TW201539624A - 雷射剝離裝置 - Google Patents

雷射剝離裝置 Download PDF

Info

Publication number
TW201539624A
TW201539624A TW104107553A TW104107553A TW201539624A TW 201539624 A TW201539624 A TW 201539624A TW 104107553 A TW104107553 A TW 104107553A TW 104107553 A TW104107553 A TW 104107553A TW 201539624 A TW201539624 A TW 201539624A
Authority
TW
Taiwan
Prior art keywords
laser
workpiece
projection lens
peeling
laser light
Prior art date
Application number
TW104107553A
Other languages
English (en)
Chinese (zh)
Inventor
Keiji Narumi
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014079350A external-priority patent/JP6020505B2/ja
Priority claimed from JP2014079351A external-priority patent/JP6008210B2/ja
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW201539624A publication Critical patent/TW201539624A/zh

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
TW104107553A 2014-04-08 2015-03-10 雷射剝離裝置 TW201539624A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014079350A JP6020505B2 (ja) 2014-04-08 2014-04-08 レーザリフトオフ装置
JP2014079351A JP6008210B2 (ja) 2014-04-08 2014-04-08 レーザリフトオフ装置

Publications (1)

Publication Number Publication Date
TW201539624A true TW201539624A (zh) 2015-10-16

Family

ID=54269484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104107553A TW201539624A (zh) 2014-04-08 2015-03-10 雷射剝離裝置

Country Status (3)

Country Link
KR (1) KR20150116778A (ko)
CN (1) CN104972231A (ko)
TW (1) TW201539624A (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101600913B1 (ko) 2016-01-22 2016-03-08 주식회사 덕인 레이저 리프트 오프 장치 및 그를 이용한 레이저 리프트 오프 방법
JP6999264B2 (ja) 2016-08-04 2022-01-18 株式会社日本製鋼所 レーザ剥離装置、レーザ剥離方法、及び有機ｅｌディスプレイの製造方法
KR102167268B1 (ko) * 2019-02-11 2020-10-19 (주)에스티아이 불량 led 제거 장치
JP2020175412A (ja) * 2019-04-18 2020-10-29 株式会社ブイ・テクノロジー レーザリフトオフ用装置及びレーザリフトオフ方法
KR102297791B1 (ko) * 2019-11-13 2021-09-03 한국광기술원 레이저를 이용하여 전사 대상물을 분리하고 전사하는 장치 및 방법
CN118404905B (zh) * 2024-07-04 2024-09-06 绍兴圆炬科技有限公司 一种用于芯片转印的激光设备及其控制方法

Also Published As

Publication number Publication date
CN104972231A (zh) 2015-10-14
KR20150116778A (ko) 2015-10-16

Similar Documents

Publication Publication Date Title
TW201539624A (zh) 雷射剝離裝置
US9387554B2 (en) Laser processing apparatus
CN102024886B (zh) 晶片的加工方法
JP6008210B2 (ja) レーザリフトオフ装置
JP4705450B2 (ja) ウェーハの保持機構
US8735772B2 (en) Method and apparatus for improved laser scribing of opto-electric devices
KR101539836B1 (ko) 스크라이빙 정렬의 온-더-플라이 제어로 실질적인 평면 반도체 기판을 스크라이빙하는 방법 및 장치
US20170106471A1 (en) Laser processing apparatus
TWI695750B (zh) 雷射處理裝置整流裝置以及雷射處理裝置
CN101989640A (zh) 晶片加工方法
JP6346827B2 (ja) 加工方法
JP2013175642A (ja) ウェーハのレーザー加工方法
JP2016022483A (ja) チャックテーブル及びレーザー切断装置
JP2016025112A (ja) レーザー切断方法及びレーザー加工装置
JP6020505B2 (ja) レーザリフトオフ装置
CN114505603A (zh) 卡盘工作台和激光加工装置
JP2006294807A (ja) ウエーハの分割方法
KR101161731B1 (ko) 레이저 가공장치 및 가공방법
CN111326469A (zh) 元件阵列的制造装置和特定元件的除去装置
TW201429594A (zh) 藍寶石切割裝置
JP2005252176A (ja) 基板処理装置および基板処理方法
US20220001494A1 (en) Laser processing device and laser processing method
US11413708B2 (en) Workpiece cutting method
JP5808182B2 (ja) レーザー加工装置用のノズルクリーナ
JP2011189400A (ja) レーザー加工装置