TW201505198A - Pattern forming apparatus and pattern forming method - Google Patents

Pattern forming apparatus and pattern forming method Download PDF

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Publication number
TW201505198A
TW201505198A TW103113930A TW103113930A TW201505198A TW 201505198 A TW201505198 A TW 201505198A TW 103113930 A TW103113930 A TW 103113930A TW 103113930 A TW103113930 A TW 103113930A TW 201505198 A TW201505198 A TW 201505198A
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Taiwan
Prior art keywords
coating liquid
gas
pattern
discharge
substrate
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TW103113930A
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Chinese (zh)
Inventor
Yoshiyuki Nakagawa
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Screen Holdings Co Ltd
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Priority claimed from JP2013150295A external-priority patent/JP2015020118A/en
Priority claimed from JP2013169493A external-priority patent/JP2015038928A/en
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of TW201505198A publication Critical patent/TW201505198A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)

Abstract

The pattern forming apparatus of the present invention includes at least one of airflow blowing equipment (1C) and pattern shaping equipment, in which the shape of a pattern (LP) is controlled by air. The airflow blowing equipment (1C) is corresponding to at least one of ejecting start and ejecting stop of coating liquid, so as to eject air toward the surface of a substrate (W) at the upstream side of a first direction X relative to a position (P1) which the coating liquid is supplied to the substrate (W), and blow airflow AF to a liquid flow of the coating liquid in the middle of an ejecting outlet (21) of a coating liquid spray nozzle (2) and a surface of the substrate (W). The pattern shaping equipment is provided to eject air to the pattern (LP) formed on the surface of the substrate (W) in a pulsed manner so as to perform the shaping.

Description

圖案形成裝置及圖案形成方法 Pattern forming device and pattern forming method

本發明係關於一種對相對於塗佈液噴嘴而相對移動之基板,自該塗佈液噴嘴以線狀供給塗佈液而形成圖案之圖案形成技術。 The present invention relates to a pattern forming technique for forming a pattern by linearly supplying a coating liquid from a coating liquid nozzle to a substrate that relatively moves with respect to a coating liquid nozzle.

作為應用此種圖案形成技術之裝置,已知例如於太陽電池元件用之基板上形成配線圖案等線型圖案之圖案形成裝置。該圖案形成裝置中,一面使基板於特定方向上移動,一面於該基板移動中自固定配置之塗佈液噴嘴開始塗佈液(電極膏)之供給,其後停止塗佈液之供給。藉此於基板之表面形成與供給持續時間對應之長度之線型圖案。如此形成之線型圖案之始端及終端有時會產生如下之問題。即,於線型圖案之始端,線端部會變形為球狀。又,於線終端會產生塗佈液之拖尾(tail)(拉絲)。尤其為了形成配線圖案,使用具有較高黏度、例如剪切速度為1[s-1]時為數十[Pa.s(帕斯卡秒)]~數百[Pa.s]之黏度之電極膏,該等成為重要之課題。 As a device to which such a pattern forming technique is applied, for example, a pattern forming device in which a line pattern such as a wiring pattern is formed on a substrate for a solar cell element is known. In the pattern forming apparatus, while the substrate is moved in a specific direction, the supply of the coating liquid (electrode paste) is started from the coating liquid nozzle that is fixedly disposed while the substrate is moving, and then the supply of the coating liquid is stopped. Thereby, a linear pattern having a length corresponding to the supply duration is formed on the surface of the substrate. The beginning and the end of the line pattern thus formed sometimes cause the following problems. That is, at the beginning of the line pattern, the end portion of the line is deformed into a spherical shape. Further, a tail (drawing) of the coating liquid is generated at the wire terminal. In particular, in order to form a wiring pattern, it is tens [pa.] when it has a high viscosity, for example, a shear rate of 1 [s -1 ]. s (Pascal seconds)] ~ hundreds [Pa. The electrode paste of s] is an important issue.

因此,為了消除該等問題,提出應用例如日本專利實開昭62-183584號公報中記載之技術。即,該提案技術係藉由自空氣噴嘴噴射空氣而抑制拖尾之產生者。 Therefore, in order to eliminate such problems, a technique described in, for example, Japanese Laid-Open Patent Publication No. SHO-62-183584 is proposed. That is, the proposed technique suppresses the generation of the smear by injecting air from the air nozzle.

且說,上述日本專利實開昭62-183584號公報中記載之裝置中,將自膠噴嘴噴出之膠(相當於本發明之「塗佈液」)塗佈於藉由輸送帶搬送之紙板上,並且朝相對於膠之流動正交之方向噴出加壓空氣。藉由該空氣流可謀求抑制拖尾之產生。但,加壓空氣之方向為與紙板之移動方向相同之方向,被加壓空氣吹跑之膠飛散而污染紙板及裝置。又,對於線端部變形為球狀之技術性課題完全無效。 In the apparatus described in Japanese Laid-Open Patent Publication No. SHO-62-183584, the glue (corresponding to the "coating liquid" of the present invention) ejected from the glue nozzle is applied to the paperboard conveyed by the conveyor belt. And the pressurized air is ejected in a direction orthogonal to the flow of the glue. By this air flow, it is possible to suppress the occurrence of smear. However, the direction of the pressurized air is in the same direction as the direction of movement of the cardboard, and the glue blown by the pressurized air scatters to contaminate the cardboard and the device. Moreover, it is completely ineffective for the technical problem that the end portion of the wire is deformed into a spherical shape.

又,圖案形成裝置之重要性能之一係將形成於基板上之圖案最後加工成所需形狀。因此,要求於基板上形成圖案之後,將該圖案整形為所需形狀之技術。 Further, one of the important properties of the pattern forming device is that the pattern formed on the substrate is finally processed into a desired shape. Therefore, a technique of shaping the pattern into a desired shape after forming a pattern on the substrate is required.

本發明係鑒於上述問題而完成者,其目的在於提供一種可於基板上以良好之形狀形成線型圖案之圖案形成技術。 The present invention has been made in view of the above problems, and an object thereof is to provide a pattern forming technique capable of forming a line pattern in a good shape on a substrate.

本發明之一之態樣之圖案形成裝置之特徵在於:其係藉由線狀之塗佈液而於基板之表面形成圖案者,上述線狀之塗佈液係自塗佈液噴嘴之噴出口噴出至相對於上述塗佈液噴嘴而於第1方向上相對移動之上述基板之表面,上述圖案形成裝置包含氣流吹送設備與圖案整形設備中之至少一者,上述氣流吹送設備係對應於上述塗佈液之噴出開始及噴出停止中之至少一者,相對於上述塗佈液對上述基板之供給位置而朝向上述第1方向之上游側之上述基板之表面噴射氣體,於上述塗佈液噴嘴之噴出口與上述基板之表面之中間對上述塗佈液之液流吹送氣流;上述圖案整形設備係對形成於上述基板之表面上之圖案以脈衝狀噴射氣體並進行整形;藉由上述氣體而控制圖案之形狀。 A pattern forming apparatus according to an aspect of the present invention is characterized in that a pattern is formed on a surface of a substrate by a linear coating liquid which is a discharge port of a coating liquid nozzle. Dissipating the surface of the substrate that is relatively moved in the first direction with respect to the coating liquid nozzle, the pattern forming device including at least one of an airflow blowing device and a pattern shaping device, wherein the airflow blowing device corresponds to the coating At least one of the discharge start of the discharge liquid and the discharge stoppage, the gas is ejected toward the surface of the substrate on the upstream side in the first direction with respect to the supply position of the coating liquid to the coating liquid nozzle. a flow of the liquid to the coating liquid is blown between the discharge port and the surface of the substrate; the pattern shaping device injects and shapes the pattern on the surface of the substrate in a pulsed manner; and is controlled by the gas The shape of the pattern.

又,本發明之另一態樣之圖案形成方法之特徵在於:其係藉由線狀之塗佈液而於基板之表面形成圖案者,上述線狀之塗佈液係自塗佈液噴嘴之第2噴出口噴出至相對於上述塗佈液噴嘴而於第1方向上相對移動之上述基板之表面,上述圖案形成方法執行以下步驟中之至少 一個步驟並控制上述圖案之形狀:第1步驟,其係對應於上述塗佈液之噴出開始及噴出停止中之至少一者,相對於上述塗佈液對上述基板之供給位置而朝向上述第1方向之上游側之上述基板之表面噴射氣體,於上述塗佈液噴嘴之第2噴出口與上述基板之表面之中間對上述塗佈液之液流吹送氣流;及第2步驟,其係對形成於上述基板之表面上之圖案以脈衝狀噴射氣體並進行整形。 Further, in another aspect of the present invention, a pattern forming method is characterized in that a pattern is formed on a surface of a substrate by a linear coating liquid, and the linear coating liquid is applied from a coating liquid nozzle. The second ejection port is ejected onto the surface of the substrate that relatively moves in the first direction with respect to the coating liquid nozzle, and the pattern forming method performs at least one of the following steps And controlling the shape of the pattern in one step: the first step is to correspond to at least one of a discharge start and a discharge stop of the coating liquid, and to face the first position with respect to a supply position of the coating liquid to the substrate a gas is ejected from a surface of the substrate on the upstream side of the direction, and a flow of the liquid is blown to the liquid of the coating liquid between the second discharge port of the coating liquid nozzle and the surface of the substrate; and the second step is to form a pair The pattern on the surface of the above substrate is pulsed to eject and shape the gas.

如此構成之發明中,執行對塗佈液之液流吹送氣流、及藉由對基板上之圖案脈衝噴射氣體而進行之圖案整形中之至少一者來控制圖案之形狀。 In the invention thus constituted, the shape of the pattern is controlled by performing at least one of a flow of the liquid to the coating liquid and a patterning of the gas by patterning the pattern on the substrate.

此處,於塗佈液噴嘴之噴出口與基板之表面之中間,針對塗佈液之液流之氣流之供給係於使塗佈液壓接於基板之方向上發揮作用,不會使塗佈液飛散,可對應於塗佈液之噴出開始及噴出停止中之至少一者而對塗佈液之液流供給氣流。例如藉由對應於塗佈液之噴出開始而進行氣流之供給,可抑制線型圖案之始端變形成球狀,且藉由對應於塗佈液之噴出停止而進行上述氣流之供給,可抑制於線型圖案之終端產生拖尾。 Here, in the middle of the discharge port of the coating liquid nozzle and the surface of the substrate, the supply of the gas flow to the liquid flow of the coating liquid acts to connect the coating hydraulic pressure to the substrate, and does not cause the coating liquid. The scattering may be performed by supplying a gas flow to the liquid flow of the coating liquid in accordance with at least one of the discharge start and the discharge stop of the coating liquid. For example, by supplying the gas flow in accordance with the start of the discharge of the coating liquid, it is possible to suppress the start of the linear pattern from becoming spherical, and to supply the gas flow in response to the discharge of the coating liquid, thereby suppressing the line type. The terminal of the pattern produces a trailing tail.

另一方面,若對形成於基板上之圖案以脈衝狀噴射氣體並進行加壓,則圖案中受到加壓之部位以附在基板上之狀態得到整形。此處,「使氣體以脈衝狀噴射」,係指反覆地進行氣體之噴射與噴射停止,於不會產生圖案不良而進行圖案整形之方面發揮重要之作用。 即,如以下詳細敍述般,若連續性地持續噴射氣體,則圖案中受到氣體之壓力之部位會飛散,從而引起圖案不良。對此,藉由以脈衝狀噴射氣體,不會使受到氣體之壓力之部位向周圍飛散,從而可使圖案整形。 On the other hand, when the gas formed on the substrate is pulsed and pressurized, the portion of the pattern that is pressurized is shaped by being attached to the substrate. Here, "pulsing the gas in a pulse shape" means that the gas is ejected and the ejection is stopped repeatedly, and the pattern is shaped so as not to cause a pattern defect. That is, as described in detail below, when the gas is continuously ejected continuously, the portion of the pattern that is subjected to the pressure of the gas scatters, causing pattern defects. On the other hand, by injecting the gas in a pulsed manner, the portion subjected to the pressure of the gas is not scattered around, and the pattern can be shaped.

根據本發明,可於基板上以良好之形狀形成線型圖案。 According to the present invention, a line pattern can be formed in a good shape on a substrate.

1‧‧‧圖案形成裝置 1‧‧‧ pattern forming device

1A、200‧‧‧平台移動機構(移動設備) 1A, 200‧‧‧ platform mobile agencies (mobile devices)

1B‧‧‧塗佈液噴出裝置 1B‧‧‧ Coating liquid ejection device

1C‧‧‧氣體噴出裝置(氣流吹送設備) 1C‧‧‧ gas ejection device (airflow blowing device)

1D‧‧‧圖案整形裝置(圖案整形設備) 1D‧‧‧pattern shaping device (pattern shaping equipment)

2‧‧‧塗佈液噴嘴 2‧‧‧ Coating liquid nozzle

3‧‧‧噴嘴組 3‧‧‧Nozzle group

4、560‧‧‧塗佈液噴出控制部 4, 560‧‧‧ coating liquid discharge control department

5‧‧‧支持塊 5‧‧‧Support block

6‧‧‧上側固持器 6‧‧‧Upper holder

7‧‧‧下側固持器 7‧‧‧Bottom holder

8‧‧‧塗佈液供給部 8‧‧‧ Coating Liquid Supply Department

21、P1~P3、P24~P26‧‧‧(塗佈液噴嘴之)噴出口 21, P1~P3, P24~P26‧‧‧ (coating liquid nozzle) spray outlet

22‧‧‧塗佈液貯存部 22‧‧‧ Coating Liquid Storage Department

23‧‧‧塗佈液流路 23‧‧‧ Coating liquid flow path

23D‧‧‧下游側流路 23D‧‧‧ downstream side flow path

23U‧‧‧上游側流路 23U‧‧‧ upstream side flow path

24‧‧‧開口 24‧‧‧ openings

31、422‧‧‧貫通孔 31, 422‧‧‧through holes

41‧‧‧旋轉驅動部 41‧‧‧Rotary drive department

42‧‧‧旋轉軸 42‧‧‧Rotary axis

43、44‧‧‧密封構件 43, 44‧‧‧ Sealing members

45、46‧‧‧滾珠軸承 45, 46‧‧‧ ball bearings

47‧‧‧間隔件 47‧‧‧ spacers

51‧‧‧導入孔 51‧‧‧Introduction hole

61‧‧‧蓋構件 61‧‧‧Caps

62‧‧‧圓筒構件 62‧‧‧Cylinder components

110、160‧‧‧噴嘴夾持器 110, 160‧‧‧ nozzle holder

120‧‧‧(第1)氣體噴嘴 120‧‧‧(1) gas nozzle

130‧‧‧(第1)氣體供給部 130‧‧‧(1) Gas Supply Department

131‧‧‧連續噴吹系統(第2供給系統) 131‧‧‧Continuous blowing system (2nd supply system)

131a、132a、181a‧‧‧配管 131a, 132a, 181a‧‧‧ piping

131b、132b、181b‧‧‧調節器 131b, 132b, 181b‧‧‧ adjusters

131c、132c、181c‧‧‧針閥 131c, 132c, 181c‧‧ needles

131d、132d、181d‧‧‧驅動開閉閥 131d, 132d, 181d‧‧‧ drive open and close valves

132‧‧‧脈衝噴吹系統(第1供給系統) 132‧‧‧Pulse blowing system (1st supply system)

140‧‧‧閥控制部(氣體供給控制部) 140‧‧‧Valve Control Unit (Gas Supply Control Unit)

150‧‧‧脈衝驅動部(氣體供給控制部) 150‧‧‧pulse drive unit (gas supply control unit)

170‧‧‧(第2)氣體噴嘴 170‧‧‧(2nd) gas nozzle

171‧‧‧噴出口 171‧‧‧Spray outlet

180‧‧‧(第2)氣體供給部 180‧‧‧(2nd) gas supply unit

181‧‧‧脈衝噴吹系統 181‧‧‧Pulse blowing system

210‧‧‧X方向移動機構 210‧‧‧X direction moving mechanism

211、221、231‧‧‧馬達 211, 221, 231‧ ‧ motor

212‧‧‧滾珠螺桿 212‧‧‧Rolling screw

213‧‧‧螺帽 213‧‧‧ nuts

214、224‧‧‧導軌 214, 224‧ ‧ rails

220‧‧‧Y方向移動機構 220‧‧‧Y direction moving mechanism

221‧‧‧平台升降機構 221‧‧‧ platform lifting mechanism

230‧‧‧θ旋轉機構 230‧‧‧θ rotating mechanism

240‧‧‧平台升降機構 240‧‧‧ platform lifting mechanism

300‧‧‧平台 300‧‧‧ platform

411‧‧‧微電動馬達 411‧‧‧Micro electric motor

412‧‧‧減速器 412‧‧‧Reducer

413‧‧‧編碼器 413‧‧‧Encoder

421‧‧‧流量調整部 421‧‧‧Flow Adjustment Department

423‧‧‧凹槽部 423‧‧‧ Groove

424‧‧‧非凹槽部 424‧‧‧Non-groove

500‧‧‧塗佈頭部 500‧‧‧Coating head

510‧‧‧基底 510‧‧‧Base

520‧‧‧塗佈液供給部 520‧‧‧ Coating Liquid Supply Department

521‧‧‧注射泵 521‧‧‧Syringe pump

524‧‧‧柱塞 524‧‧‧Plunger

530‧‧‧光照射部(圖案硬化部) 530‧‧‧Lighting section (pattern hardening section)

531‧‧‧光纖 531‧‧‧ fiber optic

532‧‧‧光源單元 532‧‧‧Light source unit

550‧‧‧噴嘴組 550‧‧‧Nozzle set

551‧‧‧噴出口 551‧‧‧Spray outlet

560‧‧‧塗佈液噴出控制部 560‧‧‧ Coating Liquid Discharge Control Department

600‧‧‧控制部 600‧‧‧Control Department

710‧‧‧基台 710‧‧‧Abutment

721‧‧‧框架 721‧‧‧Frame

800‧‧‧氣體噴出裝置 800‧‧‧ gas ejection device

AF‧‧‧空氣流(氣流) AF‧‧‧air flow (airflow)

B‧‧‧匯流排配線圖案 B‧‧‧ bus bar wiring pattern

C‧‧‧中心軸 C‧‧‧ center axis

CF‧‧‧塗佈液之液流 Fluid flow of CF‧‧‧ coating liquid

CPd‧‧‧下游側交點 CPd‧‧‧ downstream side intersection

CPu‧‧‧上游側交點 CPu‧‧‧ upstream intersection

D2‧‧‧噴出方向(第2方向) D2‧‧‧Spray direction (2nd direction)

D3‧‧‧噴射方向(第3方向) D3‧‧‧jet direction (3rd direction)

ER‧‧‧端部區域 ER‧‧‧ end area

F‧‧‧指狀配線圖案 F‧‧‧ finger wiring pattern

Fe、Fr‧‧‧電極圖案(線型圖案) Fe, Fr‧‧‧ electrode pattern (line pattern)

H1、H2‧‧‧高度 H1, H2‧‧‧ height

L12‧‧‧長度 L12‧‧‧ length

LP‧‧‧線型圖案 LP‧‧‧Line pattern

LPa‧‧‧始端部(被整形部) The beginning of LPa‧‧‧ (the Department of Plastic Surgery)

LPb‧‧‧終端部(被整形部) LPb‧‧‧ Terminal Department (Organized Department)

P‧‧‧排列方向 P‧‧‧Orientation

PS1‧‧‧(塗佈液之)供給位置 PS1‧‧‧ (coating solution) supply location

PS2‧‧‧(空氣之)供給位置 PS2‧‧‧ (air) supply location

Q‧‧‧噴出方向 Q‧‧‧Spoke direction

R‧‧‧軸方向 R‧‧‧axis direction

RR‧‧‧矩形區域 RR‧‧‧Rectangular area

S‧‧‧太陽電池單元 S‧‧‧ solar battery unit

S101~S110‧‧‧步驟 S101~S110‧‧‧Steps

T1、T2、T3、T4‧‧‧時序 T1, T2, T3, T4‧‧‧ timing

W‧‧‧基板 W‧‧‧Substrate

W1‧‧‧上游側交點CPu與下游側交點CPd之 距離 W1‧‧‧ upstream intersection point CPu and downstream side intersection point CPd distance

W2‧‧‧旋轉軸42之寬度方向P之外徑 W2‧‧‧The outer diameter of the width direction P of the rotating shaft 42

Wn‧‧‧凹槽部423之寬度 Wn‧‧‧Width of groove part 423

X‧‧‧移動方向(第1方向) X‧‧‧Moving direction (1st direction)

Y、Z‧‧‧方向 Y, Z‧‧‧ direction

△T12、△T34‧‧‧時間 △T12, △T34‧‧‧ time

圖1A及圖1B係表示本發明之圖案形成裝置之第1實施形態之外觀之圖。 Fig. 1A and Fig. 1B are views showing the appearance of a first embodiment of the pattern forming apparatus of the present invention.

圖2係圖案形成裝置中配備之塗佈液噴出裝置之剖面圖。 Fig. 2 is a cross-sectional view showing a coating liquid ejecting apparatus provided in the pattern forming apparatus.

圖3係塗佈液噴出裝置之B-B線剖面圖。 Fig. 3 is a cross-sectional view taken along line B-B of the coating liquid discharge device.

圖4A至圖4D係模式性表示塗佈液噴出裝置之噴出控制動作之圖。 4A to 4D are views schematically showing the discharge control operation of the coating liquid discharge device.

圖5係模式性表示圖案形成裝置中配備之氣體噴出裝置之構成之圖。 Fig. 5 is a view schematically showing the configuration of a gas ejection device provided in the pattern forming apparatus.

圖6A及圖6B係表示圖1A所示之圖案形成裝置之動作之時序圖。 6A and 6B are timing charts showing the operation of the pattern forming apparatus shown in Fig. 1A.

圖7係模式性表示本發明之圖案形成裝置之第2實施形態中配備之氣體噴出裝置之構成之圖。 Fig. 7 is a view schematically showing the configuration of a gas discharge device provided in a second embodiment of the pattern forming apparatus of the present invention.

圖8係表示圖7所示之圖案形成裝置之動作之一例之時序圖。 Fig. 8 is a timing chart showing an example of the operation of the pattern forming apparatus shown in Fig. 7.

圖9係表示圖7所示之圖案形成裝置之動作之另一例之時序圖。 Fig. 9 is a timing chart showing another example of the operation of the pattern forming apparatus shown in Fig. 7.

圖10係模式性表示本發明之圖案形成裝置之第3實施形態中配備之氣體噴出裝置之構成之圖。 Fig. 10 is a view schematically showing the configuration of a gas discharge device provided in a third embodiment of the pattern forming apparatus of the present invention.

圖11係表示圖案形成裝置之第3實施形態之動作之時序圖。 Fig. 11 is a timing chart showing the operation of the third embodiment of the pattern forming apparatus.

圖12係表示本發明之圖案形成裝置之第4實施形態之圖。 Fig. 12 is a view showing a fourth embodiment of the pattern forming apparatus of the present invention.

圖13係表示不使用圖案整形裝置進行圖案形成時之圖案形成裝置之動作之時序圖。 Fig. 13 is a timing chart showing the operation of the pattern forming apparatus when patterning is performed without using a pattern shaping device.

圖14係表示使用圖案整形裝置進行圖案形成時之圖案形成裝置之動作之時序圖。 Fig. 14 is a timing chart showing the operation of the pattern forming apparatus when patterning is performed using the pattern shaping device.

圖15係模式性表示圖案之始端部及終端部之形狀伴隨氣體噴射之脈衝寬度之變化而變化之圖。 Fig. 15 is a view schematically showing changes in the shape of the start end portion and the end portion of the pattern as a function of the pulse width of the gas jet.

圖16係表示本發明之圖案形成裝置之第5實施形態之圖。 Fig. 16 is a view showing a fifth embodiment of the pattern forming apparatus of the present invention.

圖17係表示圖16所示之圖案形成裝置之動作之時序圖。 Fig. 17 is a timing chart showing the operation of the pattern forming apparatus shown in Fig. 16.

圖18係表示圖案形成裝置之第6實施形態之動作之時序圖。 Fig. 18 is a timing chart showing the operation of the sixth embodiment of the pattern forming apparatus.

圖19係表示配備有本發明之圖案整形裝置之圖案形成裝置之第7實施形態之動作之圖。 Fig. 19 is a view showing the operation of the seventh embodiment of the pattern forming apparatus equipped with the pattern shaping device of the present invention.

圖20係表示本發明之圖案形成裝置之第8實施形態之圖。 Fig. 20 is a view showing an eighth embodiment of the pattern forming apparatus of the present invention.

圖21係表示使用圖20之圖案形成裝置形成之太陽電池單元之例之圖。 Fig. 21 is a view showing an example of a solar battery cell formed using the pattern forming device of Fig. 20.

圖22係模式性表示由圖20之裝置形成指狀電極之狀況之圖。 Fig. 22 is a view schematically showing a state in which the finger electrodes are formed by the apparatus of Fig. 20.

圖23係表示第8實施形態之圖案形成處理之流程圖。 Fig. 23 is a flow chart showing the pattern forming process of the eighth embodiment.

<第1實施形態> <First embodiment>

圖1A及圖1B係表示本發明之圖案形成裝置之第1實施形態之外觀之圖。更詳細而言,圖1A係圖案形成裝置之立體圖,圖1B係圖案形成裝置之側視圖。該圖案形成裝置1係將含有用於形成圖案之材料之塗佈液、例如電極膏塗佈於基板上之裝置,其可應用於例如於具有光電轉換面之基板上形成配線圖案而製造光電轉換元件之技術。 Fig. 1A and Fig. 1B are views showing the appearance of a first embodiment of the pattern forming apparatus of the present invention. In more detail, FIG. 1A is a perspective view of a patterning device, and FIG. 1B is a side view of the patterning device. The pattern forming apparatus 1 is a device for applying a coating liquid containing a material for forming a pattern, for example, an electrode paste, on a substrate, which can be applied to, for example, forming a wiring pattern on a substrate having a photoelectric conversion surface to manufacture photoelectric conversion. The technology of components.

該圖案形成裝置1包含:使基板W於X方向移動之平台移動機構(圖5中之符號1A);向於X方向上移動之基板W以線狀噴出4條塗佈液之塗佈液噴出裝置1B;及對各塗佈液之液流供給空氣流之氣體噴出裝置1C。而且,一方面平台移動機構1A使基板W以特定之移動速度於X方向上移動,一方面塗佈液噴出裝置1B以與上述移動速度相等之噴出速度噴出塗佈液,從而於基板W上最大可形成4條線型圖案。以下,對塗佈液噴出裝置1B及氣體噴出裝置1C之構成進行說明之後,對圖案形成裝置1之動作進行說明。 The pattern forming apparatus 1 includes a stage moving mechanism (symbol 1A in FIG. 5) for moving the substrate W in the X direction, and a coating liquid which ejects four coating liquids in a line shape in the substrate W moving in the X direction. The apparatus 1B; and a gas discharge device 1C that supplies an air flow to the liquid flow of each coating liquid. Further, on the one hand, the stage moving mechanism 1A moves the substrate W at a specific moving speed in the X direction, and on the other hand, the coating liquid ejecting apparatus 1B ejects the coating liquid at a discharge speed equal to the above moving speed, thereby maximizing the substrate W. Four line patterns can be formed. Hereinafter, the configuration of the coating liquid discharge device 1B and the gas discharge device 1C will be described, and the operation of the pattern forming device 1 will be described.

塗佈液噴出裝置1B包含一體地保持有4個塗佈液噴嘴2之多串噴嘴組3。即,該多串噴嘴組3中,將4個塗佈液噴嘴2排列成一排,且於其排列方向上各塗佈液噴嘴2之噴出口21以一排露出於多串噴嘴組3之 表面。又,針對每一塗佈液噴嘴2設置有控制自噴出口21噴出塗佈液之塗佈液噴出控制部4,其等4個塗佈液噴出控制部4分別獨立地作動,可控制自塗佈液供給部8壓送出之塗佈液自各噴出口21之噴出。再者,本實施形態中,將塗佈液噴嘴2之排列方向稱為「排列方向P」,將自各噴出口21之塗佈液之噴出方向稱為「噴出方向Q」,將與該等排列方向P及噴出方向Q交叉成直角之交叉方向稱為「交叉方向R」。 The coating liquid discharge device 1B includes a plurality of nozzle groups 3 in which four coating liquid nozzles 2 are integrally held. That is, in the multi-string nozzle group 3, the four coating liquid nozzles 2 are arranged in a row, and the discharge ports 21 of the respective coating liquid nozzles 2 are exposed in a row to the plurality of nozzle groups 3 in the arrangement direction. surface. Further, each of the coating liquid nozzles 2 is provided with a coating liquid discharge control unit 4 that controls the discharge of the coating liquid from the discharge port 21, and the four coating liquid discharge control units 4 are independently operated to control the self-coating. The coating liquid that is pressure-fed by the liquid supply unit 8 is ejected from each of the ejection ports 21. In the present embodiment, the direction in which the coating liquid nozzles 2 are arranged is referred to as "arrangement direction P", and the direction in which the coating liquid from the respective ejection ports 21 is ejected is referred to as "discharge direction Q". The direction in which the direction P and the discharge direction Q intersect at right angles is referred to as "cross direction R".

圖2係穿過圖1B所示之塗佈液噴出裝置之A-A線且與圖1B之紙面平行之剖面圖,圖3係圖1B所示之塗佈液噴出裝置之B-B線剖面圖。圖4A至圖4D係模式性表示圖1A及圖1B所示之塗佈液噴出裝置之噴出控制動作之圖。該塗佈液噴出裝置1B包含:一體地保持4個塗佈液噴嘴2之多串噴嘴組3;4個塗佈液噴出控制部4;支持塗佈液噴出控制部4之旋轉驅動部41之支持塊5;自上方側(+R方向側)擠壓而保持安裝於多串噴嘴組3上之塗佈液噴出控制部4之構成零件之上側固持器6;及自下方側(-R方向側)擠壓而保持塗佈液噴出控制部4之構成零件之下側固持器7。 Fig. 2 is a cross-sectional view taken along line A-A of the coating liquid ejecting apparatus shown in Fig. 1B and parallel to the plane of Fig. 1B, and Fig. 3 is a cross-sectional view taken along line B-B of the coating liquid ejecting apparatus shown in Fig. 1B. 4A to 4D are views schematically showing the discharge control operation of the coating liquid discharge device shown in Figs. 1A and 1B. The coating liquid discharge device 1B includes a plurality of nozzle groups 3 that integrally hold four coating liquid nozzles 2, four coating liquid discharge control units 4, and a rotation driving unit 41 that supports the coating liquid discharge control unit 4. Supporting block 5; squeezing from the upper side (+R direction side) to hold the component upper retainer 6 of the coating liquid discharge control unit 4 mounted on the multi-string nozzle group 3; and from the lower side (-R direction) The lower side holder 7 of the constituent parts of the coating liquid discharge control portion 4 is held while being pressed.

多串噴嘴組3中,如圖3所示,於(-Q)側端部設置有於排列方向P延伸之長方體空間,其係作為塗佈液貯存部22而發揮功能,該塗佈液貯存部22暫時貯存自塗佈液供給部8(圖1B)經由設置於支持塊5之下側端部之導入孔51壓送出之塗佈液。自該塗佈液貯存部22將具有同一形狀之4個塗佈液噴嘴2於排列方向P上以等間距(本實施形態中,為2[mm]間隔)配置成一排。各塗佈液噴嘴2於噴出方向、即(+Q)方向延伸設置,其前端部與多串噴嘴組3之(+Q)側端面相連,成為噴出口21。因此,於塗佈液噴嘴2之內部自長方體空間部22向噴出口21具有大致橢圓形狀剖面之筒形狀空間係作為塗佈液流路23發揮功能,將貯存於塗佈液貯存部22中之塗佈液導引至噴出口21。如此於本實施形態 中,將塗佈液貯存部22被壓送出之塗佈液分配至4個塗佈液噴嘴2並加以導引。 In the multi-string nozzle group 3, as shown in FIG. 3, a rectangular parallelepiped space extending in the arrangement direction P is provided at the (-Q) side end portion, and functions as a coating liquid storage portion 22, and the coating liquid is stored. The portion 22 temporarily stores the coating liquid that is pressure-fed from the coating liquid supply portion 8 (FIG. 1B) through the introduction hole 51 provided at the lower end portion of the support block 5. The coating liquid storage unit 22 has four coating liquid nozzles 2 having the same shape arranged in a row at equal intervals (in the present embodiment, at intervals of 2 [mm]) in the arrangement direction P. Each of the coating liquid nozzles 2 is extended in the discharge direction, that is, in the (+Q) direction, and the tip end portion thereof is connected to the (+Q) side end surface of the plurality of nozzle groups 3 to be the discharge port 21. Therefore, the cylindrical space having a substantially elliptical cross section from the rectangular parallelepiped space portion 22 to the discharge port 21 in the inside of the coating liquid nozzle 2 functions as the coating liquid flow path 23, and is stored in the coating liquid storage portion 22. The coating liquid is guided to the discharge port 21. So in this embodiment In the middle, the coating liquid which is sent out by the coating liquid storage unit 22 is distributed to the four coating liquid nozzles 2 and guided.

各塗佈液噴嘴2中,如圖2所示,於塗佈液流路23之中間位置之上方側(+R方向側)與下方側(-R方向側)各形成有1個開口24。本實施形態中,為了防止相互鄰接之塗佈液噴出控制部4相互干涉,將設置開口24之位置分成2段。即,如圖3所示,一方面對於最接近(+P)側之噴嘴編號「1」及噴嘴編號「3」之塗佈液噴嘴2,將開口24設置於靠近塗佈液貯存部22之位置,另一方面對於最接近(-P)側之噴嘴編號「4」及噴嘴編號「2」之塗佈液噴嘴2,將開口24設置於靠近噴出口21之位置。如此,形成於相互鄰接之2個塗佈液噴嘴2之各者之開口24在與排列方向P正交之噴出方向Q上之相互不同之位置上形成。又,於多串噴嘴組3上,自塗佈液噴嘴2之上側開口24向上方(+R方向)、且自下側開口24向下方(-R方向)設置有貫通孔31。該等貫通孔31係用於設置以下說明之塗佈液噴出控制部4之各種構成零件(旋轉軸42、密封構件43、44及滾珠軸承45、46),其內徑設定為較開口24寬。又,各開口24與塗佈液噴出控制部4之旋轉軸42之直徑(軸徑)為相同尺寸,且亦設定為較排列方向P上之塗佈液流路23之寬度寬。 In each of the coating liquid nozzles 2, as shown in FIG. 2, one opening 24 is formed in each of the upper side (+R direction side) and the lower side (-R direction side) of the intermediate position of the coating liquid flow path 23. In the present embodiment, in order to prevent the coating liquid discharge control portions 4 adjacent to each other from interfering with each other, the position at which the opening 24 is provided is divided into two stages. In other words, as shown in FIG. 3, the opening 24 is placed close to the coating liquid storage portion 22 with respect to the coating liquid nozzle 2 of the nozzle number "1" and the nozzle number "3" closest to the (+P) side. On the other hand, the coating liquid nozzle 2 closest to the nozzle number "4" on the (-P) side and the nozzle number "2" is provided at a position close to the discharge port 21. In this way, the openings 24 formed in each of the two coating liquid nozzles 2 adjacent to each other are formed at positions different from each other in the discharge direction Q orthogonal to the arrangement direction P. Further, in the multi-string nozzle group 3, the through hole 31 is provided from the upper side opening 24 of the coating liquid nozzle 2 upward (+R direction) and downward (-R direction) from the lower opening 24. The through holes 31 are used to provide various components (the rotating shaft 42, the sealing members 43, 44, and the ball bearings 45 and 46) of the coating liquid discharge control unit 4 described below, and the inner diameter thereof is set to be wider than the opening 24. . Moreover, the diameter (shaft diameter) of each of the openings 24 and the rotating shaft 42 of the coating liquid discharge control unit 4 is the same size, and is also set to be wider than the width of the coating liquid flow path 23 in the arrangement direction P.

各塗佈液噴出控制部4包含於交叉方向R延伸設置之旋轉軸42。本實施形態中,將具有直徑1[mm]之軸形狀之不鏽鋼棒用作旋轉軸42。該旋轉軸42之前端部、即(-R)側端部插入至貫通孔31中,進而經由兩開口24而貫通於塗佈液噴嘴2。 Each of the coating liquid discharge control units 4 includes a rotation shaft 42 that extends in the intersecting direction R. In the present embodiment, a stainless steel rod having a shaft shape having a diameter of 1 [mm] is used as the rotating shaft 42. The front end portion of the rotating shaft 42 , that is, the (-R) side end portion is inserted into the through hole 31 , and further penetrates the coating liquid nozzle 2 through the two openings 24 .

該旋轉軸42之前端部中位於兩開口24之間之部分(以下稱為「流量調整部421」)被插入至塗佈液噴嘴2之塗佈液流路23內。而且,如圖3所示,流量調整部421之直徑亦較塗佈液流路23之排列方向P之寬度寬,故而藉由流量調整部421將塗佈液流路23分割為上游側流路23U與下游側流路23D。在此,於流量調整部421中,將旋轉軸42之側 面切下而形成凹槽部423,藉由該凹槽部423可將塗佈液向(+Q)方向導引。更詳細而言,如圖2所示,凹槽部423在旋轉軸42與塗佈液流路23交叉之方向(軸方向R)上具有與塗佈液流路23之高度H1相同或較其低之高度H2。又,在與軸方向R及流路方向Q正交之寬度方向P上,具有如下之尺寸關係。即,如圖4A所示,將「上游側交點CPu」與「下游側交點CPd」之距離設為「W1」。又,將旋轉軸42之寬度方向P之外徑設為「W2」。繼而,若使凹槽部423之寬度Wn滿足W1<Wn<W2,則每旋轉90°而可接通/斷開。因此,藉由使旋轉軸42旋轉而可多階段地控制上游側流路23U與下游側流路23D之連通狀態。 A portion of the front end portion of the rotating shaft 42 between the two openings 24 (hereinafter referred to as "flow rate adjusting portion 421") is inserted into the coating liquid flow path 23 of the coating liquid nozzle 2. Further, as shown in FIG. 3, the diameter of the flow rate adjusting portion 421 is also wider than the width of the arrangement direction P of the coating liquid flow path 23, so that the flow rate adjusting portion 421 divides the coating liquid flow path 23 into the upstream side flow path. 23U and downstream side flow path 23D. Here, in the flow rate adjustment unit 421, the side of the rotating shaft 42 is placed The groove portion 423 is formed by cutting the surface, and the groove portion 423 can guide the coating liquid in the (+Q) direction. More specifically, as shown in FIG. 2, the groove portion 423 has the same or a higher height H1 than the coating liquid flow path 23 in the direction in which the rotating shaft 42 intersects with the coating liquid flow path 23 (axial direction R). Low height H2. Moreover, the width direction P orthogonal to the axial direction R and the flow path direction Q has the following dimensional relationship. That is, as shown in FIG. 4A, the distance between the "upstream side intersection point CPu" and the "downstream side intersection point CPd" is set to "W1". Moreover, the outer diameter of the width direction P of the rotating shaft 42 is set to "W2". Then, when the width Wn of the groove portion 423 satisfies W1 < Wn < W2, it can be turned on/off every 90 degrees. Therefore, by rotating the rotating shaft 42, the communication state between the upstream side flow path 23U and the downstream side flow path 23D can be controlled in multiple stages.

圖4A表示將旋轉軸42定位於使凹槽部423朝向下游側流路23D之狀態時。此處,使未設置凹槽部423之部分、即非凹槽部424朝向上游側流路23U而堵塞塗佈液流路23。因此,上游側流路23U與下游側流路23D被遮斷,從而來自噴出口21之塗佈液之噴出成為斷開狀態。於該圖紙面上若使旋轉軸42自該狀態向逆時針方向旋轉,則塗佈液流路23被遮斷達固定角度,但若超過該角度,則開始上游側流路23U與下游側流路23D之連通,塗佈液流經塗佈液流路23而自噴出口21(參照圖3)噴出(接通狀態)。若使旋轉軸42進一步旋轉,則連通之比例逐漸增大,若旋轉角度達90°,則如圖4B所示連通之比例成為最大。 FIG. 4A shows a state in which the rotating shaft 42 is positioned in a state in which the groove portion 423 faces the downstream side flow path 23D. Here, the portion where the groove portion 423 is not provided, that is, the non-groove portion 424 is directed toward the upstream side flow path 23U, and the coating liquid flow path 23 is blocked. Therefore, the upstream side flow path 23U and the downstream side flow path 23D are blocked, and the discharge of the coating liquid from the discharge port 21 is turned off. When the rotating shaft 42 is rotated counterclockwise from this state on the sheet surface, the coating liquid flow path 23 is blocked to a fixed angle, but if the angle is exceeded, the upstream side flow path 23U and the downstream side flow are started. When the path 23D is connected, the coating liquid flows through the coating liquid flow path 23 and is ejected from the ejection port 21 (see FIG. 3) (on state). When the rotating shaft 42 is further rotated, the ratio of the communication gradually increases, and if the rotation angle reaches 90°, the ratio of the communication as shown in FIG. 4B becomes maximum.

又,於該圖紙面上若使旋轉軸42向逆時針方向進一步旋轉,則連通之比例逐漸減少,上游側流路23U與下游側流路23D再次被遮斷,從而來自噴出口21之塗佈液之噴出成為斷開狀態。例如若使旋轉軸42自圖4A之狀態旋轉180°,則凹槽部423成為朝向上游側流路23U之狀態,且非凹槽部424朝向下游側流路23D而堵塞塗佈液流路23(例如圖4C)。因此,上游側流路23U與下游側流路23D被遮斷,從而來自噴出口21之塗佈液之噴出成為斷開狀態。於該圖紙面上若使旋轉軸42自該狀態向逆時針方向進一步旋轉,則塗佈液流路23被遮斷達固定角 度,但若超過該角度,則開始上游側流路23U與下游側流路23D之連通,塗佈液流經塗佈液流路23而自噴出口21再次噴出(接通狀態)。若使旋轉軸42進一步旋轉,則連通之比例逐漸增大,若使旋轉軸42自圖4A之狀態旋轉270°,則如圖4D所示連通之比例再次成為最大。如此,可藉由使旋轉軸42每旋轉90°而交替地切換斷開狀態與接通狀態。當然,亦可藉由控制旋轉位置而多階段地調整噴出量。 When the rotating shaft 42 is further rotated counterclockwise on the plane of the drawing, the ratio of the communication gradually decreases, and the upstream side flow path 23U and the downstream side flow path 23D are again blocked, and the coating from the discharge port 21 is again applied. The discharge of the liquid is turned off. For example, when the rotation shaft 42 is rotated by 180° from the state of FIG. 4A, the groove portion 423 is in a state of being oriented toward the upstream side flow path 23U, and the non-groove portion 424 is directed toward the downstream side flow path 23D to block the coating liquid flow path 23 (eg Figure 4C). Therefore, the upstream side flow path 23U and the downstream side flow path 23D are blocked, and the discharge of the coating liquid from the discharge port 21 is turned off. When the rotating shaft 42 is further rotated from the state to the counterclockwise direction on the sheet surface, the coating liquid flow path 23 is blocked to a fixed angle. When the angle is exceeded, the upstream side flow path 23U and the downstream side flow path 23D are started to communicate with each other, and the coating liquid flows through the coating liquid flow path 23 and is ejected again from the discharge port 21 (on state). When the rotating shaft 42 is further rotated, the ratio of the communication is gradually increased. When the rotating shaft 42 is rotated by 270 degrees from the state of FIG. 4A, the ratio of the communication as shown in FIG. 4D is again maximized. In this manner, the off state and the on state can be alternately switched by rotating the rotary shaft 42 by 90 degrees. Of course, the discharge amount can also be adjusted in multiple stages by controlling the rotational position.

如此於本實施形態中,藉由使旋轉軸42旋轉而可控制來自噴出口21之塗佈液之噴出及噴出停止,進而藉由控制旋轉位置亦可多階段地調整噴出量。當然,即便替代凹槽部而設置貫通孔,亦可進行同樣之噴出控制。再者,為了防止來自旋轉部分之塗佈液滲漏,且使旋轉軸42穩定地旋轉,本實施形態中以如下方式構成。 As described above, in the present embodiment, the discharge of the coating liquid from the discharge port 21 can be controlled by the rotation of the rotary shaft 42, and the discharge amount can be controlled in a plurality of stages by controlling the rotational position. Of course, even if a through hole is provided instead of the groove portion, the same discharge control can be performed. In addition, in order to prevent leakage of the coating liquid from the rotating portion and to stably rotate the rotating shaft 42, the present embodiment is configured as follows.

於貫通孔31內,以自上下方向(R方向)夾入塗佈液噴嘴2之方式設置有一對密封構件43、44。即,於塗佈液噴嘴2之上方側、即(+R)方向側,在旋轉軸42與上側開口24交叉之位置附近配置有圓環狀之密封構件43。又,於塗佈液噴嘴2之下方側、即(-R)方向側,在旋轉軸42與下側開口24交叉之位置附近配置有圓環狀之密封構件44。進而,於貫通孔31內,於密封構件43之上方側、即(+R)方向側設置有旋轉自如地軸支旋轉軸42之轉動式軸承、例如滾珠軸承45。又,密封構件44側亦相同,即,於密封構件44之下方側、即(-R)方向側設置有旋轉自如地軸支旋轉軸42之滾珠軸承46。旋轉軸42藉由該等2個滾珠軸承45、46而於貫通孔31內自如地旋轉。 A pair of sealing members 43 and 44 are provided in the through hole 31 so as to sandwich the coating liquid nozzle 2 from the vertical direction (R direction). In other words, on the upper side of the coating liquid nozzle 2, that is, on the (+R) direction side, an annular sealing member 43 is disposed in the vicinity of the position where the rotating shaft 42 and the upper opening 24 intersect. Further, on the lower side of the coating liquid nozzle 2, that is, on the (-R) direction side, an annular sealing member 44 is disposed in the vicinity of the position where the rotating shaft 42 and the lower opening 24 intersect. Further, in the through hole 31, a rotary bearing such as a ball bearing 45 that rotatably supports the rotating shaft 42 is provided on the upper side of the sealing member 43, that is, the (+R) direction side. Further, the sealing member 44 side is also the same, that is, the ball bearing 46 that rotatably supports the rotating shaft 42 is provided on the lower side of the sealing member 44, that is, on the (-R) direction side. The rotating shaft 42 is freely rotatable in the through hole 31 by the two ball bearings 45 and 46.

如此於塗佈液噴嘴2之上下各者上配置有密封構件及滾珠軸承,但本實施形態中,為了不使密封構件43、44與旋轉軸42直接接觸,一方面密封構件43、44分別與滾珠軸承45、46之外輪抵接,另一方面以可與內輪產生間隙之方式於密封構件43、44上設置退避部。再者,亦可替代密封構件43、44,根據耐化學品性或密封性等條件而使用由氟 橡膠等構成之O型環。 In this way, the sealing member and the ball bearing are disposed on each of the upper and lower sides of the coating liquid nozzle 2. However, in the present embodiment, in order to prevent the sealing members 43 and 44 from coming into direct contact with the rotating shaft 42, the sealing members 43 and 44 are respectively The ball bearings 45 and 46 abut against the outer wheel, and on the other hand, a relief portion is provided on the sealing members 43 and 44 so as to form a gap with the inner wheel. Further, instead of the sealing members 43, 44, it is also possible to use fluorine according to conditions such as chemical resistance or sealing property. O-ring composed of rubber or the like.

如此構成之下側之密封構件44及滾珠軸承46介隔PTFE(Polytetrafluoroethene,聚四氟乙烯)製之間隔件47由不鏽鋼製之下側固持器7擠壓而保持。此處,間隔件47壓接於滾珠軸承46之外輪,密封住塗佈液之滲漏,防止滲漏之塗佈液自塗佈液噴出裝置1B落下。又,下側固持器7亦作為旋轉軸42之軸端之抵接面發揮功能,調整旋轉軸42之軸方向之移動。 The sealing member 44 and the ball bearing 46, which are formed on the lower side, are sandwiched by a PTFE (polytetrafluoroethylene) (polytetrafluoroethylene) spacer 47 and held by a stainless steel lower side holder 7. Here, the spacer 47 is pressed against the outer ring of the ball bearing 46 to seal the leakage of the coating liquid, and the coating liquid for preventing leakage is dropped from the coating liquid discharge device 1B. Further, the lower holder 7 also functions as an abutting surface of the axial end of the rotating shaft 42, and adjusts the movement of the rotating shaft 42 in the axial direction.

又,上側之密封構件43及滾珠軸承45由上側固持器6擠壓而保持。如圖2所示,該上側固持器6包含蓋構件61、及自蓋構件61之下表面向下方延伸設置之圓筒構件62,且係由例如不鏽鋼材料構成。於該蓋構件61上,形成有用於插通旋轉軸42之貫通孔。又,圓筒構件62被最後加工成自如地插入至貫通孔31中,且當插入至貫通孔31時,以圓筒構件62之下端面向下方僅壓住滾珠軸承45之外輪而保持滾珠軸承45及密封構件43。 Further, the upper sealing member 43 and the ball bearing 45 are held by the upper holder 6 and held. As shown in FIG. 2, the upper holder 6 includes a cover member 61 and a cylindrical member 62 extending downward from the lower surface of the cover member 61, and is made of, for example, a stainless steel material. A through hole for inserting the rotating shaft 42 is formed in the cover member 61. Further, the cylindrical member 62 is finally processed to be inserted into the through hole 31 freely, and when inserted into the through hole 31, the ball bearing 45 is held by pressing only the outer ring of the ball bearing 45 with the lower end surface of the cylindrical member 62 facing downward. And a sealing member 43.

如圖1A、圖1B及圖2所示,各旋轉軸42之上方端部、即(+R)側端部經耦合而連結於藉由支持塊5之具有倒L字剖面之上方端部支持之旋轉驅動部41。各旋轉驅動部41係包含微電動馬達(例如並木精密寶石公司製之微馬達SLB系列)411、減速器412及編碼器413。微電動馬達411之旋轉軸經由減速器412而與旋轉軸42連接。若微電動馬達411作動,則微電動馬達411之旋轉軸之旋轉在由減速器412減速至例如1/30之後,傳遞至旋轉軸42。 As shown in FIG. 1A, FIG. 1B and FIG. 2, the upper end portion of each of the rotating shafts 42, that is, the (+R)-side end portion is coupled to the upper end portion of the support block 5 having an inverted L-shaped cross section. The rotation drive unit 41. Each of the rotation driving units 41 includes a micro electric motor (for example, a micromotor SLB series manufactured by Tochigi Precision Co., Ltd.) 411, a speed reducer 412, and an encoder 413. The rotating shaft of the micro electric motor 411 is connected to the rotating shaft 42 via the speed reducer 412. When the micro electric motor 411 is actuated, the rotation of the rotating shaft of the micro electric motor 411 is transmitted to the rotating shaft 42 after being decelerated to, for example, 1/30 by the speed reducer 412.

又,本實施形態中以如下方式構成:接近微電動馬達411於旋轉軸上形成使光通過之橫孔,每次以穿透式光電感測器檢測該橫孔時輸出脈衝信號,從而可檢測旋轉軸之大致之角度。進而,以如下方式構成:微電動馬達411之旋轉軸每旋轉1周,自編碼器413輸出1次脈衝信號。繼而,使用該等信號正確地決定原點,控制形成於旋轉軸42上之 貫通孔422相對於塗佈液噴嘴2之旋轉位置,藉此能以上述方式控制噴出量。 Further, in the present embodiment, the micro electric motor 411 is formed on the rotating shaft to form a horizontal hole through which the light passes, and the pulse signal is outputted each time the transmissive photodetector detects the horizontal hole, thereby detecting The approximate angle of the axis of rotation. Further, it is configured such that the rotation axis of the micro electric motor 411 outputs a pulse signal from the encoder 413 every one rotation. Then, the origin is correctly determined using the signals, and the control is formed on the rotating shaft 42. The rotational position of the through hole 422 with respect to the coating liquid nozzle 2 can thereby control the discharge amount in the above manner.

其次,一面參照圖1A、圖1B及圖5一面說明氣體噴出裝置1C之構成。圖5係模式性表示氣體噴出裝置之構成之圖。該氣體噴出裝置1C包含:與上側固持器6連結之噴嘴夾持器110;支持於噴嘴夾持器110之4個氣體噴嘴120;對各氣體噴嘴120供給壓縮空氣之氣體供給部130;及控制自氣體供給部130向氣體噴嘴120之空氣供給之閥控制部140。 Next, the configuration of the gas discharge device 1C will be described with reference to FIGS. 1A, 1B, and 5. Fig. 5 is a view schematically showing the configuration of a gas ejection device. The gas ejection device 1C includes: a nozzle holder 110 coupled to the upper holder 6; four gas nozzles 120 supported by the nozzle holder 110; a gas supply unit 130 that supplies compressed air to each of the gas nozzles 120; The valve control unit 140 that supplies the air from the gas supply unit 130 to the gas nozzle 120.

噴嘴夾持器110例如為鋁製,其藉由上側固持器6之(+Q)方向側未圖示之2根安裝螺釘安裝於上側固持器6。於該噴嘴夾持器110上,針對每一氣體噴嘴120,設置有用於插通且固定氣體噴嘴120之貫通孔。再者,本實施形態中,如圖1A所示將氣體噴嘴120之前端以2[mm]間距均勻地配置,故而上述4個貫通孔以鋸齒狀、且以不同之傾斜角度設置。 The nozzle holder 110 is made of, for example, aluminum, and is attached to the upper holder 6 by two mounting screws (not shown) on the (+Q) direction side of the upper holder 6. On the nozzle holder 110, a through hole for inserting and fixing the gas nozzle 120 is provided for each gas nozzle 120. Further, in the present embodiment, as shown in Fig. 1A, the front ends of the gas nozzles 120 are uniformly arranged at a pitch of 2 [mm], and thus the four through holes are provided in a zigzag manner and at different inclination angles.

各氣體噴嘴120具有圓筒形狀,且各氣體噴嘴120之前端部被斜切。更詳細而言,本實施形態中,將外徑Φ1/16[英吋]、孔徑Φ0.5[mm]之不鏽鋼配管之前端斜切而製作。繼而,將4個氣體噴嘴120插入至分別對應之貫通孔中,氣體噴嘴120之氣體噴出口以2[mm]間距與塗佈液噴嘴2之噴出口列同樣地配置成一排。再者,各氣體噴嘴120係藉由未圖示之緊固螺釘而固定於噴嘴夾持器110上。又,藉由緊固螺釘可調整各氣體噴嘴120之位置及角度,以滿足如下說明之配置關係。 Each of the gas nozzles 120 has a cylindrical shape, and the front end portions of the respective gas nozzles 120 are chamfered. More specifically, in the present embodiment, a stainless steel pipe having an outer diameter of Φ1/16 [inch] and a hole diameter of Φ 0.5 [mm] is chamfered. Then, the four gas nozzles 120 are inserted into the respective through holes, and the gas discharge ports of the gas nozzles 120 are arranged in a row in the same manner as the discharge port rows of the coating liquid nozzles 2 at a pitch of 2 [mm]. Further, each of the gas nozzles 120 is fixed to the nozzle holder 110 by a fastening screw (not shown). Further, the position and angle of each gas nozzle 120 can be adjusted by fastening screws to satisfy the arrangement relationship as described below.

固定於噴嘴夾持器110上之4個氣體噴嘴120係與4個塗佈液噴嘴以1對1之對應關係按如下方式配設。即,氣體噴嘴120相對於塗佈液噴嘴2而配設於基板W之移動方向X之下游側,對塗佈液之液流CF噴射空氣流AF。具體而言,若將壓縮空氣自氣體供給部130供給至該氣體 噴嘴120,則自氣體噴嘴120相對於塗佈液對基板W上之供給位置PS1(參照圖5)而朝向基板移動方向X之上游側之基板表面噴射空氣,於塗佈液噴嘴2之噴出口21與基板W之表面之中間對塗佈液之液流CF吹送空氣流AF。尤其本實施形態中,塗佈液噴嘴2相對於塗佈液之供給位置PS1而於基板移動方向X之上游側(圖5之左手側)將噴出口21朝向供給位置PS1而配置,且向相對於基板W之面法線傾斜之噴出方向D2噴出塗佈液。相對於此,自氣體噴嘴120噴射之空氣朝與噴出方向D2正交之噴射方向D3噴射。再者,噴射方向D3並不限定於此,於包含塗佈液之液流CF及空氣流AF之假想平面(圖5之紙面)上亦可設定於0°(與基板表面平行之方向)與90°(與基板表面正交之方向)之間。 The four gas nozzles 120 fixed to the nozzle holder 110 are arranged in a one-to-one correspondence relationship with the four coating liquid nozzles as follows. In other words, the gas nozzle 120 is disposed on the downstream side in the moving direction X of the substrate W with respect to the coating liquid nozzle 2, and ejects the air flow AF to the liquid flow CF of the coating liquid. Specifically, if compressed air is supplied from the gas supply unit 130 to the gas In the nozzle 120, air is ejected from the gas nozzle 120 to the substrate surface on the upstream side in the substrate moving direction X with respect to the supply position PS1 (see FIG. 5) on the substrate W with respect to the coating liquid, and the discharge port of the coating liquid nozzle 2 is ejected. 21 and the surface of the substrate W blow air flow AF to the liquid flow CF of the coating liquid. In the present embodiment, the coating liquid nozzle 2 is disposed on the upstream side (the left-hand side in FIG. 5) of the substrate moving direction X with respect to the supply position PS1 of the coating liquid toward the supply position PS1, and is opposed to each other. The coating liquid is ejected in the discharge direction D2 in which the normal to the surface of the substrate W is inclined. On the other hand, the air ejected from the gas nozzle 120 is ejected in the ejection direction D3 orthogonal to the ejection direction D2. Further, the ejection direction D3 is not limited thereto, and may be set to 0° (parallel to the substrate surface) on the virtual plane (the paper surface of FIG. 5) including the liquid flow CF of the coating liquid and the air flow AF. Between 90° (the direction orthogonal to the surface of the substrate).

氣體供給部130中,針對每一氣體噴嘴120設置有將壓縮空氣供給至氣體噴嘴120之連續噴吹系統131。如圖5所示,連續噴吹系統131係包含配管131a、調節器131b、針閥131c及驅動開閉閥131d。配管131a之一端連接於產生壓縮空氣之氣體供給源,並且另一端連接於氣體噴嘴120。而且,使調節器131b、針閥131c及驅動開閉閥131d插入至配管131a,分別進行壓力調整、流量調整及供給控制。即,由調節器131b調整自氣體供給源供給之壓縮空氣之壓力之後,進而藉由針閥131c進行空氣之流量調整。繼而,根據來自閥控制部140之開指令使驅動開閉閥131d打開以將調整結束之壓縮空氣供給至氣體噴嘴120,且如上所述自氣體噴嘴120噴射空氣,對塗佈液之液流CF吹送空氣流AF。另一方面,根據來自閥控制部140之閉指令使驅動開閉閥131d關閉以停止對氣體噴嘴120供給壓縮空氣,停止來自氣體噴嘴120之空氣之噴射。再者,作為自氣體噴嘴120噴射之空氣之流量,較理想為設定為低於如以下說明般於以特定時間連續性地噴射空氣之連續噴吹中基板上之線型圖案LP不會飛散之流量(以下稱為「飛散極限流量」),本實施形態中,設定為50[NmL/min]。 In the gas supply unit 130, a continuous blowing system 131 that supplies compressed air to the gas nozzle 120 is provided for each gas nozzle 120. As shown in Fig. 5, the continuous blowing system 131 includes a pipe 131a, a regulator 131b, a needle valve 131c, and a drive opening and closing valve 131d. One end of the pipe 131a is connected to a gas supply source that generates compressed air, and the other end is connected to the gas nozzle 120. Further, the regulator 131b, the needle valve 131c, and the drive opening and closing valve 131d are inserted into the pipe 131a, and pressure adjustment, flow rate adjustment, and supply control are performed, respectively. That is, after the regulator 131b adjusts the pressure of the compressed air supplied from the gas supply source, the flow rate of the air is further adjusted by the needle valve 131c. Then, the drive opening and closing valve 131d is opened in accordance with an opening command from the valve control unit 140 to supply the compressed air whose adjustment is completed to the gas nozzle 120, and the air is ejected from the gas nozzle 120 as described above, and the liquid flow CF of the coating liquid is blown. Air flow AF. On the other hand, the drive opening and closing valve 131d is closed by the closing command from the valve control unit 140 to stop the supply of the compressed air to the gas nozzle 120, and the injection of the air from the gas nozzle 120 is stopped. Further, as the flow rate of the air ejected from the gas nozzle 120, it is preferable to set the flow rate of the linear pattern LP on the substrate which is not continuously scattered in the continuous blowing which continuously ejects air for a specific time as described below. (hereinafter referred to as "scattering limit flow rate"), in the present embodiment, it is set to 50 [NmL/min].

圖6A及圖6B係表示圖1A所示之圖案形成裝置之動作之時序圖,一方面,圖6A表示形成未進行空氣噴射、即未進行鼓風之情形時之線型圖案時之動作,另一方面,圖6B表示對應於塗佈液之噴出開始及噴出停止而進行鼓風並且形成線型圖案之動作。於未進行鼓風之情形時,如所敍述般,會於線型圖案LP之始端產生球狀之變形部,且於終端產生塗佈液之拖尾。作為該等中之球產生之要因,認為因基板W相對於塗佈液噴嘴2之相對移動而導致基板W與塗佈液噴嘴2之間產生之風為主要原因之一。即,認為藉由該風之產生使剛噴出後之塗佈液之液流CF捲起,其引起球之產生。又,認為拖尾之產生係於如下之製程中產生。即,於塗佈液之噴出剛停止之後位於塗佈液噴嘴2之噴出口21附近之塗佈液拉長之後,斷開而落下至基板W之表面,其作為拖尾而存在。 6A and 6B are timing charts showing the operation of the pattern forming apparatus shown in Fig. 1A. On the other hand, Fig. 6A shows the action of forming a line pattern when air ejection is not performed, that is, when no air blowing is performed, and the other On the other hand, FIG. 6B shows an operation of performing air blowing in accordance with the start of discharge of the coating liquid and the stop of discharge, and forming a line pattern. When the blast is not performed, as described, a spherical deformation portion is generated at the beginning of the line pattern LP, and a tail of the coating liquid is generated at the end. As a factor causing the ball in the above, it is considered that the wind generated between the substrate W and the coating liquid nozzle 2 due to the relative movement of the substrate W with respect to the coating liquid nozzle 2 is one of the main causes. That is, it is considered that the flow CF of the coating liquid immediately after the ejection is caused by the generation of the wind, which causes the generation of the ball. Also, it is considered that the generation of the smear is generated in the following process. In other words, immediately after the discharge of the coating liquid is stopped, the coating liquid located in the vicinity of the discharge port 21 of the coating liquid nozzle 2 is elongated, and then is dropped and dropped onto the surface of the substrate W, which is present as a trailing end.

因此,本實施形態中,如上所述設置氣體噴嘴120,且如圖6B所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序由閥控制部140對驅動開閉閥131d發出開指令,開始空氣流AF之噴射。繼而,維持向較塗佈液之供給位置PS1(參照圖5)更靠基板移動方向X之上游側之基板表面噴射空氣流AF之狀態,於時序T1開始塗佈液之噴出。因此,可抑制塗佈液之液流CF之捲起,從而抑制球產生。又,藉由空氣流AF使塗佈液之液流CF之前端壓抵於基板W之表面,故而塗佈液不會飛散,且亦可取得抑制線型圖案之始端位置之偏差之作用效果。 Therefore, in the present embodiment, the gas nozzle 120 is provided as described above, and as shown in FIG. 6B, the valve control unit 140 issues the drive opening and closing valve 131d at a timing slightly earlier than the discharge start time (timing T1) of the coating liquid. Turn on the command and start the jet of air flow AF. Then, the state in which the air flow AF is ejected toward the substrate surface on the upstream side in the substrate moving direction X to the supply position PS1 (see FIG. 5) of the coating liquid is maintained, and the discharge of the coating liquid is started at the timing T1. Therefore, the rolling up of the liquid flow CF of the coating liquid can be suppressed, thereby suppressing the generation of the ball. Further, since the front end of the liquid flow CF of the coating liquid is pressed against the surface of the substrate W by the air flow AF, the coating liquid does not scatter, and the effect of suppressing the deviation of the position of the start end of the line pattern can be obtained.

於時序T1後之不久,由閥控制部140對驅動開閉閥131d發出閉指令,停止空氣流AF之噴射。其原因在於,有因藉由鼓風施加至線型圖案LP上之壓力而使線型圖案LP之剖面形狀受到影響之虞。 Shortly after the time series T1, the valve control unit 140 issues a closing command to the drive opening and closing valve 131d to stop the injection of the air flow AF. This is because the cross-sectional shape of the line pattern LP is affected by the pressure applied to the line pattern LP by the air blow.

若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T2)稍早之時序,藉由閥控制部140對驅動開閉閥131d再次發出開指令,開始空氣流AF之噴射,且維持該狀態而於時序T2停止塗佈 液之噴出。藉此,空氣流AF可輔助塗佈液之液流CF之切斷而抑制拖尾之產生。 When it is close to the terminal of the linear pattern LP, the valve control unit 140 issues an open command to the drive opening and closing valve 131d at a timing earlier than the discharge stop time point (timing T2) of the coating liquid, and starts the air flow AF. Spraying, and maintaining this state, stopping coating at timing T2 The liquid is sprayed out. Thereby, the air flow AF can assist the cutting of the liquid flow CF of the coating liquid to suppress the occurrence of smear.

如以上般,根據本實施形態,其構成為如下:將氣體噴嘴120相對於塗佈液噴嘴2而配置於基板移動方向X之下游側,自上述氣體噴嘴120相對於塗佈液之供給位置PS1而朝向基板移動方向X之上游側之基板表面噴射空氣,於塗佈液噴嘴2之噴出口21與基板W之表面之中間可對塗佈液之液流CF供給空氣流AF。而且,對應於塗佈液之噴出開始及噴出停止而以特定時間連續地進行空氣噴射、即連續噴吹。因此,空氣流AF之供給係於使塗佈液壓接於基板之方向上發揮作用,從而不會使塗佈液飛散,可抑制線型圖案LP之始端變形成球狀並抑制始端位置之偏差,且可抑制於線型圖案LP之終端產生拖尾。 As described above, according to the present embodiment, the gas nozzle 120 is disposed on the downstream side of the substrate moving direction X with respect to the coating liquid nozzle 2, and the supply position PS1 from the gas nozzle 120 to the coating liquid. On the other hand, air is ejected toward the surface of the substrate on the upstream side in the substrate moving direction X, and the air flow AF is supplied to the liquid flow CF of the coating liquid between the discharge port 21 of the coating liquid nozzle 2 and the surface of the substrate W. Further, air injection, that is, continuous blowing is continuously performed for a specific time in accordance with the start of discharge of the coating liquid and the stop of discharge. Therefore, the supply of the air flow AF acts in the direction in which the application hydraulic pressure is applied to the substrate, so that the coating liquid is not scattered, and the start of the linear pattern LP can be prevented from becoming spherical and the deviation of the start position can be suppressed. It is possible to suppress tailing of the terminal of the line pattern LP.

<第2實施形態> <Second embodiment>

且說,上述第1實施形態中進行連續噴吹,但亦可由如下方式構成:替代連續噴吹,執行自氣體噴嘴120以脈衝狀噴射空氣而對塗佈液之液流CF吹送空氣流AF之所謂脈衝噴吹(第2實施形態)。以下,一面參照圖7及圖8一面對本發明之第2實施形態進行說明。 In the above-described first embodiment, the continuous blowing is performed. However, instead of the continuous blowing, the so-called continuous blowing of the gas nozzle 120 is performed by jetting air from the gas nozzle 120 to blow the air flow AF to the liquid flow CF of the coating liquid. Pulse blowing (second embodiment). Hereinafter, a second embodiment of the present invention will be described with reference to Figs. 7 and 8 .

該第2實施形態之圖案形成裝置1除氣體噴出裝置1C之構成之一部分外與第1實施形態相同。因此,此處以不同點為中心進行說明,對於相同構成標註相同符號而省略說明。 The pattern forming apparatus 1 of the second embodiment is the same as the first embodiment except for a part of the configuration of the gas ejection device 1C. Therefore, the description will be made focusing on the same points, and the same reference numerals will be given to the same components, and description thereof will be omitted.

圖7係模式性表示本發明之圖案形成裝置之第2實施形態中配備之氣體噴出裝置之構成之圖。第2實施形態與第1實施形態之不同點在於以下之點:於氣體噴出裝置1C中追加有脈衝驅動部150、及使用高速驅動類型作為驅動開閉閥。即,第2實施形態中,針對每一氣體噴嘴120設置有將壓縮空氣以脈衝狀供給至氣體噴嘴120之脈衝噴吹系統132。脈衝噴吹系統132之基本構成與連續噴吹系統131同樣地包含配管132a、調節器132b、針閥132c及驅動開閉閥132d。但,為了可進行 脈衝噴吹,使用例如CKD股份有限公司製之脈衝噴射閥PJ系列作為驅動開閉閥132d。而且,脈衝驅動部150將脈衝寬度500[μsec]左右之高速脈衝驅動電壓提供至高速驅動開閉閥132d,由此使高速驅動開閉閥132d之電磁鐵瞬間動作,取得尖銳之空氣脈衝。於如此噴射空氣脈衝之情形時,較理想為瞬間噴射較連續噴吹之流量高之空氣,第2實施形態中,設定為超過飛散極限流量之流量,例如200[NmL/min]左右。 Fig. 7 is a view schematically showing the configuration of a gas discharge device provided in a second embodiment of the pattern forming apparatus of the present invention. The second embodiment differs from the first embodiment in that a pulse driving unit 150 is added to the gas ejection device 1C, and a high-speed driving type is used as the driving on-off valve. In other words, in the second embodiment, the gas injection system 132 is provided with a pulse injection system 132 that supplies compressed air to the gas nozzle 120 in a pulsed manner. The basic configuration of the pulse injection system 132 includes a pipe 132a, a regulator 132b, a needle valve 132c, and a drive opening and closing valve 132d similarly to the continuous injection system 131. But, in order to be For the pulse injection, a pulse injection valve PJ series manufactured by CKD Co., Ltd., for example, is used as the drive opening and closing valve 132d. Further, the pulse driving unit 150 supplies a high-speed pulse driving voltage having a pulse width of about 500 [μsec] to the high-speed driving opening and closing valve 132d, thereby instantaneously operating the electromagnet that drives the opening and closing valve 132d at a high speed to obtain a sharp air pulse. In the case where the air pulse is ejected as described above, it is preferable that the air having a higher flow rate than the continuous injection is instantaneously injected. In the second embodiment, the flow rate exceeding the scattering limit flow rate is set, for example, about 200 [NmL/min].

圖8係表示圖案形成裝置之第2實施形態之動作之時序圖,其表示對應於塗佈液之噴出開始及噴出停止而一面進行脈衝噴吹一面形成線型圖案之動作。本實施形態中,如上所述設置有氣體噴嘴120,如圖8所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序,閥控制部140輸出開指令。由此,接收到開指令之脈衝驅動部150產生脈衝寬度500[μsec]左右之高速脈衝驅動電壓,且將其提供至高速驅動開閉閥132d。與此對應,高速驅動開閉閥132d進行脈衝性動作而開始脈衝狀之空氣流AF之噴射。而且,該脈衝噴吹超過時序T1而繼續,並且於時序T1開始塗佈液之噴出。因此,可取得與進行連續噴吹之情形(第1實施形態)相同之效果,即球產生之抑制效果、及始端位置偏差之抑制效果。 FIG. 8 is a timing chart showing the operation of the second embodiment of the pattern forming apparatus, and shows an operation of forming a line pattern while performing pulse jetting in response to the start of discharge of the coating liquid and the stop of discharge. In the present embodiment, as described above, the gas nozzle 120 is provided, and as shown in FIG. 8, the valve control unit 140 outputs an opening command at a timing slightly earlier than the discharge start timing (timing T1) of the coating liquid. Thereby, the pulse drive unit 150 that has received the open command generates a high-speed pulse drive voltage having a pulse width of about 500 [μsec] and supplies it to the high-speed drive on-off valve 132d. In response to this, the high-speed drive on-off valve 132d performs a pulse operation to start the ejection of the pulsed air flow AF. Then, the pulse blowing continues beyond the timing T1, and the discharge of the coating liquid is started at the timing T1. Therefore, it is possible to obtain the same effect as the case of performing continuous blowing (the first embodiment), that is, the suppression effect of the ball generation and the suppression effect of the start position deviation.

本案發明者以如下方式研究對與塗佈液之噴出開始相對應之脈衝噴吹解析後之結果。即,藉由時序T1前後之脈衝狀之空氣流AF瞬間僅壓接線型圖案LP之始端而防止塗佈液之捲起,且即便有球之產生,脈衝噴吹亦會將其擠破而成形為扁平之形狀。因此,抑制球產生及始端位置之偏差之兩者之作用效果於第2實施形態中更為優異,目視觀察實際形成之線型圖案LP時亦可確認同樣之結果。 The inventors of the present invention studied the results of pulse jet analysis corresponding to the start of discharge of the coating liquid in the following manner. That is, the pulsed air flow AF before and after the timing T1 instantaneously presses only the beginning of the wiring pattern LP to prevent the coating liquid from being rolled up, and even if a ball is generated, the pulse blowing will be squeezed and formed. It is a flat shape. Therefore, the effect of suppressing both the generation of the ball and the deviation of the start position is more excellent in the second embodiment, and the same result can be confirmed even when the line pattern LP actually formed is visually observed.

於時序T1後之不久,藉由閥控制部140輸出閉指令,停止空氣流AF之噴射。其原因在於,與第1實施形態同樣地,防止因藉由鼓風施加至線型圖案LP上之壓力而使線型圖案LP之剖面形狀受到影響。尤 其於脈衝噴吹中,噴吹為瞬間,但為了將超過飛散極限流量之流量之空氣提供至線型圖案LP,宜為於塗佈液之噴出開始及噴出停止以外之時序停止脈衝噴吹。 Shortly after the timing T1, the valve control unit 140 outputs a closing command to stop the injection of the air flow AF. This is because, similarly to the first embodiment, the cross-sectional shape of the linear pattern LP is prevented from being affected by the pressure applied to the linear pattern LP by the air blow. especially In the pulse injection, the injection is instantaneous, but in order to supply the air having a flow rate exceeding the scattering limit flow rate to the linear pattern LP, it is preferable to stop the pulse injection at a timing other than the start of the discharge of the coating liquid and the stop of the discharge.

若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T2)稍早之時序,閥控制部140再次輸出開指令而開始脈衝噴吹之後,於時序T2停止塗佈液之供給。藉此,與進行連續噴吹之情形(第1實施形態)同樣地可取得拖尾產生之抑制效果。 When it is close to the terminal of the linear pattern LP, the valve control unit 140 outputs the ON command again to start the pulse injection at the timing earlier than the discharge stop time point (timing T2) of the coating liquid, and stops the coating at the timing T2. The supply of liquid. Thereby, the suppression effect of the occurrence of the smear can be obtained in the same manner as in the case of the continuous blowing (the first embodiment).

本案發明者以如下方式研究亦對與塗佈液之噴出停止相對應之脈衝噴吹解析後之結果。即,時序T2之前之脈衝狀之空氣流AF使線型圖案LP之後端成形為扁平之形狀,藉此改善線型圖案LP之美感。又,時序T2以後之脈衝狀之空氣流AF使拖尾切斷、消失。因此,關於線型圖案LP之後端之美感,第2實施形態更為優異,目視觀察實際形成之線型圖案LP時亦可確認同樣之結果。 The inventors of the present invention studied the results of the pulse injection analysis corresponding to the discharge stop of the coating liquid as follows. That is, the pulsed air flow AF before the timing T2 shapes the rear end of the line pattern LP into a flat shape, thereby improving the aesthetics of the line pattern LP. Further, the pulsed air flow AF after the time series T2 cuts off and disappears. Therefore, the second embodiment is more excellent in the aesthetics of the rear end of the line pattern LP, and the same result can be confirmed even when the line pattern LP actually formed is visually observed.

如以上般,第2實施形態係將連續噴吹變更為脈衝噴吹者,其不僅可取得與第1實施形態相同之作用效果,亦可進一步提高其等作用效果而形成更佳之圖案形成。 As described above, in the second embodiment, the continuous blowing is changed to the pulse blowing, and not only the same effects as those of the first embodiment can be obtained, but also the effects such as the above effects can be further improved to form a better pattern.

再者,上述第2實施形態中脈衝間隔設為固定,但考慮到上述脈衝噴吹之作用效果亦可進行適當變更脈衝間隔之例如圖9所示之FM調變(Frequency Modulation,調頻)。即,於欲提高壓接力以提高球產生之抑制效果之情形時,使時序T1以後之脈衝間隔密集以加強施加至塗佈液之液流CF上之空氣流AF之壓力即可。又,於拖尾改善時欲進一步抑制塗佈液之飛散之情形時,加大時序T2以後之脈衝間隔以減弱藉由脈衝噴吹施加至塗佈液之液流CF上之空氣流AF之壓力即可。如此對脈衝噴吹之波形進行FM調變而可調整脈衝噴吹之作用效果。當然,調變方式並不限定於上述FM調變,亦可使用各種調變方式,例如PWM(pulse width modulation:脈衝寬度調變)。 Further, in the second embodiment, the pulse interval is fixed. However, in consideration of the effect of the pulse injection, the FM modulation (Frequency Modulation) shown in Fig. 9 can be appropriately changed. That is, when it is desired to increase the pressure-bonding force to increase the suppression effect of the ball generation, the pulse interval after the time series T1 is made dense to enhance the pressure of the air flow AF applied to the liquid flow CF of the coating liquid. Further, when it is desired to further suppress the scattering of the coating liquid when the tailing is improved, the pulse interval after the timing T2 is increased to reduce the pressure of the air flow AF applied to the liquid flow CF of the coating liquid by the pulse injection. Just fine. In this way, the pulse modulation waveform is FM-modulated to adjust the effect of the pulse injection. Of course, the modulation method is not limited to the FM modulation described above, and various modulation methods such as PWM (pulse width modulation) may be used.

<第3實施形態> <Third embodiment>

上述第1實施形態中僅進行連續噴吹,第2實施形態中僅進行脈衝噴吹,但亦可構成為使其等組合而執行(第3實施形態)。以下,一面參照圖10及圖11一面對本發明之第3實施形態進行說明。 In the first embodiment, only the continuous blowing is performed, and in the second embodiment, only the pulse blowing is performed. However, the third embodiment may be configured to be combined and executed (third embodiment). Hereinafter, a third embodiment of the present invention will be described with reference to Figs. 10 and 11 .

圖10係模式性表示本發明之圖案形成裝置之第3實施形態中配備之氣體噴出裝置之構成之圖。該第3實施形態之圖案形成裝置1中,如圖10所示,並排設置有連續噴吹系統131與脈衝噴吹系統132,根據來自閥控制部140之指令而可執行連續噴吹及脈衝噴吹。而且,作為各氣體噴嘴120之氣流量,較理想為將連續噴吹之氣流量設定為50[NmL/min],將脈衝噴吹之氣流量設定為200[NmL/min]左右,本實施形態中,為包含4根塗佈液噴嘴2之所謂4通道之多噴嘴,整體成為(50+200)×4=1000[NmL/min]之流量。再者,其他構成與第1實施形態及第2實施形態相同,故而對於相同構成標註相同符號而省略說明。 Fig. 10 is a view schematically showing the configuration of a gas discharge device provided in a third embodiment of the pattern forming apparatus of the present invention. In the pattern forming apparatus 1 of the third embodiment, as shown in Fig. 10, a continuous blowing system 131 and a pulse blowing system 132 are arranged side by side, and continuous blowing and pulse spraying can be performed in accordance with an instruction from the valve control unit 140. blow. Further, as the gas flow rate of each gas nozzle 120, it is preferable to set the gas flow rate of the continuous injection to 50 [NmL/min], and to set the gas flow rate of the pulse injection to about 200 [NmL/min]. In the middle, the so-called four-channel multi-nozzle including the four coating liquid nozzles 2 has a flow rate of (50 + 200) × 4 = 1000 [NmL / min] as a whole. The other configurations are the same as those of the first embodiment and the second embodiment. Therefore, the same components are denoted by the same reference numerals, and their description is omitted.

圖11係表示圖案形成裝置之第3實施形態之動作之時序圖,其表示對應於塗佈液之噴出開始及噴出停止而一面進行連續噴吹並且適當補充性地進行脈衝噴吹一面形成線型圖案之動作。本實施形態中,如圖11所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序,閥控制部140對連續噴吹系統131之驅動開閉閥131d發出開指令,開始空氣流AF之噴射。繼而,維持向較塗佈液之供給位置PS1(參照圖5)而靠基板移動方向X之上游側之基板表面噴射空氣流AF之狀態,於時序T1開始塗佈液之供給。藉此,與第1實施形態同樣地可抑制塗佈液之液流CF之捲起,從而抑制球產生。 FIG. 11 is a timing chart showing the operation of the third embodiment of the pattern forming apparatus, and shows that a continuous pattern is ejected in response to the start of the discharge of the coating liquid and the discharge is stopped, and the pulse pattern is appropriately complementarily formed to form a line pattern. The action. In the present embodiment, as shown in FIG. 11, the valve control unit 140 issues an opening command to the drive opening/closing valve 131d of the continuous blowing system 131 at a timing slightly earlier than the discharge start time (timing T1) of the coating liquid, and starts the air. Jet of flow AF. Then, the state in which the air flow AF is ejected toward the substrate surface on the upstream side in the substrate moving direction X to the supply position PS1 (see FIG. 5) of the coating liquid is maintained, and the supply of the coating liquid is started at the timing T1. Thereby, similarly to the first embodiment, the winding of the liquid flow CF of the coating liquid can be suppressed, and the generation of the ball can be suppressed.

但,有時僅以連續噴吹而不一定會使球產生之抑制效果充分。因此,第3實施形態中,於時序T1藉由閥控制部140對脈衝驅動部150輸出開指令而追加進行脈衝噴吹。脈衝狀之空氣流AF藉由該追加脈 衝噴吹而瞬間僅壓接線型圖案LP之始端,故而更有效地防止塗佈液之捲起。且即便有球之產生,脈衝噴吹亦會將其擠破而成形為扁平之形狀。其結果為,與第1實施形態相比,可進一步提高球產生之抑制效果及始端位置偏差之抑制效果,從而可形成更佳之線型圖案LP。 However, in some cases, only continuous spraying does not necessarily have a sufficient effect of suppressing the generation of the ball. Therefore, in the third embodiment, the pulse control unit 140 outputs an opening command to the pulse driving unit 150 at the timing T1, and pulse injection is additionally performed. Pulsed air flow AF by the additional pulse When the rinsing is blown and only the beginning of the wiring pattern LP is pressed at an instant, the coating liquid is more effectively prevented from being rolled up. And even if there is a ball, the pulse blowing will break it and form a flat shape. As a result, compared with the first embodiment, the suppression effect of the ball generation and the suppression effect of the start position deviation can be further improved, and a more preferable line pattern LP can be formed.

於時序T1後之不久,藉由閥控制部140對脈衝驅動部150發出閉指令而停止脈衝噴吹之後,對連續噴吹系統131之驅動開閉閥131d發出閉指令,使連續噴吹亦停止。而且,於形成線型圖案LP之中間部之期間,停止來自氣體噴嘴120之空氣噴射而排除空氣流AF對線型圖案LP之影響。 Shortly after the time series T1, the valve control unit 140 issues a closing command to the pulse driving unit 150 to stop the pulse blowing, and then issues a closing command to the driving opening and closing valve 131d of the continuous blowing system 131 to stop the continuous blowing. Further, during the formation of the intermediate portion of the line pattern LP, the air ejection from the gas nozzle 120 is stopped to eliminate the influence of the air flow AF on the line pattern LP.

繼而,若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T2)稍早之時序,藉由閥控制部140對驅動開閉閥131d再次發出開指令而開始連續噴吹,並且對脈衝驅動部150發出開指令而開始脈衝噴吹。如此藉由即將成為時序T2之前之脈衝噴吹而使線型圖案LP之後端成形為扁平之形狀,從而改善線型圖案LP之美感。 Then, when it is close to the terminal of the line pattern LP, the valve control unit 140 starts the continuous injection by again issuing an opening command to the drive opening and closing valve 131d at a timing earlier than the discharge stop time point (timing T2) of the coating liquid. Blowing is performed, and an impulse command is issued to the pulse driving unit 150 to start pulse blowing. Thus, the rear end of the line pattern LP is formed into a flat shape by the pulse blowing immediately before the timing T2, thereby improving the aesthetics of the line pattern LP.

如此於執行連續噴吹及脈衝噴吹之狀態下停止塗佈液之噴出(時序T2)。於該噴出停止時,對塗佈液之液流CF,不僅將連續噴吹而且將脈衝噴吹亦供給至塗佈液之液流CF,抑制拖尾的產生。如此根據第3實施形態,與第1實施形態相比可提高拖尾產生之抑制效果,從而可形成更佳之線型圖案LP。 Thus, the discharge of the coating liquid is stopped in the state where the continuous blowing and the pulse blowing are performed (timing T2). At the time of the discharge stop, the liquid flow CF of the coating liquid is supplied not only to the continuous injection but also to the liquid flow CF of the coating liquid, thereby suppressing the occurrence of the tail. According to the third embodiment, the suppression effect of the occurrence of the trailing can be improved as compared with the first embodiment, and a more preferable linear pattern LP can be formed.

<第4實施形態> <Fourth embodiment>

上述第1實施形態至第3實施形態中,藉由氣體噴出裝置1C對塗佈液之液流吹送氣流而控制圖案之形狀,但亦可替代上述氣體噴出裝置1C而設置對形成於基板W表面之圖案LP之一部分以脈衝狀供給空氣來對圖案進行整形之圖案整形裝置1D。以下,一面參照圖1A、圖1B及圖12。 In the first embodiment to the third embodiment, the shape of the pattern is controlled by blowing the gas stream to the liquid flow of the coating liquid by the gas discharge device 1C. However, instead of the gas discharge device 1C, the surface may be formed on the surface of the substrate W. One of the patterns LP is a pattern shaping device 1D that shapes the pattern by supplying air in a pulsed manner. Hereinafter, reference is made to FIGS. 1A, 1B, and 12.

圖12係模式性表示本發明之圖案形成裝置之第4實施形態中配備 之圖案整形裝置之構成之圖。該圖案整形裝置1D包含:與上側固持器6連結之噴嘴夾持器160;支持於噴嘴夾持器160之4個氣體噴嘴170;對各氣體噴嘴170供給壓縮空氣之氣體供給部180;控制自氣體供給部180向氣體噴嘴170之空氣供給之閥控制部140;及脈衝驅動部150。 Figure 12 is a schematic view showing the fourth embodiment of the pattern forming apparatus of the present invention. A diagram of the composition of the pattern shaping device. The pattern shaping device 1D includes: a nozzle holder 160 coupled to the upper holder 6; four gas nozzles 170 supported by the nozzle holder 160; and a gas supply unit 180 for supplying compressed air to each of the gas nozzles 170; The gas supply unit 180 supplies the valve control unit 140 to the air of the gas nozzle 170; and the pulse drive unit 150.

噴嘴夾持器160例如為鋁製,其藉由上側固持器6之(+Q)方向側未圖示之2根安裝螺釘安裝於上側固持器6。於該噴嘴夾持器160上,針對每一氣體噴嘴170,設置有用於插通且固定氣體噴嘴170之貫通孔。再者,本實施形態中,如圖1所示將氣體噴嘴170之前端以2[mm]間距均勻地配置,故而上述4個貫通孔以鋸齒狀、且以不同之傾斜角度設置。 The nozzle holder 160 is made of, for example, aluminum, and is attached to the upper holder 6 by two mounting screws (not shown) on the (+Q) direction side of the upper holder 6. On the nozzle holder 160, a through hole for inserting and fixing the gas nozzle 170 is provided for each gas nozzle 170. Further, in the present embodiment, as shown in Fig. 1, the front ends of the gas nozzles 170 are uniformly arranged at a pitch of 2 [mm], and thus the four through holes are provided in a zigzag manner and at different inclination angles.

各氣體噴嘴170具有圓筒形狀,且各氣體噴嘴170之前端部被斜切。更詳細而言,本實施形態中,將外徑Φ1/16[英吋]、孔徑Φ0.5[mm]之不鏽鋼配管之前端斜切而製作。繼而,將4個氣體噴嘴170插入至分別對應之貫通孔中,氣體噴嘴170之氣體噴出口以2[mm]間距與塗佈液噴嘴2之噴出口列同樣地配置成一排。再者,各氣體噴嘴170係藉由未圖示之緊固螺釘而固定於噴嘴夾持器160上。又,藉由緊固螺釘可調整各氣體噴嘴170之位置及角度,以滿足如下說明之配置關係。 Each of the gas nozzles 170 has a cylindrical shape, and the front end portions of the respective gas nozzles 170 are chamfered. More specifically, in the present embodiment, a stainless steel pipe having an outer diameter of Φ1/16 [inch] and a hole diameter of Φ 0.5 [mm] is chamfered. Then, the four gas nozzles 170 are inserted into the respective through holes, and the gas discharge ports of the gas nozzles 170 are arranged in a row in the same manner as the discharge port rows of the coating liquid nozzles 2 at a pitch of 2 [mm]. Further, each of the gas nozzles 170 is fixed to the nozzle holder 160 by a fastening screw (not shown). Further, the position and angle of each gas nozzle 170 can be adjusted by fastening screws to satisfy the arrangement relationship as described below.

固定於噴嘴夾持器160上之4個氣體噴嘴170係與4條形成於基板W表面之線型圖案LP以1對1之對應關係按如下方式配設。即,氣體噴嘴170相對於塗佈液噴嘴2而配設於基板W之移動方向X之下游側(圖12中之右手側),對基板W上之線型圖案LP噴射空氣流AF。具體而言,若將壓縮空氣自氣體供給部180供給至該氣體噴嘴170,則自氣體噴嘴170朝向供給位置PS2之基板表面噴射空氣,該供給位置PS2係自基板W上之塗佈液之供給位置PS1(參照圖12)起沿基板移動方向X離開距離 L12所得,於該供給位置PS2對線型圖案LP吹送空氣流AF。線型圖案LP藉由該空氣流AF而於供給位置PS2被加壓,且如下所述被整形成所需形狀。尤其本實施形態中,相對於供給位置PS2而在基板移動方向X之上游側(圖12之左手側)將噴出口171朝向供給位置PS2而配置,且朝相對於基板W之面法線傾斜之噴射方向噴射空氣。再者,噴射方向並不限定於此,亦可構成為例如自相對於基板W之表面正交之方向噴射空氣。 The four gas nozzles 170 fixed to the nozzle holder 160 are arranged in a one-to-one correspondence relationship with the four linear patterns LP formed on the surface of the substrate W as follows. In other words, the gas nozzle 170 is disposed on the downstream side (the right-hand side in FIG. 12) of the moving direction X of the substrate W with respect to the coating liquid nozzle 2, and ejects the air flow AF to the linear pattern LP on the substrate W. Specifically, when compressed air is supplied from the gas supply unit 180 to the gas nozzle 170, air is ejected from the gas nozzle 170 toward the substrate surface of the supply position PS2, and the supply position PS2 is supplied from the coating liquid on the substrate W. The position PS1 (refer to FIG. 12) starts from the substrate moving direction X away from the distance As a result of L12, the air flow AF is blown to the line pattern LP at the supply position PS2. The line pattern LP is pressurized at the supply position PS2 by the air flow AF, and is shaped into a desired shape as described below. In the present embodiment, the discharge port 171 is disposed toward the supply position PS2 on the upstream side (the left-hand side in FIG. 12) of the substrate movement direction X with respect to the supply position PS2, and is inclined toward the normal to the surface of the substrate W. The air is sprayed in the spray direction. Further, the ejection direction is not limited thereto, and may be configured to eject air from a direction orthogonal to the surface of the substrate W, for example.

氣體供給部180中,針對每一氣體噴嘴170設置有將壓縮空氣供給至氣體噴嘴170之脈衝噴吹系統181。如圖12所示,脈衝噴吹系統181係由配管181a、調節器181b、針閥181c及驅動開閉閥181d構成。配管181a之一端連接於產生壓縮空氣之氣體供給源,並且另一端連接於氣體噴嘴170。而且,使調節器181b、針閥181c及驅動開閉閥181d插入至配管181a,分別進行壓力調整、流量調整及供給控制。即,由調節器181b調整自氣體供給源供給之壓縮空氣之壓力之後,進而藉由針閥181c進行空氣之流量調整。繼而,驅動開閉閥181d開閉而控制對氣體噴嘴170之空氣供給。再者,本實施形態中,如以下說明般為了藉由脈衝驅動部150使驅動開閉閥181d高速開閉以將空氣流AF以脈衝狀提供至線型圖案LP,作為驅動開閉閥181d使用高速驅動類型,例如CKD股份有限公司製之脈衝噴射閥PJ系列。 In the gas supply unit 180, a pulse injection system 181 that supplies compressed air to the gas nozzle 170 is provided for each gas nozzle 170. As shown in FIG. 12, the pulse injection system 181 is composed of a pipe 181a, a regulator 181b, a needle valve 181c, and a drive opening and closing valve 181d. One end of the pipe 181a is connected to a gas supply source that generates compressed air, and the other end is connected to the gas nozzle 170. Further, the regulator 181b, the needle valve 181c, and the drive opening and closing valve 181d are inserted into the pipe 181a, and pressure adjustment, flow rate adjustment, and supply control are performed, respectively. That is, after the regulator 181b adjusts the pressure of the compressed air supplied from the gas supply source, the flow rate of the air is further adjusted by the needle valve 181c. Then, the opening and closing valve 181d is opened and closed to control the supply of air to the gas nozzle 170. In the present embodiment, the drive opening/closing valve 181d is opened and closed at a high speed by the pulse drive unit 150 to supply the air flow AF to the linear pattern LP in a pulsed manner, and the high-speed drive type is used as the drive opening and closing valve 181d. For example, the pulse injection valve PJ series manufactured by CKD Co., Ltd.

脈衝驅動部150根據來自閥控制部140之開閉指令而控制提供至驅動開閉閥181d之驅動電壓以使驅動開閉閥181d開閉驅動。例如若由閥控制部140發出閉指令,則脈衝驅動部150不執行驅動開閉閥181d之可打開驅動,而是使驅動開閉閥181d維持為閉狀態。另一方面,若由閥控制部140發出開指令,則脈衝驅動部150將例如脈衝寬度500[μsec]左右之高速脈衝驅動電壓提供至驅動開閉閥181d,使高速驅動開閉閥132d之電磁鐵瞬間動作,取得尖銳之空氣脈衝。於如此噴射空氣脈衝 之情形時,可瞬間噴射流量較高之空氣,本實施形態中設定為超過飛散極限流量之流量,例如200[NmL/min]左右。再者,所謂「飛散極限流量」,係指於使空氣連續性地噴射之連續噴吹中基板W上之線型圖案LP不會飛散之流量,於形成光電轉換元件之電極圖案或配線圖案之情形時為50[NmL/min]左右。 The pulse drive unit 150 controls the drive voltage supplied to the drive opening and closing valve 181d to open and close the drive opening/closing valve 181d in response to an opening/closing command from the valve control unit 140. For example, when the valve control unit 140 issues a closing command, the pulse driving unit 150 does not perform the driveable opening of the drive opening and closing valve 181d, but maintains the drive opening and closing valve 181d in a closed state. On the other hand, when the valve control unit 140 issues an open command, the pulse drive unit 150 supplies, for example, a high-speed pulse drive voltage having a pulse width of about 500 [μsec] to the drive opening and closing valve 181d, and instantaneously drives the electromagnet of the open/close valve 132d at a high speed. Act to get a sharp air pulse. So jetting air pulses In the case of the case, the air having a high flow rate can be instantaneously injected. In the present embodiment, the flow rate exceeding the scattering limit flow rate is set, for example, about 200 [NmL/min]. In addition, the "scattering limit flow rate" refers to a flow rate in which the linear pattern LP on the substrate W does not scatter during the continuous blowing in which the air is continuously ejected, and the electrode pattern or the wiring pattern of the photoelectric conversion element is formed. The time is about 50 [NmL/min].

其次,將藉由如上所述構成之圖案形成裝置1使基板W移動並且於該基板W之表面形成線型圖案時,未進行自氣體噴嘴170以脈衝狀噴射空氣而對線型圖案LP吹送空氣流AF之所謂脈衝噴吹之情形(參照圖13)、與進行脈衝噴吹之情形(圖14)分開進行說明。 Next, when the substrate W is moved by the pattern forming apparatus 1 configured as described above and a line pattern is formed on the surface of the substrate W, air is blown from the gas nozzle 170 in a pulsed manner to blow the air flow AF to the line pattern LP. The case of pulse injection (see Fig. 13) and the case of pulse injection (Fig. 14) will be described separately.

圖13係表示未進行脈衝噴吹、即未使用圖案整形裝置進行圖案形成時之圖案形成裝置之動作之時序圖。於未進行脈衝噴吹之情形時,形成於基板W之表面之線型圖案LP中,如圖13之最上部之模式圖所示,於始端部LPa產生球狀之變形部,且於終端部LPb產生塗佈液之拖尾。 Fig. 13 is a timing chart showing the operation of the pattern forming apparatus when pulse spraying is not performed, that is, when patterning is not performed using the pattern shaping device. When the pulse is not applied, the linear pattern LP formed on the surface of the substrate W has a spherical deformed portion at the start end portion LPa as shown in the uppermost schematic view of Fig. 13, and is formed at the end portion LPb. A tailing of the coating liquid is produced.

圖14係表示進行脈衝噴吹、即使用圖案整形裝置進行圖案形成時之圖案形成裝置之動作之時序圖。本實施形態中,如圖14所示於塗佈液之噴出開始時間點(時序T1)自塗佈液噴嘴2之噴出口21噴出塗佈液而於基板W上形成線型圖案LP之始端部LPa。其後亦繼續進行塗佈液噴出,繼始端部LPa之後線型圖案LP延長,但自時序T1起經過△T12時,線型圖案LP延長僅長度L12,始端部LPa到達供給位置PS2(時序T2)。於該時序T2前後之固定時間之期間,根據來自閥控制部140之開指令,脈衝驅動部150將高速脈衝驅動電壓提供至驅動開閉閥181d,對始端部LPa予以脈衝噴吹而加壓。藉此,球狀之始端部LPa主要以沿著與基板移動方向X平行之方向滲出之方式於基板表面上移動而被整形成線狀。如此於線型圖案LP之始端部LPa進入至噴射有空氣之區域(供給位置PS2)時,對該始端部LPa執行脈衝噴吹且執行始端部LPa 之整形。 Fig. 14 is a timing chart showing the operation of the pattern forming apparatus when pulse blowing is performed, that is, when patterning is performed using a pattern shaping device. In the present embodiment, as shown in FIG. 14, the coating liquid is ejected from the ejection port 21 of the coating liquid nozzle 2 at the ejection start time point (timing T1), and the starting end portion LPa of the linear pattern LP is formed on the substrate W. . Thereafter, the coating liquid is ejected, and the linear pattern LP is extended after the start end portion LPa. However, when the ΔT12 is passed from the timing T1, the line pattern LP is extended only by the length L12, and the start end portion LPa reaches the supply position PS2 (timing T2). During a fixed period of time before and after the timing T2, the pulse driving unit 150 supplies the high-speed pulse driving voltage to the driving opening and closing valve 181d in accordance with an opening command from the valve control unit 140, and pulsates the starting end portion LPa and pressurizes it. Thereby, the spherical starting end portion LPa is linearly formed by moving on the surface of the substrate so as to ooze out in a direction parallel to the substrate moving direction X. When the start end portion LPa of the line pattern LP enters the region where the air is injected (the supply position PS2), the pulse injection is performed on the start end portion LPa and the start end portion LPA is executed. Plastic surgery.

於始端部LPa通過供給位置PS2之後,繼續進行基板移動及塗佈液噴出,線型圖案LP於X方向延長。繼而,若線型圖案LP達到所需長度,則停止塗佈液噴出(時序T3)。此時,於線型圖案LP之終端部LPb產生拖尾。因此,本實施形態中,於線型圖案LP形成後仍使基板W繼續移動。由此,於自時序T3起經過△T34時,線型圖案LP之終端部LPb到達供給位置PS2(時序T4)。於該時序T4前後之固定時間之期間,再次根據來自閥控制部140之開指令,脈衝驅動部150將高速脈衝驅動電壓提供至驅動開閉閥181d,對終端部LPb予以脈衝噴吹而加壓。藉此,尾狀之終端部LPb主要以沿著與基板移動方向X平行之方向滲出之方式於基板表面上移動而被整形成線狀。如此對於線型圖案LP之終端部LPb,亦與始端部LPa同樣地,於進入至噴射有空氣之區域(供給位置PS2)時,執行脈衝噴吹且執行終端部LPb之整形。再者,本實施形態中,於線型圖案LP之形成動作中,使基板W以固定速度移動,故而上述時間△T12、△T34為同一值,但於使始端部LPa及終端部LPb通過供給位置PS2時之基板速度互不相同之情形時,只要使時間△T12、△T34與此對應而不同即可。 After the start end portion LPa passes through the supply position PS2, the substrate movement and the coating liquid discharge are continued, and the line pattern LP is elongated in the X direction. Then, when the line pattern LP reaches the desired length, the coating liquid is ejected (timing T3). At this time, the tail portion LPb of the line pattern LP is smeared. Therefore, in the present embodiment, the substrate W is continuously moved after the formation of the line pattern LP. As a result, when ΔT34 elapses from the timing T3, the terminal portion LPb of the line pattern LP reaches the supply position PS2 (timing T4). During the fixed time period from the valve control unit 140, the pulse drive unit 150 supplies the high-speed pulse drive voltage to the drive opening and closing valve 181d, and the terminal portion LPb is pulse-jetted and pressurized. Thereby, the tail end portion LPb is mainly formed in a linear shape by moving on the surface of the substrate so as to ooze out in a direction parallel to the substrate moving direction X. In the same manner as the start end portion LPa, the terminal portion LPb of the linear pattern LP performs pulse injection and performs the shaping of the terminal portion LPb when entering the region where the air is injected (the supply position PS2). Further, in the present embodiment, in the forming operation of the line pattern LP, since the substrate W is moved at a constant speed, the times ΔT12 and ΔT34 are the same value, but the start end portion LPa and the end portion LPb are passed through the supply position. When the substrate speeds at the time of PS2 are different from each other, the time ΔT12 and ΔT34 may be different depending on the time.

如以上般,根據本實施形態,將線型圖案LP之始端部LPa及終端部LPb作為本發明之「被整形部」,於始端部LPa及終端部LPb之各者通過供給位置PS2時,對被整形部以脈衝狀噴射空氣而加壓,故而可對線型圖案LP良好地進行整形。 As described above, according to the present embodiment, the start end portion LPa and the end portion LPb of the line pattern LP are used as the "shaved portion" of the present invention, and when each of the start end portion LPa and the end portion LPb passes through the supply position PS2, Since the shaping portion presses the air in a pulsed manner, the linear pattern LP can be well shaped.

又,亦考慮執行對被整形部連續性地持續噴射空氣之所謂連續噴吹而對圖案進行整形,但連續噴吹會使構成被整形部之塗佈液飛散而引起圖案不良。對此,本實施形態中,藉由進行脈衝噴吹可抑制被整形部之塗佈液之飛散,從而對圖案良好地進行整形。但,於進行脈衝噴吹之情形時,若接近於連續噴吹,即伴隨脈衝寬度變長亦易產生 塗佈液之飛散。因此,為了形成更佳之圖案,較理想為如以下說明般對脈衝寬度亦進行研究。 Further, it is also conceivable to perform the so-called continuous blowing in which the shaped portion continuously ejects the air to shape the pattern, but continuous spraying causes the coating liquid constituting the shaped portion to scatter to cause pattern failure. On the other hand, in the present embodiment, by performing pulse jetting, scattering of the coating liquid in the shaped portion can be suppressed, and the pattern can be well shaped. However, in the case of pulse injection, if it is close to continuous blowing, it is easy to produce as the pulse width becomes longer. The coating liquid is scattered. Therefore, in order to form a better pattern, it is preferable to study the pulse width as described below.

因此,配備有圖12所示之圖案整形裝置1D之圖案形成裝置1中以各種脈衝噴吹對線型圖案LP進行整形,本案發明者觀察線型圖案LP之始端部LPa及終端部LPb之形狀。將該觀察結果彙總為圖15。圖15係模式性表示圖案之始端部及終端部之形狀伴隨氣體噴射之脈衝寬度之變化而變化之圖。該圖中之「脈衝寬度」係指由脈衝驅動部150提供至驅動開閉閥181d之高速脈衝驅動電壓之脈衝寬度,準備5[msec]、2[msec]、1[msec]、0.5[msec]、0.1[msec]之5種。又,「始端」及「終端」之欄中,模式性圖示出提供各脈衝寬度之脈衝噴吹時之線型圖案LP之始端部LPa、終端部LPb之觀察結果,該圖中之類似梨皮斑點之部分表示由脈衝噴吹產生之滲出部,黑色方形記號表示飛散之塗佈液。 Therefore, in the pattern forming apparatus 1 equipped with the pattern shaping device 1D shown in FIG. 12, the linear pattern LP is shaped by various kinds of pulse injection, and the inventors observed the shapes of the start end portion LPa and the end portion LPb of the line pattern LP. This observation is summarized into Figure 15. Fig. 15 is a view schematically showing changes in the shape of the start end portion and the end portion of the pattern as a function of the pulse width of the gas jet. The "pulse width" in the figure is the pulse width of the high-speed pulse driving voltage supplied from the pulse driving unit 150 to the driving opening and closing valve 181d, and is prepared for 5 [msec], 2 [msec], 1 [msec], and 0.5 [msec]. Five kinds of 0.1 [msec]. Further, in the column of "starting end" and "terminal", the mode diagram shows the observation results of the leading end portion LPa and the terminal portion LPb of the linear pattern LP at the time of pulse jetting for each pulse width, which is similar to the pear skin. The portion of the spot indicates the bleed portion generated by the pulse blowing, and the black square mark indicates the scattering coating liquid.

伴隨脈衝寬度、即噴射空氣之時間變長,空氣流AF對被整形部(始端部LPa或終端部LPb)之施加時間變長,構成被整形部之塗佈液主要沿X方向滲出而蔓延之滲出區域(該圖中之類似梨皮斑點之區域)變大。為了消除線型圖案LP之兩端部所產生之球形狀或尾形狀之區域而使其均勻化,較理想為將脈衝寬度設定為較0.1[msec]長。其原因亦在於,若脈衝寬度變得極短,則驅動開閉閥181d無法以充分之應答性開閉,無法以脈衝狀噴射空氣,且空氣流之流量亦較少,故而導致球形狀或尾形狀殘存。因此,如圖15中之與0.1[msec]對應之判定欄中標註「×」般,難以對線型圖案LP更佳地進行整形。 As the pulse width, that is, the time during which the air is ejected, becomes longer, the application time of the air flow AF to the shaped portion (the start end portion LPa or the end portion LPb) becomes longer, and the coating liquid constituting the shaped portion mainly oozes in the X direction and spreads. The oozing area (the area similar to the pear skin spot in the figure) becomes large. In order to eliminate the area of the spherical shape or the tail shape generated at both end portions of the line pattern LP and to homogenize it, it is preferable to set the pulse width to be longer than 0.1 [msec]. The reason for this is that if the pulse width is extremely short, the drive opening and closing valve 181d cannot be opened and closed with sufficient responsiveness, and the air cannot be jetted in a pulsed manner, and the flow rate of the air flow is also small, so that the spherical shape or the tail shape remains. . Therefore, as shown by "x" in the determination column corresponding to 0.1 [msec] in FIG. 15, it is difficult to shape the line pattern LP more preferably.

另一方面,伴隨脈衝寬度之加長,驅動開閉閥181d高速開閉,以脈衝狀噴射空氣使球部分或尾部分之塗佈液擴散而減小球部分或尾部分。由圖15之「始端」及「終端」之欄可知,伴隨球部分等之縮小,滲出區域之面積擴大,若使脈衝寬度成為2[msec]以上,則球部 分及尾部分消失。但,若將脈衝寬度設定為5[msec]以上,則塗佈液會向線型圖案LP之周圍飛散(參照圖15中之與5[msec]對應之判定之欄中之「×」)。因此,考慮到該點,較理想為將脈衝寬度設定為較5[msec]短。 On the other hand, as the pulse width is lengthened, the opening and closing valve 181d is driven to open and close at a high speed, and the air is sprayed in a pulsed manner to diffuse the coating liquid of the ball portion or the tail portion to reduce the ball portion or the tail portion. As can be seen from the column of "starting end" and "terminal" in Fig. 15, the area of the oozing area is enlarged as the ball portion is reduced, and the ball portion is made to have a pulse width of 2 [msec] or more. The minutes and tails disappear. However, when the pulse width is set to 5 [msec] or more, the coating liquid is scattered around the linear pattern LP (refer to "x" in the column corresponding to the determination of 5 [msec] in Fig. 15). Therefore, in consideration of this point, it is preferable to set the pulse width to be shorter than 5 [msec].

由此,為了更佳地形成線型圖案LP,較佳為將脈衝寬度設定為較0.1[msec]長且較5[msec]短。又,宜將脈衝寬度設定為0.5[msec]以上、且2[msec]以下(參照圖15中之判定之欄中之三角記號、圓形記號、雙圓形記號)。又,若滲出量增加,則線型圖案LP之長度會變得較設定值長,或鄰接之線型圖案LP之間隔於始端部LPa或終端部LPb會變窄。考慮到此種觀點,宜將脈衝寬度設定為0.5[msec]以上、且1[msec]以下,進而綜合而言最佳為設定為0.5[msec]。 Therefore, in order to form the line pattern LP more preferably, it is preferable to set the pulse width to be longer than 0.1 [msec] and shorter than 5 [msec]. Moreover, it is preferable to set the pulse width to 0.5 [msec] or more and 2 [msec] or less (refer to the triangular mark, the circular mark, and the double circular mark in the column of the judgment in FIG. 15). Further, when the amount of bleeding increases, the length of the line pattern LP becomes longer than the set value, or the interval between the adjacent line patterns LP becomes narrower at the start end portion LPa or the end portion LPb. In view of such a viewpoint, it is preferable to set the pulse width to 0.5 [msec] or more and 1 [msec] or less, and it is preferable to set it to 0.5 [msec] as a whole.

<第5實施形態> <Fifth Embodiment>

於上述第4實施形態之圖案形成裝置1中,替代氣體噴出裝置1C而設置有圖案整形裝置1D,但亦可一併設置氣體噴出裝置1C與圖案整形裝置1D(第5實施形態)。隨此,可形成更佳之圖案。以下,一面參照圖16及圖17一面對本發明之第5實施形態進行說明。 In the pattern forming apparatus 1 of the fourth embodiment, the pattern shaping device 1D is provided instead of the gas ejection device 1C. However, the gas ejection device 1C and the pattern shaping device 1D may be provided together (the fifth embodiment). Along with this, a better pattern can be formed. Hereinafter, a fifth embodiment of the present invention will be described with reference to Figs. 16 and 17 .

圖16係表示本發明之圖案形成裝置之第5實施形態之圖。該第5實施形態與第4實施形態之較大之不同點在於以下之點:進而設置有對自各塗佈液噴嘴2噴出之塗佈液之液流供給空氣流之氣體噴出裝置1C,其他構成基本上與第4實施形態相同。又,氣體噴出裝置1C之構成與第1實施形態之氣體噴出裝置相同。因此,對於與第1實施形態或第4實施形態相同之構成,標註相同符號而省略說明。 Fig. 16 is a view showing a fifth embodiment of the pattern forming apparatus of the present invention. The fifth embodiment differs greatly from the fourth embodiment in that a gas discharge device 1C for supplying an air flow to a liquid flow of a coating liquid discharged from each coating liquid nozzle 2 is further provided, and other components are provided. Basically, it is the same as that of the fourth embodiment. Further, the configuration of the gas ejection device 1C is the same as that of the gas ejection device of the first embodiment. Therefore, the same configurations as those in the first embodiment or the fourth embodiment are denoted by the same reference numerals and will not be described.

圖17係表示圖16所示之圖案形成裝置之動作之時序圖。圖案形成裝置1中,於未進行鼓風之情形時,如所敍述,於線型圖案LP之始端部LPa產生球狀之變形部,且於終端部LPb產生塗佈液之拖尾。作為該等中之球產生之要因,認為藉由基板W相對於塗佈液噴嘴2之相 對移動而導致基板W與塗佈液噴嘴2之間產生之風為主要原因之一。即,認為藉由該風之產生使剛噴出後之塗佈液之液流CF捲起,其引起球之產生。又,認為拖尾之產生係於如下之製程中產生。即,於塗佈液之噴出剛停止之後位於塗佈液噴嘴2之噴出口21附近之塗佈液拉長之後,斷開而落下至基板W之表面,其作為拖尾而存在。 Fig. 17 is a timing chart showing the operation of the pattern forming apparatus shown in Fig. 16. In the pattern forming apparatus 1, when the air blow is not performed, as described, a spherical deformation portion is formed at the beginning end portion LPa of the line pattern LP, and a trailing of the coating liquid is generated at the end portion LPb. As the cause of the ball generated in the above, it is considered that the phase of the substrate W relative to the coating liquid nozzle 2 The wind generated between the substrate W and the coating liquid nozzle 2 due to the movement is one of the main causes. That is, it is considered that the flow CF of the coating liquid immediately after the ejection is caused by the generation of the wind, which causes the generation of the ball. Also, it is considered that the generation of the smear is generated in the following process. In other words, immediately after the discharge of the coating liquid is stopped, the coating liquid located in the vicinity of the discharge port 21 of the coating liquid nozzle 2 is elongated, and then is dropped and dropped onto the surface of the substrate W, which is present as a trailing end.

因此,本實施形態中,如上所述設置氣體噴嘴120,且如圖17所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序由閥控制部140對驅動開閉閥131d發出開指令,開始空氣流AF之噴射。繼而,維持向較塗佈液之供給位置PS1(參照圖16)而靠基板移動方向X之上游側之基板表面噴射空氣流AF之狀態,於時序T1開始塗佈液之噴出。因此,可抑制塗佈液之液流CF之捲起,從而抑制球產生。又,藉由空氣流AF使塗佈液之液流CF之前端壓抵於基板W之表面,故而塗佈液不會飛散,且亦可取得抑制線型圖案之始端位置之偏差之作用效果。 Therefore, in the present embodiment, the gas nozzle 120 is provided as described above, and as shown in FIG. 17, the valve control unit 140 issues the drive opening and closing valve 131d at a timing slightly earlier than the discharge start time (timing T1) of the coating liquid. Turn on the command and start the jet of air flow AF. Then, the state in which the air flow AF is ejected toward the substrate surface on the upstream side in the substrate moving direction X to the supply position PS1 (see FIG. 16) of the coating liquid is maintained, and the discharge of the coating liquid is started at the timing T1. Therefore, the rolling up of the liquid flow CF of the coating liquid can be suppressed, thereby suppressing the generation of the ball. Further, since the front end of the liquid flow CF of the coating liquid is pressed against the surface of the substrate W by the air flow AF, the coating liquid does not scatter, and the effect of suppressing the deviation of the position of the start end of the line pattern can be obtained.

於時序T1後之不久,由閥控制部140對驅動開閉閥131d發出閉指令,停止空氣流AF之噴射。其原因在於,有因藉由鼓風施加至線型圖案LP上之壓力而使線型圖案LP之剖面形狀受到影響之虞。 Shortly after the time series T1, the valve control unit 140 issues a closing command to the drive opening and closing valve 131d to stop the injection of the air flow AF. This is because the cross-sectional shape of the line pattern LP is affected by the pressure applied to the line pattern LP by the air blow.

另一方面,若自時序T1起經過△T12,則線型圖案LP延長僅長度L12,始端部LPa到達供給位置PS2(時序T2)。於該時序T2前後之固定時間之期間,與第1實施形態同樣地,自氣體噴嘴170對始端部LPa予以脈衝噴吹而加壓,對始端部LPa進行整形。 On the other hand, when ΔT12 elapses from the timing T1, the line pattern LP is extended only by the length L12, and the start end portion LPa reaches the supply position PS2 (timing T2). In the same period as in the first embodiment, the starting end portion LPa is pulse-sprayed and pressurized from the gas nozzle 170, and the starting end portion LPa is shaped.

繼而,若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T3)稍早之時序,藉由閥控制部140對驅動開閉閥131d再次發出開指令,開始來自氣體噴嘴120之空氣流AF之噴射,且維持該狀態而於時序T2停止塗佈液之噴出。藉此,空氣流AF可輔助塗佈液之液流CF之切斷而抑制拖尾之產生。 Then, when it is close to the terminal of the linear pattern LP, the valve control unit 140 issues an open command to the drive opening and closing valve 131d at a timing earlier than the discharge stop time point (timing T3) of the coating liquid, and starts the gas from the gas. The air flow AF of the nozzle 120 is ejected, and this state is maintained, and the discharge of the coating liquid is stopped at the timing T2. Thereby, the air flow AF can assist the cutting of the liquid flow CF of the coating liquid to suppress the occurrence of smear.

又,若自時序T3起經過△T34,則線型圖案LP之終端部LPb到達 供給位置PS2(時序T4)。因此,與第1實施形態同樣地,於該時序T4前後之固定時間之期間,再次自氣體噴嘴170對終端部LPb予以脈衝噴吹而加壓,對終端部LPb進行整形。 Further, if ΔT34 elapses from the timing T3, the terminal portion LPb of the line pattern LP arrives The position PS2 is supplied (timing T4). Therefore, in the same manner as in the first embodiment, the terminal portion LPb is pulsed and pressurized from the gas nozzle 170 again during the fixed time period before and after the timing T4, and the terminal portion LPb is shaped.

如以上般,根據第5實施形態,不僅與第4實施形態同樣地進行線型圖案LP之整形,而且抑制始端部LPa之球產生及終端部LPb之拖尾產生。即,其構成為如下:將氣體噴嘴120相對於塗佈液噴嘴2配置於基板移動方向X之下游側,自上述氣體噴嘴120相對於塗佈液之供給位置PS1而朝向基板移動方向X之上游側之基板表面噴射空氣,於塗佈液噴嘴2之噴出口21與基板W之表面之中間可對塗佈液之液流CF供給空氣流AF。而且,對應於塗佈液之噴出開始及噴出停止而以特定時間連續地進行空氣噴射,即連續噴吹。因此,空氣流AF之供給係於使塗佈液壓接於基板之方向上發揮作用,從而不會使塗佈液飛散,可抑制線型圖案LP之始端變形成球狀並抑制始端位置之偏差,且可抑制於線型圖案LP之終端產生拖尾。因此,可更佳地形成線型圖案LP。 As described above, according to the fifth embodiment, the shaping of the line pattern LP is performed not only in the same manner as in the fourth embodiment, but also the generation of the ball at the start end portion LPa and the occurrence of the trailing end portion LPb are suppressed. In other words, the gas nozzle 120 is disposed on the downstream side of the substrate moving direction X with respect to the coating liquid nozzle 2, and is upstream from the supply position PS1 of the coating liquid toward the substrate moving direction X. The surface of the substrate is sprayed with air, and the air flow AF is supplied to the liquid flow CF of the coating liquid between the discharge port 21 of the coating liquid nozzle 2 and the surface of the substrate W. Further, air ejection, that is, continuous blowing, is continuously performed for a specific time in accordance with the start of discharge of the coating liquid and the stop of discharge. Therefore, the supply of the air flow AF acts in the direction in which the application hydraulic pressure is applied to the substrate, so that the coating liquid is not scattered, and the start of the linear pattern LP can be prevented from becoming spherical and the deviation of the start position can be suppressed. It is possible to suppress tailing of the terminal of the line pattern LP. Therefore, the line pattern LP can be formed more preferably.

<第6實施形態> <Sixth embodiment>

上述第5實施形態中,於氣體供給部130設置有連續噴吹系統131,對塗佈液之液流CF連續性地吹送空氣流AF,即進行連續噴吹,但亦可替代連續噴吹而以執行脈衝噴吹之方式構成(第6實施形態)。即,亦可替代連續噴吹系統131而使用脈衝噴吹系統。更詳細而言,作為驅動開閉閥131d使用高速驅動類型,例如CKD股份有限公司製之脈衝噴射閥PJ系列,且如圖18所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序根據來自閥控制部140之開指令,脈衝驅動部150將高速脈衝驅動電壓提供至驅動開閉閥131d,對塗佈液之液流CF予以脈衝噴吹。藉此,可抑制塗佈液之液流CF之捲起,從而抑制球產生。又,藉由空氣流AF使塗佈液之液流CF之前端壓抵於基板W之表 面,故而塗佈液不會飛散,且亦可取得抑制線型圖案之始端位置之偏差之作用效果。 In the fifth embodiment, the gas supply unit 130 is provided with the continuous blowing system 131, and the air flow AF is continuously blown to the liquid flow CF of the coating liquid, that is, the continuous blowing is performed, but the continuous blowing may be used instead. It is configured to perform pulse blowing (sixth embodiment). That is, a pulse blowing system can also be used instead of the continuous blowing system 131. More specifically, a high-speed drive type, for example, a pulse injection valve PJ series manufactured by CKD Co., Ltd., is used as the drive opening and closing valve 131d, and as shown in FIG. 18, a discharge start time point (timing T1) of the coating liquid is earlier. According to the opening command from the valve control unit 140, the pulse driving unit 150 supplies the high-speed pulse driving voltage to the driving opening and closing valve 131d, and pulse-sprays the liquid flow CF of the coating liquid. Thereby, the winding up of the liquid flow CF of the coating liquid can be suppressed, and the generation of a ball can be suppressed. Further, the front end of the liquid flow CF of the coating liquid is pressed against the substrate W by the air flow AF Since the coating liquid does not scatter, the effect of suppressing the deviation of the position of the starting end of the line pattern can be obtained.

本案發明者以如下方式研究對與塗佈液之噴出開始相對應之脈衝噴吹解析後之結果。即,藉由時序T1前後之脈衝狀之空氣流AF瞬間壓接線型圖案LP之僅始端而防止塗佈液之捲起,且即便有球產生,脈衝噴吹亦會將其擠破而成形為扁平之形狀。因此,抑制球產生及始端位置之偏差之兩者之作用效果於第6實施形態中更為優異,目視觀察實際形成之線型圖案LP時亦可確認同樣之結果。 The inventors of the present invention studied the results of pulse jet analysis corresponding to the start of discharge of the coating liquid in the following manner. That is, the pulsed air flow AF before and after the timing T1 instantaneously presses the only end of the wiring pattern LP to prevent the coating liquid from being rolled up, and even if a ball is generated, the pulse blowing will be crushed and formed into Flat shape. Therefore, the effect of suppressing both the generation of the ball and the deviation of the start position is more excellent in the sixth embodiment, and the same result can be confirmed even when the line pattern LP actually formed is visually observed.

且與第5實施形態同樣地,若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T3)稍早之時序,閥控制部140再次輸出開指令而開始脈衝噴吹之後,於固定時間後停止塗佈液之供給。藉此,與進行連續噴吹之情形(第5實施形態)同樣地可取得拖尾產生之抑制效果。 In the same manner as in the fifth embodiment, when the terminal of the linear pattern LP is approached, the valve control unit 140 outputs an opening command again to start the pulse injection at a timing slightly earlier than the discharge stop timing (timing T3) of the coating liquid. After the blowing, the supply of the coating liquid is stopped after a fixed time. Thereby, the suppression effect of the occurrence of the smear can be obtained in the same manner as in the case of the continuous blasting (the fifth embodiment).

本案發明者以如下方式研究亦對與塗佈液之噴出停止相對應之脈衝噴吹解析後之結果。即,即將成為時序T3之前之脈衝狀之空氣流AF使線型圖案LP之後端成形為扁平之形狀,藉此改善線型圖案LP之美感。又,時序T3以後之脈衝狀之空氣流AF使拖尾切斷、消失。因此,關於線型圖案LP之後端之美感,第6實施形態更為優異,目視觀察實際形成之線型圖案LP時亦可確認同樣之結果。 The inventors of the present invention studied the results of the pulse injection analysis corresponding to the discharge stop of the coating liquid as follows. That is, the pulse-shaped air flow AF immediately before the timing T3 forms the rear end of the line pattern LP into a flat shape, thereby improving the aesthetics of the line pattern LP. Further, the pulsed air flow AF after the time series T3 cuts off and disappears. Therefore, the sixth embodiment is more excellent in terms of the aesthetics of the rear end of the line pattern LP, and the same result can be confirmed even when the line pattern LP actually formed is visually observed.

如以上般,第6實施形態中,藉由脈衝噴吹而進行線型圖案LP之整形、抑制始端部LPa之球產生、及抑制終端部LPb之拖尾產生。因此,可更佳地形成線型圖案LP。 As described above, in the sixth embodiment, the linear pattern LP is shaped by the pulse injection, the generation of the ball at the start end portion LPa is suppressed, and the occurrence of the trailing end portion LPb is suppressed. Therefore, the line pattern LP can be formed more preferably.

<第7實施形態> <Seventh embodiment>

上述第5實施形態中僅進行連續噴吹而對塗佈液之液流CF吹送空氣流AF,第6實施形態中僅進行脈衝噴吹而對塗佈液之液流CF吹送空氣流AF,亦可構成為使其等組合而執行(第7實施形態)。即,於氣體 供給部130並排設置連續噴吹系統與脈衝噴吹系統,且為了如圖12所示對塗佈液之液流CF吹送空氣流AF,亦可將連續噴吹與脈衝噴吹加以組合(第7實施形態)。 In the fifth embodiment, only the continuous blowing is performed, and the air flow AF is blown to the liquid flow CF of the coating liquid. In the sixth embodiment, only the pulse injection is performed, and the air flow AF is blown to the liquid flow CF of the coating liquid. It can be configured to be executed in combination or the like (seventh embodiment). That is, in the gas The supply unit 130 is provided with a continuous blowing system and a pulse blowing system side by side, and in order to blow the air flow AF to the liquid flow CF of the coating liquid as shown in FIG. 12, continuous blowing and pulse blowing may be combined (7th) Implementation form).

圖19係表示配備有本發明之圖案整形裝置之圖案形成裝置之第7實施形態之動作之圖。再者,該圖中,記載有2個「脈衝噴吹」,上段側係噴嘴120之球產生及拖尾抑制用之脈衝噴吹,相對於此,下段側係噴嘴170之圖案整形用之脈衝噴吹。該第7實施形態中,如圖19所示於較塗佈液之噴出開始時間點(時序T1)稍早之時序,閥控制部140對連續噴吹系統之驅動開閉閥發出開指令,開始空氣流AF之噴射。繼而,維持向較塗佈液之供給位置PS1(參照圖16)更靠基板移動方向X之上游側之基板表面噴射空氣流AF之狀態,於時序T1開始塗佈液之供給。藉此,與第5實施形態同樣地可抑制塗佈液之液流CF之捲起,從而抑制球產生。 Fig. 19 is a view showing the operation of the seventh embodiment of the pattern forming apparatus equipped with the pattern shaping device of the present invention. In the figure, two "pulse blowing" are described, and the ball for the upper side nozzle 120 is generated and the pulse for the tail is suppressed. On the other hand, the pulse for pattern shaping of the lower side nozzle 170 is described. Blowing. In the seventh embodiment, as shown in FIG. 19, at a timing slightly earlier than the discharge start time (timing T1) of the coating liquid, the valve control unit 140 issues an opening command to the drive opening and closing valve of the continuous injection system to start the air. Jet of flow AF. Then, the state in which the air flow AF is ejected toward the substrate surface on the upstream side in the substrate moving direction X to the supply position PS1 (see FIG. 16) of the coating liquid is maintained, and the supply of the coating liquid is started at the timing T1. Thereby, similarly to the fifth embodiment, the winding of the liquid flow CF of the coating liquid can be suppressed, and the generation of the ball can be suppressed.

但,亦有時僅以連續噴吹而不一定會使球產生之抑制效果充分。因此,第7實施形態中,於時序T1藉由閥控制部對脈衝驅動部輸出開指令而追加進行脈衝噴吹。脈衝狀之空氣流AF藉由該追加脈衝噴吹而瞬間壓接線型圖案LP之僅始端,故而更有效地防止塗佈液之捲起。又,且即便有球之產生,脈衝噴吹亦會將其擠破而成形為扁平之形狀。其結果為,與第5實施形態相比,可進一步提高球產生之抑制效果及始端位置偏差之抑制效果,從而可形成更佳之線型圖案LP。 However, there are cases in which continuous blowing is not always sufficient to suppress the ball. Therefore, in the seventh embodiment, at the timing T1, the valve control unit outputs an opening command to the pulse driving unit to additionally perform pulse blowing. The pulsed air flow AF instantaneously presses only the beginning of the wiring pattern LP by the additional pulse blowing, so that the coating liquid is more effectively prevented from being wound up. Moreover, even if a ball is generated, the pulse blowing will crush it and form it into a flat shape. As a result, compared with the fifth embodiment, the suppression effect of the ball generation and the suppression effect of the start position deviation can be further improved, and a more preferable line pattern LP can be formed.

又,若接近於線型圖案LP之終端,則於較塗佈液之噴出停止時間點(時序T3)稍早之時序,藉由閥控制部140對連續噴吹系統之驅動開閉閥再次發出開指令而開始連續噴吹,並且對脈衝驅動部150發出開指令而開始脈衝噴吹。如此藉由即將成為時序T3之前之脈衝噴吹而使線型圖案LP之後端成形為扁平之形狀,從而改善線型圖案LP之美 觀。 When the terminal of the linear pattern LP is approached, the valve control unit 140 issues an open command to the drive opening and closing valve of the continuous injection system at a timing slightly earlier than the discharge stop time point (timing T3) of the coating liquid. On the other hand, continuous blowing is started, and an on command is issued to the pulse driving unit 150 to start pulse blowing. Thus, the rear end of the line pattern LP is formed into a flat shape by the pulse blowing immediately before the timing T3, thereby improving the beauty of the line pattern LP. View.

如此於第7實施形態中,藉由脈衝噴吹對線型圖案LP進行整形,並且將連續噴吹與脈衝噴吹加以組合而抑制始端部LPa之球產生及終端部LPb之拖尾產生。因此,可更佳地形成線型圖案LP。 In the seventh embodiment, the linear pattern LP is shaped by pulse blowing, and the continuous blowing and the pulse blowing are combined to suppress the generation of the ball at the start end portion LPa and the occurrence of the trailing end portion LPb. Therefore, the line pattern LP can be formed more preferably.

又,上述實施形態中將脈衝間隔設為固定,但亦可與第2實施形態之變形例同樣地,考慮到上述脈衝噴吹之作用效果而進行適當變更脈衝間隔之例如圖9所示FM調變(調頻)。 In the above-described embodiment, the pulse interval is fixed. However, similarly to the modification of the second embodiment, the PWM interval shown in FIG. 9 can be appropriately changed in consideration of the effect of the pulse injection. Change (frequency modulation).

上述第1實施形態至第7實施形態中,對包含4個塗佈液噴嘴2之所謂4通道之圖案形成裝置應用本發明,但噴嘴根數並不限定於此。又,將複數個塗佈液噴嘴2設置於多串噴嘴組3而一體化,但對於將複數個塗佈液噴嘴分別獨立地設置之圖案形成裝置亦可應用本發明。 In the above-described first to seventh embodiments, the present invention is applied to a so-called four-channel pattern forming apparatus including four coating liquid nozzles 2, but the number of nozzles is not limited thereto. Further, the plurality of coating liquid nozzles 2 are integrated in the plurality of nozzle groups 3, but the present invention can also be applied to a pattern forming apparatus in which a plurality of coating liquid nozzles are separately provided.

又,上述實施形態中,對於針對所有塗佈液噴嘴2設置塗佈液噴出控制部4之圖案形成裝置1應用本發明,但亦可對於針對其等中之僅至少1根以上之塗佈液噴嘴設置塗佈液噴出控制部之圖案形成裝置應用本發明(第8實施形態)。以下,一面參照圖20至圖23一面對本發明之第8實施形態進行說明。 In the above-described embodiment, the present invention is applied to the pattern forming apparatus 1 in which the coating liquid discharge control unit 4 is provided for all of the coating liquid nozzles 2. However, at least one or more coating liquids may be applied to the coating liquid discharge control unit 4. The present invention (eighth embodiment) is applied to a pattern forming apparatus in which a nozzle is provided with a coating liquid discharge control unit. Hereinafter, an eighth embodiment of the present invention will be described with reference to Figs. 20 to 23 .

<第8實施形態> <Eighth Embodiment>

圖20係表示本發明之圖案形成裝置之第8實施形態之圖。該圖案形成裝置1係將含有用於形成圖案之材料之塗佈液塗佈於基板上,且使其硬化之裝置,其可應用於例如於具有光電轉換面之基板上形成配線圖案而製造光電轉換元件之技術。而且,根據如下之技術背景,僅對一部分塗佈液噴嘴設置塗佈液噴出控制部並且設置氣體噴出裝置1C。即,藉由圖案形成裝置1欲形成圖案之基板之形狀為各種各樣。例如,作為用作太陽電池單元之基板之單晶矽基板,有將正方形之四角切下而成之八角形者。其原因在於,有效地活用圓形之單晶矽晶圓之面積。因此,欲形成於對應於四角之位置之圖案之長度與欲形成於 其他位置之圖案之長度不同。 Fig. 20 is a view showing an eighth embodiment of the pattern forming apparatus of the present invention. The pattern forming apparatus 1 is a device which applies a coating liquid containing a material for forming a pattern onto a substrate and hardens it, and is applicable to, for example, forming a wiring pattern on a substrate having a photoelectric conversion surface to manufacture a photovoltaic The technology of converting components. Further, according to the following technical background, the coating liquid discharge control unit is provided only for a part of the coating liquid nozzle, and the gas discharge device 1C is provided. That is, the shape of the substrate to be patterned by the pattern forming apparatus 1 is various. For example, as a single crystal germanium substrate used as a substrate of a solar cell, there is an octagonal shape in which four corners of a square are cut out. The reason for this is that the area of the circular single crystal germanium wafer is effectively utilized. Therefore, the length of the pattern to be formed at the position corresponding to the four corners is intended to be formed The patterns of other locations are different in length.

因此,第8實施形態之圖案形成裝置1中,對向對應於四角之位置噴出塗佈液之塗佈液噴嘴2設置上述塗佈液噴出控制部。更具體而言,於排列方向上配置成一排之26根噴嘴中,僅對排列方向之最上游側3根及最下游側3根設置塗佈液噴出控制部。因此,藉由控制壓送出之塗佈液之噴出及噴出停止,對於並非矩形形狀之基板(以下,稱為「異形基板」),亦可藉由塗佈而效率良好地形成圖案。 Therefore, in the pattern forming apparatus 1 of the eighth embodiment, the coating liquid discharge control unit is provided to the coating liquid nozzle 2 that discharges the coating liquid at positions corresponding to the four corners. More specifically, among the 26 nozzles arranged in a row in the arrangement direction, the coating liquid discharge control unit is provided only for the three most upstream sides and the most downstream side of the arrangement direction. Therefore, by controlling the ejection of the coating liquid and the ejection stop, the substrate which is not rectangular (hereinafter referred to as "shaped substrate") can be efficiently formed by coating.

該圖案形成裝置1中,於基台710上設置有平台移動機構200,保持基板W之平台300藉由平台移動機構200而可於圖20所示之X-Y平面內移動。於基台710上以橫跨平台300之方式固定有框架721,於框架721上安裝有塗佈頭部500。 In the pattern forming apparatus 1, a stage moving mechanism 200 is provided on the base 710, and the stage 300 holding the substrate W is movable in the X-Y plane shown in Fig. 20 by the stage moving mechanism 200. A frame 721 is fixed to the base 710 so as to straddle the platform 300, and the coating head 500 is attached to the frame 721.

平台移動機構200包含:使平台300於X方向移動之X方向移動機構210;使平台300於Y方向移動之Y方向移動機構220、及使平台300以朝向Z方向之軸為中心而旋轉之θ旋轉機構230。X方向移動機構210成為如下構造:於馬達211上連接有滾珠螺桿212,進而,將固定於Y方向移動機構220之螺帽213安裝於滾珠螺桿212,於滾珠螺桿212之上方固定有導軌214,若馬達211旋轉,則Y方向移動機構220與螺帽213一併沿導軌214於X方向順利地移動。 The platform moving mechanism 200 includes an X-direction moving mechanism 210 that moves the platform 300 in the X direction, a Y-direction moving mechanism 220 that moves the platform 300 in the Y direction, and a θ that rotates the platform 300 about the axis in the Z direction. Rotating mechanism 230. The X-direction moving mechanism 210 has a structure in which a ball screw 212 is connected to the motor 211, and a nut 213 fixed to the Y-direction moving mechanism 220 is attached to the ball screw 212, and a guide rail 214 is fixed above the ball screw 212. When the motor 211 rotates, the Y-direction moving mechanism 220 and the nut 213 smoothly move along the guide rail 214 in the X direction.

Y方向移動機構220亦包含馬達221、滾珠螺桿機構及導軌224,若馬達221旋轉,則θ旋轉機構230藉由滾珠螺桿機構而沿導軌224於Y方向移動。θ旋轉機構230藉由馬達231而使平台300旋轉。再者,其旋轉中心為Z方向軸。根據以上之構成,可變更塗佈頭部500相對於基板W之相對移動方向及朝向。平台移動機構200之各馬達藉由控制裝置各部之動作之控制部600而控制。 The Y-direction moving mechanism 220 also includes a motor 221, a ball screw mechanism, and a guide rail 224. When the motor 221 rotates, the θ rotation mechanism 230 moves in the Y direction along the guide rail 224 by the ball screw mechanism. The θ rotation mechanism 230 rotates the stage 300 by the motor 231. Furthermore, the center of rotation is the Z-axis. According to the above configuration, the relative moving direction and orientation of the coating head 500 with respect to the substrate W can be changed. Each of the motors of the platform moving mechanism 200 is controlled by a control unit 600 that controls the operation of each unit of the apparatus.

進而,在θ旋轉機構230與平台300之間,設置有平台升降機構240。平台升降機構240根據來自控制部600之控制指令而使平台300升 降,將基板W定位於已指定之高度(Z方向位置)。作為平台升降機構240,可使用例如由螺線管或壓電元件等之致動器而形成者、由齒輪而形成者、及由楔之嚙合而形成者等。 Further, between the θ rotation mechanism 230 and the stage 300, a platform elevating mechanism 240 is provided. The platform lifting mechanism 240 raises the platform 300 according to a control command from the control unit 600. Lower, the substrate W is positioned at the designated height (Z-direction position). As the platform elevating mechanism 240, for example, a person formed by an actuator such as a solenoid or a piezoelectric element, a person formed by a gear, and a mesh formed by engagement of a wedge can be used.

於塗佈頭部500之基底510上設置有塗佈液供給部520,將液狀(膏狀)之塗佈液貯存於其內部,根據來自控制部600之控制指令而向基板W噴出該塗佈液。塗佈液供給部520包含:內部成為空洞而貯存塗佈液之注射泵521;及插入至該泵521之內部空間之柱塞524。柱塞524藉由以控制部600驅動控制之馬達、螺線管等致動器或壓縮空氣等而上下驅動,對貯存於注射泵521之內部空間之塗佈液進行加壓。 A coating liquid supply unit 520 is provided on the base 510 of the coating head 500, and a liquid (paste) coating liquid is stored therein, and the coating is ejected onto the substrate W according to a control command from the control unit 600. Cloth liquid. The coating liquid supply unit 520 includes a syringe pump 521 that stores a coating liquid inside a cavity, and a plunger 524 that is inserted into an internal space of the pump 521. The plunger 524 is driven up and down by an actuator such as a motor or a solenoid that is driven and controlled by the control unit 600, compressed air, or the like, and pressurizes the coating liquid stored in the internal space of the syringe pump 521.

又,於塗佈液供給部520之下部安裝有多串噴嘴組550。該多串噴嘴組550係使向基板W噴出塗佈液之26根塗佈液噴嘴(圖示省略)一體化而成者,塗佈液噴嘴而於Y方向配置成一排。即,該圖案形成裝置1中,Y方向成為塗佈液噴嘴之排列方向。又,雖省略於圖20中之圖示,但各塗佈液噴嘴與塗佈液供給部520連接,將自塗佈液供給部520壓送來之塗佈液沿設置於內部之塗佈液流路導引,可自噴出口551噴出。該等26根塗佈液噴嘴中,對Y方向之最上游側3根塗佈液噴嘴及最下游側3根塗佈液噴嘴安裝塗佈液噴出控制部560,對剩餘之中央側20根塗佈液噴嘴未設置塗佈液噴出控制部。因此,注射泵521藉由柱塞524之作動而作動,以此將塗佈液向設置於多串噴嘴組550中之各塗佈液噴嘴壓送,一方面自未設置塗佈液噴出控制部560之中央側20根塗佈液噴嘴維持原樣地直接噴出塗佈液,另一方面,對於最上游側3根及最下游側3根之共計6根塗佈液噴嘴,使各塗佈液噴出控制部560之旋轉軸(圖示省略)旋轉,以此針對每一噴出口551,對塗佈液之噴出進行個別地接通、斷開控制。再者,塗佈液噴出控制部560之基本構成與上述塗佈液噴出裝置1B中採用者相同。進而,與設置有塗佈液噴出控制部560之塗佈液噴嘴對應而設置氣體噴出裝置800。氣體噴 出裝置800之基本構成與上述氣體噴出裝置1C中採用者相同。 Further, a plurality of nozzle groups 550 are attached to the lower portion of the coating liquid supply unit 520. The multi-string nozzle group 550 is formed by integrating 26 coating liquid nozzles (not shown) that eject the coating liquid onto the substrate W, and the liquid nozzles are applied and arranged in a row in the Y direction. That is, in the pattern forming apparatus 1, the Y direction is the arrangement direction of the coating liquid nozzles. In addition, the coating liquid nozzle is connected to the coating liquid supply unit 520, and the coating liquid pumped from the coating liquid supply unit 520 is applied along the coating liquid provided inside. The flow path is guided and can be ejected from the ejection outlet 551. In the six coating liquid nozzles, the coating liquid discharge control unit 560 is attached to the three coating liquid nozzles on the most upstream side in the Y direction and the three coating liquid nozzles on the most downstream side, and the remaining center side is coated with 20 coatings. The coating liquid discharge nozzle is not provided with the coating liquid discharge control unit. Therefore, the syringe pump 521 is actuated by the action of the plunger 524, whereby the coating liquid is pumped to the respective coating liquid nozzles provided in the plurality of nozzle groups 550, and the coating liquid ejection control unit is not provided. In the center of the 560, the 20 coating liquid nozzles of the 560 are directly sprayed out of the coating liquid, and the coating liquid is ejected from the total of six coating liquid nozzles of the three most upstream and three most downstream sides. The rotation axis (not shown) of the control unit 560 is rotated, and the discharge of the coating liquid is individually turned on and off for each of the discharge ports 551. The basic configuration of the coating liquid discharge control unit 560 is the same as that employed in the coating liquid discharge device 1B. Further, a gas discharge device 800 is provided corresponding to the coating liquid nozzle provided with the coating liquid discharge control unit 560. Gas spray The basic configuration of the outlet device 800 is the same as that employed in the gas ejection device 1C described above.

又,於塗佈頭部500之基底510上,安裝有向基板W照射UV光(Ultraviolet Rays,紫外線)之光照射部530。光照射部530經由光纖531而連接於產生紫外線之光源單元532。雖省略圖示,但光源單元532於其光出射部包含開閉自如之閘,可根據其開閉及開度而控制出射光之接通、斷開及光量。光源單元532藉由控制部600而控制。 Further, on the base 510 of the coating head 500, a light irradiation portion 530 that irradiates the substrate W with ultraviolet light (ultraviolet rays) is attached. The light irradiation unit 530 is connected to the light source unit 532 that generates ultraviolet light via the optical fiber 531. Although not shown in the drawings, the light source unit 532 includes a shutter that can be opened and closed in the light emitting portion, and can control the on, off, and light amount of the emitted light according to the opening and closing and the opening degree. The light source unit 532 is controlled by the control unit 600.

圖21係使用圖20之圖案形成裝置形成之太陽電池單元之例之圖。該太陽電池單元S具有如下之構造:於單晶矽基板W之表面(光電轉換面及設置有抗反射膜之面),設置有多數之寬度較窄之指狀配線圖案F、及以橫切該等之方式設置之寬度較寬之匯流排配線圖案B。指狀配線圖案F與匯流排配線圖案B係於其交點電性連接。 Fig. 21 is a view showing an example of a solar battery cell formed using the pattern forming device of Fig. 20. The solar cell unit S has a structure in which a surface of a single crystal germanium substrate W (a photoelectric conversion surface and a surface on which an antireflection film is provided) is provided, and a plurality of finger wiring patterns F having a narrow width are provided, and a cross section is provided. In these manners, a bus bar wiring pattern B having a wide width is provided. The finger wiring pattern F and the bus bar wiring pattern B are electrically connected at their intersections.

關於各部之尺寸,例如可將指狀配線圖案F之寬度及高度設為50μm左右,將匯流排配線圖案B之寬度設為1.8mm至2.0mm,高度設為50μm至70μm,但並不限定於該等之數值。 For example, the width and height of the finger wiring pattern F are set to about 50 μm, the width of the bus bar wiring pattern B is set to 1.8 mm to 2.0 mm, and the height is set to 50 μm to 70 μm, but the size is not limited thereto. The value of these.

矽基板W係將大致正方形之四角切下而成之相對於中心軸C而線對稱之八角形。該形狀之產生係由於自被製造成大致圓柱形之單晶矽棒切下之晶圓形成為圓板形狀,必須有效地利用其表面積而製作基板W。 The ruthenium substrate W is an octagonal shape which is formed by cutting four corners of a substantially square shape and is line symmetrical with respect to the central axis C. This shape is formed by forming a wafer into a disk shape from a wafer cut out of a single-crystal rod manufactured into a substantially cylindrical shape, and it is necessary to efficiently use the surface area thereof to fabricate the substrate W.

因此,形成於基板W上之多數之指狀電極F於基板W之中央部之被看作大致矩形之矩形區域RR上具有固定之長度,但於端部區域ER上配合其形狀,每一根指狀電極F之長度不同。具體而言,形成於矩形區域RR上之複數個電極Fr之任一者均具有較基板W之長度稍短之同一長度,相對於此,形成於端部區域ER上之電極Fe之長度伴隨基板W端面之後退而變化,越接近基板最端部則其長度變得越短。圖21之例中,於基板中央之矩形區域RR上形成有20根同一長度之電極圖案Fr,於基板兩端部之端部區域ER上各形成有長度相互不同之3根電極 圖案Fe。再者,此僅為一例,圖案之根數並不限定於該等,但必須根據設置於端部區域ER上之電極圖案Fe之根數而使塗佈液噴出控制部560之設置個數與之對應。 Therefore, the plurality of finger electrodes F formed on the substrate W have a fixed length on the rectangular portion RR which is regarded as a substantially rectangular shape at the central portion of the substrate W, but the shape is matched to the end region ER, each of which The length of the finger electrodes F is different. Specifically, any one of the plurality of electrodes Fr formed on the rectangular region RR has the same length which is slightly shorter than the length of the substrate W. On the other hand, the length of the electrode Fe formed on the end region ER is accompanied by the substrate. The W end face changes back and changes, and the closer to the end of the substrate, the shorter the length becomes. In the example of FIG. 21, 20 electrode patterns Fr of the same length are formed on the rectangular region RR at the center of the substrate, and three electrodes having different lengths are formed on the end regions ER at both end portions of the substrate. Pattern Fe. In addition, this is only an example, and the number of patterns is not limited to these, but the number of the coating liquid discharge control units 560 must be set in accordance with the number of electrode patterns Fe provided on the end portion region ER. Correspondence.

使噴出之接通、斷開總括地受到控制之多數之塗佈液噴嘴相對於基板一體地相對移動而形成圖案之先前技術(例如日本專利特開2011-60873號公報)無法應對此種形狀之基板。又,用於對各塗佈液噴嘴進行個別地接通、斷開控制之具體之技術在此之前並未得以實用化。相對於此,本實施形態之圖案形成裝置1中,設置有與圖2相同構成之塗佈液噴出控制部560,藉由各塗佈液噴出控制部560而控制塗佈液之噴出及噴出停止,由此,即便對於如圖21之異形基板,亦可效率良好地進行圖案形成。 The prior art in which a plurality of coating liquid nozzles which are controlled to be connected to each other by a plurality of coating liquid nozzles are integrally moved relative to each other to form a pattern (for example, Japanese Patent Laid-Open Publication No. 2011-60873) cannot cope with such a shape. Substrate. Further, the specific technique for individually turning on and off the respective coating liquid nozzles has not been put into practical use until now. On the other hand, in the pattern forming apparatus 1 of the present embodiment, the coating liquid discharge control unit 560 having the same configuration as that of FIG. 2 is provided, and the coating liquid discharge control unit 560 controls the discharge of the coating liquid and the discharge stop. Thus, even in the case of the irregular substrate as shown in FIG. 21, pattern formation can be performed efficiently.

圖22係模式性表示由圖20之裝置進行指狀電極形成之狀況之圖。如該圖所示,該裝置1中,藉由使載置有基板W之平台300於X方向移動,而使多串噴嘴組550相對於基板W之表面於(-X)方向進行相對掃描移動。於該多串噴嘴組550之下表面設置有26個噴出口551,該等噴出口551沿Y方向等間隔地配置成一排。Y方向之多串噴嘴組550之尺寸與該方向之基板W之尺寸為相同程度或其以上。因此,使多串噴嘴組550相對於基板W僅進行1次掃描移動,便可於基板W之整個面上形成指狀電極圖案Fr、Fe。 Fig. 22 is a view schematically showing a state in which the finger electrodes are formed by the apparatus of Fig. 20. As shown in the figure, in the apparatus 1, the multi-string nozzle group 550 is relatively scanned in the (-X) direction with respect to the surface of the substrate W by moving the stage 300 on which the substrate W is placed in the X direction. . 26 discharge ports 551 are provided on the lower surface of the plurality of nozzle groups 550, and the discharge ports 551 are arranged in a row at equal intervals in the Y direction. The size of the multi-string nozzle group 550 in the Y direction is equal to or greater than the size of the substrate W in this direction. Therefore, the finger electrode patterns Fr and Fe can be formed on the entire surface of the substrate W by performing the scanning movement of the plurality of nozzle groups 550 with respect to the substrate W only once.

作為塗佈液,可使用導電性膏,即,具有導電性及光硬化性且含有例如導電性粒子、有機媒劑(溶劑、樹脂、增黏劑等之混合物)及光聚合起始劑之膏狀之混合液。導電性粒子係用作電極之材料之例如銀粉末,有機媒劑包含作為樹脂材料之乙基纖維素與有機溶劑。又,塗佈液之黏度較佳為,於以光照射執行硬化處理之前例如為50[Pa.s]以下,於執行硬化處理之後為350[Pa.s]以上。 As the coating liquid, a conductive paste, that is, a paste having conductivity and photocurability and containing, for example, conductive particles, an organic vehicle (a mixture of a solvent, a resin, a tackifier, and the like) and a photopolymerization initiator can be used. a mixture of forms. The conductive particles are, for example, silver powder used as a material of the electrode, and the organic vehicle contains ethyl cellulose as a resin material and an organic solvent. Further, the viscosity of the coating liquid is preferably 50 [Pa. before the hardening treatment by light irradiation. s] below, after performing hardening treatment is 350 [Pa. s] above.

對自噴出口551向基板W之表面剛噴出後之塗佈液,照射來自塗 佈液噴嘴之掃描移動方向(-X方向)之噴出口551之後方所配置之光照射部530之出射光。藉此,於維持剛噴出後之剖面形狀之狀態下塗佈液硬化,形成電極圖案Fr、Fe。藉由適當地設定噴出口551之形狀、塗佈液之黏度及光照射條件而可形成具有各種剖面形狀之圖案,尤其可形成圖案高度相對於圖案寬度之比、即縱橫比較高之圖案。 The coating liquid immediately after being ejected from the ejection outlet 551 toward the surface of the substrate W is irradiated with the coating liquid. The light emitted from the light-irradiating portion 530 disposed behind the ejection port 551 in the scanning movement direction (-X direction) of the cloth liquid nozzle. Thereby, the coating liquid is hardened while maintaining the cross-sectional shape immediately after the ejection, and the electrode patterns Fr and Fe are formed. By appropriately setting the shape of the discharge port 551, the viscosity of the coating liquid, and the light irradiation conditions, a pattern having various cross-sectional shapes can be formed, and in particular, a ratio of the pattern height to the pattern width, that is, a pattern having a relatively high aspect ratio can be formed.

圖23係表示第8實施形態之圖案形成處理之流程圖。該處理係使用具有與欲形成之圖案之根數對應之26個噴出口551之多串噴嘴組550執行。對與該等噴出口551中之Y方向之最上游側3個噴出口551及最下游側3個噴出口551之各者相連之塗佈液噴嘴設置塗佈液噴出控制部560,以獨立地控制來自各噴出口551之塗佈液之噴出及噴出停止。因此,於藉由塗佈液噴出控制部560使來自最上游側3個噴出口551及最下游側3個噴出口551之噴出停止之狀態下,若將塗佈液自塗佈液供給部520向塗佈液噴嘴壓送,則自中央側20個噴出口551同時噴出塗佈液。其後,藉由各塗佈液噴出控制部560使旋轉軸旋轉,以此可個別地控制來自各噴出口551之塗佈液之噴出。再者,圖22所示之符號P1至P3及P24至P26係用以特定用於塗佈端部區域ER之噴出口之符號。即,將26個噴出口中位於最外側之噴出口表示為符號P1、P26,將自此向內側1個之噴出口表示為符號P2、P25,將自此再向內側1個之噴出口表示為符號P3、P24。除該等外剩餘之20個噴出口被用於矩形區域RR之圖案Fr之形成。該等噴出口P1~P3、P24~P26係如下所述藉由塗佈液噴出控制部560以與其他噴出口不同之時序獨自地受到噴出控制之噴出口,以下將該等噴出口稱為「控制對象噴出口」。 Fig. 23 is a flow chart showing the pattern forming process of the eighth embodiment. This processing is performed using a plurality of nozzle groups 550 having 26 ejection ports 551 corresponding to the number of patterns to be formed. The coating liquid discharge control unit 560 is provided to the coating liquid nozzle that is connected to each of the three discharge ports 551 on the most upstream side in the Y direction and the three discharge ports 551 on the most downstream side in the discharge port 551, independently. The discharge and discharge stop of the coating liquid from each of the discharge ports 551 are controlled. Therefore, in the state where the discharge from the most upstream three discharge ports 551 and the most downstream three discharge ports 551 is stopped by the coating liquid discharge control unit 560, the coating liquid is supplied from the coating liquid supply unit 520. When the coating liquid nozzle is pressure-fed, the coating liquid is simultaneously discharged from the center side 20 discharge ports 551. Thereafter, each of the coating liquid discharge control units 560 rotates the rotary shaft, whereby the discharge of the coating liquid from each of the discharge ports 551 can be individually controlled. Further, the symbols P1 to P3 and P24 to P26 shown in Fig. 22 are used to specify the symbols for ejecting the ejection ports of the end regions ER. In other words, the discharge ports located at the outermost of the 26 discharge ports are indicated by the symbols P1 and P26, and the discharge ports from the inside to the inside are indicated by the symbols P2 and P25, and the discharge ports from the inside to the inside are indicated as Symbols P3, P24. The remaining 20 ejection ports except for these are used for the formation of the pattern Fr of the rectangular region RR. The discharge ports P1 to P3 and P24 to P26 are respectively subjected to the discharge control of the discharge control by the coating liquid discharge control unit 560 at a timing different from the other discharge ports, and the discharge ports are hereinafter referred to as "control". Object spray outlet".

該處理中,最初將基板W搬入至圖案形成裝置1,且使欲形成圖案之面朝上而載置於平台300上(步驟S101)。又,使塗佈液噴出控制部560之旋轉軸繞軸心旋轉而使來自噴出口P1~P3、P24~P26之噴出停止(步驟S102)。具體而言,例如與圖3中之「噴嘴編號1」之塗佈液 噴嘴同樣地,將上游側流路與下游側流路之連通之比例設定為0[%]。 In this process, the substrate W is first carried into the pattern forming apparatus 1 and the surface on which the pattern is to be formed is placed on the stage 300 (step S101). Moreover, the rotation axis of the coating liquid discharge control unit 560 is rotated about the axis, and the discharge from the discharge ports P1 to P3 and P24 to P26 is stopped (step S102). Specifically, for example, the coating liquid of "Nozzle No. 1" in FIG. Similarly, the ratio of the communication between the upstream side flow path and the downstream side flow path is set to 0 [%].

該狀態下,藉由平台移動機構200使平台300於X方向移動(步驟S103),使多串噴嘴組550移動至基板W之X方向端部之正上方。繼而,開始由注射泵521對塗佈液進行加壓並且使基板W於X方向移動(步驟S104)。隨此,僅自位於中央部分之20個噴出口551開始噴出塗佈液。藉此開始形成矩形區域RR之圖案Fr。 In this state, the platform 300 is moved in the X direction by the stage moving mechanism 200 (step S103), and the plurality of nozzle groups 550 are moved right above the X-direction end of the substrate W. Then, the coating liquid is pressurized by the syringe pump 521 and the substrate W is moved in the X direction (step S104). Accordingly, the coating liquid was discharged only from the 20 discharge ports 551 located at the center portion. Thereby, the pattern Fr of the rectangular region RR is formed.

其後,按以下之順序依序打開控制對象噴出口(步驟S105)。即,自注射泵521開始加壓起經過特定時間後,首先解除來自控制對象噴出口中之最靠近中央之噴出口P3、P24之噴出停止,打開塗佈液流路。隨後打開與該等之外側鄰接之噴出口P2、P25,最後打開最外側之噴出口P1、P26。藉此,於基板W之端部區域ER上,根據噴出口之打開時序而形成始端位置各不相同之圖案Fe。又,與第1實施形態至第3實施形態同樣地,與塗佈液之噴出開始對應而控制來自氣體噴出裝置800之空氣流之供給,以防止電極圖案(線型圖案)之始端變形成球狀,或始端位置之偏差。 Thereafter, the control target discharge port is sequentially opened in the following order (step S105). In other words, after a certain period of time has elapsed since the start of the pressurization of the syringe pump 521, the discharge from the discharge ports P3 and P24 closest to the center of the control target discharge port is first released, and the coating liquid flow path is opened. Subsequently, the discharge ports P2, P25 adjacent to the outer sides are opened, and finally the outermost discharge ports P1, P26 are opened. Thereby, in the end region ER of the substrate W, the pattern Fe having different starting positions is formed in accordance with the opening timing of the discharge port. In the same manner as in the first embodiment to the third embodiment, the supply of the air flow from the gas discharge device 800 is controlled in accordance with the start of the discharge of the coating liquid to prevent the start of the electrode pattern (linear pattern) from becoming spherical. , or the deviation of the starting position.

維持該狀態而繼續進行多串噴嘴組550相對於基板W之掃描移動,以此於基板W上形成相互平行之26根電極圖案。持續該狀態直至基板W到達特定位置之後(步驟S106),以與打開之順序相反之順序,依序關閉各噴出口P1~P3、P24~P26(步驟S107)。即,關閉最外側之噴出口P1、P26,其後關閉與該等鄰接之噴出口P2、P25。進而,關閉最內側之噴出口P3、P24。伴隨噴出口之關閉,帶有少許時間差而依序結束由來自該噴出口之塗佈液形成圖案。因此,該等圖案之終端位置亦不同。且與第1實施形態至第3實施形態同樣地,與塗佈液之噴出停止對應而控制來自氣體噴出裝置800之空氣流之供給,以抑制於電極圖案(線型圖案)之終端產生拖尾。 While maintaining this state, the scanning movement of the plurality of nozzle groups 550 with respect to the substrate W is continued, thereby forming 26 electrode patterns parallel to each other on the substrate W. This state is continued until the substrate W reaches the specific position (step S106), and the discharge ports P1 to P3 and P24 to P26 are sequentially closed in the order reverse to the order of opening (step S107). That is, the outermost discharge ports P1, P26 are closed, and then the discharge ports P2, P25 adjacent thereto are closed. Further, the innermost discharge ports P3 and P24 are closed. With the closing of the discharge port, the coating liquid from the discharge port is patterned in a sequence with a slight time difference. Therefore, the terminal positions of the patterns are also different. In the same manner as in the first embodiment to the third embodiment, the supply of the air flow from the gas discharge device 800 is controlled in accordance with the stop of the discharge of the coating liquid to suppress the occurrence of smearing at the end of the electrode pattern (linear pattern).

如此完成於終端側之端部區域ER上之圖案形成,進而若多串噴 嘴組550到達矩形區域RR之端部,則停止來自注射泵521之加壓(步驟S108)。其後,停止平台300之移動(步驟S109),將形成有指狀電極圖案F(Fr,Fe)之基板W搬出(步驟S110),完成處理。 This completes the pattern formation on the end region ER on the terminal side, and if so, When the mouth group 550 reaches the end of the rectangular area RR, the pressurization from the syringe pump 521 is stopped (step S108). Thereafter, the movement of the stage 300 is stopped (step S109), and the substrate W on which the finger electrode patterns F (Fr, Fe) are formed is carried out (step S110), and the processing is completed.

根據如上之圖案形成處理,於基板W之中央部之矩形區域RR上,形成相互平行且長度相等之圖案Fr。另一方面,於基板兩端之端部區域ER上,越靠近基板W之外側,圖案之形成開始越晚,且形成結束越早。由於基板W與多串噴嘴組550以固定速度進行相對移動,故而形成時序之差異反映於基板W上之圖案之始端及終端之位置,最終形成如圖21及圖22所示之指狀電極圖案F。於此期間,多串噴嘴組550相對於基板W之掃描移動僅為1次。 According to the pattern forming process as described above, the pattern Fr which is parallel to each other and has the same length is formed on the rectangular region RR at the central portion of the substrate W. On the other hand, on the end region ER at both ends of the substrate, the closer to the outside of the substrate W, the later the formation of the pattern starts, and the earlier the formation is completed. Since the substrate W and the plurality of nozzle groups 550 are relatively moved at a fixed speed, the difference in timing is reflected on the position of the beginning and the end of the pattern on the substrate W, and finally the finger electrode patterns as shown in FIGS. 21 and 22 are formed. F. During this period, the scanning movement of the multi-string nozzle group 550 with respect to the substrate W is only one time.

又,以如下方式構成:與各控制對象噴出口551對應而對塗佈液噴嘴設置塗佈液噴出控制部560,且藉由旋轉軸之旋轉而個別地控制來自噴出口551之噴出及噴出停止。因此,對於藉由多串噴嘴組550之掃描移動而同時形成之多數線狀圖案中之一部分,可使圖案之始端位置及終端位置與其他圖案不同。其結果為,即便為如圖21或圖22所示之異形基板,亦可於其整個面上效率良好地形成圖案。而且,與塗佈液之噴出開始及噴出停止對應而與上述實施形態同樣地控制來自氣體噴出裝置800之空氣流之供給。因此,不會污染基板W或裝置,可於基板W上以良好之形狀形成圖案。 In addition, the coating liquid discharge control unit 560 is provided to the coating liquid nozzle in accordance with each of the control target discharge ports 551, and the discharge from the discharge port 551 and the discharge stop are individually controlled by the rotation of the rotary shaft. . Therefore, for one of the plurality of linear patterns simultaneously formed by the scanning movement of the plurality of strings of nozzle groups 550, the start position and the end position of the pattern can be made different from the other patterns. As a result, even if it is a deformed substrate as shown in FIG. 21 or FIG. 22, a pattern can be formed efficiently on the whole surface. In addition, the supply of the air flow from the gas discharge device 800 is controlled in the same manner as in the above embodiment in accordance with the start of the discharge of the coating liquid and the discharge stop. Therefore, the substrate W or the device is not contaminated, and the pattern can be formed in a good shape on the substrate W.

又,對包含各控制對象噴出口551之塗佈液噴嘴安裝塗佈液噴出控制部4之旋轉軸,藉由該旋轉軸之旋轉而控制來自噴出口551之塗佈液之噴出,故而不會有構成零件之變形,可穩定地進行塗佈液之高精度之噴出控制。 Moreover, the rotation axis of the coating liquid discharge control unit 4 is attached to the coating liquid nozzle including the control target discharge port 551, and the discharge of the coating liquid from the discharge port 551 is controlled by the rotation of the rotary shaft, so that it does not There is deformation of the constituent parts, and the high-precision discharge control of the coating liquid can be stably performed.

又,將塗佈液噴出控制部560配置於與排列方向Y正交之方向上之彼此不同之位置,即配置成鋸齒狀或錯開狀,故而可防止塗佈液噴出控制部4之相互干涉,且可使塗佈液噴嘴之間距狹窄。其結果為, 可使能藉由圖案形成裝置1形成之圖案之間隔狹窄化。 Further, the coating liquid discharge control unit 560 is disposed at a position different from each other in the direction orthogonal to the arrangement direction Y, that is, arranged in a zigzag shape or in a staggered shape, so that the coating liquid discharge control unit 4 can be prevented from interfering with each other. Moreover, the distance between the coating liquid nozzles can be narrowed. The result is that The interval between the patterns formed by the pattern forming device 1 can be narrowed.

又,上述第8實施形態中,為了控制圖案之形狀,僅設置氣體噴出裝置800,但亦可替代氣體噴出裝置800而設置圖案整形裝置1D,或與氣體噴出裝置800一併設置圖案整形裝置1D。於該等之情形時,對圖案Fe之始端部及終端部供給來自圖案整形裝置1D之空氣流而進行圖案整形,故而可使圖案Fe與圖案Fr近似,從而可取得優異之美感。又,藉由於圖案整形裝置1D之後方配置光照射部530而可取得以下之作用效果。即,於維持藉由圖案整形裝置1D剛整形後之剖面形狀之狀態下塗佈液硬化,形成電極圖案Fe。藉由適當地設定噴出口551之形狀、塗佈液之黏度及光照射條件,且適當地設定圖案整形裝置1D之整形條件而可形成具有各種剖面形狀之圖案,尤其可形成圖案高度相對於圖案寬度之比、即縱橫比較高之圖案,並且能以近似之形狀形成電極圖案Fr與電極圖案Fe。 Further, in the eighth embodiment, only the gas ejection device 800 is provided to control the shape of the pattern. However, the pattern shaping device 1D may be provided instead of the gas ejection device 800, or the pattern shaping device 1D may be provided together with the gas ejection device 800. . In such a case, the air flow from the pattern shaping device 1D is supplied to the start and end portions of the pattern Fe to perform pattern shaping, so that the pattern Fe and the pattern Fr can be approximated, and an excellent aesthetic feeling can be obtained. Moreover, the following effects can be obtained by arranging the light irradiation unit 530 behind the pattern shaping device 1D. In other words, the coating liquid is cured in a state in which the cross-sectional shape immediately after shaping by the pattern shaping device 1D is maintained, and the electrode pattern Fe is formed. By appropriately setting the shape of the discharge port 551, the viscosity of the coating liquid, and the light irradiation conditions, and appropriately setting the shaping conditions of the pattern shaping device 1D, a pattern having various cross-sectional shapes can be formed, and in particular, the pattern height can be formed with respect to the pattern. The ratio of the widths, that is, the pattern having a relatively high aspect ratio, and the electrode pattern Fr and the electrode pattern Fe can be formed in an approximate shape.

如此,於上述實施形態中,平台移動機構1A、200相當於使基板W相對於塗佈液噴嘴而於第1方向上相對移動之「移動設備」之一例。又,基板移動方向X、噴出方向D2及噴射方向D3分別相當於本發明之「第1方向」、「第2方向」、「第3方向」。又,脈衝噴吹系統132及連續噴吹系統131分別相當於本發明之「第1供給系統」及「第2供給系統」之一例。 As described above, in the above-described embodiment, the stage moving mechanisms 1A and 200 correspond to an example of a "mobile device" that relatively moves the substrate W in the first direction with respect to the coating liquid nozzle. Further, the substrate moving direction X, the discharge direction D2, and the ejection direction D3 correspond to the "first direction", the "second direction", and the "third direction" of the present invention, respectively. Further, the pulse blowing system 132 and the continuous blowing system 131 correspond to an example of the "first supply system" and the "second supply system" of the present invention, respectively.

又,於上述實施形態中,氣體噴出裝置1C相當於本發明之「氣流吹送設備」之一例,圖案整形裝置1D相當於本發明之「圖案整形設備」之一例。氣體噴嘴120、170分別相當於本發明之「第1氣體噴嘴」及「第2氣體噴嘴」之一例。氣體供給部130、180分別相當於本發明之「第1氣體供給部」及「第2氣體供給部」之一例。 In the above embodiment, the gas ejection device 1C corresponds to an example of the "airflow blowing device" of the present invention, and the pattern shaping device 1D corresponds to an example of the "pattern shaping device" of the present invention. The gas nozzles 120 and 170 correspond to an example of the "first gas nozzle" and the "second gas nozzle" of the present invention, respectively. Each of the gas supply units 130 and 180 corresponds to an example of the "first gas supply unit" and the "second gas supply unit" of the present invention.

又,於第1實施形態及第5實施形態中,閥控制部140相當於「第1氣體供給控制部」之一例,於第2實施形態、第3實施形態、第6實施 形態及第7實施形態中,閥控制部140及脈衝驅動部150作為本發明之「第1氣體供給控制部」發揮功能。於第4實施形態至第7實施形態中,閥控制部140及脈衝驅動部150作為本發明之「第2氣體供給控制部」發揮功能。進而,光照射部530相當於本發明之「圖案硬化部」之一例。 In the first embodiment and the fifth embodiment, the valve control unit 140 corresponds to an example of the "first gas supply control unit", and is in the second embodiment, the third embodiment, and the sixth embodiment. In the embodiment and the seventh embodiment, the valve control unit 140 and the pulse drive unit 150 function as the "first gas supply control unit" of the present invention. In the fourth embodiment to the seventh embodiment, the valve control unit 140 and the pulse drive unit 150 function as the "second gas supply control unit" of the present invention. Further, the light irradiation unit 530 corresponds to an example of the "pattern hardening portion" of the present invention.

<其他> <Other>

再者,本發明並不限定於上述實施形態,於不脫離其要旨之範圍內除上述以外還可進行各種變更。例如,於上述實施形態中,對噴嘴夾持器110以鋸齒狀、且不同之傾斜角度設置有複數個貫通孔,將氣體噴嘴120配置於各貫通孔中。藉由採用此種配置關係可防止氣體噴嘴120之相互干涉並且可使間距狹窄,從而亦可對應於圖案間隔之狹窄化。但,氣體噴嘴120之配置關係並不限定於此,例如亦可配置成一排。就該點而言,對於氣體噴嘴170亦相同。 The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention. For example, in the above embodiment, the nozzle holder 110 is provided with a plurality of through holes in a zigzag shape and at different inclination angles, and the gas nozzles 120 are disposed in the respective through holes. By adopting such an arrangement relationship, it is possible to prevent the gas nozzles 120 from interfering with each other and to narrow the pitch, and it is also possible to correspond to the narrowing of the pattern interval. However, the arrangement relationship of the gas nozzles 120 is not limited thereto, and may be arranged, for example, in a row. In this regard, the same applies to the gas nozzle 170.

又,於第1實施形態至第3實施形態、第5實施形態至第7實施形態中,與塗佈液之噴出開始及噴出停止之任一者對應而控制來自氣體噴嘴之空氣之噴射,但亦可僅與塗佈液之噴出開始對應而進行空氣之噴射控制,或相反地僅與塗佈液之噴出停止對應而進行空氣之噴射控制。又,於對線型圖案中之除始端部及終端部以外之部位必需進行整形之情形時,亦可將該部位作為本發明之「被整形部」,且對該部位以脈衝狀噴射空氣而進行整形。 In addition, in the first embodiment to the third embodiment, the fifth embodiment, and the seventh embodiment, the injection of air from the gas nozzle is controlled in accordance with any of the discharge start and the discharge stop of the coating liquid. The air injection control may be performed only in accordance with the start of the discharge of the coating liquid, or conversely, the air injection control may be performed only in accordance with the discharge stop of the coating liquid. Further, when it is necessary to shape a portion other than the start end portion and the end portion of the line pattern, the portion may be used as the "shaped portion" of the present invention, and the portion may be jetted with air in a pulsed manner. Plastic surgery.

又,於上述實施形態中,一方面將塗佈液噴嘴及氣體噴嘴固定配置,另一方面使基板W於X方向移動而形成線型圖案,但亦可使塗佈液噴嘴及氣體噴嘴一體地於X方向移動而形成線型圖案。即,對於使基板W相對於噴嘴於X方向進行相對移動而形成線型圖案之圖案形成技術普遍可應用本發明。 Further, in the above-described embodiment, the coating liquid nozzle and the gas nozzle are fixedly arranged, and the substrate W is moved in the X direction to form a linear pattern. However, the coating liquid nozzle and the gas nozzle may be integrally formed. The X direction moves to form a line pattern. That is, the present invention is generally applicable to a pattern forming technique for forming a line pattern by relatively moving the substrate W with respect to the nozzle in the X direction.

又,於上述實施形態中,對塗佈液之液流CF吹送空氣,但作為 本發明之「氣體」並不限定於此,亦可構成為例如將氮氣作為本發明之「氣體」而自氣體噴嘴噴射。 Further, in the above embodiment, air is blown to the liquid flow CF of the coating liquid, but The "gas" of the present invention is not limited thereto, and it may be configured such that nitrogen gas is ejected from the gas nozzle as the "gas" of the present invention.

本發明對於自塗佈液噴嘴向相對於該塗佈液噴嘴而相對移動之基板以線狀供給塗佈液而形成線型圖案之圖案形成技術普遍可應用。而且,為了控制圖案之形狀,藉由僅設置氣體噴出裝置(氣流吹送設備)1C、僅設置圖案整形裝置(圖案整形設備)1D、或設置其兩者,而可良好地控制圖案之形狀。再者,關於圖案整形裝置,對於在基板上良好地形成圖案之技術普遍可應用,對於任意之圖案可進行圖案整形。 The present invention is generally applicable to a pattern forming technique in which a coating liquid is supplied linearly from a coating liquid nozzle to a substrate that relatively moves with respect to the coating liquid nozzle to form a linear pattern. Further, in order to control the shape of the pattern, the shape of the pattern can be favorably controlled by providing only the gas ejection device (airflow blowing device) 1C, providing only the pattern shaping device (pattern shaping device) 1D, or both. Further, regarding the pattern shaping device, a technique for forming a pattern on a substrate is generally applicable, and patterning can be performed for any pattern.

1A‧‧‧平台移動機構 1A‧‧‧ platform moving mechanism

1C‧‧‧氣體噴出裝置 1C‧‧‧ gas ejection device

2‧‧‧塗佈液噴嘴 2‧‧‧ Coating liquid nozzle

21‧‧‧噴出口 21‧‧‧Spray outlet

110‧‧‧噴嘴夾持器 110‧‧‧Nozzle holder

120‧‧‧氣體噴嘴 120‧‧‧ gas nozzle

130‧‧‧氣體供給部 130‧‧‧Gas Supply Department

131‧‧‧連續噴吹系統 131‧‧‧Continuous blowing system

131a‧‧‧配管 131a‧‧‧Pipe

131b‧‧‧調節器 131b‧‧‧Regulator

131c‧‧‧針閥 131c‧‧‧ needle valve

131d‧‧‧驅動開閉閥 131d‧‧‧Drive on-off valve

140‧‧‧閥控制部 140‧‧‧Valve Control Department

AF‧‧‧空氣流 AF‧‧‧Air flow

CF‧‧‧(塗佈液之)液流 CF‧‧‧ (coating liquid) flow

D2‧‧‧噴出方向 D2‧‧‧Spray direction

D3‧‧‧噴射方向 D3‧‧‧jet direction

LP‧‧‧線型圖案 LP‧‧‧Line pattern

PS1‧‧‧供給位置 PS1‧‧‧ supply location

W‧‧‧基板 W‧‧‧Substrate

X‧‧‧基板移動方向 X‧‧‧ substrate moving direction

Claims (21)

一種形狀控制裝置,其特徵在於:其係藉由線狀之塗佈液而於基板之表面形成圖案者,上述線狀之塗佈液係自塗佈液噴嘴之噴出口噴出至相對於上述塗佈液噴嘴而於第1方向上相對移動之上述基板之表面;上述形狀控制裝置包括氣流吹送設備與圖案整形設備中之至少一者,上述氣流吹送設備係對應於上述塗佈液之噴出開始及噴出停止中之至少一者,相對於上述塗佈液對上述基板之供給位置而朝向上述第1方向之上游側之上述基板之表面噴射氣體,於上述塗佈液噴嘴之噴出口與上述基板之表面之中間對上述塗佈液之液流吹送氣流;上述圖案整形設備係對形成於上述基板之表面上之圖案以脈衝狀噴射氣體並進行整形;藉由上述氣體而控制圖案之形狀。 A shape control device characterized in that a pattern is formed on a surface of a substrate by a linear coating liquid, and the linear coating liquid is ejected from a discharge port of the coating liquid nozzle to be coated with respect to the coating a surface of the substrate that moves relative to the first direction in the first direction; the shape control device includes at least one of a gas flow blowing device and a pattern shaping device, wherein the airflow blowing device corresponds to a discharge start of the coating liquid and At least one of the discharge stops, the gas is ejected toward the surface of the substrate on the upstream side in the first direction with respect to the supply position of the coating liquid, and the discharge port of the coating liquid nozzle and the substrate are The liquid flow is blown to the liquid of the coating liquid in the middle of the surface; the pattern shaping device sprays and shapes the pattern on the surface of the substrate in a pulsed manner; and controls the shape of the pattern by the gas. 如請求項1之圖案形成裝置,其中上述氣流吹送設備包含:第1氣體噴嘴,其相對於上述塗佈液噴嘴而配置於上述第1方向之下游側;第1氣體供給部,其將氣體供給至上述第1氣體噴嘴;及第1氣體供給控制部,其控制上述第1氣體供給部之上述氣體之供給。 The pattern forming apparatus according to claim 1, wherein the airflow blowing device includes: a first gas nozzle disposed on a downstream side of the first direction with respect to the coating liquid nozzle; and a first gas supply unit that supplies a gas The first gas nozzle and the first gas supply control unit control the supply of the gas in the first gas supply unit. 如請求項2之圖案形成裝置,其中上述塗佈液噴嘴係相對於上述塗佈液之供給位置而在上述第1方向之上游側將上述噴出口朝向上述供給位置而配置,上述第1氣體供給部係向與供給上述塗佈液之第2方向正交之第3方向噴射氣體。 The pattern forming apparatus according to claim 2, wherein the coating liquid nozzle is disposed on the upstream side of the first direction toward the supply position with respect to the supply position of the coating liquid toward the supply position, and the first gas supply The part ejects the gas in a third direction orthogonal to the second direction in which the coating liquid is supplied. 如請求項2之圖案形成裝置,其中上述第1氣體供給部包含第1供 給系統,該第1供給系統根據來自上述第1氣體供給控制部之指令,切換對上述第1氣體噴嘴之上述氣體之供給及供給停止,上述第1氣體供給控制部反覆地使上述第1供給系統進行上述氣體之供給及供給停止,執行使上述氣體自上述第1氣體噴嘴以脈衝狀噴射之脈衝噴射。 The pattern forming apparatus of claim 2, wherein the first gas supply unit includes a first supply In the first system, the first supply system switches the supply and supply of the gas to the first gas nozzle in response to a command from the first gas supply control unit, and the first gas supply control unit repeatedly supplies the first supply. The system performs the supply of the gas and the supply stop, and performs a pulse injection of the gas from the first gas nozzle in a pulsed manner. 如請求項4之圖案形成裝置,其中上述第1氣體供給控制部係自上述塗佈液之噴出即將開始之前開始上述脈衝噴射。 The pattern forming apparatus according to claim 4, wherein the first gas supply control unit starts the pulse injection immediately before the discharge of the coating liquid. 如請求項5之圖案形成裝置,其中上述第1氣體供給控制部係使上述塗佈液之噴出開始以後藉由上述脈衝噴射施加至上述塗佈液之液流之上述氣流之壓力,較上述塗佈液之噴出即將開始之前藉由上述脈衝噴射施加至上述塗佈液之液流之上述氣流之壓力更為增強。 The pattern forming apparatus according to claim 5, wherein the first gas supply control unit compares the pressure of the gas stream applied to the liquid flow of the coating liquid by the pulse jet after the start of the discharge of the coating liquid, The pressure of the gas stream applied to the liquid flow of the coating liquid by the above-described pulse jet is more enhanced immediately before the discharge of the cloth liquid is started. 如請求項4之圖案形成裝置,其中上述第1氣體供給控制部係於上述塗佈液之噴出停止以後停止上述氣體之供給。 The pattern forming apparatus according to claim 4, wherein the first gas supply control unit stops the supply of the gas after the discharge of the coating liquid is stopped. 如請求項7之圖案形成裝置,其中上述第1氣體供給控制部,係使上述塗佈液之噴出停止後藉由上述脈衝噴射施加至上述塗佈液之液流之上述氣流之壓力,較上述塗佈液之噴出即將停止之前藉由上述脈衝噴射施加至上述塗佈液之液流之壓力更為減弱。 The pattern forming apparatus according to claim 7, wherein the first gas supply control unit is configured to cause a pressure of the gas stream applied to the liquid flow of the coating liquid by the pulse jet after the discharge of the coating liquid is stopped, The pressure of the liquid flow applied to the coating liquid by the above-described pulse jet is more weakened immediately before the discharge of the coating liquid is stopped. 如請求項4之圖案形成裝置,其中上述第1氣體供給部更包含第2供給系統,該第2供給系統根據來自上述第1氣體供給控制部之指令,切換對上述第1氣體噴嘴之上述氣體之供給及供給停止,上述第1氣體供給控制部維持上述第2供給系統之上述氣體之供給,對應於上述塗佈液之噴出開始及噴出停止而進行使上述氣體自上述第1氣體噴嘴連續性地噴射之連續噴射。 The pattern forming apparatus according to claim 4, wherein the first gas supply unit further includes a second supply system, and the second supply system switches the gas to the first gas nozzle in response to an instruction from the first gas supply control unit When the supply and the supply are stopped, the first gas supply control unit maintains the supply of the gas in the second supply system, and performs the gas from the first gas nozzle in accordance with the discharge start and the discharge stop of the application liquid. Continuous jet of ground spray. 如請求項9之圖案形成裝置,其中上述第1氣體供給控制部自上 述塗佈液之噴出即將開始之前藉由上述第2供給系統進行連續噴射,並且自上述塗佈液之噴出開始時間點起追加進行上述第1供給系統之脈衝噴射。 The pattern forming apparatus of claim 9, wherein the first gas supply control unit is from the top The continuous injection by the second supply system immediately before the start of the discharge of the coating liquid is performed, and the pulse injection of the first supply system is additionally performed from the discharge start time of the coating liquid. 如請求項9之圖案形成裝置,其中上述第1氣體供給控制部於上述塗佈液之噴出停止後停止上述第2供給系統之連續噴射,並且於上述塗佈液之噴出停止前及噴出停止後之至少一者追加進行上述第1供給系統之脈衝噴射。 The pattern forming apparatus according to claim 9, wherein the first gas supply control unit stops the continuous injection of the second supply system after the discharge of the coating liquid is stopped, and before the discharge of the coating liquid is stopped and after the discharge is stopped At least one of the above-described pulse injection of the first supply system is additionally performed. 如請求項1之圖案形成裝置,其中上述圖案整形設備包含:第2氣體噴嘴,其將第2噴出口朝向形成於上述基板上之圖案而配置;及第2氣體供給部,其將氣體供給至上述第2氣體噴嘴且使上述氣體自上述第2噴出口以脈衝狀噴射;於上述第2噴出口朝向上述圖案之被整形部時,自上述第2噴出口以脈衝狀噴射上述氣體而對上述被整形部進行整形。 The pattern forming apparatus according to claim 1, wherein the pattern shaping device includes: a second gas nozzle disposed to face a pattern formed on the substrate; and a second gas supply unit that supplies gas to The second gas nozzle sprays the gas from the second discharge port in a pulsed manner, and when the second discharge port faces the shaped portion of the pattern, the gas is sprayed from the second discharge port in a pulsed manner. It is shaped by the shaping department. 如請求項12之圖案整形裝置,其包含第2氣體供給控制部,該第2氣體供給控制部控制上述第2氣體供給部對上述第2氣體噴嘴之上述氣體之供給,上述圖案之一端部及另一端部中之至少一者為上述被整形部,上述第2氣體供給控制部於上述被整形部藉由上述基板之相對移動而進入至自上述第2噴出口以脈衝狀噴射上述氣體之區域時,執行上述第2氣體供給部對上述第2氣體噴嘴之上述氣體之供給。 The pattern shaping device according to claim 12, further comprising: a second gas supply control unit that controls supply of the gas to the second gas nozzle by the second gas supply unit, wherein one end of the pattern and At least one of the other end portions is the shaped portion, and the second gas supply control unit enters the region where the gas is pulsed from the second discharge port by the relative movement of the substrate in the shaped portion. At the time of the second gas supply unit, the supply of the gas to the second gas nozzle is performed. 如請求項12之圖案形成裝置,其中噴射上述氣體之時間寬度長於0.1[msec]、且短於5[msec]。 The pattern forming device of claim 12, wherein the time width at which the gas is ejected is longer than 0.1 [msec] and shorter than 5 [msec]. 如請求項14之圖案形成裝置,其中噴射上述氣體之時間寬度短 於2[msec]。 The pattern forming device of claim 14, wherein the time width of the gas is short At 2 [msec]. 如請求項15之圖案形成裝置,其中噴射上述氣體之時間寬度為0.5[msec]以上、且1[msec]以下。 The pattern forming apparatus according to claim 15, wherein the time width at which the gas is ejected is 0.5 [msec] or more and 1 [msec] or less. 如請求項2之圖案形成裝置,其中上述圖案整形設備包含:第2氣體噴嘴,其於上述第1方向上較上述第1氣體噴嘴更靠下游側處,將第2噴出口朝向形成於上述基板上之圖案而配置;及第2氣體供給部,其將氣體供給至上述第2氣體噴嘴且使上述氣體自上述第2噴出口以脈衝狀噴射;於上述第2噴出口朝向上述圖案之被整形部時,自上述第2噴出口以脈衝狀噴射上述氣體而對上述被整形部進行整形。 The pattern forming apparatus according to claim 2, wherein the pattern shaping device includes: a second gas nozzle having a second discharge port facing the downstream side of the first gas nozzle in the first direction; and a second discharge port facing the substrate And a second gas supply unit that supplies gas to the second gas nozzle, and causes the gas to be pulsed from the second discharge port; and the second discharge port is shaped toward the pattern At the time of the part, the shaped portion is shaped by spraying the gas from the second discharge port in a pulsed manner. 如請求項12至17中任一項之圖案形成裝置,其包含圖案硬化部,該圖案硬化部於上述第1方向上較上述第2氣體噴嘴更靠下游側處使上述圖案硬化。 The pattern forming apparatus according to any one of claims 12 to 17, comprising a pattern-cured portion that hardens the pattern on a downstream side of the second gas nozzle in the first direction. 一種圖案形成方法,其特徵在於:其係藉由線狀之塗佈液而於基板之表面形成圖案者,上述線狀之塗佈液係自塗佈液噴嘴之第2噴出口噴出至相對於上述塗佈液噴嘴而於第1方向上相對移動之上述基板之表面,上述圖案形成方法執行以下步驟中之至少一個步驟並控制上述圖案之形狀:第1步驟,其係對應於上述塗佈液之噴出開始及噴出停止中之至少一者,相對於上述塗佈液對上述基板之供給位置而朝向上述第1方向之上游側之上述基板之表面噴射氣體,於上述塗佈液噴嘴之第2噴出口與上述基板之表面之中間對上述塗佈液之液流吹送氣流;及第2步驟,其係對形成於上述基板之表面上之圖案以脈衝狀噴射氣體並進行整形。 A pattern forming method is characterized in that a pattern is formed on a surface of a substrate by a linear coating liquid, and the linear coating liquid is ejected from a second ejection port of the coating liquid nozzle to a relative The pattern forming method performs at least one of the following steps and controls the shape of the pattern by the coating liquid nozzle on the surface of the substrate that relatively moves in the first direction: the first step corresponds to the coating liquid At least one of the discharge start and the discharge stop, the gas is ejected toward the surface of the substrate on the upstream side in the first direction with respect to the supply position of the substrate by the coating liquid, and is the second in the coating liquid nozzle. a flow of the liquid to the coating liquid is blown between the discharge port and the surface of the substrate; and a second step of injecting a gas into the pattern formed on the surface of the substrate in a pulsed manner. 如請求項19之圖案形成方法,其一併執行上述第1步驟及第2步驟。 The pattern forming method of claim 19, wherein the first step and the second step are performed together. 如請求項20之圖案形成方法,其更包括第3步驟,該第3步驟係使經上述第2步驟整形之圖案硬化。 The pattern forming method of claim 20, further comprising a third step of hardening the pattern shaped by the second step.
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