TW201505168A - 有機光電轉換元件及攝像元件 - Google Patents
有機光電轉換元件及攝像元件 Download PDFInfo
- Publication number
- TW201505168A TW201505168A TW103118198A TW103118198A TW201505168A TW 201505168 A TW201505168 A TW 201505168A TW 103118198 A TW103118198 A TW 103118198A TW 103118198 A TW103118198 A TW 103118198A TW 201505168 A TW201505168 A TW 201505168A
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- photoelectric conversion
- organic
- layer
- less
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013110633A JP6128593B2 (ja) | 2013-05-27 | 2013-05-27 | 有機光電変換素子および撮像素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201505168A true TW201505168A (zh) | 2015-02-01 |
Family
ID=51988326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103118198A TW201505168A (zh) | 2013-05-27 | 2014-05-26 | 有機光電轉換元件及攝像元件 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6128593B2 (enrdf_load_stackoverflow) |
TW (1) | TW201505168A (enrdf_load_stackoverflow) |
WO (1) | WO2014192274A1 (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI625634B (zh) * | 2015-06-25 | 2018-06-01 | 華邦電子股份有限公司 | 電子構件的應力估算方法 |
US10317296B2 (en) | 2015-06-25 | 2019-06-11 | Winbond Electronics Corp. | Method for estimating stress of electronic component |
US10756132B2 (en) | 2016-03-29 | 2020-08-25 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5835450B2 (ja) | 2013-11-27 | 2015-12-24 | 株式会社デンソー | 回転機の制御装置 |
JP2017168806A (ja) * | 2015-12-21 | 2017-09-21 | ソニー株式会社 | 撮像素子、固体撮像装置及び電子デバイス |
US11751426B2 (en) * | 2016-10-18 | 2023-09-05 | Universal Display Corporation | Hybrid thin film permeation barrier and method of making the same |
JPWO2023189040A1 (enrdf_load_stackoverflow) * | 2022-03-29 | 2023-10-05 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011228648A (ja) * | 2010-03-31 | 2011-11-10 | Fujifilm Corp | 撮像素子 |
JP2013055117A (ja) * | 2011-09-01 | 2013-03-21 | Fujifilm Corp | 光電変換素子の製造方法、および撮像素子の製造方法 |
JP5730265B2 (ja) * | 2011-10-31 | 2015-06-03 | 富士フイルム株式会社 | 撮像素子 |
JP5800682B2 (ja) * | 2011-10-31 | 2015-10-28 | 富士フイルム株式会社 | 光電変換素子の製造方法、および撮像素子の製造方法 |
-
2013
- 2013-05-27 JP JP2013110633A patent/JP6128593B2/ja active Active
-
2014
- 2014-05-26 WO PCT/JP2014/002746 patent/WO2014192274A1/ja active Application Filing
- 2014-05-26 TW TW103118198A patent/TW201505168A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI625634B (zh) * | 2015-06-25 | 2018-06-01 | 華邦電子股份有限公司 | 電子構件的應力估算方法 |
US10317296B2 (en) | 2015-06-25 | 2019-06-11 | Winbond Electronics Corp. | Method for estimating stress of electronic component |
US10756132B2 (en) | 2016-03-29 | 2020-08-25 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
US12015040B2 (en) | 2016-03-29 | 2024-06-18 | Sony Corporation | Solid-state imaging device, method of manufacturing the same, and electronic apparatus capable to protect a photoelectric conversion film |
Also Published As
Publication number | Publication date |
---|---|
JP2014229854A (ja) | 2014-12-08 |
JP6128593B2 (ja) | 2017-05-17 |
WO2014192274A1 (ja) | 2014-12-04 |
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