TW201603149A - 連接體、連接體之製造方法及檢查方法 - Google Patents

連接體、連接體之製造方法及檢查方法 Download PDF

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Publication number
TW201603149A
TW201603149A TW104106244A TW104106244A TW201603149A TW 201603149 A TW201603149 A TW 201603149A TW 104106244 A TW104106244 A TW 104106244A TW 104106244 A TW104106244 A TW 104106244A TW 201603149 A TW201603149 A TW 201603149A
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Taiwan
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terminal
indentations
input
terminals
indentation
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TW104106244A
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English (en)
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TWI643273B (zh
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Reiji Tsukao
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Dexerials Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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Abstract

本發明之課題為提高壓痕之辨識性、迅速且準確地進行使用有異向性導電膜之連接步驟之連接後的檢查。 本發明之連接體具備：透明基板；及電子零件，其經由異向性導電接著劑而連接於上述透明基板上；且於上述透明基板之端子上，於面內方向排列有上述異向性導電接著劑所含有之導電性粒子所形成之複數個壓痕。

Description

連接體、連接體之製造方法及檢查方法
本發明係關於一種由電子零件與透明基板連接而成之連接體，尤其係關於一種將電子零件經由含有導電性粒子之接著劑而連接於透明基板之連接體、連接體之製造方法及檢查方法。
自先前，作為電視或PC監視器、行動電話或智慧型手機、攜帶型遊戲機、輸入板終端或可配戴終端、或車載用監視器等各種顯示手段，使用有液晶顯示裝置或有機EL面板。近年來，於此種顯示裝置中，自微間距化、輕量薄型化等之觀點而言，採用如下之施工方法：使用異向性導電膜(ACF：Anisotropic Conductive Film)，將驅動用IC直接構裝於顯示面板之玻璃基板上、或將形成有驅動電路等之可撓性基板直接構裝於玻璃基板上。
於IC或可撓性基板經構裝之玻璃基板上，形成有複數個由ITO(氧化銦錫)等構成之透明電極，且IC或可撓性基板等電子零件被連接於該透明電極上。連接於玻璃基板之電子零件於構裝面上，與透明電極對應而形成有複數個電極端子，經由異向性導電膜而熱壓接於玻璃基板上，藉此將電極端子與透明電極連接。
異向性導電膜係使導電性粒子混入至黏合劑樹脂中並形成膜狀者，於2個導體間藉由加熱壓接而由導電性粒子取得導體間之電導通，且由黏合劑樹脂保持導體間之機械連接。作為構成異向性導電膜之接著劑，通常，使用可靠性高之熱硬化性之黏合劑樹脂，但亦可為光硬化性之黏合劑樹脂或光熱併用型之黏合劑樹脂。
在經由此種異向性導電膜將電子零件連接於透明電極之情形時，首先，將異向性導電膜藉由未圖示之暫壓接手段而暫貼於玻璃基板之透明電極上。繼而，經由異向性導電膜將電子零件搭載於玻璃基板上而形成暫連接體之後，藉由熱壓接頭等熱壓接手段將電子零件與異向性導電膜一同朝透明電極側加熱擠壓。藉由該熱壓接頭之加熱，引起異向性導電膜熱硬化反應，藉此將電子零件接著於透明電極上。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本專利第4789738號公報
[專利文獻2]日本特開2004-214374號公報
[專利文獻3]日本特開2005-203758號公報
然而，於使用有此種異向性導電膜之連接步驟中，對連接之電子零件之連接部位進行加熱擠壓之步驟通常不會針對所有多數構裝品以 大面積進行加熱擠壓等。其原因在於，電子零件之連接部位相對於連接之電子零件為較小之面積，又，多數排列於連接部位之電極端子(凸塊)要求平行度等。
因此，於使用有異向性導電膜之連接步驟中，自提高生產性之觀點而言，除要求連接步驟本身之短時間化之外，伴隨短時間化亦要求連接後之檢查步驟之迅速化。
連接後之檢查係對藉由利用電子零件之電極端子與玻璃基板之透明電極將導電性粒子壓扁而確保導通性一事予以確認之步驟，於迅速化時，有時藉由「自玻璃基板之背面觀察透明電極中出現的導電性粒子之壓痕」之外觀檢查而進行。又，作為連接後之檢查，藉由人眼目測、或使用攝像圖像而觀察壓痕之狀態、或其周圍之接著劑之隆起或剝落之狀態。
壓痕之狀態係藉由與不存在導電性粒子之周邊部位之比較而進行，作為機械的判斷基準，可藉由觀察對比度或色調之差異而判斷。但，若電極端子與透明電極之間導電性粒子重疊，或於透明電極之面內方向導電性粒子連續地接觸或過度接近，則會影響壓痕與周邊部位之識別，即影響對比度或色調且使辨識性降低，從而存在無法進行迅速且準確之外觀檢查之虞。
因此，本發明之目的在於提供一種可提高壓痕之辨識性、迅速且準確地進行使用有異向性導電膜之連接步驟之連接後之檢查的連接體、連接體之製造方法及檢查方法。
為解決上述課題，本發明之連接體具備透明基板、及經由異 向性導電接著劑而連接於上述透明基板上之電子零件，上述透明基板之端子於面內方向排列有上述異向性導電接著劑所含有之導電性粒子形成之複數個壓痕。
又，本發明之連接體之製造方法係於電路基板上經由含有導電性粒子之接著劑而搭載電子零件，對上述電路基板擠壓上述電子零件，並且使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上，上述異向性導電接著劑於黏合劑樹脂中排列有導電性粒子，且上述透明基板之端子於面內方向排列有上述導電性粒子形成之複數個壓痕。
又，本發明之檢查方法係對連接體之連接狀態進行檢查者，該連接體係於透明基板上經由排列有導電性粒子之異向性導電接著劑連接有電子零件而成者，上述檢查方法係對上述透明基板之端子所出現的上述異向性導電接著劑所含有之導電性粒子之壓痕及壓痕之周邊部位加以比較，檢查連接狀態。
根據本發明，於端子內，藉由將導電性粒子排列而使壓痕以個別獨立之狀態出現。由此，端子上出現之壓痕之對比度明確呈現，使各個壓痕之辨識性大幅提高，因此識別變得容易，可迅速、準確地檢查基於壓痕之電子零件與透明基板之端子之連接性。
1‧‧‧異向性導電膜
2‧‧‧剝離膜
3‧‧‧黏合劑樹脂層
4‧‧‧導電性粒子
6‧‧‧捲繞盤
10‧‧‧液晶顯示面板
11、12‧‧‧透明基板
12a‧‧‧緣部
13‧‧‧封條
14‧‧‧液晶
15‧‧‧面板顯示部
16、17‧‧‧透明電極
18‧‧‧液晶驅動用IC
18a‧‧‧構裝面
19a‧‧‧輸入端子
19b‧‧‧輸出端子
20a‧‧‧輸入端子排
20b‧‧‧輸出端子排
21a‧‧‧輸入凸塊
21b‧‧‧輸出凸塊
22a‧‧‧輸入凸塊排
22b‧‧‧輸出凸塊排
23‧‧‧端子間之間隙
27‧‧‧構裝部
31‧‧‧基板側對準標記
32‧‧‧IC側對準標記
23‧‧‧端子間之間隙
33‧‧‧熱壓接頭
圖1係作為連接體之一例而表示之液晶顯示面板之剖面圖。
圖2係表示自透明基板之背面觀察之輸入輸出端子上出現的壓痕之狀 態之仰視圖。
圖3係表示液晶驅動用IC與透明基板之連接步驟之剖面圖。
圖4係表示液晶驅動用IC之電極端子(凸塊)及端子間之間隙之俯視圖。
圖5係表示異向性導電膜之剖面圖。
圖6係表示導電性粒子以晶格狀規則排列之異向性導電膜之俯視圖。
圖7係表示導電性粒子以六方晶格狀規則排列之異向性導電膜之俯視圖。
圖8係表示端子上出現之壓痕之俯視圖，(A)表示使用有使導電性粒子隨機地分散之異向性導電膜之情形，(B)表示使用有導電性粒子經排列之異向性導電膜之情形。
圖9表示輸入輸出端子排之俯視圖。
圖10係表示藉由形成有具有導電性粒子之粒徑之50%以內之高低差之凹凸部的凸塊與端子而夾持導電性粒子之狀態之剖面圖。
圖11係表示藉由形成有具有導電性粒子之粒徑之50%以內之高低差之凹凸部的凸塊與端子而夾持導電性粒子之狀態之剖面圖。
圖12係表示藉由形成有具有超出導電性粒子之粒徑之50%之高低差之凹凸部的凸塊與端子而夾持導電性粒子之狀態之剖面圖。
圖13係表示藉由形成有具有超出導電性粒子之粒徑之50%之高低差之凹凸部的凸塊與端子而夾持導電性粒子之狀態之剖面圖。
以下，一面參照圖式，一面對應用本發明之連接體、連接體之製造方法及檢查方法詳細地進行說明。再者，本發明並非僅限定於以下之實施形態，當然於不脫離本發明之要旨之範圍內可進行種種變更。又，圖式為示意性圖式，有時各尺寸之比率等與實際情形不同。具體之尺寸等應參考以下之說明而判斷。又，當然圖式彼此間亦包含相互之尺寸之關係或比率不同之部分。
[液晶顯示面板]
以下，作為應用本發明之連接體，以將液晶驅動用之IC晶片作為電子零件而構裝於玻璃基板之液晶顯示面板為例進行說明。如圖1所示，該液晶顯示面板10中，將由玻璃基板等構成之二片透明基板11、12對向配置，且將該等透明基板11、12藉由框狀之封條13而相互貼合。繼而，液晶顯示面板10藉由將液晶14封入至由透明基板11、12圍繞之空間內而形成面板顯示部15。
透明基板11、12於相互對向之兩內側表面，以相互交叉之方式形成有由ITO(氧化銦錫)等構成之條紋狀之一對透明電極16、17。而且，兩透明電極16、17藉由該等兩透明電極16、17之該交叉部位而構成作為液晶顯示之最小單位之像素。
於兩透明基板11、12中，一透明基板12形成得較另一透明基板11之平面尺寸大，於該較大地形成之透明基板12之緣部12a，設置有供作為電子零件之液晶驅動用IC 18構裝之構裝部27。再者，如圖2、圖3所示，於構裝部27，形成有由透明電極17之複數個輸入端子19a排列而成之輸入端子排20a及由複數個輸出端子19b排列而成之輸出端子排20b、以 及與設置於液晶驅動用IC 18上之IC側對準標記32重疊之基板側對準標記31。
液晶驅動用IC 18可藉由對像素選擇性地施加液晶驅動電壓而使液晶之配向局部地變化來進行規定之液晶顯示。又，如圖3、圖4所示，液晶驅動用IC 18於面向透明基板12之構裝面18a，形成有由與透明電極17之輸入端子19a導通連接之複數個輸入凸塊21a排列而成之輸入凸塊排22a、及由與透明電極17之輸出端子19b導通連接之複數個輸出凸塊21b排列而成之輸出凸塊排22b。輸入凸塊21a及輸出凸塊21b可適當地使用例如銅凸塊或金凸塊、或已對銅凸塊實施鍍金者等。
輸入凸塊21a例如沿構裝面18a之一側緣以一排而排列，輸出凸塊21b沿與一側緣對向之另一側緣以複數排而排列成鋸齒狀。輸入輸出凸塊21a、21b與設置於透明基板12之構裝部27之輸入輸出端子19a、19b係以分別相同數量且相同間距而形成，且其等之連接係藉由使透明基板12與液晶驅動用IC 18位置對準並連接而進行。
再者，輸入輸出凸塊21a、21b之排列除圖4所示之情形之外，亦可為於一側緣以一排或複數排而排列，且於另一側緣以一排或複數排而排列之任意之構成。又，輸入輸出凸塊21a、21b中，以一排排列之一部分可成為複數排，且複數排之一部分亦可成為一排。進而，輸入輸出凸塊21a、21b可以使複數排之各排平行且鄰接之電極端子彼此並聯之直線排列而形成，或亦可以使複數排之各排平行且鄰接之電極端子彼此均勻地錯開之鋸齒排列而形成。
又，液晶驅動用IC 18亦可使輸入輸出凸塊21a、21b沿IC 基板之長邊而排列，並且沿IC基板之短邊形成側凸塊。再者，輸入輸出凸塊21a、21b可以相同尺寸來形成，亦可以不同尺寸來形成。又，輸入輸出凸塊排22a、22b中，可由以相同尺寸形成之輸入輸出凸塊21a、21b對稱或非對稱地排列，亦可由以不同尺寸形成之輸入輸出凸塊21a、21b非對稱地排列。
再者，伴隨近年來之液晶顯示裝置等電子機器之小型化、高功能化，對於液晶驅動用IC 18等電子零件亦要求小型化、低背化，且輸入輸出凸塊21a、21b之高度亦變低(例如6~15μm)。
又，液晶驅動用IC 18中，於構裝面18a，藉由與基板側對準標記31重疊而形成有進行對透明基板12之對準之IC側對準標記32。再者，由於正在發展透明基板12之透明電極17之配線間距或液晶驅動用IC 18之輸入輸出凸塊21a、21b之微間距化，故而亦要求對液晶驅動用IC 18與透明基板12進行高精度之對準調整。
基板側對準標記31及IC側對準標記32可藉由組合而使用取得透明基板12與液晶驅動用IC 18之對準之各種標記。
在形成於構裝部27之透明電極17之輸入輸出端子19a、19b上，使用異向性導電膜1作為電路連接用接著劑而連接液晶驅動用IC 18。異向性導電膜1係含有導電性粒子4，且使液晶驅動用IC 18之輸入輸出凸塊21a、21b與透明基板12之形成於構裝部27之透明電極17之輸入輸出端子19a、19b經由導電性粒子4而電性連接者。該異向性導電膜1藉由以熱壓接頭33熱壓接而使黏合劑樹脂流動化，使導電性粒子4於輸入輸出端子19a、19b與液晶驅動用IC 18之輸入輸出凸塊21a、21b之間被壓扁，於該 狀態下黏合劑樹脂硬化。藉此，異向性導電膜1將透明基板12與液晶驅動用IC 18電性且機械連接。
又，於兩透明電極16、17上，形成有實施規定之摩擦處理後之配向膜24，藉由該配向膜24而限制液晶分子之初始配向。進而，於兩透明基板11、12之外側，配設有一對偏光板25、26，藉由該等兩偏光板25、26而限制來自背光源等光源(未圖示)之透射光之振動方向。
[異向性導電膜]
其次，對異向性導電膜1進行說明。如圖5所示，異向性導電膜(ACF：Anisotropic Conductive Film)1通常係於成為基材之剝離膜2上形成有含有導電性粒子4之黏合劑樹脂層(接著劑層)3者。異向性導電膜1係熱硬化型或紫外線等光硬化型之接著劑，其貼合於液晶顯示面板10之透明基板12所形成之輸入輸出端子19a、19b上並且搭載液晶驅動用IC 18，藉由以熱壓接頭33進行熱加壓而流動化，使導電性粒子4於相對向之透明電極17之輸入輸出端子19a、19b與液晶驅動用IC 18之輸入輸出凸塊21a、21b之間被壓扁，且於導電性粒子被壓扁之狀態下藉由加熱或紫外線照射而硬化。藉此，異向性導電膜1可將透明基板12與液晶驅動用IC 18連接且使其等導通。
又，異向性導電膜1中，導電性粒子4以規定之圖案規則地排列於含有膜形成樹脂、熱硬化性樹脂、潛伏性硬化劑、及矽烷偶合劑等通常之黏合劑樹脂層3中。
支持黏合劑樹脂層3之剝離膜2係將矽酮等剝離劑塗佈於例如PET(Poly Ethylene Terephthalate，聚對苯二甲酸乙二酯)、OPP(Oriented Polypropylene，延伸聚丙烯)、PMP(Poly-4-methylpentene-1，聚4-甲基戊烯-1)、PTFE(Polytetrafluoroethylene，聚四氟乙烯)等而成，防止異向性導電膜1之乾燥，並且維持異向性導電膜1之形狀。
作為黏合劑樹脂層3中含有之膜形成樹脂，較佳為平均分子量為10000~80000左右之樹脂。作為膜形成樹脂，可列舉環氧樹脂、改質環氧樹脂、胺酯樹脂(urethane resin)、苯氧基樹脂等各種樹脂。其中，自膜形成狀態、連接可靠性等之觀點而言，尤佳為苯氧基樹脂。
作為熱硬化性樹脂，並無特別限定，可列舉例如市售之環氧樹脂、丙烯酸樹脂等。
作為環氧樹脂，並無特別限定，可列舉例如萘型環氧樹脂、聯苯型環氧樹脂、酚系酚醛清漆型環氧樹脂、雙酚型環氧樹脂、茋型環氧樹脂、三苯酚甲烷型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚型環氧樹脂、二環戊二烯型環氧樹脂、及三苯甲烷型環氧樹脂等。該等可單獨使用，亦可為2種以上之組合。
作為丙烯酸樹脂，並無特別限制，可根據目的而適當選擇丙烯酸化合物、液狀丙烯酸酯等。可列舉例如丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸異丁酯、丙烯酸環氧酯、二丙烯酸乙二醇酯、二丙烯酸二乙二醇酯、三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、四丙烯酸四亞甲基乙二醇酯、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、二環戊烯基丙烯酸酯、丙烯酸三環癸酯、三(丙烯醯氧基乙基)異氰尿酸酯、丙烯酸胺基甲酸酯、環氧丙烯酸酯等。再者，亦可使用將丙烯酸酯換 為甲基丙烯酸酯者。該等中，可單獨使用1種，亦可將2種以上併用。
作為潛伏性硬化劑，並無特別限定，可列舉例如加熱硬化型、UV硬化型等各種硬化劑。潛伏性硬化劑通常不會反應，藉由根據熱、光、加壓等用途所選擇之各種觸發而活性化，且開始反應。熱活性型潛伏性硬化劑之活性化方法中，存在如下之方法：藉由因加熱引起之解離反應等而生成活性種(陽離子或陰離子、自由基)；於室溫附近穩定地分散於環氧樹脂中，且於高溫下與環氧樹脂相溶-熔解，開始硬化反應；使分子篩(molecular sieve)封入類型之硬化劑於高溫下溶出而開始硬化反應；及利用微膠囊之溶出-硬化等。作為熱活性型潛伏性硬化劑，有咪唑系、醯肼系、三氟化硼-胺錯合物、鋶鹽、胺醯亞胺、聚胺鹽、雙氰胺等、或該等之改質物，該等既可單獨，亦可為2種以上之混合體。其中，較佳為微膠囊型咪唑系潛伏性硬化劑。
作為矽烷偶合劑，並無特別限定，可列舉例如環氧系、胺系、巰基-硫基系、醯脲系等。藉由添加矽烷偶合劑而使有機材料與無機材料之界面之接著性提高。
[導電性粒子]
作為導電性粒子4，可列舉於異向性導電膜1中使用之公知之任意之導電性粒子。作為導電性粒子4，可列舉例如鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或於金屬合金之粒子、金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等粒子之表面塗佈有金屬者、或於該等粒子之表面進而塗佈有絕緣薄膜者等。於為樹脂粒子之表面塗佈有金屬者之情形時，作為樹脂粒子，可列舉例如環氧樹脂、酚系樹脂、丙烯酸樹脂、丙烯腈-苯乙烯 (AS)樹脂、苯胍樹脂、二乙烯苯系樹脂、苯乙烯系樹脂等之粒子。導電性粒子4之大小較佳為1~10μm，但本發明並不限定於此。
[導電性粒子之規則排列]
異向性導電膜1中，導電性粒子4於俯視時以規定之排列圖案規則地排列，例如圖6或圖7所示，以晶格狀且均勻地排列，或以六方晶格狀排列。此種導電性粒子4之排列距離可適當調整。即，亦可為根據排列之方向而為不同之排列距離。如下所述，異向性導電膜1中，與使導電性粒子4隨機地分散之情形相比，藉由俯視時規則地排列而於液晶驅動用IC 18之連接後之檢查中，可使輸入輸出端子19a、19b上出現之壓痕30之辨識性提高。
另一方面，於使導電粒子隨機地分散之情形時，導電粒子彼此於連接時成為鄰接或重複之狀態，於擠壓後難以識別各個導電粒子。
又，異向性導電膜1中，與使導電性粒子4隨機地分散之情形相比，藉由俯視時規則地排列而使液晶驅動用IC 18之鄰接之輸入輸出凸塊21a、21b間之間隙23微間距化，且使端子間面積狹小化，並且即便高密度地填充導電性粒子4，亦可於液晶驅動用IC 18之連接步驟中，防止由導電性粒子4之凝集體而導致輸入輸出凸塊21a、21b間之間隙23之凸塊間短路。
又，異向性導電膜1中，藉由使導電性粒子4規則地排列，即便於黏合劑樹脂層3中高密度地填充有導電性粒子4之情形時，亦可防止由導電性粒子4之凝集而產生疏密。由此，根據異向性導電膜1，於微間距化之輸入輸出端子19a、19b或輸入輸出凸塊21a、21b中亦可捕捉導電性粒子4。導電性粒子4之均勻排列圖案可任意設定。
此種異向性導電膜1可藉由例如以下之方法等而製造：於可延伸之片材上塗佈黏著劑，且將導電性粒子4單層排列於其上之後，使該片材以所欲之延伸倍率延伸；將導電性粒子4於基板上以規定之排列圖案整劑排列之後，將導電性粒子4轉印至由剝離膜2支持之黏合劑樹脂層3；或向由剝離膜2支持之黏合劑樹脂層3上，經由設置有與排列圖案對應之開口部之排列板而供給導電性粒子4。
再者，異向性導電膜1之形狀並無特別限定，例如圖5所示，可設為可捲繞於捲繞盤6之長條捲帶形狀，且僅切斷規定之長度而使用。
又，於上述實施形態中，作為異向性導電膜1，以將於黏合劑樹脂層3中規則排列有導電性粒子4之熱硬化性樹脂組成物成形為膜狀之接著膜為例予以說明，但本發明之接著劑並不限定於此，例如可形成為將僅由黏合劑樹脂3所構成之絕緣性接著劑層、與由規則排列有導電性粒子4之黏合劑樹脂3所構成之導電性粒子含有層積層而成之構成。又，對異向性導電膜1而言，只要導電性粒子4於俯視時規則排列，則除如圖5所示單層排列之外，亦可為將導電性粒子4遍及複數個黏合劑樹脂層3而排列並且於俯視時規則排列者。又，異向性導電膜1亦可於多層構成之至少一層內，以規定距離單一地分散。
[連接步驟]
其次，對將液晶驅動用IC 18連接於透明基板12之連接步驟進行說明。首先，將異向性導電膜1暫貼於透明基板12之形成有輸入輸出端子19a、19b之構裝部27上。其次，將該透明基板12載置於連接裝置之載置台上，將液晶驅動用IC 18經由異向性導電膜1而配置於透明基板12之構裝部27 上。
其次，藉由被加熱至使黏合劑樹脂層3硬化之規定之溫度之熱壓接頭33，以規定之壓力、時間而自液晶驅動用IC 18上進行熱加壓。藉此，異向性導電膜1之黏合劑樹脂層3顯示流動性，自液晶驅動用IC 18之構裝面18a與透明基板12之構裝部27之間流出，並且黏合劑樹脂層3中之導電性粒子4夾持於液晶驅動用IC 18之輸入輸出凸塊21a、21b與透明基板12之輸入輸出端子19a、19b之間而被壓扁。
其結果，輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之間藉由夾持導電性粒子4而電性連接，於該狀態下經熱壓接頭33加熱之黏合劑樹脂硬化。藉此，可製造確保液晶驅動用IC 18之輸入輸出凸塊21a、21b與形成於透明基板12上之輸入輸出端子19a、19b之間導通性之液晶顯示面板10。又，將上述被夾持之導電性粒子4擠壓形成者(應變)於輸入輸出端子19a、19b內成為壓痕。
不存在於輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之間之導電性粒子4分散於鄰接之輸入輸出凸塊21a、21b間之間隙23中之黏合劑樹脂中，維持電性絕緣之狀態。因此，液晶顯示面板10謀求僅液晶驅動用IC 18之輸入輸出凸塊21a、21b與透明基板12之輸入輸出端子19a、19b之間之電導通。再者，作為黏合劑樹脂，使用自由基聚合反應系之快速硬化類型者，故而藉由較短之加熱時間亦可使黏合劑樹脂速硬化。又，作為異向性導電膜1，並不限於熱硬化型，只要係進行加壓連接者，則亦可使用光硬化型或光熱併用型之接著劑。
[壓痕辨識性]
藉由於輸入輸出凸塊21a、21b之間擠壓導電性粒子4，可自透明基板12側於輸入輸出端子19a、19b之部位觀察壓痕30。於液晶驅動用IC 18之連接後，可藉由自透明基板12之背面(輸入輸出端子19a、19b之相反側)以目測(顯微鏡等)或攝像圖像觀察而進行連接性之檢查。
壓痕30係藉由於輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之間捕捉到硬度較高之導電性粒子4之狀態下利用熱壓接頭33進行擠壓而於透明電極17之輸入輸出端子19a、19b上出現之導電性粒子4之擠壓痕，藉由自透明基板12之背面側觀察而可辨識。壓痕30之形狀一般具有導電性粒子4之粒徑以上之直徑，如圖8(a)所示成大致圓形狀。又，如圖8(b)所示，壓痕30之形狀一般為一側模糊而大部分由曲線構成者。該情形時之曲線只要為圓形時之40%以上、較佳為50%以上、更佳為60%以上、即、可識別為大致圓形之曲線即可。再者，於金屬粒子之情形等時，有包含直線之狀態之情況。
壓痕30因粒子之壓入之強度而導致對比度或外徑不同。因此，壓痕成為判定熱壓接頭33之擠壓於各輸入輸出端子19a、19b間及各個輸入輸出端子19a、19b內是否均勻地擠壓之判定指標。
此處，於使用使導電性粒子4隨機地分散於黏合劑樹脂層3中之異向性導電膜而連接之連接體中，如圖8(c)所示，於輸入輸出端子上不規則地出現壓痕30，並且接近、重複，故而壓痕30之辨識性不良，狀態之掌控要費工夫，故而檢查花費時間，且壓痕30之判定精度降低。即，成為難以識別形成壓痕30之曲線之狀態。又，於以機械性圖像處理進行檢查之情形時，難以根據此種辨識性之不良程度而設置判定之基準。因此， 判定之精度本身劣化。其原因在於，該情形時，有時因解像度而導致看起來像直線之組合。
另一方面，本發明之液晶顯示面板10係使用排列有導電性粒子4之異向性導電膜1而形成，故而於輸入輸出端子19a、19b內，導電性粒子4亦以排列之狀態被夾持，如圖8(a)所示，壓痕30以個別獨立之狀態規則地出現。因此，於輸入輸出端子19a、19b上出現之壓痕30明顯呈現對比度或形成其之曲線，使各個壓痕30之辨識性大幅提高。藉此，液晶顯示面板10可迅速、準確地檢查基於壓痕30之輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之連接性。
於輸入輸出端子19a、19b上出現之各個壓痕30只要規則地呈現，則可根據與不存在導電性粒子4之平滑面之對比度而確保辨識性，故而亦可相互鄰接，但較佳為隔開規定之距離、例如外徑之0.2倍以上而出現，更佳為隔開0.4倍以上而出現。再者，與上述平滑面之對比度亦包含以曲線呈現的情形。
於一個輸入輸出端子19a、19b內，此種壓痕30較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。所謂壓痕30獨立地存在係指導電性粒子4以1個而存在，未獨立者係指鄰接或重複者。但，將刻意使多數個導電性粒子4連結而排列之情形看作以此單元而獨立者。
又，於圖9所示之複數個輸入輸出端子19a、19b排列之輸入輸出端子排20a、20b之中央之輸入輸出端子19aM、19bM內，壓痕30較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。再者， 於輸入輸出端子排20a、20b中排列有奇數個輸入輸出端子19a、9b之情形時，中央之輸入輸出端子19aM、19bM係所謂該端子排之正中間之端子，於輸入輸出端子排20a、20b中排列有偶數個輸入輸出端子19a、9b之情形時，中央之輸入輸出端子19aM、19bM係所謂該端子排之正中間之2個端子。
同樣地，於圖9所示之複數個輸入輸出端子19a、19b排列之輸入輸出端子排20a、20b之兩端之輸入輸出端子19aL、19aR、19bL、19bR之各端子上，壓痕30亦較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。根據於兩端之輸入輸出端子19aL、19aR、19bL、19bR上55%以上之壓痕30獨立地存在而可推斷，該輸入輸出端子排20a、20b之所有輸入輸出端子19a、19b具備相同之辨識性。
又，於圖9所示之複數個輸入輸出端子19a、19b排列之輸入輸出端子排20a、20b之與中央之輸入輸出端子19aM、19bM鄰接之輸入輸出端子19aMs、19bMs之各端子上，壓痕30亦較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。根據於與中央之輸入輸出端子19aM、19bM鄰接之輸入輸出端子19aMs、19bMs之各端子上55%以上之壓痕30獨立地存在而可推斷，不僅於該端子排之中央，而且於端子排整體之輸入輸出端子19a、19b上，具備相同之辨識性。
進而，於圖9所示之複數個輸入輸出端子19a、19b排列之輸入輸出端子排20a、20b之與兩端之輸入輸出端子19aL、19aR、19bL、19bR鄰接之輸入輸出端子19aLs、19aRs、19bLs、19bRs之各端子上，壓痕30亦較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。根 據於與兩端之輸入輸出端子19aL、19aR，19bL、19bR鄰接之輸入輸出端子19aLs、19aRs、19bLs、19bRs之各端子上55%以上之壓痕30獨立地存在而可推斷，不僅於該端子排之兩端，而且於端子排整體之輸入輸出端子19a、19b上，具備相同之辨識性。
又，於與透明基板平行地存在之輸入輸出端子排20a、20b之所有輸入輸出端子19a、19b上，同樣地，壓痕30較佳為55%以上獨立地存在，更佳為65%以上，進而較佳為75%以上。藉由對平行地存在之端子排彼此之壓痕加以比較，亦可檢查熱壓接頭33之整個擠壓面之均勻性。
又，於輸入輸出端子19a、19b上，為了確認進行與輸入輸出凸塊21a、21b之電性連接，壓痕30較佳為對應每個輸入輸出端子19a、19b而出現2個以上，更佳為3個以上，進而較佳為4個以上。
根據壓痕30之至少一部分規則地出現而將其設為指標，藉此可同時掌控液晶驅動用IC 18連接時之黏合劑樹脂之由輸入輸出端子19a、19b及輸入輸出凸塊21a、21b夾持之區域之連接狀態、及鄰接之輸入輸出凸塊21a、21b之端子間之間隙23之連接狀態。其原因在於，壓痕30為辨識性較佳之狀態，故而若輸入輸出端子19a、19b或其周邊部位之黏合劑樹脂之狀態中產生隆起等，則因該隆起等之透射性不同而使與成為指標之壓痕30之比較變得容易。又，於異物混入至連接體內之情形時，亦因以規則排列為指標而使成為不良之異物之發現與場所之界定、影響程度之掌控變得容易。
[接近端子彼此之壓痕之排列之相同性或相似性]
又，液晶顯示面板10中，較佳為接近之輸入輸出端子19a、19b彼此之 壓痕30之排列之一部分相同或具有相似性。藉此，液晶顯示面板10中，可容易地進行壓痕30之相對比較，亦可迅速、準確地進行檢查之判定基準之設定、或判定評價。尤其於以目測進行檢查之情形時，例如若鄰接之輸入輸出端子19a、19b彼此之壓痕30之排列相同或具有相似性而呈現，則可容易且迅速地進行相互之壓痕之評價。藉由反覆該情形而可高精度且容易地進行整個擠壓面之掌控。
再者，排列亦可為壓痕30以直線狀排列者，相同性係所謂以直線狀排列之壓痕之排列間距或長度呈現為相同，相似性包含以該直線狀排列之壓痕之排列間距或長度變化者。該情形之直線於微間距之輸入輸出端子19a、19b上，看作亦排列有由2個等之最小數形成之壓痕。相似性係指該距離或間隔變化者。其原因在於，若成為微間距，則被夾持之導電性粒子之排列僅可看作為直線、或與其接近之狀態。
液晶顯示面板10中，藉由使用規則排列有導電性粒子4之異向性導電膜1，將導電性粒子4遍及接近之輸入輸出端子19a、19b而規則地配置。於該狀態下若藉由熱壓接頭33而加熱擠壓，則黏合劑樹脂之流動性亦於接近之輸入輸出端子19a、19b之間成為大致相同，因此可使壓痕30之排列相同或具有相似性。
[一端子內之壓痕間距離]
又，壓痕30中，一個輸入輸出端子19a、19b內之所有壓痕30之壓痕間距離較佳為平均壓痕間距離±30%以內，更佳為15%以內，進而較佳為7%以內。壓痕間距離係所謂某壓痕30與接近之壓痕30之外緣間的最短距離為最短之壓痕30之該外緣間之最短距離，平均壓痕間距離係所謂一個輸入輸 出端子19a、19b內之所有壓痕30之壓痕間距離之平均值。藉此，本發明於壓痕30之檢查步驟中，亦可檢查一個輸入輸出端子19a、19b內之擠壓之均勻性。
即，於一個輸入輸出端子19a、19b內，若所有壓痕30之壓痕間距離為平均壓痕間距離±30%以內，則認為施加至導電性粒子4之擠壓力亦大致均勻，輸入輸出凸塊21a、21b與輸入輸出端子19a、19b平行地受到擠壓，各輸入輸出端子19a、19b之導通電阻之不均亦較少。另一方面，於一個輸入輸出端子19a、19b內，若所有壓痕30之壓痕間距離超出平均壓痕間距離±30%，則認為輸入輸出凸塊21a、21b與輸入輸出端子19a、19b並未平行地受到擠壓，且認為各輸入輸出端子19a、19b間之導通電阻之不均較大。
[一端子排內之擠壓之均勻性]
又，壓痕30中，一個輸入輸出端子19a、19b內之平均壓痕間距離、與該輸入輸出端子19a、19b排列之端子排之中央之輸入輸出端子19aM、19bM之平均壓痕間距離之差較佳為±30%以內，更佳為15%以內，進而較佳為7%以內。藉此，本發明於壓痕30之檢查步驟中，亦可檢查一個輸入輸出端子排20a、20b內之擠壓之均勻性。再者，於輸入輸出端子排20a、20b中排列有奇數個輸入輸出端子19a、9b之情形時，中央之輸入輸出端子19aM、19bM係所謂該端子排之正中間之端子，於輸入輸出端子排20a、20b中排列有偶數個輸入輸出端子19a、9b之情形時，中央之輸入輸出端子19aM、19bM係所謂該端子排之正中間2個端子。
即，輸入輸出端子排20a、20b中，液晶驅動用IC 18或透明 基板12平行地受到擠壓之情形自不必說，於產生翹曲之情形時，亦因中央之輸入輸出端子19aM、19bM受到最多地擠壓而使壓痕之辨識性亦最明顯地呈現，故而成為測量該端子排之擠壓之均勻性之基準。
而且，若一個輸入輸出端子19a、19b之平均壓痕間距離、與輸入輸出端子排20a、20b之中央之輸入輸出端子19aM、19bM之平均壓痕間距離之差為±30%以內，則認為於該輸入輸出端子19a、19b上，施加至導電性粒子4之擠壓力亦與端子排中央之輸入輸出端子19aM、19bM大致相同，輸入輸出凸塊21a、21b平行地受到擠壓，且與其他輸入輸出端子19a、19b之導通電阻之不均亦較少。另一方面，若一個輸入輸出端子19a、19b之平均壓痕間距離、與輸入輸出端子排20a、20b之中央之輸入輸出端子19aM、19bM之平均壓痕間距離之差超出±30%，則認為於該端子排中輸入輸出凸塊21a、21b與該輸入輸出端子19a、19b並未平行地受到擠壓，且認為各輸入輸出端子19a、19b間之導通電阻之不均較大。該情形之導通電阻之不均亦包含可靠性試驗等之經年劣化時之影響。
進而，於與透明基板12平行地存在之輸入輸出端子排20a、20b之各輸入輸出端子19a、19b上，亦同樣地，壓痕30中，一個輸入輸出端子19a、19b內之所有壓痕30之壓痕間距離較佳為平均壓痕間距離±30%以內，更佳為15%以內，進而較佳為7%以內。又，於與透明基板12平行地存在之輸入輸出端子排20a、20b上，亦為一個輸入輸出端子19a、19b內之平均壓痕間距離、與該輸入輸出端子19a、19b排列之輸入輸出端子排20a、20b之中央之輸入輸出端子19aM、19bM之平均壓痕間距離之差較佳為±30%以內，更佳為15%以內，進而較佳為7%以內。如此，藉由對平行地 存在之端子排彼此之壓痕加以比較，亦可檢查整個擠壓面之均勻性。
[凹凸部]
此處，液晶驅動用IC 18之輸入輸出凸塊21a、21b亦可為於捕捉導電性粒子4之表面設置有具有導電性粒子4之粒徑之50%以內之高低差之凹凸部28者。例如圖10、圖11所示，凹凸部28藉由使捕捉導電性粒子4之表面之兩側緣、或中央部突出而形成。又，凹凸部28之高低差係所謂於輸入輸出凸塊21a、21b之表面中，最高之凸部28a與最低之凹部28b之差。
而且，凹凸部28之高低差設為擠壓前之導電性粒子4之粒徑之50%以內。藉由將高低差設為導電性粒子4之粒徑之50%以內，於由凹部28b捕捉到導電性粒子4之情形時，亦可於該凹部28b充分地壓入導電性粒子4，並且亦無凸部28a直接抵接於輸入輸出端子19a、19b之情況。因此，輸入輸出凸塊21a、21b與輸入輸出端子19a、19b藉由夾持導電性粒子4而導通連接，且根據連接後之環境變化亦可確保良好之導通可靠性。再者，藉由於輸入輸出凸塊21a、21b之表面設置具有導電性粒子4之粒徑之50%以內之高低差的凹凸部28，亦可確保良好之辨識性，不會對輸入輸出端子19a、19b上壓痕之辨識性造成特別之影響。
另一方面，如圖12、圖13所示，若凹凸部28之高低差超出擠壓前之導電性粒子4之粒徑之50%，則於由凹部28b捕捉到導電性粒子4之情形時，導電性粒子4之壓入不足而導致導通電阻之上升，並且凸部28a直接抵接於輸入輸出端子19a、19b，因此對連接後之輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之距離之變化之追隨性較低，從而存在損及導通可靠性之虞。再者，作為圖12之由輸入輸出凸塊21a、21b之凹部28b 補捉到導電性粒子4之情形之一例，亦說明導電性粒子4沒入凹部28b側之狀態。因輸入輸出凸塊21a、21b之材質不均而導致硬度不均，於壓接步驟中導電性粒子4有時會沒入輸入輸出凸塊21a、21b中。該情形時，對連接後之輸入輸出凸塊21a、21b與輸入輸出端子19a、19b之距離之變化之追隨性亦變低，可謂存在損及導通可靠性之虞。
[實施例]
[第1實施例]
其次，對本發明之第1實施例進行說明。於第1實施例中，使用規則排列有導電性粒子之異向性導電膜、及隨機地分散有導電性粒子之異向性導電膜，製作將評價用IC連接於評價用玻璃基板之連接體樣本，分別對評價用玻璃基板之端子上出現的壓痕之個數及獨立性進行評價，並且測定初始導通電阻、鄰接之IC凸塊間之短路發生率。
[異向性導電膜]
用於評價用IC之連接之異向性導電膜之黏合劑樹脂層係藉由調整於溶劑中添加有苯氧基樹脂(商品名：YP50，新日鐵化學公司製)60質量份、環氧樹脂(商品名：jER828，三菱化學公司製)40質量份、及陽離子系硬化劑(商品名：SI-60L，三新化學工業公司製)2質量份之黏合劑樹脂組成物，並將該黏合劑樹脂組成物塗佈於剝離膜上、進行煅燒而形成。
[導通電阻測定用之評價用IC]
作為導通電阻測定用之評價元件，使用外形0.7mm×20mm、厚度0.2mm、凸塊(鍍銅)寬度15μm×長度100μm、高度12μm之評價用IC。
[IC凸塊間短路測定用之評價用IC]
作為IC凸塊間短路測定用之評價元件，使用外形0.7mm×20mm、厚度0.2mm、凸塊(鍍銅)寬度15μm×長度100μm、高度12μm、凸塊間之間隙寬度7.5μm之評價用IC。
[評價用玻璃基板]
作為將導通電阻測定用之評價用IC及IC凸塊間短路測定用之評價用IC加以連接之評價用玻璃基板，使用形成有將複數個與外形30mm×50mm、厚度0.5mm、導通電阻測定用之評價用IC之凸塊相同尺寸且相同間距之端子排列而成之端子排之ITO圖案玻璃。
將異向性導電膜暫貼於該評價用玻璃基板之後，一面取得IC凸塊與基板電極之對準一面搭載評價用IC，利用熱壓接頭以180℃、80MPa、5sec之條件進行熱壓接，藉此製作連接體樣本。對各連接體樣本，測定評價用玻璃基板之端子上出現的壓痕之個數及獨立性、初始導通電阻、及鄰接之IC凸塊間之短路發生率。
關於評價用玻璃基板之端子上出現的壓痕之獨立性，對連接有導通電阻測定用之評價用IC之各連接體樣本，自評價用玻璃基板之背面觀察出現複數個壓痕之端子，計測計數到1000個壓痕時之未獨立之壓痕之數。
又，藉由目測、及以圖像處理機(WinRoof：三谷商務公司製)處理攝影圖像而計數評價用玻璃基板之1個端子內出現的壓痕之個數，分別求出50個基板電極之平均。
又，如圖9所示，為了確認評價用IC是否均勻地受到擠壓，對2個輸出端子排20b中的外側之輸出端子排20b之中央之輸出端子 19bM、與中央之輸出端子19bM鄰接之輸出端子19bMs、兩端之輸出端子19bL、19bR、及與兩端之輸出端子19bL、19bR鄰接之輸出端子19bLs、19bRs，評價於各端子內出現之壓痕之75%以上是否具有獨立性。端子排之中央之端子19bM與端子排之兩端之端子19bL、19bR若同等地受到擠壓，則可看作同排之其他端子亦大致同等地受到擠壓。又，與端子排之中央之端子19bM鄰接之端子19bMs及與端子排之兩端之端子鄰接之端子19bLs、19bRs若同等地受到擠壓，則可評價為均勻性更高。此係簡易之檢查方法之一例。
再者，外側之輸出端子排20b之輸出端子數為偶數，中央之端子以正中間之2個輸出端子進行測定，電極排之兩端之端子、與兩端之端子鄰接之端子、及與中央之端子鄰接之端子之各部分之觀測面積成為相同。
又，導通電阻係於連接初期及可靠性試驗後測定，將初始導通電阻為1.0Ω以下、可靠性試驗後之導通電阻為6Ω以下評價為良好。可靠性試驗之條件為85℃、85% RH、500hr。又，將IC凸塊間之短路發生率為50ppm以下評價為良好。
[實施例1]
於實施例1中，使用黏合劑樹脂層中規則排列有導電性粒子之異向性導電膜。實施例1中使用之異向性導電膜係藉由以下方法而製造：將黏著劑塗佈於可延伸之片材上，且於其上將導電性粒子以晶格狀且均勻地單層排列之後，使該片材以所需之延伸倍率延伸，於該狀態下對黏合劑樹脂層進行層壓。所使用之導電性粒子(商品名：AUL704，積水化學工業公司製)之粒徑為4μm，連接前之粒子間距離為0.5μm，粒子個數密度為28000 個/mm2。
[實施例2]
於實施例2中，使用連接前之粒子間距離為1μm、粒子個數密度為16000個/mm2之異向性導電膜，除此之外，設為與實施例1相同之條件。
[實施例3]
於實施例3中，使用連接前之粒子間距離為1.5μm、粒子個數密度為10500個/mm2之異向性導電膜，除此之外，設為與實施例1相同之條件。
[實施例4]
於實施例4中，使用連接前之粒子間距離為3μm、粒子個數密度為5200個/mm2之異向性導電膜，除此之外，設為與實施例1相同之條件。
[實施例5]
於實施例5中，使用粒徑為3μm之導電性粒子(商品名：AUL703，積水化學工業公司製)，且使用連接前之粒子間距離為0.5μm、粒子個數密度為50000個/mm2之異向性導電膜，除此之外，設為與實施例1相同之條件。
[比較例1]
於比較例1中，使用藉由向黏合劑樹脂組成物中添加導電性粒子並調整、且於剝離膜上塗佈、煅燒而使導電性粒子隨機地分散於黏合劑樹脂層中之異向性導電膜。所使用之導電性粒子(商品名：AUL704，積水化學工業公司製)之粒徑為4μm，粒子個數密度為100000個/mm2。
[比較例2]
於比較例2中，粒子個數密度為60000個/mm2，除此之外，設為與比 較例1相同之條件。
如表1所示，於比較例1及比較例2之連接體樣本中，於1000個壓痕內，有104個(比較例1)、232個(比較例2)即至少10%以上之壓痕鄰接或重複，可見辨識性不良。另一方面，於實施例1~5之連接體樣本中，鄰接或重複之個數較各比較例少2個位數，故而可見辨識性良好。再者，實施例、比較例之任一者均存在壓痕之獨立性與導電性粒子之個數密度成比例地劣化之傾向。
又，藉由目測與圖像處理機而比較1端子內之壓痕個數，各比較例中其差較大，各實施例中其差較小。此係於比較例中因壓痕之鄰接或重複等而使各個壓痕之獨立性較低，將複數個壓痕計數為1個，可見識別性不良。另一方面，於實施例中幾乎不存在壓痕之鄰接或重複，故而不會因目測與圖像處理機而產生差異。因此可知，各個壓痕之識別容易，且 精度良好。
又，關於端子排之中央之端子、與中央之端子鄰接之端子、兩端之端子、及與兩端之端子鄰接之端子之各端子內出現的各個壓痕之75%以上是否具有獨立性，比較例中於任一端子上均無法取得具有獨立性之各個壓痕為75%以上之識別容易之狀態，實施例中於所有端子上可取得具有獨立性之各個壓痕為75%以上之識別容易之狀態。
該等實施例之連接體樣本中，初始導通電阻及可靠性試驗後之導通電阻均為1Ω以下，又，IC凸塊間短路之發生率亦為50ppm以下。即，根據實施例之連接體樣本可知，藉由檢查設置於端子排之中央部及兩端部之4~8個端子上之壓痕，可確認該端子排之擠壓之均勻性。
再者，各實施例之連接體樣本中，對與觀察壓痕之獨立性之端子排平行、且形成於與形成有觀察該壓痕之獨立性之端子排之基板側緣相反側之側緣之端子排(輸入端子排20a)亦進行同樣地觀察後，同樣地，端子排之中央之端子、與中央之端子鄰接之端子、兩端之端子、及與兩端之端子鄰接之端子之各端子內所出現的壓痕之75%以上具有獨立性。即，可知各實施例之連接體樣本於評價用IC之整個擠壓部位可取得擠壓之均勻性。
[第2實施例]
其次，對本發明之第2實施例進行說明。於第2實施例中，使用規則排列有導電性粒子之異向性導電膜、及隨機地分散有導電性粒子之異向性導電膜，並且使用於凸塊表面形成有具有導電性粒子之粒徑之50%以內之高低差之凹凸部之評價用IC製作連接體樣本，分別對評價用玻璃基板之端 子上出現的壓痕之個數及獨立性進行評價，並且測定初始及可靠性試驗後之導通電阻、鄰接之IC凸塊間之短路發生率。
第2實施例中使用之評價用IC對於導通電阻測定用、IC凸塊間短路測定用之任一者，均於輸入輸出凸塊表面形成有具有導電性粒子之粒徑之50%以內之高低差之凹凸部，除此之外，與第1實施例中使用者相同。又，異向性導電膜及評價用玻璃基板與第1實施例中使用者相同。
又，評價用玻璃基板之端子上出現的壓痕之個數及獨立性之評價位置及評價基準亦與第1實施例相同。再者，於第2實施例中，以目測而計數評價用玻璃基板之1個端子內出現的壓痕之個數。又，導通電阻及IC凸塊間之短路發生率之評價基準、可靠性試驗之條件亦與第1實施例相同。
[實施例6~10]
實施例6中，使用實施例1中所使用之異向性導電膜，實施例7中使用實施例2中所使用之異向性導電膜，實施例8中使用實施例3中所使用之異向性導電膜，實施例9中使用實施例4中所使用之異向性導電膜，實施例10中使用實施例5中所使用之異向性導電膜。
[比較例3、4]
又，比較例3中使用比較例1中所使用之異向性導電膜，比較例4中使用比較例2中所使用之異向性導電膜。
如表2所示，於使用凸塊表面形成有具有導電性粒子之粒徑之50%以內之高低差之凹凸部之評價用IC之情形時，亦出現與第1實施例相同之傾向。即，於比較例3及比較例4之連接體樣本中，於1000個壓痕內，有121個(比較例3)、265個(比較例4)、即至少10%以上之壓痕鄰接或重複，可見辨識性不良。另一方面，於實施例6~10之連接體樣本中，鄰接或重複之個數較各比較例少1個位數以上，故而可見辨識性良好。再者，實施例、比較例之任一者均存在壓痕之獨立性與導電性粒子之個數密度成比例地劣化之傾向。
又，關於端子排之中央之端子、與中央之端子鄰接之端子、兩端之端子、及與兩端之端子鄰接之端子之各端子內出現的各個壓痕之75%以上是否具有獨立性，比較例中於任一端子上均無法取得具有獨立性之各個壓痕為75%以上之識別容易之狀態，實施例中於所有端子上可取得具有 獨立性之各個壓痕為75%以上之識別容易之狀態。
該等實施例之連接體樣本中，初始導通電阻及可靠性試驗後之導通電阻均為1Ω以下，又，IC凸塊間短路之發生率亦為50ppm以下。即，根據實施例之連接體樣本可知，藉由檢查設置於端子排之中央部及兩端部之4~8個端子上之壓痕，可確認該端子排之擠壓之均勻性。
再者，將比較例4與表1之比較例2加以比較，導電性粒子隨機地分散於黏合劑樹脂中之點為共同，但IC凸塊間短路發生率較大地不同。可知於導電性粒子為隨機之情形時，因為導電性粒子之不均勻分佈而IC凸塊間短路發生率不均。即，由此亦可知，藉由將導電性粒子規則排列而可抑制IC凸塊間短路發生率。
再者，各實施例之連接體樣本中，對與觀察壓痕之獨立性之端子排平行、且形成於與形成有觀察該壓痕之獨立性之端子排之基板側緣相反側之側緣之端子排(輸入端子排20a)亦進行同樣地觀察後，同樣地，端子排之中央之端子、與中央之端子鄰接之端子、兩端之端子、及與兩端之端子鄰接之端子之各端子內所出現的壓痕之75%以上具有獨立性。即，可知各實施例之連接體樣本於評價用IC之整個擠壓部位可取得擠壓之均勻性。
19a、19b‧‧‧輸入輸出端子
30‧‧‧壓痕

Claims (20)

  1. 一種連接體，其具備：透明基板；及電子零件，其經由異向性導電接著劑而連接於上述透明基板上；且於上述透明基板之端子，於面內方向排列有上述異向性導電接著劑所含有之導電性粒子形成之複數個壓痕。
  2. 如申請專利範圍第1項之連接體，其中，於上述透明基板之接近之上述端子彼此，上述壓痕之排列相同或具有相似性。
  3. 如申請專利範圍第1或2項之連接體，其中，上述透明基板具有排列複數個上述端子之端子排，上述端子排於中央之端子內，55%以上之壓痕係獨立地存在。
  4. 如申請專利範圍第3項之連接體，其中，於同一上述端子內，上述壓痕不重複。
  5. 如申請專利範圍第3項之連接體，其中，上述端子內之壓痕與最接近之其他壓痕之外緣間的距離之差為同一端子內之平均的±30%以內。
  6. 如申請專利範圍第1或2項之連接體，其中，上述透明基板具有排列複數個上述端子之端子排，上述端子排於兩端之端子內，55%以上之壓痕係獨立地存在。
  7. 如申請專利範圍第6項之連接體，其中，於同一上述端子內，上述壓痕不重複。
  8. 如申請專利範圍第6項之連接體，其中， 上述端子內之壓痕與最接近之其他壓痕之外緣間的距離之差為同一端子內之平均的±30%以內。
  9. 如申請專利範圍第1或2項之連接體，其中，上述透明基板具有排列複數個上述端子之端子排，上述端子排於與中央之端子鄰接之端子內，55%以上之壓痕係獨立地存在。
  10. 如申請專利範圍第9項之連接體，其中，於同一上述端子內，上述壓痕不重複。
  11. 如申請專利範圍第9項之連接體，其中，上述端子內之壓痕與最接近之其他壓痕之外緣間的距離之差為同一端子內之平均的±30%以內。
  12. 如申請專利範圍第1或2項之連接體，其中，上述透明基板具有排列複數個上述端子之端子排，上述端子排於與兩端之端子鄰接之端子內，55%以上之壓痕獨立地存在。
  13. 如申請專利範圍第12項之連接體，其中，於同一上述端子內，上述壓痕不重複。
  14. 如申請專利範圍第12項之連接體，其中，上述端子內之壓痕與最接近之其他壓痕之外緣間的距離之差為同一端子內之平均的±30%以內。
  15. 如申請專利範圍第1或2項之連接體，其中，上述透明基板於與排列複數個上述端子之端子排平行地存在之端 子排內之端子內，55%以上之壓痕係獨立地存在。
  16. 如申請專利範圍第15項之連接體，其中，於同一上述端子內，上述壓痕不重複。
  17. 如申請專利範圍第15項之連接體，其中，上述端子內之壓痕與最接近之其他壓痕之外緣間的距離之差為同一端子內之平均的±30%以內。
  18. 如申請專利範圍第1或2項之連接體，其中，與上述透明基板之上述端子連接之上述電子零件之凸塊於捕捉上述導電性粒子之表面形成有凹凸部，該凹凸部具有上述導電性粒子之粒徑之50%以內之高低差。
  19. 一種連接體之製造方法，其係於電路基板上經由含有導電性粒子之接著劑而搭載電子零件，對上述電路基板擠壓上述電子零件，並且使上述接著劑硬化，藉此將上述電子零件連接於上述電路基板上；且上述異向性導電接著劑於黏合劑樹脂中排列導電性粒子，於上述透明基板之端子，於面內方向排列有上述導電性粒子形成之複數個壓痕。
  20. 一種檢查方法，其係對連接體之連接狀態進行檢查之方法，該連接體係於透明基板上經由排列有導電性粒子之異向性導電接著劑而連接有電子零件者，且上述檢查方法係對上述透明基板之端子所出現的上述異向性導電接著劑所含有之導電性粒子之壓痕及壓痕之周邊部位加以比較，檢查連 接狀態。
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