TW201507304A - Heat dissipation apparatus for copper bus bar of distribution board - Google Patents

Abstract

The present invention provides a heat dissipation apparatus for copper bus bar of distribution board for dissipating the heat from a copper bus bar in a distribution board, which comprises a heat conductive insulation plate with a first surface and a second surface, in which the first surface is connected to the copper bus bar; at least one heat pipe with a first end and a second end, in which the first end is connected to the second surface of heat conductive insulation plate and the second end is located outside the distribution board; and, a plurality of heat sink fins connected with the second end of the heat pipe and located outside the distribution board. With such a design, the present invention may reduce the volume of distribution board, enhance the heat dissipation efficiency, meet the IP (Ingress Protection) rating (waterproof and dustproof), and save the power.

Description

Switchboard copper row heat sink

The invention relates to a heat dissipating device, in particular to a copper bar heat dissipating device for a copper bar of a heat dissipating switchboard.

Current distribution panels use convection to dissipate the interior of the panel, such as pan-top heatsinks, disk-type heatsinks, etc. More specifically, the lower half and the upper half of the switchboard are respectively provided with an intake fan and an exhaust fan, and the intake fan introduces cold air outside the switchboard into the switchboard to exchange heat between the cold air and the heat in the switchboard. Then, the exhaust fan will discharge the hot air to achieve the effect of cooling and cooling.

However, whether it is a pan top heat sink or a disk surface heat sink, the inside of the switchboard must have a very large convection space in order to make the pan top heat sink or the disk surface heat sink work, so for the user, The switchboard is very space-consuming.

In addition, although the top-mounted heat sink or the disk-surface heat sink can dissipate heat from the switchboard, the temperature inside the switchboard will continue to rise, and the top-mounted heat sink or the disk-surface heat sink will be affected by the ambient temperature. The speed is slow and it is not possible to cool down instantly. It should also be understood that if the temperature in the switchboard is too high, it is easy to cause the switchboard to heat up, malfunction or short circuit.

Furthermore, the top-mounted radiator or the disk-type radiator is to introduce the low-temperature air outside the switchboard into the switchboard with high temperature for heat exchange, and then the hot air is led out of the switchboard, so when the switchboard is set at high humidity or high In dusty areas, moisture or fine dust can easily be introduced into the switchboard, causing the switchboard to be short-circuited, faulty or rusted.

Moreover, since the heat dissipation efficiency of the pan top type heat sink or the disk surface type heat sink is inferior, in order to cool down the heat sink of the switchboard to a specific temperature, it is necessary to consume a very large amount of energy, which is a power consumption.

Therefore, how to invent a copper bar heat sink of a switchboard, which can reduce the volume of the switchboard, improve heat dissipation efficiency, achieve IP protection (waterproof and dustproof) and save energy, and will be actively disclosed by the present invention.

It is known that the heat dissipating device used for the copper bar of the switchboard is likely to cause a large volume of the switchboard, poor heat dissipation efficiency, easy to cause short circuit or failure of the switchboard, and energy consumption.

One object of the present invention is to provide a copper discharge heat sink for a switchboard, which can reduce the volume of the switchboard, improve heat dissipation efficiency, achieve IP protection (waterproof and dustproof), and save energy.

In order to achieve the above object, a switchboard copper discharge heat sink for dissipating a copper row in a switchboard includes a heat conductive insulation plate having a first surface and a second surface, the first surface being connected to the copper row The at least one heat pipe has a first end and a second end, the first end is connected to the second side of the heat conducting insulation board, the second end is located outside the power distribution board; and the plurality of heat dissipation fins are connected to the heat pipe The two ends are located outside the switchboard.

The above-mentioned power distribution board copper discharge heat dissipating device further comprises a cooling fan disposed outside the power distribution panel and corresponding to the heat dissipation fins.

The above-mentioned switchboard copper bus heat dissipation device further includes a wind speed controller electrically connected to the heat dissipation fan, and the wind speed controller controls the heat dissipation fan by sensing the temperature of the heat pipe by a temperature sensing component. Wherein, the wind speed controller is a PWM controller.

The above-mentioned power distribution board copper discharge heat dissipating device further comprises an energy storage member, corresponding to the heat dissipation fins for thermal energy conversion.

In the above-mentioned distribution board copper row heat dissipation device, the heat conduction insulation board is a high thermal conductivity high insulation board. Wherein, the high thermal conductivity high insulation board is a ceramic heat dissipation board.

In the above-mentioned switchboard copper discharge heat sink, the heat pipe is of a sintered type, a mesh type or a groove type.

In summary, the copper discharge heat sink of the switchboard of the present invention can reduce the volume of the switchboard, improve the heat dissipation efficiency, achieve IP protection (waterproof and dustproof), and save energy by the above design.

1‧‧‧Distribution panel

2‧‧‧Interior of switchboard

3‧‧‧brass

10‧‧‧ Thermal insulation board

11‧‧‧ first side

12‧‧‧ second side

20‧‧‧heat pipe

21‧‧‧ first end

22‧‧‧ second end

30‧‧‧Heat fins

40‧‧‧ cooling fan

50‧‧‧Wind speed controller

51‧‧‧Temperature sensing components

60‧‧‧ Energy storage components

61‧‧‧Heat exchange components

62‧‧‧ Energy storage components

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a first embodiment of a copper discharge heat sink of a switchboard of the present invention.

Fig. 2 is a perspective view showing a first embodiment of the copper discharge heat sink of the switchboard of the present invention.

Figure 3 is a cross-sectional view showing a second embodiment of the copper discharge heat sink of the switchboard of the present invention.

Figure 4 is a cross-sectional view showing a third embodiment of the copper discharge heat sink of the switchboard of the present invention.

In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: Referring to Figures 1 and 2 It is the first specific embodiment of the copper discharge heat sink of the switchboard of the present invention. The switchboard copper bus heat dissipating device is used for dissipating a copper bar 3 of the switchboard interior 2 of the switchboard 1 . The switchboard copper bus heat sink comprises a heat conductive insulation plate 10, at least one heat pipe 20 and a plurality of heat dissipation fins 30.

As shown in FIG. 1, the switchboard interior 2 of the switchboard 1 has at least one copper row 3, but is not limited thereto, and the copper row 3 can also be replaced by an aluminum row or a bakelite.

The thermally conductive insulating plate 10 has a first surface 11 and a second surface 12, and the first surface 11 The heat conducting insulating plate 10 is preferably a high thermal conductive high insulating plate, such as a ceramic heat sink; the heat pipe 20 has a first end 21 and a The second end 22 is connected to the second surface 12 of the heat conducting insulation board 10 by means of a clamp, a locking or a soldering, etc., the second end 22 is located outside the power strip 1 , wherein The heat pipe 20 is a sintered type, a mesh type or a groove type, etc.; and the heat dissipation fins 30 are connected to the second end 22 of the heat pipe 20 and are located outside the switchboard 1. As shown in Fig. 2, when the number of the heat pipes 20 is increased, the heat dissipation efficiency can be improved.

Referring to FIG. 1 and FIG. 2 again, when the switchboard 1 is operated, the temperature of the copper strip 3 inside the switchboard 2 will continue to rise, and the heat conductive insulation plate 10 will transfer the heat of the copper strip 3 by way of transmission. The heat pipe 20 is transferred from the heat pipe 20 to the heat dissipation fins 30, and the heat dissipation fins 30 dissipate the heat obtained to the outside of the power distribution panel 1. With this design, the copper row 3 inside the switchboard 2 can be effectively and continuously dissipated, thereby achieving the effect of cooling.

In summary, according to the present invention, the switchboard interior 2 of the switchboard 1 does not require a large space, and can effectively and continuously dissipate heat, in other words, can reduce the overall volume of the switchboard 1; in addition, the switchboard copper strip heat dissipation of the present invention The device directly transfers the heat of the copper strip 3 to the outside of the switchboard 1 by means of heat conduction, and does not need to additionally add an intake fan and an exhaust fan to the switchboard 1 and does not require additional power to activate the heat sink. Therefore, since the heat dissipation device of the switchboard copper strip of the present invention dissipates heat by means of heat conduction, instant heat dissipation can be achieved, and the cooling speed is faster than that of convection, so that the switchboard can be effectively improved. The heat dissipation efficiency of 1; furthermore, when the switchboard 1 is disposed in a place with heavy moisture or fine dust, such as a pit, an electrostatic zone or a desert, etc., the heat sink copper discharge device of the present invention does not have an intake air. The fan does not introduce moisture or fine dust in the air into the interior of the switchboard 2, so that the switchboard can be effectively prevented from short-circuiting, malfunctioning, rusting or damage.

Although not shown, it should be understood that the switchboard 1 can be a variety of switchboards, such as high The baffle plate or the low-voltage switchboard, etc., wherein when the switchboard 1 is a low-voltage switchboard, the thermally conductive insulating plate 10 is preferably a highly thermally conductive insulating plate. This design can effectively avoid short circuit conditions.

Next, please refer to FIG. 3, which is a second embodiment of the copper bar heat sink of the switchboard of the present invention. The second embodiment of the power strip copper heat sink is substantially the same as the first embodiment of the power strip copper heat sink. The power strip copper heat sink further includes a heat dissipating fan 40. The outer surface of the switchboard 1 and the heat sink fins 30 are equalized to accelerate the heat dissipation fins 30 to dissipate heat.

In addition, the switchboard copper heat sink further includes a wind speed controller 50 electrically connected to the heat dissipation fan 40, and the wind speed controller 50 controls the heat dissipation fan 40 by sensing the temperature of the heat pipe 20 by a temperature sensing component 51. Speed. More specifically, when the temperature of the heat pipe 20 is higher, the wind speed controller 50 increases the rotation speed of the heat dissipation fan 40 to accelerate the heat dissipation of the heat dissipation fins 30; when the temperature of the heat pipe 20 is low, the wind speed The controller 50 reduces the rotational speed of the cooling fan 40 to save energy. The wind speed controller 50 is a PWM controller.

Finally, please refer to FIG. 4, which is a third embodiment of the copper bar heat sink of the switchboard of the present invention. The design of the third embodiment of the power strip copper heat sink is substantially the same as the design of the first embodiment of the power strip copper heat sink. The power strip copper heat sink further includes an energy storage member 60 having a The heat exchange element 61 and an energy storage element 62, the position of the heat exchange element 61 corresponding to the position of the heat dissipation fins 30, to convert the heat generated by the heat dissipation fins 30 into heat energy, and the converted energy is stored. The energy storage element 62 is provided to the user for use in other devices or devices. With this design, heat recovery can be effectively applied to achieve environmental protection and energy saving effects.

In summary, the switchboard copper row heat sink of the present invention can reduce the whole of the switchboard The volume of the body is facilitated to be transported or disposed; in addition, the heat of the copper row is directly transmitted to the outside of the switchboard by heat conduction, and no additional power is required to activate the heat sink, thereby effectively saving energy; By means of heat conduction, heat dissipation can be achieved, and the cooling speed is faster than that of convection, so that the heat dissipation efficiency of the switchboard can be effectively improved; in addition, when the switchboard is placed in a place with heavy moisture or fine dust When the copper discharge heat dissipating device of the switchboard of the present invention does not introduce moisture or fine dust in the air into the interior of the switchboard, IP protection (waterproof and dustproof) can be achieved, so that the switchboard can be effectively prevented from short-circuiting, malfunctioning, rusting or bad. damage.

The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

1‧‧‧Distribution panel

2‧‧‧Interior of switchboard

3‧‧‧brass

10‧‧‧ Thermal insulation board

11‧‧‧ first side

12‧‧‧ second side

20‧‧‧heat pipe

21‧‧‧ first end

22‧‧‧ second end

30‧‧‧Heat fins

Claims (8)

The utility model relates to a copper discharge heat sink of a switchboard, which is used for dissipating a copper row in a switchboard, comprising: a heat conductive insulation plate having a first surface and a second surface, the first surface being connected to the copper row; at least one heat pipe, The first end is connected to the second end of the heat conducting insulation board, the second end is located outside the power distribution board; and the plurality of heat dissipation fins are connected to the second end of the heat pipe and located at Outside the switchboard. The heat sink of the switchboard copper strip as described in claim 1 further includes a heat dissipating fan disposed outside the switchboard, and the heat sink fins should be disposed. The switchboard copper bus heat dissipation device according to claim 2, further comprising a wind speed controller electrically connected to the heat dissipation fan, wherein the wind speed controller controls the temperature of the heat pipe by a temperature sensing component to control the heat pipe Cooling fan. The wind speed controller is a PWM controller as claimed in claim 3, wherein the wind speed controller is a PWM controller. The power strip copper heat sink according to any one of claims 1 to 4, further comprising an energy storage member corresponding to the heat sink fin for thermal energy conversion. The heat-dissipating heat-dissipating plate of the switchboard according to any one of claims 1 to 4, wherein the heat-conductive insulating plate is a high-heat-conducting high-insulation plate. The high-heat-conducting high-insulation board is a ceramic heat-dissipating board, as claimed in claim 5 of the invention. The heat exchanger copper busbar heat sink according to any one of claims 1 to 4, wherein the heat pipe is of a sintered type, a mesh type or a groove type.