JP2014130267A - Gravure cylinder and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gravure cylinder having a gravure cell of a high aspect ratio, and to provide a method for manufacturing the same.SOLUTION: The gravure cylinder is manufactured by forming a DLC (diamond-like carbon) layer on a plate base material, forming a DLC coating layer made of a material capable of being etched on the DLC layer, applying a photoresist on the DLC coating layer to form a photoresist layer and then exposing and developing the photoresist layer to form a resist pattern layer, etching the DLC coating layer to form a DLC coating pattern layer, peeling the resist pattern layer, dry-etching the DLC layer to form gravure cells in the DLC layer, and peeling the DLC coating pattern layer.

Description

  The present invention relates to a gravure cylinder used for gravure printing and a manufacturing method thereof.

  There is a gravure cylinder as a gravure plate used for gravure printing. A gravure cylinder (also called a gravure plate making roll) forms a small concave part (gravure cell) according to the plate making information on the plate base material, manufactures the plate surface, fills the gravure cell with ink, and transfers it to the substrate. To do. In a general gravure cylinder, a copper plating layer (plate material) for forming a plate surface is provided on the surface of a metal hollow roll made of metal such as aluminum or iron as a plate base material, and wet etching is performed on the copper plating layer. The surface is strengthened by forming a large number of minute recesses (gravure cells) according to the plate making information, and then forming a hard coating layer by chrome plating or DLC (diamond-like carbon) to increase the printing durability of the gravure plate making roll. With the coating layer, plate making (plate surface production) is completed.

  On the other hand, in recent years, high-definition plates are increasingly required for gravure plate making, and in order to realize such high-definition plates, gravure cylinders equipped with high-aspect-ratio gravure cells are required. It needs to be manufactured. However, in the conventional method in which a gravure cell is formed on a copper plating layer by wet etching and a hard coating layer is formed by chrome plating, DLC, or the like, since wet etching becomes isotropic etching, a high aspect ratio is obtained. When trying to make a gravure cell, there was a problem that undesired side etching was also performed. Therefore, it has been difficult to produce a gravure cylinder having a high aspect ratio gravure cell.

WO2006 / 132208 JP2009-093170

  The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to provide a gravure cylinder having a high aspect ratio gravure cell and a method for manufacturing the same.

  In order to solve the above-described problems, the gravure cylinder of the present invention is formed by forming a DLC layer on a plate base material, forming a DLC coating layer on the DLC layer with an etchable material, and forming a photo on the DLC coating layer. After applying a resist and forming a photoresist layer, the photoresist layer is exposed and developed to form a resist pattern layer, the DLC coating layer is etched to form a DLC coating pattern layer, and the resist pattern layer is formed. Peeling, dry etching the DLC layer to form a gravure cell in the DLC layer, and peeling the DLC coating layer.

  In the present invention, since gravure cells are formed by dry etching, anisotropic etching is realized. This makes it possible to freely change the depth / width ratio of the gravure cell without side etching. Thereby, for example, it is possible to make the depth of the gravure cell deeper than the width of the gravure cell. That is, according to the present invention, a gravure cylinder having a high aspect ratio (gravure cell depth / gravure cell width) can be realized. Therefore, it is possible to manufacture a gravure plate having a narrow opening and a deep depth, which has been difficult in the past.

  The DLC coating layer can be formed on the DLC layer and is not particularly limited as long as it is an etchable material. However, nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, aluminum, cobalt, indium, It is preferably composed of at least one material selected from the group consisting of tin and silicon. Of course, since it is at least one kind of material, it may be an alloy or a compound.

  In forming the DLC coating layer, any known method such as plating, vapor deposition, CVD, PVD (Physical Vapor Deposition), or sputtering can be applied. From the viewpoint of production efficiency, it is preferable to form the DLC coating layer by plating.

  The plate base material is not particularly limited as long as it is a metal capable of forming a DLC layer on the surface thereof, but from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, and aluminum. It is preferably composed of at least one selected material. Of course, since it is at least one kind of material, it may be an alloy or a compound. An intermediate layer may be formed between the plate base material and the DLC layer.

  Further, the plate base material may be a plate base material provided with a cushion layer in which a metal base material is formed on a cushion layer made of rubber or a resin having cushioning properties. There exists patent document 2 as an example of the plate | board base material provided with such a cushion layer.

  In the method for producing a gravure cylinder of the present invention, a DLC layer is formed on a plate base material, a DLC coating layer is formed on the DLC layer with an etchable material, and a photoresist is applied on the DLC coating layer. Forming a photoresist layer, exposing and developing the photoresist layer to form a resist pattern layer, etching the DLC coating layer to form a DLC coating pattern layer, and the resist pattern A step of peeling the layer, a step of dry etching the DLC layer to form a gravure cell in the DLC layer, and a step of peeling the DLC coating layer.

  The DLC coating layer can be formed on the DLC layer and is not particularly limited as long as it is a material that can be etched, but nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, aluminum, cobalt, indium It is preferably composed of at least one material selected from the group consisting of tin. Of course, since it is at least one kind of material, it may be an alloy or a compound.

  In forming the DLC coating layer, any known method such as plating, vapor deposition, CVD, PVD, sputtering, etc. can be applied. From the viewpoint of production efficiency, it is preferable to form the DLC coating layer by plating.

  The plate base material is not particularly limited as long as it is a metal capable of forming a DLC layer on the surface thereof, but from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, and aluminum. It is preferably composed of at least one selected material. Of course, since it is at least one kind of material, it may be an alloy.

  The plate base material may be a plate base material provided with a cushion layer in which a metal substrate is formed on a cushion layer made of rubber or a resin having cushioning properties.

  ADVANTAGE OF THE INVENTION According to this invention, it has the remarkable effect that the gravure cylinder provided with the gravure cell of a high aspect ratio and its manufacturing method can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows the manufacturing method of the gravure cylinder of this invention typically, (a) forms a DLC layer on the plate base material, and forms a DLC coating layer with the material which can be etched on the DLC layer. The main part expanded sectional view which shows the state which apply | coated the photoresist on the said DLC coating layer, and formed the photoresist layer, (b) shows the state which exposed and developed the photoresist layer and formed the resist pattern layer The principal part expanded sectional view, (c) The principal part enlarged sectional view which shows the state which etched the DLC coating layer and formed the DLC coating pattern layer, (d) The principal part enlarged sectional view which shows the state which peeled the resist pattern layer (E) The principal part expanded sectional view which shows the state which dry-etched the DLC layer and formed the gravure cell in the said DLC layer, (f) The principal part expanded sectional view which shows the state which peeled the DLC coating layer That. It is a flowchart which shows the process order of the manufacturing method of the gravure cylinder shown in FIG. In Example 1, it is an enlarged photograph of the state which formed the DLC coating pattern layer on the DLC layer. In Example 2, it is an enlarged photograph in the state where the gravure cell was formed in the DLC layer.

  Embodiments of the present invention will be described below, but these embodiments are exemplarily shown, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention.

  In FIG. 1, the code | symbol 10 shows the gravure cylinder (gravure plate) which concerns on this invention. Reference numeral 12 denotes a plate base material, and the plate base material 12 is a metal cylindrical metal base material on which the DLC layer 14 can be formed. The plate base material 12 may be any metal as long as the DLC layer 14 can be formed on the surface. For example, the plate base material 12 is selected from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, and aluminum. It can be composed of at least one material. Of course, since it is at least one kind of material, it may be an alloy.

  Further, the cylindrical metal base material which is the plate base material 12 may be provided on a CFRP (carbon fiber reinforced resin) material, or provided on a cushion layer made of rubber or a resin having cushioning properties. It is good also as a structure.

  First, a plate base material 12 is prepared, a DLC layer 14 is formed on the plate base material 12, a DLC coating layer 16 is formed on the DLC layer 14 with an etchable material, and the DLC coating layer 16 is formed on the DLC coating layer 16. A photoresist layer 18 is formed by applying a photoresist (step 100 in FIG. 1A and FIG. 2). As the photoresist, both positive and negative photoresists can be applied.

  In forming the DLC layer, the DLC layer can be formed by a CVD (Chemical Vapor Deposition) method or a sputtering method.

  The DLC coating layer 16 can be formed on the DLC layer 14 and is not particularly limited as long as it is an etchable material. However, nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, aluminum, cobalt, It is preferably composed of at least one material selected from the group consisting of indium, tin and silicon. Of course, since it is at least one kind of material, it may be an alloy or a compound.

  In forming the DLC coating layer, any known method such as plating, vapor deposition, CVD, PVD, sputtering, etc. can be applied. From the viewpoint of production efficiency, it is preferable to form the DLC coating layer by plating.

  Next, the photoresist layer 18 is exposed and developed to form a resist pattern layer 20 (step 102 in FIG. 1B and FIG. 2). Then, the DLC coating layer 16 is etched to form the DLC coating pattern layer 22 (step 104 in FIG. 1C and FIG. 2). In etching the DLC coating layer 16, either wet etching or dry etching may be used.

  Next, the resist pattern layer 20 is removed (step 106 in FIG. 1D and FIG. 2). Then, the DLC layer 14 is dry-etched to form a gravure cell 24 in the DLC layer 14 (step 108 in FIGS. 1E and 2). In dry etching the DLC layer 14, a known dry etching apparatus can be used. For example, ion milling equipment, reactive ion beam etching (RIBE) equipment, reactive ion etching (RIE) equipment, reactive ion etching (MERIE) equipment with improved magnetism, barrel type, parallel plate type, downflow type A dry etching apparatus such as a plasma etching apparatus or a chemical dry etching apparatus can be used.

  Next, the DLC coating layer 16 is peeled off (step 110 in FIG. 1 (f) and FIG. 2). Thus, the gravure cylinder 10 in which the gravure cell 24 is formed on the DLC layer 14 on the plate base material 12 is completed.

  The present invention will be described more specifically with reference to the following examples. However, it is needless to say that these examples are shown by way of illustration and should not be construed in a limited manner.

Example 1
A plate base material (aluminum hollow roll) having a circumference of 600 mm and a surface length of 1100 mm is prepared, and the surface is polished with a four-head type polishing machine (a polishing machine manufactured by Sink Laboratory Co., Ltd.) to make the aluminum surface uniform. It was.
Subsequently, an intermediate layer having a film thickness of 0.1 μm was formed in an argon / hydrogen gas atmosphere, hexamethyldisiloxane as a source gas, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a DLC layer having a thickness of 6 μm was formed as a source gas with toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 240 minutes.

  Next, a 1 μm-thick copper sputtered layer (DLC coating layer) was formed by PVD method in an argon atmosphere, a film forming temperature of 50-80 ° C., and a film forming time of 60 minutes.

Using the formed copper sputtered layer as a base material, a photosensitive film (thermal resist: TSER2104E4 (manufactured by Sink Laboratories)) was applied to the surface (fountain coater) and dried. The film thickness of the obtained photosensitive film was 4 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 300 mJ / cm ² .
The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern.

  Using the formed resist pattern as a mask, a copper chloride corrosive solution was used for 24 seconds at 24 ° C., and the underlying copper sputter layer was wet etched to form a DLC coating pattern layer. Next, using a 5% aqueous sodium hydroxide solution, the resist was stripped by dipping for 120 seconds at a temperature of 24 ° C. A photograph of this state is shown in FIG. In FIG. 3, it can be seen that the DLC coating pattern layer 22 is formed on the DLC layer 14.

  Using a plasma etching apparatus, a DLC layer having a thickness of 5 μm was dry etched in an argon / oxygen atmosphere, an etching temperature of 180 ° C. to 220 ° C., and an etching time of 180 minutes. Next, using a 3% sulfuric acid and 5% hydrogen peroxide aqueous solution, the copper sputter layer was peeled off by immersion for 120 seconds at a temperature of 24 ° C.

  In this way, a gravure cylinder having a gravure cell formed on the DLC layer was obtained.

(Example 2)
A plate base material (aluminum hollow roll) having a circumference of 600 mm and a surface length of 1100 mm is prepared, and the surface is polished with a four-head type polishing machine (a polishing machine manufactured by Sink Laboratory Co., Ltd.) to make the aluminum surface uniform. It was.
Subsequently, an intermediate layer having a film thickness of 0.1 μm was formed in an argon / hydrogen gas atmosphere, hexamethyldisiloxane as a source gas, a film formation temperature of 80 to 120 ° C., and a film formation time of 60 minutes. Next, a DLC layer having a thickness of 6 μm was formed as a source gas with toluene, a film formation temperature of 80 to 120 ° C., and a film formation time of 240 minutes.

  Next, a 1 μm-thick copper sputtered layer (DLC coating layer) was formed by PVD method in an argon atmosphere, a film forming temperature of 50-80 ° C., and a film forming time of 60 minutes.

Using the formed copper sputtered layer as a base material, a photosensitive film (thermal resist: TSER2104E4 (manufactured by Sink Laboratories)) was applied to the surface (fountain coater) and dried. The film thickness of the obtained photosensitive film was 4 μm as measured by a film thickness meter (F20 manufactured by FILLMETRICS, sold by Matsushita Techno Trading). The image was then developed with laser exposure. In the laser exposure, a laser stream FX was used and a predetermined pattern exposure was performed under an exposure condition of 300 mJ / cm ² .
The development was performed at 24 ° C. for 90 seconds at a developer dilution ratio (stock solution 1: water 7) using a TLD developer (Sink Laboratory Co., Ltd. developer) to form a predetermined resist pattern.

  Using the formed resist pattern as a mask, a copper chloride corrosive solution was used for 24 seconds at 24 ° C., and the underlying copper sputter layer was wet etched to form a DLC coating pattern layer. Next, using a 5% aqueous sodium hydroxide solution, the resist was stripped by dipping for 120 seconds at a temperature of 24 ° C.

  Using a plasma etching apparatus, a DLC layer having a thickness of 5 μm was dry etched in an argon / oxygen atmosphere, an etching temperature of 180 ° C. to 220 ° C., and an etching time of 180 minutes. Next, using a 3% sulfuric acid and 5% hydrogen peroxide aqueous solution, the copper sputter layer was peeled off by immersion for 120 seconds at a temperature of 24 ° C.

  Thus, as shown in FIG. 4, a gravure cylinder having a gravure cell formed on the DLC layer was obtained. In FIG. 4, it can be seen that the gravure cell 24 is formed in the DLC layer 14.

10: gravure cylinder, 12: plate base material, 14: DLC layer, 16: DLC coating layer, 18: photoresist layer, 20: resist pattern layer, 22: DLC coating pattern layer, 24: gravure cell.

Claims (8)

  A DLC layer is formed on the plate base material, a DLC coating layer is formed on the DLC layer with an etchable material, a photoresist is applied on the DLC coating layer, and a photoresist layer is formed. A resist layer is exposed and developed to form a resist pattern layer, the DLC coating layer is etched to form a DLC coating pattern layer, the resist pattern layer is peeled off, and the DLC layer is dry etched to form the DLC layer. A gravure cylinder is formed by forming a gravure cell and peeling off the DLC coating layer.   The DLC coating layer is composed of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, aluminum, cobalt, indium, tin, and silicon. The gravure cylinder according to claim 1.   3. The plate base material is composed of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, and aluminum. Gravure cylinder.   The plate base material is a plate base material provided with a cushion layer in which a metal substrate is formed on a cushion layer made of rubber or a resin having cushioning properties. The gravure cylinder described in the section.   Forming a DLC layer on the plate base material, forming a DLC coating layer on the DLC layer with an etchable material, and applying a photoresist on the DLC coating layer to form a photoresist layer; Exposing and developing the photoresist layer to form a resist pattern layer; etching the DLC coating layer to form a DLC coating pattern layer; peeling the resist pattern layer; and the DLC layer A method for producing a gravure cylinder, comprising: a step of dry etching to form a gravure cell in the DLC layer; and a step of peeling the DLC coating layer.   The DLC coating layer is composed of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, aluminum, cobalt, indium, tin, and silicon. A method for producing a gravure cylinder according to claim 5.   7. The plate base material is made of at least one material selected from the group consisting of nickel, tungsten, chromium, titanium, silver, stainless steel, iron, copper, and aluminum. Of manufacturing gravure cylinders.   The plate base material is a plate base material provided with a cushion layer in which a metal substrate is formed on a cushion layer made of rubber or a resin having a cushioning property. The manufacturing method of the gravure cylinder of description.