TW201520057A - Adhesion apparatus - Google Patents

Abstract

The present invention relates to an adhesion apparatus comprising a film transfer part, a coating part for applying a coating liquid to a film, an adhesion part for adhering the film to a substrate, a position detection part for detecting a position, relative to the substrate, of a film before adhesion in a widthwise direction thereof intersecting with a transfer direction, and a position correction mechanism for correcting the relative position of the film based at least on the detection results; an adhesion apparatus comprising a feeding part for rolling out an elongated film comprising a main film material and a protective material, an adhesion part for adhering the main film material to a substrate at an adhesion position while removing the protective material from the main film material, a wind-up part for winding up the removed protective material, a driving part for rotary driving of the wind-up part, a detection part for detecting a wound diameter of the removed protective material, and a control part for controlling the driving part to adjust a rotary torque of the driving part based on the detection results; and an adhesion apparatus comprising a transfer part for transferring a film comprising a main film material and a protective material, a coating part for applying a coating liquid to the main film material, a cutter part for cutting the coated main film material at a predetermined length, an adhesion part for adhering the main film material to the upper surface of a substrate through the coating liquid at an adhesion position while removing the protective material from the main film material, and a contact part for being contacted with the upper surface of the substrate having the film adhered thereon, located in the vicinity of the adhesion position and at a position lower than the upper surface of the substrate at the adhesion position.

Description

Laminating device

The present invention relates to a bonding apparatus.

The present invention claims priority based on Japanese Patent Application No. 2013-114908, Japanese Patent Application No. 2013-114909, and Japanese Patent Application No. 2013-114910, filed on May 31, 2013, .

In the prior art, a bonding apparatus that bonds a film to a substrate while being conveyed is known (for example, see Patent Document 1).

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent No. 4568374

However, in the prior art, it is necessary to apply the adhesive material to the film material before bonding to the substrate, and it is necessary to additionally apply the adhesive. (coating liquid) coating device. Therefore, it is desirable to provide a novel technique for efficiently bonding a film to a substrate by performing a coating process for a film on a single line and a film-to-substrate bonding process after applying an adhesive. .

The present invention has been made in view of such a problem, and a first object thereof is to provide a bonding apparatus capable of efficiently and efficiently applying an adhesive or an adhesive to a substrate in a single production line. Accuracy for the cooperation industry. Further, a second object of the invention is to provide a bonding apparatus which can efficiently perform bonding work in a single production line as described above, and can sufficiently ensure adhesion between a substrate and a film. Further, a third object of the invention is to provide a highly reliable bonding apparatus capable of efficiently performing a bonding operation on a single production line as described above.

In order to achieve the basic object of the present invention in which a bonding agent or an adhesive is applied and bonded to a substrate by a single production line, the basic aspect of the present invention is characterized in that The film transporting unit, the coating unit, and the bonding unit, wherein the film transporting unit transports the film; the coating unit applies a coating liquid to the film; and the bonding unit bonds the film Combined with the substrate.

In order to achieve the first object, a bonding apparatus (hereinafter referred to as a "bonding device (I)") according to a first aspect of the present invention includes a film conveying unit, a coating unit, and a bonding unit. a position detecting unit and a position correcting unit that transports the film; the coating unit Applying a coating liquid to the film; the bonding portion bonds the film to the substrate; and the position detecting portion detects a film width intersecting the conveying direction of the film before bonding to the substrate a position relative to the substrate in the direction; the position correcting means corrects the relative position based on at least the detection result of the position detecting portion when the film is bonded.

In order to achieve the above-described second object, a bonding apparatus according to a second aspect of the present invention (hereinafter referred to as a "bonding device (II)") includes a film feeding portion, a bonding portion, and a winding portion. a driving unit, a detecting unit, and a control unit, wherein the film feeding unit sends the long film including the main film material and the protective material; and the bonding portion is configured to remove the protective material from the main film at the film bonding position. The material is peeled off and only the main film material is bonded to the substrate; the winding portion is wound from the protective material after peeling off the main film material; the driving portion is rotationally driven by the winding portion; the detecting portion is The winding diameter of the protective material wound around the winding unit is detected, and the control unit controls the driving unit to adjust the rotational torque of the winding unit based on the detection result of the detecting unit.

In order to achieve the third object, a bonding apparatus according to a third aspect of the present invention (hereinafter referred to as "bonding device (III)") includes a conveying unit, a coating unit, a cutter unit, and a sticker. a joint portion that conveys a film including a main film material and a protective material, and a coating portion that applies a coating liquid onto the main film material of the film; the cutter portion The main film material coated with the coating liquid is cut into a predetermined length; the bonding portion is used to bond the protective material from the foregoing The film is peeled off and the main film material is adhered to the upper surface of the substrate only through the coating liquid; the abutting portion is provided in the vicinity of the film bonding position of the bonding portion and is higher than the aforementioned position at the film bonding position. The upper surface of the substrate is lower and abuts on the substrate above the main film.

A bonding apparatus according to a basic aspect of the present invention includes a film transporting unit, an application unit, and a bonding unit that transports a film; and the coating unit applies a coating liquid to the coating unit. In the above-mentioned film, the film is bonded to the substrate by using the device, and by using the device, it is possible to apply the adhesive or the adhesive to the substrate in a single production line, and to efficiently bond the substrate. . Further, in the present invention, the above-described additional objects can be achieved by the above-described bonding apparatuses (I), (II), and (III) which add an additional feature to the above-described basic mode. Of course, a bonding apparatus that arbitrarily combines the features inherent to the bonding apparatuses (I), (II), and (III) and is attached to the above-described basic state is also included in the scope of the present invention.

Hereinafter, other basic aspects of the bonding apparatus of the present invention will be specifically described.

According to the bonding apparatus (I) of the present invention, since the coating process for applying the coating liquid to the film and the process of bonding the film to the substrate can be performed in a single production line, the film can be efficiently bonded. On the substrate. In addition, in the bonding apparatus (I) of the present invention, since the position correcting mechanism corrects the relative position of the film in the width direction with respect to the substrate, that is, the positional deviation, the substrate and the film can be accurately attached. Hehe.

Further, in the above-described bonding apparatus (I), it is preferable to further include a substrate transporting unit that transports the substrate and is integrally formed with the position correcting mechanism.

According to this configuration, since the substrate transfer portion integrally formed with the position correcting mechanism is provided, the relative position of the substrate with respect to the film can be adjusted while the substrate is being conveyed.

Further, in the above-described bonding apparatus (I), it is preferable that the position correcting means corrects the position of the substrate in a substrate width direction intersecting with a substrate conveying direction in which the substrate is conveyed.

According to this configuration, since the position of the substrate is corrected in the width direction of the substrate, the film is not moved in the width direction, and the relative position of the substrate and the film, that is, the relative positional deviation can be easily and surely corrected.

Further, in the above bonding apparatus (I), it is preferable to further include a cutter for cutting the film coated with the coating liquid to a predetermined length.

According to this configuration, since the film coated with the coating liquid is cut into a predetermined length, it is possible to use a film discharged from a long roll as a film. Therefore, it is possible to use a substrate of various sizes as a substrate to be bonded to the film, and it is possible to provide a highly versatile bonding device. Further, the film discharged from the roll body can be sequentially attached to a plurality of substrates, and the bonding process can be performed more efficiently.

Further, in the above-mentioned bonding apparatus (I), it is preferable that the film includes a main film material and a protective material coated with the coating liquid, and the bonding portion is the protective material from the main film material. Stripped and transparent The main film material is bonded to the substrate through the coating liquid.

According to this configuration, since the main film material bonded to the substrate is protected by the protective material, it is possible to prevent the main film material before being bonded to the substrate from being damaged.

Further, in the above-mentioned bonding apparatus (I), it is preferable that the film inspection unit further includes a film inspection unit that inspects the film bonded to the substrate, and the position correction mechanism is further based on the film inspection unit. The result is detected to correct the aforementioned positional offset.

According to this configuration, since the positional deviation is corrected by feeding back the inspection result of the film attached to the substrate, the adhesion accuracy of the film and the substrate can be further improved.

Further, in the above bonding apparatus (I), it is preferable that the coating portion is coated with an adhesive as the coating liquid.

According to this configuration, since the coating portion is coated with the adhesive, the film and the substrate can be easily bonded by the adhesive.

Further, in the above-described bonding apparatus (I), it is preferable that the conveying unit conveys the film in a direction intersecting with a horizontal plane with respect to the coating unit.

According to this configuration, since the coating liquid is applied to the film that is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the mist from being scattered and falling downward during application, and the film can be stabilized. A thick coating liquid is applied to the film. Therefore, unevenness in the coated surface of the coating liquid can be suppressed.

The laminating device (II) according to the present invention can be used in accordance with the protection The winding amount of the material is changed to change the winding diameter to adjust the rotational torque of the winding portion. Therefore, for example, as the winding diameter is increased, the rotational torque is increased and the protective material is wound up with a strong force. Therefore, the protective material can be supplied to the substrate in a state where a certain tension is applied and transported at a constant speed. Below.

As a result, the main film material peeled off from the protective material is bonded to the substrate by the bonding portion in a state where the conveying speed is constant and the tension is constant. Therefore, the main film material can be bonded to the substrate with a constant tension to obtain good adhesion, and the peeling property of the protective material can be obtained. Further, according to the bonding apparatus (II), since the coating process for applying the coating liquid to the film and the process of bonding the main film material to the substrate can be performed in a single production line, the main assembly can be efficiently performed. The film material is bonded to the substrate.

Further, in the above bonding apparatus (II), it is preferable that the detecting portion detects the winding diameter of the protective member in a non-contact manner.

According to this configuration, since the winding diameter of the protective material can be detected in a non-contact manner, it is possible to prevent the occurrence of a problem that hinders the operation of the winding portion.

Further, in the above bonding apparatus (II), it is preferable that the detecting unit is detected by ultrasonic waves.

According to this configuration, since the detection method by ultrasonic waves is employed, the detection of the winding diameter of the protective material by the non-contact method as described above can be performed simply and surely.

Further, in the above bonding apparatus (II), it is preferable to further include an application portion and a cutter, and the coating portion applies the coating liquid to the aforementioned The main film material of the film; the tool cuts the main film material coated with the coating liquid into a predetermined length.

According to this configuration, since the coating process of the coating liquid can be performed in a single production line, the cutting process of cutting the main film material into a predetermined length, and the process of bonding the main film material to the substrate, The main film material is efficiently bonded to the substrate. Further, since the main film material can be cut into a predetermined length, it is possible to use a film discharged from a long roll as a film. Therefore, it is possible to use a substrate of various sizes as a substrate to be bonded to the film, and it is possible to provide a highly versatile bonding device. Further, the film discharged from the roll body can be sequentially attached to a plurality of substrates, and the bonding process can be performed more efficiently.

Further, in the above bonding apparatus (II), it is preferable that the coating portion is coated with an adhesive or an adhesive as the coating liquid.

According to this configuration, since the coating portion is coated with an adhesive or an adhesive, the film and the substrate can be easily bonded by the adhesive or the adhesive.

Further, in the above bonding apparatus (II), it is preferable that the film is conveyed in a direction crossing the horizontal plane with respect to the coating portion.

According to this configuration, since the coating liquid can be applied to the film that is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the spray from falling and falling downward during application, and the film thickness can be stabilized. The coating liquid is applied to the film. Therefore, unevenness in the coated surface of the coating liquid can be suppressed.

When the main film material is bonded to the substrate, there is a possibility that the rear end portion of the substrate in the transport direction is, for example, the main After the film material is stretched together in the peeling direction of the protective material, the substrate is broken by the action of the separation of the main film material from the protective material to cause the substrate to jump. According to the present bonding apparatus (III) of the present invention, since the abutting portion is pressed in a state in which the upper surface of the substrate is displaced downward, the protective material and the main film can be made when the protective material is stretched in the peeling direction. The material is well separated. Therefore, it is possible to prevent the substrate from jumping due to the stretching of the main film material bonded to the substrate by the protective material. Therefore, it is possible to prevent the occurrence of the problem of breakage due to the jump of the substrate.

Further, according to the bonding apparatus (III), since the coating process for applying the coating liquid to the film and the process of bonding the main film material to the substrate can be performed in a single production line, the main assembly can be efficiently performed. The film material is bonded to the substrate.

Further, in the above bonding apparatus (III), it is preferable that the abutting portion is constituted by a roller member.

According to this configuration, since the abutting portion is constituted by the roller member, the substrate is not damaged at the time of abutment. Further, it is possible to prevent the occurrence of the problem of hindering the conveyance of the substrate by rotating the roller member.

Further, in the above bonding apparatus (III), it is preferable that the abutting portion is displaced at least in the vertical direction by the spring member.

According to this configuration, when the substrate comes into contact with the abutting portion, the abutting portion is displaced upward by the spring member to be retracted, and the substrate can be smoothly guided below the abutting portion. Therefore, it is possible to prevent the occurrence of a problem in which the substrate is prevented from being transported by the contact portion.

Further, in the above bonding apparatus (III), it is preferable that the bonding unit includes a first conveying roller and a film bonding roller, and the first The transport roller transports the substrate by constituting a part of the transport unit, and the film attaching roller is capable of moving up and down with respect to the first transport roller, and holding the substrate and the film between the substrate and the first transport roller. In the meantime, the film is bonded to the substrate, and the film bonding roller is lowered when the leading end of the substrate conveyed by the conveying unit reaches the film bonding position.

According to this configuration, since the film bonding roller is lowered in accordance with the timing at which the leading end of the substrate in the conveying direction reaches the film bonding position, the film can be bonded to the substrate in a good alignment.

Further, in the above-described bonding apparatus (III), it is preferable that the cutter portion cut the film so as to include a bonding portion bonded to the substrate and a non-bonding portion not bonded to the substrate. .

According to this configuration, by providing a non-bonding portion that is appropriately set in accordance with, for example, the conveyance speed of the substrate, the lifting speed of the film bonding roller, and the like, the alignment of the film bonding start position and the leading end of the substrate in the conveying direction can be made. Easy.

Further, in the above-described bonding apparatus (III), it is preferable to further include a nip portion that is provided on the downstream side in the conveying direction of the substrate with respect to the abutting portion, and passes through the abutting portion The substrate is sandwiched, and the nip portion includes a transport roller and a nip roller, and the transport roller transports the substrate; the nip roller is disposed on the upper side with respect to the transport roller, and the substrate is sandwiched between the substrate The abutting portion is disposed on the lower side in the vertical direction of the nip roller with the conveying roller.

According to this configuration, when the substrate is sandwiched between the nip portions in the transport direction distal end side, the rear end side in the transport direction abuts against the contact portion and is bent downward. Therefore, the abutting portion can surely suppress the rear end portion in the conveying direction, and the substrate can be more reliably prevented from jumping.

Further, in the above-mentioned bonding apparatus (III), it is preferable that the film is formed by winding a long sheet member into a roll, and the conveying unit is wound from the film bonding position from the main body. The winding portion of the protective material after the film material is peeled off is conveyed to the substrate by the sheet member discharged from the winding body by the winding operation of the protective material by the winding unit.

According to this configuration, the film discharged from the wrap can be sequentially attached to a plurality of substrates, and the lamination process can be performed more efficiently. Moreover, the operation of transporting the film can be easily and surely performed by winding the take-up portion to take action of the protective material.

Further, in the above bonding apparatus (III), it is preferable that the coating portion is coated with an adhesive or an adhesive as the coating liquid.

According to this configuration, since the coating portion is coated with an adhesive or an adhesive, the film and the substrate can be easily bonded by the adhesive or the adhesive.

Further, in the above bonding apparatus (III), it is preferable that the film is conveyed in a direction intersecting the horizontal plane with respect to the coating portion.

According to this configuration, since the coating liquid can be applied to the film that is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the spray from falling and falling downward during application, and the film thickness can be stabilized. Coating The liquid is applied to the film. Therefore, unevenness in the coated surface of the coating liquid can be suppressed.

According to the bonding apparatus (I) of the present invention, when an adhesive or an adhesive is applied and bonded to a substrate by a single production line, the bonding work can be performed efficiently and with high precision. According to the bonding apparatus (II) of the present invention, when the adhesive or the adhesive is applied and bonded to the substrate by a single production line, the bonding work can be efficiently performed, and the substrate and the film are sufficiently ensured. Adhesion. According to the bonding apparatus (III) of the present invention, it is possible to provide a device which can efficiently perform the bonding work by applying the adhesive to a single production line and bonding the substrates.

1‧‧‧Substrate

N‧‧‧Binder

R‧‧‧ 卷卷

33‧‧‧4th substrate transfer roller unit (holding unit)

33a‧‧‧Bottom roller (transport roller)

33b‧‧‧Upper roller (clamping roller)

51‧‧‧ Film Reeling Department

54‧‧‧ Drive Department

55‧‧‧Revolving Department Control Department

56‧‧‧Detection Department

60‧‧‧ film

61‧‧‧Main film

62‧‧‧Protective materials

100 (IA, IB, IC, ID, IIA, IIB, IIC, IID, IIIA, IIIB, IIIC, IIID) ‧‧‧ affixing device

104‧‧‧film transport department

105‧‧‧Film Fitting Department

105a‧‧‧Film bonding position

106‧‧‧ Coating Department

109‧‧‧Film position detection department

111‧‧‧Location Correction Mechanism

136‧‧‧Substrate abutment

136a‧‧‧Roll member

136b‧‧ ‧ spring components

48, 160‧‧‧Tools Department

H1, H2, H3‧‧‧ height

[Fig. 1] is a side view showing a schematic structure of a bonding apparatus (I) of the first embodiment.

[Fig. 2] A cross-sectional view showing a schematic structure of a first adsorption roller and a second adsorption roller.

[Fig. 3] is a view showing a schematic structure of a cutter portion and a laminated structure of a film.

[Fig. 4] A view showing a schematic structure of a film position detecting unit.

[Fig. 5] is a view showing the structure of an important part of the position correcting mechanism.

[Fig. 6] is a schematic view showing a structure of an important portion of a coating portion.

[Fig. 7] is a view showing the operation of the tip end of the nozzle with respect to the film.

[Fig. 8] is a view showing the operation of the tip end of the nozzle in the case where the rotating portion is not provided.

[Fig. 9] is a schematic view showing the structure of the periphery of the application portion.

[Fig. 10] is a schematic view showing the structure of a spray recovery mechanism.

[Fig. 11] is a view showing a peripheral structure of a film thickness adjusting mechanism.

[Fig. 12] is a flow chart for explaining a bonding process of a film by the bonding apparatus (I).

Fig. 13 is a view showing a schematic configuration of a second embodiment of the bonding apparatus (I).

[Fig. 14] is a film of the second embodiment of the bonding apparatus (I), the seventh embodiment of the bonding apparatus (II), or the inspection unit of the seventh embodiment of the bonding apparatus (III) An illustration of the inspection method.

Fig. 15 is a view showing a schematic configuration of a third embodiment of the bonding apparatus (I).

[Fig. 16] shows the structure of the film thickness adjusting portion of the third embodiment of the bonding apparatus (I) or the bonding apparatus (III), (a) is a perspective view, and (b) is a sectional view. .

Fig. 17 is a view showing a schematic configuration of a fifth embodiment of the bonding apparatus (I).

[Embodiment 18] The sixth embodiment of the bonding apparatus (I), the fifth embodiment of the bonding apparatus (II), or the magnification of the peripheral structure of the film holding roller of the fifth embodiment of the bonding apparatus (III) Figure.

[Fig. 19] is a seventh embodiment of the bonding apparatus (I), and is attached A schematic structural view of a cutter portion of the sixth embodiment of the device (II) or the sixth embodiment of the bonding device (III) and its surroundings.

[Fig. 20] A side view showing a schematic structure of a first embodiment of the bonding apparatus (II).

[Fig. 21] is a flow chart for explaining a bonding process of a film by the bonding device (II).

[Fig. 22] A view showing the structure of a detecting portion of a modification.

Fig. 23 is a view showing a schematic configuration of a second embodiment of the bonding apparatus (II).

Fig. 24 is a view showing a schematic configuration of a fourth embodiment of the bonding apparatus (II).

Fig. 25 is a view showing a schematic configuration of a seventh embodiment of the bonding apparatus (II).

[Fig. 26] A side view showing a schematic structure of the first embodiment of the bonding apparatus (II).

[Fig. 27] is a view showing the structure of an important portion around the substrate abutting portion.

[Fig. 28] is a view for explaining the action performed by the substrate abutting portion.

[Fig. 29] A flow chart for explaining a bonding process of a film by the bonding apparatus (III).

[Fig. 30] A view showing a schematic configuration of a second embodiment of the bonding apparatus (III).

[Fig. 31] shows a fourth embodiment of the bonding apparatus (III) A diagram of the schematic structure.

[Fig. 32] A view showing a schematic configuration of a seventh embodiment of the bonding apparatus (III).

Hereinafter, an embodiment of the bonding apparatus (I) of the present invention will be described with reference to the drawings. In the following description, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The conveyance direction of the film in the horizontal plane is set to the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is set to the Y-axis direction, and is orthogonal to the X-axis direction and the Y-axis direction (that is, The vertical direction is set to the Z-axis direction. In the bonding apparatus (I) of the present embodiment, the protective film and the main film are separated from the film while the film is being conveyed, and the main film is bonded to the substrate. The film is a long protective material and The film in which the main film material is bonded is unwound from a wound body wound in a roll shape.

(First embodiment of the bonding device (I))

Fig. 1 is a side view showing a schematic structure of a bonding apparatus (I) of the present embodiment.

As shown in Fig. 1, the bonding apparatus (I) 100IA includes a device casing 101, a substrate supply unit 102, a substrate transport unit 103, a film transport unit 104, a film bonding unit (bonding unit) 105, and a sticker. Auxiliary portion 135, coating portion 106, heating portion 107, and film position detecting portion (position detecting portion) 109. and a position correcting mechanism 111.

The substrate supply unit 102 is configured to move the substrate 1 into the device casing 101 to supply the supplier. The substrate supply unit 102 includes a cassette 102a for holding the substrate 1 before the film bonding, and a driving unit 102b capable of pulling the substrate 1 from the inside of the cassette 102a. Further, the sheet bundle 102a has a structure that can be lowered to a position where the substrate 1 held inside can be transferred to the driving portion 102b. Thereby, the substrate supply unit 102 can sequentially supply the plurality of substrates 1 from the inside of the cassette 102a to the apparatus casing 101 side by the driving unit 102b. Further, the structure of the substrate supply unit 102 is not limited to the structure in which the substrate 1 is sequentially supplied from the cassette 102a, and the structure in which the substrate 1 is sequentially supplied to the device casing 101 side by piece by the transfer robot may be employed. .

In the substrate transfer unit 103, the substrate 1 is moved to a predetermined position (film bonding position), and after the film is bonded, the substrate 1 is moved to a carry-out position for carrying out from the device case 101.

The film transport unit 104 is for transporting the film to the bonding position with respect to the substrate 1. The film bonding unit 105 is for bonding a film conveyed by the film conveying unit 104 to the substrate 1 . The bonding assisting portion 135 is configured to hold the substrate 1 as described later and perform a bonding assisting actor that adheres the film to the substrate 1.

The application unit 106 is for applying an adhesive or an adhesive as a coating liquid to the substrate 1 for adhering the film 60 to the substrate 1.

The heating unit 107 is configured to apply the adhesive to the coating unit 106 or The film 60 of the adhesive is heated (baked) to harden the adhesive or the adhesive.

The film position detecting unit 109 detects the relative position of the film 60 conveyed by the film transport unit 104 with respect to the substrate 1 in the film width direction (Y direction) intersecting the transport direction. The position correcting mechanism 111 corrects the relative position with respect to the substrate 1 in the film width direction at least based on the detection result of the film position detecting unit 109 when the film 60 is bonded.

The substrate transport unit 103 includes a first substrate transport roller unit 30, a second substrate transport roller unit 31, a third substrate transport roller unit 32, a fourth substrate transport roller unit 33, and a fifth substrate transport roller unit 34.

The third substrate conveyance roller unit 32 is constituted by a conveyance roller (first conveyance roller) 32a that is driven by a drive motor (not shown). The transport roller 32a is configured to hold the substrate 1 between the film bonding roller 40 and the film bonding roller 40 for performing bonding work on the film of the film transport unit 104. Thereby, the film can be bonded to the substrate 1 on the transport roller 32a. That is, the conveying roller 32a and the film bonding roller 40 constitute the film bonding portion 105 of the present invention.

The first substrate transfer roller unit 30 has a plurality of (four in the present embodiment) passive rollers 30a. Thereby, the first substrate transport roller unit 30 receives the substrate 1 supplied from the substrate supply unit 102 and guides it into the device casing 101.

The second substrate transfer roller unit 31 is bonded by a transmissive film The portion 105 is disposed to face the fourth substrate transfer roller portion 33.

The second substrate transfer roller unit 31 has a plurality of (three in the present embodiment) roller pairs 131. Each of the roller pairs 131 has a lower roller 31a and an upper roller 31b. The substrate 1 is conveyed while being held between the rollers 31a and 31b.

The fourth substrate conveyance roller unit 33 receives the substrate 1 to which the film is bonded to the film conveyance unit 104. The fourth substrate transfer roller unit 33 has a plurality of (two in the present embodiment) roller pairs 133. Each of the roller pairs 133 has a lower roller 33a and an upper roller 33b. The substrate 1 is conveyed while being held between the rollers 33a and 33b.

The bonding assisting portion 135 is disposed between the third substrate transporting roller portion 32 and the fourth substrate transporting roller portion 33. The bonding assisting unit 135 includes a transport roller (second transport roller) 135a and a bonding assist roller 135b. The bonding auxiliary roller 135b is configured to be able to advance and retreat with respect to the conveying roller 135a.

The bonding assisting unit 135 can hold the bonding auxiliary roller 135b close to the transport roller 135a that transports the substrate 1 and hold the substrate 1 between the bonding auxiliary roller 135b and the transport roller 135a. Further, the drive unit that raises and lowers the bonding auxiliary roller 135b applies a pressing force to the substrate 1 between the driving unit and the conveying roller 135a. The drive unit is constituted by, for example, a cylinder or a motor, and the pressing force is controlled by controlling the drive unit. The drive unit defines a timing at which the bonding auxiliary roller 135b is moved up and down according to the size of the substrate 1 and the conveyance time.

The auxiliary roller 135b is attached to the substrate 1 at least The rear end of the conveyance direction (+X direction) is held between the substrate 1 and the conveyance roller 135a until the edge of the rear end thereof passes.

In addition, the bonding auxiliary roller 135b is only required to be abutted at least at the time of the rear end of the substrate 1 in the transport direction, and the contact start position of the substrate 1 is not particularly limited. In other words, the bonding auxiliary roller 135b can be brought into contact with one half of the substrate 1, or can be abutted from the front end of the substrate 1 in the transport direction.

In this manner, the film bonding portion 105 can suppress the edge portion of the rear end of the film in the transport direction (+X direction) and reliably cut the cut portion of the rear end of the film to the substrate 1, and the entire substrate 1 can be well followed. film.

The fifth substrate transfer roller unit 34 has a plurality of (four in the present embodiment) passive rollers 34a. By this, the fifth substrate transfer roller unit 34 moves so as to receive the substrate 1 transported from the fourth substrate transfer roller unit 33 and housed in the substrate carrying cassette (not shown).

The film conveying unit 104 includes a film feeding unit 41, a conveying path adjusting unit 42, a film holding roller 43, a first suction roller 44, a cutter unit 48, a time adjustment unit 47, a relay roller unit 45, and a second adsorption roller 49. The film bonding roller 40, the film winding portion 51, and the relay rollers 52, 53.

The film feeding portion 41 has a rotation driving portion 41a for holding and rotating the roll body R in which the film 60 is wound in a roll shape. In addition, the film 60 has a main film 61, a protective material 62, and a paste. The layer 63 is formed in a strip shape, and the adhesive layer 63 is used to bond the main film member 61 and the protective member 62 (see Fig. 3). The film 60 has a film width in a direction crossing the conveyance direction corresponding to the width of the substrate 1. Here, the width of the substrate 1 includes not only the case where the width of the film 60 and the substrate 1 are substantially the same, but also the case where the width of the film 60 is slightly wider or slightly narrower than the width of the substrate 1. Thereby, the film conveying unit 104 conveys the film 60 by unwinding from the roll body R.

The conveyance path adjusting unit 42 includes a lever portion 141 and a contact roller 142 that is rotatably attached to the rotation driving portion 41a. The abutting roller 142 is rotatably attached to the front end of the lever portion 141 and abuts On the film 60. The lever portion 141 is rotated coaxially with the wrapper R by the rotation drive portion 41a.

The film 60 unwound from the roll body R changes the conveyance path (transport distance) in accordance with the remaining amount of the roll body R. When the conveyance path (transport distance) of the film 60 is changed, it is necessary to change the driving condition of the rotation drive unit 41a in order to keep the conveyance speed of the film 60 constant.

On the other hand, in the film transport unit 104 of the present embodiment, the transport path adjusting unit 42 rotates the lever unit 141 to a predetermined position to change the transport distance (transport path) of the film 60. For example, the film conveyance unit 104 can rotate the lever portion 141 so that the contact roller 142 is lowered when the remaining amount of the roll body R is reduced, thereby prolonging the conveyance distance which is shortened due to the reduction in the outer shape of the roll body R. In this way, the conveyance path adjustment unit 42 does not need to change the driving condition (rotation speed) of the rotation drive unit 41a. The conveying speed of the film 60 can be kept constant. Further, the conveyance path (transport distance) of the film 60 can be changed by the abutment roller 142 whose weight is lowered. In this case, the amount of drop of the contact roller 142 is measured by a sensor (not shown) provided in the vicinity of the contact roller 142, and the volume to be rotated by the rotary drive unit 41a is changed based on the measured value. The rotation speed of the body R is sufficient.

The film holding roller 43 is held so that the film 60 is conveyed in a slightly vertical direction (Z-axis direction) between the film and the first suction roller 44 to be described later. Thereby, the film 60 is conveyed along the vertical direction.

The first adsorption roller 44 and the second adsorption roller 49 are rotated in a state in which the adsorption film 60 is moved, and the film 60 can be conveyed at a constant speed. FIG. 2 is a cross-sectional view showing a schematic structure of the first adsorption roller 44 and the second adsorption roller 49. In addition, since the first adsorption roller 44 and the second adsorption roller 49 have the same structure, the structure of the first adsorption roller 44 will be described in the following description.

As shown in FIG. 2, the first suction roller 44 has a roller body 144 and a suction portion 145. The roller body 144 has a plurality of through holes 144a formed on the surface thereof, and the suction portion 145 is provided inside the roller body 144. The suction portion 145 has a casing 145a formed in a box shape that is slidably contactable with the inner surface of the rotating roller main body 144, and the casing 145a is connected to a blower (not shown).

The casing 145a abuts against the inner surface of the roller main body 144 and passes through the through hole 144a to attract the air on the roller surface side. At the first adsorption In the roller 44, air can be sucked only from the through hole 144a of the region A facing the opening of the casing 145a. The case 145a is fixed, and only the roller main body 144 is rotationally driven.

With this configuration, in the first suction roller 44, the roller body 144 is configured to suck air from the through hole 144a at a predetermined rotational position. Therefore, the first adsorption roller 44 can convey the film 60 adsorbed through the through hole 144a in a good direction along the rotation direction of the roller body 144. In addition, the suction portion 145 does not have to be in contact with the inner surface of the roller body 144, and may have a structure that can be sucked through the through hole 144a, and may be interposed therebetween.

Further, since the first adsorption roller 44 holds the film 60 by adsorption, friction between the roller main body 144 and the film 60 can be prevented, and generation of static electricity can be suppressed. Although the structure of the first adsorption roller 44 has been described above, the second adsorption roller 49 is also the same.

Fig. 3 is a view showing a schematic structure of the cutter portion 48 and a laminated structure of the film 60.

As shown in Fig. 3, the cutter portion 48 of the present embodiment includes a rotary blade (tool edge) 161 for cutting (cutting) the film 60, a film support portion 162 disposed to face the rotary blade 161, and A blade cleaning portion (tool blade cleaning portion) 163 that cleans the rotary blade 161.

The rotary blade 161 is formed of a disk-shaped cutter blade, and is cut along the width direction of the film 60 (from the right direction to the left direction shown in FIG. 4) by a guide member (not shown). Breaking the aforementioned film 60. The rotary blade 161 is rotated in the - direction (clockwise direction) shown in FIG. 4 when the film 60 is cut. The film support portion 162 is for holding the film 60 between it and the rotary blade 161. In the cutter portion 48, the rotation edge 161 is moved in the thickness direction (X direction) of the film 60 in response to the thickness of the film 60 (main film member 61), and the interval between the film support portion 162 and the rotary blade 161 is adjusted. Thereby, the cutter portion 48 can cut only the main film member 61 in the film 60. Further, the cutter portion 48 can arbitrarily set the rotational speed or the moving speed of the rotary blade 161 in accordance with the conditions such as the thickness or material of the film 60 (the main film member 61).

The blade cleaning portion 163 is disposed at a position that does not face the film supporting portion 162 and is at a standby position of the cutter portion 48. Here, the standby position of the cutter portion 48 is the standby position before the cutting of the film 60 by the rotary blade 161, and the rotary blade 161 is directed from one end side (the right end portion shown in FIG. 4) of the film 60 toward the other side. The one end side (the left end portion shown in FIG. 4) moves back and then returns to the position where it returns to the end side after returning to the one end side. Further, when the cutting blade 60 returns to the other end side, the rotary blade 161 rotates in the + direction (counterclockwise direction) as shown in FIG. 4, for example. In the present description, the case where the rotary blade 161 rotates in the − direction (clockwise direction) when the film 60 is cut and rotates in the + direction (counterclockwise direction) when returning to the other end side is exemplified, but The present invention is not limited thereto, and conversely, the rotary blade 161 may be rotated in the + direction at the time of cutting, and may be rotated in the - direction when returning to the other end side. Alternatively, the rotation direction of the rotary blade 161 may be fixed in either the -direction or the + direction.

In this way, the cutter portion 48 is disposed in the standby position. Since the blade cleaning portion 163 is provided, the adhesive layer 63 adhering to the rotary blade 161 can be cleaned by cutting the film 60.

The blade cleaning unit 163 includes a sponge member 163a that is in sliding contact with the tip end of the rotary blade 161, and a cleaning liquid supply unit 163b that supplies the cleaning liquid to the sponge member 163a. . The sponge member 163a is formed with a slit 163s capable of accommodating the tip end of the rotary blade 161. The cleaning liquid supply unit 163b is used to impregnate the sponge member 163a with the cleaning liquid, and is used to maintain the cleaning property of the rotary blade 161 in the sponge member 163a.

According to such a configuration, as shown in Fig. 3, the cutter portion 48 can cut only the main film member 61 in the film 60. Therefore, the film 60 which has been cut by the cutter portion 48 is in a state in which the main film member 61 is bonded to the protective member 62 by the adhesive layer 63 while being cut into a predetermined length. Further, in Fig. 3, for example, an adhesive N applied to the main film member 61 of the film 60 is shown.

Specifically, when the main film member 61 is cut, the cutter portion 48 forms a bonding portion that is bonded to the substrate 1 and a non-bonding portion that is not bonded to the substrate. Therefore, the protective material 62 is bonded to the main film member 61 constituting the bonding portion and the main film member 61 constituting the non-bonding portion by the adhesive layer 63. Here, the length of the bonding portion means the one corresponding to the length of the substrate 1. Further, the length of the non-bonding portion refers to the distance that the film is transferred to the substrate 1 and before the film is bonded to the next substrate 1 before being transferred to the substrate 1 . That is, the length of the non-adhesive portion is in response to the transport speed of the substrate 1, the film. The lifting speed of the roller 40 is adjusted and the like is appropriately set. By using the film including the bonding portion and the non-bonding portion, the leading end of the film (bonding portion) conveyed by the film conveying portion 104 and the substrate 1 conveyed by the substrate conveying portion 103 can be easily transported. Alignment of the front end of the direction.

Here, the cutter portion 48 cuts the film 60 in a state in which it is conveyed by the film transport unit 104. When the film portion 60 is cut by the cutter portion 48, the conveyance of the film 60 is temporarily stopped. At this time, the conveyance of the film 60 is continued except for the cut portion. Therefore, the conveyance speed of the film 60 is different due to the cut portion and the other portion by the cutter portion 48. As a result, the conveyance speed is deviated, and the film 60 to be conveyed is swayed, and the conveyance failure of the film 60 occurs.

On the other hand, the film transport unit 104 of the present embodiment includes the time point adjustment unit 47 as means for adjusting the deviation of the transport speed with respect to the film 60 when the cutter unit 48 is cut.

The timing adjustment unit 47 includes a transport roller (roller member) 241, a lever member 242, and a rotating portion 240 that abuts on one surface side (back side) of the film 60 and transports it in a predetermined direction. The lever member 242 holds the conveying roller 241 on the other end side, and the rotating portion 240 rotates the lever member 242 with reference to one end side. The conveying roller 241 is held to be rotatable relative to the lever member 242.

In the present embodiment, the time point adjusting portion 47 is configured to match the conveying speed of the portion where the film 60 is temporarily stopped and the portion of the other transporting portion when the film 60 is cut by the cutter portion 48, by rotating The portion 240 rotates the lever member 242 clockwise to move the conveying roller 241 provided on the other end side of the lever member 242 in an arc shape. At this time, the conveying roller 241 presses one surface side of the film 60 to impart a predetermined tension to the film 60. Further, since the conveyance roller 241 is rotatable with respect to the lever member 242, the conveyance roller 241 rotates in association with the conveyance of the film 60. Therefore, the conveyance roller 241 can be prevented from interfering with the conveyance of the film 60.

As a result, the film transport unit 104 does not cause a conveyance failure, and can be directly cut by the cutter unit 48 while the film 60 is being conveyed. Therefore, since it is not necessary to temporarily stop the conveyance of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

The film bonding roller 40 is movable in the vertical direction (Z direction). The film bonding roller 40 is lowered to a position where the substrate 1 can be pressed against the film 60 on the transport roller 32a (the third substrate transport roller portion 32) of the substrate transport unit 103.

The film bonding roller 40 and the conveying roller 32a are bonded to each other by holding the film 60 and the substrate 1. In this manner, the film bonding roller 40 forms a part of the film conveying portion 104 and constitutes the film bonding portion 105.

The film bonding roller 40 is attached to the substrate 1 by bonding the main film 61 of the bonding portion of the film 60 to the bonding of the film 60. Since the film 60 is bonded to the substrate 1 while being conveyed, for example, the film bonding roller 40 is in contact with the substrate 1 until the substrate 1 is conveyed. At the rear end, the non-bonding portion that is conveyed in the bonded portion can be restrained between the transfer roller 32a and the transfer roller 32a. Therefore, in the past, the main film member 61 which is a non-bonding portion which is not bonded and which is to be discarded may be bonded to the substrate 1 or the transport roller 32a.

In the present embodiment, in order to prevent such a problem, the film bonding roller 40 does not continuously abut against the structure of the rear end of the substrate 1 in the transport direction. In other words, the film bonding roller 40 is configured such that the leading end portion of the main film member 61 corresponding to the bonding portion of the film 60 in the transport direction coincides with the leading end of the substrate 1 in the transport direction (that is, the transport of the main film member 61) When the front end of the direction reaches the film bonding position, the position is lowered, and the abutting portion reaches the rear end portion of the main film member 61 corresponding to the bonding portion (the rear end of the substrate 1 in the transport direction) (that is, The rear end of the main film 61 in the conveyance direction reaches the time before the film bonding position) and starts to rise. Thereby, the film bonding roller 40 as described above can prevent the non-bonding portion of the film 60 from being caught between the transfer roller 32a and the transfer roller 32a. Therefore, the film bonding roller 40 is repeatedly lifted and lowered every time the film 60 is bonded to the substrate 1.

However, the film bonding roller 40 rises earlier than the back end of the substrate 1 in the transport direction as described above. Therefore, the film 60 cannot be sufficiently pressed against the substrate 1 at the rear end side in the transport direction, so that the film 60 is formed. The fit becomes inadequate.

On the other hand, in the present embodiment, the bonding assisting portion 135 (the bonding auxiliary roller 135b) is provided. The bonding auxiliary roller 135b is at least abutted against the rear end of the substrate 1 in the transport direction. The substrate 1 is held between the transfer roller 135a and the edge of the rear end, and the cut portion at the rear end of the film 60 which is insufficient only in the film bonding roller 40 can be surely adhered to the substrate 1. Therefore, according to the present embodiment, the film 60 can be satisfactorily adhered to the entire substrate 1 .

The film take-up portion 51 has a take-up shaft 51a and a drive portion 51b that drives the take-up shaft 51a for winding up the film from the film bonding portion 105 60 separate protective material 62.

The relay rollers 52 and 53 relay the conveyance of the film 60 between the film bonding roller 40 and the film winding unit 51. The relay roller 52 is located above the film bonding position by the film bonding roller 40 (Z direction). Further, the relay roller 52 is disposed above the bonding assisting portion 135 and the film bonding portion 105 in the transport direction of the substrate 1. As a result, the film 60 that has passed through the film bonding roller 40 is bent sharply upward, and only the divided main film material 61 is bonded to the substrate 1 as will be described later, and the protective material 62 is removed from the main film 61. Separation.

In the bonding apparatus (I) 100IA of the present embodiment, a structure in which the long film 60 is conveyed by the film conveying unit 104 until the film bonding portion 105 is bonded to the film is used.

The substrate transport unit 103 controls the substrate so that the bonding portion of the film 60 conveyed by the film transport unit 104 reaches the film bonding unit 105 in synchronization with the film bonding unit 105 in the transport direction. 1 transfer speed. Therefore, the film 60 is in the conveying direction. The occurrence of a relative positional offset with respect to the substrate 1 is prevented.

However, since the film 60 is conveyed from the roll body R to the film bonding position by the film bonding unit 105 after passing through the plurality of roller members, there is a fear that the film transfer unit 104 is transported by the film transfer unit 104. The relative position of the film width direction with respect to the substrate 1 is changed.

Here, the change in the relative position means that the position of the film 60 in the width direction (Y direction) intersecting with the conveyance direction of the substrate 1 is shifted when the film 60 reaches the position where the film is bonded by the film bonding portion 105. For example, when the widths of the substrate 1 and the film 60 are the same, when the position of the film 60 is shifted, the film 60 is brought from the substrate 1 toward one end side in the width direction, and the film 60 is not bonded to the substrate 1 . The area on the other end side.

In the bonding apparatus (I) 100IA of the present embodiment, the film position detecting unit 109 and the position correcting mechanism 111 are provided. It is preferable that the film position detecting unit 109 is disposed upstream of the film bonding position by the film bonding unit 105 in the conveyance path of the film 60, and is located as close as possible to the film bonding position.

In the present embodiment, the film position detecting unit 109 is disposed between the cutter portion 48 and the second adsorption roller 49 in the transport path of the film 60. Further, the position at which the film position detecting unit 109 is disposed is not limited to the above-described position, and may be disposed between the second adsorption roller 49 and the film bonding roller 40, for example.

Fig. 4 is a view showing a schematic configuration of the film position detecting unit 109. In addition, the fourth figure corresponds to the surface orthogonal to the film 60. A diagram of the section.

As shown in Fig. 4, the film position detecting unit 109 is, for example, a laser scanning system, and has a frame-shaped main body portion 109c, a laser emitting portion 109a, and a light receiving portion 109b. The two sides of one end portion 60c surrounding the film 60 in the shape; the laser emitting portion 109a is provided on one surface facing the main body portion 109c, and emits laser light; the light receiving portion 109b receives the light receiving portion 109b The laser light emitted from the laser emitting portion 109a. The result of the light reception by the light receiving unit 109b is sent to the determination unit 112. The determination unit 112 can be constituted by, for example, a hardware such as an arithmetic circuit, or can be realized by a software such as a program. Further, the film position detecting unit 109 may be provided only on one end portion 60c of the film 60, but may be provided on the other end portion 60d side of the film.

The determination unit 112 acquires the positional information of the end portion of the film 60 based on the result of the transmission from the light receiving unit 109b. The determining unit 112 detects the relative position of the film 60 with respect to the substrate 1 in the film width direction. Specifically, the determination unit 112 drives the position correction mechanism 111 when the film 60 is displaced in the film width direction with respect to the position of the substrate 1 . On the other hand, when the determination unit 112 does not shift in the film width direction at the position of the film 60 with respect to the substrate 1, the position correcting mechanism 111 is not driven.

The structure of the film position detecting unit 109 is not limited to the above-described laser scanning method, and an imaging unit constituted by, for example, a CCD sensor or the like may be used. In this case, as long as a pair of imaging units are disposed on one surface side (the −X direction side) of the film 60, they are respectively imaged on the film 60. The end of the transport direction is transmitted, and the imaging result is sent to the determination unit 121. Further, the CCD sensor of the imaging unit includes a plurality of pixels arranged in a matrix. Each pixel of the CCD sensor includes a light-receiving element such as a photodiode, and a switching element such as a thin film transistor.

The position correcting mechanism 111 adjusts the relative position (positional shift) of the substrate 1 and the film 60 based on the detection result by the film position detecting unit 109. Fig. 5 is a view showing the configuration of an important portion of the position correcting mechanism 111. As shown in FIG. 5, in the present embodiment, the position correcting mechanism 111 includes a base portion 111a and a driving portion 111b that holds the second substrate transporting roller portion 31 of the transport substrate 1; The portion 111b drives the base portion 111a in the width direction (Y direction) of the substrate 1. The drive unit 111b is connected to the LM guide, for example, and the second substrate transfer roller unit 31 is moved in the width direction of the substrate 1 by a drive motor.

According to such a configuration, the position correcting mechanism 111 moves the base portion 111a in the Y direction by the driving portion 111b, and the substrate 1 can be transported by the second substrate transporting roller portion 31, and the substrate 1 can be corrected with respect to the film 60. Relative position. By this, the substrate 1 supplied to the film bonding unit 105 via the second substrate conveying roller unit 31 (position correcting mechanism 111) is aligned with the film 60 in the width direction. Therefore, the film bonding portion 105 can bond the film 60 to the substrate 1 in a state where no positional deviation occurs in the width direction (Y direction).

The coating unit 106 applies an adhesive or an adhesive to the film 60 that is conveyed in the vertical direction by the film holding roller 43. In addition, as the coating liquid applied to the coating unit 106, a liquid having at least an adhesiveness capable of adhering the film 60 to the substrate 1 after drying by the heating unit 107 is used.

The coating unit 106 includes an application mechanism 70, a spray recovery mechanism 71, and a film thickness adjustment mechanism 72 for applying an adhesive or an adhesive to the substrate 1; the film thickness adjustment mechanism 72 is The thickness of the adhesive or the adhesive applied to the film 60 is adjusted (refer to Fig. 9).

Fig. 6(a) is a schematic view showing the structure of an important part of the coating mechanism 70, and Fig. 6(b) is a view schematically showing the operation of the front end 73a of the nozzle 73.

As shown in Fig. 6(a), the coating mechanism 70 includes a nozzle 73 that sprays an adhesive or an adhesive, a main body portion 74, and a rotating portion 75 that rotates the main body portion 74 around the X-axis. For the nozzle 73, a spray nozzle that sprays an adhesive or an adhesive can be used. The main body portion 74 has a moving mechanism 79 that can move the nozzle 73 in the width direction of the film 60. The moving mechanism 79 includes a guiding portion 79a that guides the movement of the nozzle 73, and a driving portion 79b that transmits a driving force for moving the nozzle 73 relative to the guiding portion 79a. The nozzle 73 is connected to the guide portion 79a via the mounting arm 78.

The drive unit 79b transmits the driving force to the side of the guide portion 79a by, for example, a rack and pinion mechanism. Thereby, the nozzle 73 can be moved in the width direction of the film 60 as indicated by the arrow B in the figure. Therefore, the nozzle 73 is formed to be able to extend over the entire width direction of the film 60. Domain spray adhesive or adhesive.

The rotating portion 75 is constituted by a motor or the like. The main body portion 74 is attached to the central portion thereof with a rotating portion 75. Thereby, the main body portion 74 can be swung by the center portion based on the rotation portion 75. The nozzle 73 can be independently moved by the moving mechanism 79 of the main body portion 74 separately from the rocking motion of the main body portion 74. In the following, for convenience of explanation, the center of the front end 73a of the nozzle 73 is aligned with the center of rotation of the rotating portion 75.

According to such a configuration, the tip end 73a of the nozzle 73 moves in a substantially figure-eight manner with reference to the rotation center of the rotating portion 75 as shown in Fig. 6(b). Specifically, when the YZ axis is set with reference to the rotation center C of the rotating portion 75, the tip end of the nozzle 73 passes through the fourth quadrant to the second quadrant, and passes through the third quadrant to the first quadrant, and is drawn. The arc is rotated to the fourth quadrant, and then moved in such a manner as to repeat the same trajectory. Further, in the present description, when the front end 73a of the nozzle 73 is from the second quadrant to the third quadrant and from the first quadrant to the fourth quadrant, the case where the arc return is drawn is taken as an example, but the present invention is not limited thereto. herein. For example, it is possible to move back from the second quadrant to the third quadrant and to move from the first quadrant to the fourth quadrant so as to be folded back along the Y-axis along the Z-axis direction. At this time, the application mechanism 70 has a moving portion that moves the main body portion 74 in the YZ direction instead of the rotating portion 75.

Fig. 7 is a view showing the operation of the front end 73a of the nozzle 73 on the film 60 when the application portion 106 of the present embodiment is applied with an adhesive or an adhesive. In addition, Figure 8 shows that there is no rotating part as a comparison. The action of the front end 73a of the nozzle 73 on the film 60 when the application portion 106 of the 75 is applied with an adhesive or an adhesive. In the application unit 106 of the present embodiment, since the nozzle 73 moves in a substantially figure-eight manner with respect to the rotation center C of the rotating portion 75 as described above, the conveying speed of the film 60 and the moving speed of the nozzle 73 can be adjusted. As shown in Fig. 7, the tip end of the nozzle 73 is moved in the width direction of the surface of the film 60 conveyed in a predetermined direction. On the other hand, when the rotating portion 75 is not provided, the film 60 itself is transported while the nozzle 73 is moving in the width direction of the film 60. Therefore, as shown in Fig. 8, the front end 73a of the nozzle 73 is opposed to the film. The surface of 60 moves in a zigzag manner.

As described above, the application portion 106 of the present embodiment includes the rotating portion 75, and the tip end 73a of the nozzle 73 can be moved over the entire width direction and the conveyance direction of the film 60 without a gap. Therefore, the coating portion 106 can be spread over the film 60. Apply an adhesive or adhesive completely and evenly.

Returning to Fig. 1, the heating unit 107 has a first heating unit 76 and a second heating unit 77. The heating temperatures of the first heating unit 76 and the second heating unit 77 are set to different values.

The first heating unit 76 is used to temporarily cure the adhesive or the adhesive by performing the first baking treatment on the film 60. The second heating unit 77 is for temporarily curing the adhesive or the adhesive by performing the second baking treatment on the film 60.

According to such a configuration, the heating portion 107 can be cured by the stepwise (two-stage) heating of the film 60. In addition, the adhesive or adhesive contains a plurality of (for example, 2 When the solvent is used, the first solvent in the adhesive or the adhesive can be evaporated in the first baking treatment (heat treatment in the first step) by the first heating unit 76, and the second heating unit 77 can be used in the second heating unit 77. The second baking treatment (heat treatment in the second stage) is performed to evaporate the second solvent in the adhesive or the adhesive, and to dry the adhesive or the adhesive to be cured.

Further, since the heating unit 107 performs the heat treatment of the one film 60 by using the first heating unit 76 and the second heating unit 77, the structure of the film 60 is not heated by only one heating unit. The problem of the drying process of the next film 60 cannot be started until the drying process of the film 60 is completed. Therefore, since the film 60 can be sequentially transported into the heating unit 107, the man-hour required for the heat treatment can be shortened.

Fig. 9 is a schematic view showing the structure of the periphery of the application portion 106. Fig. 10 is a schematic view showing the structure of the spray recovery mechanism 71. The spray recovery mechanism 71 is for recovering a spray generated when an adhesive or an adhesive is applied from the nozzle 73 of the coating mechanism 70.

The spray recovery mechanism 71 has a main body portion 80, a spray cleaning portion 81, and a cleaning liquid circulation portion 82 as shown in Fig. 9. The main body portion 80 constitutes a processing chamber that is subjected to an adhesive coating treatment by the coating portion 106. The main body portion 80 is provided with an opening portion 80a for conveying the film 60 conveyed by the film conveying portion 104 to the inside or carrying it out from the inside.

As shown in Fig. 10, the spray cleaning portion 81 covers the back surface opposite to the surface on which the film 60 is coated with an adhesive or an adhesive. The body 60a and the side surface 60b are provided in the main body portion 80. The spray cleaning unit 81 has a cleaning liquid storage unit 83 that stores the cleaning liquid W and a cleaning unit 84 that flows the cleaning liquid W that has overflowed from the cleaning liquid storage unit 83, as shown in FIG. And a cleaning liquid receiving unit 85. In addition, in the ninth drawing, only the spray cleaning portion 81 disposed on the back surface 60a side of the film 60 is illustrated for easy viewing of the drawing surface, but the side surface 60b side of the film 60 is also arranged as shown in Fig. 10. There is a spray cleaning unit 81. The spray cleaning portion 81 disposed on the side surface 60b side of the film 60 also has the same structure as the spray cleaning portion 81 on the back surface 60a side.

The cleaning unit 84 is constituted by a brush member that extends in the conveying direction (Z direction) of the film 60, and has a structure in which the cleaning liquid flows downward along the surface of the brush member. The cleaning liquid receiving unit 85 functions as a container for receiving the cleaning liquid, and the cleaning liquid flows along the cleaning unit 84 and flows downward.

A communication portion 85a that allows the cleaning liquid W to communicate with the inside of the main body portion 80 is provided below the cleaning liquid receiving portion 85, and the cleaning liquid in the cleaning liquid receiving portion 85 is transmitted through the communication portion 85a and flows into the main body portion. The bottom of the 80 is 89. In the cleaning liquid circulation unit 82, the cleaning liquid stored in the bottom portion 89 of the main body portion 80 is transmitted through the communication portion 89a, and is circulated in the cleaning liquid storage portion 83 of the cleaning unit 84 by the driving force of the pump P. The cleaning liquid circulation unit 82 has a filter F through which the cleaning liquid is circulated. Thereby, the foreign matter contained in the cleaning liquid can be removed after washing, and the washing liquid can be reused.

According to the coating portion 106 of the present embodiment, the adhesive agent can be recovered from the nozzle 73 for the film 60 by the spray recovery mechanism 71. Or the spray generated when the adhesive is applied, thereby preventing the contamination of the bonding apparatus (I) 100IA from occurring due to the adhesion of the spray.

The film thickness adjusting mechanism 72 is adjusted so that the thickness of the adhesive or the adhesive applied to the film end in the width direction of the film 60 is uniform. Fig. 11 is a view showing the structure of the periphery of the film thickness adjusting mechanism 72, which is a perspective view of the same drawing (a) and a sectional view of the same drawing (b).

As shown in Fig. 11 (a) and (b), the film thickness adjusting mechanism 72 includes a virtual roller 90 provided near the film end of the film 60, a driving roller 91, a passive roller 92, and a cradle on the virtual The roller 90, the drive roller 91, and the belt 93 of the passive roller 92. The belt 93 is made of polyimide of the same material as the film 60.

The virtual roller 90 rotates coaxially with the film holding roller 43 that conveys the film 60 in the vertical direction. The outer diameter of the virtual roller 90 is set such that the surface of the belt 93 of the virtual roller 90 is slightly the same height as the surface of the film 60 that is hung on the film holding roller 43. Further, in the application portion 106, in a region where the surface of the belt 93 and the surface of the film 60 are slightly equal in height, the front end of the nozzle 73 is aligned so that an adhesive or an adhesive is applied to the surface of the film 60.

Here, in the case where the belt 93 of the film thickness adjusting mechanism 72 is not provided at the film end of the film 60, the film thickness of the film end adhesive or the adhesive which changes the scattering condition of the adhesive or the adhesive is reduced. As a result, there is a fear that variations in the film thickness of the adhesive or the adhesive in the width direction of the film 60 may occur.

On the other hand, according to the embodiment, the film thickness is adjusted. The surface of the belt 93 of the mechanism 72 is located at the same height as the surface of the film end of the film 60 opposed to the nozzle 73, so that the scattering condition of the adhesive or the adhesive can be made uniform at the film end and the center portion of the film. Therefore, by adhering the film forming conditions of the adhesive or the adhesive in the width direction of the film 60, it is possible to apply the adhesive or the adhesive with a uniform film thickness.

However, unevenness occurs in the coated surface when a spray nozzle such as the nozzle 73 of the present embodiment is used.

On the other hand, in the present embodiment, a structure in which an adhesive or an adhesive is applied to the film 60 conveyed in the vertical direction (Z direction) from the nozzle 73 is employed.

In addition, when the nozzle 73 and the film 60 are disposed such that the opening end of the tip end 73a faces the surface of the film 60, the above-described unevenness suppression effect can be obtained even if the film 60 is not necessarily conveyed in the vertical direction. . That is, the film 60 may be conveyed in a direction crossing the horizontal plane. In this manner, as long as the film 60 is conveyed in a direction intersecting with the horizontal plane, that is, in a state of being inclined with respect to the horizontal plane, the front end 73a of the nozzle 73 and the surface of the film 60 are constantly separated at a predetermined distance in the horizontal direction. Therefore, it is possible to suppress the occurrence of unevenness in the coated surface of the above-mentioned adhesive or adhesive.

As a result, the tip end of the nozzle 73 and the surface of the film 60 are separated by a predetermined distance in the horizontal direction. Therefore, among the particles of the adhesive or the adhesive applied by the nozzle 73, the particles are rough (large grain). It falls before reaching the surface of the film 60 and is not applied to the film 60. On the other hand, the adhesive or adhesive applied from the nozzle 73 Among the particles, the fine particles (small particles) reach the surface of the film 60 disposed at a predetermined distance from the front end of the nozzle 73, and are applied to the film 60. Therefore, since an adhesive or an adhesive containing uniform particles can be applied to the film 60, unevenness as described above can be suppressed from occurring on the coated surface of the adhesive or the adhesive.

Further, a washing device for washing the adhesive or the adhesive adhering to the surface of the belt 93 may be provided. The structure of the washing device may be either a structure in which the washing liquid is sprayed on the belt 93 or a structure in which the belt 93 is immersed in the washing liquid storage portion. Thereby, since the surface of the belt 93 can be kept constantly in a clean state, the film formation conditions of the adhesive or the adhesive on the film end of the film 60 can be adjusted with high precision for a long period of time.

Next, an operation of bonding the film 60 to the substrate 1 will be described as an operation of the bonding apparatus (I) 100IA of the present embodiment.

Fig. 12 is a flow chart showing the lamination process of the film 60 by the bonding apparatus (I) 100IA.

First, in the bonding apparatus (I) 100IA, the roll body R is attached to the film feeding portion 41 (step S1).

After the roll body R is mounted, the bonding apparatus (I) 100IA drives the film transport unit 104 to release the film 60 (step S2). Specifically, the film transport unit 104 rotationally drives the film feed portion 41 and the film take-up portion 51 to transport the film 60 in a predetermined direction.

In the bonding apparatus (I) 100IA, the coating unit 106 is driven by the conveyance of the film 60 by the film conveying unit 104, and the coating unit 106 is driven to perform the bonding. Coating of the agent or adhesive (step S3). Specifically, the application unit 106 moves the nozzle 73 in a substantially eight-shape manner with respect to the rotation center of the rotating portion 75 as described above, and applies an adhesive or a film to the film 60 conveyed by the film conveying unit 104. Adhesive. The application portion 106 rotates the main body portion 74 of the holding nozzle 73 around the X-axis by the rotating portion 75 while moving the nozzle 73 by the moving mechanism 79, so that the tip end of the nozzle 73 can extend over the width direction of the film 60 and The transport direction moves through the entire area without a gap (see Fig. 7). Therefore, the adhesive or the adhesive can be applied uniformly over the entire width direction of the film 60.

However, when the film 60 is coated with an adhesive or an adhesive, the thickness of the adhesive or the adhesive at the film end becomes larger due to the change in the scattering condition of the film end adhesive or the adhesive in the width direction of the film 60. The central part is thinner. On the other hand, in the application portion 106 of the present embodiment, when the adhesive or the adhesive is applied to the film 60 from the nozzle 73, the film thickness adjusting mechanism 72 functions to be adjusted so as to be applied to the width direction of the film 60. The thickness of the adhesive or adhesive at the film end becomes uniform.

Specifically, the film thickness adjusting mechanism 72 rotates the virtual roller 90 in synchronization with the rotation of the film holding roller 43 of the conveying film 60. At this time, the surface of the belt 93 of the pylon on the surface of the virtual roller 90 and the surface of the film 60 of the film holding roller 43 at the pylon are at the same height.

Thereby, since the surface of the belt 93 is located at the same height as the surface of the film 60 near the film end, the scattering condition of the adhesive or the adhesive at the film end can be substantially made uniform with the center portion.

Thus, the adhesive or adhesive applied from the nozzle 73 is Even at the film end of the film 60, the scattering conditions of the adhesive or the adhesive are not changed, and the film forming conditions of the adhesive or the adhesive can be stabilized in the width direction of the film 60 to apply the adhesive or adhesion under uniform conditions. Agent.

When an adhesive or an adhesive is applied to the film 60 from the nozzle 73, the spray is scattered from the nozzle 73 to the surroundings. On the other hand, in the application unit 106 of the present embodiment, the spray can be recovered by the spray recovery mechanism 71. Specifically, the spray scattered from the nozzle 73 is captured by the cleaning unit 84 of the spray cleaning unit 81 (the spray recovery unit 71), which covers the back surface 60a and the side surface 60b of the film 60. Settings.

As described above, the cleaning unit 84 has a structure in which the cleaning liquid flows down the surface of the brush member, so that the captured spray is discharged to the lower side together with the cleaning liquid. Thereby, it is not necessary to accumulate the captured spray in the washing portion 84, and the spray can be recovered stably.

The washing liquid after the spray recovery is discharged from the cleaning liquid receiving portion 85 to the bottom of the main body portion 80, and the foreign matter is removed by the filter F of the cleaning liquid circulation portion 82, and then circulated again in the cleaning portion 84.

Further, in the present embodiment, since the adhesive or the adhesive is applied to the film 60 conveyed in the vertical direction (Z direction) from the nozzle 73, it is possible to prevent the particles of the adhesive or the adhesive applied from the nozzle 73. In the case where the particles are rough (large particles) are applied to the film 60, only the fine particles (small particles) are applied to the film 60. In this way, since the applied adhesive or the adhesive contains uniform particles, it can be applied in a state where the occurrence of unevenness is suppressed. Since the adhesive or the adhesive is small in surface unevenness, it is carried out even in a process described later. When it is bonded to the substrate 1, the problem of lowering the flatness of the main film member 61 can be prevented.

In the film transport unit 104, the film 60 coated with the adhesive or the adhesive by the application unit 106 is transferred to the heating unit 107, and the film 60 is heated (baked) to harden the adhesive or the adhesive ( Step S4). Specifically, in the heating unit 107, first, the first (1st) baking treatment is performed on the film 60 by the first heating unit 76. Next, the heating unit 107 performs a second (2nd) baking treatment on the film 60 by the second heating unit 77. The heating temperature of the first heating unit 76 and the second heating unit 77 is appropriately changed depending on the conditions of the type of the adhesive or the adhesive, the film thickness, and the like.

In the present embodiment, the heating unit 107 heats the film 60 by using the first heating unit 76 and the second heating unit 77. Therefore, the film 60 can be sequentially transferred to the heating unit 107. The man-hours required for heat treatment can be shortened.

In the film transport unit 104, the film 60 subjected to the heat treatment by the heating unit 107 is transferred to the cutter unit 48, and the film 60 is cut (step S5). In the cutter portion 48, as shown in Fig. 3, the film 60 on the pedestal portion 48b is pressed against the blade 48a, and only the main film member 61 in the film 60 is cut. The film 60 after the cutting by the cutter portion 48 is bonded to the protective member 62 by the adhesive layer 63 while the main film member 61 is cut into a predetermined length.

Specifically, the cutter portion 48 cuts only the main film member 61 so as to include the bonded portion and the non-bonded portion as described above.

Here, when the film 60 is cut, the conveyance of the film 60 is temporarily stopped. On the other hand, the conveyance by the film conveyance unit 104 except the cut portion of the film 60 continues. Therefore, the conveyance speed of the film 60 passing through the cutter portion 48 is different, and the film 60 is swayed due to the variation in the conveyance speed, resulting in a defective conveyance.

On the other hand, in the present embodiment, the time point adjustment unit 47 adjusts the deviation of the conveyance speed which occurs when the film 60 is cut. The timing adjustment unit 47 moves the contact roller unit 147 to the upstream side in the transport direction (+X direction) when the film 60 is cut. Therefore, the distance between the cutter portion 48 and the time point adjustment portion 47 (the contact roller portion 147) is increased, and the conveyance speed of the film 60 toward the cutter portion 48 is reduced. Therefore, it is possible to prevent the film 60 from sloshing in accordance with the conveying speed of the film 60.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film 60 can be favorably cut by the cutter portion 48 in the conveyed state. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

After the film is diced, the bonding apparatus (I) 100IA is bonded to the film 60 first, and the film position detecting unit 109 detects the film 60 conveyed by the film conveying unit 104 in the film width direction (Y direction). The relative position of the substrate 1 (the film position detecting process shown in step S6).

In addition, the bonding device (I) 100IA is first performed on the film 60 The bonding is pulled out from the cassette 102a of the substrate supply unit 102, and the substrate 1 is transported by the substrate transport unit 103 (steps S7 and S8).

Returning to step S6, the film position detecting unit 109 detects the end portion 60c of the film 60 in the conveyance direction (see Fig. 4). The result of the light reception by the light receiving unit 109b is sent to the determination unit 112. The determination unit 112 detects the relative position of the film 60 in the width direction with respect to the substrate 1 based on the positional information of the end portion 60c of the film 60 detected by the light receiving unit 109b, that is, the positional shift amount, and determines the film 60 for the substrate. Whether or not the position of 1 is offset (step S9).

When the position of the film 60 with respect to the substrate 1 is determined to be offset in the film width direction (in the case of YES in step S9), the determination unit 112 drives the position correcting mechanism 111 to correct the substrate 1 with respect to The relative position of the film 60 (step S10).

Specifically, in the step S10, the position correcting mechanism 111 drives the driving unit 111b to move the second substrate transporting roller unit 31 of the transport substrate 1 toward the width direction (Y direction) of the substrate 1 along with the base portion 111a. mobile. The position correcting mechanism 111 moves the second substrate transporting roller unit 31 to a direction in which no positional deviation occurs between the film 60 and the substrate 1. The second substrate conveyance roller unit 31 moves in the Y direction by the drive unit 111b along with the base portion 111a in a state in which the substrate 1 is conveyed. By the second substrate transfer roller unit 31 (position correction mechanism 111), the substrate 1 supplied to the film bonding unit 105 is not displaced in the width direction of the film 60, and the positions in the width direction are aligned. status.

On the other hand, the determination unit 112 determines that the position of the film 60 with respect to the substrate 1 is not shifted in the film width direction (in the case of NO in step S9), and does not drive the position correction mechanism 111. The substrate 1 is transported to the lower side of the film bonding unit 105 by the second substrate transfer roller unit 31, and proceeds to a film bonding process to be described later.

As described above, after the relative position of the film 60 with respect to the substrate 1 is corrected, the bonding of the film 60 to the substrate 1 is performed (step S11). In the step S11, the film bonding unit 105 bonds the film 1 to the substrate 1 conveyed by the substrate transfer unit 103 (the second substrate transfer roller unit 31).

Specifically, the substrate 1 is transported to the third substrate transport roller unit 32 (transport roller 32 a ) via the first substrate transport roller unit 30 and the second substrate transport roller unit 31 . The film transfer unit 104 lowers the film bonding roller 40 when the substrate 1 reaches the third substrate transfer roller unit 32. As a result, the film bonding roller 40 is pressed against the substrate 1 on the transport roller 32a (the third substrate transport roller portion 32) of the substrate transport unit 103. In addition, when the front end of the substrate 1 in the conveyance direction reaches the film bonding unit 105, the bonding portion of the film 60 conveyed by the film conveying unit 104 reaches the film bonding unit 105 in synchronization with the film bonding unit 105. The conveying speed of the substrate 1 is controlled.

The film 60 is attached to the protective film 63 by the adhesive layer 63 in a state where the main film 61 is cut into a predetermined length (a bonded portion or a non-bonded portion) by a cutting process by the cutter portion 48. Material 62 status.

Specifically, the film bonding roller 40 is lowered as described above when the leading end portion of the main film member 61 in the bonding portion corresponding to the film 60 is aligned with the leading end of the substrate 1 in the transport direction. In the present embodiment, when the second substrate transporting roller unit 32 transports the substrate 1 in step S8, the position of the substrate 1 is corrected so as not to be displaced in the width direction with respect to the film 60. Therefore, the main film material 61 of the bonding portion is conveyed in a state where the film bonding roller 40 and the conveying roller 32a are not displaced in the width direction with respect to the substrate 1, and therefore, together with the substrate 1 The main film member 61 is adhered to the substrate 1 through the adhesive N without being displaced in position.

The film 60 that has passed through the film bonding roller 40 is taken up by the film winding portion 51 via the relay rollers 52 and 53. Here, since the relay roller 52 is located above the film bonding position by the film bonding roller 40 (Z direction), the film 60 is bent sharply upward by the film bonding roller 40.

Therefore, in the film 60 bent upward by the relay roller 52, only the main film material 61 remains on the substrate 1 through the adhesive N, and only the protective material 62 is conveyed to the side of the relay roller 52 to make the main film. The material 61 is separated from the protective material 62 (step S12). The protective material 62 separated from the film 60 is taken up by the film winding unit 51 through the relay rollers 52 and 53 (step S13).

The substrate 1 to which the bonding portion of the main film member 61 is bonded by the film bonding portion 105 is transferred to the fourth substrate conveying roller portion 33. in In this case, the film bonding roller 40 is prevented from being caught between the non-bonding portion and the transport roller 32a, and is lifted before the end of the substrate 1 in the transport direction as described above. Therefore, after the transport direction The film 60 on the end side is insufficient for the pressing of the substrate 1, and the bonding of the film 60 is insufficient.

In the fourth embodiment, the bonding assisting unit 135 (the bonding auxiliary roller 135b) is attached to the fourth substrate transporting roller unit 33, and the substrate 1 is held between the transport roller 135a and the transport roller 135a until the rear end of the transport direction of the substrate 1. When the edge passes, the cut portion at the rear end of the film 60 which is insufficiently bonded can be surely adhered to the substrate 1. Therefore, the film 60 can be satisfactorily adhered to the entire substrate 1 .

The substrate 1 to which the main film member 61 is bonded is accommodated in a substrate carrying-out cassette (not shown) via the roller pair 133 and the fifth substrate conveying roller unit 34 (step S14).

The bonding apparatus (I) 100IA repeats the film bonding processing process SS1 of the above-described steps S1 to S14 until the main film material 61 (film 60) is attached to the predetermined number of substrates 1 in the substrate supply unit 102. The process ends (step S15). According to the above aspect, the bonding apparatus (I) 100IA can bond the film 60 to the substrate 1 of a predetermined number.

According to the present embodiment, the coating process for applying the adhesive or the adhesive to the film 60, the process of cutting the film 60, and the bonding of the film 60 to the substrate 1 can be performed in a single production line. The process allows the film 60 to be bonded to the substrate 1 efficiently. this Further, since the position correcting mechanism 111 corrects the relative position of the film 60 with respect to the substrate 1 in the width direction, that is, the positional deviation, the substrate 1 and the film 60 can be accurately attached.

Further, according to the above-described embodiment, since the second substrate transporting roller portion 31 integrally formed with the position correcting mechanism 111 is provided, the relative position of the substrate 1 with respect to the film 60 can be adjusted while the substrate 1 is being transported. Further, since the position correcting mechanism 111 corrects the position of the substrate 1 in the width direction, the film 60 is not moved in the width direction, and the relative position of the substrate 1 and the film 60 can be easily and surely corrected, that is, relative. Position offset.

Further, in the bonding apparatus (I) 100IA, since the film 60 coated with the adhesive or the adhesive is cut into a predetermined length, the film 60 can be used as the film 60 from the long roll body R. Therefore, it is possible to use a substrate of various sizes as the substrate 1 to be bonded to the film 60, and it is a highly versatile bonding device. Further, the film 60 discharged from the roll body R can be sequentially attached to the plurality of substrates 1, and the bonding process can be performed efficiently.

Further, in the bonding apparatus (I) 100IA, since the main film member 61 bonded to the substrate 1 is protected by the protective member 62, it is possible to prevent the main film member 61 before being bonded to the substrate 1 from being damaged.

Further, in the bonding apparatus (I) 100IA, since the adhesive or the adhesive is applied to the film 60 which is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the spray from falling and falling downward when applied. A stable film thickness adhesive or adhesive can be applied to the film 60. Therefore, unevenness in the coated surface of the adhesive or the adhesive can be suppressed. Therefore, the adhesion between the substrate 1 and the film can be improved.

The present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the invention. For example, in the above-described embodiment, a case where the position correcting mechanism 111 and the substrate conveying unit 103 (the second substrate conveying roller unit 31) are integrally formed is taken as an example. In other words, when the relative positions of the film 60 and the substrate 1 are adjusted, the position on the side of the substrate 1 is adjusted to correct the positional deviation between the two, but the present invention is not limited thereto. For example, a configuration in which the position of the film 60 in the width direction is corrected and the relative position of the film 60 to the substrate 1 is corrected may be employed. Further, a structure in which the film 60 and the substrate 1 are respectively moved in the width direction (Y direction) to correct the relative positions of each other may be employed.

Further, in the above-described embodiment, the case where the driving portion is provided in both the film feeding portion 41 and the film winding portion 51 is exemplified, but the driving portion may be provided only in the film winding portion 51, and the film may be taken up. The portion 51 that is actively rotated to perform passive rotation and that is unwound after the film feeding portion 41 is wound is wound.

Further, in the above embodiment, the heating unit 107 is exemplified as a case where the film 60 is heated in two stages, but the film 60 may be heated in one stage or three stages or more.

(Second embodiment of bonding device (I))

Next, a second embodiment of the bonding apparatus (I) will be described. In the following description, the same or equivalent to the above embodiment The structural parts are denoted by the same symbols, and the description thereof is simplified or omitted.

Fig. 13 is a view showing a schematic configuration of a bonding apparatus (I) 100IB of the present embodiment.

As shown in Fig. 13, the bonding apparatus (I) 100IB of the present embodiment includes an inspection unit 170 that inspects a film attached to the substrate 1. The inspection unit 170 is disposed between the fourth substrate conveyance roller unit 33 and the fifth substrate conveyance roller unit 34.

The inspection unit 170 includes a substrate transport roller unit 171, an imaging unit 172 that captures a film (main film 61) that is bonded to the substrate 1, and a determination unit 173 that determines an inspection result based on an imaging result by the imaging unit 172. .

The substrate transport roller unit 171 has a plurality of (four in the present embodiment) passive rollers 171a. By this, the substrate transport roller unit 171 moves so as to receive the substrate 1 transported from the fourth substrate transport roller unit 33 and transfer it to the fifth substrate transport roller unit 34.

The imaging unit 172 is configured by, for example, a CCD sensor or the like. The CCD sensor includes a plurality of pixels arranged in a matrix. Each pixel of the CCD sensor includes a light-receiving element such as a photodiode, and a switching element such as a thin film transistor.

The determination unit 173 is configured to determine the state of the film bonded to the substrate 1 based on the image captured by the imaging unit 172. The determination unit 173 can be constituted by a hardware such as an arithmetic circuit, or can be realized by a software such as a program.

Figure 14 is a diagram for explaining the thinness performed by the inspection unit 170. A diagram showing an example of a method of inspecting a film (main film 61).

As shown in FIG. 14, the inspection unit 170 images the four corners of the substrate 1 to which the main film 61 is bonded by the imaging unit 172, and transmits the captured image G to the determination unit 173. The determination unit 173 calculates the distances D1 and D2 between the respective edge portions of the corner portions constituting the substrate 1 and the main film member 61 with respect to the image G transmitted from the imaging unit 172.

The determination unit 173 compares the calculated distances D1 and D2 with the threshold value stored in advance, and determines that the main film member 61 is present with respect to the substrate 1 when the difference between the threshold value and the distances D1 and D2 is equal to or greater than a predetermined value. When the bent state is attached, the substrate 1 is judged to be defective. On the other hand, the determination unit 173 compares the calculated distances D1 and D2 with the above-described threshold value, and determines that the main film material 61 is relative to the predetermined value when the difference between the threshold value and the distances D1 and D2 is lower than a predetermined value. The substrate 1 is a good one, and the substrate 1 is judged to be a good product.

According to the present embodiment, since the inspection unit 170 is provided, the bonding state of the film (the main film member 61) to the substrate 1 can be determined, so that the determination of the substrate 1 as a good product or a defective product can be easily performed. Therefore, it is possible to provide the bonding apparatus (I) 100IB which can remove the substrate 1 which is defective in the bonding state of the film, and which is excluded in advance.

Further, in the present embodiment, the bonding apparatus (I) 100IB may feed back the inspection result by the inspection unit 170 to the position correcting mechanism 111. Specifically, the position correcting means 111 adjusts the relative positions of the substrate 1 and the film 60 based on the inspection result of the inspection unit 170 in addition to the detection result of the film position detecting unit 109. (Position offset). In this case, for example, when the film position detecting unit 109 fails, or the film position detecting unit 109 causes a positional shift in the width direction in the downstream direction of the film position detecting unit 109, the inspection unit 170 may be used. The relative results of the substrate 1 and the film 60 are corrected by feedback of the inspection results. Therefore, the substrate 1 and the film 60 can be bonded with high precision.

(The third embodiment of the bonding device (I))

Next, a third embodiment of the bonding apparatus (I) will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 15 is a view showing the structure of the bonding apparatus (I) of the third embodiment of the bonding apparatus (I). In the bonding apparatus (I) 100IC, as shown in FIG. 15, a plurality of static electricity removers 110 may be disposed in the apparatus casing 101. By removing the static electricity generated by the conveyance of the film 60, it is possible to prevent the occurrence of a problem such as the bonding of the film 60 due to static electricity, and the film 60 is favorably conveyed and bonded to the substrate 1.

Further, as shown in Fig. 15, the cooling portion 108 may be provided on the downstream side in the conveying direction of the film 60 of the heating portion 107. Thereby, the film 60 heated by the heating unit 107 can be cooled and lowered to a predetermined temperature in a short time. Therefore, the transport path of the film 60 can be shortened, and the film transport unit 104 can be downsized to realize the miniaturization of the bonding apparatus (I) 100IC.

(Fourth embodiment of the bonding device (I))

Next, a fourth embodiment of the bonding apparatus (I) will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above embodiment, the surface of the belt 93 is set to have a height equal to the surface of the film 60 as the film thickness adjusting mechanism 72. However, in the present embodiment, the virtual roller 90 is used without using the belt 93. The surface has a configuration in which the height of the surface of the film 60 coincides. At this time, it is preferable that the material of the dummy roller 90 is low in surface roughness, for example, SUS, resin, aluminum, or the like, whereby the film forming conditions of the adhesive or the adhesive at the film end of the film 60 can be favorably adjusted.

Fig. 16 is a view showing the structure of a film thickness adjusting portion of a fourth embodiment of the bonding apparatus (I), and is a perspective view of the same embodiment (a) and a cross-sectional view of the same drawing (b). In the present embodiment, as shown in FIGS. 16(a) and 16(b), the rotating shaft of the virtual roller 95 is integrally formed on the film holding roller 43, and the virtual roller 95 and the film holding roller 43 are integrally rotated. structure.

In the present embodiment, as shown in FIGS. 16(a) and (b), the virtual roller 95 integrally formed with the film holding roller 43 constitutes a film thickness adjusting portion. The virtual roller 95 rotates coaxially with the film holding roller 43. The virtual roller 95 is set to have the same height as the surface 95a and the surface of the film 60. That is, the virtual roller 95 is configured to have a larger outer diameter than the film holding roller 43 of the holding film 60.

However, an adhesive or adhesive is applied to the film 60 from the nozzle 73. When the agent is applied, the spray scattered from the nozzle 73 adheres to the virtual roller 95. In the present modification, the squeegee member 96 abutting against the surface of the virtual roller 95 is disposed. The squeegee member 96 abuts on a surface on the downstream side of the abutting portion of the virtual roller 95 with respect to the film 60 in the rotational direction. The material of the squeegee member 96 is preferably rubber, resin or the like, whereby the spray adhered to the virtual roller 95 can be satisfactorily scraped without damaging the dummy roller 95. Thereby, the squeegee member 96 can scrape the spray which scatters from the nozzle 73 and adheres to the surface of the virtual roller 95. The spray scraped by the squeegee member 96 can be collected in the washing portion W, or a recovery mechanism can be additionally provided. The cleaning portion W is stored at the bottom of the main body portion 80 of the spray recovery mechanism 71 shown in Fig. 10 . 89.

Thereby, the film thickness adjusting portion of the present invention can be formed only by the virtual roller 95, and the number of parts can be reduced, and the cost can be reduced. Further, since the virtual roller 95 and the film holding roller 43 rotate integrally, the driving portions of the virtual roller 90 and the film holding roller 43 can be shared, and the cost can be reduced.

(Fifth Embodiment of the bonding apparatus (I))

Next, a fifth embodiment of the bonding apparatus (I) will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above-described first embodiment, the structure in which the transport path of the film 60 is changed by the transfer roller 241 to adjust the tension of the film 60 is exemplified as the time point adjustment unit 47. However, the present invention is not limited thereto. It is here.

Fig. 17 is a view showing a schematic configuration of a bonding apparatus (I) 100ID of the present embodiment.

As shown in Fig. 17, the time point adjustment unit 247 of the present embodiment has an abutting roller portion 147 that abuts against the back side of the film 60, a holding portion 148 that holds the abutting roller portion 147, and The holding portion 148 moves along the driving direction 149 of the film 60 (X direction).

In order to cut the film 60 by the cutter portion 48, the timing adjustment unit 247 moves the contact roller portion 147 to the conveyance direction by matching the portion where the film 60 is temporarily stopped with the conveyance speed of the other portion in the middle of conveyance. The upstream side (+X direction). Thereby, since the distance between the cutter portion 48 and the time point adjustment portion 47 (contact roller portion 147) becomes long, the conveyance speed of the film 60 to the cutter portion 48 in appearance can be reduced, and the film can be prevented from being mixed with the conveyance speed of the film 60. 60 swayed due to a deviation in the conveying speed.

In the present embodiment, since the timing adjustment unit 247 adjusts the variation in the conveyance speed which occurs when the film 60 is cut, it is possible to prevent the film 60 from being swayed by the conveyance speed of the film 60.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film portion 60 can be satisfactorily cut by the cutter portion 48 in the conveyed state. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

(Sixth embodiment of the bonding device (I))

Next, a sixth embodiment of the bonding apparatus (I) will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment, the thickness of the adhesive or the adhesive applied to the film end in the width direction of the film 60 is made uniform by the film thickness adjusting mechanism 72. However, the present invention is not limited thereto. Therefore, the film thickness adjusting mechanism 72 may not be provided.

Fig. 18 is an enlarged view showing the structure of the periphery of the film holding roller 43 which is an important part of the bonding apparatus (I) of the present embodiment.

As shown in Fig. 18, in the present embodiment, the roller cleaning unit 150 for washing the adhesive or the adhesive adhering to the film holding roller 43 is provided.

In the present embodiment, the film holding roller 43 has a width larger than the width of the film 60 in a direction intersecting the conveying direction of the film 60. Therefore, the film holding roller 43 holds the entire surface of the film 60 while applying the adhesive or the adhesive from the nozzle 73 to prevent wrinkles or slack on the coated surface of the adhesive or the adhesive. Therefore, the adhesive or the adhesive is applied to the film 60 without unevenness.

On the other hand, since the film holding roller 43 has a larger width than the film 60, it is in a state in which both end portions are exposed when the film 60 is held. Therefore, a part of the adhesive or the adhesive applied from the nozzle 73 adheres to the film holding roller 43. In contrast, in this embodiment In the above, a roller cleaning unit 150 having an adhesive or an adhesive attached to the film holding roller 43 is provided.

The roller cleaning unit 150 includes a cleaning liquid application unit 150a and a squeegee member 150b for at least a portion of the film holding roller 43 to which an adhesive or an adhesive is adhered. The cleaning liquid is applied; the squeegee member 150b is in sliding contact with the surface 43a of the film holding roller 43 coated with the cleaning liquid.

The cleaning solution application unit 150a is configured by, for example, a spray nozzle, and is disposed so as to apply a cleaning liquid in a direction that does not face the application of the adhesive or the adhesive of the film 60. In the present embodiment, the cleaning liquid application portion 150a is disposed in parallel with the conveyance direction of the film 60, and the cleaning liquid is applied to the film holding roller 43 from above. Thereby, the problem of the adhesion of the cleaning liquid to the adhesive region of the film 60 or the application region of the adhesive is prevented.

The squeegee member 150b is at least in sliding contact with a portion of the surface 43a of the film holding roller 43 to which the cleaning liquid adheres. In the present embodiment, the squeegee member 150b has the same width as the film holding roller 43, and can wipe the entire surface 43a of the film holding roller 43 in a comprehensive manner. Further, the squeegee member 150b may be configured to wipe only the end portion of the surface 43a of the film holding roller 43 to which the cleaning liquid adheres. In this case, as long as two squeegee members 150b are prepared, the sliding contact is made. The surface 43a of both ends of the film holding roller 43 may be used.

The squeegee member 150b abuts on a surface on the downstream side of the film holding roller 43 from the abutting portion of the film 60 in the rotational direction. 43a. The material of the squeegee member 150b is preferably rubber or resin, whereby the adhesive or the cleaning agent adhering to the film holding roller 43 can be satisfactorily scraped without damaging the film holding roller 43.

As described above, according to the present embodiment, even if the bonding apparatus having the structure without the film thickness adjusting mechanism 72 is provided, the roller cleaning unit 150 is provided, and the adhesive adhering to the film holding roller 43 can be favorably removed. Or adhesive. Therefore, it is possible to prevent the occurrence of a problem of contamination inside the apparatus due to the adhesive or the adhesive attached to the film holding roller 43.

(Seventh embodiment of the bonding device (I))

Next, a seventh embodiment of the bonding apparatus (I) will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above-described first embodiment, the case where the cutter portion 48 cuts the main film member 61 in the width direction by the rotary blade 161 is exemplified, but the present invention is not limited thereto, and other configurations may be employed. Tool department.

Fig. 19 is a view showing a schematic configuration of an important part of the bonding apparatus (I) of the present embodiment, that is, a cutter portion and its periphery.

As shown in Fig. 19, the cutter portion 160 has a blade 48a for cutting (cutting) the film 60, and a pedestal portion 48b which is disposed opposite to the blade 48a. In the cutter portion 160, the film 60 is pressed against the film 60 on the pedestal portion 48b, and the film 60 can be cut. Specifically, the cutter portion 48 presses the blade 48a to the same position as shown in Fig. 19. It is sufficient to cut only the position of the main film 61 in the film 60. In this way, the film 60 can be bonded to the protective member 62 by the adhesive layer 63 while the main film member 61 is cut into a predetermined length.

As described above, according to the present embodiment, the cutter portion 160 presses the blade 48a over the entire width direction of the film 60, and the film 60 can be simply and reliably cut.

Hereinafter, an embodiment of the bonding apparatus (II) of the present invention will be described with reference to the drawings. In the following description, the same or equivalent components as those of the above-described bonding apparatus (I) are denoted by the same reference numerals, and the description thereof will be simplified or omitted. The bonding apparatus (II) of the present embodiment is a device for bonding a protective material and a main film material from a film while transferring a film, and bonding the main film material to the substrate, wherein the film is a long protective material and The film in which the main film materials are bonded together is unwound from a wound body wound in a roll shape.

(First embodiment of the bonding device (II))

Fig. 20 is a side view showing a schematic structure of a bonding apparatus (II) 100IIA of the present embodiment.

In the present embodiment, the film winding unit 51 includes a winding shaft 57, a driving unit 54, a winding unit control unit (control unit) 55, and a detecting unit 56 for winding The protective material 62 separated from the film 60 after being bonded by the film bonding unit 105; the driving unit 54 drives the winding shaft 57; and the winding portion control unit (control unit) 55 Controlling the driving unit 54; the detecting unit 56 detects the winding The winding diameter of the wrap 51R constituted by the protective material 62 of the take-up shaft 57.

The take-up shaft 57 is formed, for example, by a reel shape, and can be wound up by being wound around a cylindrical surface to take up the protective material 62. The drive unit 54 is configured by, for example, a motor, and the winding shaft 57 is rotationally driven on a predetermined rotating shaft.

The take-up portion control unit 55 controls the drive unit 54 to adjust the rotational torque of the take-up shaft 57 based on the detection result of the detecting unit 56 as will be described later. Further, the winding unit control unit 55 may be constituted by one of the entire control units that control the operation of the entire bonding apparatus (II) 100IIA (not shown), or may be provided separately from the entire control unit.

The detecting unit 56 is for detecting the radius (winding radius) of the wrap 51R formed by winding the protective member 62 around the take-up shaft 57. The detecting unit 56 detects the winding diameter of the protective member 62 in a non-contact manner. In the present embodiment, the detecting unit 56 is constituted by, for example, an ultrasonic sensor. The detecting unit 56 includes an ultrasonic wave illuminating unit 56a, a sound wave detecting unit 56b, and a calculating unit 56c that illuminates the ultrasonic wave toward the wrap 51R. The sound wave detecting unit 56b detects the wrap. The sound wave after the 51R reflection; the calculation unit 56c calculates a predetermined detection result (radius of the wrap 51R) based on the detection signal by the sound wave detecting unit 56b. Further, the calculation unit 56c may be constituted by a hardware such as an arithmetic circuit, or may be realized by a software such as a program.

The calculation unit 56c obtains the distance between the sound wave detecting unit 56b and the wrap 51R based on the information detected by the sound wave detecting unit 56b (the time until the sound wave reflected by the surface of the wrap 51R returns). Calculation department For example, the distance between the winding unit 51 (winding shaft 57) before the winding of the protective material 62 and the sound wave detecting unit 56b (the time until the reflected sound wave returns) is recorded as an initial value in the internal memory. body. The calculation unit 56c calculates the protection based on the distance calculated from the initial value recorded in the internal memory and the time required for the sound wave detecting unit 56b to detect the sound wave (the distance between the surface of the wrap 51R and the sound wave detecting unit 56b). The take-up diameter of the material 62. As described above, the detecting unit 56 can detect the winding diameter of the protective member 62. The detection unit 56 outputs the detection result of the winding diameter of the protective material 62 to the winding unit control unit 55.

Here, when the tension of the protective member 62 is T, and the winding radius of the wrap 51R composed of the take-up protecting member 62 is r, the rotational torque of the winding portion 51 can be It is represented by the following formula (N=r×T).

In the equation, when the tension T of the protective member 62 is constant, the diameter of the wrap 51R is increased by the winding of the protective member 62, so that the winding portion is increased in proportion to the diameter. The rotational torque of 51 must be set to the torque of the drive unit 54.

Therefore, in the present embodiment, the winding portion control unit 55 controls the winding diameter of the driving portion 54 to adjust the rotational torque of the winding shaft 57 in response to the protective member 62.

Specifically, the winding unit control unit 55 controls the driving unit 54 to increase the rotational torque of the winding shaft 57 in a stepwise manner (for example, three stages) in proportion to the winding diameter of the protective material 62. As described above, the film take-up portion 51 can maintain the conveyance speed of the protective member 62 at a constant speed.

In the present embodiment, the film winding unit 51 winds up the protective material 62 in the film 60 to form the film transport unit 104 that transports the film 60 to the lower side of the substrate 1.

In other words, in the present embodiment, the conveying speed of the protective material 62 by the film winding unit 51 means the conveying speed of the film 60 by the film conveying unit 104. Therefore, according to the present embodiment, the winding unit control unit 55 controls the driving unit 54 to increase the rotational torque of the winding shaft 57 in proportion to the winding diameter of the protective member 62. As a result, the film transport unit 104 is The film 60 can be given a certain tension and the film 60 can be conveyed at a constant speed.

Next, an operation of bonding the film 60 to the substrate 1 will be described as an operation of the bonding apparatus (II) 100IIA of the present embodiment.

Fig. 21 is a flow chart showing the lamination process of the film 60 by the bonding apparatus (II) 100IIA.

First, in the bonding apparatus (II) 100IIA, the roll body R is attached to the film feeding portion 41 (step S'1).

After the roll body R is mounted, the bonding apparatus (II) 100IIA drives the film transport unit 104 to release the film 60 (step S'2). Specifically, the film transport unit 104 rotationally drives the film feed portion 41 and the film take-up portion 51 to transport the film 60 in a predetermined direction.

The film take-up portion 51 drives the drive portion 54 under the control of the take-up portion control portion 55 to rotate the take-up shaft 57. The take-up shaft 57 winds up the protective material 62 and conveys the film 60 in a predetermined direction. In the present embodiment, the film take-up portion 51 is rotationally driven on the take-up shaft 57. At the time of the use, the detecting unit 56 starts the detection of the winding diameter of the protective member 62 and the adjustment of the rotational torque of the winding shaft 57 (step S'3).

In the step S'3, the detecting unit 56 irradiates the ultrasonic wave toward the wrap 51R from the ultrasonic illuminating unit 56a, and detects the sound wave reflected by the wrap 51R by the acoustic wave detecting unit 56b. The sound wave detecting unit 56b outputs a detection signal to the calculating unit 56c, and the calculating unit 56c calculates the radius of the wrap 51R, that is, the winding diameter of the protective material 62. The detection unit 56 outputs the detection result of the winding diameter of the protective material 62 to the winding unit control unit 55.

The take-up portion control unit 55 increases the diameter of the wrap 51R by the winding of the protective member 62 based on the detection result of the detecting portion 56 (the winding diameter of the protective member 62), so that the diameter is increased. The rotation torque of the take-up shaft 57 is increased in proportion, and the torque of the drive portion 54 is set. For example, the take-up portion control unit 55 controls the winding of the take-up shaft with a small rotational torque in the case where the diameter of the wrap 51R is small as when the film take-up portion 51 is just driven. In the manner of 57, the driving portion 54 is driven, and in the case where the diameter of the winding body 51R is increased as the winding of the protective member 62 is performed, the rotational torque of the winding shaft 57 is gradually increased and is performed with a strong force. drive.

Therefore, according to the present embodiment, the take-up portion control unit 55 can control the drive unit 54 to increase the rotational torque of the take-up shaft 57 in proportion to the winding diameter of the protective member 62. Therefore, the film transport unit 104 applies a constant tension to the film 60 and transports the film 60 to the lower side of the substrate 1 at a constant speed.

The bonding apparatus (II) 100IIA is used to convey the film 60 by the film conveying unit 104, and the coating unit 106 is driven to apply the adhesive or the adhesive (step S'4). Specifically, in the application unit 106, the nozzle 73 moves in a substantially figure-eight manner with respect to the rotation center of the rotating portion 75, and applies an adhesive or adhesion to the film 60 conveyed by the film conveying unit 104. Agent. The application portion 106 rotates the main body portion 74 of the holding nozzle 73 around the X-axis by the rotating portion 75 while moving the nozzle 73 by the moving mechanism 79, so that the tip end of the nozzle 73 can extend over the width direction of the film 60 and The transport direction moves through the entire area without a gap (see Fig. 7). Therefore, the adhesive or the adhesive can be applied uniformly over the entire width direction of the film 60.

However, when the film 60 is coated with an adhesive or an adhesive, the thickness of the adhesive or the adhesive at the film end becomes larger due to the change in the scattering condition of the film end adhesive or the adhesive in the width direction of the film 60. The central part is thinner. On the other hand, in the application portion 106 of the present embodiment, when the adhesive or the adhesive is applied to the film 60 from the nozzle 73, the film thickness adjusting mechanism 72 functions to be adjusted so as to be applied to the width direction of the film 60. The thickness of the adhesive or adhesive at the film end becomes uniform.

Specifically, the film thickness adjusting mechanism 72 rotates the virtual roller 90 in synchronization with the rotation of the film holding roller 43 of the conveying film 60. At this time, the surface of the belt 93 of the pylon on the surface of the virtual roller 90 and the surface of the film 60 of the film holding roller 43 at the pylon are at the same height.

Thereby, since the surface of the belt 93 is located at the same height as the surface of the film 60 near the film end, it can be substantially made at the film end. The scattering conditions of the adhesive or adhesive are consistent with those of the central part.

Therefore, the adhesive or the adhesive applied from the nozzle 73 does not change the scattering condition of the adhesive or the adhesive even at the film end of the film 60, and the film forming conditions of the adhesive or the adhesive can be made in the film 60. The width direction is set to be stable and the adhesive or the adhesive is applied under uniform conditions.

When an adhesive or an adhesive is applied to the film 60 from the nozzle 73, the spray is scattered from the nozzle 73 to the surroundings. On the other hand, in the application unit 106 of the present embodiment, the spray can be recovered by the spray recovery mechanism 71. Specifically, the spray scattered from the nozzle 73 is captured by the cleaning unit 84 of the spray cleaning unit 81 (the spray recovery unit 71) that covers the back surface 60a and the side surface 60b of the film 60. Way to set.

As described above, the cleaning unit 84 has a structure in which the cleaning liquid flows down the surface of the brush member, so that the captured spray is discharged to the lower side together with the cleaning liquid. Thereby, it is not necessary to accumulate the captured spray in the washing portion 84, and the spray can be recovered stably.

The washing liquid after the spray recovery is discharged from the cleaning liquid receiving portion 85 to the bottom of the main body portion 80, and the foreign matter is removed by the filter F of the cleaning liquid circulation portion 82, and then circulated again in the cleaning portion 84.

Further, in the present embodiment, since the adhesive or the adhesive is applied to the film 60 conveyed in the vertical direction (Z direction) from the nozzle 73, it is possible to prevent the particles of the adhesive or the adhesive applied from the nozzle 73. In the case where the particles are rough (large particles) are applied to the film 60, only the fine particles (small particles) are applied to the film 60. As a result, by Since the adhesive or the adhesive after coating contains uniform particles, it can be applied in a state where the occurrence of unevenness is suppressed. Since the adhesive or the adhesive is small in surface unevenness, the problem of lowering the flatness of the main film 61 can be prevented even when it is bonded to the substrate 1 in the later-described step.

In the film transport unit 104, the film 60 coated with the adhesive or the adhesive by the application unit 106 is transferred to the heating unit 107, and the film 60 is heated (baked) to harden the adhesive or the adhesive ( Step S'5). Specifically, in the heating unit 107, first, the first (1st) baking treatment is performed on the film 60 by the first heating unit 76. Next, the heating unit 107 performs a second (2nd) baking treatment on the film 60 by the second heating unit 77. The heating temperature of the first heating unit 76 and the second heating unit 77 is appropriately changed depending on the conditions of the type of the adhesive or the adhesive, the film thickness, and the like.

In the present embodiment, the heating unit 107 heats the film 60 by using the first heating unit 76 and the second heating unit 77. Therefore, the film 60 can be sequentially transferred to the heating unit 107. The man-hours required for heat treatment can be shortened.

In the film transport unit 104, the film 60 subjected to the heat treatment by the heating unit 107 is transferred to the cutter unit 48, and the film 60 is cut (step S'6). The cutter portion 48 presses the rotary blade 161 against the film 60 on the film supporting portion 162 as shown in Fig. 3, and cuts only the main film member 61 of the film 60. The cut film 60 by the cutter portion 48 is formed by cutting the main film member 61 to a predetermined length. In the state of being adhered to the protective member 62 by the adhesive layer 63.

Specifically, the cutter portion 48 cuts only the main film member 61 so as to include the bonded portion and the non-bonded portion as described above. The cutter portion 48 is movably cut from the one end side toward the other end side of the film 60 by the rotary blade 161, whereby the film 60 can be easily and surely cut. Further, the film 60 can be easily and surely cut by using the rotary blade 161. Further, since the blade cleaning portion 163 is provided, the performance of the cutting by the rotary blade 161 can be maintained by washing the rotary blade 161, and as a result, the life of the rotary blade 161 can be extended.

Further, since the cutter portion 48 of the present embodiment rotationally drives the rotary blade 161 in a state of being in contact with the sponge member 163a, the adhesive layer 63 adhering to the tip end of the rotary blade 161 can be reliably washed and removed.

Further, in the present embodiment, the case where the cutter portion 48 includes the rotary blade 161 is exemplified, but the cutter blade does not have to be rotated, and the non-rotating blade may be moved to the width direction of the film 60. The structure of the film 60 (main film 61) is cut.

However, when the film 60 is cut, the conveyance of the film 60 is temporarily stopped. On the other hand, the conveyance by the film conveyance unit 104 except the cut portion of the film 60 continues. Therefore, the conveyance speed of the film 60 passing through the cutter portion 48 is different, and the film 60 is swayed due to the variation in the conveyance speed, resulting in a defective conveyance.

On the other hand, in the present embodiment, the time point adjustment unit 47 adjusts the deviation of the conveyance speed which occurs when the film 60 is cut. The time adjustment portion 47 is freely adjusted to impart a film by the conveyance roller 241. The conveyance path of the film 60 is changed by the tension of 60, and the distance between the cutter portion 48 of the film 60 and the timing adjustment portion 47 (the conveyance roller 241) can be extended. Therefore, the conveyance speed of the film 60 to the outer appearance of the cutter portion 48 can be reduced, and by adjusting the conveyance speed of the entire film 60, it is possible to prevent the film 60 from being swayed due to variations in the conveyance speed. Further, in the present embodiment, since the lever adjusting member 47 rotates the lever member 242 in a simple manner, it is possible to reduce the size and cost of the entire device.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film 60 can be favorably cut by the cutter portion 48 in the conveyed state. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

Next, a bonding process of the cut film 60 is performed. In the bonding apparatus (II) 100IIA, the film 60 is bonded first, and is pulled out from the cassette 102a of the substrate supply unit 102, and the substrate 1 is transported by the substrate transport unit 103 (steps S'7, S'8). ).

The substrate transfer unit 103 moves the substrate 1 to the film bonding unit 105. The film bonding unit 105 performs bonding of the film 60 to the substrate 1 conveyed by the substrate conveying unit 103 (step S'9). In addition, when the front end of the substrate 1 in the conveyance direction reaches the film bonding unit 105, the bonding portion of the film 60 conveyed by the film conveying unit 104 reaches the film bonding unit 105 in synchronization with the film bonding unit 105. The conveying speed of the substrate 1 is controlled.

Specifically, the substrate 1 is conveyed by the first substrate transfer roller The unit 30 and the second substrate transport roller unit 31 are transported to the third substrate transport roller unit 32 (transport roller 32a). The film transfer unit 104 lowers the film bonding roller 40 when the substrate 1 reaches the third substrate transfer roller unit 32. As a result, the film bonding roller 40 presses the substrate 1 on the substrate 1 on the transport roller 32a (the third substrate transport roller portion 32) of the substrate transport unit 103.

The film bonding roller 40 is attached to the substrate 1 by bonding the main film 61 of the bonding portion of the film 60. The film 60 is bonded to the film member 48 by a cutting process, and the main film member 61 is cut into a predetermined length (a bonded portion or a non-bonding portion) by an adhesive layer 63. The state of the protective material 62.

Specifically, the film bonding roller 40 is lowered as described above when the leading end portion of the main film member 61 in the bonding portion corresponding to the film 60 is aligned with the leading end of the substrate 1 in the transport direction. The main film material 61 of the bonding portion is held between the film bonding roller 40 and the conveying roller 32a together with the substrate 1, and the main film material 61 is passed through the substrate 1 through the adhesive N. In the present embodiment, the film 60 (the main film member 61) is conveyed to the film conveyance unit 104 at a constant speed, and is conveyed to the lower surface of the substrate 1 with a constant tension. Therefore, by holding between the film bonding roller 40 and the conveying roller 32a, the main film material 61 can be satisfactorily adhered to the substrate 1 through the adhesive N, and high bonding reliability can be obtained.

The film 60 that has passed through the film bonding roller 40 is taken up by the film winding portion 51 via the relay rollers 52 and 53. Here, the relay wheel 52 is located above the position where the film is bonded by the film bonding roller 40 (Z direction). Therefore, the film 60 is bent sharply upward by the film bonding roller 40.

Therefore, only the main film material 61 passes through the adhesive N and remains on the substrate 1 by the film 60 bent upward by the relay roller 52, and only the protective material 62 is conveyed to the side of the relay roller 52 to make the main film 61 Separated from the protective material 62 (step S'10). The protective material 62 separated from the film 60 is taken up by the film winding portion 51 through the relay rollers 52, 53 (step S'11).

The substrate 1 to which the bonding portion of the main film member 61 is bonded by the film bonding portion 105 is transferred to the fourth substrate conveying roller portion 33. Here, the film bonding roller 40 is raised in the conveyance direction so as to prevent the gap between the transfer roller 32a and the transfer roller 32a of the non-bonding portion from being caught before the rear end of the substrate 1 in the conveyance direction as described above. The film 60 on the rear end side is insufficient for the pressing of the substrate 1, and the bonding of the film 60 is insufficient.

In the fourth embodiment, the bonding assisting unit 135 (the bonding auxiliary roller 135b) is attached to the fourth substrate transporting roller unit 33, and the substrate 1 is held between the transport roller 135a and the transport roller 135a until the rear end of the transport direction of the substrate 1. When the edge passes, the cut portion at the rear end of the film 60 which is insufficiently bonded can be surely adhered to the substrate 1. Therefore, the film 60 can be satisfactorily adhered to the entire substrate 1 .

The substrate 1 to which the main film 61 is bonded is accommodated in a substrate (not shown) via the roller pair 133 and the fifth substrate transfer roller unit 34. The film is used (step S'12).

The bonding apparatus (II) 100IIA repeats the film bonding processing process SS'1 of the above steps S'1 to S'12 (step S'13) until the main film material 61 (film 60) is supplied to the substrate The bonding of the substrate 1 of a predetermined number of sheets in the portion 102 is completed. According to the above aspect, the bonding apparatus (II) 100IIA can bond the film 60 to the substrate 1 of a predetermined number.

As described above, according to the present embodiment, the rotational torque of the winding shaft 57 can be adjusted in accordance with the winding diameter of the wrap 51R which varies depending on the winding amount of the protective material 62. Therefore, for example, as the winding diameter is increased, the rotational torque is increased and the protective material 62 is wound up with a strong force. Therefore, the protective material 62 can be supplied with a certain tension and transported at a constant speed. To the underside of the substrate 1. By this, the main film material 61 peeled off from the protective material 62 is bonded to the substrate 1 by the film bonding portion 105 in a state where the conveyance speed is constant and the tension is constant. Therefore, the main film material 61 can be bonded to the substrate 1 with a constant tension to obtain good adhesion, and the protective material can be peeled off favorably. Further, according to the bonding apparatus (II), the coating process for applying the adhesive or the adhesive to the film 60, the process of cutting the film 60, and the bonding of the film 60 to the substrate can be performed in a single production line. With the process of 1, the film 60 can be bonded to the substrate 1 efficiently.

Further, in the above-described embodiment, since the detecting portion 56 can detect the winding diameter of the protective member 62 in a non-contact manner, it is possible to prevent the occurrence of a problem that hinders the operation of the winding shaft 57. Further, since the detecting unit 56 Since it is constituted by an ultrasonic sensor, it is possible to easily and surely perform the detection of the winding diameter of the protective material in a non-contact manner as described above.

Further, in the bonding apparatus (II) 100IIA, the film 60 coated with the adhesive or the adhesive is cut into a predetermined length. Therefore, the film 60 can be used as the film 60 from the long roll body R. Therefore, various sizes can be used as the substrate 1 to be bonded to the film 60, and the bonding device (II) having high versatility can be used. Further, the film 60 discharged from the roll body R can be sequentially attached to the plurality of substrates 1, and the bonding process can be performed efficiently.

Further, in the bonding apparatus (II) 100IIA, since the main film member 61 bonded to the substrate 1 is protected by the protective member 62, it is possible to prevent the main film member 61 before being bonded to the substrate 1 from being damaged.

Further, since the bonding apparatus (II) 100IIA is coated with an adhesive or an adhesive on the film 60 that is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the spray from scattering during application and falling downward. Adhesion can be applied to the film 60 with a stable film thickness adhesive or adhesive. Therefore, unevenness in the coated surface of the adhesive or the adhesive can be suppressed. Therefore, the adhesion between the substrate 1 and the film can be improved.

The present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the invention. For example, in the above-described embodiment, the case where the detecting unit 56 is constituted by an ultrasonic sensor is exemplified, but the present invention is not limited thereto. For example, a reflective sensor can also be used in place of the ultrasonic sensor. In this case, the detecting unit 56 may be provided with a predetermined detection for irradiating, for example, ultraviolet light or the like. The light source unit and the detecting unit configured by, for example, a CCD sensor and receiving the detection light reflected on the surface of the wrap 51R. Further, each pixel of the CCD sensor may include a light receiving element such as a photodiode or a switching element such as a thin film transistor.

Further, in the above-described embodiment, the case where the non-contact type detection (ultrasonic sensor) is used as the detection unit 56 is exemplified, but the invention is not limited thereto, and the detection may be performed by contact.

In the detection method by the contact method, for example, as shown in Fig. 22 (a) and (b), the contact member 65 is brought into contact with the surface of the wrap 51R, and the take-up detection by the protective member 62 is accompanied. The amount of movement of the contact member 65 (rotation angle θ) by the change in the diameter of the roll 51R can detect the take-up diameter of the protective member 62.

Further, in the bonding apparatus (II) 100IIA of the above-described embodiment, a case where the cutter portion 48 in which only the main film member 61 of the film 60 is cut into a predetermined length is exemplified, but the invention is not limited thereto. Alternatively, the cutter portion 48 may not be provided. Alternatively, the cutter portion 48 may be part of a device configuration other than the bonding device (II) 100IIA. In this case, the bonding apparatus (II) 100IIA may be a structure in which the film 60 to which the main film material 61 is bonded to the protective material 62 in a state of being cut in half is bonded to the substrate 1.

Further, in the bonding apparatus (II) 100IIA of the above-described embodiment, a case where an adhesive or an adhesive is applied to the application portion 106 of the main film member 61 is exemplified, but the invention is not limited thereto. The coating unit 106 may not be provided. Alternatively, the coating portion 106 may be a bonding device (II) Part of the construction of a device other than 100IIA. In this case, the bonding apparatus (II) 100IIA is a structure in which the main film material 61 on which the adhesive is applied on the surface is bonded to the substrate 1, or a surface in which the adhesive is applied to the surface of the substrate 1 in advance. The structure can be.

Further, in the above-described embodiment, the case where the driving portion is provided in both the film feeding portion 41 and the film winding portion 51 is exemplified, but the driving portion may be provided only in the film winding portion 51, and the film may be taken up. The portion 51 that is actively rotated to perform passive rotation and that is unwound after the film feeding portion 41 is wound is wound.

Further, in the above embodiment, the heating unit 107 is exemplified as a case where the film 60 is heated in two stages, but the film 60 may be heated in one step or three stages or more.

(Second embodiment of the bonding device (II))

Next, a second embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 23 is a view showing the structure of the bonding apparatus (II) of the second embodiment. In the bonding apparatus (II) 100IIB, as shown in FIG. 23, a plurality of static electricity removers 110 may be disposed in the apparatus casing 101. By removing the static electricity generated by the conveyance of the film 60, it is possible to prevent the occurrence of problems such as the bonding of the film 60 due to static electricity, and the film 60 can be favorably conveyed and bonded to the substrate 1. .

In addition, as shown in FIG. 23, the heating unit 107 may be used. The cooling unit 108 is provided on the downstream side in the conveyance direction of the film 60. Thereby, the film 60 heated by the heating unit 107 can be cooled and lowered to a predetermined temperature in a short time. Therefore, the transport path of the film 60 can be shortened, and the film transport unit 104 can be miniaturized to achieve miniaturization of the bonding apparatus (II) 100IIB.

(The third embodiment of the bonding device (II))

Next, a third embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above embodiment, the surface of the belt 93 is set to have a height equal to the surface of the film 60 as the film thickness adjusting mechanism 72. However, in the present embodiment, the virtual roller 90 is used without using the belt 93. The surface has a configuration in which the height of the surface of the film 60 coincides. In this case, it is preferable that the material of the dummy roller 90 is low in surface roughness, for example, SUS, resin, aluminum, or the like, whereby the film forming conditions of the adhesive or the adhesive at the film end of the film 60 can be favorably adjusted to prepare an adhesive. Or adhesive.

The film thickness adjusting portion of the third embodiment is referred to as Fig. 16 and described above.

(Fourth embodiment of the bonding device (II))

Next, a fourth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment, the structure in which the transport path of the film 60 is changed by the transfer roller 241 to adjust the tension of the film 60 is exemplified as the time point adjustment unit 47. However, the present invention is not limited thereto.

Fig. 24 is a view showing a schematic configuration of a bonding apparatus (II) 100IIC of the present embodiment.

As shown in Fig. 24, the time point adjustment unit 247 of the present embodiment has a contact roller portion 147 that abuts against the back side of the film 60, a holding portion 148 that holds the contact roller portion 147, and can The holding portion 148 moves along the driving direction 149 of the film 60 (X direction).

The time point adjustment unit 247 moves the contact roller unit 147 to the transport direction by matching the transport speed of the portion where the film 60 is temporarily stopped and the portion of the other transporting portion when the film 60 is cut by the cutter portion 48. The upstream side (+X direction). Thereby, since the distance between the cutter portion 48 and the time point adjustment portion 47 (contact roller portion 147) becomes long, the conveyance speed of the film 60 to the cutter portion 48 in appearance can be reduced, and the conveyance speed of the film 60 can be blended. The film 60 is prevented from swaying due to variations in the conveying speed.

In the present embodiment, since the timing adjustment unit 247 adjusts the variation in the conveyance speed which occurs when the film 60 is cut, it is possible to prevent the film 60 from being swayed by the conveyance speed of the film 60.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film 60 can be favorably formed by the cutter portion 48 in the conveyed state. Cut off. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

(Fifth Embodiment of the bonding device (II))

Next, a fifth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment, the thickness of the adhesive or the adhesive applied to the film end in the width direction of the film 60 is uniform because the film thickness adjusting mechanism 72 is provided. However, the present invention is not limited thereto. Alternatively, the film thickness adjusting mechanism 72 may not be provided.

In the present embodiment, as shown in FIG. 18 (an enlarged view of the structure of the periphery of the film holding roller 43,), the roller cleaning unit 150 for washing the adhesive or the adhesive adhering to the film holding roller 43 is provided. . The structure and function of the film holding roller 43 and the roller cleaning unit 150 according to the present embodiment are related to the bonding apparatus (I), and refer to Fig. 18 as described above.

According to the present embodiment, even if the bonding apparatus (II) having the structure without the film thickness adjusting mechanism 72 is provided, the roller cleaning unit 150 is provided, and the adhesive or adhesion adhering to the film holding roller 43 can be favorably removed. Agent. Therefore, it is possible to prevent the occurrence of a problem of contamination inside the apparatus due to the adhesive or the adhesive attached to the film holding roller 43.

(Sixth embodiment of the bonding device (II))

Next, a sixth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above-described first embodiment, the case where the cutter portion 48 cuts the main film member 61 in the width direction by the rotary blade 161 is exemplified, but the present invention is not limited thereto, and other configurations may be employed. Tool department.

In the present embodiment, as shown in Fig. 19 (showing a schematic view of the cutter portion and the periphery thereof), the cutter portion 160 has a blade 48a and a pedestal portion 48b for cutting (cutting). The film 60; the pedestal portion 48b is disposed opposite to the blade 48a. The structure and function of the cutter portion 160 are related to the bonding device (I), and refer to Fig. 19 and are as described above.

According to the present embodiment, the cutter portion 160 presses the blade 48a over the entire width direction of the film 60, and the film 60 can be simply and reliably cut.

(Seventh embodiment of the bonding device (II))

Next, a seventh embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 25 is a view showing a schematic structure of a bonding apparatus (II) 100IID of the present embodiment.

As shown in Fig. 25, the bonding apparatus 100IID of the present embodiment includes an inspection unit 170 that inspects a film attached to the substrate 1. The inspection unit 170 is disposed between the fourth substrate conveyance roller unit 33 and the fifth substrate conveyance roller unit 34.

The structure and function of the inspection unit 170 are related to the bonding device (I) and are as described above. The method of inspecting the film (main film member 61) by the inspection unit 170 is related to the bonding device (I), and the method illustrated in the above can be employed by referring to FIG.

According to the present embodiment, since the inspection unit 170 is provided, the bonding state of the film (main film member 61) to the substrate 1 can be determined, so that the determination of the substrate 1 as a good product or a defective product can be easily performed. Therefore, it is possible to provide the bonding apparatus 100IID which can remove the substrate 1 which is a defective product in which the bonding state of the film is not good, and which is excluded in advance. In the above description, the case where the four corners of the substrate 1 are imaged by the imaging unit 172 is exemplified, but the present invention is not limited thereto, and only two of the four corners of the substrate 1 may be imaged. .

Hereinafter, an embodiment of the bonding apparatus (III) of the present invention will be described with reference to the drawings. In the following description, the same or equivalent components as those of the above-described bonding apparatus (I) are denoted by the same reference numerals, and the description thereof will be simplified or omitted. The bonding apparatus (III) of the present embodiment is a device for bonding a protective material and a main film material from a film while transferring a film, and bonding the main film material to the substrate, wherein the film is a long protective material and The film in which the main film material is bonded is unwound from a wound body wound in a roll shape.

(First embodiment of the bonding device (III))

Fig. 26 is a side view showing a schematic structure of a bonding apparatus (III) 100IIIA of the present embodiment.

The fourth substrate conveyance roller unit 33 receives the substrate 1 to which the film is bonded to the film conveyance unit 104 and conveys it toward the downstream side. The fourth substrate transfer roller unit 33 constitutes a sandwiching portion for sandwiching the end portion of the substrate in which the film is not bonded to the substrate 1. The fourth substrate transfer roller unit 33 has a plurality of (three in the present embodiment) roller pairs 133. Each of the roller pairs 133 has a lower roller 33a and an upper roller 33b. The lower roller 33a constitutes a transport roller that transports the substrate 1. Further, the upper roller 33b constitutes a grip roller for sandwiching the end portion of the substrate 1 between the lower roller 33a and the lower roller 33a. The substrate 1 is conveyed while being held between the rollers 33a and 33b (clamped state).

The lower roller 33a and the upper roller 33b are attached to a casing portion (not shown).

Specifically, the upper roller 33b is attached to a casing portion (not shown) through the holding member 134, for example. The upper roller 33b is rotatably attached to one end side of the holding member 134 via the rotating shaft 132. The upper roller 33b may also be composed of either a passive roller or an active roller. The upper roller 33b is made of an elastic material such as rubber. Thereby, damage to the surface of the substrate 1 at the time of abutment can be prevented.

The holding member 134 is supported by a housing portion (not shown) through the spring member 134a. In addition, the holding member 134 is permeable The over-rotation shaft 139 holds the other end side rotatably in a casing portion (not shown). As a result, the upper roller 33b is pressed downward by the transmission spring member 134a, and the rotation member 139 is rotated by the rotation shaft 139 to be displaced at least in the vertical direction (Z-axis direction).

A substrate abutting portion 136 is disposed between the third substrate transporting roller portion 32 and the fourth substrate transporting roller portion 33.

Fig. 27 is a view showing the configuration of an important portion of the periphery of the substrate abutting portion 136.

As shown in Fig. 27, the substrate abutting portion 136 includes a roller member 136a, a spring member 136b, and a holding member 136c for holding the roller member 136a. The roller member 136a is rotatably attached to one end side of the holding member 136c via the rotating shaft 137. The roller member 136a may also be composed of any one of a passive roller or an active roller. The roller member 136a is made of an elastic material such as rubber. Thereby, damage to the surface of the substrate 1 at the time of abutment can be prevented.

The holding member 136c is rotatably held by a housing portion (not shown) through the rotating shaft 138. The spring member 136b is attached to a casing portion (not shown) so as to support one end side of the holding member 136c. As a result, the roller member 136a is pressed downward by the transmission spring member 136b, and the rotation member 136 is rotated by the rotation shaft 138 to be displaced at least in the vertical direction (Z-axis direction).

In the present embodiment, the film 60 is formed of an elongated strip having a main film member 61, a protective member 62, and an adhesive layer 63 for applying the main film member 61 and the protective member 62. Fit (Refer to Figure 3). In the film bonding portion 105, only the main film member 61 of the film 60 is bonded to the upper surface of the substrate 1.

The roller member 136a (substrate abutting portion 136) is provided in the vicinity of the film bonding position 105a of the film bonding portion 105, and is located lower than the upper surface of the substrate 1 of the film bonding position 105a. The upper surface of the substrate 1 refers not only to the single body of the substrate 1 (excluding the state of the main film 61 after bonding) but also to the surface of the main film 61 attached to the substrate 1. In addition, the vicinity of the film bonding position 105a means the film bonding portion 105 or the position where the film bonding portion 105 does not contact the peeled protective material 62, and the shape of the substrate abutting portion 136 is required (for example, The diameter is set as appropriate.

In addition, the film bonding position 105a is a line located between the center of the transport roller 32a and the film bonding roller 40, and specifically, a gap between the transport roller 32a and the film bonding roller 40. Fig. 27 shows a state in which the leading end of the substrate 1 in the transport direction reaches the film bonding position 105a.

In the present embodiment, as shown in Fig. 27, when the height of the surface of the main film member 61 on the upper surface of the substrate 1 is H1, and the height of the lowermost end portion of the roller member 136a is H2, it satisfies H1>H2 conditions. Further, the roller member 136a can be moved in the vertical direction by the turning operation by the holding member 136c, but it is also set to satisfy the above-described condition of H1>H2 in the range of rotation by the holding member 136c. In the present embodiment, the difference in height between H1 and H2 is set to, for example, 0.2 mm. In addition, the roller member 136a is formed by a spring member The pressing force of 136b gives a predetermined pressing force to the substrate 1.

Further, the substrate abutting portion 136 is disposed on the lower side in the vertical direction of the upper roller 33b (roller pair 133), and the upper roller 33b constitutes a pinch roller for holding the substrate 1 to which the film is bonded.

In the present embodiment, as shown in Fig. 27, when the height of the lowermost end portion of the upper roller 33b is H3, the condition of H3 > H2 is satisfied. Further, the upper roller 33b can be moved in the vertical direction by the turning operation by the holding member 134. However, the above-described H3>H2 condition is also satisfied in the range of rotation by the holding member 134. Further, although a plurality of upper rollers 33b (three in the present embodiment) may be provided, they are all provided at the same height. Further, the magnitude relationship between the height H1 and the height H3 is not limited as long as the above two conditions (H1>H2 and H3>H2) are satisfied.

That is, in the present embodiment, although H1 and H3 are set to the same height for convenience of explanation, any of H1>H3 or H1<H3 may be satisfied.

According to such a configuration, the roller member 136a of the substrate contact portion 136 can be brought into contact with the side end portion of the substrate 1 to which the main film member 61 is bonded in the film bonding portion 105 as will be described later. The substrate 1 that is in contact with the roller member 136a enters the lower side of the roller member 136a by bending downward, and is brought into contact with the roller member 136a to be pressed.

The film take-up portion 51 has a protective material for being wound up from the film 60 after being bonded by the film bonding portion 105. A winding shaft 51a of 62 and a driving portion 51b for driving the winding shaft 51a.

The relay rollers 52 and 53 relay the conveyance of the film 60 between the film bonding roller 40 and the film winding unit 51. The relay roller 52 is located above the position 105a (see FIG. 27) where the film is bonded by the film bonding roller 40 (in the Z direction).

Further, the relay roller 52 is disposed above the substrate abutting portion 136 and the film bonding portion 105 in the transport direction of the substrate 1. As a result, the film 60 that has passed through the film bonding roller 40 is bent sharply upward, and only the divided main film material 61 is bonded to the substrate 1 as will be described later, and the protective material 62 is removed from the main film 61. Stripped and separated.

In the present embodiment, the film bonding roller 40 is formed such that the leading end portion of the main film member 61 in the bonding portion corresponding to the film 60 coincides with the leading end of the substrate 1 in the transport direction (that is, the main film material) When the front end of the conveyance direction of the 61 is reached at the time of reaching the film bonding position, the contact portion is lowered, and the contact portion reaches the rear end portion of the main film member 61 corresponding to the bonding portion (the rear end in the conveyance direction of the substrate 1) ( That is, the time at which the rear end of the main film 61 in the conveyance direction reaches the film bonding position starts to rise. As described above, the film bonding roller 40 is repeatedly lifted and lowered every time the film 60 is bonded to the substrate 1.

However, in the present embodiment, the film bonding portion 105 separates the protective material 62 from the film 60, and only the main film member 61 is bonded to the substrate 1. At this time, the main film member 61 cut into a predetermined length by the cutter portion 48 is favorably held by the protective member 62 by the adhesive 63. However, the pressing force due to the film bonding portion 105 and the tensile force of the protective member 62 due to the film winding portion 51 are bonded to the substrate 1, and only the protective member 62 is peeled off. .

As described above, only the main film material 61 is bonded to the substrate 1 from the front end side toward the rear end side in the conveyance direction. However, when the substrate 1 passes through the film bonding position 105a at the rear end portion in the conveyance direction, the clamping force by the film bonding portion 105 (the film bonding roller 40 and the conveying roller 32a) does not function. At this time, the main film member 61 bonded to the rear end portion of the substrate 1 in the transport direction is cut by the cutter portion 48. However, since the above-described gripping force does not function, the adhesion due to the adhesive layer 63 cannot be overcome. The force causes the rear end portion of the substrate 1 in the transport direction to slightly rise upward with the protective material 62. Therefore, there is a fear that the substrate 1 will jump due to the impact of the separation of the main film material 61 from the protective material 62. Further, although the main film member 61 is cut by the cutter portion 48, the adhesion of the adhesive layer 63 is not completely cut, for example, when the depth of the cut half is not sufficiently cut, or even if the depth of the cut half is sufficient. When the strength is more than necessary, the force that the substrate 1 lifts upward is increased. In this case, when the substrate 1 is bouncing, the constituent members of the substrate 1 or the fifth substrate transporting roller portion 34 that transports the substrate 1 may be damaged by vibration.

On the other hand, in the bonding apparatus (III) 100IIIA of the present embodiment, the substrate abutting portion 136 is disposed between the third substrate conveying roller portion 32 and the fourth substrate conveying roller portion 33. Fig. 28 is a view for explaining the action performed by the substrate abutting portion 136. In addition, in Fig. 28, in order to easily view the drawing, the roller member 136a is used. The illustration of the peripheral structure of the upper roller 33b is simplified. That is, the illustration of the spring members 136b, 134a and the holding members 136c, 134 is omitted.

The substrate 1 passing through the film bonding position 105a of the film bonding portion 105 is a roller member 136a of the substrate abutting portion 136, as shown in Fig. 28(a). In the present embodiment, the roller member 136a is disposed at a position lower than the upper surface of the substrate 1. When the substrate 1 is transported to the downstream side by the transport roller 32a of the film bonding unit 105, as shown in Fig. 28(b), the substrate 1 is bent downward and enters the lower side of the roller member 136a. In the present embodiment, the roller member 136a is displaced upward by the spring member 136b, and the substrate 1 is smoothly guided downward.

The substrate 1 is conveyed toward the downstream side in a state where the upper surface is pressed by the roller member 136a. As shown in Fig. 28(c), the side surface on the distal end side in the transport direction abuts against the lower roller 33a, and the lower roller 33a constitutes a holding roller for holding the substrate 1 after the film is bonded. In the present embodiment, the lowermost end portion of the upper roller 33b is disposed at a lower position than the upper surface of the substrate 1, and is disposed on the uppermost end portion of the lower roller 33a disposed on the upper roller 33b. The higher position above.

In this case, when the substrate 1 is transported to the downstream side by the transport roller 32a of the film bonding unit 105, as shown in FIG. 28(d), the substrate 1 is bent upward to climb the upper and lower rollers 33a, and enters the The gap between the lower roller 33a and the upper roller 33b. As a result, the end portion of the substrate 1 on the distal end side in the transport direction is sandwiched (held) on the lower roller 33a and the upper roller 33b (the fourth substrate transport roller portion 33).

According to the present embodiment, even when the film bonding position 105a is passed through the film bonding position 105a at the rear end portion of the substrate 1 in the conveying direction, the clamping force by the film bonding portion 105 does not function. As shown in FIG. 8(e), the upper surface of the substrate 1 is pressed by the substrate abutting portion 136 so that the substrate 1 is bent downward. Therefore, it is possible to prevent the rear end portion of the substrate 1 from being lifted upward with the protective member 62, and the protective member 62 and the main film member 61 can be separated well. Therefore, it is possible to prevent the substrate 1 from jumping due to the pulling of the main film 61 attached to the substrate 1 by the protective member 62, and it is possible to prevent the occurrence of breakage due to the jump of the substrate 1. Further, although the main film member 61 is cut by the cutter portion 48, the adhesion of the adhesive layer 63 is not completely cut, for example, when the depth of the cut half is not sufficiently cut, or even if the depth of the cut half is sufficient. When it is more than necessary, there is a possibility that the force raised above the substrate 1 increases. According to the present embodiment, since the upper surface of the substrate 1 can be reliably pressed by the substrate contact portion 136, a particularly remarkable effect can be obtained in the case where the force lifted by the substrate 1 is increased as described above.

Next, an operation of bonding the film 60 to the substrate 1 will be described as an operation of the bonding apparatus (III) 100IIIA of the present embodiment.

Fig. 29 is a flow chart showing the lamination process of the film 60 by the bonding apparatus (III) 100IIIA.

First, in the bonding apparatus (III) 100IIIA, the roll body R is attached to the film feeding portion 41 (step S"1).

After the roll body R is mounted, the bonding apparatus (III) 100IIIA drives the film transport unit 104 to release the film 60 (step S2). In other words, the film transport unit 104 rotates the film feed unit 41 and the film take-up unit 51 to transport the film 60 in a predetermined direction.

The bonding apparatus (III) 100IIIA is used to convey the film 60 by the film conveying unit 104, and the coating unit 106 is driven to apply the adhesive or the adhesive (step S3). Specifically, In the application unit 106, the nozzle 73 is moved in a substantially figure-eight manner with respect to the rotation center of the rotating portion 75, and an adhesive or an adhesive is applied to the film 60 conveyed by the film conveying unit 104. The cloth portion 106 rotates the main body portion 74 of the holding nozzle 73 around the X-axis by the rotating portion 75 while moving the nozzle 73 by the moving mechanism 79, so that the tip end of the nozzle 73 can be conveyed throughout the width direction of the film 60 and conveyed. The entire direction is moved without a gap (refer to Fig. 7). Therefore, an adhesive or an adhesive can be uniformly applied over the entire width direction of the film 60.

However, when the film 60 is coated with an adhesive or an adhesive, the thickness of the adhesive or the adhesive at the film end becomes larger due to the change in the scattering condition of the film end adhesive or the adhesive in the width direction of the film 60. The central part is thinner. On the other hand, in the application portion 106 of the present embodiment, when the adhesive or the adhesive is applied to the film 60 from the nozzle 73, the film thickness adjusting mechanism 72 functions to adjust the width of the film 60 to be applied. The thickness of the adhesive or adhesive at the film end of the direction becomes uniform.

Specifically, the film thickness adjusting mechanism 72 rotates the virtual roller 90 in synchronization with the rotation of the film holding roller 43 of the conveying film 60. At this time, the surface of the belt 93 of the pylon on the surface of the virtual roller 90 and the surface of the film 60 on the film holding roller 43 of the pylon are the same height. degree.

Thereby, since the surface of the belt 93 is located at the same height as the film end near the surface of the film 60, the scattering condition of the adhesive or the adhesive at the film end can be substantially made uniform with the center portion.

Therefore, the adhesive or the adhesive applied from the nozzle 73 does not change the scattering condition of the adhesive or the adhesive even at the film end of the film 60, so that the film forming conditions of the adhesive or the adhesive are on the film 60. The adhesive agent or the adhesive is applied in a uniform condition under uniform conditions in the width direction.

When an adhesive or an adhesive is applied to the film 60 from the nozzle 73, the spray is scattered from the nozzle 73 to the surroundings. On the other hand, in the application unit 106 of the present embodiment, the spray can be recovered by the spray recovery mechanism 71. Specifically, the spray scattered from the nozzle 73 is captured by the cleaning unit 84 of the spray cleaning unit 81 (the spray recovery unit 71) that covers the back surface 60a and the side surface 60b of the film 60. Mode setting.

As described above, the cleaning unit 84 has a structure in which the cleaning liquid flows down the surface of the brush member, so that the captured spray is discharged to the lower side together with the cleaning liquid. Thereby, it is not necessary to accumulate the captured spray in the washing portion 84, and the spray can be recovered stably.

The washing liquid after the spray recovery is discharged from the cleaning liquid receiving portion 85 to the bottom of the main body portion 80, and the foreign matter is removed by the filter F of the cleaning liquid circulation portion 82, and then circulated again in the cleaning portion 84.

Further, in the present embodiment, an adhesive or a paste is applied to the film 60 conveyed in the vertical direction (Z direction) from the nozzle 73. Since the agent is applied, it is possible to prevent the particles of the adhesive or the adhesive applied from the nozzle 73 from being applied to the film 60 when the particles are rough (large particles), and only the fine particles (small particles) are applied to the film. 60. In this case, since the adhesive or the adhesive after application contains uniform particles, the coating can be performed in a state where the occurrence of unevenness is suppressed. Since the adhesive or the adhesive is small in surface unevenness, the problem of lowering the flatness of the main film 61 can be prevented even when it is bonded to the substrate 1 in the later-described step.

In the film transport unit 104, the film 60 coated with the adhesive or the adhesive by the application unit 106 is transferred to the heating unit 107, and the film 60 is heated (baked) to cure the adhesive or the adhesive. Specifically, in the heating unit 107, first, the first (1st) baking process is performed on the film 60 by the first heating unit 76 (step S′4). Next, the heating unit 107 is used by the second heating unit 77. The film 60 is subjected to a second (2nd) baking treatment (step S"5). The heating temperature of the first heating unit 76 and the second heating unit 77 is appropriately changed depending on the conditions of the type of the adhesive or the adhesive, the film thickness, and the like.

In the present embodiment, the heating unit 107 heats the film 60 by using the first heating unit 76 and the second heating unit 77. Therefore, the film 60 can be sequentially transported into the heating unit 107, and The man-hours required for heat treatment can be shortened.

In the film transport unit 104, the film 60 subjected to the heat treatment by the heating unit 107 is transferred to the cutter unit 48, and the film 60 is cut (step S6). The cutter portion 48 is as shown in Fig. 3. General The film 60 on the film supporting portion 162 presses the rotary blade 161, and only the main film 61 in the film 60 is cut. The film 60 after the cutting by the cutter portion 48 is bonded to the protective member 62 by the adhesive layer 63 while the main film member 61 is cut into a predetermined length.

Specifically, the cutter portion 48 cuts only the main film member 61 so as to include the bonded portion and the non-bonded portion as described above. The cutter portion 48 is movably cut from the one end side toward the other end side of the film 60 by the rotary blade 161, whereby the film 60 can be easily and surely cut. Further, the film 60 can be easily and surely cut by using the rotary blade 161. Further, since the blade cleaning portion 163 is provided, the cutting performance by the rotary blade 161 can be maintained by washing the rotary blade 161, and as a result, the life of the rotary blade 161 can be extended.

Further, since the cutter portion 48 of the present embodiment rotationally drives the rotary blade 161 in a state of being in contact with the sponge member 163a, the adhesive layer 63 adhering to the tip end of the rotary blade 161 can be reliably washed and removed.

Further, in the present embodiment, the case where the cutter portion 48 includes the rotary blade 161 is exemplified, but the cutter blade does not have to be rotated, and the blade that does not rotate can be moved to the width of the film 60. The structure of the film 60 (main film member 61) is cut in the direction.

However, when the film 60 is cut, the conveyance of the film 60 is temporarily stopped. On the other hand, the conveyance by the film conveyance unit 104 other than the cut portion of the film 60 continues. Therefore, the conveyance speed of the film 60 passing through the cutter portion 48 is different, and the film 60 is swayed due to the variation in the conveyance speed, resulting in a defective conveyance.

On the other hand, in the present embodiment, the time point adjustment unit 47 adjusts the deviation of the conveyance speed which occurs when the film 60 is cut. The timing adjustment unit 47 changes the conveyance path of the film 60 by adjusting the tension applied to the film 60 by the conveyance roller 241, and extends the distance between the cutter portion 48 of the film 60 and the time adjustment portion 47 (the conveyance roller 241). . Therefore, the conveyance speed of the film 60 to the outer appearance of the cutter portion 48 can be reduced, and by adjusting the conveyance speed of the entire film 60, it is possible to prevent the film 60 from being swayed due to the variation in the conveyance speed. Further, in the present embodiment, since the lever adjusting member 47 rotates the lever member 242 in a simple manner, it is possible to reduce the size and cost of the entire device.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film 60 can be favorably cut by the cutter portion 48 in the conveyed state. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

Next, a bonding process of the cut film 60 is performed. In the bonding apparatus (III) 100IIIA, the film 60 is bonded first, and is pulled out from the cassette 102a of the substrate supply unit 102, and the substrate 1 is transported by the substrate transport unit 103 (steps S7, S8). ).

The substrate transfer unit 103 moves the substrate 1 to the film bonding unit 105. The film bonding unit 105 performs bonding of the film 60 to the substrate 1 conveyed by the substrate conveying unit 103 (step S9). Further, the substrate conveying unit 103 is configured such that the leading end of the substrate 1 in the conveying direction reaches the film sticker. Combined At the time of the portion 105, the conveyance speed of the substrate 1 is controlled so that the bonding portion of the film 60 conveyed by the film conveying portion 104 reaches the film bonding portion 105 in synchronization with each other.

Specifically, the substrate 1 passes through the first substrate transport roller unit 30 and the second substrate transport roller unit 31 , and is transported to the third substrate transport roller unit 32 (transport roller 32 a ). The film transfer unit 104 lowers the film bonding roller 40 when the substrate 1 reaches the third substrate transfer roller unit 32. As a result, the film bonding roller 40 is pressed against the substrate 1 on the transport roller 32a (the third substrate transport roller portion 32) of the substrate transport unit 103.

The film bonding roller 40 is attached to the substrate 1 by bonding the main film 61 of the bonding portion of the film 60. The film 60 is bonded to the film member 48 by a cutting process, and the main film member 61 is cut into a predetermined length (a bonded portion or a non-bonding portion) by an adhesive layer 63. The state of the protective material 62.

Specifically, as described above, the film bonding roller 40 is lowered at the time when the leading end portion of the main film member 61 corresponding to the bonding portion of the film 60 in the conveying direction and the leading end of the substrate 1 in the conveying direction are lowered. The main film material 61 of the bonding portion is held between the film bonding roller 40 and the conveying roller 32a together with the substrate 1, and the main film material 61 is passed through the substrate 1 through the adhesive N.

The film 60 that has passed through the film bonding roller 40 is taken up by the film winding portion 51 via the relay rollers 52 and 53. Here, the relay roller 52 is positioned closer to the film than the film bonding roller 40. Further upward (Z direction), the film 60 is bent sharply upward through the film bonding roller 40.

Therefore, only the main film material 61 is left on the substrate 1 by the adhesive N by the film 60 bent upward by the relay roller 52, and only the protective material 62 is conveyed to the side of the relay roller 52 to separate the main film 61 and The protective material 62 (step S" 10). The protective material 62 separated from the film 60 is taken up by the film winding portion 51 through the relay rollers 52, 53 (step S"11).

In the present embodiment, even when the film bonding position 105a is passed through the film bonding position 105a at the rear end portion of the substrate 1 in the transport direction, the clamping force by the film bonding portion 105 does not function. The substrate abutting portion 136 presses the upper surface so that the substrate 1 is bent downward. The substrate abutting portion 136 is provided in the vicinity of the film bonding position 105a and lower than the upper surface of the substrate 1 of the film bonding position 105a. position. Thereby, the jump of the substrate 1 can be prevented. Therefore, it is possible to prevent the occurrence of the problem of breakage of the substrate 1 due to jumping.

The substrate 1 to which the bonding portion of the main film member 61 is bonded by the film bonding portion 105 is sequentially transferred to the fourth substrate conveying roller portion 33 and the fifth substrate conveying roller portion 34, and then stored in the figure. The substrate is carried out in the sheet cassette (step S"12).

The bonding apparatus (III) 100IIIA repeats the film bonding processing process SS"1 (step S"13) of the above steps S"1 to S"12 until the main film material 61 (film 60) is supplied to the substrate The bonding of the substrate 1 of a predetermined number of sheets in the portion 102 is completed. By above In the bonding apparatus (III) 100IIIA, the film 60 can be favorably bonded to the substrate 1 of a predetermined number.

As described above, according to the present embodiment, the coating process for applying the adhesive or the adhesive to the film 60, the process of cutting the film 60, and the bonding of the film 60 to the substrate 1 can be performed in a single production line. Therefore, the film 60 can be attached to the substrate 1 efficiently. Further, since the position correcting mechanism 111 corrects the relative position of the film 60 with respect to the substrate 1 in the width direction, that is, the positional deviation, the substrate 1 and the film 60 can be accurately attached. Further, in the present embodiment, by providing the substrate contact portion 136, the jump of the substrate 1 can be prevented. Therefore, it is possible to provide a bonding apparatus (III) 100IIIA which is highly reliable in preventing damage of the substrate 1, and the substrate is abutted. The joint portion 136 is provided in the vicinity of the film bonding position 105a of the film bonding portion 105, and is located lower than the upper surface of the substrate 1 of the film bonding position 105a.

Further, in the bonding apparatus (III) 100IIIA, since the substrate abutting portion 136 is mainly constituted by the roller member 136a, it is possible to prevent the surface of the substrate 1 from being damaged during the contact. Further, it is possible to prevent the conveyance of the substrate 1 from being hindered by the rotation of the roller member 136a.

Further, in the bonding apparatus (III) 100IIIA, the substrate abutting portion 136 is displaceable at least in the vertical direction by the spring member 136b. Therefore, when the substrate 1 comes into contact with the substrate abutting portion 136, the substrate abutting portion 136 The spring member 136b is displaced to the upper direction to be retracted, and the substrate 1 can be smoothly guided below the substrate abutting portion 136. Therefore, it is possible to prevent the problem that the substrate 1 is transported by the substrate abutting portion 136. occur.

Further, in the bonding apparatus (III) 100IIIA, the substrate abutting portion 136 is disposed on the lower side in the vertical direction of the upper roller 33b constituting the nip roller, and therefore can be sandwiched at the distal end side of the substrate 1 in the conveying direction. In the state in which the rear end side in the conveyance direction abuts against the board contact portion 136, it is in a state of being bent downward. Therefore, the substrate abutting portion 136 can surely suppress the rear end portion of the substrate 1 in the transport direction, and can more reliably prevent the substrate 1 from jumping.

Further, in the bonding apparatus (III) 100IIIA, since the film 60 coated with the adhesive or the adhesive is cut into a predetermined length, the film 60 can be used as the film 60 from the long roll body R. Therefore, it is possible to use a substrate of various sizes as the substrate 1 to be bonded to the film 60, and it is a highly versatile bonding device. Further, the film 60 discharged from the roll body R can be sequentially attached to the plurality of substrates 1, and the bonding process can be performed efficiently.

Further, in the bonding apparatus (III) 100IIIA, by the operation of winding the protective material 62 by the film winding unit 51, the conveying operation of the film 60 can be easily and surely performed.

Further, in the bonding apparatus (III) 100IIIA, since the adhesive film or the adhesive is applied to the film 60 which is conveyed in the direction perpendicular to the horizontal plane, for example, in the vertical direction, it is possible to prevent the spray from scattering during application and falling downward. Adhesion can be applied to the film 60 with a stable film thickness adhesive or adhesive. Therefore, unevenness in the coated surface of the adhesive or the adhesive can be suppressed. Therefore, the adhesion between the substrate 1 and the film can be improved.

Further, the present invention is not limited to the above embodiment. Appropriate changes can be made without departing from the spirit of the invention. For example, in the above-described embodiment, the case where the driving portion is provided in both the film feeding portion 41 and the film winding portion 51 is exemplified, but the driving portion may be provided only in the film winding portion 51, and the film may be taken up. The portion 51 that is actively rotated to perform passive rotation and that is unwound after the film feeding portion 41 is wound is wound.

Further, in the above embodiment, the heating unit 107 is exemplified as a case where the film 60 is heated in two stages, but the film 60 may be heated in one step or three stages or more.

(Second embodiment of the bonding device (III))

Next, a second embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 30 is a view showing the structure of the bonding apparatus (III) of the second embodiment. In the bonding apparatus (III) 100IIIB, as shown in FIG. 30, a plurality of static electricity removers 110 may be disposed in the apparatus casing 101. By removing static electricity generated by the conveyance of the film 60, it is possible to prevent problems such as bonding of the film 60 due to static electricity, and the film 60 can be favorably conveyed and bonded to the substrate 1.

Further, as shown in Fig. 30, the cooling portion 108 may be provided on the downstream side in the conveying direction of the film 60 of the heating portion 107. Thereby, the film 60 heated by the heating unit 107 can be cooled and lowered to a predetermined temperature in a short time. Therefore, the transport path of the film 60 can be shortened, and the film transport unit 104 can be miniaturized to realize the bonding device (III). 100IIIB is miniaturized by itself.

(Third embodiment of bonding device (III))

Next, a third embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the above embodiment, the surface of the belt 93 is set to have a height equal to the surface of the film 60 as the film thickness adjusting mechanism 72. However, in the present embodiment, the virtual roller 90 is used without using the belt 93. The surface has a configuration in which the height of the surface of the film 60 coincides. In this case, it is preferable that the material of the dummy roller 90 is low in surface roughness, for example, SUS, resin, aluminum, or the like, whereby the film forming conditions of the adhesive or the adhesive at the film end of the film 60 can be favorably adjusted and an adhesive is prepared. Or adhesive.

In the bonding apparatus (III) of the third embodiment, a film thickness adjusting portion having a structure as shown in Fig. 16 is used. The construction and function of the members shown in Fig. 16 are related to the bonding device (I) and are as described above.

(Fourth embodiment of the bonding device (III))

Next, a fourth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment described above, the film 60 is changed as the tension applied to the film 60 is freely adjusted by the conveyance roller 241. The structure of the transport path is the time point adjustment unit 47, but the present invention is not limited thereto.

Fig. 31 is a view showing a schematic configuration of a bonding apparatus (III) 100IIIC of the present embodiment.

As shown in Fig. 31, the bonding apparatus (III) 100IIIC of the present embodiment is provided with a time adjustment unit 247 having the same structure as that of the conveyance path adjusting unit 42.

The timing adjustment unit 247 has an abutting roller portion 147 that abuts against the back side of the film 60, a holding portion 148 that holds the abutting roller portion 147, and a conveying direction of the holding portion 148 along the film 60 (X The drive unit 149 that moves in the direction.

The time point adjustment unit 247 moves the contact roller unit 147 to the transport direction by matching the transport speed of the portion where the film 60 is temporarily stopped and the portion of the other transporting portion when the film 60 is cut by the cutter portion 48. The upstream side (+X direction). Thereby, since the distance between the cutter portion 48 and the time point adjustment portion 47 (contact roller portion 147) becomes long, the conveyance speed of the film 60 to the cutter portion 48 in appearance can be reduced, and the conveyance speed of the film 60 can be made In cooperation, the film 60 is prevented from swaying due to variations in the conveying speed.

In the present embodiment, since the timing adjustment unit 247 adjusts the variation in the conveyance speed which occurs when the film 60 is cut, it is possible to prevent the film 60 from being swayed by the conveyance speed of the film 60.

Therefore, the film conveyance unit 104 does not cause the conveyance failure of the film 60, and the film 60 can be favorably formed by the cutter portion 48 in the conveyed state. Cut off. Further, since the film transport unit 104 does not need to temporarily stop the transport of the film 60 every time the cutting operation is performed by the cutter portion 48, the work time required for the bonding of the film 60 can be shortened.

(Fifth Embodiment of the bonding device (III))

Next, a fifth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment, the thickness of the adhesive or the adhesive applied to the film end in the width direction of the film 60 is made uniform by the film thickness adjusting mechanism 72. However, the present invention is not limited thereto. Therefore, the film thickness adjusting mechanism 72 may not be provided.

In the present embodiment, as shown in FIG. 18 (an enlarged view of the structure of the periphery of the film holding roller 43,), the roller cleaning unit 150 for washing the adhesive or the adhesive adhering to the film holding roller 43 is provided. . The structure and function of the film holding roller 43 and the roller cleaning unit 150 according to the present embodiment are related to the bonding apparatus (I), and refer to Fig. 18 as described above.

(Sixth embodiment of the bonding device (III))

Next, a sixth embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

In the first embodiment described above, the cutter portion 48 is cited. The case where the main film 61 is cut in the width direction by the rotary blade 161 is taken as an example, but the present invention is not limited thereto, and another structure may be employed as the cutter portion.

In the present embodiment, as shown in Fig. 19 (showing a schematic view of the cutter portion and the periphery thereof), the cutter portion 160 has a blade 48a and a pedestal portion 48b for cutting (cutting). The film 60; the pedestal portion 48b is disposed opposite to the blade 48a. The structure and function of the cutter portion 160 are related to the bonding device (I), and refer to Fig. 19 and are as described above.

According to the present embodiment, the cutter portion 160 presses the blade 48a over the entire width direction of the film 60, and the film 60 can be simply and reliably cut.

(Seventh embodiment of the bonding device (III))

Next, a seventh embodiment will be described. In the following description, structural elements that are the same or equivalent to those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 32 is a view showing a schematic configuration of a bonding apparatus (III) 100IIID of the present embodiment.

As shown in Fig. 32, the bonding apparatus (III) 100IIID of the present embodiment includes an inspection unit 170 that inspects a film attached to the substrate 1. The inspection unit 170 is disposed between the fourth substrate conveyance roller unit 33 and the fifth substrate conveyance roller unit 34.

The structure and function of the inspection unit 170 are related to the sticker. Unit (I), and as described above. The method of inspecting the film (main film member 61) by the inspection unit 170 is related to the bonding device (I), and the method illustrated in the above can be employed by referring to FIG.

1‧‧‧Substrate

R‧‧‧ 卷卷

30‧‧‧First substrate transfer roller unit

30a‧‧‧Passive wheel

31‧‧‧Second substrate transfer roller unit

31a‧‧‧Bottom roller

31b‧‧‧Upper wheel

32‧‧‧3rd substrate transfer roller unit

32a‧‧‧Transport roller

33‧‧‧4th substrate transfer roller unit (holding unit)

33a‧‧‧Bottom roller (transport roller)

33b‧‧‧Upper roller (clamping roller)

34‧‧‧5th substrate transfer roller unit

34a‧‧‧Passive wheel

40‧‧‧Film Fitting Roller

41‧‧‧ Film delivery department

41a‧‧‧Rotary Drive Department

42‧‧‧Transport path adjustment unit

43‧‧‧Film retaining roller

44‧‧‧1st adsorption roller

45‧‧‧Relay roller

47‧‧‧ time adjustment department

48‧‧‧Tools Department

49‧‧‧2nd adsorption roller

51‧‧‧ Film Reeling Department

51a‧‧‧Rolling shaft

51b‧‧‧Driving Department

52‧‧‧Relay wheel

53‧‧‧Relay wheel

60‧‧‧ film

76‧‧‧1st heating department

77‧‧‧2nd heating department

100IA‧‧‧Fitting device

101‧‧‧ device housing

102‧‧‧Substrate supply department

102a‧‧‧ pieces (cassette)

102b‧‧‧Driving Department

103‧‧‧Substrate transport unit

104‧‧‧film transport department

105‧‧‧Film Fitting Department

106‧‧‧ Coating Department

107‧‧‧heating department

109‧‧‧Film position detection department

109a‧‧‧Laser injection department

109b‧‧‧Receiving Department

111‧‧‧Location Correction Mechanism

111a‧‧‧ base

131‧‧‧Roller pair

133‧‧‧Roller pair

135‧‧‧Affiliation Assistant

135a‧‧‧Transport roller (2nd transfer roller)

135b‧‧‧Adhesive auxiliary roller

141‧‧‧Leverage

142‧‧‧Resist the wheel

240‧‧‧Rotation

241‧‧‧Transport roller

242‧‧‧Leverage components

Claims (23)

A bonding apparatus comprising: a film conveying unit, an application unit, a bonding unit, a position detecting unit, and a position correcting unit that transports a film; the coating unit applies a coating liquid Applying to the film; the bonding portion is configured to bond the film to the substrate; and the position detecting portion detects that the film before bonding to the substrate is opposite to the film width direction intersecting with the conveying direction The relative position of the substrate; the position correcting means corrects the relative position based on at least the detection result of the position detecting portion when the film is bonded. The bonding apparatus according to claim 1, further comprising a substrate transporting unit that transports the substrate and is integrally formed with the position correcting mechanism. The bonding apparatus according to the second aspect of the invention, wherein the position correcting means corrects a position of the substrate in a substrate width direction intersecting a substrate conveying direction in which the substrate is conveyed. The bonding apparatus according to claim 1, further comprising a cutter that cuts the film coated with the coating liquid to a predetermined length. The bonding apparatus according to claim 1, wherein the film comprises a main film material and a protective material coated with the coating liquid, and the bonding portion is the protective material from the main film material. Stripping, And the main film material is bonded to the said board|substrate through the said coating liquid. The bonding apparatus according to the first aspect of the invention, further comprising a film inspection unit that inspects the film bonded to the substrate, wherein the position correction mechanism is further based on the film inspection unit The detection result is used to correct the aforementioned relative position. The bonding apparatus according to claim 1, wherein the coating portion is coated with an adhesive as the coating liquid. The bonding apparatus according to the first aspect of the invention, wherein the conveying unit conveys the film in a direction intersecting with a horizontal plane with respect to the coating unit. A bonding apparatus comprising: a film feeding portion, a bonding portion, a winding portion, a driving portion, a detecting portion, and a control portion, wherein the film feeding portion is formed in a strip shape including a main film member and a protective material The film is fed out at a film bonding position, and the protective material is peeled off from the main film material, and only the main film material is bonded to the substrate; the winding portion is peeled off from the main film material. The driving member winds up; the driving portion rotates the winding portion; the detecting portion detects a winding diameter of the protective material wound around the winding portion; and the control portion is based on the detecting portion As a result of the detection, the drive unit is controlled to adjust the rotational torque of the winding unit. The bonding apparatus according to claim 9, wherein the detecting unit detects the winding diameter of the protective material in a non-contact manner. The bonding apparatus according to claim 10, wherein the detecting unit detects by ultrasonic waves. The bonding apparatus according to claim 9, further comprising: an application unit that applies a coating liquid onto the main film material of the film; and the tool unit The main film material coated with the coating liquid is cut into a predetermined length. The bonding apparatus according to claim 12, wherein the coating portion is coated with an adhesive or an adhesive as the coating liquid. The bonding apparatus according to claim 12, wherein the film is conveyed in a direction crossing the horizontal plane with respect to the coating portion. A bonding apparatus comprising: a conveying unit, an application unit, a cutter unit, a bonding unit, and a contact portion that conveys a film including a main film material and a protective material; The coating liquid is applied onto the main film material of the film; the cutter portion cuts the main film material coated with the coating liquid into a predetermined length; The bonding portion is formed by peeling the protective material from the film at a film bonding position, and bonding only the main film material to the upper surface of the substrate through the coating liquid; and the abutting portion is provided on the bonding portion The vicinity of the film bonding position is lower than the upper surface of the substrate located at the film bonding position, and is in contact with the substrate on which the main film material is bonded. The bonding apparatus according to claim 15, wherein the abutting portion is constituted by a roller member. The bonding apparatus according to claim 15, wherein the abutting portion is displaceable at least in the vertical direction by a spring member. The bonding apparatus according to the fifteenth aspect, wherein the bonding unit includes a first conveying roller and a film bonding roller, and the first conveying roller constitutes a part of the conveying unit and conveys the substrate The film bonding roller is capable of moving up and down with respect to the first conveying roller, and sandwiching the substrate and the film between the first conveying roller and the first conveying roller to bond the film to the substrate, and the film bonding The roller is lowered in accordance with the timing at which the leading end of the substrate conveyed by the transport unit reaches the film bonding position. The bonding apparatus according to the fifteenth aspect, wherein the cutter portion is configured to cut the bonding portion including the bonding portion of the substrate and the non-bonding portion not bonded to the substrate film. The bonding device according to claim 15, wherein Further, the nip portion is provided on the downstream side in the transport direction of the substrate with respect to the contact portion, and the substrate is sandwiched by the contact portion, and the nip portion includes a transport roller And a pinch roller that transports the substrate; the pinch roller is disposed on the upper side with respect to the transport roller, and the substrate is sandwiched between the transfer roller and the contact roller, and the abutting portion is disposed The clamping roller is vertically positioned on the lower side. The bonding apparatus according to claim 15, wherein the film is formed by winding a long sheet member into a roll, and the conveying unit has a winding portion at the film bonding position. The winding portion of the protective material after the main film material is peeled off is conveyed to the substrate by the sheet member discharged from the winding body by the winding operation of the protective material by the winding unit. The bonding apparatus according to claim 15, wherein the coating portion is coated with an adhesive or an adhesive as the coating liquid. The bonding apparatus according to claim 15, wherein the conveying unit conveys the film in a direction intersecting with a horizontal plane with respect to the coating unit.