CN111341716A - Flexible display substrate stripping device and flexible display substrate stripping method - Google Patents
Flexible display substrate stripping device and flexible display substrate stripping method Download PDFInfo
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- CN111341716A CN111341716A CN202010157802.9A CN202010157802A CN111341716A CN 111341716 A CN111341716 A CN 111341716A CN 202010157802 A CN202010157802 A CN 202010157802A CN 111341716 A CN111341716 A CN 111341716A
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- flexible display
- display substrate
- substrate
- flexible
- bearing base
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- 239000000758 substrate Substances 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000001179 sorption measurement Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920006304 triacetate fiber Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229920004934 Dacron® Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Abstract
The invention discloses a flexible display substrate stripping device and a flexible display substrate stripping method, wherein the flexible display substrate stripping device comprises: the bearing base station is provided with a plurality of through holes on the surface of one side; the vacuum module is arranged below the bearing base station and is connected with the through holes; and one side surface of the bearing base platform is a curved surface, so that the flexible display substrate is peeled from the bearing base platform along the curved surface. Compared with the conventional flexible display substrate stripping device, the flexible display substrate stripping device has the advantages that the bearing base station with the curved surface is designed, the substrate to be stripped is placed on the bearing base station with the curved surface, and the flexible display substrate is easily stripped by utilizing the deformation difference of the hard substrate and the flexible display substrate under the action of the curved surface and utilizing the falling phenomenon between the hard substrate and the flexible display substrate. By adopting the mode of the curved surface bearing base station, the damage of the blade to the flexible substrate can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of display manufacturing, in particular to a flexible display substrate stripping device and a flexible display substrate stripping method.
Background
Flexible displays are a mainstream trend in new displays because of their advantages of light weight, thinness, and flexibility. However, the conventional glass substrate has disadvantages of excessive bending curvature, heavy weight, and fragility, which limits the application and development of the conventional glass substrate in flexible displays. Therefore, at present, flexible displays mostly use polymer-based flexible substrates as carriers. In the manufacturing process of a common panel manufacturer, a layer of flexible substrate is first fabricated on a rigid substrate (such as glass), and after the fabrication process is completed, the device is removed from the rigid substrate to obtain a flexible display device.
At present, the laser separation mode is the mainstream removal mode in the panel field due to the advantages of high laser beam focusing precision, short time, high production efficiency and the like. In laser separation, a laser beam is generally irradiated from the carrier substrate side, and the surface is swept over the interface between the flexible substrate and the carrier substrate, so that the flexible substrate at the interface is ablated with high energy and is detached from the rigid substrate. In order to ensure the display quality, the flexible substrate generally remains a film formation guarantee region during coating, and thus the coating may be uneven at the edge portion of the coating. The edge portion may not be automatically peeled off after irradiation with the same laser energy. The flexible display substrate is typically obtained by separating the edge portions with a blade or other means. But this approach is prone to damage to the substrate.
In summary, in the current technical solution, there is a technical problem that the flexible display substrate is easily damaged when the hard substrate and the flexible display substrate are peeled off.
Disclosure of Invention
The embodiment of the invention provides a display substrate and a display device, and aims to solve the technical problem that a flexible display substrate is easily damaged when a hard substrate and the flexible display substrate are peeled off in the conventional technical scheme.
In order to solve the above problem, in a first aspect, the present invention provides a flexible display substrate peeling apparatus for peeling a flexible display substrate and a rigid substrate that are attached to each other, including:
the bearing base station is provided with a plurality of through holes on the surface of one side;
the vacuum module is arranged below the bearing base station and is connected with the through holes;
and one side surface of the bearing base platform is a curved surface, so that the flexible display substrate is peeled from the bearing base platform along the curved surface.
In some embodiments of the invention, the laser generator is disposed on a side surface of the bearing base.
In some embodiments of the present invention, the substrate further includes a flexible adsorption plate disposed above the supporting base.
In some embodiments of the present invention, the adsorption device further includes a slide rail, and the flexible adsorption plate is disposed on the slide rail.
In some embodiments of the present invention, the material of the flexible adsorption plate is at least one of polyimide, dacron resin, polycarbonate or triacetate fiber.
In some embodiments of the invention, the curvature of one side surface of the bearing base is greater than 100 mm.
In some embodiments of the present invention, the curved surface of the bearing base platform is an arc surface protruding upwards.
In some embodiments of the present invention, the curved surface of the carrier substrate is a downward concave arc surface.
In a second aspect, the present invention further provides a method for peeling off a flexible display substrate, which is applied to the apparatus for peeling off a flexible display substrate, and includes:
adsorbing the surface of one side of the substrate to be stripped by using a flexible adsorption plate;
placing the substrate to be stripped on a bearing base station with a curved surface;
starting a vacuum module below the bearing base station, wherein the bearing base station adsorbs the other side surface of the substrate to be stripped;
and applying a pulling force to the flexible adsorption plate. And peeling to obtain the flexible display substrate.
In some embodiments of the invention, the method further comprises placing the substrate to be peeled above a laser generator for irradiation, wherein the substrate to be peeled comprises a hard substrate and a flexible display substrate, and the laser generator irradiates from one side of the hard substrate.
Compared with the conventional flexible display substrate stripping device, the flexible display substrate stripping device has the advantages that the bearing base station with the curved surface is designed, the substrate to be stripped is placed on the bearing base station with the curved surface, and the flexible display substrate is easily stripped by utilizing the deformation difference of the hard substrate and the flexible display substrate under the action of the curved surface and utilizing the falling phenomenon between the hard substrate and the flexible display substrate. By adopting the mode of the curved surface bearing base station, the damage of the blade to the flexible substrate can be effectively avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a flexible display substrate peeling apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a substrate to be stripped in one embodiment of the present invention;
FIG. 3 is a schematic illustration of laser lift-off in one embodiment of the present invention; and
FIG. 4 is a flowchart illustrating a method for peeling off a flexible display substrate according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the current technical scheme, the technical problem that the flexible display substrate is easily damaged exists when the hard substrate and the flexible display substrate are peeled.
Based on this, the embodiment of the invention provides a flexible display substrate peeling device and a flexible display substrate peeling method. The following are detailed below.
First, an embodiment of the invention provides a flexible display substrate peeling apparatus, as shown in fig. 1, which is a schematic diagram of the flexible display substrate peeling apparatus in an embodiment of the invention. The flexible display substrate stripping device is used for stripping the hard substrate 200 and the flexible display substrate 300 which are mutually adsorbed, and a plurality of through holes 101 are formed in the surface of one side of the bearing base station 100; a vacuum module (not shown) disposed below the supporting base 100 and connected to the plurality of through holes 101; one side surface of the supporting base 100 is a curved surface, so that the flexible display substrate can be peeled off from the supporting base along the curved surface.
It can be understood that fig. 1 is a schematic diagram of a flexible display substrate peeling apparatus when peeling is just started, due to the curved surface effect of the supporting base 100 and the adsorption effect of the supporting base 100 on the substrate to be peeled (referring to the hard substrate 200 and the flexible display substrate 300 which are adsorbed to each other, the hard substrate 200 and the flexible display substrate are deformed, but the deformation amount is small and there is almost no difference at this time, as shown in fig. 2, which is a schematic diagram of the substrate to be peeled in an embodiment of the present invention, the substrate to be peeled further includes a film formation guarantee area 301, the hard substrate 200 and the flexible display substrate 300 are separated in the film formation guarantee area 301, the deformation of the hard substrate 200 is limited when the substrate to be peeled is continuously peeled, and the flexible display substrate 300 is continuously deformed, and a deformation difference is formed between the two, so that a peeling phenomenon occurs, the well-preserved flexible display substrate 300 is obtained, and damage to the flexible display substrate 300 caused by a blade in the prior art is avoided.
In some embodiments of the present invention, the flexible display substrate peeling apparatus further includes a laser generator disposed at a side of the supporting base 100. FIG. 3 is a schematic illustration of laser lift-off in one embodiment of the present invention. Laser generator follows stereoplasm base plate 200 one side is shone, can not harm just flexible display substrate 300, owing to have the curved surface bear the study object that base station 100 is directed against for laser ablation after treat the base plate of peeling off, consequently, for production convenience, will activation generator with bear base station 100 integration on same host computer platform, laser generator set up in bear the close height in base station 100 side, real-time observation when being convenient for manual operation or automatic operation.
Of course, in actual production, only the carrying base 100 is used, and a part of the base to be peeled cannot be peeled or is damaged after being peeled. In another embodiment of the present invention, the flexible display substrate peeling apparatus further includes a flexible adsorption plate disposed above the supporting base. As can be seen from fig. 1, in the base station to be peeled, the hard substrate 200 is located below, the supporting base station 100 adsorbs the lower surface of the hard substrate 200, and the flexible display substrate 300 is located above, so that the introduced soft adsorption plate contacts and adsorbs a side surface of the flexible display substrate 300, which can accelerate the generation speed of the deformation difference between the hard substrate 200 and the flexible display substrate 300, and is suitable for products in more situations, and the flexibility of the soft adsorption plate can protect the flexible display substrate 300. Preferably, the flexible adsorption plate also comprises a vacuum module, and the flexible adsorption plate is adsorbed by manufacturing a negative pressure environment in the vacuum module.
Preferably, the material of the soft adsorption plate is at least one of Polyimide (PI), polyester resin (PET), Polycarbonate (PC) or Triacetyl Cellulose (TAC). It is worth mentioning that the above list is only preferred, and other materials can be used in the soft absorption plate if they satisfy the requirement that the polymer film material with a certain mechanical strength can receive a certain degree of mechanical pulling force, and can play a role in protecting the flexible device.
Preferably, install the ascending slide rail of level and vertical direction on the host computer platform, soft adsorption plate set up in on the slide rail, soft adsorption plate can slide rail within range level or vertical removal. The host computer platform includes two regions, is laser irradiation district and mechanical stripping area respectively, and the back is accomplished in the laser irradiation process, soft adsorption plate is in the absorption of laser irradiation district treat to peel off the base plate, remove the back along the slide rail, will treat to peel off the base plate place in mechanical stripping area bear on the base station 100, carry out further mechanical stripping.
On the basis of the above embodiment of the present invention, in another embodiment of the present invention, the curvature of one side surface of the supporting base 100 is larger than 100mm, so as to prevent the insufficient vacuum absorption of the supporting substrate 100 caused by too small curvature.
In one embodiment, the curved surface of the bearing base 100 is an arc surface protruding upwards; in another embodiment, the curved surface of the carrier substrate 100 is a downwardly concave arc surface. The specific shape of the curved surface of the supporting base 100 can be flexibly changed according to the sample and the actual requirement.
Preferably, the flexible adsorption plate is vacuum adsorption, electrostatic adsorption or a viscous chuck, and the surface of the flexible adsorption plate is adapted to the shape of the flexible display substrate 300.
Preferably, the material of the supporting base 100 is hard silica gel, and the material of the soft adsorption plate is flexible silica gel.
In order to better implement the flexible display substrate peeling apparatus in the embodiment of the present invention, on the basis of the flexible display substrate peeling apparatus, the embodiment of the present invention further provides a flexible display substrate peeling method, which is applied to the flexible display substrate peeling apparatus described in the above embodiment. Fig. 4 is a flowchart illustrating a method for peeling off a flexible display substrate according to an embodiment of the invention.
The method comprises the following steps:
s1, adsorbing the substrate to be stripped on one side surface by a flexible adsorption plate;
s2, placing the substrate to be stripped on a bearing base station 100 with a curved surface;
s3, starting a vacuum module below the bearing base station 100, wherein the bearing base station adsorbs the other side surface of the substrate to be stripped;
and S4, applying a pulling force to the soft adsorption plate. And peeling to obtain the flexible display substrate.
Specifically, the method for peeling the flexible display substrate further comprises the step of placing the substrate to be peeled above a laser generator for irradiation, wherein the substrate to be peeled comprises a hard substrate and the flexible display substrate, and the laser generator irradiates from one side of the hard substrate. The laser type emitted by the laser generator comprises excimer laser or solid-state laser, and the laser emitted by the laser generator performs at least twice scanning irradiation on the hard substrate.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again. In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again. The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A flexible display substrate peeling apparatus that peels off a flexible display substrate adsorbed on a hard substrate, comprising:
the bearing base station is provided with a plurality of through holes on the surface of one side;
the vacuum module is arranged below the bearing base station and is connected with the through holes;
and one side surface of the bearing base platform is a curved surface, so that the flexible display substrate is peeled from the bearing base platform along the curved surface.
2. The peeling apparatus for a flexible display substrate according to claim 1, further comprising a laser generator disposed on a side surface of the supporting base.
3. The peeling apparatus for flexible display substrate according to claim 1, further comprising a flexible adsorption plate disposed above the supporting base.
4. The device for peeling off a flexible display substrate according to claim 3, further comprising a slide rail, wherein the flexible absorption plate is disposed on the slide rail.
5. The peeling apparatus for flexible display substrate according to claim 3, wherein the material of the flexible absorption plate is at least one of polyimide, polyester resin, polycarbonate or triacetate fiber.
6. The flexible display substrate peeling apparatus of claim 1, wherein a curvature of a side surface of the carrier base is greater than 100 mm.
7. The flexible display substrate peeling apparatus of claim 1, wherein the curved surface of the supporting base is an arc surface protruding upward.
8. The peeling apparatus for flexible display substrate according to claim 1, wherein the curved surface of the carrier substrate is a circular arc surface recessed downward.
9. A method for peeling a flexible display substrate is characterized by comprising the following steps:
adsorbing the surface of one side of the substrate to be stripped by using a flexible adsorption plate;
placing the substrate to be stripped on a bearing base station with a curved surface;
starting a vacuum module below the bearing base station, wherein the bearing base station adsorbs the other side surface of the substrate to be stripped;
and applying a pulling force to the flexible adsorption plate, and peeling to obtain the flexible display substrate.
10. The method of claim 9, further comprising placing the substrate to be peeled over a laser generator to irradiate the substrate, wherein the substrate to be peeled comprises a hard substrate and a flexible display substrate, and the laser generator irradiates the substrate from one side of the hard substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010157802.9A CN111341716A (en) | 2020-03-09 | 2020-03-09 | Flexible display substrate stripping device and flexible display substrate stripping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010157802.9A CN111341716A (en) | 2020-03-09 | 2020-03-09 | Flexible display substrate stripping device and flexible display substrate stripping method |
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| CN111341716A true CN111341716A (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010157802.9A Pending CN111341716A (en) | 2020-03-09 | 2020-03-09 | Flexible display substrate stripping device and flexible display substrate stripping method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125931A (en) * | 1996-08-27 | 1998-05-15 | Seiko Epson Corp | Transfer of thin film element, thin film element, thin film integrated circuit device, active materix substrate and liquid crystal display device |
| JP2004142878A (en) * | 2002-10-24 | 2004-05-20 | Toray Ind Inc | Peeling method of flexible film, peeling device and circuit substrate |
| CN101154561A (en) * | 2006-09-29 | 2008-04-02 | 株式会社半导体能源研究所 | Peeling apparatus and manufacturing method of semiconductor device |
| KR20120033285A (en) * | 2010-09-29 | 2012-04-06 | 포항공과대학교 산학협력단 | Chemical peel-off method of manufacturing flexible electronic device, flexible electronic device and flexible substrate |
| CN103963421A (en) * | 2013-01-30 | 2014-08-06 | 大日本网屏制造株式会社 | Detaching apparatus and detaching method |
| US20170212371A1 (en) * | 2015-06-26 | 2017-07-27 | Boe Technology Group Co., Ltd. | Device and Method for Stripping Flexible Substrate |
| CN108648630A (en) * | 2018-05-31 | 2018-10-12 | 武汉华星光电半导体显示技术有限公司 | Curved screen laminating apparatus and applying method |
-
2020
- 2020-03-09 CN CN202010157802.9A patent/CN111341716A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10125931A (en) * | 1996-08-27 | 1998-05-15 | Seiko Epson Corp | Transfer of thin film element, thin film element, thin film integrated circuit device, active materix substrate and liquid crystal display device |
| JP2004142878A (en) * | 2002-10-24 | 2004-05-20 | Toray Ind Inc | Peeling method of flexible film, peeling device and circuit substrate |
| CN101154561A (en) * | 2006-09-29 | 2008-04-02 | 株式会社半导体能源研究所 | Peeling apparatus and manufacturing method of semiconductor device |
| KR20120033285A (en) * | 2010-09-29 | 2012-04-06 | 포항공과대학교 산학협력단 | Chemical peel-off method of manufacturing flexible electronic device, flexible electronic device and flexible substrate |
| CN103963421A (en) * | 2013-01-30 | 2014-08-06 | 大日本网屏制造株式会社 | Detaching apparatus and detaching method |
| US20170212371A1 (en) * | 2015-06-26 | 2017-07-27 | Boe Technology Group Co., Ltd. | Device and Method for Stripping Flexible Substrate |
| CN108648630A (en) * | 2018-05-31 | 2018-10-12 | 武汉华星光电半导体显示技术有限公司 | Curved screen laminating apparatus and applying method |
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Application publication date: 20200626 |