TW201540526A - Patterned roll and manufacturing method therefor - Google Patents

Abstract

Provided are: a roll with a pattern, which has excellent releasability of a photosensitive material during a photosensitive material releasing process during the production of this roll with a pattern and excellent releasability of a material that is transferred using this roll with a pattern, while solving the problem of side etching; and a method for producing this roll with a pattern. A photosensitive material is applied to the surface of a base, said surface being configured of a conductive DLC layer, and a resist pattern is formed by exposing and developing the photosensitive material. A DLC coating film is formed on the surfaces of the conductive DLC layer and the resist pattern, and the DLC coating film formed on the resist pattern is removed together with the resist pattern, thereby forming a DLC pattern on the surface of the conductive DLC layer.

Description

Drawing roller and manufacturing method thereof

The present invention relates to a patterned roll that is patterned by DLC (Drilling Carbon) and a method of manufacturing the same.

The attached pattern roll has a roll for gravure printing. In the gravure printing, a small concave portion (gravure mesh) corresponding to the plate making information is formed on the gravure plate making roller (gravure cylinder) to form a layout, and the intaglio mesh is filled with ink to be transferred to the object to be printed. In a general gravure plate roll, a copper plating layer (plate) for forming a plate is provided on a surface of a base material such as aluminum or iron, and a plating layer is formed on the copper plating layer by etching. A plurality of minute recesses (gravure mesh holes) are then formed into a surface-strengthened coating layer by forming a hard chromium layer by chrome plating for increasing the brush resistance of the gravure plate-making roll, thereby completing the plate making (laying of the layout). The applicant of the present invention proposed a gravure plate-making roll described in, for example, Patent Document 1.

Further, the patterned roll has an embossing roll for forming. It is carried out by performing embossing on a thermoplastic resin film, and producing a ruthenium sheet or a double embossing used for a backlight or a rear projection screen for LCD. Electronic parts such as sheets, Fresnel sheets, anti-reflective films, etc., or embossing on a metal plate to improve design or have an anti-slip function. The applicant of the present invention proposed an embossing roll as described in, for example, Patent Document 2.

Further, as the patterning roll, there is a roll for continuous plating. The continuous plating roll is used in a continuous plating apparatus, and is continuously electroplated by, for example, continuously winding a strip-shaped workpiece such as a steel plate wound on a reel while passing through a plating bath. . An example of the roll for continuous plating is a roll such as a sink roll disclosed in Patent Document 3 or Patent Document 4.

In the case of producing the above-mentioned general patterning roll, if the photosensitive material is coated on a substrate and exposed, developed, patterned, and etched, excessive etching called so-called side etching occurs. problem. However, as the patterning becomes finer, the problem of side etching becomes more pronounced.

Further, there is also a technique in which, as in the technique disclosed in Patent Document 5, a DLC film formed on a surface of a convex pattern formed by a photoresist is peeled off together with the convex pattern-like photoresist. Gravure.

However, in the intaglio plate disclosed in Patent Document 5, since it is difficult to peel off the photoresist perfectly, as clearly shown in the second drawing of Patent Document 5, there is a case where the angle of the side surface of the concave portion is about 45 degrees. The problem of tilting left and right. Therefore, when the wiring of the electronic circuit is printed by using the intaglio plate, the cross section of the circuit wiring after printing is made trapezoidal, and there is a problem that a portion having a different resistance is generated in the circuit wiring.

Further, although the applicant of the present invention has proposed a pattern roll shown in Patent Document 6, in the case of performing the continuous plating in the pattern roll, in order to peel the plating material from the pattern roll, A stripping solution is required.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] International Publication WO2008/120789

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-72828

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2006-283044

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2001-89836

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2008-254331

[Patent Document 6] Japanese Laid-Open Patent Publication No. 2012-154964

[Patent Document 7] International Publication WO2011/125926

The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a problem that can solve the problem of side etching, and the peeling property of the photosensitive material in the photosensitive material peeling process at the time of manufacture of the pattern roll, and the use thereof The peeling property of the transfer material after the transfer of the drawing roller is also an excellent patterning roll and a method for producing the same.

In order to solve the above problems, the pattern roll according to the present invention is characterized in that a photosensitive material is applied to the surface of a substrate on which a conductive DLC layer is formed, and exposed and developed to form a photoresist pattern. A DLC coating film is formed on the surface of the conductive DLC layer and the photoresist pattern, and the DLC coating film formed on the photoresist pattern is peeled off together with the photoresist pattern to form a DLC pattern on the surface of the conductive DLC layer. Made.

In this way, since the DLC coating formed on the substrate on which the surface is formed into the conductive DLC layer is peeled off by so-called lift off, the side surface of the concave portion of the pattern is made nearly vertical, and Solve the advantages of the problem of side erosion.

Moreover, since the peeling property of the photosensitive material (photoresist) in the photosensitive material peeling process at the time of manufacture of a pattern roll is excellent, the DLC coating film formed on this photoresist pattern is together with this photoresist pattern. The peeling property at the time of peeling is excellent, and there is also an advantage that the concave portion (or convex portion) of the pattern can be formed well.

Further, since the DLC coating film formed on the photoresist pattern is peeled off together with the photoresist pattern, the conductive DLC layer on the surface is exposed, and the portion and non-conductive property of the conductive DLC are formed. Part of the DLC. By using the surface of the base material as the conductive DLC, for example, plating or the like can be performed, and the portion of the conductive DLC is easily peeled off due to poor adhesion. Therefore, the patterning roll which is excellent in the peeling property of the transfer material at the time of transcription|transfer is acquired.

The thickness of the DLC coating film is preferably 0.1 μm to 20 μm, more preferably 0.1 μm to 10 μm, still more preferably 0.1 μm. 5 μm.

The conductive DLC layer is preferably one having a volume resistivity of 1.0 × 10 ^-3 Ω ‧ cm to 1.0 × 10 ⁰ Ω ‧ cm.

The thickness of the conductive DLC layer is not particularly limited, but the thickness of the conductive DLC layer is preferably from 0.1 μm to 20 μm, more preferably from 0.1 μm to 10 μm, more preferably from the viewpoint of production efficiency. 0.1μm~5μm.

In the formation of the conductive DLC layer and the formation of the DLC coating film, any of various well-known methods such as plating, vapor deposition, CVD, PVD (Physical Vapor Deposition), and sputtering can be applied.

The substrate whose surface is made of a conductive DLC layer is preferably at least one selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. The constituents. Further, since it is at least one kind of material, it may of course be an alloy.

It is preferable that the base material is provided with a cushion layer made of rubber or a cushioning resin. In other words, the substrate may be a substrate having a buffer layer formed by forming a metal substrate on a buffer layer made of rubber or a cushioning resin. As the buffer layer, a synthetic rubber such as ruthenium rubber, or a synthetic resin having elasticity such as polyurethane or polystyrene can be used. The thickness of the buffer layer is not particularly limited as long as it can impart cushioning properties, that is, a thickness that can provide elasticity, and is sufficient as long as it is, for example, about 1 cm to 5 cm. As a base having a buffer layer composed of rubber or a cushioning resin Examples of the material are, for example, Patent Document 6 and the like.

The aforementioned patterning roller is preferably a roller for continuous plating.

The article of the present invention is characterized in that electroplating is carried out by the aforementioned patterning roller.

The aforementioned patterning roller is preferably an electroforming mold roller.

The article of the present invention is characterized in that electroforming is carried out by the aforementioned pattern roll.

The above-mentioned pattern roll is preferably a roll for gravure printing. Since there is no problem of side etching, the concentration range can be expanded compared with the conventional one.

The article of the present invention is characterized in that printing is carried out by the aforementioned pattern roll.

The above-mentioned patterning roll is preferably a forming embossing roll.

The article of the present invention is characterized in that it is formed by the aforementioned pattern roll.

A method for producing a patterned roll according to the present invention includes: preparing a substrate having a surface on which a conductive DLC layer is formed, coating a photosensitive material on a surface of the substrate, and exposing and developing the photosensitive material; a process of forming a photoresist pattern, a process of forming a DLC coating film on the surface of the conductive DLC layer and the photoresist pattern, and peeling off the DLC coating film formed on the photoresist pattern together with the photoresist pattern Engineering.

The thickness of the aforementioned DLC coating is preferably 0.1 μm. ~20 μm, more preferably 0.1 μm to 10 μm, still more preferably 0.1 μm to 5 μm.

The conductive DLC layer is preferably one having a volume resistivity of 1.0 × 10 ^-3 Ω ‧ cm to 1.0 × 10 ⁰ Ω ‧ cm.

The substrate coated with the photosensitive material is preferably one composed of at least one selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. . Further, since it is at least one kind of material, it may of course be an alloy.

It is preferable that the base material is provided with a cushion layer made of rubber or a cushioning resin.

In the method for producing a patterned roll of the present invention, it is preferable to manufacture a patterning roll by using a pattern roll automatic manufacturing system, and the pattern roll automatic manufacturing system is configured to: provide a plurality of processes for processing the processed roll The device is processed, and the processed roller is sequentially transferred to the processing device by a robot arm for processing.

Preferably, the pattern roll automatic manufacturing system has a processing chamber A and a processing chamber B, and the processing chamber A and the processing chamber B are connected to each other. The processing chamber A has a processing roller for clamping. a processing area of the first industrial robot to be processed; the processing chamber B having a processing area for the second industrial robot that is processed by the processing roller, and the processing area of the first industrial robot in the processing chamber A or the At least one vacuum film forming apparatus is disposed in the processing area of the second industrial robot in the processing chamber B, and the roller storage device, the photosensitive material coating device, and the electronic device are disposed in the processing region of the first industrial robot in the processing chamber A. At least one of the engraving device, the laser exposure latent image forming device, the degreasing device, the vermiculite polishing device, the ultrasonic cleaning device, the copper plating device, the developing device, and the processing device selected by the paper polishing device, in the processing chamber B At least one of the processing devices that are not disposed in the processing chamber A among the processing devices of the second industrial robot, and the processing device of the processing chamber A and the processing chamber B are provided In the removal, the first industrial robot and the second industrial robot are sequentially transferred to the processing device to perform processing.

Further, it is preferable that the patterning roller is manufactured, and the forming process of the conductive DLC layer and the formation of the DLC coating film are performed by the vacuum film forming apparatus, and the patterning roller is formed on the surface. The surface of the substrate of the conductive DLC layer is coated with a photosensitive material, exposed and developed to form a photoresist pattern, and a DLC coating film is formed on the surface of the conductive DLC layer and the photoresist pattern to be formed thereon. The DLC coating film on the photoresist pattern is peeled off together with the photoresist pattern, and a DLC pattern is formed on the surface of the conductive DLC layer.

It is preferable that the vacuum film forming apparatus is disposed in two or more, and the forming process of the conductive DLC layer and the forming process of the DLC coating film can be simultaneously performed in each of the vacuum film forming apparatuses.

According to the present invention, it is possible to provide a pattern roller which is excellent in the peeling property of the photosensitive material and the peeling property of the transfer material, and a remarkable effect of the method for producing the same, which can solve the problem of the side etching.

10‧‧‧Scheduled roll of the invention

12‧‧‧Substrate

14‧‧‧ Conductive DLC layer

16‧‧‧Photographic material

18‧‧‧resist pattern

20‧‧‧DLC film

22‧‧‧DLC pattern

30‧‧‧With pattern roll automatic manufacturing system

32, 33, 76‧‧‧ wall

34‧‧‧ gate

36‧‧‧First Industry Robot

38, 52‧‧‧ robotic arm

40‧‧‧Processed roller

41‧‧‧paper grinding device

42a, 42b‧‧‧ Roll storage device

44‧‧‧Photosensitive material coating device

46‧‧‧Laser exposure device

48‧‧‧ computer

50‧‧‧Second Industry Robot

54‧‧‧砥石研磨装置

58‧‧‧Degreasing device

60‧‧‧copper plating equipment

62‧‧‧Developing device

68a, 68b‧‧‧Vacuum film forming device

70‧‧‧Roller relay mounting table

78, 80‧‧‧

90‧‧‧ Ultrasonic cleaning device with dry function

92, 94‧‧‧ clamping means

A, B, C‧‧ ‧ processing room

[Fig. 1] is an explanatory view showing an example of a pattern roll of the present invention, and (a) is a cross-sectional view of an important portion in a state in which a conductive DLC layer is formed on a surface of a substrate, (b) It is a cross-sectional view of an important part in a state in which a photosensitive material is applied to the surface of the conductive DLC layer, and (c) is a cross-sectional view of an important part in a state in which a photoresist pattern is formed by exposure and development, and (d) A cross-sectional view of an important portion in a state in which a DLC coating film is formed on a surface of a conductive DLC layer and a photoresist pattern, and (e) a DLC coating film formed on the photoresist pattern together with the photoresist pattern The state of the peeling together is a cross-sectional view of the important part of the display.

[Fig. 2] is a flow chart showing the engineering sequence of the method for manufacturing the pattern roll shown in Fig. 1.

[Fig. 3] is a schematic plan view showing one embodiment of a fully automatic manufacturing system for a patterned roll used in the method for producing a patterned roll of the present invention.

In the following, the embodiments of the present invention are described, and the embodiments are shown by way of example, and various modifications can be made without departing from the spirit of the invention. In addition, the same components are denoted by the same symbols.

In Fig. 1, reference numeral 10 denotes a patterning roller. symbol 12 denotes a substrate, and a material composed of at least one selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al can be used. For the base material 12, a cylindrical shape can be used. Further, a buffer layer made of rubber or a cushioning resin may be provided on the lower surface of the substrate 12. The buffer layer is a sheet having a smoothness of a surface having a uniform thickness of about 1 mm to 10 cm, which is made of rubber or a cushioning resin, so as to avoid a gap between the joints and the substrate. 12 Strongly followed by precision cylindrical grinding and mirror polishing.

First, a conductive DLC layer 14 is formed on the surface of the substrate 12 (steps (a) and (step 100 of FIG. 2)). The conductive DLC layer 14 may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

Next, the photosensitive material 16 is applied onto the surface of the conductive DLC layer 14 (steps (b) of FIG. 1 and step 102 of FIG. 2). The photoresist pattern 18 is formed by exposure and development (steps (c) of FIG. 1 and step 104 of FIG. 2). The photosensitive composition used as a photosensitive material can be used for either a negative type or a positive type. As a result, the portion of the photoresist pattern 18 is not formed, and the conductive DLC layer 14 is exposed.

Next, the DLC coating film 20 is formed on the surface of the exposed conductive DLC layer 14 and the photoresist pattern 18 (steps (d) and (106) of FIG. 1). The DLC coating film 20 may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

Next, the DLC formed on the photoresist pattern 18 is made The coating film 20 is peeled off together with the photoresist pattern 18, and the DLC pattern 22 is formed on the conductive DLC layer 14 (steps (e) of FIG. 1 and step 108 of FIG. 2).

Further, in the method for producing a pattern roll according to the present invention, it is preferable to manufacture a pattern roll by using a pattern roll automatic manufacturing system, and the pattern roll automatic manufacturing system is configured to: set a plurality of The processing device that processes the processed roller and the processed roller are sequentially transferred to the processing device by the robot arm for processing.

One of the embodiments of the fully automatic manufacturing system for such a pattern roll used in the method for producing a patterned roll of the present invention is shown in Fig. 3.

In Fig. 3, reference numeral 30 denotes a pattern-roller automatic manufacturing system.

The fully automatic manufacturing system 30 is roughly divided into a processing chamber A and a processing chamber B. Further, the processing chamber A further distinguishes the processing chamber C. The processing chamber A and the processing chamber B, the processing chamber A, and the processing chamber C are separated by walls 32 and 33, and communicate with each other via an open gate 34.

The structure of the processing chamber A will be described. In the processing chamber A, reference numeral 36 is a first industrial robot having a multi-axis robot arm 38 that is rotatable.

Reference numeral 40 is a processed roller, and the processed roller 40 is the substrate 12 described above. Reference numerals 42a and 42b are respectively roller storage devices. For this roller storage device, for example, it is disclosed in Patent Document 7. The roller storage device shown.

At the front end of the robot arm 38, a holding means 92 is provided, and the processing roller 20 can be detachably held by the holding means 92.

Next, the structure of the processing chamber B will be described. In the processing chamber B, reference numeral 50 is a second industrial robot having a multi-axis robot arm 52 that is rotatable.

At the front end of the robot arm 52, a holding means 94 is provided, and the processing roller 40 can be detachably held by the holding means 94.

Reference numeral 44 is a photosensitive material coating device, and reference numeral 46 is a laser exposure device. In the illustrated example, a photosensitive material coating device 44 is disposed above the laser exposure device 46. As such a device, a conventionally known device can be applied. For example, a photosensitive material coating device and a laser exposure device as disclosed in Patent Document 7 can be used.

Reference numeral 70 denotes a roller relaying stage for placing the to-be-processed roller 40 for relaying, which is provided so that the processing area of the first industrial robot 36 and the processing area of the second industrial robot 50 overlap each other. position. Reference numeral 90 is a supersonic cleaning device with a drying function for performing ultrasonic cleaning and drying treatment on the processed roller 40, and the ultrasonic cleaning device 90 with a drying function is provided in close proximity to In the above roller, the table 70 is described.

The ultrasonic cleaning device 90 has a storage tank for storing the washing water and an ultrasonic vibrator provided at a lower portion of the storage tank. Further, it is a device capable of cleaning the washing water by the ultrasonic vibration of the ultrasonic vibrator. The ultrasonic cleaning device 90 with a drying function is further provided with a drying function. The ultrasonic cleaning device 90 is provided with a drying function, and each of the treatments is ultrasonically washed and dried as needed.

Further, the pattern roll automatic manufacturing system 30 is electrically controlled by the computer 48, and the first industrial robot 36 and the second industrial robot 50 are also controlled by the computer 48.

The symbol 62 is a developing device, and for example, a developing device as disclosed in Patent Document 7 can be used.

Symbol 58 is a degreasing device, and symbol 60 is a copper plating device. In the illustrated example, a degreasing device 58 is disposed above the copper plating apparatus 60. As such a device, a conventionally known device can be applied. For example, an electrolytic degreasing device and a copper plating device as disclosed in Patent Document 7 can be used.

Reference numerals 68a and 68b are vacuum film forming apparatuses which are capable of performing a formation process of a conductive DLC layer and a formation process of a DLC coating film for sputtering, CVD, plasma CVD, and vacuum evaporation. Such vacuum film forming devices are included. In the example of the drawing, as the vacuum film forming apparatuses 68a and 68b, an example of a vapor phase film forming apparatus which performs film formation using a raw material in a gas phase state is shown.

The vacuum film forming apparatuses 68a and 68b can accommodate a plurality of processed rolls 40 in an upright state, and can simultaneously process a plurality of processed rolls 40.

Further, although omitted in the example of the drawing, an ultrasonic cleaning device may be provided in the processing region of the second industrial robot 50 as needed. The ultrasonic cleaning device has a storage tank for storing washing water and an ultrasonic vibrator provided at a lower portion of the storage tank, and is capable of washing water with ultrasonic vibration of the ultrasonic vibrator. A device that is vibrated for cleaning.

Next, the structure of the processing chamber C will be described. In the processing chamber C, reference numeral 41 is a paper polishing device for performing paper polishing, and reference numeral 54 is a vermiculite polishing device. The vermiculite polishing device 54 can be applied to a conventionally known device. For example, a vermiculite polishing device as disclosed in Patent Document 7 can be used. In the illustrated example, a paper polishing device 41 is disposed above the vermiculite polishing device 54. As the paper polishing device 41, for example, a paper polishing device as disclosed in Patent Document 7 can be used.

The processing chamber A and the processing chamber C are connected via the shutter 34, and the vermiculite polishing device 54 and the paper polishing device 41 are disposed in the processing region of the first industrial robot 36.

In the illustrated example, the processing chamber A is set as a clean room. The processing chamber A and the processing chamber B can be set as clean rooms, respectively, as needed.

The walls 76 of the process chamber A are provided with doors 78, 80 for taking out the manufactured pattern roll 10 or placing a new processed roll (cylindrical base material). The attached pattern roll 10 is carried out after being placed on either of the roll storage devices 42a and 42b. On the other hand, the processed roller which is processed after this is placed on the other roller. Release device. On the outside of the processing chamber A, a computer 48 is disposed, and various information is confirmed, managed, or programmed, and the control of the fully automatic manufacturing system 30 with the pattern roll is performed.

In the example shown in the drawing, the processed roller 40 is placed on the roller storage device 42a, and an example of the attached patterned roller 10 is placed on the roller storage device 42b.

In this manner, the fully automatic manufacturing system 30 for patterning rolls used in the method for manufacturing a patterned roll of the present invention has a processing chamber A and a processing chamber B, and connects the processing chamber A and the processing chamber B described above. The processing chamber A is a processing area of the first industrial robot 36 that holds the processed roller 40 for processing; the processing chamber B has a second industrial robot 50 that holds the processed roller for processing. In the processing area, at least one vacuum film forming apparatus 68a, 68b is disposed in the processing area of the first industrial robot 36 in the processing chamber A or the processing area of the second industrial robot 50 in the processing chamber B. The processing area of the first industrial robot 36, the roller storage devices 42a and 42b, the photosensitive material coating device 44, the laser exposure latent image forming device 46, the ultrasonic cleaning device 90, the vermiculite polishing device 54, and the paper polishing device 41. The degreasing device 58 and the copper plating device of the processing device that is not disposed in the processing chamber A among the processing devices are disposed in the processing region of the second industrial robot in the processing chamber B. 60. The developing device 62, wherein the processing device of the processing chamber A and the processing chamber B can be installed and removed.

Moreover, as shown in Fig. 1 and Fig. 3, the structure is In order to process the processed roller 40 in the first industrial robot 36 and the second industrial robot 50 in order to transfer the processed roller 40 to the processing device, the patterning roller is manufactured, and the vacuum film forming device 68a is used. 68b, in which the formation process of the conductive DLC layer 14 and the formation of the DLC film 20 are applied to the surface of the substrate 12 on which the conductive DLC layer 14 is formed, so that the photosensitive material 16 is coated. The photoresist pattern 18 is formed by exposure and development, and the DLC coating film 20 is formed on the surface of the conductive DLC layer 14 and the photoresist pattern 18, and the DLC coating film formed on the photoresist pattern 18 is formed. 20 is peeled off together with the photoresist pattern 18, and a DLC pattern is formed on the surface of the conductive DLC layer.

In addition, since the vacuum film forming apparatuses are provided with the two vacuum film forming apparatuses 68a and 68b, the forming process of the conductive DLC layer 14 and the formation of the DLC film 20 can be performed in each of the vacuum film forming apparatuses 68a. Simultaneously performed in 68b.

Next, the action of the fully automatic manufacturing system 30 for the pattern roll used in the method of manufacturing the pattern roll will be described based on Fig. 3 . The first industrial robot 36 holds the processed roller 40 placed on one of the roller storage devices 42a and 42b, places it on the roller relay mounting table 70, and delivers it to the second industrial robot 50. The second industrial robot 50 is held by the processing roller 40, transported to the degreasing device 58 and the processed roller 40 is released, and is placed in the degreasing device 58.

When the degreasing operation at the degreasing device 58 is completed, the second industrial robot 50 is held by the processing roller 40, transported to the copper plating device 60, and the processed roller 40 is released, and is placed in the copper plating device 60.

When the plating operation of the copper plating apparatus 60 is completed, the second industrial robot 50 holds the processed roller 40, transports it to the roller relay mounting table 70, and places it, and delivers it to the first industrial robot 36. The first industrial robot 36 is held by the processing roller 40, transported to the vermiculite polishing device 54, and the processed roller 40 is released, and is placed in the vermiculite polishing device 54.

When the vermiculite polishing operation of the vermiculite polishing device 54 is completed, the first industrial robot 36 is placed on the roller relay mounting table 70 and placed on the roller relay mounting table 70, and delivered to the second industrial robot 50. The second industrial robot 50 is placed between the processed roller 40, transported to the vacuum film forming apparatus 68a, and the processed roller 40 is released, and is placed in the vacuum film forming apparatus 68a or 68b. Next, a process of forming a conductive DLC layer is performed in the vacuum film forming apparatus 68a or 68b.

When the forming process of the conductive DLC layer of the vacuum film forming apparatus 68a or 68b is completed, the second industrial robot 50 is placed on the processed roller 40, transported to the roller relaying stage 70, and placed, and delivered to the first. Industrial robot 36. The first industrial robot 36 is placed in the photosensitive material application device 44 by sandwiching the processed roller 40, transporting it to the photosensitive material application device 44, and releasing the processed roller 40.

When the photosensitive material application operation of the photosensitive material application device 44 is completed, the first industrial robot 36 is caused to hold the processed roller 40, transported to the laser exposure device 46, and the processed roller 40 is released, and is placed on the laser. Exposure device 46.

If the exposure operation of the laser exposure device 46 is completed, the first industrial robot 36 is caused to hold the processed roller 40 and placed on the roller relay. The stage 70 is delivered to the second industrial robot 50. The second industrial robot 50 is placed between the processing roller 40, transported to the developing device 62, and the processed roller 40 is released, and is placed in the developing device 62.

When the developing operation of the developing fat device 62 is completed, the second industrial robot 50 is held by the processing roller 40, transported to the vacuum film forming device 68a or 68b, and the processed roller 40 is released, and is placed in a vacuum film forming process. Device 68a or 68b. Next, the formation process of the DLC coating film is performed in the vacuum film forming apparatus 68a or 68b.

The processed roller 40 after the formation of the DLC coating film is transferred to the outside of the vacuum film forming apparatus 68a or 68b by the second industrial robot 50, and then the formation of the conductive DLC layer should be performed. The processed roller 40 which has been subjected to the formation treatment of the DLC coating film described above is sequentially transferred into the vacuum film forming apparatuses 68a and 68b. In this manner, the formation process of the conductive DLC layer or the formation process of the DLC coating film can be performed in turn.

When the forming process of the DLC coating film of the vacuum film forming apparatus 68a or 68b is completed, the second industrial robot 50 is placed in the processing roller 40 and transported to the roller relay mounting table 70, and placed in the first industry. Robot 36.

The first industrial robot 36 is held by the processing roller 40, transported to the ultrasonic cleaning device 90, and the processed roller 40 is released, and is placed in the ultrasonic cleaning device 90, and the DLC formed on the photoresist pattern is formed. The coating film is peeled off together with the photoresist pattern.

If the stripping process is completed, the first industrial robot 36 is caused. The processed roller 40 is nipped, conveyed to the paper polishing device 41, and the processed roller 40 is released, and is placed in the paper polishing device 41. When paper polishing (automatic polishing) is performed by the paper polishing device 41, the patterning roller 10 is placed, and is placed on the roller storage device 42b in the illustrated example. Further, paper polishing is necessary only when manufacturing a roll for gravure printing, and is not required in the case of producing a pattern roll for other purposes.

In this way, the completed pattern roll 10 is conveyed to the outside of the processing chamber A to be completed.

In the example of the third embodiment, the first industrial robot 36 and the second industrial robot 50 transport the processed roller 40 to each processing device while holding the cylindrical processed roller 40, and release it to be processed. The roller 40 is provided in the processing apparatus, and an example in which the processing roller is rotated by the driving means provided by the processing apparatus is shown.

On the other hand, as the first industrial robot and the second industrial robot, the industrial robot with the driving means may be used, and the cylindrical processed roller 40 may be sandwiched while being held. The processing roller 40 is transported to each processing device, and is placed in the processing device while the processed roller 40 is being held, and the processed roller is rotated by a driving means provided at the industrial robot.

[Examples]

The present invention is further illustrated by the following examples, but these examples are merely illustrative, and should not be construed as limiting.

(Example 1)

A plate base material (aluminum hollow roll) having a circumference of 600 mm and a face length of 1100 mm was prepared, and NewFX (automatic laser gravure plate making system manufactured by Think Laboratory Co., Ltd.) was used to manufacture the following pattern roll. First, a plate base material (aluminum hollow roll) as a treated roll was attached to a copper plating tank, and the hollow roll was completely immersed in the plating solution to form a 40 μm copper plating layer at 30 A/dm ² and 6.0 V. The plating surface is free of small particles or pits, and a uniform copper plating layer serving as a substrate can be obtained. The surface of the copper plating layer was polished using a four-head type grinder (a grinder manufactured by Think Laboratory Co., Ltd.), and the surface of the copper plating layer was made into a uniform polished surface.

Next, the processed roller on which the copper plating layer as the base material was formed was placed in a vacuum film forming apparatus, and a conductive DLC layer was formed by a CVD method under the following conditions. The CVD conditions are as follows. A conductive DLC layer having a film thickness of 2 μm was formed in the material gas by using toluene/acetylene, a film formation temperature of 200 to 300 ° C, and a film formation time of 60 minutes. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm.

A photosensitive material (thermal resist: TSER-NS (manufactured by Think Laboratory Co., Ltd.)) (jet-type blade coater) was applied to the surface of the conductive DLC layer formed as described above, and dried. The film thickness of the obtained photosensitive material was measured by a film thickness meter (F20 manufactured by FILLMETRICS Co., Ltd., sold by Panasonic Techno Trading Co., Ltd.), and the result was 7 μm. Next, the image is subjected to laser exposure for development. The above laser exposure was performed by using a Laser Stream FX and performing specific pattern exposure at an exposure condition of 300 mJ/cm ² . In addition, the above-mentioned development was carried out by using a TLD developing solution (developing liquid manufactured by Think Laboratory Co., Ltd.) at a dilution ratio of the developing solution (stock solution 1: water 7) at 24 ° C for 90 seconds to form a specific light. Resistance pattern.

A DLC coating film is formed on the surface of the conductive DLC layer and the photoresist pattern by a CVD method. An intermediate layer having a film thickness of 0.1 μm was formed in the material gas by using toluene, a film formation temperature of 80 to 120 ° C, and a film formation time of 60 minutes. Next, a DLC layer having a film thickness of 5 μm was formed in a material gas at a film forming temperature of 80 to 120 ° C and a film formation time of 180 minutes.

Next, the treated roll was subjected to ultrasonic treatment in an aqueous sodium hydroxide solution for 30 minutes. Next, the DLC coating film formed on the photoresist pattern is peeled off together with the photoresist pattern to obtain a pattern roller having a DLC pattern formed on the surface of the conductive DLC layer.

As a result of observing the surface of the patterning roller with an optical microscope, a high-definition patterning roll having a plurality of square-shaped convex portions formed on the surface was observed. The line width of the DLC pattern was 10 μm, and the square-shaped convex portion was a square having a side of 100 μm. Further, the depth of the square-shaped concave portion was 5 μm.

The obtained pattern roll was attached to a copper plating tank, and the pattern roll was completely immersed in the plating solution, and continuous plating of 20 μm of copper was performed at 20 A/dm ² and 6.0 V. The obtained copper plating can be perfectly peeled off from the pattern roll without using a peeling liquid.

(Example 2)

An electroforming mold roll was obtained in the same manner as in Example 1 except that the shape of the pattern was changed. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained electroforming mold roll by an optical microscope, a high-definition DLC pattern was observed.

(Example 3)

The DLC coating film was peeled off together with the photoresist pattern in the same manner as in Example 1 except that the pattern shape was changed, and then paper polishing was performed to obtain a gravure printing roll (gravure cylinder). The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained roll for gravure printing with an electron microscope, a high-definition DLC pattern was observed.

(Example 4)

An embossing roll for forming was obtained in the same manner as in Example 1 except that the shape of the pattern was changed. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained embossing roll for forming with an electron microscope, a high-definition DLC pattern was observed.

(Example 5)

A patterning roll was obtained in the same manner as in Example 1 except that the substrate was made of stainless steel. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained pattern roll by an electron microscope, a high-definition DLC pattern was observed. Further, the obtained pattern roll was attached to a copper plating bath to carry out continuous plating of copper. The obtained copper plating can be perfectly peeled off from the pattern roll without using a peeling liquid.

(Example 6)

A patterning roll was obtained in the same manner as in Example 1 except that the substrate was made of titanium. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained pattern roll by an electron microscope, a high-definition DLC pattern was observed. Further, the obtained pattern roll was attached to a copper plating bath to carry out continuous plating of copper. The obtained copper plating can be perfectly peeled off from the pattern roll without using a peeling liquid.

A patterned roll was produced in the same manner as in Example 1 except that a roll having a nickel sleeve having a thickness of 0.4 mm was fitted to the base rubber. The volume resistivity of the conductive DLC layer was 5.0 × 10 ^-2 Ω ‧ cm. As a result of observing the obtained pattern roll by an electron microscope, a high-definition DLC pattern was observed.

10‧‧‧Scheduled roll of the invention

12‧‧‧Substrate

14‧‧‧ Conductive DLC layer

16‧‧‧Photographic material

18‧‧‧resist pattern

20‧‧‧DLC film

22‧‧‧DLC pattern

Claims (21)

A patterned roll is characterized in that a photosensitive material is coated on a surface of a substrate on which a conductive DLC layer is formed, and exposed and developed to form a photoresist pattern on the conductive DLC layer and the photoresist. A DLC coating film is formed on the surface of the pattern, and the DLC coating film formed on the photoresist pattern is peeled off together with the photoresist pattern to form a DLC pattern on the surface of the conductive DLC layer. The pattern roll according to the first aspect of the invention, wherein the film thickness of the DLC coating film is 0.1 μm to 20 μm. The patterned roll according to the first aspect of the invention, wherein the conductive DLC layer has a conductivity of a volume resistivity of 1.0 × 10 ^-3 Ω ‧ cm to 1.0 × 10 ⁰ Ω ‧ cm. The pattern roll according to the first aspect of the invention, wherein the surface is made of a substrate of a conductive DLC layer, which is made of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu. And at least one material selected from the group consisting of Al. The pattern roll according to the first aspect of the invention, wherein the substrate is provided with a buffer layer made of rubber or a cushioning resin. The pattern roll according to the first aspect of the invention, wherein the pattern roll is a roll for continuous plating. An article characterized by being plated by a pattern roll as described in claim 6 of the patent application. The pattern roll as described in item 1 of the patent application scope, The aforementioned pattern roller is an electroforming mold roller. An article characterized by being electroformed by a pattern roll as described in claim 8 of the patent application. The pattern roll according to the first aspect of the invention, wherein the pattern roll is a gravure roll. An article characterized in that printing is carried out by a pattern roll as described in claim 10 of the patent application. The pattern roll according to the first aspect of the invention, wherein the pattern roll is a molding embossing roll. A product characterized by being formed by a pattern roll as described in claim 12 of the patent application. A method for producing a patterned roll, comprising: preparing a substrate having a surface formed of a conductive DLC layer, coating a photosensitive material on a surface of the substrate, exposing and developing the light to form light The process of forming a resist pattern, the process of forming a DLC coating film on the surface of the conductive DLC layer and the photoresist pattern, and the process of peeling off the DLC coating film formed on the photoresist pattern together with the photoresist pattern . The method for producing a patterned roll according to claim 14, wherein the DLC coating film has a thickness of 0.1 μm to 20 μm. The method for producing a patterned roll according to claim 14, wherein the conductive DLC layer has a conductivity of a volume resistivity of 1.0 × 10 ^-3 Ω ‧ cm to 1.0 × 10 ⁰ Ω ‧ cm. The method of attaching a pattern roll as described in item 14 of the patent application scope The substrate coated with the photosensitive material is at least one selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. Composition. The method for producing a patterned roll according to claim 14, wherein the substrate is provided with a buffer layer made of rubber or a cushioning resin. The method for manufacturing a pattern roll according to claim 14, wherein the pattern roll is manufactured by using a pattern roll automatic manufacturing system, and the pattern roll automatic manufacturing system is configured to: set a plurality of pairs The processing device that is processed by the processing roller, and the processing roller is sequentially transferred to the processing device by the robot arm for processing. The method for manufacturing a pattern roll according to claim 19, wherein the pattern roll automatic manufacturing system has a processing chamber A and a processing chamber B, and connects the processing chamber A and the processing chamber B. The processing chamber A has a processing area for the first industrial robot that holds the processed roller for processing, and the processing chamber B has a processing region for the second industrial robot that holds the processed roller for processing. At least one vacuum film forming apparatus is disposed in the processing area of the first industrial robot in the processing chamber A or the processing area of the second industrial robot in the processing chamber B, and the processing area of the first industrial robot in the processing chamber A , configured by a roller storage device, a photosensitive material coating device, an electronic engraving device, a laser exposure latent image forming device, a degreasing device, a vermiculite polishing device, and an ultrasonic wave At least one of the cleaning device, the copper plating device, the developing device, and the processing device selected by the paper polishing device is disposed in the processing region of the second industrial robot in the processing chamber B, and is disposed in the processing device At least one of the processing devices in the processing chamber A, and the processing device of the processing chamber A and the processing chamber B are capable of being installed and removed, and the first industrial robot and the second industrial robot are processed. The roll is sequentially transferred to the processing apparatus for processing, thereby producing a pattern roll which is coated with a photosensitive material on the surface of the substrate on which the surface is made of the conductive DLC layer. A photoresist pattern is formed by exposure and development, and a DLC coating film is formed on the surface of the conductive DLC layer and the photoresist pattern, and the DLC coating film formed on the photoresist pattern is peeled off together with the photoresist pattern. On the other hand, a DLC pattern is formed on the surface of the conductive DLC layer, and the formation process of the conductive DLC layer and the formation process of the DLC coating film are performed by the vacuum film forming apparatus. The method for producing a patterned roll according to claim 20, wherein the vacuum film forming apparatus is provided with two or more, and the formation of the conductive DLC layer and the formation of the DLC coating film can be performed. This is carried out simultaneously in each of the aforementioned vacuum film forming apparatuses.