TW201444774A - Conveying head of brittle material substrate - Google Patents
Conveying head of brittle material substrate Download PDFInfo
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- TW201444774A TW201444774A TW103101402A TW103101402A TW201444774A TW 201444774 A TW201444774 A TW 201444774A TW 103101402 A TW103101402 A TW 103101402A TW 103101402 A TW103101402 A TW 103101402A TW 201444774 A TW201444774 A TW 201444774A
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- transfer head
- brittle material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
Abstract
Description
本發明係關於一種用於對基板進行吸附並搬送時之搬送頭，該基板係半導體晶圓等之脆性材料基板，具有於縱方向及橫方向陣列地形成之多數個功能區域(亦稱元件區域)，且就每個功能區域裂斷而成之基板。 The present invention relates to a transfer head for adsorbing and transporting a substrate, the substrate being a brittle material substrate such as a semiconductor wafer, having a plurality of functional regions (also referred to as element regions) formed in an array in the longitudinal direction and the lateral direction. ), and the substrate is broken for each functional area.
在專利文獻1中，提及有藉由對形成有刻劃線之基板，從形成有刻劃線之面的背面，沿刻劃線往面垂直地按壓而進行裂斷之基板裂斷裝置。以下，揭示利用如此般之裂斷裝置進行裂斷之概要。在成為裂斷對象之半導體晶圓，陣列地形成有多數個功能區域。在進行分斷之情形，首先，於基板、於功能區域之間隔著等間隔於縱方向及橫方向形成刻劃線。然後，沿該刻劃線利用裂斷裝置進行分斷。圖1(a)表示分斷前載置於裂斷裝置之基板的剖面圖。如該圖所示，於基板101、於功能區域101a、101b之其間形成有刻劃線S1、S2、S3…。在進行分斷之情形，於基板101之背面貼附黏著帶102，且於其表面貼附保護薄膜103。然後，於裂斷時，如圖1(b)所示般，應於承受刀刃105、106之正中間裂斷之刻劃線，於該情形配置刻劃線S2，從其上部使刀片104吻合刻劃線並下降，對基板101進行按壓。以如此方式進行了利用一對承受刀刃105、106與刀片104之三點彎曲之裂斷。 Patent Document 1 mentions a substrate breaking device which is formed by cutting a substrate having a score line from a back surface on which a scribed line is formed, and pressing it perpendicularly along a scribe line. In the following, an outline of the cracking by using such a cracking device will be disclosed. In the semiconductor wafer to be a cracked object, a plurality of functional regions are formed in an array. In the case of breaking, first, a scribe line is formed on the substrate at equal intervals in the longitudinal direction and the lateral direction at intervals in the functional region. Then, along the scribe line, the breaking device is used for breaking. Fig. 1(a) is a cross-sectional view showing a substrate placed on a cracking device before breaking. As shown in the figure, scribe lines S1, S2, S3, . . . are formed on the substrate 101 between the functional regions 101a and 101b. In the case of breaking, the adhesive tape 102 is attached to the back surface of the substrate 101, and the protective film 103 is attached to the surface. Then, at the time of the cracking, as shown in Fig. 1(b), the scribe line should be cut at the middle of the cutting edge of the cutting edges 105, 106. In this case, the scribe line S2 is arranged, and the blade 104 is fitted from the upper portion thereof. The substrate 101 is pressed by scribing and descending. In this manner, the breakage of the three points of the blade 105, 106 and the blade 104 is utilized.
專利文獻1：日本特開第2004-39931號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-39931
在使用具有如此般構成之裂斷裝置，對呈格子狀地形成有刻劃線之基板進行裂斷後，格子狀之功能區域與成為周圍之端材之不要部分分離殘留。功能區域係LED，且在其表面突出形成有透鏡(lens)之情形，由於無法進行真空吸附，因此存在有難以僅將功能區域一起進行搬送之問題點。 When the substrate having the scribe line formed in a lattice shape is broken by using the cracking device having such a configuration, the lattice-shaped functional region is separated from the unnecessary portion of the peripheral material. The functional area is an LED, and a lens is formed on the surface thereof. Since vacuum adsorption is not possible, there is a problem that it is difficult to transport only the functional areas together.
本發明係著眼於如此般之問題點而完成者，目的在於提供一種能夠僅對經裂斷之功能區域的部分在維持該狀態下進行搬送之搬送頭。 The present invention has been made in view of such a problem, and an object thereof is to provide a transfer head capable of transporting only a portion of a split functional region while maintaining the state.
為了解決該問題，本發明之搬送頭，係用於搬送脆性材料基板，該脆性材料基板係於一面具有於縱方向及橫方向以既定之間距形成之功能區域，且沿以功能區域位於中心之方式呈格子狀地形成之刻劃線被裂斷；該搬送頭具備頭部、以及將該頭部保持成上下移動自如之滑件機構；該頭部，具備：頂板；基座板，係在與該頂板之間形成氣密之空洞，在不與該頂板相接之表面，具有配列成與該脆性材料基板之功能區域對應並與該空洞連通之開口；以及彈性片，係貼附於該基座板之不與該頂板相接之表面，具有配列於與基座板之開口對應之位置之開口。 In order to solve this problem, the transfer head of the present invention is for transporting a brittle material substrate having a functional region formed at a predetermined distance in the longitudinal direction and the lateral direction on one side, and centered on the functional region. The pattern is formed in a lattice shape and the score line is broken; the transfer head has a head portion, and a slider mechanism that holds the head portion up and down to move freely; the head portion includes: a top plate; the base plate is attached to Forming a gas-tight cavity with the top plate, and having an opening arranged to correspond to a functional region of the brittle material substrate and communicating with the cavity on a surface not in contact with the top plate; and an elastic piece attached to the surface The surface of the base plate that is not in contact with the top plate has an opening that is disposed at a position corresponding to the opening of the base plate.
此處，亦可為：該脆性材料基板，係以於表面形成有透鏡之LED為功能區域之LED基板；設於該彈性片之開口，係具有較該LED晶片之各透鏡為大之徑長。 Here, the brittle material substrate may be an LED substrate having a lens on which a lens is formed as a functional region; and the opening provided in the elastic sheet may have a larger diameter than each lens of the LED chip. .
此處，該頭部亦可為透過彈性連結構件與該滑件機構之下部連接。 Here, the head may also be connected to the lower portion of the slider mechanism through the elastic connecting member.
根據具有如此般之特徵之本發明，能夠藉由使搬送頭之彈性片抵接於沿刻劃線裂斷之基板而僅吸附功能區域。因此可獲得能夠利用搬送頭僅將功能區域之部分一起進行搬送之效果。 According to the present invention having such a feature, it is possible to adsorb only the functional region by bringing the elastic sheet of the transfer head into contact with the substrate which is broken along the score line. Therefore, it is possible to obtain an effect that only a part of the functional area can be transported together by the transfer head.
10‧‧‧基板 10‧‧‧Substrate
11‧‧‧功能區域 11‧‧‧ functional area
12‧‧‧線狀突起 12‧‧‧Linear protrusion
20‧‧‧搬送頭 20‧‧‧Transfer head
21‧‧‧吊架基座 21‧‧‧ hanger base
22‧‧‧吊架 22‧‧‧ hanger
23、24‧‧‧吊架托架 23, 24‧‧‧ hanger bracket
25‧‧‧線性滑件 25‧‧‧Linear sliders
26a、26b‧‧‧針閥 26a, 26b‧‧‧ needle valve
31‧‧‧基座板 31‧‧‧Base plate
32‧‧‧頂板 32‧‧‧ top board
33‧‧‧密封橡膠 33‧‧‧ Sealing rubber
34‧‧‧空隙 34‧‧‧ gap
35‧‧‧彈性片 35‧‧‧Elastic film
36‧‧‧開口 36‧‧‧ openings
37‧‧‧管接頭 37‧‧‧ pipe joint
38a~38d‧‧‧臂 38a~38d‧‧‧ Arm
41‧‧‧上部板 41‧‧‧ upper board
42a~42d‧‧‧球柱塞 42a~42d‧‧‧ ball plunger
43‧‧‧側板 43‧‧‧ side panels
44‧‧‧罩板 44‧‧‧ hood
圖1，係表示習知的基板之裂斷時之狀態的剖面圖。 Fig. 1 is a cross-sectional view showing a state in which a conventional substrate is broken.
圖2，係表示經裂斷之基板之一例的前視圖及部分剖面圖。 Fig. 2 is a front view and a partial cross-sectional view showing an example of a fractured substrate.
圖3，係表示本發明之實施形態之搬送頭的立體圖。 Fig. 3 is a perspective view showing a transfer head according to an embodiment of the present invention.
圖4，係本實施形態之搬送頭的前視圖。 Fig. 4 is a front elevational view of the transfer head of the embodiment.
圖5，係表示切除本實施形態之搬送頭之一部分的側視圖。 Fig. 5 is a side view showing a part of the transfer head of the embodiment.
圖6，係本實施形態之搬送頭的仰視圖。 Fig. 6 is a bottom view of the transfer head of the embodiment.
在本發明之實施形態中，成為裂斷對象之基板10，如於圖2中所示之前視圖及其部分剖面圖般，係為在製造步驟中沿x軸與y軸以一定間距形成有多數個功能區域11之基板。該功能區域11，例如為具有作為LED之功能的區域，且於各功能區域，於各個表面形成有LED之圓形的透鏡。而且，為了就各功能區域進行分斷而形成LED晶片，藉由刻劃裝置以各功能區域位於中心之方式，形成縱方向之刻劃線Sy1~Syn與橫方向之刻劃線Sx1~Sxm相互正交。因此該等刻劃線Sx1~Sxm、刻劃線Sy1~Syn之間距，係功能區域之x軸與y軸方向之間距為相同。而且，於該基板10之刻劃線Sx1、Sxm、Sy1、Syn之內側，於搬送基板時雖填充矽樹脂，但為了使該矽樹脂留於形成有LED之功能區域之範圍，而在功能區域之外側之周圍形成有較基板10 之表面稍微高之線狀之突起12。 In the embodiment of the present invention, the substrate 10 to be cracked is formed as a front view and a partial cross-sectional view thereof as shown in FIG. 2, and a majority is formed at a certain interval along the x-axis and the y-axis in the manufacturing step. The substrate of the functional area 11. The functional area 11 is, for example, a region having a function as an LED, and a circular lens of an LED is formed on each surface in each functional region. Further, in order to form the LED chips by dividing the functional regions, the scribing means forms the scribe lines S y1 to S yn in the longitudinal direction and the scribe lines S x1 in the lateral direction so that the functional regions are located at the center. ~S xm are orthogonal to each other. Thus these scribe line S x1 ~ S xm, score line S y1 ~ S yn of the pitch, the pitch of the line x-axis and the functional area of the y-axis direction are the same. Further, inside the scribe lines S x1 , S xm , S y1 , and Syn on the substrate 10 , the resin is filled while the substrate is being transferred, but the resin is left in the functional region in which the LED is formed. Further, a linear protrusion 12 having a slightly higher surface than the surface of the substrate 10 is formed around the outer side of the functional region.
該基板10藉由裂斷裝置沿刻劃線裂斷。經裂斷之下一刻之基板10，雖沿刻劃線分斷但並不分離。亦即，已分斷之基板10，由成為外周之端材之不要部分、與外周以外之格子狀之多數個LED晶片之部分構成。 The substrate 10 is broken along the score line by a breaking device. The substrate 10 at the moment of the break is broken along the score line but is not separated. That is, the divided substrate 10 is composed of a portion which is an unnecessary portion of the outer peripheral end material and a plurality of LED chips which are lattice-shaped outside the outer periphery.
接著，針對該發明之實施形態之用以僅吸引LED晶片之部分的搬送頭進行說明。圖3係表示搬送頭之立體圖，圖4係前視圖，圖5係表示切除其一部分的搬送頭之側視圖、圖6係其仰視圖。 Next, a transfer head for sucking only a portion of an LED chip according to an embodiment of the present invention will be described. Fig. 3 is a perspective view showing a transfer head, Fig. 4 is a front view, Fig. 5 is a side view showing a transfer head partially cut away, and Fig. 6 is a bottom view thereof.
此外，在位於搬送機構之上部的橋部，設置使搬送頭於水平方向移動之未圖示之線性滑件。於圖3表示有安裝於線性滑件之搬送頭20。如圖示般，大致L字狀之吊架(hanger)22與大致正方形狀之水平方向之吊架基座21垂直地連接。於吊架22之側方連接長方形狀之吊架托架23，於吊架托架23進一步地以疊於其面之方式安裝長方形狀之吊架托架24。於該吊架托架24設置上下移動自如之線性滑件25。線性滑件25係於上方向與下方向之2個方向分別可流入空氣流，藉由切換該流入而成為上下移動自如。而且，於線性滑件25安裝一對針閥(needle valve)26a、26b。能夠藉由調整該等之針閥26a、26b而控制空氣之流入量，且設定往上方向之移動速度與往下方向之移動速度。此處，線性滑件25與針閥26a、26b構成將頭部保持成上下移動自如之滑件機構。 Further, a linear slider (not shown) that moves the transport head in the horizontal direction is provided in the bridge portion located above the transport mechanism. Fig. 3 shows a transfer head 20 attached to a linear slider. As shown in the figure, a substantially L-shaped hanger 22 is vertically connected to a substantially square-shaped hanger base 21 in the horizontal direction. A rectangular hanger bracket 23 is connected to the side of the hanger 22, and a rectangular hanger bracket 24 is further attached to the hanger bracket 23 so as to be stacked on the surface. The hanger bracket 24 is provided with a linear slider 25 that is movable up and down. The linear slider 25 is capable of flowing into the air flow in two directions of the upper direction and the lower direction, and is movable up and down by switching the inflow. Further, a pair of needle valves 26a, 26b are attached to the linear slider 25. The inflow amount of the air can be controlled by adjusting the needle valves 26a and 26b, and the moving speed in the upward direction and the moving speed in the downward direction can be set. Here, the linear slider 25 and the needle valves 26a and 26b constitute a slider mechanism that holds the head up and down.
而且，在該滑件25之下方設置頭部30。接著，在頭部30之下方，如圖3~5所示，具有長方形狀之基座板31、及與此大致相同形狀之頂板32。基座板31與頂板32在相對向之面之各個中央部分形成窪部，其等之間為了保持氣密而透過環狀之密封橡膠33接著。而且，藉由各個窪 部與密封橡膠33形成有氣密的空隙34。在基座板31，如圖6之搬送頭之仰視圖所示般，於對角線上之角之位置設置有引導用之開口31a、31b。該開口31a、31b係藉由插入往基板上突出之銷，而能夠使該頭部30相對於基板正確地定位。在基座板31之下面呈格子狀地設置有以與經裂斷之基板之功能區域對應之方式陣列於xy方向之多數個開口。 Further, a head portion 30 is provided below the slider 25. Next, below the head portion 30, as shown in Figs. 3 to 5, a rectangular base plate 31 and a top plate 32 having substantially the same shape are provided. The base plate 31 and the top plate 32 form a weir portion at each central portion of the opposing surface, and the like is passed through the annular seal rubber 33 in order to maintain airtightness. And, with each The portion and the seal rubber 33 form an airtight gap 34. In the base plate 31, as shown in the bottom view of the transfer head of Fig. 6, openings 31a and 31b for guiding are provided at positions on the diagonal corners. The openings 31a, 31b are capable of correctly positioning the head 30 relative to the substrate by inserting a pin projecting onto the substrate. A plurality of openings arrayed in the xy direction so as to correspond to the functional regions of the cracked substrate are provided in a lattice shape on the lower surface of the base plate 31.
在基座板31之下面貼附有橡膠等之彈性片35。在彈性片35除了4邊之外周部以外呈格子狀地設置有以與經裂斷之基板之功能區域對應之方式陣列於xy方向之多數個開口36。該等之開口36具有較形成於功能區域之LED之透鏡之徑長略大之徑長，且構成為在將處於已裂斷之基板10之功能區域之LED晶片一起吸引時，LED之透鏡不直接與彈性片35接觸。 An elastic piece 35 such as rubber is attached to the lower surface of the base plate 31. A plurality of openings 36 arrayed in the xy direction so as to correspond to the functional regions of the cracked substrate are provided in a lattice shape in addition to the peripheral portions of the elastic piece 35. The openings 36 have a path length slightly larger than the diameter of the lens of the LED formed in the functional area, and are configured such that when the LED chips in the functional region of the cracked substrate 10 are attracted together, the lens of the LED is not Directly in contact with the elastic piece 35.
此外，該彈性片35之開口36透過設置於基座板31之相同位置之開口與氣密之空隙34連結。在頂板32之上面於4個部位設置管接頭37，且與空隙34相通。該管接頭37透過未圖示之管而與真空吸附裝置連結，藉由驅動真空吸附裝置而能夠從開口36使空氣噴出、或吸引空氣。 Further, the opening 36 of the elastic piece 35 is coupled to the airtight gap 34 through an opening provided at the same position of the base plate 31. A pipe joint 37 is provided at four places on the top of the top plate 32, and communicates with the gap 34. The pipe joint 37 is connected to a vacuum suction device through a pipe (not shown), and by driving the vacuum suction device, air can be ejected or sucked from the opening 36.
而且，在頂板32之上方垂直地設置4個臂38a~38d，透過該等之臂38a~38d水平地設置上部板41。在上部板41之上面突出保持有圖5所示之球柱塞42a、42b及未圖示之球柱塞42c、42d。球柱塞係具有球、及設於其下方之彈簧，且在既定範圍將球保持成上下移動自如。球柱塞之各球與上部之側板43抵接。側板43由保持其外周之框狀之罩板44保持。而且，即使搬送頭20在稍微傾斜之情形球柱塞任何之彈簧之收縮程度亦產生變化，因此構成為能夠彈性地調整搬送頭20之稍微的角度變動。上部板41 與球柱塞42a~42d及罩板44，構成使頭部30與滑件機構之下部連接之彈性連結構件。 Further, four arms 38a to 38d are vertically disposed above the top plate 32, and the upper plate 41 is horizontally disposed through the arms 38a to 38d. The ball plungers 42a and 42b and the ball plungers 42c and 42d (not shown) shown in Fig. 5 are protruded from the upper surface of the upper plate 41. The ball plunger has a ball and a spring disposed below it, and the ball is held up and down in a predetermined range. Each ball of the ball plunger abuts against the upper side plate 43. The side plate 43 is held by a cover plate 44 that retains its outer circumference. Further, even if the transfer head 20 is slightly inclined, the degree of contraction of any of the springs of the ball plunger changes, so that a slight angular variation of the transfer head 20 can be flexibly adjusted. Upper plate 41 The ball plungers 42a to 42d and the cover plate 44 constitute an elastic coupling member that connects the head portion 30 to the lower portion of the slider mechanism.
此外，針對使用該搬送頭20對經裂斷之基板進行搬送之情形進行說明。首先，如圖2所示，對經刻劃之基板藉由裂斷裝置從基板10之刻劃線之正上方往下壓而進行裂斷。然後，藉由沿刻劃線Sx1~Sxm反覆進行裂斷而可成為細長之分斷片，進一步地，藉由沿刻劃線Sy1~Syn反覆進行裂斷而可生成個別的LED晶片。 In addition, a case where the split substrate is transported by the transfer head 20 will be described. First, as shown in FIG. 2, the scribed substrate is ruptured by being pressed downward from the scribe line of the substrate 10 by the rupture means. Then, the slits can be formed by repeatedly slashing along the scribe lines S x1 to S xm , and further, the individual LED chips can be formed by repeatedly slashing along the scribe lines S y1 to S yn . .
接著，在對位於該基板10之功能區域之LED晶片進行搬送之情形，使搬送頭20吻合已裂斷之基板並加以固定。此時，在搬送頭20相對於基板10從上部往下降時，稍微之傾斜或位置錯位能夠由球柱塞42a~42d吸收。此時，頭部30之最下部之彈性片35之開口36與LED之透鏡部對應。而且，藉由從各開口36吸引空氣而能夠僅吸引基板10之功能區域。然後，藉由將搬送頭20在維持該狀態下往上抬而能夠將經裂斷之基板之功能區域、亦即LED晶片群往上抬。 Next, in the case where the LED wafer located in the functional region of the substrate 10 is transported, the transfer head 20 is brought into conformity with the cracked substrate and fixed. At this time, when the transfer head 20 is lowered from the upper portion with respect to the substrate 10, a slight inclination or a positional displacement can be absorbed by the ball plungers 42a to 42d. At this time, the opening 36 of the lowermost elastic piece 35 of the head portion 30 corresponds to the lens portion of the LED. Moreover, only the functional area of the substrate 10 can be attracted by sucking air from the respective openings 36. Then, by moving the transfer head 20 up while maintaining the state, the functional region of the cracked substrate, that is, the LED chip group can be lifted up.
然後，在該狀態下使搬送頭整體往x軸方向或y軸方向移動而能夠將LED晶片群搬送往所希望之位置。 Then, in this state, the entire transport head is moved in the x-axis direction or the y-axis direction, and the LED chip group can be transported to a desired position.
在該實施形態中，雖針對將具有於上面擁有透鏡之功能區域的LED基板之LED晶片一起進行搬送之例進行說明，但本發明不僅可適用於在表面擁有透鏡之晶片，尤其是對於具有未有任何突出之功能區域之晶片亦可適用，此外，亦可適用於將具有擁有透鏡以外之突起物之功能區域之晶片一起進行搬送之搬送頭。 In this embodiment, an example is described in which an LED chip having an LED substrate having a functional region of a lens is transported together. However, the present invention can be applied not only to a wafer having a lens on its surface, but particularly to having an A wafer having any outstanding functional area can also be applied, and it can also be applied to a transfer head in which a wafer having a functional region having a projection other than a lens is transported together.
此外，在該實施形態中，在頭部之上部、在滑件機構之間雖 設置有彈性連結機構，但並不一定要設置彈性連結機構。 Further, in this embodiment, although the upper part of the head is between the slider mechanisms, An elastic coupling mechanism is provided, but it is not necessary to provide an elastic coupling mechanism.
本發明能夠僅吸附在裂斷脆性材料基板之後呈格子狀地配置之功能區域並往必要之位置進行搬送，能夠很有效果地應用於晶片群之搬送裝置。 According to the present invention, it is possible to adsorb only the functional regions arranged in a lattice shape after the cracked brittle material substrate and transport them to a necessary position, and it is possible to be applied to a wafer group transfer apparatus with great efficiency.
20‧‧‧搬送頭 20‧‧‧Transfer head
21‧‧‧吊架基座 21‧‧‧ hanger base
22‧‧‧吊架 22‧‧‧ hanger
24‧‧‧吊架托架 24‧‧‧ hanger bracket
25‧‧‧線性滑件 25‧‧‧Linear sliders
30‧‧‧頭部 30‧‧‧ head
31‧‧‧基座板 31‧‧‧Base plate
32‧‧‧頂板 32‧‧‧ top board
33‧‧‧密封橡膠 33‧‧‧ Sealing rubber
38a、38b‧‧‧臂 38a, 38b‧‧‧ arms
41‧‧‧上部板 41‧‧‧ upper board
44‧‧‧罩板 44‧‧‧ hood
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013114484A JP6163881B2 (en) | 2013-05-30 | 2013-05-30 | Brittle material substrate transfer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201444774A true TW201444774A (en) | 2014-12-01 |
Family
ID=52092839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103101402A TW201444774A (en) | 2013-05-30 | 2014-01-15 | Conveying head of brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6163881B2 (en) |
| KR (1) | KR20140142133A (en) |
| CN (1) | CN104210846A (en) |
| TW (1) | TW201444774A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343507A (en) * | 1992-06-10 | 1993-12-24 | Fujitsu Ltd | Electrostatic attraction method |
| JP3232972B2 (en) * | 1995-08-31 | 2001-11-26 | セイコーエプソン株式会社 | Semiconductor container transfer device and semiconductor container transfer method |
| KR100591710B1 (en) * | 2004-04-20 | 2006-06-22 | 미래산업 주식회사 | Tray Feeder |
| JP2007243088A (en) * | 2006-03-13 | 2007-09-20 | Sumitomo Metal Electronics Devices Inc | Multilayer ceramic substrate and its manufacturing method |
| JP4746579B2 (en) * | 2007-03-29 | 2011-08-10 | シャープ株式会社 | Low load conveyor |
| JP5001074B2 (en) * | 2007-06-20 | 2012-08-15 | 株式会社ディスコ | Wafer transport mechanism |
| JP4544282B2 (en) * | 2007-09-14 | 2010-09-15 | ソニー株式会社 | Data processing apparatus, data processing method, and program |
| KR100959372B1 (en) * | 2008-03-24 | 2010-05-24 | 미래산업 주식회사 | Transferring Semiconductor, Handler having the same, and Method of Manufacturing Semiconductor using the same |
| JP2010118424A (en) * | 2008-11-12 | 2010-05-27 | Disco Abrasive Syst Ltd | Conveying device for thin plate type workpiece |
| CN201540830U (en) * | 2009-10-30 | 2010-08-04 | 天津三星电机有限公司 | Device for inputting substrate in chip capacitor substrate cutting device |
| CN201614177U (en) * | 2009-12-21 | 2010-10-27 | 黎科 | Non-contact loading device |
| KR101135546B1 (en) * | 2010-02-12 | 2012-04-13 | 삼성모바일디스플레이주식회사 | Transfer apparatus for cell made organic light emitting diode display panel |
| JP2012004159A (en) * | 2010-06-14 | 2012-01-05 | Panasonic Corp | Suction collet |
| JP2013078810A (en) * | 2011-10-03 | 2013-05-02 | Smc Corp | Vacuum suction apparatus |
-
2013
- 2013-05-30 JP JP2013114484A patent/JP6163881B2/en not_active Expired - Fee Related
-
2014
- 2014-01-15 TW TW103101402A patent/TW201444774A/en unknown
- 2014-02-12 KR KR20140015921A patent/KR20140142133A/en not_active Application Discontinuation
- 2014-04-10 CN CN201410144018.9A patent/CN104210846A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014236013A (en) | 2014-12-15 |
| JP6163881B2 (en) | 2017-07-19 |
| KR20140142133A (en) | 2014-12-11 |
| CN104210846A (en) | 2014-12-17 |
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