TW201510666A - 經改善潤溼性之表面改質處理之構造體及印刷用孔版、與製造彼等之方法 - Google Patents
經改善潤溼性之表面改質處理之構造體及印刷用孔版、與製造彼等之方法 Download PDFInfo
- Publication number
- TW201510666A TW201510666A TW103117708A TW103117708A TW201510666A TW 201510666 A TW201510666 A TW 201510666A TW 103117708 A TW103117708 A TW 103117708A TW 103117708 A TW103117708 A TW 103117708A TW 201510666 A TW201510666 A TW 201510666A
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- Prior art keywords
- printing
- water
- screen
- ink
- plasma
- Prior art date
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Textile Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013106025 | 2013-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201510666A true TW201510666A (zh) | 2015-03-16 |
Family
ID=51933579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103117708A TW201510666A (zh) | 2013-05-20 | 2014-05-20 | 經改善潤溼性之表面改質處理之構造體及印刷用孔版、與製造彼等之方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160121636A1 (https=) |
| EP (1) | EP3000612A4 (https=) |
| JP (2) | JP6067846B2 (https=) |
| KR (1) | KR101776041B1 (https=) |
| CN (1) | CN105392635A (https=) |
| TW (1) | TW201510666A (https=) |
| WO (1) | WO2014189026A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017019279A (ja) * | 2015-07-14 | 2017-01-26 | 太陽誘電ケミカルテクノロジー株式会社 | 撥水撥油性表面を有する構造体及びその製造方法 |
| JP6872728B2 (ja) * | 2016-06-27 | 2021-05-19 | パナソニックＩｐマネジメント株式会社 | 金属メッシュの製造方法 |
| US20180201010A1 (en) * | 2017-01-18 | 2018-07-19 | Microsoft Technology Licensing, Llc | Screen printing liquid metal |
| CN110042649B (zh) * | 2019-05-20 | 2020-08-04 | 江南大学 | 一种用于织物功能整理的大气压等离子体设备及其应用 |
| DE102020122181A1 (de) | 2020-08-25 | 2022-03-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Druckform zur Herstellung einer Struktur eines elektronischen Bauelementes, insbesondere einer photovoltaischen Solarzelle und Verfahren zur Herstellung solch einer Druckform |
| JP7799629B2 (ja) * | 2020-12-25 | 2026-01-15 | 株式会社Ｎｂｃメッシュテック | スクリーン版 |
| CN112768559A (zh) * | 2021-01-06 | 2021-05-07 | 中国科学院上海高等研究院 | 太阳电池结构及基于丝网印刷制备太阳电池栅线的方法 |
| CN118046661B (zh) * | 2024-03-28 | 2026-01-06 | 嘉兴南博精密制造股份有限公司 | 一种基于等离子的印刷网版加工工艺 |
| CN118700694B (zh) * | 2024-08-29 | 2025-02-11 | 浙江微铸科技有限公司 | 一种柔性合金网版及其制作方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0220121A3 (en) * | 1985-10-14 | 1987-07-01 | Shin-Etsu Chemical Co., Ltd. | A method for the preparation of a screen mesh for screen printing |
| JPH0580522A (ja) | 1991-09-20 | 1993-04-02 | Cmk Corp | スクリーン印刷用のスクリーン版 |
| JP3451762B2 (ja) * | 1994-12-12 | 2003-09-29 | 旭硝子株式会社 | 水系インキ用スクリーン印刷版 |
| TW387845B (en) * | 1996-11-29 | 2000-04-21 | Mitsubishi Plastics Inc | Lithography film, lithography ink, and lithographic method and system using the film |
| JP4509295B2 (ja) * | 2000-04-26 | 2010-07-21 | リコーマイクロエレクトロニクス株式会社 | 印刷用マスク及びその製造方法 |
| JP2008192977A (ja) * | 2007-02-07 | 2008-08-21 | Pjt Kk | プラズマ処理済み金属メッシュを用いたプラズマ処理済み転写基材への印刷方法及びその印刷装置 |
| JP2007245708A (ja) * | 2007-02-07 | 2007-09-27 | Asada Mesh Co Ltd | 金属メッシュ |
| DE102007010936A1 (de) * | 2007-03-07 | 2008-09-11 | Biotronik Crm Patent Ag | Siebdruckvorrichtung und Verfahren zur Herstellung derselben |
| JP5264427B2 (ja) * | 2008-03-25 | 2013-08-14 | 富士フイルム株式会社 | 平版印刷版の作製方法 |
| DE202008012829U1 (de) * | 2008-09-26 | 2008-12-04 | Nb Technologies Gmbh | Siebdruckform |
| JP2011218673A (ja) * | 2010-04-09 | 2011-11-04 | Yasuo Kondo | スクリーン印刷用メッシュ |
| US9186879B2 (en) * | 2010-05-28 | 2015-11-17 | Taiyo Yuden Chemical Technology Co., Ltd. | Screen-printing stencil having amorphous carbon films and manufacturing method therefor |
| JP5802752B2 (ja) * | 2011-07-01 | 2015-11-04 | 太陽誘電ケミカルテクノロジー株式会社 | プライマー組成物、該組成物から成るプライマー層を含む構造体、及び該構造体の製造方法 |
| EP2743092A4 (en) * | 2011-08-10 | 2015-04-01 | Taiyo Chemical Industry Co Ltd | STRUCTURE WITH A PRIMER THIN FILM AND METHOD FOR THE PRODUCTION THEREOF |
| US20150314588A1 (en) * | 2012-10-26 | 2015-11-05 | Taiyo Chemical Industry Co., Ltd. | Mesh structure and method for manufacturing the same |
-
2014
- 2014-05-20 KR KR1020157029183A patent/KR101776041B1/ko active Active
- 2014-05-20 JP JP2015518248A patent/JP6067846B2/ja active Active
- 2014-05-20 US US14/889,295 patent/US20160121636A1/en not_active Abandoned
- 2014-05-20 EP EP14800392.4A patent/EP3000612A4/en not_active Withdrawn
- 2014-05-20 WO PCT/JP2014/063282 patent/WO2014189026A1/ja not_active Ceased
- 2014-05-20 CN CN201480028895.8A patent/CN105392635A/zh active Pending
- 2014-05-20 TW TW103117708A patent/TW201510666A/zh unknown
-
2016
- 2016-12-21 JP JP2016248372A patent/JP6412547B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6412547B2 (ja) | 2018-10-24 |
| EP3000612A4 (en) | 2017-03-08 |
| KR101776041B1 (ko) | 2017-09-07 |
| US20160121636A1 (en) | 2016-05-05 |
| WO2014189026A1 (ja) | 2014-11-27 |
| JPWO2014189026A1 (ja) | 2017-02-23 |
| JP2017077732A (ja) | 2017-04-27 |
| KR20150135358A (ko) | 2015-12-02 |
| EP3000612A1 (en) | 2016-03-30 |
| CN105392635A (zh) | 2016-03-09 |
| JP6067846B2 (ja) | 2017-01-25 |
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