WO2015076180A1

WO2015076180A1 - Roll with pattern and method for producing same

Info

Publication number: WO2015076180A1
Application number: PCT/JP2014/080100
Authority: WO
Inventors: 申太郎菅原; 大地米倉
Original assignee: 株式会社シンク・ラボラトリー
Priority date: 2013-11-25
Filing date: 2014-11-13
Publication date: 2015-05-28
Also published as: JPWO2015076180A1; TW201540526A

Abstract

Provided are: a roll with a pattern, which has excellent releasability of a photosensitive material during a photosensitive material releasing process during the production of this roll with a pattern and excellent releasability of a material that is transferred using this roll with a pattern, while solving the problem of side etching; and a method for producing this roll with a pattern. A photosensitive material is applied to the surface of a base, said surface being configured of a conductive DLC layer, and a resist pattern is formed by exposing and developing the photosensitive material. A DLC coating film is formed on the surfaces of the conductive DLC layer and the resist pattern, and the DLC coating film formed on the resist pattern is removed together with the resist pattern, thereby forming a DLC pattern on the surface of the conductive DLC layer.

Description

Patterned roll and method for producing the same

The present invention relates to a patterned roll patterned by DLC (Diamond Like Carbon) and a method for manufacturing the same.

There is a roll for gravure printing as a roll with a pattern. In gravure printing, for a gravure printing roll (gravure cylinder), a micro concave portion (gravure cell) corresponding to the plate making information is formed to produce a plate surface, and the gravure cell is filled with ink and transferred to a substrate. is there. In a general gravure plate-making roll, a copper plating layer (plate material) for forming a plate surface is provided on the surface of a plate base material such as aluminum or iron, and a number of minute concave portions are formed on the copper plating layer according to plate making information by etching. (Gravure cell) is formed, and then a hard chromium layer is formed by chromium plating for increasing the printing durability of the gravure plate making roll to form a surface-enhanced coating layer, and plate making (plate surface production) is completed. The applicant of the present application has proposed, for example, a gravure printing roll described in Patent Document 1.

Also, there is an embossing roll for molding as a roll with a pattern. Embossing thermoplastic film to produce electronic parts such as prism sheet, lenticular sheet, Fresnel sheet, anti-reflection film used for LCD backlights and rear projection screens, and embossing metal plate For example, it is possible to improve the design and to provide an anti-slip function. The applicant of the present application has proposed an embossing roll described in Patent Document 2, for example.

Also, there is a continuous plating roll as a roll with a pattern. The roll for continuous plating is used for a continuous plating apparatus. For example, a continuous plating is performed by continuously winding a strip-shaped workpiece such as a steel sheet wound around a reel through a plating bath. is there. As an example of the roll for continuous plating, there exist rolls, such as a sink roll disclosed by patent document 3 or patent document 4, for example.

When manufacturing a roll with a pattern as described above, there is a problem in that over-etching called side etching occurs when a photosensitive material is applied to a substrate and exposed, developed, burned and etched. As the patterning becomes finer, the problem of side etching becomes more obvious.

Also, as in the technique disclosed in Patent Document 5, a DLC film formed on the surface of a convex pattern formed of a resist is peeled off together with the convex pattern resist to form an intaglio. is there.

However, in the intaglio disclosed in Patent Document 5, since the resist is difficult to remove cleanly, as shown in FIG. 2 of Patent Document 5, there is a problem that the angle of the side surface of the recess is inclined approximately 45 degrees. It was. For this reason, when the wiring of an electronic circuit is printed using such an intaglio, the cross section of the printed circuit wiring becomes trapezoidal, so that there is a problem that a portion having different electric resistance is generated in the circuit wiring. .

The applicant of the present application has also proposed a roll with a pattern as shown in Patent Document 6, but in such a roll with a pattern, in order to peel a plated product from the roll with a pattern when continuous plating is performed, a stripping solution is used. Was necessary.

International Publication WO2008 / 120789 JP 2009-72828 A JP 2006-283044 A JP 2001-89836 A JP 2008-254331 A JP 2012-154964 A International Publication WO2011 / 125926

The present invention has been made in view of the above-described problems of the prior art, and eliminates the problem of side etching and uses the photosensitive material peeling property and the patterned roll in the photosensitive material peeling process during the production of the patterned roll. It aims at providing the roll with a pattern excellent in the peelability of the transcription | transfer material at the time of transcription | transfer, and its manufacturing method.

In order to solve the above-mentioned problems, the patterned roll of the present invention is formed by applying a photosensitive material to the surface of a base material whose surface is a conductive DLC layer, and exposing and developing to form a resist pattern. A DLC coating film is formed on the surface of the DLC layer and the resist pattern, the DLC coating film formed on the resist pattern is peeled off together with the resist pattern, and a DLC pattern is formed on the surface of the conductive DLC layer. It is characterized by that.

In this way, the DLC coating film formed on the base material whose surface is the conductive DLC layer is peeled off by so-called lift-off, so that the side surface of the concave portion of the pattern becomes nearly vertical, and the problem of side etching is solved. There are advantages.

In addition, because it has excellent releasability of the photosensitive material (resist) in the photosensitive material peeling process at the time of manufacturing the roll with a pattern, it has excellent releasability when the DLC coating film formed on the resist pattern is peeled together with the resist pattern. There is also an advantage that the concave portion (or convex portion) of the pattern is formed cleanly.

Further, since the DLC coating film formed on the resist pattern is peeled together with the resist pattern, the conductive DLC layer on the surface is exposed, and a conductive DLC portion and a nonconductive DLC portion are formed. Is done. When the surface of the substrate is made of conductive DLC, for example, plating can be performed, and the conductive DLC portion is easily peeled off because of poor adhesion. For this reason, it becomes a roll with a pattern excellent in the peelability of the transferred material at the time of transfer.

The thickness of the DLC coating film is preferably 0.1 μm to 20 μm, more preferably 0.1 μm to 10 μm, and even more preferably 0.1 μm to 5 μm.

The conductive DLC layer preferably has a volume resistivity of 1.0 × 10 ⁻³ Ω · cm to 1.0 × 10 ⁰ Ω · cm.

The thickness of the conductive DLC layer is not particularly limited, but from the viewpoint of production efficiency, the thickness of the conductive DLC layer is preferably 0.1 μm to 20 μm, more preferably 0.1 μm to 10 μm, More preferably, the thickness is 0.1 μm to 5 μm.

In the formation of the conductive DLC layer and the DLC coating film, any of known methods such as plating, vapor deposition, CVD, PVD (Physical Vapor Deposition), and sputtering can be applied.

It is preferable that the base material whose surface is a conductive DLC layer is made of at least one material selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. It is. Of course, since it is at least one kind of material, it may be an alloy.

It is preferable that the base material includes a cushion layer made of rubber or a resin having cushioning properties. That is, the base material may be a base material provided with a cushion layer in which a metal base material is formed on a cushion layer made of rubber or a resin having cushioning properties. As the cushion layer, a synthetic rubber such as silicone rubber, or a synthetic resin having elasticity such as polyurethane or polystyrene can be used. The thickness of the cushion layer is not particularly limited as long as it can provide cushioning properties, that is, elasticity, but for example, a thickness of about 1 cm to 5 cm is sufficient. As an example of a base material provided with a cushion layer made of rubber or a resin having cushioning properties, there is, for example, Patent Document 6.

It is preferable that the roll with a pattern is a roll for continuous plating.

The product according to the present invention is characterized by being plated by the roll with the pattern.

It is preferable that the roll with a pattern is an electroforming mold roll.

The product according to the present invention is characterized in that it is electroformed by the patterned roll.

It is preferable that the roll with a pattern is a gravure printing roll. This is because there is no problem of side etching, so that the concentration range can be expanded as compared with the conventional case.

The product according to the present invention is printed by the patterned roll.

It is preferable that the roll with pattern is an embossing roll for molding.

The product according to the present invention is characterized by being formed by the roll with the pattern.

The method for producing a patterned roll according to the present invention includes a step of preparing a base material having a conductive DLC layer on the surface, a photosensitive material is applied to the surface of the base material, and a resist pattern is formed by exposure and development. And a step of forming a DLC coating film on the surfaces of the conductive DLC layer and the resist pattern, and a step of peeling the DLC coating film formed on the resist pattern together with the resist pattern. Features.

It is preferable that the substrate on which the photosensitive material is applied is made of at least one material selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. Of course, since it is at least one kind of material, it may be an alloy.

It is preferable that the base material includes a cushion layer made of rubber or a resin having cushioning properties.

The method for manufacturing a patterned roll according to the present invention includes a pattern in which a plurality of processing apparatuses for performing processing on a roll to be processed are provided, and the processing roll is sequentially transferred to the processing apparatus by a robot arm and processed. It is preferable to manufacture a roll with a pattern using a fully automatic manufacturing system with a roll.

The fully automatic roll manufacturing system with a pattern has a processing chamber A having a handling area of a first industrial robot for chucking and handling the roll to be processed, and a handling of a second industrial robot for chucking and handling the roll to be processed. A processing chamber B having an area, wherein the processing chamber A and the processing chamber B are communicated, and the handling area of the first industrial robot in the processing chamber A or the second industry in the processing chamber B At least one vacuum film forming apparatus is disposed in the handling area of the robot, and a roll stock apparatus, a photosensitive material coating apparatus, an electronic engraving apparatus, and a laser exposure latent image formation are formed in the handling area of the first industrial robot in the processing chamber A. Equipment, degreasing equipment, grinding wheel polishing equipment, ultrasonic cleaning equipment, copper plating equipment, development equipment, paper polishing equipment Arrange at least one selected processing apparatus, and arrange at least one of the processing apparatuses not disposed in the processing chamber A in the handling area of the second industrial robot in the processing chamber B. In addition, the processing apparatuses in the processing chamber A and the processing chamber B can be installed and removed, and the roll to be processed is transferred to the processing apparatus by the first industrial robot and the second industrial robot. It is preferable to transfer and process sequentially.

Then, a photosensitive material is applied to the surface of the base material whose surface is a conductive DLC layer, exposed and developed to form a resist pattern, and a DLC coating film is formed on the surfaces of the conductive DLC layer and the resist pattern. The DLC coating film formed on the resist pattern is peeled off together with the resist pattern to produce a patterned roll formed by forming a DLC pattern on the surface of the conductive DLC layer. It is preferable that the apparatus is configured to perform the conductive DLC layer forming process and the DLC coating film forming process.

It is preferable that two or more vacuum film forming apparatuses are arranged, and the process for forming the conductive DLC layer and the process for forming the DLC coating film can be simultaneously performed in each of the vacuum film forming apparatuses. .

According to the present invention, there is a remarkable effect that it is possible to provide a patterned roll excellent in releasability of a photosensitive material and removability of a transferred material and a method for producing the same while eliminating the problem of side etching.

It is explanatory drawing which shows typically an example of the roll with a pattern of this invention, (a) is principal part sectional drawing of the state in which the electroconductive DLC layer was formed in the surface of a base material, (b) is an electroconductive DLC layer FIG. 4C is a cross-sectional view of a main part in a state where a photosensitive material is applied on the surface, FIG. 4C is a cross-sectional view of a main part in a state where a resist pattern is formed by exposure and development, and FIG. FIG. 4E is a cross-sectional view of a main part showing a state in which the DLC coating film formed on the resist pattern is peeled off together with the resist pattern. It is a flowchart which shows the process order of the manufacturing method of the roll with a pattern shown in FIG. It is a schematic plan view which shows one embodiment of the fully automatic manufacturing system of the roll with a pattern used for the manufacturing method of the roll with a pattern of this invention.

Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications are possible without departing from the technical idea of the present invention. In addition, the same member is represented with the same code | symbol.

In FIG. 1, reference numeral 10 indicates a roll with a pattern. The code | symbol 12 shows a base material and what consists of at least 1 type of material chosen from the group which consists of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, Al can be used. The substrate 12 is cylindrical. Moreover, you may make it equip the lower surface of the base material 12 with the cushion layer which consists of resin which has rubber | gum or cushioning properties. The cushion layer is made of rubber or a resin having cushioning properties, and is made of a sheet having a uniform thickness of about 1 mm to 10 cm and high surface smoothness, and is firmly attached to the base material 12 so as not to open a gap at the seam. Then, precision cylindrical grinding and mirror polishing are performed.

First, the conductive DLC layer 14 is formed on the surface of the substrate 12 (step 100 in FIG. 1A and FIG. 2). The conductive DLC layer 14 may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

Next, a photosensitive material 16 is applied on the conductive DLC layer 14 on the surface (step 102 in FIG. 1B and FIG. 2). The resist pattern 18 is formed by exposure and development (step 104 in FIG. 1C and FIG. 2). The photosensitive composition used as the photosensitive material can be either a negative type or a positive type. In this way, the conductive DLC layer 14 is exposed in the portion where the resist pattern 18 is not formed.

Next, a DLC coating film 20 is formed on the exposed surfaces of the conductive DLC layer 14 and the resist pattern 18 (step 106 in FIGS. 1D and 2). The DLC coating film 20 may be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

Next, the DLC coating film 20 formed on the resist pattern 18 is peeled off together with the resist pattern 18 to form a DLC pattern 22 on the conductive DLC layer 14 (step 108 in FIGS. 1E and 2). ).

In the method for manufacturing a roll with a pattern according to the present invention, a plurality of processing apparatuses for processing the roll to be processed are provided, and the roll to be processed is sequentially transferred to the processing apparatus by a robot arm for processing. It is preferable that the roll with a pattern is manufactured using the fully automatic roll manufacturing system with a pattern.

FIG. 3 shows one embodiment of such a fully automatic roll manufacturing system with a pattern used in the method for manufacturing a roll with a pattern of the present invention.

In FIG. 3, reference numeral 30 denotes a fully automatic roll manufacturing system with a pattern.

The fully automatic manufacturing system 30 is roughly divided into a processing chamber A and a processing chamber B. The processing chamber A is further divided into processing chambers C. The processing chamber A and the processing chamber B, and the processing chamber A and the processing chamber C are separated by

walls

32 and 33, and communicated with each other through a shutter 34 that can be opened and closed.

The configuration of the processing chamber A will be described. In the processing chamber A, reference numeral 36 denotes a first industrial robot, which has a multi-axis robot arm 38 that can turn freely.

Numeral 40 is a roll to be treated, and the roll to be treated 40 is the base material 12 described above.

Reference numerals

42a and 42b denote roll stock apparatuses. For this roll stock device, for example, the roll stock device disclosed in Patent Document 7 can be used.

A chuck means 92 is provided at the tip of the robot arm 38, and the processing roll 20 can be detachably chucked by the chuck means 92.

Next, the configuration of the processing chamber B will be described. In the processing chamber B, reference numeral 50 denotes a second industrial robot, which has a multi-axis robot arm 52 that can turn freely.

A chuck means 94 is provided at the tip of the robot arm 52, and the processing roll 40 can be detachably chucked by the chuck means 94.

Reference numeral 44 denotes a photosensitive material coating apparatus, and reference numeral 46 denotes a laser exposure apparatus. In the illustrated example, a photosensitive material coating device 44 is provided on a laser exposure device 46. Conventionally known apparatuses can be applied to these apparatuses. For example, a photosensitive material coating apparatus and a laser exposure apparatus as disclosed in Patent Document 7 can be used.

Reference numeral 70 denotes a roll relay mounting table for placing the processing roll 40 for relay, and is provided at a position where the handling area of the first industrial robot 36 and the handling area of the second industrial robot 50 overlap. ing. Reference numeral 90 denotes an ultrasonic cleaning device with a drying function for performing an ultrasonic cleaning process and a drying process on the roll to be processed 40, and the ultrasonic cleaning device 90 with a drying function is close to the roll relay mounting table 70. Is provided.

The ultrasonic cleaning device 90 has a storage tank for storing cleaning water and an ultrasonic vibrator provided at a lower portion of the storage tank, and vibrates the cleaning water by the ultrasonic vibration of the ultrasonic vibrator. It is an apparatus that can be cleaned. The ultrasonic cleaning device with a drying function 90 is further provided with a drying function. The ultrasonic cleaning device 90 with a drying function can perform ultrasonic cleaning and drying as necessary for each process.

Further, the fully automatic roll manufacturing system 30 with patterns is electrically controlled by a computer 48, and the first industrial robot 36 and the second industrial robot 50 are also controlled by the computer 48.

Reference numeral 62 denotes a developing device. For example, a developing device as disclosed in Patent Document 7 can be used.

Numeral 58 is a degreasing apparatus, and numeral 60 is a copper plating apparatus. In the illustrated example, a degreasing device 58 is provided on the copper plating device 60. Conventionally known devices can be applied to these devices. For example, an electrolytic degreasing device and a copper plating device as disclosed in Patent Document 7 can be used.

Reference numerals

68a and 68b denote vacuum film forming apparatuses, which are only required to be capable of forming a conductive DLC layer and forming a DLC coating film, and for performing sputtering, CVD, plasma CVD, vacuum deposition, and the like. Any vacuum film forming apparatus is included. In the illustrated example, as the vacuum

film forming apparatuses

68a and 68b, an example of a gas phase film forming apparatus that forms a film using a raw material in a gas phase state is shown.

The vacuum

film forming apparatuses

68a and 68b can accommodate a plurality of rolls 40 to be processed in an upright state, and can process the plurality of rolls 40 simultaneously.

Although omitted in the illustrated example, an ultrasonic cleaning device may be provided in the handling area of the second industrial robot 50 as necessary. The ultrasonic cleaning apparatus has a storage tank for storing cleaning water and an ultrasonic vibrator provided at a lower portion of the storage tank, and vibrates the cleaning water by ultrasonic vibration of the ultrasonic vibrator. It is an apparatus that can be cleaned.

Next, the configuration of the processing chamber C will be described. In the processing chamber C, reference numeral 41 denotes a paper polishing apparatus for performing paper polishing, and reference numeral 54 denotes a grindstone polishing apparatus. A conventionally well-known apparatus can be applied to the grindstone polishing apparatus 54. For example, a grindstone polishing apparatus disclosed in Patent Document 7 can be used. In the illustrated example, a paper polishing device 41 is provided on the grindstone polishing device 54. As the paper polishing apparatus 41, for example, a paper polishing apparatus disclosed in Patent Document 7 can be used.

The processing chamber A and the processing chamber C are communicated with each other via a shutter 34, and the grindstone polishing device 54 and the paper polishing device 41 are disposed in the handling area of the first industrial robot 36.

In the illustrated example, the processing chamber A is a clean room. The processing chamber A and the processing chamber B can each be a clean room as required.

Doors

78 and 80 are provided on the wall 76 of the processing chamber A, and the manufactured patterned roll 10 is taken out or a new roll to be processed (cylindrical base material) is inserted. The manufactured roll 10 with a pattern is carried out after being placed on one of the

roll stock devices

42a and 42b. On the other hand, the roll to be processed from now on is placed on the other roll stock device. A computer 48 is placed outside the processing chamber A, where various information is checked and managed, various programs are set, etc., and the fully automatic manufacturing system 30 for the patterned roll is controlled. Do.

In the illustrated example, an example is shown in which the roll 40 to be treated is placed on the roll stock apparatus 42a and the manufactured roll 10 with the pattern is placed on the roll stock apparatus 42b.

In this way, the fully automatic pattern roll manufacturing system 30 used in the method for manufacturing a patterned roll according to the present invention has a handling area of the first industrial robot 36 that chucks and handles the roll 40 to be processed. A chamber A and a processing chamber B having a handling area for the second industrial robot 50 for chucking and handling the roll to be processed. The processing chamber A and the processing chamber B are connected to each other. At least one

vacuum deposition apparatus

68a, 68b is disposed in the handling area of the first industrial robot 36 or the handling area of the second industrial robot 50 in the processing chamber B, and the first in the processing chamber A. In the handling area of the industrial robot 36, roll

stock devices

42a and 42b, photosensitive material coating device 44, A laser exposure latent image forming device 46, an ultrasonic cleaning device 90, a grindstone polishing device 54, and a paper polishing device 41 are arranged in the handling area of the second industrial robot in the processing chamber B. The degreasing device 58, the copper plating device 60, and the developing device 62 of the processing apparatus not disposed in the processing chamber A are disposed, and the processing apparatuses in the processing chamber A and the processing chamber B can be installed and removed. Being done.

Then, as shown in FIGS. 1 and 3, the first industrial robot 36 and the second industrial robot 50 transfer the processing roll 40 to the processing apparatus in order to process the surface. A photosensitive material 16 is applied to the surface of the base material 12 that is the conductive DLC layer 14, and is exposed and developed to form a resist pattern 18. A DLC coating film is formed on the surfaces of the conductive DLC layer 14 and the resist pattern 18. 20, and the DLC coating film 20 formed on the resist pattern 18 is peeled off together with the resist pattern 18 to produce a patterned roll formed by forming a DLC pattern on the surface of the conductive DLC layer. In the vacuum

film forming apparatuses

68a and 68b, the conductive DLC layer 14 is formed and the DLC film 20 is formed.

Since two vacuum

film forming apparatuses

68a and 68b are arranged, the process for forming the conductive DLC layer 14 and the process for forming the DLC film 20 are performed in the vacuum

film forming apparatuses

68a and 68b. Can be performed simultaneously.

Next, the operation of the fully automatic manufacturing system 30 for a roll with a pattern used in the method for manufacturing a roll with a pattern will be described with reference to FIG. The first industrial robot 36 chucks the roll 40 to be processed placed on one of the

roll stock devices

42 a and 42 b, places it on the roll relay mounting table 70, and delivers it to the second industrial robot 50. The second industrial robot 50 chucks the roll 40 to be processed and transports it to the degreasing device 58 to release the roll 40 and set it on the degreasing device 58.

When the degreasing work in the degreasing apparatus 58 is completed, the second industrial robot 50 chucks the roll 40 to be processed and carries it to the copper plating apparatus 60 to release the roll 40 and set it in the copper plating apparatus 60.

When the plating operation in the copper plating apparatus 60 is finished, the second industrial robot 50 chucks the roll 40 to be processed, places it on the roll relay mounting table 70, and delivers it to the first industrial robot 36. The first industrial robot 36 chucks the roll 40 to be processed and carries it to the grindstone polishing apparatus 54 to release the roll 40 and set it on the grindstone polishing apparatus 54.

When the grindstone polishing operation by the grindstone polishing apparatus 54 is completed, the first industrial robot 36 chucks the roll 40 to be processed, places it on the roll relay mounting table 70, and delivers it to the second industrial robot 50. The second industrial robot 50 chucks the roll 40 to be processed and transports it to the vacuum film forming apparatus 68a to release the roll 40 and set it in the vacuum

film forming apparatus

68a or 68b. Then, the conductive DLC layer is formed by the vacuum

film forming apparatus

68a or 68b.

When the process for forming the conductive DLC layer in the vacuum

film forming apparatus

68a or 68b is completed, the second industrial robot 50 chucks the roll 40 to be processed and carries it to the roll relay mounting table 70 to place it on the first Delivered to the industrial robot 36. The first industrial robot 36 chucks the roll 40 to be processed and transports it to the photosensitive material coating device 44 to release the processing roll 40 and set it on the photosensitive material coating device 44.

When the photosensitive material application operation in the photosensitive material application device 44 is completed, the first industrial robot 36 chucks the processing roll 40 and carries it to the laser exposure device 46 to release the processing roll 40 and set it in the laser exposure device 46. To do.

When the exposure operation in the laser exposure apparatus 46 is completed, the first industrial robot 36 chucks the roll 40 to be processed, places it on the roll relay mounting table 70, and delivers it to the second industrial robot 50. The second industrial robot 50 chucks the roll 40 to be processed and transports it to the developing device 62 to release the roll 40 to be set on the developing device 62.

When the developing operation in the developing device 62 is completed, the second industrial robot 50 chucks the roll 40 to be processed and transports it to the vacuum

film forming apparatus

68a or 68b to release the roll 40 to be processed. Set to 68b. Then, the DLC coating film is formed by the vacuum

film forming apparatus

68a or 68b.

The to-be-processed roll 40 in which the DLC coating film forming process is completed is transferred to the outside of the vacuum

film forming apparatus

68a or 68b by the second industrial robot 50, and the conductive DLC layer forming process or the The next roll 40 to be processed for forming the DLC coating film is sequentially transferred into the vacuum

film forming apparatuses

68a and 68b. In this manner, the process for forming the conductive DLC layer or the process for forming the DLC coating film is simultaneously performed sequentially.

When the DLC coating film forming process in the vacuum

film forming apparatus

68a or 68b is completed, the second industrial robot 50 chucks the roll 40 to be processed and carries it to the roll relay mounting table 70 to place it in the first industry. Transfer to the robot 36.

The first industrial robot 36 chucks the roll 40 to be processed and transports it to the ultrasonic cleaning apparatus 90, releases the roll 40 to be set and sets it in the ultrasonic cleaning apparatus 90, and forms a DLC coating film formed on the resist pattern. Is peeled off together with the resist pattern.

After finishing the peeling process, the first industrial robot 36 chucks the roll 40 to be processed and carries it to the paper polishing apparatus 41 to release the roll 40 and set it in the paper polishing apparatus 41. When the paper polishing (automatic polishing) is performed by the paper polishing device 41, the roll 10 is provided with a pattern, and is placed on the roll stock device 42b in the illustrated example. In addition, paper grinding | polishing is required only when manufacturing the roll for gravure printing, and is unnecessary when manufacturing the roll with a pattern for another use.

</ RTI> The patterned roll 10 thus completed is carried out of the processing chamber A and completed.

In the example of FIG. 3, as the first industrial robot 36 and the second industrial robot 50, the processing roll 40 is carried to each processing apparatus while the cylindrical processing roll 40 is chucked, and the processing roll 40 is released. In this example, the roll is set in the processing apparatus and the roll to be processed is rotated by the driving means provided in the processing apparatus.

On the other hand, as the first industrial robot and the second industrial robot, the processing roll 40 is carried to each processing apparatus while the cylindrical processing roll 40 is chucked using an industrial robot with a driving means. The roll 40 may be set in the processing apparatus while being gripped, and the roll to be processed may be rotated by a driving unit provided in the industrial robot.

Hereinafter, the present invention will be described more specifically with reference to examples. However, it is needless to say that these examples are shown by way of example and should not be interpreted in a limited manner.

Example 1
A plate base material (aluminum hollow roll) having a circumference of 600 mm and a surface length of 1100 mm was prepared, and a roll with a pattern described below was manufactured using NewFX (a fully automatic laser gravure plate making system manufactured by Sink Laboratory Co., Ltd.). First, a plate base material (aluminum hollow roll) which is a roll to be treated was mounted in a copper plating tank, and the hollow roll was completely immersed in a plating solution to form a 40 μm copper plating layer at 30 A / dm ² and 6.0 V. . The plating surface was free of bumps and pits, and a uniform copper plating layer serving as a substrate was obtained. The surface of the copper plating layer was polished using a 4-head type polishing machine (Sink Laboratory Co., Ltd. polishing machine) to make the surface of the copper plating layer a uniform polishing surface.

Next, the roll to be processed on which the copper plating layer as the base material was formed was housed in a vacuum film forming apparatus, and a conductive DLC layer was formed by a CVD method under the following conditions. The CVD conditions are as follows. A conductive DLC layer having a thickness of 2 μm was formed as a source gas using toluene / acetylene, a film formation temperature of 200 to 300 ° C., and a film formation time of 60 minutes. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm.

A photosensitive material (thermal resist: TSER-NS (manufactured by Sink Laboratories)) was applied to the surface of the conductive DLC layer formed (fountain coater) and dried. The film thickness of the obtained photosensitive material was 7 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 300 mJ / cm ² . The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern.

A DLC coating film was formed on the surfaces of the conductive DLC layer and the resist pattern by a CVD method. An intermediate layer having a thickness of 0.1 μm was formed on the source gas using toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a DLC layer having a thickness of 5 μm was formed as a source gas with toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 180 minutes.

Next, the treated roll was subjected to ultrasonic treatment in an aqueous sodium hydroxide solution for 30 minutes. And the DLC coating film formed on this resist pattern was peeled with the said resist pattern, and the roll with a pattern by which the DLC pattern was formed in the surface of the electroconductive DLC layer was obtained.

When the surface of this patterned roll was observed with an optical microscope, a high-definition patterned roll having a large number of square-shaped convex portions formed on the surface was observed. The line width of the DLC pattern was 10 μm, and the square convex part was a square having a side of 100 μm. Further, the depth of the rectangular recess was 5 μm.

The obtained patterned roll was mounted on a copper plating bath, and the patterned roll was completely immersed in a plating solution, and continuous plating of 20 μm of copper was performed at 20 A / dm ² and 6.0 V. The obtained copper plating could be removed cleanly from the patterned roll without using a stripping solution.

(Example 2)
An electroforming mold roll was obtained in the same manner as in Example 1 except that the patterning shape was changed. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained electroformed mold roll was observed with an optical microscope, a high-definition DLC pattern was observed.

Example 3
Except having changed the patterning shape, it carried out similarly to Example 1, and after carrying out the peeling process of the DLC coating film with this resist pattern, the paper grinding | polishing was performed and the roll for gravure printing (gravure cylinder) was obtained. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained gravure printing roll was observed with an electron microscope, a high-definition DLC pattern was observed.

Example 4
An embossing roll for molding was obtained in the same manner as in Example 1 except that the patterning shape was changed. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained embossing roll for molding was observed with an electron microscope, a high-definition DLC pattern was observed.

(Example 5)
A patterned roll was obtained in the same manner as in Example 1 except that the base material was stainless steel. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained roll with a pattern was observed with the electron microscope, the high-definition DLC pattern was observed. Moreover, the obtained roll with a pattern was mounted | worn with the copper plating tank, and copper continuous plating was performed. The obtained copper plating could be removed cleanly from the patterned roll without using a stripping solution.

(Example 6)
A patterned roll was obtained in the same manner as in Example 1 except that the base material was titanium. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained roll with a pattern was observed with the electron microscope, the high-definition DLC pattern was observed. Moreover, the obtained roll with a pattern was mounted | worn with the copper plating tank, and copper continuous plating was performed. The obtained copper plating could be removed cleanly from the patterned roll without using a stripping solution.

A patterned roll was produced in the same manner as in Example 1 except that a roll in which a nickel sleeve having a thickness of 0.4 mm was fitted on silicon rubber was used as the base material. The volume resistivity of the conductive DLC layer was 5.0 × 10 ⁻² Ω · cm. When the obtained roll with a pattern was observed with the electron microscope, the high-definition DLC pattern was observed.

10: Roll with pattern of the present invention, 12: base material, 14: conductive DLC layer, 16: photosensitive material, 18: resist pattern, 20: DLC coating film, 22: DLC pattern, 30: fully automatic roll with pattern Manufacturing system, 32, 33, 76: Wall, 34: Shutter, 36: First industrial robot, 38, 52: Robot arm, 40: Roll to be treated, 41: Paper polishing device, 42a, 42b: Roll stock device, 44: photosensitive material coating device, 46: laser exposure device, 48: computer, 50: second industrial robot, 54: grinding wheel polishing device, 58: degreasing device, 60: copper plating device, 62: developing device, 68a, 68b : Vacuum film forming apparatus, 70: roll relay mounting table, 78, 80: door, 90: ultrasonic cleaning apparatus with drying function, 92, 94: chuck means, A, B, C: processing Room.

Claims

A photosensitive material is applied to the surface of the base material whose surface is a conductive DLC layer, exposed and developed to form a resist pattern, and a DLC coating film is formed on the surface of the conductive DLC layer and the resist pattern. A patterned roll, wherein the DLC coating film formed on the resist pattern is peeled off together with the resist pattern to form a DLC pattern on the surface of the conductive DLC layer.
2. The patterned roll according to claim 1, wherein the DLC coating film has a thickness of 0.1 μm to 20 μm.
3. The patterned roll according to claim 1, wherein the conductive DLC layer has a volume resistivity of 1.0 × 10 −3 Ω · cm to 1.0 × 10 0 Ω · cm. .
The substrate whose surface is a conductive DLC layer is made of at least one material selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. The patterned roll according to any one of claims 1 to 3.
The patterned roll according to any one of claims 1 to 4, wherein the substrate comprises a cushion layer made of rubber or a resin having a cushioning property.
The patterned roll according to any one of claims 1 to 5, wherein the patterned roll is a roll for continuous plating.
A product plated with the patterned roll according to claim 6.
The patterned roll according to any one of claims 1 to 5, wherein the patterned roll is an electroformed mold roll.
A product characterized in that it is electroformed by the patterned roll according to claim 8.
6. The patterned roll according to claim 1, wherein the patterned roll is a gravure printing roll.
A product printed by the roll with a pattern according to claim 10.
6. The patterned roll according to claim 1, wherein the patterned roll is an embossing roll for molding.
A product formed by the patterned roll according to claim 12.
A step of preparing a base material whose surface is a conductive DLC layer, a step of applying a photosensitive material to the surface of the base material, exposing and developing to form a resist pattern, and the conductive DLC layer and the resist pattern A process for producing a patterned roll, comprising: a step of forming a DLC coating film on the surface of the substrate; and a step of peeling the DLC coating film formed on the resist pattern together with the resist pattern.
15. The method for producing a patterned roll according to claim 14, wherein the DLC coating film has a thickness of 0.1 μm to 20 μm.
16. The patterned roll according to claim 14, wherein the conductive DLC layer has a volume resistivity of 1.0 × 10 −3 Ω · cm to 1.0 × 10 0 Ω · cm. Manufacturing method.
The base material to which the photosensitive material is applied is made of at least one material selected from the group consisting of Ni, stainless steel, brass, Fe, Cr, Zn, Sn, Ti, Cu, and Al. Item 17. The method for producing a patterned roll according to any one of Items 14 to 16.
The method for producing a roll with a pattern according to any one of claims 14 to 17, wherein the base material includes a cushion layer made of rubber or a resin having a cushioning property.
Using a fully automatic manufacturing system with a pattern roll, in which a plurality of processing devices for processing the processing roll are provided and the processing rolls are sequentially transferred to the processing device by a robot arm and processed. The method for producing a roll with a pattern according to any one of claims 14 to 18, wherein the roll is produced.
The fully automatic roll manufacturing system with pattern is
A processing chamber A having a handling area of a first industrial robot for chucking and handling the roll to be processed; and a processing chamber B having a handling area for a second industrial robot for chucking and handling the roll to be processed. And connecting the processing chamber A and the processing chamber B,
Disposing at least one vacuum film forming apparatus in the handling area of the first industrial robot in the processing chamber A or in the handling area of the second industrial robot in the processing chamber B;
In the handling area of the first industrial robot in the processing chamber A, a roll stock device, a photosensitive material coating device, an electronic engraving device, a laser exposure latent image forming device, a degreasing device, a grindstone polishing device, an ultrasonic cleaning device, a copper plating At least one processing apparatus selected from an apparatus, a developing apparatus, and a paper polishing apparatus is disposed, and is not disposed in the processing chamber A of the processing apparatus in the handling area of the second industrial robot in the processing chamber B. And at least one of the processing devices disposed therein, and the processing devices in the processing chamber A and the processing chamber B can be installed and removed, and are the first industrial robot and the second industrial robot. By sequentially transferring and processing the rolls to be processed to the processing apparatus,
A photosensitive material is applied to the surface of the base material whose surface is a conductive DLC layer, exposed and developed to form a resist pattern, and a DLC coating film is formed on the surface of the conductive DLC layer and the resist pattern. The DLC coating film formed on the resist pattern is peeled off together with the resist pattern, and a patterned roll formed by forming the DLC pattern on the surface of the conductive DLC layer is manufactured.
The manufacturing method of the roll with a pattern of Claim 19 with which the formation process of an electroconductive DLC layer and the formation process of a DLC coating film are performed in the said vacuum film-forming apparatus.
Two or more vacuum film forming apparatuses are arranged, and a process for forming a conductive DLC layer and a process for forming a DLC coating film can be performed simultaneously in each of the vacuum film forming apparatuses. The manufacturing method of the roll with a pattern of Claim 20.