CN207624673U - Convenient for removing the precast segment of flexible base board - Google Patents
Convenient for removing the precast segment of flexible base board Download PDFInfo
- Publication number
- CN207624673U CN207624673U CN201721103879.8U CN201721103879U CN207624673U CN 207624673 U CN207624673 U CN 207624673U CN 201721103879 U CN201721103879 U CN 201721103879U CN 207624673 U CN207624673 U CN 207624673U
- Authority
- CN
- China
- Prior art keywords
- support column
- precast segment
- base board
- flexible base
- multiple support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of precast segment convenient for stripping flexible base board, including rigid substrates and multiple support columns, the multiple support column are formed in setting spacing on the rigid substrates, and the top end surface of the multiple support column is in the same plane and a supporting surface is collectively formed.A supporting surface is collectively formed by the support of multiple support columns in the precast segment convenient for stripping flexible base board of the utility model, realizing that the while of being supported to the flexible substrate of flexible base board reduces the contact area with flexible substrate, the tensile stress being subject to when flexible base board is removed from rigid substrates can be reduced, product yield is improved.
Description
Technical field
The utility model is related to display technology fields, especially with regard to a kind of precast segment convenient for stripping flexible base board.
Background technology
Currently, pasting flexible substrate on the rigid substrate and after having prepared function element, two kinds of sides can be passed through
Formula removes flexible substrate from rigid substrates.One way in which is mechanical stripping, and mechanical stripping will be incited somebody to action from rigid substrates
One monoblock flexible substrate tears it down, and flexible substrate is easy by larger tensile stress at this time, in stress transfer to core devices
The core devices in flexible substrate can be destroyed.Another way is laser lift-off, and laser lift-off is using high energy laser beam to rigid
Property substrate the back side be scanned, the PI layers contacted with rigid substrates are carbonized, then flexible substrate removed from rigid substrates
Get off, if there is impurity in the flexible substrate back side or rigid substrates front, which will not shell after being irradiated with a laser
From causing to remove uneven, can equally destroy flexible substrate.As it can be seen that existing stripping mode is easily destroyed flexible substrate or position
In the function element in flexible substrate, cause product yield low.
Utility model content
The purpose of this utility model is to provide a kind of precast segments convenient for stripping flexible base board, can reduce flexible base
The tensile stress that plate is subject to when being removed from rigid substrates improves product yield.
The utility model provides a kind of precast segment convenient for stripping flexible base board, and the precast segment includes rigid substrates
With multiple support columns, the multiple support column is formed in setting spacing on the rigid substrates, the top of the multiple support column
End surfaces are in the same plane and a supporting surface is collectively formed, and the flexible base board includes flexible substrate and function element, institute
Supporting surface is stated for attaching the fixed flexible substrate to prepare the function element in the flexible substrate.
Further, the multiple support column is arranged in arrays, be located at a line support column spacing be located at it is same
The spacing of the support column of row is equal.
Further, it is 0.1mm- positioned at the spacing of the support column of same a line and the spacing of the support column positioned at same row
2mm。
Further, the height of the multiple support column is 0.5 μm -2 μm.
Further, the cross section of the multiple support column is circle, equilateral triangle, ellipse or square.
Further, the support column is cylindrical support column, and the radius of the cylindrical support column is 100 μm of -2mm.
Further, the multiple support column is the support construction that can be removed from the rigid substrates.
Further, the multiple support column is made of a glue material, metal material or oxide material.
Further, the size for the supporting surface that the multiple support column is formed is greater than or equal to the ruler of the flexible substrate
It is very little.
Further, the rigid substrates are glass substrate or stainless steel substrate.
A supporting surface is collectively formed by multiple support columns in the precast segment convenient for stripping flexible base board of the utility model,
The contact area with flexible substrate is reduced while realization is supported the flexible substrate of flexible base board, can be reduced soft
Property the tensile stress that is subject to when being removed from rigid substrates of substrate, improve product yield.
Description of the drawings
Fig. 1 is the structural schematic diagram of the precast segment convenient for stripping flexible base board in an embodiment.
Fig. 2 is that the structural schematic diagram after flexible base board is prepared on precast segment in an embodiment.
Fig. 3 is the schematic top plan view of the precast segment convenient for stripping flexible base board in an embodiment.
Fig. 4 is the schematic top plan view of the precast segment convenient for stripping flexible base board in another embodiment.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model is taken,
Below in conjunction with attached drawing and preferred embodiment, to specific embodiment of the present utility model, structure, feature and its effect, specifically
It is bright as after.
Fig. 1 is the structural schematic diagram of the precast segment convenient for stripping flexible base board in an embodiment.Fig. 2 is an embodiment
In the structural schematic diagram after flexible base board is prepared on precast segment.As shown in Figures 1 and 2, precast segment includes rigid substrates 1
With multiple support columns 2, multiple support columns 2 are formed on the rigid substrate 1, can be in rigid substrates 1 by the support of multiple support columns 2
On prepare flexible base board 3, and be easy to after the completion of preparing to remove flexible base board 3 from rigid substrates 1, improve product yield.
Specifically, incorporated by reference to Fig. 3, rigid substrates 1 are the bases made of rigid such as glass substrate or stainless steel substrate
Plate, multiple support columns 2 are formed on the rigid substrate 1 with setting spacing, and the top end surface of multiple support columns 2 is in the same plane
And a supporting surface is collectively formed, which is used to support fixed flexible base board 3.In the present embodiment, multiple support columns 2 are in square
Battle array arrangement is located at the spacing of the support column 2 of same a line (X-direction in Fig. 3) and the branch for being located at same row (Y-direction in Fig. 3)
The spacing of dagger 2 is equal, to make the supporting surface to be formed have uniform support force, is located at the spacing of the support column 2 with a line
Spacing with the support column 2 positioned at same row is 0.1mm, and the height of support column 2 is 0.5 μm.
In an embodiment, the spacing of the support column 2 of same row is 2mm, and the height of support column 2 is 2 μm.As
The height of a kind of replacement of the embodiment, support column 2 can be chosen between 0.5-2 μm, such as 0.6 μm, 0.7 μm, 0.8 μm,
0.9 μm, 1.0 μm, 1.1 μm, 1.2 μm, 1.3, μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm or 1.9 μm；As the reality
A kind of replacement of example is applied, the spacing between same row support column 2 can be chosen between 0.1-2mm, such as：0.2mm、0.3mm、
0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、 0.9mm、1.0mm、1.1mm、1,2mm、1.3mm、1.4mm、1.5mm、
1.6mm、1.7mm、 1.8mm、1.9mm.It should be noted that：Spacing between the height and support column 2 of support column 2 and stripping
The complexity of flexible base board is relevant, in the case where the bearing area of support column 2 is constant, the support column 2 of same row it
Between spacing it is smaller (within the scope of 0.1-2mm), stripping difficulty it is higher；And under this condition, the height selection of support column 2 also can be right
It removes complexity and excellent support can be provided for flexible base and generate certain influence, those skilled in the art should be able to root
It is suitably chosen according to the height of spacing and support column 2 of the above description between support column 2, it will not be described in detail here.
In an embodiment, as shown in figure 3, it is 100 μm of cylinder namely multiple that multiple support columns 2, which are radius,
The cross section of support column 2 is circle.So so that each the contact surface between support column 2 and flexible base board 3 is circle, from
And flexible base board 3 can be removed since the either side of rigid substrates 1, also, when removing to the position of support column 2, branch
It is point contact between the boundary of the release surface of dagger 2 and flexible base board 3, can effectively reduces peeling force.As the embodiment
Instead of the radius of cylindrical support column 2 can be chosen between 100 μm of -2mm, such as：200μm、300μm、400μm、500μm、
600μm、700μm、800μm、 900μm、1.1mm、1.2mm、1.3mm、1.4mm、1.5mm、1.6mm、1.7mm、1.8mm、
1.9mm or 2mm, under conditions of the spacing between the height of support column 2 and adjacent supports column 2 is constant, support column 2 it is transversal
Can face area, i.e. the cross sectional radius value of cylindrical support column 2 can be to removing complexity and being provided for flexible base
Excellent support generates certain influence, and those skilled in the art should be able to be suitable to the cross sectional radius of support column 2 as described above
Work as selection, it will not be described in detail here.
In another embodiment, as shown in figure 4, the cross section of multiple support columns 2 can also be equilateral triangle,
In, be located at the support column 2 of a line (X-direction in Fig. 4) with cross section apex angle towards identical and bottom edge on the same line
Mode is alternatively arranged, and the support column 2 for being located at same row (Y-direction in Fig. 4) is mutual towards identical and bottom edge with cross section apex angle
Parallel mode is alternatively arranged.In this way, each contact surface between support column 2 and flexible base board 3 is triangle and all
The cross section apex angle of dagger 2, can be from the side (namely since upside in terms of Fig. 4) of the apex angle direction of triangle towards identical
Flexible base board 3 is removed, when at stripping to the position of support column 2, the side of support column 2 and the release surface of flexible base board 3
It is point contact between boundary, can effectively reduces peeling force.
In other embodiments, in addition to except round with triangle, the cross sections of multiple support columns 2 can also be ellipse or
Square, also, according to the different spacing that can accordingly adjust support column 2 of the cross-sectional shape of support column 2.
In an embodiment, multiple support columns 2 are the support construction that can be removed from rigid substrates 1, are not limited to use
Point glue material, metal material or oxide material are made, wherein point glue material is, for example, silicone, metal material be, for example, Cu,
Al, oxide material are, for example, Al2O3, ZnO, it is pre- that multiple support columns 2 are not limited by ultraviolet light solidification dispensing material, etching PVD
The mode of metallic film processed, the prefabricated sulls of etching CVD or inkjet printing is formed.Wherein, ultraviolet light cures dispensing material
Mode refer to a glue material be exposed again, develop after forming point glue material on the rigid substrate 1, ultraviolet light solidification with
To support column 2, etching PVD prefabricated metal films refer to the metal foil for depositing required thickness by PVD process on the rigid substrate 1
Metallic film is performed etching again after film with the column 2 that is supported, the etching prefabricated sulls of CVD refer on rigid substrates 1
By being performed etching to sull again with the column 2 that is supported, ink-jet after the sull of CVD process deposits required thicknesses
Printing refers to that support column 2 is directly formed in a manner of inkjet printing above-mentioned material on the surface of rigid substrates 1.
With continued reference to FIG. 2, flexible base board 3 includes flexible substrate 31 and function element 32.Specifically, flexible substrate 31 with
The mode of transfer is transferred on multiple support columns 2 and is fixed, can be on support column 2 or in flexible substrate 31 in advance when transfer
Coating glue, then by a flexible substrate 31 or multiple flexible substrates 31 are transferred to multiple support columns simultaneously by transferring template
Attaching fixation is carried out on 2 supporting surfaces formed, then prepares function element 32 in flexible substrate 31 again to form flexible base board
3.Wherein, flexible substrate 31 is not limited to PI (polyimides) substrate, PET (polyethylene terephthalate) substrates or PEN
(polyethylene naphthalate) substrate, be formed in function element 32 in flexible substrate 31 include thin film transistor (TFT), it is organic
Light emitting diode and thin-film packing structure.
The (not shown) in an embodiment, the size for the supporting surface that multiple support columns 2 are formed is more than or equal to soft
The size of property substrate 31, so as to which by a flexible substrate 31 or multiple flexible substrates 31 are transferred to multiple support columns simultaneously
Attaching fixation is carried out on 2 supporting surfaces formed, in addition, according to the size of flexible substrate 31 and the difference of softness, it can
It is adjusted with the spacing to support column 2, while there is good flatness after the guarantee attaching of flexible substrate 31, to the greatest extent
Amount reduces the contact area with flexible substrate 31.
The stripping process of flexible base board 3 is illustrated below in conjunction with Fig. 1 to Fig. 3.
Step 1, a rigid substrates are provided.Specifically, rigid substrates 1 are glass substrate or stainless steel substrate etc. by rigid material
The number of substrate made of matter, the size of the flexible base board 3 prepared as needed and the flexible base board 3 for needing while preparing carries
For the rigid substrates 1 of corresponding size.
Step 2, multiple support columns 2 are formed on the rigid substrate.Multiple support columns 2 are not limited by ultraviolet light solidification dispensing
Material, the mode for etching PVD prefabricated metals film, the prefabricated sulls of etching CVD or inkjet printing are formed so that Duo Gezhi
Dagger 2 is arranged in arrays and top end surface is in the same plane and a supporting surface is collectively formed, in addition, being located at same a line (Fig. 3
In X-direction) support column 2 spacing with positioned at the spacing of support column 2 of same row (Y-direction in Fig. 3) it is equal, be located at
Spacing and the spacing of the support column 2 positioned at same row with the support column 2 of a line are 0.1mm-2mm, and multiple support columns 2 are equal
It is 100 μm of -2mm for radius, is highly 0.5 μm -2 μm of cylinder.
Step 3, flexible base board is prepared on multiple support columns 2.First pass through the mode of transfer by a flexible substrate 31 or
Multiple flexible substrates 31 are transferred on the supporting surface that multiple support columns 2 are formed simultaneously and carry out attaching fixation, then again in flexibility
Function element 32 is prepared on substrate 31 to form flexible base board 3.Wherein, flexible substrate 31 be not limited to PI substrates, PET substrate or
PEN substrates, the function element 32 being formed in flexible substrate 31 include thin film transistor (TFT), Organic Light Emitting Diode and thin-film package
Structure, the technique for preparing flexible base board 3 know that details are not described herein for skilled person.
Step 4, flexible base board is removed.Flexible base board 3 can be removed by following three kinds of modes：
Mode one, mechanical stripping.Fixed flexible substrate 31 is attached using support column 2 reduces rigid substrates 1 and flexibility
The contact area of substrate 3 can make flexible base board 3 be easy to tear from rigid substrates 1 in mechanical stripping.Further, since each
Contact surface between support column 2 and flexible base board 3 is circle, thus can be removed since the either side of rigid substrates 1 soft
Property substrate 3, when tearing flexible base board 3 along Fig. 1 arrow directions and stripping is at the position of support column 2, support column 2 and flexible base
It is point contact between the boundary of the release surface of plate 3, can effectively reduces peeling force；
Mode two etches support column 2 using chemical solution.Due to being equipped with support between rigid substrates 1 and flexible base board 3
Column 2 so that chemical solution can enter between rigid substrates 1 and flexible base board 3, can make flexibility after removing support column 2
Substrate 3 is stripped down from rigid substrates 1；
Mode three washes off remaining support column 2 with chemical solution again using after laser ablation support column 2.Due to using support
Column 2 reduces the contact area of rigid substrates 1 and flexible base board 3 to attach fixed flexible substrate 31, thus is burnt using laser
The influence of impurity can be reduced when falling support column 2, meanwhile, remaining support column 2 is washed off with chemical solution again after burning up support column 2,
It can make there is no support column 2 remaining on flexible base board 3, conform to quality requirements.
In the above method, it is preferred to use mode one is removed, and to 1 He of rigid substrates after removing flexible base board 3
Remaining glue is cleaned on support column 2, so as to reuse, reduces production cost.
A supporting surface is collectively formed by multiple support columns 2 in the precast segment of above-described embodiment, is realizing to flexible base board
Flexible substrate the contact area with flexible substrate is reduced while be supported, flexible base board can be reduced from rigid substrates
The tensile stress being subject to when upper stripping improves product yield.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation be not limited to the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe
Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (10)
1. a kind of precast segment convenient for stripping flexible base board, which is characterized in that the precast segment include rigid substrates with it is more
A support column, the multiple support column are formed in setting spacing on the rigid substrates, the top table of the multiple support column
Face is in the same plane and a supporting surface is collectively formed, and the flexible base board includes flexible substrate and function element, the branch
Support face is for attaching the fixed flexible substrate to prepare the function element in the flexible substrate.
2. precast segment as described in claim 1, which is characterized in that the multiple support column is arranged in arrays, is located at same
The spacing of capable support column is equal with positioned at the spacing of support column of same row.
3. precast segment as claimed in claim 2, which is characterized in that be located at a line support column spacing be located at it is same
The spacing of the support column of row is 0.1mm-2mm.
4. precast segment as described in claim 1, which is characterized in that the height of the multiple support column is 0.5 μm -2 μm.
5. precast segment as described in claim 1 or 4, which is characterized in that the cross section of the multiple support column be it is round, etc.
Side triangle, ellipse or square.
6. precast segment as claimed in claim 5, which is characterized in that the support column is cylindrical support column, the cylinder
The radius of shape support column is 100 μm of -2mm.
7. precast segment as described in claim 1, which is characterized in that the multiple support column is can be from the rigid substrates
The support construction of removal.
8. precast segment as claimed in claim 7, which is characterized in that the multiple support column is by a glue material, metal material
Or oxide material is made.
9. precast segment as described in claim 1, which is characterized in that the size for the supporting surface that the multiple support column is formed is big
In or equal to the flexible substrate size.
10. precast segment as described in claim 1, which is characterized in that the rigid substrates are glass substrate or stainless base steel
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721103879.8U CN207624673U (en) | 2017-08-30 | 2017-08-30 | Convenient for removing the precast segment of flexible base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721103879.8U CN207624673U (en) | 2017-08-30 | 2017-08-30 | Convenient for removing the precast segment of flexible base board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207624673U true CN207624673U (en) | 2018-07-17 |
Family
ID=62818084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721103879.8U Active CN207624673U (en) | 2017-08-30 | 2017-08-30 | Convenient for removing the precast segment of flexible base board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207624673U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| WO2020150902A1 (en) * | 2019-01-22 | 2020-07-30 | 深圳市柔宇科技有限公司 | Flexible display panel and manufacturing method therefor |
| CN117812831A (en) * | 2024-03-01 | 2024-04-02 | 四川科尔威光电科技有限公司 | Method for preparing flexible film circuit and rigid fixing device for facilitating stripping |
-
2017
- 2017-08-30 CN CN201721103879.8U patent/CN207624673U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN109743846B (en) * | 2018-09-27 | 2021-08-20 | 常州市武进三维电子有限公司 | Manufacturing process of hollow flexible circuit board of new energy automobile |
| WO2020150902A1 (en) * | 2019-01-22 | 2020-07-30 | 深圳市柔宇科技有限公司 | Flexible display panel and manufacturing method therefor |
| CN117812831A (en) * | 2024-03-01 | 2024-04-02 | 四川科尔威光电科技有限公司 | Method for preparing flexible film circuit and rigid fixing device for facilitating stripping |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207624673U (en) | Convenient for removing the precast segment of flexible base board | |
| CN102300688B (en) | Substrate breaking apparatus | |
| US20170317301A1 (en) | Base carrier, flexible display panel and manufacturing method thereof, flexible display device | |
| KR102236538B1 (en) | Producing method of mask and producing method of mask integrated frame | |
| CN109494237B (en) | Flexible display panel, manufacturing method thereof and flexible display device | |
| KR20050092131A (en) | Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board | |
| CN104276751B (en) | The processing unit (plant) of adhesive substrates | |
| US20220139781A1 (en) | Systems and methods for manufacturing flexible electronics | |
| CN104552629A (en) | Breaking apparatus and dividing method | |
| CN104552624A (en) | Elastic support plate, breaking apparatus and dividing method | |
| US20190067605A1 (en) | Method for manufacturing flexible electronic device | |
| CN104552628A (en) | Expander, breaking apparatus and dividing method | |
| KR102101257B1 (en) | Producing method of mask integrated frame | |
| KR102196797B1 (en) | Template for supporting mask and producing methoe thereof and producing method of mask integrated frame | |
| KR102138801B1 (en) | Producing method of template for supporting mask and producing method of mask integrated frame | |
| JP6832915B2 (en) | Printing equipment and printing method | |
| JP2002190457A (en) | Method for manufacturing and handling element having directivity | |
| KR20200046000A (en) | Producing method of template for supporting mask and producing method of mask integrated frame | |
| US11018328B2 (en) | Method and apparatus for manufacturing display substrate | |
| CN113437234B (en) | Method for peeling flexible substrate, flexible substrate and display panel | |
| JP6410157B2 (en) | Bonded substrate processing equipment | |
| EP2111993A3 (en) | Manufacturing method for a heating resistor element component | |
| CN105304446B (en) | The lower electrode base station and dry etching equipment of dry etching equipment | |
| KR102032025B1 (en) | Efficient Adhesive Cuck and Dechuck System | |
| JP2017066440A (en) | Method of manufacturing vapor deposition mask with substrate, method of manufacturing vapor deposition mask, and vapor deposition mask with substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |