TWM472157U - LED illumination device - Google Patents

Description

LED lighting device

The present invention relates to a light-emitting device, and more particularly to an LED light-emitting device that can be directly electrically connected to an external power source.

In recent years, the application of light-emitting diodes (LEDs) has gradually become widespread, and with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which are sufficient to replace the traditional illumination sources.

Most of today's LED lighting devices are equipped with packaged LED chips and packaged LED driving components respectively on the circuit carrier board. Alternatively, when the LED carrier is mounted on the circuit carrier board, a support layer is formed on the circuit carrier board, and the support layer is formed with a plurality of accommodating grooves, and the LED bare crystal is disposed in the accommodating groove and connected by wire bonding. The device is placed in the circuit carrier portion of the accommodating groove, and is dispensed into the accommodating groove to encapsulate the LED bare crystal.

However, the construction of today's LED lighting devices is still too complicated, which is not conducive to reducing costs, thereby slowing down the speed of replacing traditional lighting sources. Therefore, the creator feels that the above-mentioned deficiency can be improved. He is devoted to research and cooperates with the application of theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned deficiency.

[Creation content]

The present invention provides an LED lighting device, which can integrally cover an LED bare crystal module and an LED driving component, and package the LED bare crystal module in the package. In the package body.

The present invention provides an LED light-emitting device, comprising: a circuit carrier board comprising a heat-conducting substrate; and a conductive layer and two electrodes disposed on the heat-conducting substrate, the heat-conducting substrate having a first surface and an opposite side a second surface, the conductive layer is disposed on the first surface, the two electrodes are electrically connected to the conductive layer; an LED bare crystal module is soldered to the conductive layer; an LED driving component is soldered to the On the conductive layer, the LED driving component is electrically connected to the LED die module and the two electrodes via the conductive layer; and a package body is integrally transparent, the package is located on the first surface And encapsulating the LED die module and the LED driving component, and packaging the LED die module in the package; wherein the two electrodes can be electrically connected to an external power source to enable the external power source The supplied power passes through the conductive layer and the LED driving component, thereby causing the LED bare module to emit light.

Preferably, the LED lighting device further includes a rectifying component and a power component, the rectifying component and the power component are soldered to the conductive layer, and the package encloses the rectifying component, the power component, and the conductive layer The LED bare die module, the LED driving component, the rectifying component, and the power component are not soldered; wherein the two electrodes can be electrically connected to a mains socket to enable communication provided by the mains socket The electric light passes through the conductive layer, the LED driving element, the rectifying element, and the power element, thereby causing the LED bare module to emit light.

The present invention further provides an LED lighting device, comprising: a circuit carrier board comprising a heat conducting substrate; and a conductive layer and two electrodes disposed on the heat conducting substrate, the heat conducting substrate having a first surface on the opposite side and a second surface, the conductive layer is disposed on the first surface, the two electrodes are electrically connected to the conductive layer; an LED bare crystal module is soldered to the conductive layer; and an electronic component is a bare crystal Constructed and soldered to the conductive layer, and the electronic component is electrically connected to the LED die module and the two electrodes via the conductive layer; and a package body, which is a light transmissive body structure, the package body Located on the first surface and integrally covering the LED die module and the electronic component, the LED die module and the electronic component are simultaneously packaged in the package Inside.

In summary, the LED lighting device provided by the present embodiment can encapsulate the LED bare crystal module in the package while protecting the electronic component (such as the LED driving component), thereby reducing the LED illumination. The production cost of the device. And the LED lighting device can be directly used by being electrically connected to an external power source.

In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of this creation, but these descriptions and drawings are only used to illustrate this creation, not the right to this creation. The scope is subject to any restrictions.

100‧‧‧LED lighting device

1‧‧‧Circuit carrier board

11‧‧‧thermal substrate (eg ceramic substrate)

111‧‧‧ first surface

112‧‧‧ second surface

113‧‧‧through holes

12‧‧‧ Conductive layer

13‧‧‧Electrode

2‧‧‧LED bare crystal module

21‧‧‧LED bare crystal

211‧‧‧First LED bare crystal

212‧‧‧Second LED bare crystal

3, 3'‧‧‧ electronic components

31‧‧‧LED drive components

32‧‧‧Rectifying components

33‧‧‧Power components

4, 4'‧‧‧ package (eg molded package)

5‧‧‧Reflective layer

200‧‧‧External power supply (eg: mains outlet)

300‧‧‧ functional heat sink

FIG. 1 is a perspective view of a first embodiment of an LED lighting device.

Figure 2 is a side elevational view of Figure 1.

FIG. 3 is a schematic perspective view of the package body not formed in FIG. 1. FIG.

4 is a perspective view showing the phosphor powder in the package of FIG. 1.

FIG. 5 is a schematic diagram of the application of the first embodiment of the LED lighting device.

FIG. 6 is a side elevational view showing a variation of the first embodiment of the LED lighting device of the present invention.

FIG. 7 is a side elevational view showing another variation of the first embodiment of the LED lighting device of the present invention.

FIG. 8 is a perspective view of a second embodiment of the LED light emitting device of the present invention.

FIG. 9 is a perspective view of a third embodiment of the LED lighting device of the present invention.

FIG. 10 is a perspective view of another perspective view of the third embodiment of the LED lighting device.

Figure 11 is a cross-sectional view showing a third embodiment of the LED lighting device of the present invention.

FIG. 12 is a schematic diagram of the application of the third embodiment of the LED lighting device.

[First Embodiment]

Please refer to FIG. 1 to FIG. 7 , which are the first embodiment of the present invention. It should be noted that the related number and shape mentioned in the embodiment are only used to specifically Explain the implementation of this creation in order to understand its content, and not to limit the scope of the creation of this creation.

Referring to FIG. 1 to FIG. 3 , the LED light emitting device 100 includes a circuit carrier board 1 , an LED bare crystal module 2 , a plurality of electronic components 3 , and a package 4 . The LED die module 2 and the electronic component 3 are disposed on the circuit carrier 1 , and the package 4 is molded on the circuit carrier 1 and integrally covered with the LED bare. The crystal module 2 and the electronic component 3. In order to facilitate the understanding of the contents of the present embodiment, the components of the LED lighting device 100 will be described below, and then the connection relationship between the components of the LED lighting device 100 will be described.

The circuit carrier 1 includes a thermally conductive substrate 11 and a conductive layer 12 and electrodes 13 disposed on the thermally conductive substrate 11. In the present embodiment, the thermally conductive substrate 11 is exemplified by a ceramic substrate, but in practical applications, it is not limited thereto.

In more detail, the heat conductive substrate 11 has a substantially rectangular plate shape and has a first surface 111 on the opposite side (such as the top surface of the heat conductive substrate 11 in FIG. 3) and a second surface 112 (such as the heat conduction in FIG. 3). The bottom surface of the substrate 11). The conductive layer 12 and the two electrodes 13 are integrally formed and formed on the first surface 111 of the heat conductive substrate 11 , that is, the conductive layer 12 and the two electrodes 13 are exposed outside the heat conductive substrate 11 .

The LED bare crystal module 2 includes a plurality of LED bare crystals 21, and the LED bare crystals 21 are soldered on the conductive layer 12, so that each LED bare crystal 21 is structurally and electrically connected to the conductive layer. 12. The manner in which the LED bare crystal 21 is soldered to the conductive layer 12 is a metal butt joint manner, that is, the LED bare crystal 21 and the conductive layer 12 can be electrically connected without passing through a bonding wire (ie, no wire is applied). Sexual connection. For example, the manner of the above metal docking method may be a die bonding method such as flip chip, reflow, ultrasonic, surface mount technology (SMT), and is not limited herein.

In addition, in the embodiment, the LED die 21 included in the LED module 2 can be divided into a plurality of first LED die 211 and a plurality of second LED die 212 according to the type of illumination, and the first LED is bare. The crystal 211 and the second LED die 212 are respectively used Lights of different colors.

In the embodiment, the electronic component 3 includes two LED driving components 31, a plurality of rectifying components 32 (such as a bridge rectifier), and a plurality of power components 33, but in practical applications, the electronic component 3 The type can be adjusted according to the needs of the designer, and is not limited to this. For example, in an embodiment not shown, the electronic component 3 can also include both linear components and nonlinear components.

The LED driving component 31, the rectifying component 32, and the power component 33 are respectively soldered on the conductive layer 12, and the LED driving component 31, the rectifying component 32, and the power component 33 are electrically connected to the LED bare crystal via the conductive layer 12. Module 2 and two electrodes 13. The two LED driving elements 31 are electrically connected to the first LED die 211 and the second LED die 212 respectively, thereby adjusting the first LED die 211 and the second LED through the two LED driving components 31 respectively. The ratio of light emission between the bare crystals 212 further achieves the effect of light mixing.

In more detail, the LED driving component 31, the rectifying component 32, and the power component 33 may all have a bare crystal structure, but it is not excluded that the LED driving component 31, the rectifying component 32, and the power component 33 are at least partially encapsulated. .

Furthermore, the LED bare crystal 21 is substantially distributed in the central region of the first surface 111 of the thermally conductive substrate 11 in this embodiment, and the LED driving element 31, the rectifying element 32, and the power element 33 are distributed on the LED bare crystal 21 Peripheral, but in practical applications, the above arrangement can also be adjusted according to the needs of the designer, and is not limited to the schema. For example, in an unillustrated embodiment, the electronic components 3 may be distributed in a substantially central region of the first surface 111, and the LED bare crystals 21 are distributed on the periphery of the electronic component 3.

In addition, when the LED lighting device 100 is in practical application, the number of each of the LED bare chip 21, the LED driving component 31, the rectifying component 32, and the power component 33 can be adjusted according to the designer's needs. In other words, the number of each of the LED bare crystal 21, the LED driving element 31, the rectifying element 32, and the power element 33 may be only a single one. For example, in an unillustrated embodiment, when the number of LED driving elements 31 is only a single The LED bare die module 2 is correspondingly designed to have only the LED die 21 for emitting a single light color (for example, both the first LED die 211 or the second LED die 212).

The package body 4 has a light transmissive structure, and the package body 4 shown in FIG. 1 is transparent, but is not limited thereto. That is, the package 4 shown in Fig. 1 can also be replaced by the package 4' shown in Fig. 4. A plurality of phosphors (not shown) are disposed in the package 4' shown in FIG. 4, so that the light emitted by the LED die module 2 changes the color of the light through the phosphors.

The package body 4 is located on the first surface 111 and integrally covers the LED die module 2, the LED driving component 31, the rectifying component 32, the power component 33, and the LED die module 2 and the electronic component 3 The conductive layer 12 is partially encapsulated in the package 4, and the two electrodes 13 are exposed outside the package 4.

Thereby, the package body 4 can not only package a plurality of LED bare crystals 21 therein, thereby reducing the production cost of the LED light-emitting device 100, and the package body 4 can also protect the LED driving component 31, the rectifying component 32, and the power. The element 33 and the portion of the conductive layer 12 that are not soldered to the LED bare module 2 and the electronic component 3 are not soldered. The LED lighting device 100 after forming the package 4 is a complete product, which can be grounded or used in conjunction with other devices, and the detailed application situation is described later.

In addition, when the LED driving component 31, the rectifying component 32, and the power component 33 are all in a bare crystal structure, the package body 4 can simultaneously integrally package the LED bare crystal 21, the LED driving component 31, and the rectifying component 32, The power component 33 is included therein to greatly reduce the cost of packaging required for the production of the LED lighting device 100. It should be noted that the package body 4 at this time is preferably a molded package, not a package formed by dispensing, especially when the heat conductive substrate 11 of the LED light emitting device 100 is a ceramic substrate. The ceramic substrate is not suitable for forming a supporting layer on the metal plate as is conventional, and the package 4 needs to integrally package the LED bare crystal module 2 and all the bare-state electronic components 3. At this time, if the package 4 is formed by dispensing, it is less difficult to reach. The purpose of integrally packaging the LED bare crystal module 2 and all the bare-state electronic components 3 is less suitable for forming by dispensing.

In more detail, the package body 4 has a flat shape, and its top surface is substantially parallel to the first surface 111 of the heat conductive substrate 11, that is, the distance from the top surface of the package body 4 to the first surface 111 of the heat conductive substrate 11 is greater than The thickness of any of the electronic components 3 is also greater than the thickness of any of the LED dies 21. Furthermore, the four side surfaces of the package 4 do not protrude from the outline of the thermally conductive substrate 11. In this embodiment, the package body 4 is adjacent to the side surface of the adjacent electrode 13 , and the other three side surfaces are flush with the side edges of the heat conductive substrate 11 and are coplanar, but the package body 4 and the heat conductive substrate 11 are The relative relationship is not limited to this.

Referring to FIG. 5, according to the LED lighting device 100, the two electrodes 13 can be electrically connected to an external power source 200 (such as a commercial power socket) through a wire (not shown) to make an external power source 200 (eg, a commercial power supply). The power (such as AC power) supplied by the socket) causes the LED bare module 2 to emit light via the conductive layer 12, the LED driving element 31, the rectifying element 32, and the power element 33. However, FIG. 5 is a diagram for explaining that the LED lighting device 100 of the present embodiment is a complete product, and FIG. 5 is one of many implementations of the LED lighting device 100, and is not limited in practical applications. herein.

In addition, when the LED lighting device 100 uses the packaged electronic component 3', the packaged electronic component 3' may not need to be completely covered by the package 4 (as shown in Figs. 6 and 7). In more detail, as shown in FIG. 6, the flat package 4 is formed in a molding manner and the thickness can be further reduced, and the thickness thereof is sufficient to completely cover and package the LED bare crystal module 2 and the bare crystal state. Element 3 is ok, and the top of packaged electronic component 3' can be exposed outside of package 4. Alternatively, as shown in FIG. 7, the package body 4 is formed in a dispensing manner so that the top surface of the package body 4 can be designed in a curved shape, and the packaged electronic component 3' is located at a thin portion of the periphery of the package body 4 and exposed. In addition, the LED bare die module 2 and the bare metal component 3 need to be completely wrapped and packaged at substantially the center of the package 4.

[Second embodiment]

Referring to FIG. 8 , which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment, and the same portions are not described again. The difference between the two is mainly as follows: the LED lighting device 100 of the embodiment further includes a Reflective layer 5.

Specifically, the conductive layer 12 is formed on the first surface 111 of the thermally conductive substrate 11, and the reflective layer 5 covers the first surface 111 and the partial conductive layer 12. Further, the reflective layer 5 does not cover the two electrodes 13 and the portions of the conductive layer 12 for soldering to the LED die module 2 and the electronic components 3. The LED bare crystal module 2 and the electronic components 3 are soldered to the conductive layer 12 not covered by the reflective layer 5, and the LED bare crystal module 2 and the electronic components 3 protrude from the reflective Layer 5. Furthermore, the package 4 covers the reflective layer 5, the LED bare die 2 and the electronic components 3.

[Third embodiment]

Referring to FIG. 9 to FIG. 12 , which is a third embodiment of the present invention, the present embodiment is similar to the first and second embodiments described above, and the same portions are not repeated, and the difference between the present embodiment and the foregoing embodiment is mainly The two electrodes 13 of the LED light emitting device 100 of the present embodiment are disposed on the second surface 112 of the thermally conductive substrate 11.

Specifically, referring to FIG. 9 to FIG. 11 , the thermally conductive substrate 11 of the present embodiment can be further reduced in size, and the two electrodes 13 are formed on the second surface 112 of the thermally conductive substrate 11 , and the two electrodes 13 are also electrically connected. In the conductive layer 12. The electrical connection between the conductive layer 12 and the two electrodes 13 is such that the through-holes 113 are formed through the heat-conducting substrate 11 and the two electrodes 13 and the electrodes 13 are formed through the first surface 111 and the second surface 112. And electrically conductive materials (not labeled) are filled in the two through holes 113, so that the two electrodes 13 can be electrically connected to the conductive layer 12 through the through holes 113, respectively.

In more detail, the periphery of the package 4 of the present embodiment is substantially aligned with the periphery of the first surface 111, that is, the four side surfaces of the package 4 and the thermally conductive substrate 11 The side edges are flush with each other and are coplanar. Thereby, the LED light-emitting device 100 of the present embodiment not only has a smaller size, but also enhances the appearance. And the two electrodes 13 are formed on the second surface 112 of the heat conductive substrate 11 so that the LED light emitting device 100 can be electrically connected to the position where the LED light emitting device 100 is placed when the LED light emitting device 100 is mounted on the matched device. Sexual connections, which in turn have more ways of using them. The mounting manner of the LED lighting device 100 and the matching device thereof may be directly soldered or fixed, such as a screw lock, a snap, a bonding, etc., and is not limited herein.

For example, as shown in FIG. 12, the LED lighting device 100 of the present embodiment can be fixedly and electrically connected to a functional heat dissipation plate 300, wherein the functional heat dissipation plate 300 has dimming or other applicable LED lighting device. The function of the LED bare die module 2 of 100 enables the LED lighting device 100 to be flexibly utilized according to different needs. It should be noted that the LED lighting device 100 of the present embodiment can also be electrically connected to an external power source (not shown) through a wire as in the first embodiment, or a reflective layer 5 can be formed as in the second embodiment. ).

Incidentally, the thermally conductive substrate 11 of the LED lighting device 100 of the present embodiment preferably uses a ceramic substrate instead of a metal plate because the use of the metal plate is not advantageous for forming the electrode on the surface of the metal plate. However, the material of the heat conductive substrate 11 is not limited to this in practical applications.

[Possible effects of this creative embodiment]

In summary, the LED lighting device proposed in the present embodiment can protect the LED driving component, the rectifying component, the power component, and the LED not soldered at the same time as the LED bare die module is encapsulated in the package. The bare crystal module and the conductive layer portion of the electronic component are used to reduce the production cost of the LED lighting device. And the LED lighting device can be directly used by being electrically connected to an external power source.

Furthermore, when the LED driving component, the rectifying component, and the power component are all of a bare crystal structure, the package body can be molded in a package shape, and the LED bare crystal and the LED driving component are simultaneously packaged. , rectifying elements, and power components are included therein, In order to greatly reduce the packaging cost of the LED lighting device.

In addition, the present embodiment is formed on the second surface of the thermally conductive substrate through two electrodes to reduce the size of the LED lighting device, and can make the LED lighting device have more modes of operation.

The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the patents of the present invention. Any changes and modifications made to the scope of the patent application of the present invention should be covered by the present invention.

100‧‧‧LED lighting device

1‧‧‧Circuit carrier board

11‧‧‧thermal substrate (eg ceramic substrate)

111‧‧‧ first surface

112‧‧‧ second surface

12‧‧‧ Conductive layer

13‧‧‧Electrode

2‧‧‧LED bare crystal module

21‧‧‧LED bare crystal

211‧‧‧First LED bare crystal

212‧‧‧Second LED bare crystal

3‧‧‧Electronic components

31‧‧‧LED drive components

32‧‧‧Rectifying components

33‧‧‧Power components

4‧‧‧Package (eg molded package)

Claims (10)

An LED light-emitting device includes: a circuit carrier board comprising a heat-conducting substrate; and a conductive layer and two electrodes disposed on the heat-conducting substrate, the heat-conducting substrate having a first surface and a second surface on opposite sides, a conductive layer is disposed on the first surface, the two electrodes are electrically connected to the conductive layer; an LED die module is soldered to the conductive layer; an LED driving component is soldered to the conductive layer, and The LED driving component is electrically connected to the LED die module and the two electrodes via the conductive layer; and a package body is a light transmissive body structure, and the package body is located on the first surface and integrally covered The LED die module and the LED driving component, and the LED die module is packaged in the package; wherein the two electrodes can be electrically connected to an external power source to provide power provided by the external power source The LED bare module is illuminated by the conductive layer and the LED driving component. The LED lighting device of claim 1, further comprising a rectifying element soldered to the conductive layer, and the package encasing the rectifying element. The LED lighting device of claim 2, further comprising a power component soldered to the conductive layer, the package covering the power component and the conductive layer not soldered to the LED die module The LED driving component, the rectifying component, and a portion of the power component; wherein the two electrodes can be electrically connected to a mains socket, and the AC power provided by the mains socket is driven by the conductive layer and the LED The component, the rectifying component, and the power component cause the LED bare module to emit light. The LED lighting device of claim 3, wherein the LED driving component, the rectifying component, and the power component are at least partially in a bare crystal configuration, and the LED driver The movable element, the rectifying element, and an element having a bare crystal structure among the power elements are encapsulated in the package, and the package is further defined as a molded package. The LED lighting device of claim 1, wherein the conductive layer is formed on the first surface and exposed outside the thermally conductive substrate, the package encasing the conductive layer. The LED lighting device of claim 1, wherein the conductive layer is formed on the first surface, the LED lighting device further comprising a light reflecting layer covering the first surface and a portion of the conductive layer, The LED bare crystal module and the LED driving component are soldered to the conductive layer portion not covered by the reflective layer, and the LED bare crystal module and the LED driving component protrude from the reflective layer, and the package is covered At least part of the reflective layer. The LED lighting device of claim 1, wherein the LED bare die module comprises a first LED die and a second LED die, and the first LED die and the second LED die are respectively used To emit light of different colors. The LED lighting device of claim 1, wherein the package body is provided with a plurality of phosphor powders for causing light emitted by the LED bare crystal module to change the color of the light through the phosphor powder. The LED lighting device of any one of claims 1 to 8, wherein the thermally conductive substrate is further defined as a ceramic substrate, the two electrodes are disposed on the second surface, and a periphery of the package is substantially the same as the first The circumference of the surface is aligned. An LED light-emitting device includes: a circuit carrier board comprising a heat-conducting substrate; and a conductive layer and two electrodes disposed on the heat-conducting substrate, the heat-conducting substrate having a first surface and a second surface on opposite sides, a conductive layer is disposed on the first surface, the two electrodes are electrically connected to the conductive layer; an LED bare crystal module is soldered on the conductive layer; an electronic component is a bare crystal structure and soldered to the On the conductive layer, the electronic component is electrically connected to the LED die module and the two electrodes via the conductive layer; a package body having a light-transmissive structure, the package being located on the first surface and integrally covering the LED die module and the electronic component, so that the LED die module and the electronic component are simultaneously packaged In the package body.