TW201522606A - 用於可熱成型電路的導熱介電質 - Google Patents
用於可熱成型電路的導熱介電質 Download PDFInfo
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Abstract
本發明是關於一種聚合物厚膜導熱可熱成型的介電質組成物,其包含聚胺甲酸酯樹脂(urethane resin)、熱塑性苯氧樹脂、二丙酮醇、以及導熱粉末。由該組成物製成的介電質可用於各種電子應用以保護電性元件,特別是用於電容式開關應用以隔絕及保護傳導性可熱成型銀及聚碳酸酯基板。該熱成型電路接著經射出成型製程處理。
Description
本發明係關於一種具有導熱性之聚合物厚膜可熱成型介電質組成物。由該組成物製成的介電質可用於各種電子應用以保護電性元件,特別是提供導熱性給電容式開關。
長期以來,介電質係用於保護電性元件。其也被用來作為隔離層。雖然其已在這類應用中使用多年,但在熱成型程序期間內使用介電質當作熱導體並不常見。這在使用高傳導性銀之可熱成型的電容式電路中特別重要,而且必須防止熱積聚在該電路內。熱會對電路性能產生有害效應,其經常造成非所欲之電阻偏移。本發明的其中一個目的係為減輕這個問題,以及生產一種其中可處理所產生熱之可熱成型的電容式構造。
本發明係關於一種聚合物厚膜導熱可熱成型介電質組成物,其包含:(a)10至35重量百分比的第一有機介質,其包含溶解於50至90重量百分比的第一有機溶劑中之10至50重量百分比的聚胺甲酸酯樹脂(urethane resin),其中聚胺甲酸酯樹
脂與第一有機溶劑的重量百分比係以第一有機介質的總重量為基礎;(b)10至35重量百分比的第二有機介質,其包含溶解於50至90重量百分比的第二有機溶劑中之10至50重量百分比的熱塑性苯氧樹脂,其中熱塑性苯氧樹脂與第二有機溶劑的重量百分比係以第二有機介質的總重量為基礎;(c)2至20重量百分比的二丙酮醇,其中重量百分比係以組成物的總重量為基礎;以及(d)1至70重量百分比的導熱粉末;其中第一有機介質、第二有機介質、二丙酮醇及導熱粉末的重量百分比係以組成物的總重量為基礎。
本發明進一步關於使用導熱可熱成型的介電質,以在可熱成型電容式電路中形成保護及/或絕緣層。
本發明係關於一種用於熱成型電路中之聚合物厚膜導熱可熱成型介電質組成物。
常用於聚合物厚膜可熱成型電容式電路中的基板係聚碳酸酯(PC)。PC基本上是較佳的,因為其可輕易地予以熱成型。然而,PC對於用在沈積於其上之層中的溶劑非常敏感。不適當的溶劑可導致且將導致PC基板龜裂或產生裂紋。
聚合物厚膜(PTF)導熱可熱成型介電質組成物由下
列組成:(i)二種有機介質,其包含溶解在相同或不同有機溶劑中的二種聚合物樹脂;(ii)二丙酮醇有機溶劑;及(iii)導熱粉末。此外,可添加粉末及印刷助劑到該組成物。
在一實施例中,該聚合物厚膜導熱可熱成型介電質組
成物亦可被描述為包含聚胺甲酸酯樹脂、熱塑性苯氧樹脂、二丙酮醇以及選自由氮化硼、氮化鋁及氧化鋁所組成之群組的導熱粉末。
第一有機介質係由溶解在第一有機溶劑中的聚胺甲酸酯樹脂所組成。聚胺甲酸酯樹脂必須良好地黏著至二種電性元件,例如,沈積於其上的銀層以及被其沈積於上的底層基板。聚胺甲酸酯樹脂也必須提供彈性以供熱成型。它必須與電性元件相容且不會不利地影響電性元件的性能。
在一實施例中,聚胺甲酸酯樹脂佔第一有機介質之總重量的10至50重量百分比,且第一有機溶劑佔50至90重量百分比。在另一實施例中,聚胺甲酸酯樹脂佔第一有機介質之總重量的25至45重量百分比,且第一有機溶劑佔55至75重量百分比。在又一實施例中,聚胺甲酸酯樹脂佔第一有機介質之總重量的15至25重量百分比,且第一有機溶劑佔75至85重量百分比。在一實施例中,聚胺甲酸酯樹脂係聚胺甲酸酯彈性體。在另一實施例中,聚胺甲酸酯樹脂係以聚酯為主的共聚物。
第二有機介質係由溶解在可與第一有機溶劑相同之
第二有機溶劑中的苯氧樹脂所組成。亦可使用不同的溶劑。苯氧樹脂為組成物帶來高溫性能,此有助於使用此介電質作為焊料遮罩(若有需要),且亦改善透濕性。亦即是,它有助於妨礙濕氣透過該組成物。在一實施例中,苯氧樹脂佔第二有機介質之總重量的10至50重量百分比,且第二有機溶劑佔50至90重量百分比。在另一實施例中,苯氧樹脂佔第二有機介質之總重量的20至35重量百分比,且第二有機溶劑佔65至80重量百分比。
在一實施例中,各介質佔該組成物之總重量的10至
35重量百分比。在另一實施例中,各介質佔該組成物之總重量的15至30重量百分比。
雖然較佳的是分開製備二種有機介質,但是假如二種
介質使用相同溶劑,則可使用均等於以上所說明之二種有機介質的單一有機介質。典型藉由機械混合將聚合物樹脂添加至有機溶劑以形成介質。
適用於聚合物厚膜組成物之有機介質的溶劑係為熟
悉此項技術者所了解,且包括乙酸酯和萜烯(terpenes),例如,卡必醇乙酸酯及α-或β-松脂醇(alpha- or beta-terpineol)或其與其他溶劑的混合物,例如與煤油、鄰苯二甲酸二丁酯、丁基卡必醇、丁基卡必醇乙酸酯、2-甲-2,4-戊二醇以及高沸點醇和醇酯的混合物。此外,可將揮發性液體包含在其中,以便於在將其塗覆到基板上後促進快速硬化。在本發明許多實施例中,可使用之溶劑如乙二醇醚類、酮
類、酯類與其他具類似沸點(範圍為介於180℃至250℃)的溶劑與其混合物。配製這些和其他溶劑的不同組合,以獲得所需的黏度和揮發性需求。所用的溶劑必須使樹脂溶解。
聚合物厚膜導熱可熱成型介電質組成物亦包含有機溶劑二丙酮醇。此特定溶劑已經顯示與PC相容並且不會造成該基板產生任何明顯的裂紋。在一實施例中,二丙酮醇佔該組成物之總重量的2至20重量百分比。在另一實施例中,二丙酮醇佔總重量的3至10重量百分比,此係以組成物之總重量為基礎,而且在又另一項實施例中,二丙酮醇佔組成物之總重量的4至6重量百分比。
導熱粉末包括此類粉末。在一實施例中,導熱粉末的量佔整個組成物之總重量的1至70%。在另一實施例中,導熱粉末佔整個組成物之總重量的20至60重量百分比,而且在又另一實施例中,導熱粉末佔整個組成物之總重量的40至55重量百分比。較佳的是將導熱粉末的顆粒尺寸維持在1至10微米的範圍中,以避免任何龜裂問題。
可將各種粉末添加至PTF濕氣障壁層介電質組成
物,以改善黏附力、修改流變性及增加低剪切黏度,從而改善印刷性。一種此類粉末係白煙矽,已發現其可明顯改善對濕氣滲透的抵抗性。
PTF導熱可熱成型介電質組成物(亦稱為「糊」)通常被沈積於不太為氣體及濕氣所滲透的基板上,如聚碳酸酯。該基板亦可為由塑膠薄板與沈積至其上之選用的金屬或介電層的組合所構成的複合材料薄板。在其它構造中,該導熱可熱成型的介電質可被沈積在現有的銀/介電質構造上。
PTF導熱可熱成型介電質組成物的沈積通常藉由網版印刷進行,但也可利用其他沈積技術例如刻板印刷、注射佈著或塗佈技術等。在網板印刷的情況中,網目尺寸能夠控制所沈積的厚膜之厚度。
一般而言,厚膜組合物包括功能相,該功能相能夠賦予該組合物適當的電功能特性。該功能相包括分散在有機介質中的電功能性粉末,而該有機介質則充當功能相的載體。一般而言,該組成物經過燒製,以燒盡有機介質的聚合物及溶劑兩者,並賦予電功能性質。然而,在聚合物厚膜的情況中,有機介質的聚合物部分在乾燥後仍為該組成物之整體部分。
PTF導熱可熱成型介電質組成物係經必要的時間及溫
度處理,以移除所有溶劑。例如,所沈積的厚膜通常藉由暴露於130℃之熱度達10至15分鐘來予以乾燥。
所使用的基礎基板典型為10密耳厚的聚碳酸酯。濕氣障壁層介電質(例如US 8,785,799所說明者)係按照上文所述之條件予以印刷及乾燥。可印刷及乾燥數層。接著印刷及乾燥可熱成型的傳導性銀組成物(譬如DuPont 5043),該印刷及乾燥條件與障壁層所使用的條件相同。然後也可在銀導體上面印刷濕氣障壁層,以形成保護性夾層。接著沈積導熱可熱成型介電質。接下來的步驟包括熱成型整個單元,此在3D電路的製造上是典型的。假如沒有使用濕氣障壁層介電質,銀組成物將接觸滲透過聚碳酸酯基板之濕氣且該功能性電路將受損,通常導致壽命縮短。
在生產三維電容式電路的過程中,於熱成型步驟後,最終步驟通常是模塑步驟,其中電路成品係藉由使用樹脂(如聚碳酸酯)射出成型來形成。這個製程稱為模內成型,並且涉及更高的溫度。取決於所選擇的樹脂,這些溫度通常可超過250℃達10至30秒。因此,選擇使用於PTF組成物中的樹脂至關重要。本發明之PTF組成物中所使用的樹脂組合已顯示可耐受模內成型製程,並產生具完整功能之電路,但典型用於PTF組成物中的大部分樹脂無法如此。
PTF導熱可熱成型介電質組成物係以下列方式製備。第一有機介質之製備係藉由混合20.0重量百分比的聚胺甲酸酯Desmocoll 540(Bayer MaterialScience LLC,Pittsburgh,PA)與80.0重量百分比的二價酸酯(DuPont Co.,Wilmington,DE)(作為有機溶劑)。該樹脂的分子量大約為40.000。此混合物係在90℃加熱1至2小時,以溶解全部的樹脂。第二有機介質之製備係藉由添加27.0重量百分比的PKHH(苯氧基)樹脂(InChem Corp.)至73.0重量百分比的二價酸酯,並如上述加熱。上述重量百分比係分別以各介質之總重量為基礎。所有下述重量百分比係以PTF導熱可熱成型介電質組成物之總重量為基礎。接著添加48.5重量百分比的氮化硼粉末(Saint-Gobain Corp)。添加5重量百分比的二丙酮醇(得自Eastman Chemical,Kingsport,TN),然後混合整個組成物。接著以三滾筒輥磨機將該組成物以150psi的壓力輾壓兩回。
組成物(以該組成物之總重量為基礎)係為:
接著如下述製造電路:在10密耳厚的聚碳酸酯基板上,以200不鏽鋼網版進行如US 8,785,799所述之濕氣障壁介電質
組成物的毯覆印刷(blanket print),且在120℃乾燥10分鐘。然後進行相同組成物的第二印刷並乾燥。銀線的圖案係使用DuPont銀糊5043(DuPont Co.,Wilmington,DE)以280網目不鏽鋼網版印刷。於強制通風箱式烘箱內,將該等圖案化線在120℃乾燥15分鐘。如上述製備的導熱可熱成型介電質組成物係以280 SS網版印刷並在130℃乾燥10分鐘。檢視該部件,沒有發現底層基板出現紋裂或變形跡象。接著使電路經熱成型條件處理(160℃ 10秒)。然後測量並且記錄電阻。該部件隨後經受供電85℃/85%相對濕度(R.H.)100小時以模擬加速老化的情況並且測量電阻。因模擬老化造成之電阻變化被紀錄為△R,並且顯示於表1中。
完全按照實例1所述之方式生產電路。唯一的差別是不使用該導熱可熱成型的介電質組成物。因模擬老化造成之電阻變化被紀錄為△R,並且顯示於表1中。
完全按照實例1所述之方式生產電路。差別是濕氣障壁層介電質組成物被印刷在5043銀導體之下及之上,而且不使用該導熱可熱成型介電質組成物。因模擬老化造成之電阻變化被紀錄為△R,並且顯示於表1中。
因導熱可熱成型介電質所致之性能改善,可從表1所示的結果顯而易見。
Claims (10)
- 一種聚合物厚膜導熱可熱成型介電質組成物,其包含:(a)10至35重量百分比的第一有機介質,其包含溶解於50至90重量百分比的第一有機溶劑中之10至50重量百分比的聚胺甲酸酯樹脂(urethane resin),其中聚胺甲酸酯樹脂與該第一有機溶劑的該重量百分比係以該第一有機介質的該總重量為基礎;(b)10至35重量百分比的第二有機介質,其包含溶解於50至90重量百分比的第二有機溶劑中之10至50重量百分比的熱塑性苯氧樹脂,其中該熱塑性苯氧樹脂與該第二有機溶劑的該重量百分比係以該第二有機介質的該總重量為基礎;(c)2至20重量百分比的二丙酮醇,其中該重量百分比係以該組成物的該總重量為基礎;以及(d)1至70重量百分比的導熱粉末;其中該第一有機介質、該第二有機介質、該二丙酮醇以及該導熱粉末的該重量百分比係以該組成物的該總重量為基礎。
- 如請求項1之聚合物厚膜導熱可熱成型介電質組成物,其中該聚胺甲酸酯樹脂係為一聚胺甲酸酯彈性體或者一以聚酯為主的共聚物,而且該導熱粉末係選自由氮化硼、氮化鋁、氧化鋁、及其混合物所組成之群組。
- 如請求項1之聚合物厚膜導熱可熱成型介電質組成物,其包含: (a)15至35重量百分比的第一有機介質,其包含溶解於75至85重量百分比的第一有機溶劑中之15至25重量百分比的聚胺甲酸酯樹脂,其中該聚胺甲酸酯樹脂與該第一有機溶劑的該重量百分比係以該第一有機介質的該總重量為基礎;(b)15至35重量百分比的第二有機介質,其包含溶解於65至80重量百分比的第二有機溶劑中之20至35重量百分比的熱塑性苯氧樹脂,其中該熱塑性苯氧樹脂與該第二有機溶劑的該重量百分比係以該第二有機介質的該總重量為基礎;(c)3至10重量百分比的二丙酮醇;以及(d)20至60重量百分比的導熱粉末;其中該第一有機介質、該第二有機介質、該二丙酮醇以及該導熱粉末的該重量百分比係以該組成物的該總重量為基礎。
- 一種聚合物厚膜導熱可熱成型介電質組成物,其包含:(a)聚胺甲酸酯樹脂;(b)熱塑性苯氧樹脂;(c)二丙酮醇;以及(d)導熱粉末。
- 如請求項4之聚合物厚膜導熱可熱成型介電質組成物,其中該熱塑性聚胺甲酸酯樹脂係為一聚胺甲酸酯彈性體或者一以聚酯為主 的共聚物,而且該導熱粉末係選自由氮化硼、氮化鋁、氧化鋁、及其混合物所組成之群組。
- 一種電容式開關電路,其包含從如請求項1之聚合物厚膜導熱可熱成型介電質組成物所形成的一導熱可熱成型介電質。
- 如請求項6之電容式開關電路,其進一步包含一聚碳酸酯基板,其中如請求項1之該聚合物厚膜導熱可熱成型介電質組成物的該聚胺甲酸酯樹脂為一聚胺甲酸酯彈性體或者一以聚酯為主的共聚物,而且如請求項1之該聚合物厚膜導熱可熱成型介電質組成物的該導熱粉末係選自由氮化硼、氮化鋁、氧化鋁、及其混合物所組成之群組。
- 如請求項6之電容式開關電路,其中該電路係經熱成型。
- 如請求項7之電容式開關電路,其中該電路係經熱成型。
- 如請求項8之電容式開關電路,其中該電容式開關電路接著經一射出成型製程處理。
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