TW201513250A - 晶圓狀物件之液體處理設備及用於該設備中之加熱系統 - Google Patents

晶圓狀物件之液體處理設備及用於該設備中之加熱系統 Download PDF

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TW201513250A
TW201513250A TW103117195A TW103117195A TW201513250A TW 201513250 A TW201513250 A TW 201513250A TW 103117195 A TW103117195 A TW 103117195A TW 103117195 A TW103117195 A TW 103117195A TW 201513250 A TW201513250 A TW 201513250A
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wafer
infrared
infrared heating
rotating chuck
heating elements
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Ante Plazonic
Vijay Kumar Badam
Michael Brugger
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Lam Res Ag
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    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B5/00—Muffle furnaces; Retort furnaces; Other furnaces in which the charge is held completely isolated
    • F27B5/06—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B5/14—Arrangements of heating devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D2003/0085—Movement of the container or support of the charge in the furnace or in the charging facilities
    • F27D2003/0087—Rotation about a vertical axis
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Abstract

本發明揭露一種用於處理一圓盤狀物件之設備，該設備包含一旋轉夾盤和至少三個可獨立控制之紅外線加熱元件。該等紅外線加熱元件相對於該旋轉夾盤之旋轉係以固定的方式安裝。至少設置於該等加熱元件及一晶圓之底面之間的透明平板係安裝以與該旋轉夾盤旋轉。可替代地，該透明平板係為圍繞該等紅外線加熱元件之外罩的一部分，且當該等加熱元件相對於該旋轉夾盤為靜止時，該外罩與該旋轉夾盤旋轉。

Description

晶圓狀物件之液體處理設備及用於該設備中之加熱系統
本發明關於一種晶圓狀物件之液體處理設備，以及用於該設備中之加熱系統。
液體處理包含濕式蝕刻和濕式清洗，其中待處理之晶圓的表面區域係以處理液體潤濕，且該晶圓之一層係從而被移除，或是雜質從而被帶走。用於進行液體處理之設備係描述於美國專利第4903717號中。在此設備中液體之分佈可藉由施加至該晶圓的旋轉運動所協助。
用於處理圓盤狀物件之表面的技術係通常用於半導體產業的矽晶圓，例如直徑300毫米或450毫米者。然而，此等技術可應用於其它平板狀物件，如光碟、光罩、標線片、磁性光碟或平板顯示器。當用於半導體產業時，此等技術亦可應用於玻璃基板（例如，在絕緣層上矽晶處理中），III-V族基板（如GaAs）或用於製造積體電路之任何其他基板或載體。
當使用加熱之處理液體時，在整個晶圓表面上取得溫度均勻性為一難題，且隨著晶圓直徑的增加，解決該難題之需要變得更加急迫。
特別地，當晶圓直徑增加時，被施加至該晶圓之中央區域處的液體，以及當該相同液體徑向地朝外流動至該晶圓的周圍時，兩者之間的溫度差異也將增加。這將導致隨著與晶圓之中心的距離而變化的不同蝕刻速率，且因此導致不良的處理均勻性。
緩解這個問題的習知作法包含從可動臂（即所謂“擺動式吊臂”分配器分配處理液體；然而，此涉及成本以及裝置及其操作的複雜度之增加。透過增加處理液體之流動，及／或藉由分配諸如去離子水之高溫液體在該晶圓之相對側上；此難題可在某種程度上獲得解決，然而，這些技術導致處理液體之消耗更高。
美國專利申請案公開號第20130061873號中描述一改善之設備，該設備具有用以加熱晶圓以提高處理均勻性之紅外線加熱器。雖然該專利申請案之設備代表對於習知技術上的改良，吾人仍需要提供進一步增強的處理均勻性和更穩健且更易於維護之設備。
因此，在一實施態樣中，本發明關於一種用於處理一晶圓狀物件之設備，該設備包含一旋轉夾盤，該旋轉夾盤用以將一晶圓狀物件固持在一預定之方位，其中該晶圓狀物件之下表面係與該旋轉夾盤之上表面以一段預設之距離間隔開。至少一紅外線加熱器係安裝於該旋轉夾盤之上表面上，且當一晶圓狀物件係安裝於該旋轉夾盤上時，該至少一紅外線加熱器位於該晶圓物件下方且相對於該旋轉夾盤之旋轉呈現靜止。對於由該至少一紅外線加熱器所發出的紅外輻射可穿透之一平板係安裝以用於與旋轉夾盤旋轉，且係設置在該至少一紅外線加熱器和當放置在該旋轉夾盤上之一晶圓狀物件之間。
根據本發明之設備的較佳實施例中，該平板係為圍繞該至少一紅外線加熱器的外罩之一部分，該外罩係安裝以用於與該旋轉夾盤旋轉。
根據本發明之設備的較佳實施例中，該外罩包含圍繞該至少一紅外線加熱器且設置於該至少一紅外線加熱器和該旋轉夾盤的該上表面之間的一下部殼體，該下部殼體具有一反射內表面。
在根據本發明之設備的較佳實施例中，該旋轉夾盤包含圍繞一中央固定柱的一可旋轉夾盤主體，且該至少一紅外線加熱器係安裝至該中央固定柱之一上端。
在根據本發明之設備的較佳實施例中，該至少一紅外線加熱器為一加熱組件之一部份，該加熱組件包含至少二個，且較佳地至少三個可獨立控制的紅外線加熱元件。
在根據本發明之設備的較佳實施例中，該外罩係以該旋轉夾盤之一旋轉軸為中心，且該旋轉夾盤包含一環狀系列之複數銷，該等銷係用以接觸在一封閉位置之該晶圓狀物件之一邊緣，該等銷穿過形成於該外罩週緣相對應的一系列開​​口。
在根據本發明之設備的較佳實施例中，該等可獨立控制的加熱元件之每一者包含至少一彎曲部。
在根據本發明之設備的較佳實施例中，一下部殼體包圍該至少一紅外線加熱器且係設置於該至少一紅外線加熱器和該旋轉夾盤之該上表面之間，該下部殼體具有一反射內表面且相對於該旋轉夾盤之旋轉係為固定。
在另一實施態樣中，本發明關於用以在一處理晶圓狀物件之設備中使用的一紅外線加熱組件。該紅外線加熱組件包含外罩，該外罩包含一對於由該紅外線加熱組件所發出的紅外輻射可穿透之上部平板以及一具有一反射內表面的下部殼體。複數紅外線加熱元件係安裝至與該外罩一同設置之一共同框架上，該共同框架包含一接頭部，該接頭部朝下突出穿過在該下部殼體中之一中央開口。一旋轉軸承係設置於該接頭部外部和該中央開口內部，從而使該外罩可相對於該共同框架和該複數紅外線加熱元件而旋轉。
在根據本發明之紅外線加熱組件的較佳實施例中，該等紅外線加熱元件之每一者係可獨立控制且包含至少一彎曲部。
在根據本發明之紅外線加熱組件的較佳實施例中，相鄰的紅外線加熱元件之彎曲部沿著同心圓延伸。
在根據本發明之紅外線加熱組件的較佳實施例中，該接頭部包含數量等同於該複數紅外線加熱元件之複數電接頭，從而使該複數紅外線加熱元件之每一者可個別連接至一用以個別地對該複數紅外線加熱元件之每一者充能的控制器。
在根據本發明之紅外線加熱組件的較佳實施例中，該外罩可相對於該共同框架和該複數紅外線加熱元件繞一垂直於該上部平板的軸線旋轉。
在根據本發明之紅外線加熱組件的較佳實施例中，該紅外線加熱元件之每一者包含至少一彎曲部，且該紅外線加熱元件之每一者的至少一彎曲部沿一圓的圓弧延伸，該圓之中心係從該軸偏移。
在根據本發明之紅外線加熱組件的較佳實施例中，該外罩包含一環狀系列之複數外周開口，以當該紅外線加熱組件安裝至一旋轉夾盤時，複數卡銷能夠通過。
現在參照附圖，圖1和2描繪由二個主要次組件，即，底座旋轉夾盤10和一模組化紅外線加熱組件20所組成之設備。旋轉夾盤10包含旋轉主體12，旋轉主體12係安裝以繞固定之中央中空柱14旋轉。此中央中空柱14從而包含一中央噴嘴18以及在中央中空柱14的肩部之一系列母插座15，其中該中央噴嘴18係用於當晶圓安裝於旋轉夾盤上時，分配處理液體或氣體至晶圓的底面，而該等母插座15接收從加熱組件20向下懸掛之相對應的公接頭（未示出），且母插座15供應驅動電流至位於該組件20內的紅外線加熱燈。
夾盤主體12具有安裝於其中之一系列夾持銷16，夾持銷16大致以如上參照之美國專利第4903717號中所述地操作，其中複數夾持銷16係一起由一共同環形齒輪驅動於一徑向外側打開位置及一徑向內側關閉位置之間，其中此等銷之上端與待處理之圓盤狀物件的邊緣接合。夾盤主體12還包含光滑壁面之複數孔13，該等孔接收從加熱組件20向下懸掛之相對應的定位突出部（未示出），以便助於加熱部件20相對於夾盤主體10以正確的座向設置並加以支承。
加熱組件20在此實施例中係形成為一模組化單元，該模組化單元包含一其中含有紅外線燈21、23、25之下部碟狀外罩或殼體22。平板24係由一系列周圍螺釘26旋入至下部殼體22中，螺釘26在本實施例中為六個。螺釘26與六個凹口或開口17交替，凹口或開口17從加熱組件20之頂部至底部完全穿過，且使夾持銷16可通過。
圖1中之虛線1指出當晶圓W由該設備所固持時之位置，在該位置上時，晶圓在其外周邊緣係由向上突出穿過孔或凹口17之夾持銷16的遠端所支承，而晶圓W之底面係與平板24以一小界定之間隙間隔開。
在本實施例中之平板24係由一材料所製成，該材料對於由燈21、23、25發出的紅外線輻射之波長可穿透，且此平板24可由，如熟習本領域之技術者所熟知，例如藍寶石或石英玻璃所製成。該平板24具有形成於其中之小中央開口19，以使分配噴嘴18的上端可通過。
加熱組件20的外罩內，即，下部殼體22內且位於透明平板24之下方，安裝一組三個紅外線加熱燈21、23、25，該等加熱燈係由一共同的框架29裝載，該框架29亦結合了相關的電源佈線（未示出）。在本實施例中由框架29及燈21、23、25所組成之組件係剛性地安裝至固定柱14，而下部殼體22和上部平板24構成的外罩係剛性地安裝至旋轉夾盤主體12。因此，框架29且因此其所裝載之燈21、23、25係安裝以相對於由構件22，24所形成之周圍的外罩旋轉，如將於以下更詳細地說明者。
現參照圖2，吾人可看出晶圓W係現由銷16之端部所支承，銷16穿透在加熱組件20中之開口或凹口17。晶圓W之中心對齊加熱組件20，而加熱組件20之中心對齊下方旋轉夾盤之旋轉軸。吾人將可理解旋轉夾盤10係因此設計成固持一具有特定直徑的晶圓W。在本文所述之實施例中，該直徑係為300mm，此為目前之矽晶圓常見的直徑。然而，該設備當然可設計成固持為其它直徑，如200mm和450mm之圓盤狀物件。
在圖2之俯視圖中，吾人可看出在本實施例中三個加熱元件21、23、25之每一者係為一連續彎曲管狀元件。此外，雖然此等加熱元件通常為圓弧狀且當三個加熱元件皆較佳地實質上為同心，由這些加熱元件所描繪之圓圈在此實施例中並非與加熱組件20之中心為同心且因此並非與旋轉夾盤之旋轉軸同心。
因此，在本實施例中，加熱元件21、23、25之位置和形狀兩者為如此，以當晶圓W被夾盤10相對於固定之加熱元件21、23、25旋轉時，每一加熱元件實質上相對於旋轉之晶圓W徑向地 "行進”，因為每個加熱元件加熱一環形區域，該環形區域之徑向範圍係顯著地大於加熱元件之橫剖面直徑。
在圖3中，吾人可看出框架29係由適當的旋轉軸承33支承於殼體22、24內，此使加熱組件20之外罩可相對於靜止柱14旋轉，而框架29及燈21、23、25則以靜止方式安裝至柱14。下部外罩部分或殼體22之面向上的表面係較佳地設置合適的紅外線反射塗佈31，以助於將由燈21、23、25所發出紅外輻射引導向上穿過透明平板24並向上至晶圓W之面向下的表面上。
固定柱14係安裝至該設備之框架32上，在本實施例中框架32亦裝載定子34。定子34進而驅動連接至旋轉夾盤10之主體12的轉子36。圖3中亦可見上述之環形齒輪11，環形齒輪11將夾持銷16一致地驅動。
圖4顯示進入框架29且與柱14之出口連通之入​​口37，入口37使加熱組件20之內部可使用例如氮氣進行清除。導管35亦顯示於圖4中，導管35於柱14之肩部上打開，並進入界定於夾盤主體12之上表面和外罩殼體22之下表面之間的小間隙39。導管35可有利地用以提供去離子水至間隙39，以在加熱操作完成時冷卻加熱組件20，以及調節由加熱組件在加熱操作期間產生之溫度。
圖5中可見設置於透明平板24及​​下部外罩殼體22之間的間隙41，間隙41使引入至外罩內的氮淨化氣體可從該處向外排出。相似地，圖5所示之間隙43使已被引入至殼體22底部和夾盤主體12之上表面之間的間隙39內的去離子水（或氮氣，若期望的話）可逸出。
在圖6中之替代實施例中，透明平板24'仍與旋轉夾盤10旋轉，且銷16'仍向上穿過形成於透明平板24'內的開口。然而，本實施例中的下部殼體22'以及框架29和燈21、23、25現在係以懸臂方式剛性地固著於柱14 。本實施例如上所述地與前一實施例相關。
如在此等實施例中可見，透明平板24、24'與旋轉夾盤10旋轉係為有利的，因為附著在透明平板24、24'之任何處理液體之液滴將從而被抛出。然而，在一進一步之實施例中，整個加熱組件可以固定方式安裝至柱14上，如結合揭露於共同擁有的同時申請中之美國專利申請公開案第20130061873案中所述。
吾人應注意，在前述實施例之每一者中的加熱燈係較佳地為可單獨控制。特別較佳地，每個燈不僅可獨立於其它者打開和關閉，且每個燈之瓦特數可獨立地改變。這使吾人可進行各種有利的處理控制。
雖然本發明已結合其各種較佳實施例進行說明，但吾人應理解這些實施例係僅提供以說明本發明，且不應該被用來作為限定由隨附請求項之真正範圍及精神所賦予之保護範圍。
W‧‧‧晶圓
10‧‧‧底座旋轉夾盤
11‧‧‧環形齒輪
12‧‧‧旋轉主體
13‧‧‧孔
14‧‧‧中央中空固定柱
15‧‧‧母插座
16‧‧‧夾持銷
16'‧‧‧夾持銷
17‧‧‧開口
18‧‧‧中央噴嘴
19‧‧‧中央開口
20‧‧‧模組化紅外線加熱組件
21‧‧‧紅外線燈
22 22’‧‧‧殼體 下部殼體
23‧‧‧紅外線燈
24‧‧‧上部透明平板
24’‧‧‧透明平板
25‧‧‧紅外線燈
26‧‧‧螺釘
29‧‧‧框架
31‧‧‧紅外線反射塗佈
32‧‧‧框架
33‧‧‧旋轉軸承
34‧‧‧定子
35‧‧‧導管
36‧‧‧轉子
37‧‧‧入​​口
39‧‧‧間隙
41‧‧‧間隙
43‧‧‧間隙
本發明之其它目標、特徵及優點將於閱讀以下關於本發明之較佳實施例的詳細描述、參照隨附圖式後變得更加明顯，其中：
圖1為根據本發明一實施例之用於處理圓盤狀物件的設備之分解透視圖；
圖2為圖1的實施例之俯視平面圖；
圖3為沿圖2中之III-III所截取之穿過圖1和圖2所示的夾盤之軸向剖面；
圖4為標明於圖3中之細部IV的放大圖；
圖5為標明於圖3中之細部V的放大視圖3；以及
類似於圖3，為根據本發明之用以處理圓盤狀物件之設備的另一實施例之軸向剖面圖。
W‧‧‧晶圓
10‧‧‧底座旋轉夾盤
12‧‧‧旋轉主體
13‧‧‧孔
14‧‧‧中央中空固定柱
15‧‧‧母插座
16‧‧‧夾持銷
17‧‧‧開口
18‧‧‧中央噴嘴
19‧‧‧中央開口
20‧‧‧模組化紅外線加熱組件
21‧‧‧紅外線燈
22‧‧‧殼體
23‧‧‧紅外線燈
24‧‧‧上部透明平板
25‧‧‧紅外線燈
26‧‧‧螺釘
29‧‧‧框架

Claims (15)

  1. 一種用於處理一晶圓狀物件之設備，包含：一旋轉夾盤，用以將一晶圓狀物件維持在一預定之方位，其中該晶圓狀物件之一下表面係與該旋轉夾盤之上表面以一段預設之距離間隔開；至少一紅外線加熱器安裝於該旋轉夾盤之該上表面上，且當該晶圓狀物件係安裝於該旋轉夾盤上時，該至少一紅外線加熱器係位於該晶圓狀物件下方，該至少一紅外線加熱器係相對於該旋轉夾盤之旋轉呈現靜止；以及一平板，對於由該至少一紅外線加熱器所發出的紅外輻射可穿透，該平板係安裝以用於與該旋轉夾盤旋轉，且係設置在該至少一紅外線加熱器和當放置在該旋轉夾盤上之一晶圓狀物件之間。
  2. 如申請專利範圍第1項之用於處理一晶圓狀物件之設備，其中該平板係為圍繞該至少一紅外線加熱器的外罩之一部分，該外罩係安裝以用於與該旋轉夾盤旋轉。
  3. 如申請專利範圍第2項之用於處理一晶圓狀物件之設備，其中該外罩包含圍繞該至少一紅外線加熱器且設置於該至少一紅外線加熱器和該旋轉夾盤的該上表面之間之一下部殼體，該下部殼體具有一反射內表面。
  4. 如申請專利範圍第1項之用於處理一晶圓狀物件之設備，其中該旋轉夾盤包含圍繞一中央固定柱的一可旋轉夾盤主體，且該至少一紅外線加熱器係安裝至該中央固定柱之一上端。
  5. 如申請專利範圍第1項之用於處理一晶圓狀物件之設備，其中該至少一紅外線加熱器為一加熱組件之一部份，該加熱組件包含至少二個，且較佳地至少三個可獨立控制的紅外線加熱元件。
  6. 如申請專利範圍第2項之用於處理一晶圓狀物件之設備，其中該外罩係以該旋轉夾盤之一旋轉軸為中心，且其中該旋轉夾盤包含一環狀系列之複數銷，該等銷係用以接觸在一封閉位置之該晶圓狀物件之一邊緣，該等銷穿過形成於該外罩週緣之相對應的一系列開口。
  7. 如申請專利範圍第5項之用於處理一晶圓狀物件之設備，其中該等可獨立控制的加熱元件之每一者包含至少一彎曲部。
  8. 如申請專利範圍第1項之用於處理一晶圓狀物件之設備，更包含一下部殼體，該下部殼體包圍該至少一紅外線加熱器且設置於該至少一紅外線加熱器和該旋轉夾盤之該上部表面之間，該下部殼體具有一反射內表面且相對於該旋轉夾盤之旋轉係為固定。
  9. 一種用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，該紅外線加熱組件包含：一外罩，該外罩包含一對於由該紅外線加熱組件所發出的紅外輻射可穿透之上部平板以及一具有一反射內表面的下部殼體；複數紅外線加熱元件，安裝至與該外罩一同設置之一共同框架上，該共同框架包含一接頭部，該接頭部朝下突出穿過在該下部殼體中之一中央開口；以及一旋轉軸承，設置於該接頭部外部和該中央開口內部，從而使該外罩可相對於該共同框架和該複數紅外線加熱元件旋轉。
  10. 如申請專利範圍第9項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中該等紅外線加熱元件之每一者係可獨立控制且包含至少一彎曲部。
  11. 如申請專利範圍第10項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中相鄰的紅外線加熱元件之複數彎曲部沿著同心圓延伸。
  12. 如申請專利範圍第9項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中該接頭部包含數量等同於該複數紅外線加熱元件之複數電接頭，從而使該複數紅外線加熱元件之每一者可個別連接至用以個別地對該複數紅外線加熱元件之每一者充能的一控制器。
  13. 如申請專利範圍第9項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中該外罩可相對於該共同框架和該複數紅外線加熱元件繞一垂直於該上部平板的軸線旋轉。
  14. 如申請專利範圍第13項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中該紅外線加熱元件之每一者包含至少一彎曲部，且其中該紅外線加熱元件之每一者的至少一彎曲部沿一圓的圓弧延伸，該圓之中心係從該軸偏移。
  15. 如申請專利範圍第9項之用以在一處理晶圓狀物件之設備中使用的紅外線加熱組件，其中該外罩包含一環狀系列之複數外周開口，以當該紅外線加熱組件安裝至一旋轉夾盤時，複數銷能夠通過。 摘要披露本發明揭露一種用於處理一圓盤狀物件之設備，該設備包含一旋轉夾盤和至少三個可獨立控制之紅外線加熱元件。該等紅外線加熱元件相對於該旋轉夾盤之旋轉係以固定的方式安裝。至少設置於該等加熱元件及一晶圓之底面之間的透明平板係安裝以與該旋轉夾盤旋轉。可替代地，該透明平板係為圍繞該等紅外線加熱元件之外罩的一部分，且當該等加熱元件相對於該旋轉夾盤為靜止時，該外罩與該旋轉夾盤旋轉。
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TWI614827B (zh) 2018-02-11
US20160118278A1 (en) 2016-04-28
KR20140135127A (ko) 2014-11-25
US9685358B2 (en) 2017-06-20
US20140339215A1 (en) 2014-11-20
KR102126590B1 (ko) 2020-06-25

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