TW201530602A - 應用電子束誘發電漿探針以檢測、測試、偵錯及表面改質 - Google Patents
應用電子束誘發電漿探針以檢測、測試、偵錯及表面改質 Download PDFInfo
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- TW201530602A TW201530602A TW103134654A TW103134654A TW201530602A TW 201530602 A TW201530602 A TW 201530602A TW 103134654 A TW103134654 A TW 103134654A TW 103134654 A TW103134654 A TW 103134654A TW 201530602 A TW201530602 A TW 201530602A
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- Prior art keywords
- electron beam
- sample
- plasma
- electron
- vacuum envelope
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Links
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
- G01N27/68—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using electric discharge to ionise a gas
- G01N27/70—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using electric discharge to ionise a gas and measuring current or voltage
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
- G01R1/072—Non contact-making probes containing ionised gas
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
- H01J37/3233—Discharge generated by other radiation using charged particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J2237/16—Vessels
- H01J2237/164—Particle-permeable windows
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
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- H01J2237/18—Vacuum control means
- H01J2237/188—Differential pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2240/00—Testing
- H05H2240/10—Testing at atmospheric pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/40—Surface treatments
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Multimedia (AREA)
- Biochemistry (AREA)
- Electrochemistry (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma Technology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Drying Of Semiconductors (AREA)
- Electron Sources, Ion Sources (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361886625P | 2013-10-03 | 2013-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201530602A true TW201530602A (zh) | 2015-08-01 |
Family
ID=52779296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103134654A TW201530602A (zh) | 2013-10-03 | 2014-10-03 | 應用電子束誘發電漿探針以檢測、測試、偵錯及表面改質 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160299103A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2017502484A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20160066028A (cg-RX-API-DMAC7.html) |
| CN (1) | CN105793716A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201530602A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2015051175A2 (cg-RX-API-DMAC7.html) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759658B (zh) * | 2018-12-31 | 2022-04-01 | 荷蘭商Ａｓｍｌ荷蘭公司 | 運用多重射束進行透鏡內之晶圓預充電及檢測 |
| TWI767385B (zh) * | 2019-10-31 | 2022-06-11 | 德商卡爾蔡司Ｓｍｔ有限公司 | 半導體檢查裝置以及用以分析在一積體半導體裝置內的一組ｈａｒ結構的方法 |
| TWI795969B (zh) * | 2020-12-24 | 2023-03-11 | 大陸商中微半導體設備（上海）股份有限公司 | 用於電容耦合等離子處理器阻抗特性測量的測量裝置和方法、電容耦合等離子處理器 |
| TWI828021B (zh) * | 2020-12-22 | 2024-01-01 | 德商卡爾蔡司Ｓｍｔ有限公司 | 用於修復微影光罩缺陷之方法和裝置以及執行修復微影光罩缺陷的方法之電腦程式載體 |
| US12469669B2 (en) | 2020-08-21 | 2025-11-11 | Asml Netherlands B.V. | Printed circuit board for sealing vacuum system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013012616A2 (en) | 2011-07-15 | 2013-01-24 | Orbotech Ltd. | Electrical inspection of electronic devices using electron-beam induced plasma probes |
| EP3066341B1 (en) * | 2013-11-04 | 2021-03-24 | Aerojet Rocketdyne, Inc. | Ground based systems and methods for testing reaction thrusters |
| CN104962863B (zh) * | 2015-05-06 | 2018-05-25 | 中国科学院广州能源研究所 | 一种原子级真空气态3d打印系统 |
| US20160368056A1 (en) * | 2015-06-19 | 2016-12-22 | Bharath Swaminathan | Additive manufacturing with electrostatic compaction |
| US10497541B2 (en) | 2016-05-19 | 2019-12-03 | Nedal Saleh | Apparatus and method for programmable spatially selective nanoscale surface functionalization |
| CN106199392B (zh) * | 2016-06-27 | 2019-02-12 | 中国科学院深圳先进技术研究院 | 芯片单粒子效应探测方法及装置 |
| UA126968C2 (uk) * | 2016-06-29 | 2023-03-01 | Тае Текнолоджіз, Інк. | Комбінації проводу з потокової петлі і мініатюрного індуктивного зонда з мінеральною ізоляцією |
| JP7042071B2 (ja) * | 2016-12-20 | 2022-03-25 | エフ・イ－・アイ・カンパニー | ｅビーム操作用の局部的に排気された容積を用いる集積回路解析システムおよび方法 |
| KR20200022493A (ko) * | 2017-08-02 | 2020-03-03 | 에이에스엠엘 네델란즈 비.브이. | 전압 대비 결함 신호를 향상시키는 하전 입자 플러딩을 위한 시스템 및 방법 |
| KR102399898B1 (ko) * | 2017-09-26 | 2022-05-19 | 에이에스엠엘 네델란즈 비.브이. | 후방 산란 입자에 의한 매립된 피쳐의 검출 |
| US11179808B1 (en) | 2018-07-11 | 2021-11-23 | Rosemount Aerospace Inc. | System and method of additive manufacturing |
| US11491575B2 (en) | 2019-04-16 | 2022-11-08 | Arcam Ab | Electron beam melting additive manufacturing machine with dynamic energy adjustment |
| CN110945641B (zh) * | 2019-10-30 | 2021-06-08 | 长江存储科技有限责任公司 | 用于校准粒子束的垂直度的方法以及应用于半导体制造工艺的系统 |
| KR102411068B1 (ko) * | 2020-08-14 | 2022-06-22 | 주식회사 아이에스시 | 피검사 디바이스의 온도 조절을 위한 온도 조절 장치 |
| US11664189B2 (en) * | 2020-10-04 | 2023-05-30 | Borries Pte. Ltd. | Apparatus of charged-particle beam such as scanning electron microscope comprising plasma generator, and method thereof |
| CN114256058B (zh) * | 2021-07-08 | 2025-09-09 | 宁波伯锐锶电子束科技有限公司 | 一种亲水性基片制作方法及装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5902741A (en) * | 1986-04-18 | 1999-05-11 | Advanced Tissue Sciences, Inc. | Three-dimensional cartilage cultures |
| US6172363B1 (en) * | 1996-03-05 | 2001-01-09 | Hitachi, Ltd. | Method and apparatus for inspecting integrated circuit pattern |
| US6952108B2 (en) * | 2003-09-16 | 2005-10-04 | Micron Technology, Inc. | Methods for fabricating plasma probes |
| EP1798751A1 (en) * | 2005-12-13 | 2007-06-20 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Protecting aperture for charged particle emitter |
| JP2008292372A (ja) * | 2007-05-25 | 2008-12-04 | Oht Inc | 検査支援システムを搭載する回路検査装置とその検査支援方法 |
| US20100068408A1 (en) * | 2008-09-16 | 2010-03-18 | Omniprobe, Inc. | Methods for electron-beam induced deposition of material inside energetic-beam microscopes |
| US20130245505A1 (en) * | 2011-04-08 | 2013-09-19 | The Board of Trustees of the Leland Stanford Junior University | Noninvasive Ultrasound-Based Retinal Stimulator: Ultrasonic Eye |
| WO2013012616A2 (en) * | 2011-07-15 | 2013-01-24 | Orbotech Ltd. | Electrical inspection of electronic devices using electron-beam induced plasma probes |
| US8716673B2 (en) * | 2011-11-29 | 2014-05-06 | Fei Company | Inductively coupled plasma source as an electron beam source for spectroscopic analysis |
-
2014
- 2014-10-02 WO PCT/US2014/058899 patent/WO2015051175A2/en not_active Ceased
- 2014-10-02 CN CN201480054629.2A patent/CN105793716A/zh active Pending
- 2014-10-02 US US15/026,953 patent/US20160299103A1/en not_active Abandoned
- 2014-10-02 JP JP2016546884A patent/JP2017502484A/ja active Pending
- 2014-10-02 KR KR1020167010496A patent/KR20160066028A/ko not_active Withdrawn
- 2014-10-03 TW TW103134654A patent/TW201530602A/zh unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759658B (zh) * | 2018-12-31 | 2022-04-01 | 荷蘭商Ａｓｍｌ荷蘭公司 | 運用多重射束進行透鏡內之晶圓預充電及檢測 |
| TWI767385B (zh) * | 2019-10-31 | 2022-06-11 | 德商卡爾蔡司Ｓｍｔ有限公司 | 半導體檢查裝置以及用以分析在一積體半導體裝置內的一組ｈａｒ結構的方法 |
| US12469669B2 (en) | 2020-08-21 | 2025-11-11 | Asml Netherlands B.V. | Printed circuit board for sealing vacuum system |
| TWI828021B (zh) * | 2020-12-22 | 2024-01-01 | 德商卡爾蔡司Ｓｍｔ有限公司 | 用於修復微影光罩缺陷之方法和裝置以及執行修復微影光罩缺陷的方法之電腦程式載體 |
| TWI795969B (zh) * | 2020-12-24 | 2023-03-11 | 大陸商中微半導體設備（上海）股份有限公司 | 用於電容耦合等離子處理器阻抗特性測量的測量裝置和方法、電容耦合等離子處理器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017502484A (ja) | 2017-01-19 |
| WO2015051175A3 (en) | 2015-11-19 |
| KR20160066028A (ko) | 2016-06-09 |
| US20160299103A1 (en) | 2016-10-13 |
| WO2015051175A2 (en) | 2015-04-09 |
| CN105793716A (zh) | 2016-07-20 |
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