TW201507559A - Circuit board with electronic element embeded and method for manufacturing same - Google Patents

Abstract

A circuit board with electronic element embedded includes an inner circuit substrate, an electronic element, a first build-up substrate, and a second build-up substrate. The inner circuit substrate has a first surface and a second surface opposite to the first surface. At least two connecting pads are formed on the first surface. A receiving hole is defined in the inner circuit substrate. The electronic element includes a body and at least two soldering portions. The body is received in the receiving hole. Each soldering portion is parallel to the first surface and extends out from the receiving hole. Each soldering portion is soldered with a corresponding connecting pad. The electronic element is fixed between the first build-up substrate and the second build-up substrate. The present invention also relates to a method for manufacturing the circuit board with electronic element embedded.

Description

Circuit board with embedded electronic components and manufacturing method thereof

The present invention relates to the field of circuit board manufacturing, and in particular to a circuit board having buried electronic components and a method of fabricating the same.

In the prior art, the electronic component has a substantially rectangular parallelepiped shape. On one of its surfaces, two solder terminals are provided. The two soldering terminals are separated from each other and disposed at opposite ends of the surface. The electronic component is buried in the circuit board, and the following method is generally used: First, an inner circuit board is fabricated. An inner layer conductive line is formed in the inner layer circuit board. Then, a recess is formed in the inner layer circuit board to house the electronic component in the recess such that a surface of the electronic component having the solder terminal is exposed from the recess. Finally, a layer is formed on the side of the surface of the electronic component having the soldering terminal, and a blind hole is formed in the layered substrate by laser ablation, so that the soldering terminal is exposed from the blind hole, in the blind The hole is filled with a conductive material such that the solder terminal and the outer conductive track of the buildup layer are electrically connected to each other.

The fabrication by the above method has the following problems: First, in the process of forming a blind hole by using a laser, the alignment accuracy of the formed blind hole and the soldering terminal cannot be ensured. Secondly, before the layer is formed, the soldering terminals of the electronic components are not soldered, and when the lamination is performed, the electronic components are prone to irregular displacement, thereby increasing the precision between the subsequent formation of the blind vias and the soldered terminals. The difficulty of the alignment.

Therefore, it is necessary to provide a circuit board and a method thereof to solve the above problems.

A circuit board having embedded electronic components, including an inner circuit substrate, an electronic component, a first build-up substrate, and a second build-up substrate, the inner circuit substrate having opposing first and second surfaces, Forming at least two connection pads on one side of the first surface, a receiving hole penetrating the first surface and the second surface is formed in the inner layer circuit substrate, the electronic component includes a body and at least two soldering terminals, each of which The soldering terminal is electrically connected to one of the electrode pads corresponding to the body, the body is received in the receiving hole, the soldering terminal is in one-to-one correspondence with the connecting pad, and each soldering terminal is parallel to the first surface and Extending out the receiving hole and welding with a corresponding connecting pad, the first build-up substrate is formed on one side of the first surface, and the second build-up substrate is formed on a side of the second surface The electronic component is fixed between the first build-up substrate and the second build-up substrate.

A manufacturing method of a circuit board having embedded electronic components, comprising the steps of: fabricating an inner layer circuit substrate formed with a conductive circuit, the inner layer circuit substrate having opposite first and second surfaces, the first surface Forming at least two connection pads on the side; providing an electronic component, the electronic component comprising a body and at least two soldering terminals, each of the soldering terminals being electrically connected to a corresponding one of the body pads, each soldering terminal protruding Forming a receiving hole corresponding to the electronic component in the inner layer circuit substrate; housing the electronic component in the receiving hole, the soldering terminal and the connecting pad are one by one Corresponding to welding; forming a first build-up substrate on the first surface of the inner layer circuit substrate, forming a second build-up substrate on the second surface of the inner layer circuit substrate, the electronic component being fixed to the first build-up substrate and Between the second build-up substrates.

The circuit board with built-in electronic components and the manufacturing method thereof are provided. The soldering terminal of the electronic component forms a body and extends out of the body. When the electronic component is received in the receiving hole of the inner circuit substrate, The connection pads of the inner layer circuit substrate in which the extended solder terminals of the electronic component are parallel to the solder terminals can be soldered to each other to achieve electrical conduction between the electronic component and the inner layer circuit substrate. When forming the build-up substrate, it is not necessary to make a conductive hole corresponding to the solder terminal. In the prior art, in the process of forming a blind hole in a build-up substrate by using a laser, the alignment accuracy of the blind hole and the solder terminal cannot be guaranteed. Further, before the build-up is performed, the solder terminals of the electronic component are soldered to the connection pads of the inner layer circuit substrate, and the electronic components are not irregularly displaced when the laminate is laminated.

100‧‧‧ boards

110‧‧‧ Inner layer circuit board

111‧‧‧ first surface

112‧‧‧ second surface

113‧‧‧First inner layer

1131‧‧‧First connection pad

1132‧‧‧Second connection pad

114‧‧‧Second inner circuit layer

115‧‧‧core circuit layer

116‧‧‧First dielectric layer

117‧‧‧Second dielectric layer

118‧‧‧ Third dielectric layer

119‧‧‧ receiving holes

120‧‧‧Electronic components

121‧‧‧Ontology

122‧‧‧First soldering terminal

123‧‧‧Second welding terminal

1211‧‧‧ top surface

1212‧‧‧ first side

1213‧‧‧ second side

124‧‧‧Welding materials

151‧‧‧First build-up substrate

152‧‧‧Second build-up substrate

131‧‧‧First insulation

141‧‧‧First outer circuit layer

1411‧‧‧First electrical contact pad

132‧‧‧Second insulation

142‧‧‧Second outer circuit layer

1421‧‧‧Second electrical contact pads

133‧‧‧Electrical hole

161‧‧‧First solder mask

1611‧‧‧first opening

162‧‧‧Second solder mask

1621‧‧‧second opening

170‧‧‧Protective layer

1 is a schematic cross-sectional view of an inner layer circuit substrate provided by an embodiment of the present technical solution.

2 is a schematic cross-sectional view of an electronic component provided by an embodiment of the present technical solution.

3 is a schematic cross-sectional view showing a housing hole formed in the inner layer circuit board of FIG. 1.

4 is a schematic cross-sectional view showing the electronic component of FIG. 2 housed in a receiving hole of the inner layer circuit board of FIG. 3 and welded.

FIG. 5 is a schematic cross-sectional view showing the formation of a build-up substrate in two layers of the inner layer circuit substrate of FIG. 4. FIG.

6 is a schematic cross-sectional view of a circuit board having buried electronic components fabricated by the present technical solution.

The circuit board manufacturing method provided by the technical solution includes the following steps:

In the first step, referring to FIG. 1, the inner layer circuit substrate 110 is fabricated.

The inner layer circuit substrate 110 is a circuit board on which conductive lines are formed. In this embodiment, the inner layer circuit substrate 110 is a four-layer circuit board including four conductive circuit layers and three dielectric layers. Each dielectric layer is disposed between adjacent two conductive circuit layers. Conductive holes are formed in each of the dielectric layers, and adjacent two conductive circuit layers are electrically connected to each other through the conductive holes.

In this embodiment, the inner layer circuit substrate 110 has opposite first and second surfaces 111 and 112. The first inner wiring layer 113 is formed on one side of the first surface 111. The second inner wiring layer 114 is formed on the side of the second surface 112. Two core inner wiring layers 115 are disposed between the first inner wiring layer 113 and the second inner wiring layer 114. The first dielectric layer 116 is disposed between the first inner wiring layer 113 and the core wiring layer 115, and the second dielectric layer 117 is disposed between the second inner wiring layer 114 and the other core wiring layer 115. . The third dielectric layer 118 is disposed between the two core circuit layers 115.

The manufacturing method of the inner layer circuit substrate 110 can be made by using the manufacturing method of the circuit board in the prior art. If the core substrate is fabricated first, then the layers are layered on both sides of the core substrate by means of build-up, thereby obtaining an inner layer circuit substrate.

The inner layer circuit substrate 110 includes a centrally located receiving area 1101 and a line area 1102 surrounding the receiving area 1101. The lines within the inner layer circuit substrate 110 are distributed in the line area 1102. The first inner wiring layer 113 includes a first connection pad 1131 and a second connection pad 1132. The first connection pad 1131 and the second connection pad 1132 are located on opposite sides of the receiving area 1101.

In the second step, referring to FIG. 2, an electronic component 120 is provided.

The electronic component 120 can be an electronic device that can be packaged in a circuit board, such as a capacitor, a resistor, or the like. The electronic component 120 includes a body 121 and a first soldering terminal 122 and a second soldering terminal 123 connected to the body 121. The first soldering terminal 122 and the second soldering terminal 123 are electrically connected to a corresponding one of the electrode pads of the body 121, respectively. In this embodiment, the body 121 has a substantially rectangular parallelepiped shape, and has a top surface 1211 and a first side surface 1212 and a second side surface 1213 perpendicularly connected to opposite sides of the top surface 1211.

The first soldering terminal 122 and the second soldering terminal 123 are formed on the body 121 and disposed parallel to the top surface 1211. The first soldering terminal 122 and the second soldering terminal 123 both extend out of the top surface 1211, and the first soldering terminal 122 and the second soldering terminal 123 extend in opposite directions. In this embodiment, the first soldering terminal 122 and the second soldering terminal 123 are separated from each other. The first soldering terminal 122 extends toward the first side surface 1212 and protrudes from the first side surface 1212. The second soldering terminal 123 extends toward the second side surface 1213 and protrudes from the second side surface 1213 .

It can be understood that the shape of the body 121 of the electronic component 120 is not limited to a rectangular parallelepiped shape, and it may also be a cylindrical shape or the like.

In the third step, referring to FIG. 3, a receiving hole 119 is formed in the receiving area 1101 of the inner layer circuit substrate 110. The shape and size of the receiving hole 119 correspond to the shape and size of the electronic component 120.

The receiving hole 119 can be formed by laser ablation. The receiving hole 119 penetrates through the inner layer circuit substrate 110. Preferably, the thickness of the inner layer circuit substrate 110 is substantially equal to or slightly larger than the thickness of the body 121 of the electronic component 120.

In the fourth step, referring to FIG. 4, the electronic component 120 is received in the receiving hole 119, and the first soldering terminal 122 is soldered to the first connecting pad 1131, and the second soldering terminal 123 is soldered. The second connection pad 1132.

In this step, the main body 121 of the electronic component 120 is received in the receiving hole 119. A solder material 124 is disposed on the first soldering terminal 122 and the first connection pad 1131, and a solder material 124 is disposed on the second soldering terminal 123 and the second connection pad 1132, so that the first soldering terminal 122 is soldered to the first connection pad 1131. The second soldering terminal 123 is soldered to the second connection pad 1132.

In the fifth step, referring to FIG. 5, a first build-up substrate 151 is formed on the first surface 111 of the inner layer circuit substrate 110, and a second build-up substrate 152 is formed on the second surface 112 of the inner layer circuit substrate 110.

Specifically, the first insulating layer 131 is pressed on the first surface 111 side of the inner layer circuit substrate 110, and the first outer layer circuit layer 141 is formed on the surface of the first insulating layer 131. The second insulating layer 132 is press-bonded on the second surface 112 of the inner layer circuit substrate 110, and the second outer wiring layer 142 is formed on the surface of the second insulating layer 132. That is, in the embodiment, the first build-up substrate 151 includes a first insulating layer 131 and a first outer wiring layer 141. The second build-up substrate 152 includes a second insulating layer 132 and a second outer wiring layer 142.

In this step, it can be fabricated by the layering method in the prior art. Specifically, the first insulating layer 131 may be pressed on the first surface 111 side of the inner layer circuit substrate 110, and the second insulating layer 132 may be pressed on the second surface 112 of the inner layer circuit substrate 110. Then, holes are formed in the first insulating layer 131 and the second insulating layer 132, respectively. Finally, a first outer wiring layer 141 is formed on the surface of the first insulating layer 131 by using a semi-additive method or a conductive wiring manufacturing method thereof, and a second outer wiring layer 142 is formed on the surface of the second insulating layer 132, and at the same time A conductive material is formed in the holes in the first insulating layer 131 and the second insulating layer 132 to obtain conductive vias 133. Thereby, the first outer wiring layer 141 and the second outer wiring layer 142 are respectively in communication with the conductive lines in the inner layer circuit substrate 110 through the conductive holes 133.

In a sixth step, referring to FIG. 6, a first solder resist layer 161 is formed on one side of the first outer wiring layer 141, and a second solder resist layer 162 is formed on one side of the second outer wiring layer 142, thereby obtaining A circuit board 100 in which electronic components are embedded.

In this step, the first solder resist layer 161 and the second solder resist layer 162 may be formed by printing liquid solder resist ink. A plurality of first openings 1611 are formed in the first solder resist layer 161. The conductive lines in the first outer layer circuit layer 141 are exposed from the first openings 1611 to form a first electrical contact pad 1411. A plurality of second openings 1621 are formed in the second solder mask layer 162. The conductive lines in the second outer layer circuit layer 142 are exposed from the second openings 1621 to form a second electrical contact pad 1421.

After the step, the step of forming a protective layer 170 on the surface of the first electrical contact pad 1411 and the second electrical contact pad 1421 may be further included. The protective layer 170 may be an organic solder mask (OSP). It may be a nickel gold layer or a nickel palladium gold layer.

It can be understood that the circuit board manufacturing method with embedded electronic components provided by the technical solution can continue to be layer-added after the fifth step to obtain a circuit board having more layers.

Referring to FIG. 6 , the technical solution further provides a circuit board 100 having embedded electronic components, the circuit board 100 including an inner layer circuit substrate 110 , an electronic component 120 , a first build-up substrate 151 , and a second build-up substrate 152 . .

The inner layer circuit substrate 110 has opposing first and second surfaces 111, 112. A receiving hole 119 corresponding to the electronic component 120 is formed in the inner layer circuit substrate 110 , and the receiving hole 119 extends from the first surface 111 to the second surface 112 . The first inner wiring layer 113 is formed on one side of the first surface 111. The second inner wiring layer 114 is formed on the side of the second surface 112. The first inner wiring layer 113 includes a first connection pad 1131 and a second connection pad 1132. The first connection pad 1131 and the second connection pad 1132 are located on opposite sides of the receiving hole 119 of the receiving area 1101.

The electronic component 120 includes a body 121 and a first soldering terminal 122 and a second soldering terminal 123 connected to the body 121. The first soldering terminal 122 and the second soldering terminal 123 are electrically connected to a corresponding one of the electrode pads of the body 121, respectively. The body 121 is received in the receiving hole 119. The body 121 has a top surface 1211 and a first side surface 1212 and a second side surface 1213 that are perpendicularly connected to opposite sides of the top surface 1211. The first soldering terminal 122 and the second soldering terminal 123 are both formed on the body 121 and disposed parallel to the top surface 1211. The first soldering terminal 122 and the second soldering terminal 123 both extend out of the top surface 1211, and the first soldering terminal 122 and the second soldering terminal 123 extend in opposite directions. In this embodiment, the first soldering terminal 122 and the second soldering terminal 123 are separated from each other. The first soldering terminal 122 extends toward the first side surface 1212 and protrudes from the first side surface 1212. The second soldering terminal 123 extends toward the second side surface 1213 and protrudes from the second side surface 1213 .

The first soldering terminal 122 and the second soldering terminal 123 extend out of the receiving hole 119. The first soldering terminal 122 is soldered to the surface of the first connection pad 1131, and the second soldering terminal 123 is soldered to the surface of the second connection pad 1132.

The first build-up substrate 151 is formed on the first surface 111 side of the inner layer circuit substrate 110, and the second build-up substrate 152 is formed on the second surface 112 side of the inner layer circuit substrate 110. The electronic component 120 is fixed between the first build-up substrate 151 and the second build-up substrate 152.

The circuit board with built-in electronic components and the manufacturing method thereof are provided, wherein a soldering terminal of the electronic component is formed on a top surface and extends parallel to the top surface, and the electronic component is received in the inner circuit substrate When the hole is received, the soldering terminal extending from the electronic component and the connection pad of the inner layer circuit board parallel to the soldering terminal can be soldered to each other to realize electrical conduction between the electronic component and the inner layer circuit substrate. When forming the build-up substrate, it is not necessary to make a conductive hole corresponding to the solder terminal. In the prior art, in the process of forming a blind hole in a build-up substrate by using a laser, the alignment accuracy of the blind hole and the solder terminal cannot be guaranteed. Further, before the build-up is performed, the solder terminals of the electronic component are soldered to the connection pads of the inner layer circuit substrate, and the electronic components are not irregularly displaced when the laminate is laminated.

It can be understood that the circuit board manufacturing method of the present technical solution can be applied to the fabrication of a high density interconnect circuit board (HDI).

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

no

100‧‧‧ boards

110‧‧‧ Inner layer circuit board

1131‧‧‧First connection pad

1132‧‧‧Second connection pad

120‧‧‧Electronic components

122‧‧‧First soldering terminal

123‧‧‧Second welding terminal

151‧‧‧First build-up substrate

152‧‧‧Second build-up substrate

1411‧‧‧First electrical contact pad

1421‧‧‧Second electrical contact pads

161‧‧‧First solder mask

1611‧‧‧first opening

162‧‧‧Second solder mask

1621‧‧‧second opening

170‧‧‧Protective layer

Claims (10)

A circuit board having embedded electronic components, including an inner circuit substrate, an electronic component, a first build-up substrate, and a second build-up substrate, the inner circuit substrate having opposing first and second surfaces, Forming at least two connection pads on one side of the first surface, a receiving hole penetrating the first surface and the second surface is formed in the inner layer circuit substrate, the electronic component includes a body and at least two soldering terminals, each of which The soldering terminal is electrically connected to one of the electrode pads corresponding to the body, the body is received in the receiving hole, the soldering terminal is in one-to-one correspondence with the connecting pad, and each soldering terminal is parallel to the first Forming and extending the receiving hole to be soldered to the corresponding connecting pad, the first build-up substrate is formed on one side of the first surface, and the second build-up substrate is formed on the side of the second surface The electronic component is fixed between the first build-up substrate and the second build-up substrate. The circuit board with embedded electronic components according to claim 1, wherein the at least two soldering terminals are two soldering terminals, and the at least two connecting pads are two connecting pads, the two connecting pads The two soldering terminals extend in opposite directions from the receiving holes on opposite sides of the receiving hole. The circuit board with embedded electronic components of claim 2, wherein the body has a top surface, a first side, and a second side, the first side and the second vertical perpendicularly connected to the top surface The first soldering terminal and the second soldering terminal are disposed at and parallel to the top surface, and the first soldering terminal extends toward the first side surface and protrudes from the first side surface, and the second soldering terminal The second side direction extends and protrudes from the second side. A circuit board having embedded electronic components according to claim 1, wherein the solder terminals and the corresponding connection pads are soldered and electrically connected to each other by a solder material. A circuit board having embedded electronic components according to claim 1, wherein the thickness of the inner layer circuit substrate is greater than or equal to the thickness of the body. A method for manufacturing a circuit board having embedded electronic components, comprising the steps of:
Forming an inner layer circuit substrate formed with a conductive circuit, the inner layer circuit substrate having opposite first and second surfaces, and at least two connection pads are formed on one side of the first surface;
Providing an electronic component, the electronic component comprising a body and at least two soldering terminals, each of the soldering terminals and one of the electrode pads corresponding to the body being electrically connected to each other, each soldering terminal extending out of the body;
Forming a receiving hole corresponding to the electronic component in the inner layer circuit substrate;
The body of the electronic component is received in the receiving hole, the soldering terminal is soldered in one-to-one correspondence with the connecting pad, and a first build-up substrate is formed on the first surface of the inner layer circuit substrate. The second surface of the layer circuit substrate forms a second build-up substrate, and the electronic component is fixed between the first build-up substrate and the second build-up substrate. The manufacturing method of a circuit board having embedded electronic components according to claim 6, wherein the at least two soldering terminals are two soldering terminals, and the at least two connecting pads are two connecting pads, the two The connecting pads are opposite to the receiving holes, and the two soldering terminals extend in the opposite direction out of the receiving holes. The method of fabricating a circuit board having embedded electronic components according to claim 7, wherein the inner layer circuit substrate includes a receiving area and a conductive line area surrounding the receiving area, and the at least two connection pads are formed on the The conductive line area, the receiving hole is located in the receiving area. The method of manufacturing a circuit board having embedded electronic components according to claim 6, wherein the solder terminals and the corresponding connection pads are soldered and electrically connected to each other by a solder material. The method of manufacturing a circuit board having embedded electronic components according to claim 6, wherein the receiving hole is formed by laser cutting.