TW201605934A - 有機聚矽氧烷及其製造方法 - Google Patents

有機聚矽氧烷及其製造方法 Download PDF

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Publication number
TW201605934A
TW201605934A TW104119855A TW104119855A TW201605934A TW 201605934 A TW201605934 A TW 201605934A TW 104119855 A TW104119855 A TW 104119855A TW 104119855 A TW104119855 A TW 104119855A TW 201605934 A TW201605934 A TW 201605934A
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TW
Taiwan
Prior art keywords
group
sio
formula
carbon atoms
organopolyoxane
Prior art date
Application number
TW104119855A
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English (en)
Chinese (zh)
Inventor
森田好次
Original Assignee
道康寧東麗股份有限公司
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Publication date
Application filed by 道康寧東麗股份有限公司 filed Critical 道康寧東麗股份有限公司
Publication of TW201605934A publication Critical patent/TW201605934A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
TW104119855A 2014-06-20 2015-06-18 有機聚矽氧烷及其製造方法 TW201605934A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014127675 2014-06-20

Publications (1)

Publication Number Publication Date
TW201605934A true TW201605934A (zh) 2016-02-16

Family

ID=54935164

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119855A TW201605934A (zh) 2014-06-20 2015-06-18 有機聚矽氧烷及其製造方法

Country Status (2)

Country Link
TW (1) TW201605934A (fr)
WO (1) WO2015194159A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112442276A (zh) * 2019-08-29 2021-03-05 信越化学工业株式会社 加成固化型有机硅组合物及光学元件
TWI837415B (zh) 2019-08-29 2024-04-01 日商信越化學工業股份有限公司 加成硬化型聚矽氧組成物及光學元件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016152073A1 (fr) * 2015-03-20 2016-09-29 Dow Corning Toray Co., Ltd. Organopolysiloxane, son procédé de production, et composition de silicone durcissable
JP6347237B2 (ja) * 2015-08-21 2018-06-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン組成物及び半導体装置
CN110330653B (zh) * 2019-07-05 2020-10-23 北京化工大学 一种耐高温高折射率的主链含亚苯基的钛杂化硅树脂、其制备方法及应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP5972511B2 (ja) * 2008-03-31 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物およびその硬化物
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5667740B2 (ja) * 2008-06-18 2015-02-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
US20150299543A1 (en) * 2012-12-07 2015-10-22 Dow Corning Toray Co., Ltd. Curable Silicone Composition And Optical Semiconductor Device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112442276A (zh) * 2019-08-29 2021-03-05 信越化学工业株式会社 加成固化型有机硅组合物及光学元件
TWI837415B (zh) 2019-08-29 2024-04-01 日商信越化學工業股份有限公司 加成硬化型聚矽氧組成物及光學元件

Also Published As

Publication number Publication date
WO2015194159A1 (fr) 2015-12-23

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