-05-10 | 2013-03-19 | The testing apparatus of stacked wafer |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310088184.7A Active CN103219257B (en) | 2012-05-10 | 2013-03-19 | The testing apparatus of stacked wafer |
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| Country | Link |
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| CN (2) | CN102655102A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811371A (en) * | 2014-02-18 | 2014-05-21 | 致茂电子(苏州)有限公司 | Testing equipment for stacked semiconductor encapsulating member and testing method thereof |
| TWI547792B (en) * | 2014-09-11 | 2016-09-01 | Motech Taiwan Automatic Corp | Electronic device test module of the opening and closing device (a) |
| CN109444591A (en) * | 2018-11-19 | 2019-03-08 | 环旭电子股份有限公司 | Test device and test method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2685891Y (en) * | 2004-04-02 | 2005-03-16 | 达方电子股份有限公司 | Connecting sheet tester |
| CN1811462A (en) * | 2005-01-25 | 2006-08-02 | 照敏企业股份有限公司 | Electric circuit board tester |
| TWM306388U (en) * | 2006-06-30 | 2007-02-11 | Chroma Ate Inc | Semiconductor member test machine with an airway for heat sink |
| CN201206982Y (en) * | 2008-04-25 | 2009-03-11 | 东莞市骏泰精密机械有限公司 | Battery appearance measuring machine |
| CN102288893A (en) * | 2010-06-18 | 2011-12-21 | 致茂电子(苏州)有限公司 | Testing device and testing machine capable of preventing electromagnetic interference |
| CN201897631U (en) * | 2010-10-19 | 2011-07-13 | 致茂电子(苏州)有限公司 | Semiconductor wafer testing device and detecting system with cooling devices |
-
2012
- 2012-05-10 CN CN2012101422853A patent/CN102655102A/en active Pending
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2013
- 2013-03-19 CN CN201310088184.7A patent/CN103219257B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811371A (en) * | 2014-02-18 | 2014-05-21 | 致茂电子(苏州)有限公司 | Testing equipment for stacked semiconductor encapsulating member and testing method thereof |
| CN103811371B (en) * | 2014-02-18 | 2016-04-13 | 致茂电子(苏州)有限公司 | The testing equipment of stack type semiconductor packing component and method of testing thereof |
| TWI547792B (en) * | 2014-09-11 | 2016-09-01 | Motech Taiwan Automatic Corp | Electronic device test module of the opening and closing device (a) |
| CN109444591A (en) * | 2018-11-19 | 2019-03-08 | 环旭电子股份有限公司 | Test device and test method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103219257A (en) | 2013-07-24 |
| CN103219257B (en) | 2015-10-21 |
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Application publication date: 20120905 |