TW201522693A - 在一真空鍍覆設備中將基材作真空處理的處理裝置以及具有一處理裝置的真空鍍覆設備 - Google Patents

在一真空鍍覆設備中將基材作真空處理的處理裝置以及具有一處理裝置的真空鍍覆設備 Download PDF

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Publication number
TW201522693A
TW201522693A TW103138328A TW103138328A TW201522693A TW 201522693 A TW201522693 A TW 201522693A TW 103138328 A TW103138328 A TW 103138328A TW 103138328 A TW103138328 A TW 103138328A TW 201522693 A TW201522693 A TW 201522693A
Authority
TW
Taiwan
Prior art keywords
vacuum
carrier device
substrate carrier
substrate
suction
Prior art date
Application number
TW103138328A
Other languages
English (en)
Chinese (zh)
Inventor
Andreas Caspari
Gerd Ickes
Torsten Schmauder
Ludger Urban
Andre Herzog
Peter Sauer
Original Assignee
Leybold Optics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Optics Gmbh filed Critical Leybold Optics Gmbh
Publication of TW201522693A publication Critical patent/TW201522693A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW103138328A 2013-11-06 2014-11-05 在一真空鍍覆設備中將基材作真空處理的處理裝置以及具有一處理裝置的真空鍍覆設備 TW201522693A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013112180 2013-11-06

Publications (1)

Publication Number Publication Date
TW201522693A true TW201522693A (zh) 2015-06-16

Family

ID=52450037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138328A TW201522693A (zh) 2013-11-06 2014-11-05 在一真空鍍覆設備中將基材作真空處理的處理裝置以及具有一處理裝置的真空鍍覆設備

Country Status (2)

Country Link
TW (1) TW201522693A (fr)
WO (1) WO2015067665A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646868B (zh) * 2015-11-05 2019-01-01 德商比埃勒阿爾策瑙有限公司 用於真空塗佈之設備與製程

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3731688A1 (de) 1987-09-21 1989-03-30 Degussa Verfahren zur katalytischen umsetzung von kohlenwasserstoff, halogenkohlenwasserstoff und kohlenmonoxid enthaltenden abgasen
JP4099092B2 (ja) * 2002-03-26 2008-06-11 東京エレクトロン株式会社 基板処理装置および基板処理方法、高速ロータリバルブ
EP1947211A1 (fr) 2006-12-05 2008-07-23 Galileo Vacuum Systems S.p.A. Dispositif de métallisation sous vide
JP5545061B2 (ja) * 2010-06-18 2014-07-09 東京エレクトロン株式会社 処理装置及び成膜方法
DE102010032591A1 (de) 2010-07-23 2012-01-26 Leybold Optics Gmbh Vorrichtung und Verfahren zur Vakuumbeschichtung
CN201971892U (zh) * 2011-01-17 2011-09-14 东莞市汇成真空科技有限公司 一种用于真空镀膜机均匀抽气的抽气口及其接头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI646868B (zh) * 2015-11-05 2019-01-01 德商比埃勒阿爾策瑙有限公司 用於真空塗佈之設備與製程

Also Published As

Publication number Publication date
WO2015067665A1 (fr) 2015-05-14

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