TW201600482A - Method for dividing bonded substrate - Google Patents
Method for dividing bonded substrate Download PDFInfo
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- TW201600482A TW201600482A TW104108449A TW104108449A TW201600482A TW 201600482 A TW201600482 A TW 201600482A TW 104108449 A TW104108449 A TW 104108449A TW 104108449 A TW104108449 A TW 104108449A TW 201600482 A TW201600482 A TW 201600482A
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- glass portion
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- bonded substrate
- lower glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Description
本發明是關於一種貼合基板之分斷方法，詳細而言，是關於一種不僅能夠使基板不要的端材部最大限度地成為較小，也能夠獲得滑順分斷面的貼合基板之分斷方法。 The present invention relates to a method for separating a bonded substrate. More specifically, the present invention relates to a bonded substrate which can not only minimize the thickness of the end portion of the substrate but also obtain a smooth cross-section. Break method.
一般而言，習知以往在去除液晶基板不要的端材部時，僅利用刻劃輪。 In general, conventionally, only the scribing wheel is used when removing the end portion of the liquid crystal substrate.
具體而言，一般的液晶基板，在上部玻璃部與下部玻璃部間填充液晶層後，以液晶層不往外部露液的方式利用密封層圍繞液晶層之框部分而將其密封。 Specifically, in a general liquid crystal substrate, after a liquid crystal layer is filled between the upper glass portion and the lower glass portion, the liquid crystal layer is sealed around the frame portion of the liquid crystal layer by a sealing layer so as not to be exposed to the outside.
亦即，成為使密封層附著在上部玻璃部與下部玻璃部相互對向的面，並以液晶層不往外部流出的方式密封的構造。 In other words, the sealing layer is adhered to a surface on which the upper glass portion and the lower glass portion face each other, and the liquid crystal layer is sealed so as not to flow outward.
此外，為了提高密封性，而使密封層寬度較寬地形成在基板平面的延伸方向。 Further, in order to improve the sealing property, the sealing layer is formed to have a wide width in the extending direction of the substrate plane.
如此般，在以往習知技術中，由於在液晶基板之框部分包含具有較寬寬度的密封層，因此存在有如下的實際情形：以較大的邊框(額緣)(bezel)尺寸的狀態使用、或者切除密封層之外周部分以使邊框變小。 As described above, in the prior art, since the sealing portion having a wide width is included in the frame portion of the liquid crystal substrate, there is a practical situation in which a large bezel size is used. Or cut off the outer peripheral portion of the sealing layer to make the frame smaller.
然而，最近亦存在有將液晶基板相互地連結成平面而使用的情形，且在該情形，存在有於影像具體顯現時在密封層外周部分彼此之連 結部位影像不滑順的問題點。 However, there have been recent cases in which liquid crystal substrates are connected to each other in a plane, and in this case, there is a case where the outer peripheral portion of the sealing layer is connected to each other when the image is specifically developed. The problem that the image of the knot is not smooth.
為了解決如此般之問題點，而為了最大限度地切取液晶基板之密封層寬度，於是利用刻劃輪以較深地侵入至液晶基板之密封層的方式進行分斷。 In order to solve such a problem, in order to maximize the thickness of the sealing layer of the liquid crystal substrate, the scribing wheel is used to break into the sealing layer of the liquid crystal substrate.
然而，在利用刻劃輪對液晶基板之密封層進行刻劃時，因密封層所具有的物性，而產生了刻劃輪一邊進行刻劃一邊失去直進性、無法沿刻劃預定線進行移動等而往其他方向行進，從而使基板變不佳的問題點。 However, when the sealing layer of the liquid crystal substrate is scribed by the scribing wheel, the physical properties of the sealing layer cause the scoring wheel to lose the straightness while scribing, and cannot move along the scribed line. The problem of traveling in other directions, thereby making the substrate poor.
此外，在利用習知的刻劃輪方式中，實際情形為：難以進行侵入至位於上部玻璃部與下部玻璃部間的密封層般的刻劃，且在刻劃輪之刻劃作業完成後密封層尚未被分斷而仍殘留著，亦產生玻璃未完全分離的問題點。 Further, in the conventional scoring wheel method, the actual situation is that it is difficult to invade to the sealing layer located between the upper glass portion and the lower glass portion, and is sealed after the scoring wheel is finished. The layer has not been broken yet remains, and there is also a problem that the glass is not completely separated.
此外，在最近，將多個液晶基板以平面並以框相互地抵接以使大型影像具體顯現而販售的影像裝置變多，從而為了使能具體顯現影像的液晶層以外的部分、例如密封層為最小的研究廣為試行。 In addition, recently, a plurality of liquid crystal substrates have been planarly joined to each other to make a large-sized image appear and a large number of image devices have been sold, and in order to enable a portion other than the liquid crystal layer in which the image is specifically displayed, for example, a seal is provided. The study with the smallest layer is widely tested.
本發明是為了解決如上述般之問題點而創造出，其目的在於提供一種在利用雷射對液晶基板等貼合基板進行刻劃時，不僅能夠使基板不要的端材部最大限度地成為較小，而且亦能夠獲得滑順分斷面的貼合基板之分斷方法。 The present invention has been made to solve the problems as described above, and an object of the invention is to provide a method of not only making a substrate portion that is not required for a substrate to be maximized when a bonded substrate such as a liquid crystal substrate is scribed by a laser. It is small, and it is also possible to obtain a method of breaking the laminated substrate which is smooth and sectional.
為了解決上述課題，本發明之一實施形態之貼合基板之分斷方法，係對形成在貼合基板(10)之上部玻璃部(11a)與下部玻璃部(11b)間的密封部(8)上進行分斷，其特徵在於包含以下階段：利用刻劃輪(60)對該密封部 (8)上的上部玻璃部(11a)或下部玻璃部(11b)進行刻劃而在上部玻璃部(11a)或下部玻璃部(11b)形成刻劃線(CL)；對在從形成於該上部玻璃部(11a)或下部玻璃部(11b)的該刻劃線(CL)位置起隔著間隔而隔離之位置所形成的密封部(8)照射雷射而對該密封部(8)進行刻劃；以及，在對該密封部(8)進行刻劃的階段後，利用刻劃輪(60)對未形成有該刻劃線(CL)的殘留的玻璃部進行刻劃。 In order to solve the above problems, a method for dividing a bonded substrate according to an embodiment of the present invention is a sealing portion formed between a glass portion (11a) and a lower glass portion (11b) of an upper portion of a bonded substrate (10). Breaking on, characterized by comprising the following stage: using the scoring wheel (60) for the sealing portion (8) The upper glass portion (11a) or the lower glass portion (11b) is scribed to form a score line (CL) in the upper glass portion (11a) or the lower glass portion (11b); The sealing portion (8) formed at a position where the scribe line (CL) of the upper glass portion (11a) or the lower glass portion (11b) is separated by a space therebetween is irradiated with a laser to perform the sealing portion (8). After the step of scribing the seal portion (8), the remaining glass portion on which the score line (CL) is not formed is scored by the scoring wheel (60).
此外，根據本發明之其他實施形態的貼合基板(10)之分斷方法，係對形成在貼合基板(10)之上部玻璃部(11a)與下部玻璃部(11b)間的密封部(8)上進行分斷，其特徵在於包含以下階段：利用刻劃輪(60)對該密封部(8)上的上部玻璃部(11a)及下部玻璃部(11b)進行刻劃而在上部玻璃部(11a)及下部玻璃部(11b)形成刻劃線(CL)；以及，對從形成於該上部玻璃部(11a)及下部玻璃部(11b)的該刻劃線(CL)之位置起隔著間隔而隔離之位置所形成的密封部(8)照射雷射而對該密封部(8)進行刻劃。 Further, according to another embodiment of the present invention, the method of dividing the bonded substrate (10) is a sealing portion formed between the upper glass portion (11a) and the lower glass portion (11b) of the bonded substrate (10) ( 8) Performing the breaking, characterized in that it comprises the following steps: the upper glass portion (11a) and the lower glass portion (11b) on the sealing portion (8) are scored by the scoring wheel (60) in the upper glass The portion (11a) and the lower glass portion (11b) form a score line (CL); and, from the position of the score line (CL) formed on the upper glass portion (11a) and the lower glass portion (11b) The sealing portion (8) formed at a position separated by a space is irradiated with a laser to scribe the sealing portion (8).
此外，亦可為：在該上部玻璃部(11a)與下部玻璃部(11b)間，形成有外周部分由該密封部(8)密封的液晶部(50)；以該液晶部(50)為基準，對較該刻劃線(CL)更遠位置的該密封部(8)照射雷射而對該密封部(8)進行刻劃。 Further, a liquid crystal portion (50) having an outer peripheral portion sealed by the sealing portion (8) may be formed between the upper glass portion (11a) and the lower glass portion (11b); and the liquid crystal portion (50) may be In the reference, the sealing portion (8) at a position farther than the score line (CL) is irradiated with a laser to scribe the sealing portion (8).
此外，亦可為：以該刻劃線(CL)到達該密封部(8)的方式進行刻劃。 Further, the scribe line (CL) may be scribed so as to reach the sealing portion (8).
在該情形，亦可為：在利用該刻劃輪(60)對該上部玻璃部(11a)或下部玻璃部(11b)進行刻劃後，利用裂斷滾筒或裂斷桿對已刻劃的上部玻璃部(11a)或下部玻璃部(11b)進行裂斷。 In this case, after the upper glass portion (11a) or the lower glass portion (11b) is scored by the scribing wheel (60), the scribed groove is formed by using a split roller or a split rod. The upper glass portion (11a) or the lower glass portion (11b) is broken.
根據本發明，具有如下之效果：藉由在以雷射對貼合基板之 密封部進行刻劃時所產生的氣泡不往貼合基板之液晶層側流入，而能夠防止液晶層被汙染、成為不良品等。 According to the present invention, there is an effect of bonding a substrate by laser pairing The air bubbles generated when the sealing portion is scribed do not flow into the liquid crystal layer side of the bonded substrate, and the liquid crystal layer can be prevented from being contaminated and become defective.
此外，還具有以下效果：能夠良好地形成貼合基板之分斷面，並且能夠使貼合基板之分離性提高。 Further, it has an effect that the cross-section of the bonded substrate can be favorably formed, and the separation property of the bonded substrate can be improved.
8‧‧‧密封部 8‧‧‧ Sealing Department
10‧‧‧貼合基板 10‧‧‧Fixed substrate
11a‧‧‧上部玻璃部 11a‧‧‧Upper glass department
11b‧‧‧下部玻璃部 11b‧‧‧Lower glass department
50‧‧‧液晶部 50‧‧‧Liquid Department
60‧‧‧刻劃輪 60‧‧‧scribed wheel
CL‧‧‧刻劃線 CL‧‧ scribe
圖1，係表示在貼合基板之密封部上形成刻劃線的圖式。 Fig. 1 is a view showing a scribe line formed on a sealing portion of a bonded substrate.
圖2，係從貼合基板之側剖面觀察的概略圖。 Fig. 2 is a schematic view showing a cross section of the bonded substrate.
圖3，係表示利用刻劃輪對貼合基板進行刻劃之作業狀態的圖式。 Fig. 3 is a view showing an operation state in which the bonded substrate is scribed by the scoring wheel.
圖4，係表示關於貼合基板之刻劃方法的其他實施例的圖式。 Fig. 4 is a view showing another embodiment of a scribing method for a bonded substrate.
圖5，係表示對貼合基板之刻劃線上照射雷射時氣泡之浸透現象的放大顯微照片。 Fig. 5 is an enlarged photomicrograph showing the phenomenon of impregnation of bubbles upon irradiation of a laser on a scribe line of a bonded substrate.
圖6，係表示對貼合基板之刻劃線之外側位置照射雷射時氣泡之浸透現象的放大顯微照片。 Fig. 6 is a magnified micrograph showing the phenomenon of impregnation of bubbles when irradiating a laser to the outer side of the scribed line of the bonded substrate.
參照所附圖式具體地說明本發明之一實施形態之貼合基板之分斷方法。 A method of dividing a bonded substrate according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings.
如圖1及圖2所示，本實施形態之貼合基板10，包含上部玻璃部11a及下部玻璃部11b，且在該等上部玻璃部11a與下部玻璃部11b間形成有液晶部50。而且，以液晶部50不往貼合基板10之外部漏液的方式將液晶部50外周以密封部8密封。 As shown in FIGS. 1 and 2, the bonded substrate 10 of the present embodiment includes an upper glass portion 11a and a lower glass portion 11b, and a liquid crystal portion 50 is formed between the upper glass portion 11a and the lower glass portion 11b. Further, the outer periphery of the liquid crystal portion 50 is sealed by the sealing portion 8 so that the liquid crystal portion 50 does not leak to the outside of the bonded substrate 10.
在貼合基板10之框部，存在不要的部分即端材部5。在相 當於如此般之端材部5的上部玻璃部11a及下部玻璃部11b之框部間亦包含有密封部8。 The end portion 5, which is an unnecessary portion, is present in the frame portion of the bonded substrate 10. In phase The sealing portion 8 is also included between the frame portions of the upper glass portion 11a and the lower glass portion 11b of the end portion 5 as described above.
如此般之端材部5，為了使通過貼合基板10具體顯現之影像品質提高而較佳為使其尺寸最小化，且有必要分斷去除端材部5。 In order to minimize the image quality which is specifically exhibited by the bonded substrate 10, the end portion 5 is preferably made to have a minimum size, and it is necessary to separate and remove the end portion 5.
在本實施形態之貼合基板之刻劃方法中，首先，於貼合基板10上利用刻劃輪60一次性地在上部玻璃部11a或下部玻璃部11b形成刻劃線CL(圖1中以虛線所示之箭頭部分)。於圖2中，圖示有在下部玻璃部11b形成有刻劃線CL的樣態以作參考。 In the scribing method of the bonded substrate of the present embodiment, first, the scribe line CL is formed on the bonded substrate 10 by the scribing wheel 60 at one time in the upper glass portion 11a or the lower glass portion 11b (in FIG. 1 The arrow part shown by the dotted line). In FIG. 2, a state in which the score line CL is formed in the lower glass portion 11b is shown for reference.
而且，在上部玻璃部11a或下部玻璃部11b形成刻劃線CL時，以刻劃輪60侵入至密封部8之區域的方式形成刻劃線CL。在與此不同之方法中，如圖3所示，亦可為利用刻劃輪60以侵入至上部玻璃部11a或下部玻璃部11b厚度一部分之方式形成刻劃線，之後利用裂斷滾筒70等裂斷器具往厚度方向按壓形成有該刻劃線之玻璃部，而在上部玻璃部11a或下部玻璃部11b形成從該玻璃部表面到達形成有密封部8之面的刻劃線CL。 Further, when the score line CL is formed in the upper glass portion 11a or the lower glass portion 11b, the score line CL is formed so that the score wheel 60 intrudes into the region of the seal portion 8. In the method different from this, as shown in FIG. 3, the scribing wheel 60 may be used to form a score line so as to intrude into a part of the thickness of the upper glass portion 11a or the lower glass portion 11b, and then the broken drum 70 or the like may be used. The rupture tool presses the glass portion in which the scribe line is formed in the thickness direction, and the scribe line CL that reaches the surface on which the sealing portion 8 is formed is formed in the upper glass portion 11a or the lower glass portion 11b.
如上述般，若在上部玻璃部11a或下部玻璃部11b形成刻劃線CL，則對位於從刻劃線CL往外側(貼合基板10之框側)隔離既定間隔之位置的密封部8(參照圖1中以實線所示之箭頭部分)照射雷射而對密封部8進行刻劃。 As described above, when the scribe line CL is formed in the upper glass portion 11a or the lower glass portion 11b, the sealing portion 8 located at a predetermined interval from the scribe line CL to the outside (the frame side of the bonded substrate 10) is separated ( The sealing portion 8 is scribed by irradiating a laser with reference to the arrow portion shown by a solid line in Fig. 1 .
此時，一旦藉由雷射刻劃密封部8則產生氣泡，且所產生的氣泡，在上部玻璃部11a及下部玻璃部11b之間往密封部8之寬度方向即液晶部50及端材部5側傳播。 At this time, when the sealing portion 8 is scored by the laser, air bubbles are generated, and the generated bubbles are in the width direction of the sealing portion 8 between the upper glass portion 11a and the lower glass portion 11b, that is, the liquid crystal portion 50 and the end portion. 5 side spread.
往端材部5側傳播的氣泡，經由端材部5而往貼合基板10 外排出。 The air bubbles that have propagated toward the side of the end portion 5 are bonded to the substrate 10 via the end portion 5 Discharged outside.
而且，往與端材部5相反方向的液晶部50側傳播的氣泡，到達形成有刻劃線CL的部位。此時氣泡沿圖2之放大圖所圖示之箭頭方向，從密封部8被往形成於下部玻璃部11b的刻劃線CL之間隙誘導並往外排出。亦即，由於通過形成在貼合基板10上的刻劃線CL擠壓出氣泡，因此氣泡不再往形成液晶部50的位置前進。 Further, the air bubbles that have propagated toward the liquid crystal portion 50 side in the opposite direction to the end portion 5 reach the portion where the score line CL is formed. At this time, the bubble is induced from the seal portion 8 to the gap formed by the score line CL formed in the lower glass portion 11b in the direction of the arrow shown in the enlarged view of Fig. 2, and is discharged outward. That is, since the air bubbles are squeezed by the score line CL formed on the bonded substrate 10, the air bubbles are no longer advanced to the position where the liquid crystal portion 50 is formed.
參照圖5，在使雷射照射於與刻劃線CL同一線上的密封部8的情形時，可確認在密封部8上所產生的氣泡越過刻劃線CL而壓入至液晶部50。 Referring to Fig. 5, when the laser is irradiated onto the sealing portion 8 on the same line as the score line CL, it is confirmed that the air bubbles generated in the sealing portion 8 are pressed into the liquid crystal portion 50 beyond the score line CL.
相對於此，參照圖6，在上部玻璃部11a或下部玻璃部11b上之任一方形成刻劃線CL，對位於從該刻劃線CL起隔著間隔而隔離的位置之密封部8照射雷射的情形時，可確認在密封部8產生的氣泡不會越過刻劃線CL並滯留。藉此，能夠確認在密封部8所產生的氣泡，在往液晶部50側傳播的途中被往刻劃線CL之間隙外誘導並排出。 On the other hand, with reference to Fig. 6, a scribe line CL is formed on either one of the upper glass portion 11a or the lower glass portion 11b, and the sealing portion 8 located at a position separated from the scribe line CL at intervals is irradiated with a ray. In the case of shooting, it was confirmed that the air bubbles generated in the sealing portion 8 did not pass over the score line CL and stayed. By this, it is confirmed that the air bubbles generated in the sealing portion 8 are induced and discharged outside the gap of the score line CL in the middle of the propagation to the liquid crystal portion 50 side.
因此，從防止氣泡侵透液晶部50的觀點來看，在對貼合基板10之密封部8上照射雷射時，較佳為：對從上部玻璃部11a或下部玻璃部11b之刻劃線CL起往端材部5側隔著間隔而隔離之位置的密封部8照射雷射。 Therefore, from the viewpoint of preventing the air bubbles from penetrating the liquid crystal portion 50, when the laser is applied to the sealing portion 8 of the bonded substrate 10, it is preferable that the pair is scribed from the upper glass portion 11a or the lower glass portion 11b. The CL is irradiated with laser light from the sealing portion 8 at a position where the end portion 5 side is separated by the interval.
而且，在經過對密封部8照射雷射以進行刻劃的階段後，利用刻劃輪60對上部玻璃部11a或下部玻璃部11b中未被刻劃而附著殘留的玻璃部進行刻劃。藉此，能夠容易且漂亮地從貼合基板10去除不要的端材部5及密封部8。 Then, after the step of irradiating the sealing portion 8 with the laser to perform the scribing, the glass portion that is not scribed and adhered to the upper glass portion 11a or the lower glass portion 11b is scored by the scribing wheel 60. Thereby, the unnecessary end portion 5 and the sealing portion 8 can be easily and beautifully removed from the bonded substrate 10.
另一方面，在本實施形態中，雖已說明了僅對上部玻璃部11a或下部玻璃部11b中任某一方先形成刻劃線CL後，對密封部8照射雷射並使氣泡往形成有刻劃線CL的間隙誘導並排出的技術內容，但並不限定於此。 On the other hand, in the present embodiment, it has been described that only the scribe line CL is formed on only one of the upper glass portion 11a or the lower glass portion 11b, and then the sealing portion 8 is irradiated with a laser beam to form a bubble. The technical content of the gap inducing and discharging the scribe line CL is not limited thereto.
亦即，根據本發明之其他實施形態，亦可為：利用刻劃輪60在上部玻璃部11a及下部玻璃部11b兩方形成刻劃線CL後，對密封部8照射雷射並將氣泡往形成於兩方玻璃部的刻劃線CL誘導(參照圖4)。 That is, according to another embodiment of the present invention, after the score line CL is formed on both the upper glass portion 11a and the lower glass portion 11b by the scribing wheel 60, the seal portion 8 may be irradiated with a laser and the bubble may be directed to The scribe line CL formed in the glass portions of both sides is induced (see Fig. 4).
具體而言，在上部玻璃部11a及下部玻璃部11b兩方形成刻劃線CL，之後，如上述之實施形態般當利用雷射20照射密封部8而進行刻劃時，在密封部8產生的氣泡，如圖4所示般能夠一邊沿著形成在上部玻璃部11a及下部玻璃部11b的刻劃線CL誘導而一邊使其往外部排出。 Specifically, the score line CL is formed on both the upper glass portion 11a and the lower glass portion 11b, and then, when the seal portion 8 is irradiated with the laser 20 and scribing is performed as in the above-described embodiment, the seal portion 8 is generated. As shown in FIG. 4, the air bubbles can be discharged to the outside along the scribe line CL formed in the upper glass portion 11a and the lower glass portion 11b.
在本發明之上述實施形態中，藉由在玻璃上預先形成有刻劃線CL，從而即使在照射雷射而對密封部8進行刻劃時產生氣泡，該氣泡亦沿玻璃部之刻劃線CL自然地被往外部誘導而排出，因此能夠以被分斷的密封部之面具有漂亮的面之方式進行分斷。 In the above-described embodiment of the present invention, by forming the scribe line CL on the glass in advance, even when the laser beam is irradiated and the sealing portion 8 is scribed, bubbles are generated, and the bubbles are scribed along the glass portion. Since the CL is naturally induced and discharged to the outside, it can be separated so that the surface of the sealed sealing portion has a beautiful surface.
此外，在本發明之上述實施形態中，利用刻劃輪在玻璃部預先形成有刻劃線CL後，對密封部8照射雷射20而能夠去除接合基板之端材部5，且能夠使邊框(額緣)部分等減少到最小限度。 Further, in the above-described embodiment of the present invention, after the scribing line CL is formed in advance on the glass portion by the scribing wheel, the sealing portion 8 is irradiated with the laser beam 20, whereby the end portion 5 of the bonded substrate can be removed, and the frame can be made. The (frontal) part is reduced to a minimum.
5‧‧‧端材部 5‧‧‧Terminal Department
8‧‧‧密封部 8‧‧‧ Sealing Department
10‧‧‧貼合基板 10‧‧‧Fixed substrate
11a‧‧‧上部玻璃部 11a‧‧‧Upper glass department
11b‧‧‧下部玻璃部 11b‧‧‧Lower glass department
20‧‧‧雷射 20‧‧‧Laser
50‧‧‧液晶部 50‧‧‧Liquid Department
60‧‧‧刻劃輪 60‧‧‧scribed wheel
CL‧‧‧刻劃線 CL‧‧ scribe
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| ??10-2014-0078290 | 2014-06-25 | ||
| KR1020140106717A KR101614379B1 (en) | 2014-06-25 | 2014-08-18 | Method for cutting of bonded substrate |
| ??10-2014-0106717 | 2014-08-18 |
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| CN106940487A (en) * | 2016-01-05 | 2017-07-11 | 三星钻石工业股份有限公司 | Substrate disconnects method |
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| KR102633196B1 (en) * | 2016-12-01 | 2024-02-05 | 주식회사 탑 엔지니어링 | Scribing apparatus and scribing method |
| KR20200102992A (en) * | 2017-12-27 | 2020-09-01 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribe processing method and scribe processing device |
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| KR100218580B1 (en) | 1996-07-09 | 1999-09-01 | 구자홍 | High density large screen lcd manufacture method |
| JP2002287107A (en) * | 2001-03-28 | 2002-10-03 | Hitachi Ltd | Liquid crystal display device and method for manufacturing the same |
| JP2003002676A (en) * | 2001-06-19 | 2003-01-08 | Seiko Epson Corp | Method for splitting substrate and method for producing liquid crystal device |
| KR100689314B1 (en) * | 2003-11-29 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | Method of cutting liquid crystal display panel |
| JP2009210658A (en) * | 2008-02-29 | 2009-09-17 | Citizen Finetech Miyota Co Ltd | Manufacturing method of liquid crystal display element |
| WO2010029660A1 (en) * | 2008-09-12 | 2010-03-18 | シャープ株式会社 | Method of manufacturing display panel |
| JP5481167B2 (en) * | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | Glass welding method |
| JP4996703B2 (en) * | 2010-02-09 | 2012-08-08 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
| KR101818449B1 (en) * | 2010-12-15 | 2018-01-16 | 엘지디스플레이 주식회사 | Method of cutting liquid crystal display panel and fabricating liquid crystal display device |
| JP5767595B2 (en) * | 2012-02-23 | 2015-08-19 | 三星ダイヤモンド工業株式会社 | Scribing device for brittle material substrate |
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| KR101614379B1 (en) | 2016-04-21 |
| JP2016008171A (en) | 2016-01-18 |
| TWI669278B (en) | 2019-08-21 |
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