TW201444015A - Method of peeling substrate and substrate peeling device - Google Patents

Abstract

The present invention provides a method of peeling substrate. According to the method of peeling substrate, it comprises the following steps: a step to form the combined body of substrate, the combined body of substrate comprises a first substrate and a second flexible substrate combined with the first substrate, and is divided into a first region and a second region; a step to mount the combined body of substrate on the working stage; a first laser scanning step to irradiate a laser beam onto the first region; a step to measure the distance between a distance measurement part configured on the combined body of substrate and the combined body of substrate; a step to change the focal point position of the laser with respect to the distance between the distance measurement part and the combined body of substrate; a second laser scanning step to irradiate a laser beam onto the second region.

Description

Substrate peeling method and substrate peeling device

The present invention relates to a substrate peeling method and a substrate peeling device, and more particularly to a substrate peeling method using a laser and a substrate peeling device.

When manufacturing a flexible display device, a structure for forming a flexible display device on a carrier substrate having a relatively low softness can be manufactured for the convenience of manufacturing. The carrier substrate supports the structure of the flexible display device, so that the manufacturing process of the flexible display device can be facilitated. In the manufacturing process of the flexible display device, the carrier substrate is separated from the structure of the flexible display device, and the substrate peeling device can be used as the structure for separating the carrier substrate and the flexible display device.

The substrate peeling device is for separating the substrates bonded to each other in the substrate combination or removing the film bonded to the substrate from the substrate. In order to peel off the substrate, the substrate peeling device can use a laser. The substrate is irradiated to the substrate so that the bonding force between the substrates or between the layers of the substrate and the peeled article can be weakened.

The amplitude of the laser is smaller than the amplitude of the substrates bonded to each other, and it is impossible to illuminate all areas of the bonded substrates by one laser scanning. At this time, in order to separate the substrates bonded to each other, the laser scanning can be performed several times. When laser scanning is performed only in a partial region of the substrate assembly, the substrate of the laser-scanned region can be separated, and the substrate of the region not subjected to the laser scanning cannot be separated. When the substrate assembly includes a flexible substrate, the outer shape of the substrate changes due to the soft substrate separated from the other substrate only in a partial region. Therefore, the arrangement of the substrate assembly changes. As the configuration of the substrate assembly is changed, the area where the laser is focused in the substrate in combination with the substrate changes, and therefore, the substrate cannot be smoothly separated.

An object of the present invention is to provide a substrate peeling method capable of smoothly separating a substrate by changing a region where a laser focus is in a substrate bond.

Another object to be solved by the present invention is to provide a substrate peeling apparatus capable of smoothly separating a substrate by changing a region where a laser focus is in a substrate bonded body.

The subject matter of the present invention is not limited to the above-described technical problems, and those skilled in the art will clearly understand the other technical problems that are not mentioned.

In order to solve the problem, a substrate peeling method according to an embodiment of the present invention includes: a step of forming a substrate assembly, the substrate assembly including a first substrate and a flexible second substrate bonded to the first substrate, the first being divided into a region and a second region; a step of mounting the substrate assembly on the table; a first laser scanning step of irradiating the first region with a laser; and measuring a distance between the distance measuring portion and the substrate assembly disposed on the substrate assembly a step of distance; a step of changing a focus position of the laser corresponding to a distance between the distance measuring portion and the substrate combination; and a second laser scanning step of irradiating the second region with a laser.

In order to solve the above problems, a substrate stripping apparatus according to another embodiment of the present invention includes: a laser output portion that irradiates a laser to a substrate assembly including a first substrate and a flexible second substrate bonded to the first substrate; The substrate is mounted on the upper portion; the distance measuring unit is disposed on the substrate assembly for measuring the distance from the substrate assembly; and the control unit changes the distance between the distance measuring unit and the substrate assembly to change the laser. Focus position.

Specific matters of other embodiments are included in the detailed description and drawings.

Embodiments according to the present invention have at least the following effects.

That is, the substrate can be smoothly peeled off by easily changing the area of the laser focus in the substrate assembly.

Further, by easily changing the area of the laser focus in the substrate assembly, it is possible to reduce the damage of the substrate which occurs when the substrate is peeled off.

The effects of the present invention are not limited to the above, and the present invention encompasses a wide variety of effects.

S10~S80. . . step

10. . . Substrate combination

11. . . First substrate

12. . . Second substrate

12a. . . Main substrate

12b. . . Auxiliary layer

13. . . Adhesive layer

13a. . . First adhesive layer

13b. . . Second bonding layer

20. . . Substrate stripping device

twenty one. . . Workbench

twenty two. . . Laser output

twenty three. . . Distance measurement department

23a. . . First distance measuring unit

23b. . . Second distance measuring unit

twenty four. . . Control department

R1. . . First area

R2. . . Second area

dL. . . Amplitude

dS. . . Amplitude

TL. . . Test light

Da. . . distance

Db. . . distance

L1. . . First laser

F1. . . First focus

Da`. . . distance

Db`. . . distance

F2. . . Second focus

L2. . . Second laser

R2C. . . central

Fig. 1 is a flow chart showing a substrate peeling method according to an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a substrate assembly according to an embodiment of the present invention.

Fig. 3 is a plan view of a substrate assembly in accordance with an embodiment of the present invention.

Fig. 4 is a view showing a step of mounting a substrate assembly according to an embodiment of the present invention on a workbench.

Fig. 5 is a block diagram of a substrate peeling apparatus according to an embodiment of the present invention.

Fig. 6 is a perspective view showing a substrate assembly in which a substrate peeling device is disposed according to an embodiment of the present invention.

Fig. 7 is a view showing a step of measuring the distance between the distance measuring unit and the substrate assembly according to an embodiment of the present invention.

8 and 9 are diagrams showing a first laser scanning step in accordance with an embodiment of the present invention.

Fig. 10 is a view showing a substrate assembly after the first laser scanning.

Figure 11 is a view showing a step of measuring the distance between the distance measuring portion and the substrate assembly after the first laser scanning according to an embodiment of the present invention.

Figure 12 is a diagram showing the steps of adjusting the focus position of a laser according to an embodiment of the present invention.

Figures 13 and 14 are diagrams showing a second laser scanning step in accordance with an embodiment of the present invention.

Fig. 15 is a view showing the substrate assembly after the second laser scanning.

Figure 16 is a diagram showing the steps of adjusting the focus position of the laser and the second laser scanning step according to other embodiments of the present invention.

Fig. 17 is a view showing a step of adjusting a focus position of a laser and a second laser scanning step according to still another embodiment of the present invention.

Figure 18 is a diagram showing the steps of adjusting the focus position of the laser and the second laser scanning step according to still another embodiment of the present invention.

Advantages, features, and methods of the present invention will become more apparent from the accompanying drawings and embodiments. However, the present invention is not limited to the following embodiments, and can be embodied in various different forms. This embodiment is provided to make the content of the present invention more complete and to provide the scope of the invention to those skilled in the art to which the invention belongs. The invention is defined by the scope of the patent application.

An element or layer refers to the "on" of another element or layer including the case where other layers or other elements are placed on or in the middle of other elements. The same constituent elements are denoted by the same reference numerals throughout the specification.

Although the first, second, etc. are used to represent various constituent elements, these terms are not limited to constituent elements. These terms are used to distinguish one constituent element from another constituent element. Therefore, the first constituent element described below may also be the second constituent element within the technical idea of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a flow chart showing a substrate peeling method according to an embodiment of the present invention.

According to FIG. 1, the substrate peeling method may include a step of forming a substrate assembly (S10), a step of mounting a substrate assembly on a table (S20), and a step of measuring a distance between the distance measuring portion and the substrate assembly. (S30); a first laser scanning step (S40); a step of measuring a distance between the distance measuring portion and the substrate assembly after the first laser scanning (S50); and a step of adjusting the focus position of the laser (S60) a second laser scanning step (S70); a step of separating the first substrate and the second substrate (S80).

Hereinafter, a step (S10) of forming a substrate assembly will be described with reference to FIGS. 2 and 3 . Fig. 2 is a cross-sectional view showing a substrate assembly according to an embodiment of the present invention. Fig. 3 is a plan view of a substrate assembly in accordance with an embodiment of the present invention. According to FIG. 2, the substrate assembly 10 may include a first substrate 11, a second substrate 12, and an adhesive layer 13.

The first substrate 11 may be formed of an optically transparent material, and may be formed of at least a material capable of transmitting laser light L. For example, the first substrate 11 may be formed of glass or a transparent synthetic resin. The first substrate 11 is less curved with respect to the second substrate 12 and can be used as a carrier substrate for supporting the second substrate 12, but is not limited thereto.

The second substrate 12 can be disposed on the first substrate 11 . The second substrate 12 may be bonded to the first substrate 11. The second substrate 12 may be a substrate having a softness. The second substrate 12 may be a substrate for forming a display panel of a flexible display device, but is not limited thereto. When the second substrate 12 is a substrate for forming a display panel of a flexible display device, although not shown in the drawing, the second substrate 12 may include therein a display layer for displaying an image and for controlling the display layer. A thin film transistor layer of a thin film transistor. The second substrate 12 may be a substrate for forming a flexible organic light-emitting display panel, a liquid crystal display panel, or an electrophoretic display panel, but is not limited thereto. The second substrate 12 may be formed on the first substrate 11. When the soft second substrate 12 is formed on the first substrate 11 having a relatively small degree of curvature, the shape of the second substrate 12 is prevented from being deformed, and the second substrate 12 can be formed more easily.

The second substrate 12 may include a main substrate 12a and an auxiliary layer 12b. The main substrate 12a may include a display layer and a thin film transistor layer. The auxiliary layer 12b may be disposed on the main substrate 12a. The auxiliary layer 12b can be adhered to the main substrate 12a. Although not shown, the auxiliary layer 12b can be adhered to the main substrate 12a through the adhesive layer. The auxiliary layer 12b is disposed on the upper portion of the main substrate 12a, and supports the main substrate 12a after separating the first substrate 11 and the second substrate 12, thereby preventing the movement of the main substrate 12b and facilitating subsequent processes. Moreover, the auxiliary layer 12b can protect the main substrate 12 from the outside. The auxiliary layer 12b may cover the side surface of the main substrate 12, and may be coupled to the first substrate 11 through a second adhesive layer 13b to be described later. The auxiliary layer 12b may comprise plastics such as polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, and the like, and stainless steel. A metal foil or the like is formed, but is not limited thereto.

The adhesive layer 13 may be disposed between the first substrate 11 and the second substrate 12. The adhesive layer 13 can bond the first substrate 11 and the second substrate 12. Due to the laser, at least a partial region of the adhesive layer 13 is weakened in combination with the adhesion of the first substrate 11 and the second substrate 12.

The adhesive layer 13 may include a first adhesive layer 13a and a second adhesive layer 13b. The first adhesive layer 13a is disposed inside the substrate assembly 10 than the second adhesive layer 13b. In more detail, the first adhesive layer 13a may be disposed between the main substrate 12a and the first substrate 11. When the laser is irradiated on the first adhesive layer 13a, the constituent material is deformed, and therefore, the bonding force in combination with the first substrate 11 and the second substrate 12 becomes weak. For example, the first adhesive layer 13a may be formed of a photodegradable polymer material, yttrium hydride or hydrogenated amorphous yttrium, but is not limited thereto. When the first adhesive layer 13a is formed of a photodegradable polymer material, if the laser is irradiated onto the first adhesive layer 13a, the covalent bond of the polymer substance is broken or carbonized, and the first adhesive layer 13a is break down. When the first adhesive layer 13a is formed of hydrogenated hafnium nitride or hydrogenated amorphous germanium, if the laser is irradiated onto the first adhesive layer 13a, hydrogen contained in the hydrogenated tantalum nitride or hydrogenated amorphous germanium is discharged while The bonding force between the first adhesive layer 13a and the first substrate 11 is weakened, and the first substrate 11 and the second substrate 12 can be easily separated.

The second adhesive layer 13b may be disposed outside the substrate assembly 10 than the first adhesive layer 13a. The second adhesive layer 13b may be disposed at the periphery of the substrate assembly 11. In more detail, the second adhesive layer 13b is disposed between the auxiliary layer 12b and the first substrate 11, and the auxiliary layer 12b and the first substrate 11 may be bonded. Even if the laser is irradiated, the adhesion of the second adhesive layer 13b does not become weak.

Although not shown in the figure, the substrate assembly may further include an adhesive layer between the adhesive layer 13 and the first substrate 11 in order to assist the bonding of the first substrate 11 and the second substrate 12.

Referring to FIG. 3, the substrate assembly 10 can be divided into a first region R1 and a second region R2. The first region R1 is a region of the substrate assembly 10 that irradiates the laser in the first laser scanning step (S40), and the second region R2 is the substrate assembly 10 that irradiates the laser in the second laser scanning step (S70). region. In the laser scanning, when the amplitude dL of the laser is smaller than the amplitude dS of the substrate assembly 10, the laser cannot be irradiated to the entire area of the substrate assembly 10 by one laser scanning, and therefore, the substrate assembly 10 is divided into the first. The region R1 and the second region R2 are subjected to laser scanning twice. Even if the laser scanning is performed twice, the laser cannot be irradiated to the entire area of the substrate assembly 10, and laser scanning can be further performed. The substrate assembly 10 can be further distinguished in addition to the first region R1 and the second region R2. .

Hereinafter, the step of attaching the substrate assembly 10 to the table 21 will be described with reference to Fig. 4 (S20). Fig. 4 is a view showing a step of mounting a substrate assembly according to an embodiment of the present invention on a workbench. When the substrate assembly 10 is mounted on the stage 21, the substrate assembly 10 may be disposed to face the table, that is, the first substrate 11 is located at an upper portion of the substrate assembly, and the second substrate 12 is located at a lower portion of the substrate assembly.

The stage 21 supports the substrate assembly 10, and the substrate peeling device can be disposed on the table 21. The stage 21 can be included in the substrate peeling device 20. Hereinafter, the substrate peeling device 20 will be described with reference to FIGS. 5 and 6. Fig. 5 is a block diagram of a substrate peeling apparatus according to an embodiment of the present invention. Fig. 6 is a perspective view showing a substrate assembly in which a substrate peeling device is disposed according to an embodiment of the present invention.

Referring to FIGS. 5 and 6 , the substrate peeling device 20 may include a table 21 , a laser output unit 22 , a distance measuring unit 23 , and a control unit 24 .

The substrate assembly 10 can be disposed on the table 21, and the table 21 can support the substrate assembly 10. The table 21 is movable up and down, and the movement of the table 21 can be controlled by the control unit 24.

The laser output unit 22 is disposed at an upper portion of the table 21 from the table 21 . The laser output unit 22 can output a laser, and the output laser 22 can be irradiated onto the substrate assembly 10 disposed on the stage 21. The laser output unit 22 is movable in the horizontal direction, and the laser output unit 22 outputs the laser while moving in the horizontal direction, so that the substrate assembly 10 can perform laser scanning.

The distance measuring unit 23 is disposed on the upper portion of the table 21 so as to be spaced apart from the table 21 . The distance measuring unit 23 can measure the distance between the distance measuring unit 23 and the substrate assembly 10 disposed on the table 21. The distance measuring unit 23 may include a first distance measuring unit 23a and a second distance measuring unit 23b that are spaced apart from each other. The first distance measuring unit 23a is disposed on the first region R1, and the second distance measuring unit 23b is disposed in the second region R2. However, the present invention is not limited thereto.

The control unit 24 can control the operations of the table 21, the laser output unit 22, and the distance measuring unit 23. The control unit 23 can control the vertical movement of the table 21 in accordance with the distance between the distance measuring unit 23 and the substrate assembly 10 measured by the distance measuring unit 23. The substrate peeling device 20 includes a control unit 24 that controls the vertical movement of the table 21 in accordance with the distance between the distance measuring unit 23 and the substrate assembly 10 measured by the distance measuring unit 23, so that the output from the laser output unit 22 can be adjusted. The region in the substrate assembly 10 where the focus of the laser is placed increases the range in which the focus of the laser is located and the extent to which the adhesive layer 13 overlaps, so that the substrate assembly 10 can be effectively peeled off. Further, by reducing the range in which the region where the focus of the laser is located overlaps with the second substrate 12, it is possible to reduce the damage of the second substrate 12 by the laser when the laser beam is applied to the substrate assembly 10. This will be described in detail later.

Hereinafter, a step (S30) of measuring the distance between the distance measuring unit 23 and the substrate assembly 10 will be described with reference to Fig. 7 . Fig. 7 is a view showing a step of measuring the distance between the distance measuring unit and the substrate assembly according to an embodiment of the present invention. According to Fig. 7, the distance measuring unit 23 can emit the test light TL. The test light TL can be reflected by the substrate assembly 10, and more specifically, can be reflected through the upper surface of the first substrate 11. The distance measuring unit 23 can receive the test light TL reflected by the substrate assembly 10, and the distance measuring unit 23 can calculate the distance between the distance measuring unit 23 and the substrate assembly 10 from the received test light TL. The first distance measuring unit 23a and the second distance measuring unit 23b can measure the distances between the mutually different regions of the substrate assembly 10. The first distance measuring unit 23a can measure the distance da between the partial region of the first region R1 disposed at the lower portion of the first distance measuring unit 23a and the first distance measuring unit 23a. The second distance measuring unit 23b can measure the distance db between the partial region of the second region R2 disposed at the lower portion of the second distance measuring unit 23b and the second distance measuring unit 23b. According to several embodiments, the step of measuring the distance between the distance measuring unit 23 and the substrate assembly 10 may be omitted (S30).

Hereinafter, the first laser scanning step (S40) will be described with reference to Figs. 8 and 9. 8 and 9 are diagrams showing a first laser scanning step in accordance with an embodiment of the present invention. According to FIGS. 8 and 9, in the first laser scanning step (S40), the laser output unit 22 outputs the first laser L1, and transmits the first portion of the first region R1 through the horizontal movement, and irradiates the first region R1 with the first light. Laser L1. In the first laser scanning step (S40), the first focus f1 of the first laser L1 may be located on the adhesive layer 13. If the laser is irradiated to the adhesive layer 13, the adhesion of the first adhesive layer 13a is weakened, and the first substrate 11 and the second substrate 12 can be separated. Therefore, when the focus of the first laser L1 is located on the adhesive layer 13, In order to effectively separate the substrate assembly 10. The thickness of each layer of the substrate assembly 10 may be set in advance, whereby the height of the table 21 may be set such that the first focus f1 of the first laser L1 is located on the adhesive layer 13.

According to several embodiments, although not shown, the substrate peeling method may further include the step (S30) of measuring the distance between the distance measuring portion and the substrate assembly before the first laser scanning step (S40). The step of adjusting the focus position of the laser by the distance between the measuring unit 23 and the substrate assembly 10. The control unit 24 maintains the distance between the distance measuring unit 23 and the substrate assembly 10, and when the first laser scanning (S40) is performed, if it is determined that the first focus f1 of the first laser L1 is not in the adhesive layer 13a, the transmission adjustment is performed. The position of the first focus f1 of the first laser L1 is such that the first focus f1 of the first laser L1 is located on the adhesive layer 13a. The position adjustment of the first focus f1 of the first laser L1 can be transmitted through the upper and lower moving table, or the laser output unit 22 can be moved up and down, or the first focus f1 of the first laser L1 output from the laser output unit 22 can be adjusted. Distance is achieved.

Hereinafter, the substrate assembly 10 after the first laser scanning step (S40) will be described with reference to FIG. Fig. 10 is a view showing a substrate assembly after the first laser scanning. After the first laser scanning step (S40), the adhesion of the first adhesive layer 13a in the first region R1 of the first laser beam L1 is weakened, thereby being bonded through the first adhesive layer 13a. The first substrate 11 and the second substrate 12 in the first region R1 may be separated from each other, and the second substrate 12 is lifted. Since the adhesive force of the second adhesive layer 13b in the first region R1 is not weakened, the first substrate 11 and the second substrate 12 in the first region R1 adhered through the second adhesive layer 13b can be kept from each other. Combined state. Since the first laser L1 is not irradiated to the second region R2, the first substrate 11 and the second substrate 12 in the second region R2 can maintain the bonded state. As described above, after the first laser scanning step (S40), in a partial region of the substrate assembly 10, the first substrate 11 and the second substrate 12 remain bonded, while the other regions of the first substrate 11 and the second substrate 12 may Separation. The soft first substrate 11 separated from the second substrate may be deformed, and therefore, the shape of the substrate assembly 10 may be deformed. Specifically, as shown in FIG. 10, since the upper surface of the substrate assembly 10 is inclined and cannot be horizontal, the adhesive layer 13 in the second region R2 cannot be horizontal.

Hereinafter, a step (S50) of measuring the distance between the distance measuring unit 23 and the substrate assembly 10 after the first laser scanning will be described with reference to FIG. Figure 11 is a view showing a step of measuring the distance between the distance measuring portion and the substrate assembly after the first laser scanning according to an embodiment of the present invention. According to Fig. 11, the distance measuring unit 23 can emit the test light TL, and the test light TL reflected by the transmission substrate assembly 10 can detect the distance between the distance measuring unit 23 and the substrate assembly. The first distance measuring unit 23a can measure the distance da' between the partial region of the first region R1 disposed at the lower portion of the first distance measuring portion 23a and the first distance measuring portion 23a. The second distance measuring unit 23b can measure the distance db' between the partial region of the second region R2 disposed at the lower portion of the second distance measuring portion 23b and the second distance measuring portion 23b.

Hereinafter, the step of adjusting the focus position of the laser (S60) will be described with reference to FIG. Figure 12 is a diagram showing a focus position adjustment step of a laser according to an embodiment of the present invention. The focus position of the laser is adjusted in accordance with the distance between the distance measuring unit 23 and the substrate assembly 10 measured after the first laser scanning. The distance between the distance measuring unit 23 and the substrate assembly 10 measured after the first laser scanning can detect the position of the upper surface of the substrate assembly 10, whereby the bonding in the second region R2 can be extracted. The location of layer 13. In order to detect the position of the upper surface of the substrate assembly 10, the distance measuring unit 23 calculates the absolute distance from the upper surface of the substrate assembly 10 from the incident test light TL, or compares it before the first laser scanning step (S40). The distance between the distance measuring unit 23 and the upper surface of the substrate assembly 10 calculated by the step (S30) of measuring the distance between the fixed portion 23 and the substrate assembly 10 can be used as the difference between the distances. Based on the calculated distance between the distance measuring unit 23 and the substrate assembly 10 measured after the first laser scanning, the control unit 24 can adjust the focus position of the laser to output the lightning in the second laser scanning step (S70). The area where the focus position of the shot overlaps with the adhesive layer 13 increases. To this end, the focus position of the laser can be adjusted so that the focus position of the laser outputted in the second laser scanning step (S70) is located at the center of the thickness of the adhesive layer 13 in the center of the second region R2. When the focus position of the laser outputted by the second laser scanning step (S70) and the area where the adhesive layer 13 overlap are increased, the laser of the first adhesive layer 13a is irradiated in the second laser scanning step (S70). The amount is increased to effectively weaken the bonding force of the first adhesive layer 13a, so that the first substrate 11 and the second substrate 12 can be easily separated. Moreover, since the first substrate 11 and the second substrate 12 are lifted after the first laser scanning step (S40), the position of the second substrate 12 in the second region R2 is before the first laser scanning step (S40) It is possible to move to the upper part compared to it. Therefore, when the second laser scanning step (S70) is performed at the same focus position of the laser as the first laser scanning step (S40), the focus of the laser may be located on the second substrate 12, and at this time, the second The substrate 12 causes damage. The substrate peeling method according to an embodiment of the present invention includes the step of adjusting the focus position of the laser (S60), whereby the damage of the second substrate 12 due to the laser can be reduced when the substrate is peeled off. In order to adjust the focus position of the laser, the control unit 24 can move the table 21 up and down. For example, after the first laser scanning step (S40), when the second substrate 12 is lifted up, the control portion 24 can move the table 21 to the lower side.

Hereinafter, the second laser scanning step (S70) will be described with reference to FIGS. 13 and 14. Figures 13 and 14 are diagrams showing a second laser scanning step in accordance with an embodiment of the present invention. According to FIGS. 13 and 14, in the second laser scanning step (S70), the laser output unit 22 outputs the second laser L2 having the second focus f2, and transmits the upper portion of the second region R2 through the horizontal direction. The second region R2 illuminates the second laser L2. The second laser L2 may be substantially the same as the first laser L1, and the distance from the laser output 22 to the second focus f2 may be substantially the same as the distance from the laser output 22 to the first focus f1. At least a portion of the second focus 13 may overlap the adhesive layer 13. For example, in the center R2C of the second region R2, the second focus f2 may be located at the center of the thickness of the adhesive layer 13.

Hereinafter, the substrate assembly after the second laser scanning step (S70) will be described with reference to Fig. 15. Fig. 15 is a view showing the substrate assembly after the second laser scanning. Due to the second laser scanning step (S70), the adhesion of the first adhesive layer 13a in the second region R2 may be weakened, thereby, the first substrate 11 and the second bonded through the first adhesive layer 13a. In the region of the substrate 12, the first substrate 11 and the second substrate 12 may be separated from each other. By bonding the regions of the first substrate 11 and the second substrate 12 through the second adhesive layer 13b, since the adhesion of the second adhesive layer 13b is not weakened by the laser, the bonding state can be maintained.

In the step (S80) of separating the first substrate 11 and the second substrate 12, the first substrate 11 and the second substrate are also separated by an external force in a region where the first substrate 11 and the second substrate 12 are bonded through the second bonding layer 13b. 12, whereby the first substrate 11 and the second substrate 12 can be completely separated.

Hereinafter, other embodiments of the present invention will be described with reference to Fig. 16. Figure 16 is a diagram showing the steps of adjusting the focus position of the laser and the second laser scanning step in accordance with other embodiments of the present invention. Referring to Fig. 16, in accordance with other embodiments of the present invention, in the laser focus position adjustment step (S60), the laser output portion 22 can be moved up and down to adjust the focus position of the laser. For example, when the second substrate 12 is tilted after the first laser scanning step (S40), the control portion 24 may move the laser output 22 to the upper side to output the second laser at the second laser scanning step (S70). The position of the focus f2 of L2 overlaps with the area where the adhesive layer 13 overlaps. The other description of the substrate peeling method according to another embodiment of the present invention is substantially the same as the description of the substrate peeling method described with reference to FIGS. 1 to 15, and therefore the description thereof will be omitted.

Hereinafter, still another embodiment of the present invention will be described with reference to Fig. 17. Figure 17 is a diagram showing the steps of adjusting the focus position of the laser and the second laser scanning step according to still another embodiment of the present invention. Referring to Fig. 17, in accordance with other embodiments of the present invention, in the focus position adjustment step (S60) of the laser, in order to adjust the focus position of the laser, the focus distance of the laser outputted from the laser output portion 22 can be changed. For example, when the second substrate 12 is tilted after the first laser scanning step (S40), the control portion 24 can reduce the focal distance of the laser so as to output the second laser L2 at the second laser scanning step (S70). The position of the focus f2 overlaps with the area where the adhesive layer 13 overlaps, whereby the second focus f2 can be located above the first focus f1. The other description of the substrate peeling method according to still another embodiment of the present invention is substantially the same as the description of the substrate peeling method described with reference to FIGS. 1 to 15, and therefore the description thereof will be omitted.

Hereinafter, still another embodiment of the present invention will be described with reference to Fig. 18. Figure 18 is a diagram showing the steps of adjusting the focus position of the laser and the second laser scanning step according to still another embodiment of the present invention. According to still another embodiment of the present invention, the control board 24 is connectable from the distance measuring section 23 and the substrate assembly 10 measured in the step (S30) of measuring the distance between the distance measuring section 23 and the substrate assembly 10. The distance from the upper surface of the substrate assembly 10 is inclined, whereby the thickness of the adhesive layer 13 disposed in the second region R2 can be retracted. The first distance measuring unit 23a and the substrate combination measured by the step (S50) of measuring the distance between the distance measuring unit 23 and the substrate assembly 10 after the first laser scanning can be performed by the degree of inclination of the upper surface of the substrate assembly 10. The difference between the distance da' between 10 and the distance db' between the second distance measuring portion 23b and the substrate assembly 10 is remitted. The step (S60) of adjusting the focus position of the laser can rotate the table 21 so that the adhesive layer 13 becomes horizontal. While rotating the table 21, the focus f2 of the second laser beam L2 can be placed in the adhesive layer 13 by moving the table 21 up and down or moving the laser output unit 22 up and down. According to still another embodiment of the present invention, the focus of the laser L2 can be controlled not to be separated from the adhesive layer 13, whereby the first substrate 11 and the second substrate 12 can be smoothly separated, and the second substrate 12 can be prevented from being laser-induced. damage. The other description of the substrate peeling method according to still another embodiment of the present invention is substantially the same as the description of the substrate peeling method described with reference to FIGS. 1 to 15, and therefore the description thereof will be omitted.

The embodiments of the present invention have been described above with reference to the drawings, but those skilled in the art can understand that other specific embodiments can be implemented without changing the technical idea or essential features of the present invention. Therefore, the above described embodiments are merely illustrative and are not intended to limit the invention.

S10~S80. . . step

Claims (20)

A substrate stripping method comprising:
Forming a substrate assembly, the substrate assembly includes a first substrate and a flexible second substrate coupled to the first substrate, and is divided into a first region and a second region;
a step of mounting the substrate assembly on a workbench;
a first laser scanning step of illuminating the first region with a laser;
Determining a distance between a distance measuring portion and the substrate assembly disposed on the substrate assembly;
a step of changing a focus position of the laser corresponding to a distance between the distance measuring portion and the substrate assembly; and a second laser scanning step of irradiating the second region with the laser. The substrate peeling method according to claim 1, wherein the step of changing the focus position of the laser includes the step of changing the height of the table to the substrate assembly. The substrate peeling method according to claim 2, wherein the distance measuring unit includes a first distance measuring unit and a second distance measuring unit for measuring a distance between the mutually different regions of the substrate assembly. The measuring of the distance between the distance measuring unit and the substrate assembly disposed on the substrate assembly includes measuring a distance between the substrate assembly and the first distance measuring unit, and measuring the substrate assembly The distance from the second distance measuring unit further includes a distance corresponding to a distance between the substrate assembly and the first distance measuring unit and a distance between the substrate assembly and the second distance measuring unit. The step of tilting the table is performed to the extent that the upper surface of the substrate assembly is inclined. The substrate peeling method of claim 1, wherein the step of changing a focus position of the laser comprises changing a focus distance of the laser. The substrate peeling method of claim 1, wherein the step of changing a focus position of the laser comprises changing a laser output height of the laser output. The substrate stripping method of claim 1, wherein the substrate assembly further comprises a first adhesive layer, the first adhesive layer being disposed between the first substrate and the second substrate a first substrate and the second substrate whose bonding force is weakened by the laser, and the step of changing a focus position of the laser includes configuring the at least a portion of the first bonding layer disposed in the second region The focus of the laser. The substrate peeling method according to claim 6, wherein the step of changing a focus position of the laser includes disposing a focus of the laser at a center of a thickness of the first adhesive layer at a center of the second region . The substrate stripping method of claim 6, wherein the substrate assembly further comprises a second adhesive layer disposed on the substrate between the first substrate and the second substrate The periphery of the bonded body is made of a substance different from the first adhesive layer. The substrate peeling method according to claim 6, further comprising the step of measuring a distance between the distance measuring portion and the substrate assembly before the first laser scanning step, changing a focus position of the laser The step of including a distance between the distance measuring portion and the substrate assembly measured before the first scanning step and a distance between the distance measuring portion and the substrate combination measured after the first scanning , changing the position where the focus of the laser is configured. A substrate stripping device comprising:
a laser output portion irradiates a laser to a substrate assembly including a first substrate and a soft second substrate bonded to the first substrate;
a workbench, the substrate assembly is mounted on the upper portion;
a distance measuring unit disposed on the substrate assembly for measuring a distance from the substrate assembly; and a control unit that changes a focus position of the laser corresponding to a distance between the distance measuring unit and the substrate assembly . The substrate stripping device of claim 10, wherein the substrate assembly is divided into a first region and a second region.
The laser output unit illuminates the first area with the laser.
After the laser is irradiated to the first region, the control portion changes the focal position of the laser on the substrate assembly corresponding to the distance between the distance measuring portion and the substrate assembly, and changes the focus position of the laser. Thereafter, the laser output unit illuminates the laser toward the second region. The substrate peeling device according to claim 11, wherein the control portion changes a height of the table corresponding to a distance between the distance measuring portion and the substrate assembly. The substrate peeling device according to claim 12, wherein the control portion corresponds to a distance between the distance measuring portion and the substrate assembly before the laser is irradiated to the first region, and is irradiated in the first region The height of the table is changed by the difference between the distance between the distance measuring portion and the substrate assembly after the laser. The substrate stripping device of claim 12, wherein the substrate assembly comprises a first adhesive layer, and the first adhesive layer is disposed between the first substrate and the second substrate to bond the first bonding layer The bonding force of a substrate and the second substrate is weakened by the laser, and the control portion changes the height of the table so that the focus of the laser is located at the first bonding layer in the center of the second region. The substrate peeling device according to claim 12, wherein the distance measuring unit includes a first distance measuring unit and a second distance measuring unit for measuring a distance between the mutually different regions of the substrate assembly. The control unit is inclined to be inclined from a distance between the first distance measuring unit and the substrate assembly and an inclination of an upper surface of the substrate assembly that is derived from a distance between the second distance measuring unit and the substrate assembly. And the workbench. The substrate peeling device according to claim 11, wherein the control portion changes a focal length of the laser corresponding to a distance between the distance measuring portion and the substrate assembly. The substrate stripping device of claim 16, wherein the substrate assembly comprises a first adhesive layer, and the first adhesive layer is disposed between the first substrate and the second substrate to bond the first bonding layer A substrate and the second substrate are weakened by the laser, and the control portion changes a focal distance of the laser so that the laser focus is located at the first adhesive layer in the center of the second region. The substrate peeling device according to claim 11, wherein the control portion changes a height of the laser output portion corresponding to a distance between the distance measuring portion and the substrate assembly. The substrate stripping device of claim 18, wherein the substrate assembly further comprises a first adhesive layer, the first adhesive layer being disposed between the first substrate and the second substrate The bonding force of the first substrate and the second substrate is weakened by the laser, and the control portion changes the height of the laser output portion so that the laser focus is located at the first bonding layer in the center of the second region. The substrate stripping device of claim 11, wherein the substrate assembly further comprises a second adhesive layer disposed on the substrate between the first substrate and the second substrate The periphery of the bonded body is composed of a substance different from the first adhesive layer.