TW201515188A - All-around LED module and manufacturing thereof - Google Patents

Abstract

The instant disclosure relates to an all-around LED module comprising a transparent substrate, an anode blade, a cathode blade, a plurality of fluorescent layers, a plurality of LED chips, and a fluorescent packaging body. The transparent substrate has an emitting area and at least one periphery area on one side of the emitting area. The anode blade and the cathode blade dispose on the periphery area in pairs and extend beyond the edge of the transparent substrate. The fluorescent layers dispose on the emitting area, and the LED chips laminate on the fluorescent layers respectively and electrically connect to the anode blade and the cathode blade. The fluorescent packaging body dispose on the transparent substrate and cover the LED chips.

Description

Full-circumference LED module and manufacturing method thereof

The invention relates to a packaging technology of a light emitting diode (LED), in particular to a full-circumference LED module and a manufacturing method thereof.

Compared with the traditional light source, the LED light-emitting element has small volume, low power consumption, high measurement, high color performance, fast reaction speed (high-frequency operation), environmental protection (shockproof, impact resistant, not easy to break, recyclable) and easy The advantages of developing a light, thin and short product make the LED light source have certain market advantages; for example, the current LED light source can be applied in various fields such as automobiles, communications, consumer electronic products, industrial instruments and the like.

In the field of illumination, the white light emitted by the LED is produced by the light mixing of the three primary colors of red, green and blue. However, the packaging process of the conventional LED module needs to be soldered to the printed circuit board in the final stage, whether it is a single LED lamp package, a surface-mount device (SMD) or a flip chip package. By connecting electronic circuits, it is impossible to achieve the purpose of white light on both sides.

In order to provide the effect of double-sided white light, the prior art provides an LED module including a first transparent substrate and a second transparent substrate, a plurality of LED chips, a line, and a transparent colloid. Specifically, the LED chips are fixed on the first transparent substrate, and the circuit is formed on the first transparent substrate and electrically connected to the LED chips, the transparent colloid encapsulates the LED chips, and the second transparent The substrate covers the transparent colloid.

However, the above packaging method is made in addition to the complicated process and time consuming process. The double-sided white-light package module can not be effectively miniaturized, and must be soldered and fixed during use; in the quantitative consideration of the product, not only will the process cost increase, but also limit the application range of the LED module.

Therefore, the present inventors have in view of the necessity of improvement of the existing LED module and packaging process, and have actively carried out improvement research on LED light-emitting components in various aspects with their years of experience in creative design and professional manufacturing in related fields. The invention has finally been developed with careful consideration of the conditions.

The present invention provides a full-circumference LED module and a manufacturing method thereof according to the defects of the prior art, and aims to simplify the package structure and the program by a special package design, thereby improving product yield, shortening manufacturing time and cost.

In order to achieve the above object and effect, the present invention adopts the following technical solution: a method for manufacturing a full-circumference LED module, comprising the following steps: First, a transparent carrier is provided, which has a light-emitting area and a side of the light-emitting area. a peripheral region; then, a plurality of phosphor pads are disposed on the light-emitting region; then, a positive conductive sheet and a negative conductive sheet are disposed in pairs on the peripheral region and protrude from the transparent carrier; Fixing a plurality of LED chips correspondingly on the fluorescent pad layers; then, electrically connecting the LED chips to the positive electrode conductive sheet and the negative electrode conductive sheet by wire bonding; finally, forming a transparent carrier plate A fluorescent encapsulant covers the LED chips.

Based on the above manufacturing method, the present invention further provides a full-circumference LED module, comprising a transparent carrier, a positive conductive sheet, a negative conductive sheet, a plurality of fluorescent mat layers, a plurality of LED chips, and a fluorescent seal. colloid. The transparent carrier has a light-emitting area and a peripheral area on one side of the light-emitting area; the positive conductive sheet and the negative conductive sheet are disposed in pairs on the peripheral area and protrude from the transparent carrier; the fluorescent a pad layer is disposed on the light-emitting area; the LED chips are respectively fixedly connected to the fluorescent pad layers and electrically connected to the positive electrode conductive piece and the negative electrode conductive piece for generating a light; the fluorescent light a sealing system disposed on the transparent carrier and covering the LED chips; A portion of the light generated by the LED chips penetrates the fluorescent encapsulant and is emitted from one side of the full-circumference LED module, and another portion of the light generated by the LED chips respectively penetrates the The fluorescent mats are ejected from the other side of the full-circumference LED module.

The invention has at least the following advantages: the full-circumference LED module of the invention has a simple process, and the fully-circumferential LED module is simple in structure, small in size, convenient to carry, and capable of generating full-period light.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the present invention, and provide further explanation of the scope of the patent application of the present invention.

1‧‧‧LED lamps

10‧‧‧Full-Circumference LED Module

11‧‧‧Transparent carrier

11a‧‧‧ first surface

E‧‧‧Lighting area

P‧‧‧ surrounding area

11b‧‧‧ second surface

12‧‧‧ positive conductive sheet

13‧‧‧Negative conductive sheet

14‧‧‧Fluorescent cushion

15‧‧‧LED chip

151‧‧‧Top light surface

152‧‧‧Bottom luminous surface

153‧‧‧Side light surface

W‧‧‧Crystal line

16‧‧‧Fluorescent sealant

C‧‧‧ joint pad

20‧‧‧Portable power base

21‧‧‧Power terminal

22‧‧‧Slots

1 is an exploded view of a full-circumference LED module of the present invention.

2 is a combined view of a full-circumference LED module of the present invention.

3 is a top plan view of a full-circumference LED module of the present invention.

4 is a cross-sectional view of the full-circumference LED module of the present invention.

Figure 5 is a perspective view of the LED lamp of the present invention.

6 is a schematic flow chart of a method for manufacturing a full-circumference LED module of the present invention.

The present disclosure proposes a novel LED package component, which is characterized by simple structure, small size, convenient carrying and full-period light; it is worth mentioning that the proposed LED package component can be directly connected to an external power supply or a Portable power supply, so it can be widely used in various lighting fixtures. The detailed features of the full-circumference LED module of the present invention are further described below with reference to a preferred embodiment and in conjunction with the accompanying drawings.

1 and 2, FIG. 1 is an exploded view of a full-circumference LED module according to a preferred embodiment of the present invention, and FIG. 2 is a perspective view of a full-circumference LED module according to a preferred embodiment of the present invention. As shown, the full-circumference LED module 10 of the present embodiment includes a The transparent carrier 11 , a positive conductive sheet 12 , a negative conductive sheet 13 , a plurality of fluorescent mat layers 14 , a plurality of LED chips 15 , and a fluorescent sealant 16 .

In this embodiment, the transparent carrier 11 is, for example, a glass substrate or a plastic substrate and has a first surface 11a and a second surface 11b opposite thereto, wherein the first surface 11a provides a surface for component placement. The first surface 11a can be further divided into a light-emitting area E and a peripheral area P, and the second surface 11b serves as a light-emitting surface. It should be noted that the transparent carrier 11 of the present embodiment is preferably a high-transmission plastic material, such as epoxy resin (Epoxy), polystyrene (PS), and acrylonitrile-butadiene-styrene copolymer. (Acrylonitrile-Butadene-Styrene, ABS), polymethyl methacrylate (PMMA), Acrylic resin, Silicone or a combination thereof, but the invention is not limited thereto. .

The positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 are disposed on the peripheral region P of the transparent carrier 11 , and the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 are parallel to each other and protrude from the edge of the transparent carrier 11 for connecting an external power source. At the supply end, the external power supply terminal is, for example, a fixed power source or a portable power source, but the invention is not limited thereto. In the present embodiment, the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 may be made of any conductive material, and the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 are embedded on a bonding pad C, and the bonding pad C is It is fixed to the peripheral area P.

The phosphor pads 14 are formed on the light-emitting area E of the transparent carrier 11 , and the LED chips 15 are fixedly connected to the fluorescent pad layers 14 and between the positive electrode conductive sheets 12 and the negative electrode conductive sheets 13 . Electrical continuity is achieved. In this embodiment, the LED chip 15 is, for example, a blue LED chip, specifically a rectangular hexahedral structure, including a top light emitting surface 151, a bottom light emitting surface 152, and between the top light emitting surface 151 and the bottom light emitting surface 152. The four LEDs 15 are arranged on the light-emitting area E in a dot matrix. However, the specific positions of the LED chips 15 are not limited to those shown in FIG. 1 . The arrangement of the LED chips 15 can be adjusted according to the lighting effect of the product.

Please refer to FIG. 3 , which is a top view of the full-circumference LED module of the present invention. Further, the LED chips 15 may be formed into a series or parallel type by using a plurality of crystal wires W, and electrically connect the LED chips 15 connected in series or in parallel to an external power supply device (not shown); Each of the LED chips 15 is connected to the transparent carrier 11 by the bottom light-emitting surface 152, but still has six light-emitting surfaces; accordingly, when the crystal wires W are electrically connected to the positive electrode conductive sheets 12 and the negative electrode conductive sheets 13, At the same time, the full-circumference LED module 10 can produce the effect of full-circumferential illumination. It should be noted that although FIG. 1 illustrates 16 LED chips 15 for illustration, the number of LED chips 15 of the present invention is not limited thereto.

Please refer to FIG. 4, which is a cross-sectional view of the full-circumference LED module of the present invention. Please refer to FIG. 1 together, the fluorescent sealing body 16 may be formed by mixing epoxy resin with a certain proportion of fluorescent powder, or the fluorescent sealing body 16 may be formed by mixing silicone rubber with a certain proportion of fluorescent powder, but The present invention is not limited thereto; the fluorescent encapsulant 16 is formed on the first surface 11a of the transparent carrier 11 and covers all of the LED chips 15 such that the top emitting surface 151 and all the side emitting surfaces 153 of each LED chip 15 Both of them are covered by the fluorescent sealing body 16 , and the bottom surface of the bottom light emitting surface 152 is covered by the fluorescent mat layer 14 , so that each LED chip 15 can exhibit the effect of uniformly generating white light on six sides.

It should be noted that the fluorescent encapsulant 16 may be formed only on the light-emitting area E or may be further extended to the peripheral area P to cover part of the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13, especially covering The junction of the crystal line W with the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13. In other words, under the premise that the fluorescent encapsulant 16 has covered the top emitting surface 151 and all the side emitting surfaces 153 of all the LED chips 15, the shape, size or fluorescent powder of the fluorescent encapsulant 16 can be The adjustment is made according to the product requirements or the type of the LED chip 15, and the present invention is not limited thereto.

Referring to FIG. 5, an LED luminaire 1 to which the full-circumference LED module 10 of the present invention is applied is shown. As shown in the figure, the LED lamp 1 includes a full-circumference LED module 10 and a portable power supply base 20, wherein the portable power supply base 20 can be regarded as a power supply end for direct supply. Full-circumference LED module 10 power supply.

Specifically, the portable power supply base 20 includes a plurality of power terminals 21, a slot 22, and a power module (not shown). The power terminal 21 is housed in the slot 22 and has one end and a power module. Group electrical connection. Accordingly, the present invention can be directly inserted into the slot 22 during use, and respectively contacts the power terminals 21 via the positive conductive sheet 12 and the negative conductive sheet 13 protruding from the transparent carrier 11 to make the power module and the whole Electrical conduction between the LED modules 10 is achieved. Obviously, the full-circumference LED module 10 can be easily combined with the power supply end, thereby enhancing the convenience and practicability of use.

In summary, the structural features of the full-circumference LED module 10 of the present invention have been described in detail above. However, in order to achieve product quantization, the present invention further provides for manufacturing the full-circumference LED module 10. The method is such that one of ordinary skill in the art can implement it.

Please refer to FIG. 6 , which is a schematic flow chart of a method for manufacturing the full-circumference LED module 10 of the present invention. Referring to FIG. 1 to FIG. 4, the manufacturing process of the full-circumference LED module 10 of the present invention is as follows: First, step S10 is performed to provide a transparent carrier 11 and on the first surface 11a of the transparent carrier 11. A light-emitting area E and a peripheral area P are defined, wherein the light-emitting area E provides the arrangement of the LED chip 15, and the peripheral area P provides the arrangement of the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13.

Then, in step S12, the fluorescent pad layer 14 is disposed on the light-emitting area E of the transparent carrier 11. Since the layout position of the fluorescent pad layer 14 needs to be the same as that of the LED chip 15, the fluorescent pad layer 14 is also similar in this step. A dot matrix is arranged on the light-emitting area E to provide an LED chip 15 fixed thereon, thereby converting the light generated by the bottom light-emitting surface 152 into white light.

Specifically, the step of forming the phosphor underlayer 14 further includes the following sub-steps: first mixing a certain proportion of the phosphor powder in a transparent or translucent sealant (such as silicone, epoxy, etc.), followed by dispensing. A colloidal cloth mixed with phosphor powder is disposed on the light-emitting area E, and then a baking process is performed to form a colloid mixed with the phosphor powder into the fluorescent mat layer 14.

Then, in step S14, the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 are disposed in the peripheral region P of the transparent carrier 11. In this step, the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 are first embedded on a bonding pad C, and then the bonding pad C is attached to the transparent peripheral region P; it should be noted that the positive electrode conductive sheet 12 and The length of the negative electrode conductive sheet 13 must be larger than that of the bonding pad C. When the bonding pad C is fixed to the peripheral region P, the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13 can protrude from the edge of the transparent carrier 11.

Then, in step S16, the LED chip 15 is fixed to the fluorescent pad layer 14 of the light-emitting area E and wired to be electrically connected to the positive electrode conductive sheet 12 and the negative electrode conductive sheet 13. Specifically, in this step, the LED chip 15 is fixed on the fluorescent pad layer 14 in a flip chip manner, and then the plurality of crystal wires W are connected in series or in parallel with the positive and negative electrodes of the LED chips 15 and further connected to Positive electrode conductive sheet 12 and negative electrode conductive sheet 13.

Finally, in step S18, a fluorescent encapsulant 16 is formed on the light-emitting area E of the transparent carrier 11, and the fluorescent encapsulant 16 covers the LED chips 15. Specifically, the step of forming the phosphor sealant 16 is similar to the step S16, comprising first mixing a certain proportion of the phosphor powder into a transparent or translucent sealant (such as silicone rubber, epoxy resin, etc.), followed by coating. In the procedure, a colloid mixed with phosphor powder is formed on the light-emitting area E, and then subjected to a baking process to form a fluorescent sealant 16 to cover the top light-emitting surface 151 of all the LED chips 15 and all the side light-emitting surfaces. 153. The full-circumference LED module 10 of the present invention is completed through all of the above steps.

Therefore, the full-circumference LED module of the present invention has a simple structure, a small size, is convenient to carry, and can generate full-circumference light compared to the conventional LED package component and packaging process; further, the full-circumference LED is described. The module has a special package design, which can be easily combined with a power supply terminal to enhance the convenience and practicability of use. In addition, the full-circumference LED module has a simple process, and thus has an advantage in mass production compared with the same industry.

In summary, the present invention has been in conformity with the requirements of the invention patent and has been filed according to law. However, the above disclosure is only a preferred embodiment of the present invention, and cannot be limited thereto. The scope of rights in this case, therefore, the equivalent changes or modifications made in the scope of the application of this case are still covered by this case.

10‧‧‧Full-Circumference LED Module

11‧‧‧Transparent carrier

11a‧‧‧ first surface

E‧‧‧Lighting area

P‧‧‧ surrounding area

11b‧‧‧ second surface

12‧‧‧ positive conductive sheet

13‧‧‧Negative conductive sheet

14‧‧‧Fluorescent cushion

15‧‧‧LED chip

151‧‧‧Top light surface

152‧‧‧Bottom luminous surface

153‧‧‧Side light surface

W‧‧‧Crystal line

16‧‧‧Fluorescent sealant

C‧‧‧ joint pad

Claims (10)

A full-circumference LED module includes: a transparent carrier plate having a light-emitting area and a peripheral area on a side of the light-emitting area; a positive conductive sheet and a negative conductive sheet are disposed in pairs on the peripheral area Extending the transparent carrier; a plurality of fluorescent pads are disposed on the light-emitting area; a plurality of LED chips are respectively fixedly connected to the fluorescent pads and electrically connected to the positive conductive sheets and The negative electrode conductive sheet is used to generate a light beam; and a fluorescent sealant is disposed on the transparent carrier plate and covers the LED chips; wherein a part of the light generated by the LED chips penetrates the firefly Photocuring the gel and ejecting from one side of the full-circumference LED module, and another portion of the light generated by the LED chips penetrates the phosphor pads and from the other of the full-circumference LED modules One side shot. The full-circumference LED module of claim 1, further comprising a bonding pad, the positive conductive sheet and the negative conductive sheet are embedded on the bonding pad and parallel to each other, and the bonding pad is fixed to the transparent carrier On the surrounding area. The full-circumference LED module of claim 1, wherein the fluorescent encapsulant is formed on the peripheral region. The full-circumference LED module of claim 3, wherein the fluorescent encapsulant further extends onto the peripheral region and covers a portion of the positive conductive sheet and a portion of the negative conductive sheet. The full-circumference LED module of claim 1, wherein the fluorescent encapsulant is formed by mixing one of an epoxy resin and a silicone rubber with a phosphor powder. A method for manufacturing a full-circumference LED module, comprising the steps of: providing a transparent carrier plate having a light-emitting area and a peripheral area on a side of the light-emitting area; and arranging a plurality of fluorescent pad layers on the light-emitting area; A positive electrode conductive piece and a negative electrode conductive piece are disposed in pairs on the peripheral area and protruded And a plurality of LED chips are respectively fixed on the fluorescent pad layers, and electrically connected between the LED chips and the positive electrode conductive sheets and the negative electrode conductive sheets are electrically connected; And forming a fluorescent seal on the transparent carrier to cover the LED chips. The method for manufacturing a full-circumference LED module according to claim 6, wherein the step of arranging a positive electrode conductive piece and a negative electrode conductive piece in pairs on the peripheral area and protruding from the transparent carrier plate is further The method further includes: inserting the positive electrode conductive piece and the negative electrode conductive piece in parallel on a bonding pad; and attaching the bonding pad to a peripheral area of the transparent carrier. The method of manufacturing a full-period LED module according to claim 6, wherein the step of forming a fluorescent seal on the transparent carrier to cover the LED chips further comprises: converting a certain proportion of the fluorescent light The powder is mixed with a transparent sealant to form a sealant containing the phosphor powder; the sealant containing the phosphor powder is coated on the light-emitting area; and a baking process is performed to make the phosphor powder The sealant is formed into the fluorescent sealant. The method of manufacturing a full-period LED module according to claim 6, wherein the step of forming a fluorescent seal on the transparent carrier to cover the LED chips further comprises: converting a certain proportion of the fluorescent light The powder is mixed with a transparent sealant to form a sealant containing the phosphor powder; the sealant containing the phosphor powder is coated on the light-emitting region and a portion of the peripheral region to further cover a portion of the positive electrode conductive a sheet and a portion of the negative electrode conductive sheet; and performing a baking process to form the phosphor powder-containing sealant into the fluorescent sealant. The method for manufacturing a full-circumference LED module according to claim 8 or 9, wherein the transparent encapsulant is epoxy resin or silicone rubber.