TW201811692A - Substrate breaking device and substrate breaking method capable of suppressing the occurrence of chippings when an end material is removed from a laminate substrate by forming scribe lines before the end material is removed - Google Patents

Substrate breaking device and substrate breaking method capable of suppressing the occurrence of chippings when an end material is removed from a laminate substrate by forming scribe lines before the end material is removed Download PDF

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TW201811692A
TW201811692A TW106120823A TW106120823A TW201811692A TW 201811692 A TW201811692 A TW 201811692A TW 106120823 A TW106120823 A TW 106120823A TW 106120823 A TW106120823 A TW 106120823A TW 201811692 A TW201811692 A TW 201811692A
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substrate
scribe line
end material
bonded
pressing
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TW106120823A
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岩坪佑磨
三浦善孝
田端淳
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日商三星鑽石工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)

Abstract

An object of the present invention is to suppress the occurrence of chippings when an end material is removed from a laminate substrate by forming scribe lines before the end material is removed, wherein the inner side of any one substrate of the laminate substrate is being exposed. The substrate breaking device of this invention is provided with a work table 2, and a pressing device 1. The work table 2 supports the laminate substrate G; the pressing device 1 presses from the opposite end on G1 side of a first substrate such that the end portion breaks along a first scribe line S1 and a second scribe line S2.

Description

基板分斷裝置及基板分斷方法    Substrate breaking device and substrate breaking method   

本發明係一種基板分斷裝置，尤其是關於具有在表面形成有為了切離端部之第1刻劃線之第1基板、與貼合於第1基板背面，第2刻劃線形成於較第1刻劃線近邊緣之位置之第2基板之貼合基板的分斷裝置。同時，本發明亦與基板分斷方法相關。 The present invention relates to a substrate cutting device, and more particularly to a first substrate having a first scribe line formed on a surface for cutting off an end portion, and a first substrate affixed to a back surface of the first substrate. A cutting device for bonding a substrate to a second substrate at a position near the edge of the first scribe line. At the same time, the present invention is also related to a substrate cutting method.

液晶裝置係由第1基板及第2基板夾著液晶層，並由密封材料貼合之貼合基板所構成。對於如上述之貼合基板，上述基板之其中一塊(例如：第1基板)上形成濾色片(color filter)，另一塊基板(例如：第2基板)上形成TFT(Thin Film Transistor)及連接端子。 The liquid crystal device is composed of a first substrate and a second substrate with a liquid crystal layer sandwiched therebetween, and a bonding substrate bonded with a sealing material. For the bonded substrate as described above, a color filter is formed on one of the substrates (eg, the first substrate), and a thin film transistor (TFT) and a connection are formed on the other substrate (eg, the second substrate). Terminal.

於上述之貼合基板中，為了與外部之電子機器連接，須使形成於第2基板之連接端子露出。於實際上是液晶裝置之貼合基板中，使形成連接端子之面露出(使貼合基板之其中一塊基板之內側面露出)之基板的分離方法，於專利文獻1所揭示。 In the above-mentioned bonded substrate, in order to connect to an external electronic device, the connection terminals formed on the second substrate must be exposed. In a bonded substrate which is actually a liquid crystal device, a method for separating a substrate in which a surface on which a connection terminal is formed is exposed (the inner side surface of one of the bonded substrates is exposed) is disclosed in Patent Document 1.

於專利文獻1中，首先，在刻劃線形成時，將在第1基板形成刻劃線之滾刀(cutter)之配置位置，與在第2基板形成刻劃線之滾刀之配置位置錯開，形成刻劃線。然後，於將成為被切除側之貼合基板(端材)與成為裝置側之貼合基板分離，使連接端子露出時，在將端材由夾頭(chuck)構 件保持之狀態下使夾頭構件遠離成為裝置側之貼合基板。 In Patent Document 1, first, when the scribe line is formed, the arrangement position of the cutter where the scribe line is formed on the first substrate is staggered from the arrangement position of the cutter where the scribe line is formed on the second substrate. To form an engraved line. Then, when the bonded substrate (end material) serving as the cut-off side is separated from the bonded substrate serving as the device side to expose the connection terminal, the chuck is held while the end material is held by a chuck member. The component is away from the bonding substrate which becomes the device side.

專利文獻1：日本特開2012-250871號公報。 Patent Document 1: Japanese Patent Application Publication No. 2012-250871.

如上述，藉由以夾頭構件保持端材並移動之方法將端材去除的情形下，於原貼合基板之端材所在之側之端部會有產生剝離之現象。此種剝離現象，主要由夾頭構件與維持貼合基板之工作臺之距離變化使得端材與貼合基板之端部接觸而產生。上述剝離之發生，會使貼合基板之端部及露出面之狀態惡化。 As described above, when the end material is removed by holding and moving the end material by the chuck member, peeling may occur at the end portion of the side where the end material of the original bonded substrate is located. This peeling phenomenon is mainly caused by the change in the distance between the chuck member and the table that maintains the bonded substrate, so that the end material contacts the end of the bonded substrate. The occurrence of the above-mentioned peeling deteriorates the state of the end portion and the exposed surface of the bonded substrate.

本發明之目的係於刻劃線形成後將端材去除，使貼合基板之任一基板之內側面露出之情形下，抑制從貼合基板去除端材時產生剝離之現象。 The object of the present invention is to suppress the occurrence of peeling when removing the end material from the bonded substrate in the case where the end material is removed after the scribe line is formed to expose the inner side surface of any one of the bonded substrates.

關於本發明之一部分之基板分斷裝置，係具有在表面形成有為了切離端部之第1刻劃線之第1基板、與貼合於第1基板背面，第2刻劃線形成於較第1刻劃線近邊緣之位置之第2基板之貼合基板的分斷裝置。 A substrate cutting device according to one aspect of the present invention includes a first substrate having a first scribe line formed on the surface for cutting off an end portion, and a first substrate affixed to a back surface of the first substrate. A cutting device for bonding a substrate to a second substrate at a position near the edge of the first scribe line.

分斷裝置，具備工作臺、及按壓裝置。 The breaking device includes a table and a pressing device.

工作臺，支撐貼合基板。 The worktable supports the substrate.

按壓裝置，藉由從第1基板側按壓端部，使端部沿著第1刻劃線及第2刻劃線分斷。 The pressing device presses the end portion from the first substrate side, and the end portion is divided along the first score line and the second score line.

本裝置，於第1刻劃線及第2刻劃線分別貫通第1基板及第2基板之厚度方向後，按壓裝置仍繼續按壓端部。若端部於刻劃線貫通基板後繼續被按壓，端部，將會向離開貼合基板之方向移動被分斷。 In this device, after the first scribe line and the second scribe line penetrate the thickness direction of the first substrate and the second substrate, respectively, the pressing device continues to press the end portion. If the end portion is continuously pressed after penetrating through the substrate through the scribe line, the end portion will be moved away from the bonded substrate and cut off.

藉由此種分斷方式，當刻劃線貫通基板使端部可相對貼合基 板移動時，端部將不會往接近貼合基板之方向移動。如此，可抑制端部與貼合基板接觸而產生剝離之現象。 With this breaking method, when the scribe line penetrates the substrate so that the end portion can be moved relative to the bonded substrate, the end portion will not move in a direction approaching the bonded substrate. In this way, it is possible to suppress the phenomenon that the end portion comes into contact with the bonded substrate and peeling occurs.

第2刻劃線，可配置於較工作臺之邊緣內側之位置。於此，藉由將形成於面向工作臺之第2基板的第2刻劃線配置於較工作臺之邊緣內側之位置，當端部從貼合基板分斷時，可減少端部與工作臺之相互干涉。 The second scribe line can be placed on the inner side of the edge of the table. Here, by arranging the second scribe line formed on the second substrate facing the table at a position inside the edge of the table, when the end portion is cut off from the bonding substrate, the end portion and the table can be reduced Interfere with each other.

關於本發明之另一部分之基板分斷方法，係具有在表面形成有為了切離端部之第1刻劃線之第1基板、與貼合於第1基板背面，第2刻劃線形成於較第1刻劃線近邊緣之位置之第2基板之貼合基板的分斷裝置。而且，具有以下步驟。 A substrate cutting method according to another aspect of the present invention includes a first substrate having a first scribe line formed on the surface for cutting off an end portion, and a first substrate affixed to a back surface of the first substrate. A second scribe line is formed on A cutting device for bonding a substrate to a second substrate at a position closer to the edge than the first scribe line. In addition, it has the following steps.

a：載置貼合基板於工作臺之載置步驟。 a: The step of placing the bonded substrate on the worktable.

b：藉由從第1基板側按壓端部，使端部沿著第1刻劃線及第2刻劃線分斷之分斷步驟。 b: A step of breaking the end portion along the first scribe line and the second scribe line by pressing the end portion from the first substrate side.

於載置步驟，第2刻劃線可配置於較工作臺之邊緣內側之位置。 In the placing step, the second scribe line can be arranged at a position which is more inside than the edge of the table.

本發明，可抑制從貼合基板去除端材時產生剝離之現象。 The present invention can suppress the occurrence of peeling when removing the end material from the bonded substrate.

1‧‧‧按壓裝置 1‧‧‧Pressing device

2‧‧‧工作臺 2‧‧‧Workbench

11‧‧‧按壓部 11‧‧‧Pressing section

11a‧‧‧按壓面 11a‧‧‧Pressing surface

G‧‧‧貼合基板 G‧‧‧ Laminated substrate

G1‧‧‧第1基板 G1‧‧‧The first substrate

G2‧‧‧第2基板 G2‧‧‧The second substrate

GL‧‧‧端材 GL‧‧‧End material

M1、M2‧‧‧驅動構件 M1, M2‧‧‧ drive components

S1‧‧‧第1刻劃線 S1‧‧‧The first score line

S2‧‧‧第2刻劃線 S2‧‧‧ 2nd scribe

圖1係本發明之一實施形態之基板分斷裝置之示意圖。 FIG. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention.

圖2係說明基板分斷方法之分斷步驟之示意圖(其1)。 FIG. 2 is a schematic diagram (No. 1) illustrating a breaking step of a substrate breaking method.

圖3係說明基板分斷方法之分斷步驟之示意圖(其2)。 FIG. 3 is a schematic diagram (No. 2) illustrating a breaking step of a substrate breaking method.

圖4係於分斷步驟時，顯示端材被分離之情形之示意圖。 FIG. 4 is a schematic diagram showing a situation where the end material is separated during the breaking step.

圖1係本發明之一實施形態之基板分斷裝置之示意圖。此裝置係為了去除位於貼合基板G之一側之端材GL的裝置。貼合基板G，如圖1所示，由第1基板G1、與貼合於第1基板G1之背面之第2基板G2所構成。於此，在第1基板G1之表面形成第1刻劃線S1；在第2基板G2被工作臺2(後述)所載置之側之表面形成第2刻劃線S2。第1刻劃線S1及第2刻劃線S2係於厚度方向具長度之裂紋，端材GL將沿著第1刻劃線S1及第2刻劃線S2被切離。 FIG. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention. This device is a device for removing the end material GL on one side of the bonded substrate G. As shown in FIG. 1, the bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the back surface of the first substrate G1. Here, a first scribe line S1 is formed on the surface of the first substrate G1; and a second scribe line S2 is formed on the surface of the second substrate G2 on the side on which the table 2 (described later) is placed. The first scribe line S1 and the second scribe line S2 are cracks having a length in the thickness direction, and the end material GL is cut along the first scribe line S1 and the second scribe line S2.

第2刻劃線S2於第2基板G2之厚度方向之長度以，例如，具第2基板G2之厚度之75%以上為佳，75%~80%左右尤佳。以此，於按壓裝置1(後述)將第1基板G1往圖1之下方按壓時，將利於第2刻劃線S2貫穿第2基板G2之厚度之進展。 The length of the second scribe line S2 in the thickness direction of the second substrate G2 is, for example, preferably more than 75% of the thickness of the second substrate G2, and more preferably about 75% to 80%. With this, when the pressing device 1 (to be described later) presses the first substrate G1 below FIG. 1, the progress of the thickness of the second scribe line S2 passing through the second substrate G2 is facilitated.

又，第1刻劃線S1及第2刻劃線S2，因不會形成至分別貫穿第1基板G1及第2基板G2之程度，可避免如搬運刻劃線S1、S2形成後之貼合基板G至工作臺2時，端材GL從貼合基板G分離的情形。 In addition, since the first scribe line S1 and the second scribe line S2 are not formed to the extent that they penetrate the first substrate G1 and the second substrate G2, respectively, it is possible to avoid the bonding after the formation of the scribe lines S1 and S2. When the substrate G reaches the stage 2, the end material GL is separated from the bonded substrate G.

分斷裝置，包含按壓裝置1、及工作臺2。按壓裝置1，由未繪出於圖式中之支架(gantry)構件等以圖1之紙面垂直方向支撐。按壓裝置1，藉由驅動構件M1得自由升降，並具有按壓部11。工作臺2，以第1基板G1於上方之方式配置，載置貼合基板G。 The breaking device includes a pressing device 1 and a table 2. The pressing device 1 is supported by a gantry member and the like not shown in the drawing in a vertical direction on the paper surface of FIG. 1. The pressing device 1 is freely raised and lowered by the driving member M1 and includes a pressing portion 11. The table 2 is arranged such that the first substrate G1 is above, and the bonded substrate G is placed thereon.

而且，當配置貼合基板G於工作臺2時，將按壓部11配置於遠離貼合基板G之端部之位置(但，按壓部11可按壓到第1基板G1之位置)為佳。以此，於端材GL被分離且自由落下時，可使按壓部11不易與端材GL互相干涉。 When the bonded substrate G is arranged on the table 2, the pressing portion 11 is preferably located at a position far from the end portion of the bonded substrate G (however, the pressing portion 11 can be pressed to the position of the first substrate G1). With this, when the end material GL is separated and dropped freely, the pressing portion 11 can be made less likely to interfere with the end material GL.

貼合基板G，以配置於第2刻劃線S2位於較工作臺2之端部內側(例如，距工作臺2之端部500μm左右之內側)之位置為佳。以此，於端材GL從貼合基板G分離且自由落下時，可使端材GL不易與貼合基板G互相干涉。 The substrate G is bonded so as to be disposed on the second scribe line S2 on the inner side of the end of the table 2 (for example, about 500 μm from the end of the table 2). In this way, when the end material GL is separated from the bonded substrate G and dropped freely, the end material GL and the bonded substrate G are less likely to interfere with each other.

工作臺2，藉由包含驅動馬達或導引構件等之驅動構件M2，得於圖1之左右方向移動。 The table 2 is moved in the left-right direction in FIG. 1 by a driving member M2 including a driving motor, a guide member, and the like.

按壓裝置1之按壓部11，對於貼合基板G，由按壓面11a從第1基板G1側按壓端材GL。如此，端材GL將沿著第1刻劃線S1及第2刻劃線S2分斷。按壓部11係由較第1基板G1之剛性低之樹脂等形成。因此，按壓部11於按壓端材GL時，可彈性變形。 The pressing portion 11 of the pressing device 1 presses the end material GL on the bonded substrate G from the first substrate G1 side by the pressing surface 11 a. In this way, the end material GL is divided along the first score line S1 and the second score line S2. The pressing portion 11 is formed of a resin or the like having lower rigidity than the first substrate G1. Therefore, the pressing portion 11 can be elastically deformed when the end material GL is pressed.

接著，說明從貼合基板G分斷並去除端材GL之方法。 Next, a method of cutting and removing the end material GL from the bonded substrate G will be described.

首先，準備貼合著第1基板G1及第2基板G2之貼合基板G，利用未繪出於圖示中之刻劃線形成裝置，於第1基板G1之表面(非與第2基板貼合側之表面)，形成第1刻劃線S1；於第2基板G2之由工作臺2載置之表面形成第2刻劃線S2。 First, a bonded substrate G on which the first substrate G1 and the second substrate G2 are bonded is prepared, and an scribe line forming apparatus (not shown in the figure) is used to bond the surface of the first substrate G1 (not bonded to the second substrate) The first scribe line S1 is formed on the surface on the combined side); the second scribe line S2 is formed on the surface of the second substrate G2 placed on the table 2.

接著，載置貼合基板G於工作臺2之載置面。於此，將貼合基板G載置於工作臺2上時，如以下方式載置。即，如圖1所示，以表面形成有第1刻劃線S1之第1基板G1在上方、第2基板G2之第2刻劃線S2形成之側之表面被載置於工作臺2、且第2刻劃線S2位於較工作臺2之端部內側之位置，之方式將貼合基板G配置於工作臺2。又，將分離端材GL時被按壓之部分，配置於按壓部11之正下方之位置。 Next, the bonding substrate G is placed on the placement surface of the table 2. Here, when the bonded substrate G is placed on the table 2, it is placed as follows. That is, as shown in FIG. 1, the surface of the first substrate G1 on which the first scribe line S1 is formed on the surface and the side on which the second scribe line S2 of the second substrate G2 is formed is placed on the table 2. In addition, the second scribe line S2 is located at a position inside the end portion of the worktable 2, and the bonding substrate G is arranged on the worktable 2. In addition, a portion that is pressed when the end material GL is separated is disposed at a position directly below the pressing portion 11.

然後，如圖2所示，使按壓部11下降，按壓面11a和端材 GL之部分接觸；如圖3所示，使按壓部11再下降，由按壓面11a從第1基板G1側向下按壓端材GL之部分。此時，端材GL之下方因不存在工作臺2之載置面，藉由按壓部11按壓端材GL之部分，於第1基板G1及第2基板G2上之第1刻劃線S1及第2刻劃線S2之裂紋，將分別往基板厚度方向延伸，使端材GL完全切斷。 Then, as shown in FIG. 2, the pressing portion 11 is lowered, and the pressing surface 11 a is in contact with a part of the end material GL. As shown in FIG. 3, the pressing portion 11 is lowered again, and the pressing surface 11 a is downward from the first substrate G1 side. Press the part of the end material GL. At this time, since there is no mounting surface of the table 2 under the end material GL, the portion of the end material GL is pressed by the pressing portion 11, and the first scribe lines S1 and The cracks on the second score line S2 will extend in the thickness direction of the substrate, respectively, so that the end material GL is completely cut.

之後，如圖4所示，若使按壓部11再下降，端材GL會以第2基板G2之第2刻劃線S2形成之位置為中心旋轉，自貼合基板G完全分離。從貼合基板G完全分離之端材GL，從按壓部11與工作臺2之間的空隙自由落下。 Thereafter, as shown in FIG. 4, if the pressing portion 11 is lowered again, the end material GL is rotated around the position formed by the second scribe line S2 of the second substrate G2 and completely separated from the bonded substrate G. The end material GL completely separated from the bonding substrate G falls freely from the gap between the pressing portion 11 and the table 2.

如此，第1刻劃線S1及第2刻劃線S2貫穿第1基板G1及第2基板G2後，藉由持續按壓端材GL使其從貼合基板G移動，可避免端材GL向接近貼合基板G之本體之方向移動。於是，可以抑制端材GL與貼合基板G接觸產生剝離之現象。以此，可避免如剝離之碎片落至第2基板之露出面，使該露出面之品質下降之情形。 In this way, after the first scribe line S1 and the second scribe line S2 pass through the first substrate G1 and the second substrate G2, the end material GL can be prevented from approaching the substrate G by continuously pressing the end material GL to move it. The direction of the body of the bonded substrate G is moved. Accordingly, it is possible to suppress the phenomenon that the end material GL comes into contact with the bonded substrate G and peels off. With this, it is possible to avoid the situation where the peeled fragments fall on the exposed surface of the second substrate and the quality of the exposed surface is reduced.

本發明並不限於如以上之實施形態，在不超越本發明之範圍之情形下，能做各種的變形或修正。 The present invention is not limited to the embodiments described above, and various modifications or corrections can be made without going beyond the scope of the present invention.

於上述之實施形態中，按壓部11雖為矩形之構件，但並不受限於此，例如，按壓部11之按壓面11a側之面積可縮小；例如，可使按壓部11往按壓面11a之方向削尖。 In the above embodiment, although the pressing portion 11 is a rectangular member, it is not limited to this. For example, the area of the pressing surface 11a side of the pressing portion 11 can be reduced; for example, the pressing portion 11 can be moved toward the pressing surface 11a. The direction is sharpened.

Claims (4)

一種基板分斷裝置，係具有在表面形成有為了切離端部之第1刻劃線之第1基板、與貼合於第1基板背面，第2刻劃線形成於較第1刻劃線近邊緣之位置之第2基板之貼合基板的分斷裝置，其具備：工作臺，支撐上述貼合基板；及按壓裝置，藉由從上述第1基板側按壓上述端部，使上述端部沿著上述第1刻劃線及上述第2刻劃線分斷。     A substrate cutting device includes a first substrate having a first scribe line formed on the surface for cutting off an end portion, and a first substrate affixed to a back surface of the first substrate. A second scribe line is formed on the first scribe line. A cutting device for a bonded substrate of a second substrate at a position near the edge includes: a table supporting the bonded substrate; and a pressing device for pressing the end portion from the first substrate side to make the end portion It is divided along the first scribe line and the second scribe line.     如申請專利範圍第1項之基板分斷裝置，其中，上述第2刻劃線係配置於較上述工作臺之邊緣內側之位置。     For example, the substrate cutting device of the first scope of the patent application, wherein the second scribe line is disposed at a position more than the inner side of the edge of the table.     一種基板分斷方法，係具有在表面形成有為了切離端部之第1刻劃線之第1基板、與貼合於第1基板背面，第2刻劃線形成於較第1刻劃線近邊緣之位置之第2基板之貼合基板的分斷方法，其具備：載置步驟，載置上述貼合基板於工作臺；及分斷步驟，藉由從上述第1基板側按壓上述端部，使上述端部沿著上述第1刻劃線及上述第2刻劃線分斷。     A substrate cutting method includes a first substrate having a first scribe line formed on a surface for cutting off an end portion, and a first substrate affixed to a back surface of the first substrate. A second scribe line is formed on the first scribe line. A method for cutting a bonded substrate of a second substrate at a position near the edge includes: a mounting step of placing the bonded substrate on a table; and a cutting step of pressing the end from the first substrate side. The end portion is divided along the first scribe line and the second scribe line.     如申請專利範圍第3項之基板分斷方法，其中，於上述載置步驟，上述第2刻劃線係配置於較上述工作臺之邊緣內側之位置。     For example, the method for cutting a substrate according to item 3 of the scope of patent application, wherein, in the above-mentioned mounting step, the second scribe line is disposed at a position more than the inner side of the edge of the table.    
TW106120823A 2016-07-26 2017-06-22 Substrate breaking device and substrate breaking method capable of suppressing the occurrence of chippings when an end material is removed from a laminate substrate by forming scribe lines before the end material is removed TW201811692A (en)

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