TW201439689A - Drawing device and drawing method - Google Patents

Drawing device and drawing method Download PDF

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TW201439689A
TW201439689A TW103101193A TW103101193A TW201439689A TW 201439689 A TW201439689 A TW 201439689A TW 103101193 A TW103101193 A TW 103101193A TW 103101193 A TW103101193 A TW 103101193A TW 201439689 A TW201439689 A TW 201439689A
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substrate
sub
scanning direction
optical head
optical
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TW103101193A
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Chinese (zh)
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TWI542955B (en
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Hiroyuki Shirota
Ken Shigemoto
Yasuyuki Nagai
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Dainippon Screen Mfg
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Abstract

The present invention provides a technique to improve the drawing accuracy of patterns in strip-like areas of a substrate end portion. A drawing apparatus100 irradiates strip-like drawing light on a substrate 90 formed with photoreceptor, so as to draw patterns on the substrate 90. The drawing device 100 includes: a plurality of optical heads 33a~33e to emit the drawing light; a sub-scanning mechanism 221 to move the optical heads 33a~33e relative to the substrate 90 toward the sub-scanning direction (+x direction), and a main scanning mechanism 231 to relatively move toward the main-scanning direction (+y, -y direction). Furthermore, the drawing apparatus 100 includes an autofocus mechanism 6 for automatically adjusting the focus position of drawing light emitted by the plurality of optical heads 33. The autofocus mechanism 6 of heads 33b~33e of the plurality of optical heads 33 uses the substrate position, which is shifted from the central position CP of the drawing light toward the direction (-x direction) opposite to the sub-scanning direction, as the detecting position 71 for detecting changes of the separation distance L1.

Description

描繪裝置及描繪方法 Drawing device and drawing method

本發明係關於一種對半導體基板、印刷基板、液晶顯示裝置等所具備之彩色濾光片用基板、液晶顯示裝置或電漿顯示裝置等所具備之平板顯示器用玻璃基板、磁碟用基板、光碟用基板、太陽電池用面板等各種基板等(以下,亦簡稱為「基板」)照射光,而於基板上描繪圖案之技術。 The present invention relates to a glass substrate for a flat panel display, a substrate for a magnetic disk, and a compact disk for a color filter substrate, a liquid crystal display device, or a plasma display device provided in a semiconductor substrate, a printed circuit board, or a liquid crystal display device. A technique of irradiating light on various substrates such as a substrate or a solar cell panel (hereinafter also simply referred to as "substrate") to draw a pattern on the substrate.

已知有一種曝光裝置(所謂之描繪裝置),其於塗佈於基板上之感光材料上曝光電路等圖案時,不使用光罩等而藉由根據記述圖案之資料調變之光(描繪光)掃描基板上之感光材料,藉此於該感光材料上直接曝光圖案。作為此種描繪裝置,已知有例如自具備以像素單位對光束進行接通/斷開調變之空間光調變器之光學頭,對相對該光學頭相對地移動之基板照射描繪光而於基板上曝光(描繪)圖案者(例如,參照專利文獻1)。 There is known an exposure apparatus (so-called drawing apparatus) that modulates light according to data of a description pattern without using a mask or the like when exposing a pattern such as a circuit on a photosensitive material applied to a substrate (depicting light) The photosensitive material on the substrate is scanned to directly expose the pattern on the photosensitive material. As such a drawing device, for example, an optical head including a spatial light modulator that turns on and off a light beam in units of pixels is known, and the substrate that is relatively moved relative to the optical head is irradiated with the drawing light. A person who exposes (drapes) a pattern on a substrate (for example, refer to Patent Document 1).

於描繪裝置中,光學頭一面射出例如剖面為帶狀之描繪光,一面沿著與描繪光之長度方向正交之軸(主掃描軸)相對基板相對地移動(主掃描)。藉由進行該主掃描,相對基板上之沿著主掃描軸之一條帶狀區域進行圖案之曝光。光學頭完成伴有描繪光之照射之主掃描後,於沿著與主掃描軸正交之副掃描軸相對基板相對地移動後,再次進行伴有描繪光之照射之主掃描。藉此,對已於前次主掃描中曝光圖案之 帶狀區域之毗鄰之帶狀區域進行圖案之曝光。如此般,藉由間隔副掃描而反復進行伴有描繪光之照射之主掃描,於基板之整個區域曝光圖案。又,一般而言,亦預先於副掃描方向配置複數個光學頭,藉由上述主掃描同時於複數個帶狀區域描繪圖案。 In the drawing device, for example, the optical head emits, for example, a strip-shaped drawing light, and moves relative to the substrate (main scanning) along an axis (main scanning axis) orthogonal to the longitudinal direction of the drawing light. By performing the main scanning, pattern exposure is performed on a strip-shaped region along the main scanning axis on the opposite substrate. After the optical head completes the main scanning accompanied by the illumination of the drawing light, the main scanning is performed with the sub-scanning axis orthogonal to the main scanning axis, and then the main scanning is performed with the irradiation of the drawing light. Thereby, the exposure pattern has been used in the previous main scan. The adjacent strip-shaped regions of the strip region are subjected to pattern exposure. In this manner, the main scanning accompanied by the irradiation of the drawing light is repeated by the interval sub-scanning, and the pattern is exposed over the entire area of the substrate. Further, in general, a plurality of optical heads are arranged in advance in the sub-scanning direction, and the pattern is drawn in a plurality of strip-shaped regions simultaneously by the main scanning.

又,為使描繪光之焦點對準於基板上,有對光學頭設置自動聚焦機構之情形。自動聚焦機構藉由於圖案描繪中,計測光學頭、基板間之距離之變動,檢測因基板之彎曲或不平整等引起之曝光面之上下變動。自動聚焦機構根據該變動使光學頭之透鏡上升下降,藉此使描繪光之焦點始終對準於基板上之所需之曝光面。 Further, in order to align the focus of the drawing light on the substrate, there is a case where an optical focusing mechanism is provided to the optical head. The autofocus mechanism detects fluctuations in the distance between the optical head and the substrate during pattern drawing, and detects fluctuations in the exposure surface due to bending or unevenness of the substrate. The autofocus mechanism raises and lowers the lens of the optical head according to the change, thereby aligning the focus of the drawing light with the desired exposure surface on the substrate.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2009-237917號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-237917

然而,藉由上述之掃描進行圖案描繪處理時,存在對於複數個光學頭中之一部分光學頭,藉由自動聚焦機構獲得之上述距離之變動之檢測位置成為基板之外側或基板之端部之情形。基板之端部因未層壓有光阻膜或形成有階差或孔等,故而不適合於上述距離之計測之情形較多。因此,有自動聚焦機構無法正常發揮功能之情形。因此,關於基板端附近之帶狀區域,有描繪精度降低之虞。 However, when the pattern drawing process is performed by the above-described scanning, there is a case where the detection position of the variation of the above-described distance obtained by the autofocus mechanism becomes the outer side of the substrate or the end of the substrate for one of the plurality of optical heads. . Since the end portion of the substrate is not laminated with a photoresist film or a step or a hole is formed, it is not suitable for the measurement of the above distance. Therefore, there is a case where the autofocus mechanism cannot function normally. Therefore, regarding the strip-shaped region in the vicinity of the substrate end, the drawing accuracy is lowered.

本發明係鑑於上述問題而完成者,目的在於提供一種提高基板端部之帶狀區域之圖案之描繪精度之技術。 The present invention has been made in view of the above problems, and an object thereof is to provide a technique for improving the drawing accuracy of a pattern of a strip-shaped region at an end portion of a substrate.

為解決上述問題,第1態樣係對形成有感光體之基板照射光而於上述基板上描繪圖案之描繪裝置,該描繪裝置包含:複數個光學頭,其排列於副掃描方向,且各自射出帶狀之描繪光;掃描機構,其藉由 使上述複數個光學頭相對於上述基板,朝上述副掃描方向及與上述副掃描方向正交之主掃描方向相對地移動,來以上述描繪光掃描基板;及複數個自動聚焦機構,其設置於上述複數個光學頭之各者,並配合由檢測上述光學頭及上述基板之間之間隔距離之變動之檢測器所檢測出之上述間隔距離之變動,調整上述光學頭之上述描繪光之焦點位置;且上述複數個光學頭中之至少一部分光學頭之上述自動聚焦機構,以從上述描繪光之中央位置向與上述副掃描方向相反之方向偏移之基板上之位置,作為上述間隔距離之變動之檢測位置。 In order to solve the above problems, the first aspect is a drawing device that irradiates light onto a substrate on which a photoreceptor is formed to draw a pattern on the substrate, and the drawing device includes a plurality of optical heads arranged in a sub-scanning direction and each of which is emitted. Strip-shaped depicting light; scanning mechanism by The plurality of optical heads are moved relative to the substrate in the sub-scanning direction and the main scanning direction orthogonal to the sub-scanning direction to scan the substrate by the drawing light; and a plurality of autofocus mechanisms are provided on the substrate Each of the plurality of optical heads adjusts a focus position of the drawing light of the optical head in accordance with a variation of the separation distance detected by a detector that detects a variation in a distance between the optical head and the substrate And the autofocusing mechanism of at least a part of the plurality of optical heads is a position on the substrate shifted from a central position of the drawing light to a direction opposite to the sub-scanning direction as a variation of the separation distance Detection position.

又,第2態樣係如第1態樣之描繪裝置,其中於上述一部分光學頭中包含朝向上述副掃描方向配置於最外側之上述光學頭。 Further, the second aspect is the drawing device according to the first aspect, wherein the optical head includes the optical head disposed on the outermost side in the sub-scanning direction.

又,第3態樣係如第1或第2態樣之描繪裝置,其中上述一部分光學頭包含安裝機構,其以將上述檢測位置分別設定在相對於上述描繪光之中央位置於上述副掃描方向或其相反方向偏移之位置之方式,來安裝上述檢測器。 Further, the third aspect is the drawing device according to the first or second aspect, wherein the part of the optical head includes a mounting mechanism for setting the detection position at a center position with respect to the drawing light in the sub-scanning direction. The detector is mounted in such a manner that it is offset in the opposite direction.

又,第4態樣係如第1至第3態樣中任一1態樣之描繪裝置,其中上述一部分光學頭中,描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述自動聚焦機構,於描繪上述端部帶狀區域時,基於前次主掃描時所獲得之上述間隔距離之變動之檢測結果,調整上述焦點位置。 Further, the fourth aspect is the drawing device according to any one of the first aspect to the third aspect, wherein the part of the optical head is the same as the end band portion of the end portion of the substrate in the sub-scanning direction In the above-described autofocusing mechanism of the optical head, when the end band region is drawn, the focus position is adjusted based on the detection result of the variation of the separation distance obtained in the previous main scanning.

又,第5態樣係如第1至第4態樣中任一1態樣之描繪裝置,其中進而包含控制上述掃描機構及上述自動聚焦機構之控制部,上述控制部一面以使上述一部分光學頭中,描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述自動聚焦機構之檢測位置,被包含於基板之既定之有效區域之方式,使上述光學頭沿著上述副掃描方向相對移動,然後朝上述主掃描方向相對移動,一面使上述自動聚焦機構進行上述間隔距離之變動之檢測。 Further, the fifth aspect is the drawing device according to any one of the first aspect to the fourth aspect, further comprising: a control unit that controls the scanning mechanism and the autofocus mechanism, wherein the control unit is configured to make the optical portion a head in which the detection position of the autofocus mechanism of the optical head of the end portion of the substrate in the sub-scanning direction is included in a predetermined effective area of the substrate, so that the optical head is along The sub-scanning direction is relatively moved, and then moved in the main scanning direction, and the autofocus mechanism detects the variation of the separation distance.

又,第6態樣係對形成有感光體之基板照射光而於上述基板上描繪圖案之描繪方法,該描繪方法包含:(a)自排列於副掃描方向之複數個光學頭之各者射出帶狀之描繪光之步驟;(b)於上述(a)步驟中,藉由使上述複數個光學頭相對於上述基板,朝上述副掃描方向及與上述副掃描方向正交之主掃描方向相對地移動,來以上述描繪光掃描基板之步驟;及(c)於上述(b)步驟中,藉由檢測器檢測上述光學頭及上述基板之間之間隔距離之變動,並配合所檢測出之上述間隔距離之變動,調整上述光學頭之上述描繪光之焦點之步驟;且於上述(c)步驟中,對於上述複數個光學頭中之至少一部分光學頭,於從自上述描繪光之中央位置向與上述副掃描方向相反之方向偏移之基板上之位置,檢測上述間隔距離之變動。 Further, the sixth aspect is a method of drawing a pattern on a substrate on which a photoreceptor is formed, and drawing a pattern on the substrate, the drawing method comprising: (a) emitting each of a plurality of optical heads arranged in the sub-scanning direction. a step of drawing light in a strip shape; (b) in the step (a), the plurality of optical heads are opposed to the substrate, and the main scanning direction is orthogonal to the sub-scanning direction and the sub-scanning direction Ground moving to scan the substrate by the above-described light scanning; and (c) in the above step (b), detecting, by the detector, a variation of the separation distance between the optical head and the substrate, and cooperating with the detected a step of adjusting a focus of the drawing light of the optical head by the variation of the separation distance; and in the step (c), at least a part of the optical heads of the plurality of optical heads are at a central position from the light to be drawn The change in the separation distance is detected at a position on the substrate offset from the sub-scanning direction.

又,第7態樣係如第6態樣之描繪方法,其中上述一部分光學頭包含朝向上述副掃描方向配置於最外側之上述光學頭。 Further, the seventh aspect is the drawing method according to the sixth aspect, wherein the part of the optical head includes the optical head disposed to the outermost side in the sub-scanning direction.

又,第8態樣係如第6或第7態樣之描繪方法,其中上述一部分光學頭包含安裝機構,其以將上述檢測位置分別設定在相對於上述描繪光之中央位置於上述副掃描方向或其相反方向偏移之位置之方式,來安裝上述檢測器。 Further, the eighth aspect is the drawing method according to the sixth or seventh aspect, wherein the part of the optical head includes a mounting mechanism for setting the detection position at a central position with respect to the drawing light in the sub-scanning direction The detector is mounted in such a manner that it is offset in the opposite direction.

又,第9態樣係如第6至第8態樣中任一1態樣之描繪方法,其中於上述(c)步驟中,對於上述一部分光學頭中描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭,係於描繪上述端部帶狀區域時,基於由前次主掃描所獲得之上述間隔距離之變動之檢測結果,調整上述焦點位置。 Further, the ninth aspect is the drawing method according to any one of the sixth aspect to the eighth aspect, wherein in the step (c), the end portion of the substrate in the sub-scanning direction is drawn for the portion of the optical head The optical head of the end band-shaped region adjusts the focus position based on the detection result of the variation of the separation distance obtained by the previous main scanning when the end band region is drawn.

又,第10態樣係如第6至第9態樣中任一1態樣之描繪方法,其中上述(c)步驟包含:(c-1)以使針對上述一部分光學頭中描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述檢測位置,被包含於基板之既定之有效區域之方式,使上述光學頭沿著上述 副掃描方向相對移動之步驟;及(c-2)於上述(c-1)步驟後,一面使上述光學頭33朝上述主掃描方向相對移動,一面檢測上述離間距離之變動之步驟。 Further, the tenth aspect is the drawing method of any one of the sixth to ninth aspects, wherein the step (c) comprises: (c-1) to position the substrate for the part of the optical head; The detection position of the optical head in the end strip region of the end portion in the sub-scanning direction is included in a predetermined effective area of the substrate, so that the optical head is along the above a step of relatively moving the sub-scanning direction; and (c-2) a step of detecting the variation of the separation distance while moving the optical head 33 in the main scanning direction after the step (c-1).

根據第1至第10態樣,可使針對至少一部分光學頭之檢測間隔距離之變動之檢測位置,相對於描繪光之中央位置向與副掃描方向相反之方向偏移。藉此,可提高於描繪基板之端部帶狀區域時,可將檢測位置設定於檢測有效之區域之可能性。藉此,可提高端部帶狀區域之描繪精度。 According to the first to tenth aspects, the detection position for the variation of the detection interval distance of at least a part of the optical head can be shifted in the direction opposite to the sub-scanning direction with respect to the central position of the drawing light. Thereby, it is possible to increase the possibility that the detection position is set to the area where the detection is effective when the end band portion of the substrate is drawn. Thereby, the drawing accuracy of the end band region can be improved.

又,根據第2及第7之態樣,可使針對描繪端部帶狀區域之光學頭之檢測位置,相對於描繪光之中央向與副掃描方向相反之方向位移。藉此,可提高端部帶狀區域之描繪精度。 Further, according to the second and seventh aspects, the detection position of the optical head for drawing the end band region can be displaced in the direction opposite to the sub-scanning direction with respect to the center of the drawing light. Thereby, the drawing accuracy of the end band region can be improved.

又,根據第3及第8之態樣,只要變更檢測器之安裝方法就可決定針對各光學頭之檢測位置之位移方向。藉由此種零件之共通化,易進行零件管理,又可謀求裝置成本之降低化。 Further, according to the third and eighth aspects, the direction of displacement of the detection position for each optical head can be determined by changing the mounting method of the detector. With the commonality of such parts, it is easy to manage parts and reduce the cost of the device.

又,根據第4及第9態樣,即使於描繪端部帶狀區域時光學頭之檢測位置自檢測有效之區域偏離之情形時,亦可利用前次檢測結果進行描繪光之焦點位置之調整。因此,可對端部帶狀區域良好地進行圖案描繪。 Further, according to the fourth and ninth aspects, even when the detection position of the optical head is deviated from the area where the detection is effective when the end band region is drawn, the focus position of the drawing light can be adjusted by the previous detection result. . Therefore, the end band region can be well patterned.

又,根據第5及第10態樣,於圖案描繪之前,以將檢測位置設定於檢測有效之有效區域之方式移動光學頭,然後檢測間隔距離之變動。藉此,於端部帶狀區域之圖案描繪時,即便檢測位置自既定之有效區域偏離,亦可基於預先取得之間隔距離之變動,有效地調整描繪光之焦點位置。 Further, according to the fifth and tenth aspects, before the pattern drawing, the optical head is moved such that the detection position is set to the effective area for detecting the detection, and then the variation of the separation distance is detected. Thereby, even when the detection position is deviated from the predetermined effective area in the pattern drawing of the end band-shaped region, the focus position of the drawing light can be effectively adjusted based on the fluctuation of the interval distance acquired in advance.

1‧‧‧台座 1‧‧‧ pedestal

2‧‧‧移動板組 2‧‧‧Mobile board set

3‧‧‧曝光部 3‧‧‧Exposure Department

4‧‧‧光調變部 4‧‧‧Light Modulation Department

5‧‧‧控制部 5‧‧‧Control Department

6‧‧‧自動聚焦機構 6‧‧‧Auto Focus Mechanism

11‧‧‧橋接構造體 11‧‧‧Bridged structure

21‧‧‧基板保持板 21‧‧‧Substrate retention board

22‧‧‧支撐板 22‧‧‧Support board

23‧‧‧底板 23‧‧‧floor

24‧‧‧基台 24‧‧‧Abutment

31‧‧‧LED光源部 31‧‧‧LED light source department

32‧‧‧照明光學系統 32‧‧‧Lighting optical system

33‧‧‧光學頭 33‧‧‧ Optical head

33a‧‧‧光學頭 33a‧‧‧ Optical head

33b‧‧‧光學頭 33b‧‧‧ Optical head

33c‧‧‧光學頭 33c‧‧ optical head

33d‧‧‧光學頭 33d‧‧‧Optical head

33e‧‧‧光學頭 33e‧‧ optical head

33R‧‧‧描繪區域 33R‧‧‧ depicting area

51‧‧‧CPU 51‧‧‧CPU

52‧‧‧ROM 52‧‧‧ROM

53‧‧‧RAM 53‧‧‧RAM

54‧‧‧記憶體 54‧‧‧ memory

55‧‧‧程式 55‧‧‧Program

56‧‧‧顯示部 56‧‧‧Display Department

57‧‧‧操作部 57‧‧‧Operation Department

61‧‧‧檢測器 61‧‧‧Detector

62‧‧‧安裝機構 62‧‧‧Installation agency

63‧‧‧升降機構 63‧‧‧ Lifting mechanism

71‧‧‧檢測位置 71‧‧‧Detection location

71a‧‧‧檢測位置 71a‧‧‧Detection location

71b‧‧‧檢測位置 71b‧‧‧Detection location

71c‧‧‧檢測位置 71c‧‧‧Detection location

71d‧‧‧檢測位置 71d‧‧‧Detection location

71e‧‧‧檢測位置 71e‧‧‧Detection location

81‧‧‧圖表 81‧‧‧Chart

83‧‧‧圖表 83‧‧‧ Chart

85‧‧‧圖表 85‧‧‧Chart

90‧‧‧基板 90‧‧‧Substrate

100‧‧‧描繪裝置 100‧‧‧Drawing device

211‧‧‧轉動機構 211‧‧‧Rotating mechanism

211a‧‧‧線性馬達 211a‧‧‧linear motor

211b‧‧‧轉動軸 211b‧‧‧Rotary axis

221‧‧‧副掃描機構 221‧‧‧Sub Scanning Mechanism

221a‧‧‧線性馬達 221a‧‧‧linear motor

221b‧‧‧引導部 221b‧‧‧Guidance

231‧‧‧主掃描機構 231‧‧‧Main scanning mechanism

231a‧‧‧線性馬達 231a‧‧‧Linear motor

231b‧‧‧引導部 231b‧‧‧Guidance

332‧‧‧投影光學系統 332‧‧‧Projection optical system

541‧‧‧圖案資料 541‧‧‧Pattern information

611‧‧‧照射部 611‧‧‧ Department of Irradiation

613‧‧‧受光部 613‧‧‧Receiving Department

a‧‧‧距離 A‧‧‧distance

AR11‧‧‧掃描方向 AR11‧‧‧ scan direction

AR12‧‧‧掃描方向 AR12‧‧‧ scan direction

AR13‧‧‧掃描方向 AR13‧‧‧ scan direction

CP‧‧‧中央位置 CP‧‧‧Central location

CPa‧‧‧中央位置 CPa‧‧‧Central location

CPb‧‧‧中央位置 CPb‧‧‧ central location

CPc‧‧‧中央位置 CPc‧‧‧ central location

CPd‧‧‧中央位置 CPd‧‧‧ central location

CPe‧‧‧中央位置 CPe‧‧‧ central location

H‧‧‧間隔 H‧‧‧ interval

L1‧‧‧間隔距離 L1‧‧‧ separation distance

Mx‧‧‧移動量 Mx‧‧‧moving volume

NR‧‧‧不適合區域 NR‧‧‧Not suitable for the area

p‧‧‧寬度 p‧‧‧Width

q‧‧‧寬度 q‧‧‧Width

r‧‧‧有效區域VR之裕度 R‧‧‧ Effective area VR margin

R1‧‧‧帶狀區域 R1‧‧‧ banded area

R2‧‧‧帶狀區域 R2‧‧‧ banded area

R3‧‧‧帶狀區域 R3‧‧‧ banded area

R11‧‧‧端部帶狀區域 R11‧‧‧End strip zone

S1‧‧‧步驟 S1‧‧‧ steps

S2‧‧‧步驟 S2‧‧‧ steps

S3‧‧‧步驟 S3‧‧‧ steps

SW‧‧‧描繪光之寬度(條寬度) SW‧‧‧Draws the width of light (bar width)

VR‧‧‧有效區域 VR‧‧‧effective area

Wb‧‧‧副掃描方向之寬度 Wb‧‧‧ width of sub-scanning direction

x‧‧‧方向 X‧‧‧ directions

X‧‧‧方向 X‧‧‧ direction

y‧‧‧方向 Y‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

圖1係顯示實施形態之描繪裝置之概略之立體圖。 Fig. 1 is a perspective view showing the outline of the drawing device of the embodiment.

圖2係顯示描繪裝置之概略之俯視圖。 Fig. 2 is a plan view showing the outline of the drawing device.

圖3係描繪裝置之匯流排配線圖。 Figure 3 is a diagram showing the busbar wiring diagram of the device.

圖4係顯示曝光部之概略之立體圖。 Fig. 4 is a perspective view showing an outline of an exposure portion.

圖5係顯示正在進行描繪處理之基板之俯視圖。 Fig. 5 is a plan view showing a substrate on which drawing processing is being performed.

圖6係顯示光學頭之概略之側視圖。 Fig. 6 is a side view showing an outline of an optical head.

圖7係顯示曝光部之概略之前視圖。 Fig. 7 is a schematic front view showing an exposure portion.

圖8係概念性顯示複數個光學頭對基板進行主掃描之位置之圖。 Figure 8 is a diagram conceptually showing the position at which a plurality of optical heads perform a main scan on a substrate.

圖9係顯示描繪端部帶狀區域之光學頭之概略俯視圖。 Figure 9 is a schematic plan view showing an optical head depicting an end band region.

圖10係顯示描繪端部帶狀區域之光學頭之概略俯視圖。 Figure 10 is a schematic plan view showing an optical head depicting an end band region.

圖11係顯示由描繪端部帶狀區域之光學頭之檢測器所檢測出之間隔距離之變動量之圖。 Figure 11 is a graph showing the amount of variation in the separation distance detected by the detector of the optical head depicting the end band region.

圖12係顯示由描繪端部帶狀區域之光學頭之檢測器所檢測出之間隔距離之變動量之圖。 Figure 12 is a graph showing the amount of variation in the separation distance detected by the detector of the optical head depicting the end band region.

圖13係顯示由描繪端部帶狀區域之光學頭之檢測器所檢測出之間隔距離之變動量之圖。 Figure 13 is a graph showing the amount of variation in the separation distance detected by the detector of the optical head depicting the end band region.

圖14係顯示描繪端部帶狀區域之光學頭之概略俯視圖。 Figure 14 is a schematic plan view showing an optical head depicting an end band region.

圖15係顯示描繪基板中位於與副掃描方向為相反方向之端部之帶狀區域之光學頭之概略俯視圖。 Fig. 15 is a schematic plan view showing an optical head in which a strip-shaped region located at an end portion opposite to the sub-scanning direction in the substrate is drawn.

圖16係顯示藉由預聚焦所獲得之基板之表面高度之變動之圖表之圖。 Fig. 16 is a graph showing a graph showing changes in the surface height of the substrate obtained by pre-focusing.

圖17係顯示圖案描繪處理之流程之圖。 Fig. 17 is a view showing the flow of the pattern drawing processing.

以下,一面參照圖式一面對本發明之實施形態進行說明。另外,於圖式中為容易理解而存在將各部之尺寸或數量誇大或簡略化圖示之情形。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the drawings, for the sake of easy understanding, there is a case where the size or number of each part is exaggerated or simplified.

<1.裝置構成> <1. Device configuration>

圖1係顯示實施形態之描繪裝置100之概略之立體圖。又,圖2係顯示描繪裝置100之概略之俯視圖。再者,圖3係描繪裝置100之匯流排配線圖。於圖1中,雖為方便圖示及說明,而定義為Z軸方向表示鉛直方向,XY平面表示水平面者,但其等係為方便把握位置關係而定義者,並非限定以下將說明之各方向者。對於以下之各圖亦相同。又,於圖2中,為方便說明,藉由二點鏈線圖示橋接構造體11及光學頭33。 Fig. 1 is a perspective view showing the outline of the drawing device 100 of the embodiment. 2 is a plan view showing the outline of the drawing device 100. Furthermore, FIG. 3 is a diagram showing the busbar wiring diagram of the device 100. In FIG. 1, for convenience of illustration and description, the Z-axis direction is defined as a vertical direction, and the XY plane is a horizontal plane. However, it is defined to facilitate the grasp of the positional relationship, and is not limited to the directions described below. By. The same is true for the following figures. Further, in Fig. 2, for convenience of explanation, the bridge structure 11 and the optical head 33 are illustrated by a two-dot chain line.

描繪裝置100係於製造印刷基板之步驟中,於形成於印刷基板(以下,簡稱為「基板」)90之上表面之感光材料(光阻膜)之層(感光體)上描繪用於器件形成之圖案之裝置。如圖1及圖2所示,描繪裝置100主要具備台座1、移動板組2、曝光部3、及控制部5。 The drawing device 100 is formed on a layer (photoreceptor) of a photosensitive material (photoresist film) formed on the upper surface of a printed substrate (hereinafter simply referred to as "substrate") 90 for the device formation in the step of manufacturing a printed substrate. The device of the pattern. As shown in FIGS. 1 and 2, the drawing device 100 mainly includes a pedestal 1, a moving plate group 2, an exposure unit 3, and a control unit 5.

○台座1 ○ pedestal 1

台座1具有大致長方體狀之外形,於其上表面之大致水平之區域中具備橋接構造體11或移動板組2。橋接構造體11大致水平地架設於移動板組2之上方而固定於台座1上。如圖1所示,台座1一體地支撐移動板組2與橋接構造體11。 The pedestal 1 has a substantially rectangular parallelepiped shape, and has a bridge structure 11 or a moving plate group 2 in a substantially horizontal region of the upper surface thereof. The bridge structure 11 is mounted horizontally above the moving plate group 2 and fixed to the pedestal 1. As shown in FIG. 1, the pedestal 1 integrally supports the moving plate group 2 and the bridge structure 11.

○移動板組2 ○Mobile board group 2

移動板組2主要具備:基板保持板21,其將基板90保持於其上表面之大致水平之區域;支撐板22,其自下方支撐基板保持板21;底板23,其自下方支撐支撐板22;基台24,其自下方支撐底板23;轉動機構211,其使基板保持板21繞Z軸轉動;副掃描機構221,其用於使支撐板22朝X軸方向移動;及主掃描機構231,其用於使底板23朝Y軸方向移動。 The moving plate group 2 mainly includes a substrate holding plate 21 that holds the substrate 90 at a substantially horizontal area of the upper surface thereof, a support plate 22 that supports the substrate holding plate 21 from below, and a bottom plate 23 that supports the support plate 22 from below. a base 24 that supports the bottom plate 23 from below; a rotating mechanism 211 that rotates the substrate holding plate 21 about the Z axis; a sub-scanning mechanism 221 that moves the support plate 22 toward the X-axis direction; and a main scanning mechanism 231 It is used to move the bottom plate 23 in the Y-axis direction.

雖省略圖示,但基板保持板21於其上表面分散設置有複數個吸附孔。該等吸附孔連接於真空泵,藉由使該真空泵動作,可將基板及基板保持板21間之氣體排氣。藉此,可將基板90吸附保持於基板保持 板21之上表面。 Although not shown in the drawings, the substrate holding plate 21 is provided with a plurality of adsorption holes dispersed on the upper surface thereof. The adsorption holes are connected to a vacuum pump, and by operating the vacuum pump, the gas between the substrate and the substrate holding plate 21 can be exhausted. Thereby, the substrate 90 can be adsorbed and held on the substrate. The upper surface of the plate 21.

如圖2所示,轉動機構211具有線性馬達211a,該線性馬達211a包含安裝於基板保持板21之(-Y)側端部之移動子與設置於支撐板22之上表面之固定子。又,轉動機構211於基板保持板21之中央部下表面側與支撐板22之間具有轉動軸211b。藉由使線性馬達211a動作,移動子沿著固定子朝X軸方向移動,基板保持板21則以支撐板22上之轉動軸211b為中心於特定角度之區域內轉動。 As shown in FIG. 2, the rotation mechanism 211 has a linear motor 211a including a mover attached to the (-Y) side end portion of the substrate holding plate 21 and a stator provided on the upper surface of the support plate 22. Further, the rotation mechanism 211 has a rotation shaft 211b between the lower surface side of the central portion of the substrate holding plate 21 and the support plate 22. By operating the linear motor 211a, the mover moves in the X-axis direction along the stator, and the substrate holding plate 21 rotates in a region of a specific angle centering on the rotation shaft 211b on the support plate 22.

副掃描機構221具有線性馬達221a,該線性馬達211a包含安裝於支撐板22之下表面之移動子與設置於底板23之上表面之固定子。又,副掃描機構221於支撐板22與底板23之間,具有一對朝X軸方向延伸之引導部221b。藉由使線性馬達221a動作,支撐板22會沿著底板23上之引導部221b朝X軸方向移動。 The sub-scanning mechanism 221 has a linear motor 221a including a mover mounted on a lower surface of the support plate 22 and a stator provided on an upper surface of the bottom plate 23. Further, the sub-scanning mechanism 221 has a pair of guide portions 221b extending in the X-axis direction between the support plate 22 and the bottom plate 23. By operating the linear motor 221a, the support plate 22 moves in the X-axis direction along the guide portion 221b on the bottom plate 23.

主掃描機構231具有線性馬達231a,該線性馬達231a包含安裝於底板23之下表面之移動子與設置於基台24上之固定子。又,主掃描機構231於底板23與台座1之間具有一對朝Y軸方向延伸之引導部231b。藉由使線性馬達231a動作,底板23會沿著基台24上之引導部231b朝Y軸方向移動。因此,藉由於將基板90保持在基板保持板21上之狀態下,來使主掃描機構231動作,可使基板90沿著Y軸方向移動。另外,該等移動機構係利用後述之控制部5控制其動作。 The main scanning mechanism 231 has a linear motor 231a including a mover mounted on the lower surface of the bottom plate 23 and a stator provided on the base 24. Further, the main scanning mechanism 231 has a pair of guiding portions 231b extending in the Y-axis direction between the bottom plate 23 and the pedestal 1. By operating the linear motor 231a, the bottom plate 23 moves in the Y-axis direction along the guide portion 231b on the base 24. Therefore, by holding the substrate 90 on the substrate holding plate 21, the main scanning mechanism 231 is operated, and the substrate 90 can be moved in the Y-axis direction. Further, these mobile mechanisms control the operation of the mobile unit by a control unit 5 which will be described later.

另外,關於轉動機構211、副掃描機構221及主掃描機構231之驅動,係非限定於利用上述線性馬達211a、221a、231a者。例如,關於轉動機構211及副掃描機構221,亦可為利用伺服馬達及滾珠螺桿驅動者。又,亦可設置使曝光部3移動之移動機構,來取代使基板90移動。再者,亦可使基板90及曝光部3兩者均移動。又,雖省略圖示,但亦可設置例如藉由使基板保持板21於Z軸方向升降,而使基板90上下升降之升降機構。 The driving of the rotation mechanism 211, the sub-scanning mechanism 221, and the main scanning mechanism 231 is not limited to those using the linear motors 211a, 221a, and 231a. For example, the rotation mechanism 211 and the sub-scanning mechanism 221 may be driven by a servo motor or a ball screw. Further, instead of moving the substrate 90, a moving mechanism for moving the exposure unit 3 may be provided. Furthermore, both the substrate 90 and the exposure unit 3 can be moved. Moreover, although not shown in the figure, for example, an elevating mechanism that raises and lowers the substrate 90 by moving the substrate holding plate 21 up and down in the Z-axis direction may be provided.

○曝光部3 ○ Exposure section 3

回到圖1,曝光部3具備複數個光學單元(此處為5個),該等光學單元係包含LED(Light Emitting Diode:發光二極體)光源部31、照明光學系統32及光學頭33。另外,於圖1中雖省略圖示,但針對各光學頭33,分別設置有LED光源部31及照明光學系統32。LED光源部31係基於自控制部5所傳送而來之所需之驅動信號,射出所需波長之雷射光之光源裝置。自LED光源部31射出之光束,經由包含桿積算器、透鏡及鏡面等之照明光學系統32而被導入光學頭33。 Referring back to FIG. 1 , the exposure unit 3 includes a plurality of optical units (here, five), and the optical units include an LED (Light Emitting Diode) light source unit 31, an illumination optical system 32, and an optical head 33. . Although not shown in FIG. 1, the LED light source unit 31 and the illumination optical system 32 are provided for each of the optical heads 33. The LED light source unit 31 is a light source device that emits laser light of a desired wavelength based on a required driving signal transmitted from the control unit 5. The light beam emitted from the LED light source unit 31 is guided to the optical head 33 via an illumination optical system 32 including a rod totalizer, a lens, and a mirror surface.

各光學頭33係將自照明光學系統32射出之光線照射至基板90之上表面者。各光學頭33沿著X軸方向以等間距配設於橋接構造體11之側面上部。 Each of the optical heads 33 irradiates the light emitted from the illumination optical system 32 to the upper surface of the substrate 90. Each of the optical heads 33 is disposed at an upper portion of the side surface of the bridge structure 11 at equal intervals along the X-axis direction.

圖4係顯示曝光部3之概略之立體圖。又,圖5係顯示光學頭33之概略之側視圖。另外,於圖4中光調變部4及投影光學系統332配置於各光學頭33之內部之特定位置。自LED光源部31射出之光束於照明光學系統32中成形為矩形狀。且,通過照明光學系統32之光束導入至光調變部4,從而照射至光調變部4之調變動作有效區域。 FIG. 4 is a schematic perspective view showing the exposure unit 3. Moreover, FIG. 5 is a schematic side view showing the optical head 33. Further, in FIG. 4, the light modulation unit 4 and the projection optical system 332 are disposed at specific positions inside the optical heads 33. The light beam emitted from the LED light source unit 31 is formed into a rectangular shape in the illumination optical system 32. Then, the light beam that has passed through the illumination optical system 32 is introduced into the light modulation unit 4, and is irradiated to the modulation operation effective region of the light modulation unit 4.

照射至光調變部4之光束基於控制部5之控制空間調變,而射入至投影光學系統332。投影光學系統332將射入之光變倍至所需之倍率,而導向朝主掃描方向移動之基板90上。 The light beam that has been irradiated to the light modulation unit 4 is modulated by the control space of the control unit 5, and is incident on the projection optical system 332. The projection optical system 332 doubles the incident light to a desired magnification and directs it onto the substrate 90 that moves in the main scanning direction.

○光調變部4 ○Light modulation part 4

光調變部4具備數位鏡面裝置(DMD:Digital Mirror Device),其藉由電性控制使入射光空間調變,並使有助於圖案之描繪之必要光與不助於圖案之描繪之不必要光,相互朝不同之方向反射。DMD係將例如1邊約10μm之正方形之微小鏡面排列成1920×1080個矩陣狀而成之空間調變元件。各個鏡面構成為根據寫入至記憶單元之資料,以正方形之對角為軸,而以所需角度傾斜。根據來自控制部5之復位信 號,各個鏡面一齊驅動。 The light modulation unit 4 is provided with a digital mirror device (DMD: Digital Mirror Device), which adjusts the incident light spatially by electrical control, and does not contribute to the necessary light of the pattern and does not contribute to the depiction of the pattern. Necessary light, reflecting each other in different directions. The DMD is a spatial modulation element in which, for example, a square mirror having a square of about 10 μm is arranged in a matrix of 1920 × 1080. Each mirror is configured to be tilted at a desired angle based on the data written to the memory unit, with the diagonal of the square as the axis. According to the reset letter from the control unit 5 No., each mirror is driven together.

顯示於DMD之圖案藉由投影光學系統332投影於基板90之曝光面上。又,顯示於DMD之圖案如後述般,隨著由主掃描機構231產生之基板保持板21之移動,藉由基於主掃描機構231之編碼器信號所製作之復位脈衝連續重寫。藉此,描繪光照射至基板90之曝光面上,而形成條狀之像。 The pattern displayed on the DMD is projected onto the exposure surface of the substrate 90 by the projection optical system 332. Further, as will be described later, the pattern of the DMD is continuously rewritten by the reset pulse generated based on the encoder signal of the main scanning unit 231 as the substrate holding plate 21 generated by the main scanning unit 231 moves. Thereby, the drawing light is irradiated onto the exposure surface of the substrate 90 to form a strip image.

圖5係顯示正在進行描繪處理之基板90之俯視圖。描繪處理係藉由一面在控制部5之控制下使主掃描機構231及副掃描機構221載置於基板保持板21之基板90相對複數個光學頭33相對地移動,一面自複數個光學頭33之各者對基板90之上表面照射經空間調變之光而進行。 FIG. 5 is a plan view showing the substrate 90 in which the drawing process is being performed. The drawing process is performed by moving the substrate 90 on which the main scanning mechanism 231 and the sub-scanning mechanism 221 are placed on the substrate holding plate 21 relative to the plurality of optical heads 33 under the control of the control unit 5, and the plurality of optical heads 33 are self-contained. Each of these is performed by irradiating the surface of the substrate 90 with spatially modulated light.

另外,於以下之說明中,於基板90上定義相互正交之x軸方向及y軸方向。該基板90上所定義之xy座標系,隨著由主掃描機構231產生之基板90之移動,沿著XYZ座標系之Y軸方向移動。又,xy座標系隨著由副掃描機構221產生之基板90之移動,沿著XYZ座標系之X軸方向移動。 In addition, in the following description, the x-axis direction and the y-axis direction orthogonal to each other are defined on the substrate 90. The xy coordinate system defined on the substrate 90 moves along the Y-axis direction of the XYZ coordinate system in accordance with the movement of the substrate 90 generated by the main scanning mechanism 231. Further, the xy coordinate moves along the X-axis direction of the XYZ coordinate system in accordance with the movement of the substrate 90 generated by the sub-scanning mechanism 221.

又,將藉由主掃描機構231移動基板90時之自基板90觀察到之光學頭33之移動方向作為主掃描方向。又,將藉由副掃描機構231移動基板90時之自基板90觀察到之光學頭33之移動方向作為副掃描方向。於圖5所示之例中,主掃描方向成為+y方向(箭頭符號AR11)及-y方向(箭頭符號AR13),副掃描方向成為+x方向(箭頭符號AR12)。 Moreover, the moving direction of the optical head 33 observed from the substrate 90 when the main scanning mechanism 231 moves the substrate 90 is taken as the main scanning direction. Moreover, the moving direction of the optical head 33 observed from the substrate 90 when the sub-scanning mechanism 231 moves the substrate 90 is referred to as the sub-scanning direction. In the example shown in FIG. 5, the main scanning direction is the +y direction (arrow symbol AR11) and the -y direction (arrow symbol AR13), and the sub-scanning direction is the +x direction (arrow symbol AR12).

首先,藉由主掃描機構231使基板保持板12朝-Y方向移動,藉此使基板90相對光學頭相對地移動(主掃描)。自基板90觀察此時,複數個光學頭33如箭頭符號AR11所示般朝+y方向相對地移動。進行該主掃描之期間,各光學頭33將根據圖案資料541調變之剖面矩形狀之描繪光連續照射於基板90。即,將光投影至基板90之曝光面。於各光學頭33沿著主掃描方向(+y方向)橫截基板90一次時,與各描繪光對 應之描繪區域33R通過基板90上,藉此於帶狀區域R1中描繪圖案。該帶狀區域R1係朝主掃描方向延伸,且沿著副掃描方向之寬度相當於描繪光之寬度(條寬度)之區域。此處,由於5個光學頭33同時於基板90上進行橫截,故可藉由1次主掃描同時於5條帶狀區域R1之各者中描繪圖案。 First, the substrate holding plate 12 is moved in the -Y direction by the main scanning mechanism 231, whereby the substrate 90 is relatively moved relative to the optical head (main scanning). At this time, as viewed from the substrate 90, the plurality of optical heads 33 relatively move in the +y direction as indicated by the arrow symbol AR11. During the main scanning, each of the optical heads 33 continuously irradiates the substrate 90 with the drawing light having a rectangular cross section that is modulated according to the pattern data 541. That is, light is projected onto the exposure surface of the substrate 90. When each optical head 33 crosses the substrate 90 once in the main scanning direction (+y direction), it is associated with each drawing light. The drawing area 33R passes through the substrate 90, thereby drawing a pattern in the strip-shaped area R1. The strip-shaped region R1 extends in the main scanning direction, and the width along the sub-scanning direction corresponds to a region in which the width (bar width) of the light is drawn. Here, since the five optical heads 33 are simultaneously cross-sectionally formed on the substrate 90, the pattern can be drawn simultaneously in each of the five strip-shaped regions R1 by one main scanning.

結束1次主掃描後,藉由副掃描機構221使基板保持板21朝+X方向移動既定之距離,藉此使基板90相對光學頭33相對移動(副掃描)。自基板90觀察此時,如箭頭符號AR12所示般,複數個光學頭33朝副掃描方向(+x方向)移動既定之距離。 After the main scanning is completed once, the substrate holding plate 21 is moved by a predetermined distance in the +X direction by the sub scanning mechanism 221, whereby the substrate 90 is relatively moved relative to the optical head 33 (sub-scanning). At this time, as viewed from the substrate 90, as shown by an arrow symbol AR12, the plurality of optical heads 33 are moved by a predetermined distance in the sub-scanning direction (+x direction).

結束副掃描後,再次進行主掃描。即,藉由主掃描機構231使基板保持板21朝+Y方向移動,藉此使基板90相對複數個光學頭33相對地移動。自基板90觀察此時,各光學頭33藉由朝-y方向移動,而如箭頭符號AR13所示般,橫截基板90上之鄰接於由前次主掃描所描繪之帶狀區域R1之區域。於該主掃描中,各光學頭33亦向基板90連續地照射根據圖案資料541調變之描繪光。藉此,於鄰接於由前次主掃描所描繪之帶狀區域R1之帶狀區域R2中描繪圖案。 After the sub-scan is finished, the main scan is performed again. That is, the substrate holding plate 21 is moved in the +Y direction by the main scanning mechanism 231, whereby the substrate 90 is relatively moved relative to the plurality of optical heads 33. At this time, as viewed from the substrate 90, each of the optical heads 33 is moved in the -y direction, as shown by the arrow symbol AR13, across the area of the substrate 90 adjacent to the strip-shaped region R1 depicted by the previous main scan. . In the main scanning, each of the optical heads 33 also continuously irradiates the substrate 90 with the drawing light modulated according to the pattern information 541. Thereby, a pattern is drawn in the strip-shaped region R2 adjacent to the strip-shaped region R1 drawn by the previous main scan.

以下,與上述同樣地反覆進行主掃描與副掃描,從而於基板90上之描繪對象區域之整個區域中描繪圖案後,描繪處理結束。於圖5所示之例中,藉由間隔2次副掃描之3次主掃描,各光學頭33橫截帶狀區域R1、R2、R3,藉此於描繪對象區域之整個區域中形成圖案。 Hereinafter, the main scanning and the sub-scanning are repeatedly performed in the same manner as described above, and the drawing process is completed after the pattern is drawn on the entire area of the drawing target area on the substrate 90. In the example shown in FIG. 5, each of the optical heads 33 crosses the strip-shaped regions R1, R2, and R3 by three main scanning intervals of two sub-scans, thereby forming a pattern in the entire region of the drawing target region.

○控制部5 ○ Control unit 5

如圖3所示,控制部5具備CPU(Central Processing Unit:中央處理單元)51、讀取專用之ROM(Read Only Memory:唯讀記憶體)52、主要用作CPU51之暫時之工作區域之RAM(Random Access Memory:隨機存取記憶體)53及非揮發性之記錄媒體即記憶體54。又,控制部5與顯示部56、操作部57、轉動機構211、副掃描機構221、主掃描機構 231、LED光源部31(詳細而言,光源驅動器)、光調變部4及自動聚焦機構6等之描繪裝置100之各構成相連接,而進行該等各構成之動作之控制。 As shown in FIG. 3, the control unit 5 includes a CPU (Central Processing Unit) 51, a ROM (Read Only Memory) 52 for reading, and a RAM mainly used as a temporary working area of the CPU 51. (Random Access Memory) 53 and a non-volatile recording medium, that is, the memory 54. Moreover, the control unit 5, the display unit 56, the operation unit 57, the rotation mechanism 211, the sub-scanning mechanism 221, and the main scanning mechanism 231. The respective configurations of the drawing device 100 such as the LED light source unit 31 (in detail, the light source driver), the light modulation unit 4, and the autofocus mechanism 6 are connected, and the operations of the respective configurations are controlled.

CPU51讀取並執行儲存於ROM52內之程式55,藉此進行針對記憶於RAM53或記憶體54之各種資料之運算。 The CPU 51 reads and executes the program 55 stored in the ROM 52, thereby performing operations on various materials stored in the RAM 53 or the memory 54.

記憶體54記憶關於應描繪於基板90上之圖案之圖案資料541。圖案資料541係例如將藉由CAD(computer-aided design:電腦輔助設計)軟體等製作之矢量形式之資料,展開為光柵形式之資料之圖像資料。控制部5基於該圖案資料541控制光調變部4,藉此調變自光學頭33射出之光束。另外,於描繪裝置100中,基於自主掃描機構231之線性馬達231a傳送而來之線性刻度信號,產生調變之復位脈衝。藉由基於該復位脈衝動作之調變部4,將根據基板4之位置調變之描繪光自各描繪頭33射出。 The memory 54 memorizes the pattern material 541 regarding the pattern to be drawn on the substrate 90. The pattern data 541 is, for example, a material of a vector form produced by a CAD (computer-aided design) software, and is expanded into image data of a raster image. The control unit 5 controls the light modulation unit 4 based on the pattern data 541, thereby modulating the light beam emitted from the optical head 33. Further, in the drawing device 100, a modulated reset pulse is generated based on the linear scale signal transmitted from the linear motor 231a of the autonomous scanning mechanism 231. The patterning light modulated according to the position of the substrate 4 is emitted from each of the drawing heads 33 by the modulation unit 4 that operates based on the reset pulse.

另外,於本實施形態中,圖案資料541可作為針對單一之圖像(表現應形成於整面基板90之圖案之圖像)之資料,亦可採用例如根據針對單一圖像之圖案資料541,於每個光學頭33個別地產生針對光學頭33各自擔當描繪之部分之圖像資料之構成。 Further, in the present embodiment, the pattern data 541 can be used as a material for a single image (an image representing a pattern to be formed on the entire surface substrate 90), and for example, according to the pattern material 541 for a single image, Each of the optical heads 33 individually generates image data for the portion of the optical head 33 that is each depicted.

顯示部56由一般之液晶顯示器等構成,藉由控制部5之控制將各種資料各種資料顯示給操作員。又,操作部57包含各種按鈕及按鍵、滑鼠、觸控面板等,為對描繪裝置100輸入指示,而由操作員進行操作。 The display unit 56 is constituted by a general liquid crystal display or the like, and displays various materials and various materials to the operator by the control of the control unit 5. Further, the operation unit 57 includes various buttons and buttons, a mouse, a touch panel, and the like, and is operated by an operator to input an instruction to the drawing device 100.

○自動聚焦機構6 ○Auto focus mechanism 6

圖6係顯示光學頭33之概略之側視圖。如圖6所示,於各光學頭33上分別設置有自動聚焦機構6。自動聚焦機構6具備檢測器61,其係用於檢測光學頭33及基板90(詳細而言,曝光面)之間之間隔距離L1之變動。自動聚焦機構6配合利用檢測器61檢測出之間隔距離L1之變 動,調整光學頭33之描繪光之焦點。 Fig. 6 is a side view showing the outline of the optical head 33. As shown in FIG. 6, an autofocus mechanism 6 is provided on each of the optical heads 33. The autofocus mechanism 6 is provided with a detector 61 for detecting a variation in the distance L1 between the optical head 33 and the substrate 90 (in detail, the exposure surface). The autofocus mechanism 6 cooperates with the change of the separation distance L1 detected by the detector 61. The focus of the light drawn by the optical head 33 is adjusted.

檢測器61包含將雷射光照射至基板90之照射部611,及接收基板90反射之雷射光之受光部613。照射部611使雷射光沿著相對於基板90之表面之法線方向(此處為Z軸方向)僅傾斜特定之角度之軸,射入至基板90之上表面,以點狀照射。於以下之說明中,將該雷射光照射之基板90上之位置作為檢測位置71。受光部613包含例如朝Z軸方向延伸之線感測器。根據該線感測器上之雷射光之入射位置,檢測基板90之上表面之變動。檢測器61經由設置於光學頭33之投影光學系統332之框體外周面之安裝機構62,而固定於光學頭33。 The detector 61 includes an illuminating unit 611 that irradiates the laser light to the substrate 90, and a light receiving unit 613 that receives the laser light reflected by the substrate 90. The illuminating unit 611 causes the laser light to be incident on the upper surface of the substrate 90 along an axis which is inclined at a specific angle with respect to the normal direction of the surface of the substrate 90 (here, the Z-axis direction), and is irradiated in a spot shape. In the following description, the position on the substrate 90 on which the laser light is irradiated is taken as the detection position 71. The light receiving unit 613 includes, for example, a line sensor extending in the Z-axis direction. The variation of the upper surface of the substrate 90 is detected based on the incident position of the laser light on the line sensor. The detector 61 is fixed to the optical head 33 via a mounting mechanism 62 provided on the outer peripheral surface of the housing of the projection optical system 332 of the optical head 33.

又,自動聚焦機構6具備升降機構63,其根據利用檢測器61所檢測出之變動量,使投影光學系統332之透鏡於Z軸方向上升下降。將由檢測器61所檢測出之變動量交付至控制部5或未圖示之專用之運算電路等,按照所需之程式進行運算處理。藉此,決定以升降機構63所產生之透鏡之升降量。 Further, the autofocus mechanism 6 includes an elevating mechanism 63 that raises and lowers the lens of the projection optical system 332 in the Z-axis direction in accordance with the amount of fluctuation detected by the detector 61. The amount of fluctuation detected by the detector 61 is supplied to the control unit 5 or a dedicated arithmetic circuit (not shown), and the arithmetic processing is performed in accordance with a required program. Thereby, the amount of lifting and lowering of the lens generated by the lifting mechanism 63 is determined.

圖7係顯示曝光部3之概略之前視圖。於圖7中,為識別5個光學頭33,朝副掃描方向(+x方向)於符號「33」上依序附注有符號「a」~「e」。例如朝與副掃描方向相反之方向(-x方向)配置於最外側之光學頭33為光學頭33a,朝副掃描方向配置於最外側之光學頭33為光學頭33e。 Fig. 7 is a schematic front view showing the exposure portion 3. In FIG. 7, in order to recognize the five optical heads 33, the symbols "a" to "e" are sequentially attached to the symbol "33" in the sub-scanning direction (+x direction). For example, the optical head 33 disposed on the outermost side in the direction opposite to the sub-scanning direction (-x direction) is the optical head 33a, and the optical head 33 disposed on the outermost side in the sub-scanning direction is the optical head 33e.

又,對於各光學頭33所具備之各自動聚焦機構6之檢測位置71,亦與上述同樣地於符號「71」上分別附注有符號「a」~「e」。例如,將光學頭33a之自動聚焦機構6之檢測位置71設為檢測71a。 Further, in the detection position 71 of each of the autofocus mechanisms 6 included in each of the optical heads 33, the symbols "a" to "e" are respectively attached to the symbol "71" in the same manner as described above. For example, the detection position 71 of the autofocus mechanism 6 of the optical head 33a is set to the detection 71a.

再者,對於各光學頭33射出之描繪光之副掃描方向之中央位置CP,亦與上述同樣地於符號「CP」上分別附注有符號「a」~「e」。例如,光學頭33a之描繪光之中央位置CP為中央位置CPa。 Further, in the same manner as described above, the symbol "a" to "e" are respectively attached to the symbol "CP" in the center position CP of the sub-scanning direction of the drawing light emitted from each of the optical heads 33. For example, the central position CP of the drawing light of the optical head 33a is the central position CPa.

於本實施形態中,各自動聚焦機構6之檢測位置71,係相對於對 應之光學頭33之描繪光之中央位置CP,向副掃描方向(+x方向)或其相反方向(-x方向)偏移之位置。更詳細而言,關於光學頭33a,將其檢測位置71a設定於較中央位置CPa向副掃描方向(+x方向)偏移既定距離之位置上。與此相對,關於其他光學頭33b~33e,將各自之檢測位置71b~71e設定在相對於中央位置CPb~CPe,分別向與副掃描方向相反之方向(-x方向)偏移既定之距離之位置上。 In the present embodiment, the detection position 71 of each autofocus mechanism 6 is relative to the pair. The central position CP of the light of the optical head 33 is shifted to the sub-scanning direction (+x direction) or its opposite direction (-x direction). More specifically, the optical head 33a is set at a position shifted by a predetermined distance from the center position CPa in the sub-scanning direction (+x direction). On the other hand, in the other optical heads 33b to 33e, the respective detection positions 71b to 71e are set to be offset from the center positions CPb to CPe in a direction opposite to the sub-scanning direction (-x direction) by a predetermined distance. Location.

檢測位置71之相對中央位置CP之位移方向,係由檢測器61之相對光學頭33之安裝方向所決定。即,如圖6所示,藉由安裝機構62,如實線所示般,以將照射部611配置於-Y側,將受光部613配置於+Y側之方式固定檢測器61。於該狀態下,檢測位置71成為相對描繪光之中央位置CP向與副掃描方向相反之方向(-x方向)位移之狀態。又,亦可藉由使檢測器61旋轉180度而安裝於安裝機構62,而於照射部611配置於+Y側,受光部613配置於-Y側之狀態下,將檢測器61固定於光學頭33。於該狀態下,檢測位置71成為相對描繪光之中央位置CP於副掃描方向(+x方向)位移之狀態。藉由設置此種安裝機構62,只要改變檢測器61之安裝方向即可變更檢測位置71之位移方向。如此般,藉由使零件共通化,可減少零件個數。因此,易進行零件管理,又可謀求裝置成本之降低化。 The direction of displacement of the detection position 71 relative to the center position CP is determined by the mounting direction of the detector 61 relative to the optical head 33. In other words, as shown by the solid line, the mounting unit 62 fixes the detector 61 such that the irradiation unit 611 is disposed on the -Y side and the light receiving unit 613 is disposed on the +Y side. In this state, the detection position 71 is in a state of being displaced in the direction (-x direction) opposite to the sub-scanning direction with respect to the center position CP of the drawing light. Further, the detector 61 may be attached to the mounting mechanism 62 by rotating the detector 61 by 180 degrees, and the detector 61 may be fixed to the optical unit 613 while being disposed on the +Y side, and the light receiving unit 613 being disposed on the -Y side. Head 33. In this state, the detection position 71 is in a state of being displaced in the sub-scanning direction (+x direction) with respect to the center position CP of the drawing light. By providing such a mounting mechanism 62, the displacement direction of the detection position 71 can be changed by changing the mounting direction of the detector 61. In this way, the number of parts can be reduced by making the parts common. Therefore, it is easy to carry out part management, and it is also possible to reduce the cost of the device.

如圖5所示,有因基板90之副掃描方向之寬度,使基板90上之副掃描方向端部之帶狀區域(以下,稱為端部帶狀區域R11),較所對應之光學頭之掃描區域33R更窄之情形。於此種情形時,根據自動聚焦機構6之檢測位置71之設定位置,有設定於自描繪對象區域偏離之位置之虞。於基板90之端部附近,有存在階差等之情形,若自動聚焦機構6於描繪對象區域外發揮功能,則有描繪精度顯著降低之虞。 As shown in FIG. 5, a strip-shaped region (hereinafter, referred to as an end band-shaped region R11) on the end portion of the substrate 90 in the sub-scanning direction due to the width of the substrate 90 in the sub-scanning direction is provided. The case where the scanning area 33R is narrower. In this case, depending on the set position of the detection position 71 of the autofocus mechanism 6, there is a setting which is set at a position deviated from the object to be drawn. In the vicinity of the end portion of the substrate 90, there is a case where there is a step or the like, and if the autofocus mechanism 6 functions outside the drawing target region, the drawing accuracy is remarkably lowered.

於本實施形態中,將光學頭33b~33e所具備之各自動聚焦機構6之檢測位置71b~71e,設定在相對於描繪光之中央位置CPb~CPe向 與副掃描方向相反之方向位移之位置上。即,各光學頭33之自動聚焦機構6之檢測位置71於朝向基板90之內側之方向位移。因此,可提高將檢測位置71於基板90之端部附近之端部帶狀區域R11中,設定於描繪對象區域上之可能性。針對該點,一面參照圖8~圖10,一面從數學方面進行研究。 In the present embodiment, the detection positions 71b to 71e of the respective autofocus mechanisms 6 included in the optical heads 33b to 33e are set at the central positions CPb to CPe with respect to the drawing light. Positioned in the opposite direction to the sub-scanning direction. That is, the detection position 71 of the autofocus mechanism 6 of each optical head 33 is displaced in the direction toward the inner side of the substrate 90. Therefore, it is possible to increase the position of the detection position 71 in the end band region R11 near the end portion of the substrate 90 and set it on the drawing target region. In view of this point, the research is done mathematically with reference to FIGS. 8 to 10.

圖8係概念性顯示複數個光學頭33對基板90進行主掃描之位置之圖。如圖8所示,將基板90之副掃描方向之寬度設為Wb,將描繪光之寬度(條寬度)設為SW,將鄰接之光學頭33、33之間隔設為H時,描繪基板90之副掃描方向端部之端部帶狀區域R11之光學頭33由使用INT函數之以下之式決定。 FIG. 8 is a diagram conceptually showing a position at which a plurality of optical heads 33 perform main scanning on the substrate 90. As shown in FIG. 8, the width of the substrate 90 in the sub-scanning direction is Wb, the width of the drawing light (bar width) is SW, and when the interval between the adjacent optical heads 33 and 33 is H, the substrate 90 is drawn. The optical head 33 of the end band portion R11 of the end portion in the sub-scanning direction is determined by the following equation using the INT function.

N=int(Wb/H)+1‧‧‧(式1) N=int(Wb/H)+1‧‧‧(Form 1)

此處,N意指光學頭33之序號,頭序號「1」~「5」分別對應於光學頭33a~33e。 Here, N means the number of the optical head 33, and the head numbers "1" to "5" correspond to the optical heads 33a to 33e, respectively.

又,描繪端部帶狀區域R11時之主掃描之次數(條序號S)係以以下之式算出。 Moreover, the number of main scans (bar number S) when the end band region R11 is drawn is calculated by the following equation.

S=(Wb-(N-1)×H)/SW+1‧‧‧(式2) S=(Wb-(N-1)×H)/SW+1‧‧‧(Form 2)

又,自進行端部帶狀區域R11之描繪之光學頭33所射出之描繪光之端部(與副掃描方向為相反方向之端部)至基板90之副掃描方向端部之寬度p,係以以下之式算出。 Moreover, the width p of the end portion of the drawing light (the end portion opposite to the sub-scanning direction) emitted from the optical head 33 for drawing the end band-shaped region R11 to the end portion of the substrate 90 in the sub-scanning direction is Calculated by the following formula.

p=Wb-(N-1)×H-(S-1)×SW‧‧‧(式3) p=Wb-(N-1)×H-(S-1)×SW‧‧‧(Formula 3)

圖9及圖10係顯示描繪端部帶狀區域R11之光學頭33之概略俯視圖。於圖9及圖10中,將自與描繪光之副掃描方向為相反方向(-x側)之端部至檢測位置71之距離設為a。又,自基板90之端部離開特定寬度(q)之區域,由於例如未層壓有光阻膜或形成有階差或孔等,故設為不適合於由檢測器61測定間隔距離L1之區域(不適合區域NR)。圖9係顯示p-q≦a成立之狀態之圖,圖10係顯示p-q>a成立之狀態之 圖。 9 and 10 are schematic plan views showing the optical head 33 which depicts the end strip region R11. In FIGS. 9 and 10, the distance from the end in the opposite direction (-x side) from the sub-scanning direction of the drawing light to the detection position 71 is a. Further, since the end portion of the substrate 90 is apart from the region of the specific width (q), since the photoresist film is not laminated or a step or a hole is formed, it is not suitable for the region where the distance J1 is measured by the detector 61. (Not suitable for area NR). Fig. 9 is a view showing a state in which p-q≦a is established, and Fig. 10 is a view showing a state in which p-q>a is established. Figure.

如圖9所示,於p-q≦a成立之情形時,檢測位置71包含於不適合區域NR。於該情形時,因由檢測器61計測基板90之表面之位置,並進行基於其結果之不適當之焦點之調整,故有描繪光之焦點偏移之虞。與此相對,如圖10所示,於p-q>a成立之情形時,檢測位置71包含於較不適合區域NR更為基板90內側之區域(有效區域VR)。藉此,由於即便於端部帶狀區域R11中,亦可進行適當之焦點調整,故而可高精度地描繪圖案。 As shown in FIG. 9, when p-q≦a is established, the detection position 71 is included in the unsuitable area NR. In this case, since the position of the surface of the substrate 90 is measured by the detector 61 and the adjustment of the inappropriate focus based on the result is performed, the focus of the light is shifted. On the other hand, as shown in FIG. 10, when p-q>a is satisfied, the detection position 71 is included in the area (effective area VR) which is more suitable for the area NR and more inside the substrate 90. Thereby, since the appropriate focus adjustment can be performed even in the end band-shaped region R11, the pattern can be drawn with high precision.

根據以上,a越小檢測位置71設定於適合基板90上之間隔距離L1之位置之可能性越高,其結果,可實現高精度之圖案之描繪。另外,於將a設為「0」之情形時(即,將檢測位置71設定於描繪光之內側端部之位置之情形時),始終為圖9所示之狀態,而理論上無檢測位置71包含於不適合區域NR之可能性。然而,檢測位置71關於平行於副掃描方向之方向,設定於描繪光偏移之位置時,亦可能產生於1個矩形狀之描繪光中,自檢測位置71遠離之描繪光之部分之曝光精度降低之不均一之問題。因此,自實現高精度之描繪之觀點出發,可以說較理想為關於副掃描方向,儘可能接近描繪光之中央位置CP而設定檢測位置71。 As described above, the smaller the a detection position 71 is, the higher the possibility of setting the position on the substrate 90 at the distance L1. As a result, the pattern of the high-precision pattern can be realized. Further, when a is set to "0" (that is, when the detection position 71 is set to the position of the inner end portion of the drawing light), the state shown in Fig. 9 is always maintained, and theoretically there is no detection position. 71 is included in the possibility of not suitable for the area NR. However, when the detection position 71 is set in the direction parallel to the sub-scanning direction and is set at the position where the light is shifted, it may be generated in one rectangular drawing light, and the exposure accuracy of the portion of the light from the detection position 71 away from the detection light 71 may be generated. Reduce the problem of inhomogeneity. Therefore, from the viewpoint of realizing high-precision drawing, it can be said that the detection position 71 is set as close as possible to the center position CP of the drawing light with respect to the sub-scanning direction.

<檢測位置71屬於不適合區域NR之情形時之處理> <Processing when the detection position 71 is not suitable for the area NR>

光學頭33描繪端部帶狀區域R11時,如圖9所示,自動聚焦機構6之檢測位置71包含於不適合區域NR之情形時(即,p-q≦a成立之情形時),利用以該光學頭33所執行之前次主掃描獲得之間隔距離L1之變動之檢測結果亦有效。原因係因為可預測端部帶狀區域R11和與其鄰接之帶狀區域R1其高度之變動相似。作為如此般利用前次主掃描之檢測結果之自動聚焦處理,可列舉例如於以下將說明之若干個態樣為例。 When the optical head 33 depicts the end band region R11, as shown in FIG. 9, the detection position 71 of the autofocus mechanism 6 is included in the case where the region NR is not suitable (that is, when pq≦a is established), and the optical is utilized. The detection result of the variation of the separation distance L1 obtained by the previous main scan performed by the head 33 is also effective. The reason is because the end band-like region R11 is predicted to be similar in height to the band-like region R1 adjacent thereto. As the autofocus processing using the detection result of the previous main scan as described above, for example, a plurality of aspects described below will be exemplified.

圖11~圖13係顯示由描繪端部帶狀區域R11之光學頭33之檢測器61所檢測出之間隔距離L1之變動量之圖。另外,於圖11~13中,橫軸表示基板90之y軸方向之位置,縱軸表示間隔距離L1之變動量。又,以虛線表示之圖表83表示於描繪端部帶狀區域R11前之主掃描時所檢測出之間隔距離L1之變動。又,以實線表示之圖表81表示為描繪端部帶狀區域R11而決定之間隔距離L1之假想之變動。 11 to 13 are views showing the amount of change in the separation distance L1 detected by the detector 61 of the optical head 33 which depicts the end band-shaped region R11. In FIGS. 11 to 13, the horizontal axis represents the position of the substrate 90 in the y-axis direction, and the vertical axis represents the amount of variation of the separation distance L1. Further, a graph 83 indicated by a broken line indicates a variation in the separation distance L1 detected at the time of main scanning before the end strip region R11 is drawn. Further, a graph 81 indicated by a solid line indicates an imaginary fluctuation of the separation distance L1 determined by drawing the end strip region R11.

首先,如圖11所示,於第1自動聚焦處理中,將描繪端部帶狀區域R11時之間隔距離L1之變動量設為於前次主掃描中最後檢測出之變動量。因此,於第1自動聚焦處理中,描繪光之焦點位置固定於前次主掃描時最後檢測出變動量時之描繪光之焦點位置。於該情形時,有無需特別之運算處理之優點。又,亦有無需預先保持所有於前次主掃描時所檢測出之變動量之資料之優點。 First, as shown in FIG. 11, in the first autofocus processing, the amount of change in the distance L1 at the time of drawing the end band region R11 is the last detected amount of change in the previous main scan. Therefore, in the first autofocus processing, the focus position of the drawing light is fixed at the focus position of the drawing light when the amount of change is finally detected at the time of the previous main scanning. In this case, there is an advantage that no special arithmetic processing is required. Further, there is an advantage that it is not necessary to maintain all the data of the amount of change detected in the previous main scan.

又,如圖12所示,於第2自動聚焦處理中,將描繪端部帶狀區域R11時之間隔距離L1之變動量設為於前次主掃描中所檢測出之變動量之平均值。 Further, as shown in FIG. 12, in the second autofocus processing, the fluctuation amount of the separation distance L1 when the end band region R11 is drawn is the average value of the fluctuation amount detected in the previous main scan.

又,如圖13所示,於第3自動聚焦處理中,將描繪端部帶狀區域R11時之間隔距離L1之變動量設為於前次主掃描中關於副掃描方向位於同位置時所檢測出之變動量。於該態樣之情形時,由於自動聚焦處理根據基板90之主掃描方向之位置而執行,故有可實現高精度描繪之可能性較高之優點。 Further, as shown in FIG. 13, in the third autofocus processing, the amount of change in the distance L1 when the end band region R11 is drawn is set to be the same position as the sub-scanning direction in the previous main scan. The amount of change. In the case of this aspect, since the autofocus processing is performed in accordance with the position of the main scanning direction of the substrate 90, there is an advantage that the possibility of realizing high-precision drawing is high.

上述圖11~圖13中說明之例任一者均係於以端部帶狀區域R11為對象之主掃描前,進行其他主掃描。然而,根據基板90之寬度(詳細而言,描繪對象區域之寬度),亦設想無前次主掃描之情形,即以第1次主掃描於端部帶狀區域R11描繪圖案之情形。於此種情形時,於開始描繪之前,進行預聚焦處理。 Any of the examples described above with reference to FIGS. 11 to 13 performs other main scanning before the main scanning for the end strip region R11. However, depending on the width of the substrate 90 (in detail, the width of the drawing target region), it is also assumed that there is no previous main scanning, that is, a case where the pattern is drawn by the first main scanning in the end band region R11. In this case, the pre-focusing process is performed before the start of drawing.

於預聚焦處理中,以使以第1次主掃描描繪端部帶狀區域R11之 光學頭33所具備之檢測器61之檢測位置71包含於有效區域VR之方式,使基板90朝與副掃描方向相反之方向移動。且,於該檢測位置71包含於有效區域VR內之狀態下,使基板90朝主掃描方向移動,且由檢測器61檢測基板90之端部帶狀區域R11之各位置之間隔距離L1之變動,並保存於記憶部(亦包含RAM等暫時性記憶資訊者)。且,於圖案描繪處理中,預先自記憶部讀出於預聚焦處理時所取得之變動量之資料,並利用於針對描繪端部帶狀區域R11之光學頭33之自動聚焦處理。 In the pre-focusing process, the end band region R11 is drawn in the first main scan. The detection position 71 of the detector 61 provided in the optical head 33 is included in the effective area VR, and the substrate 90 is moved in a direction opposite to the sub-scanning direction. Further, in a state where the detection position 71 is included in the effective area VR, the substrate 90 is moved in the main scanning direction, and the detector 61 detects the variation of the separation distance L1 between the respective positions of the end strip regions R11 of the substrate 90. And stored in the memory department (also includes temporary memory information such as RAM). Further, in the pattern drawing processing, the data of the amount of fluctuation obtained at the time of the pre-focusing processing is read from the memory unit in advance, and is used for the autofocus processing of the optical head 33 for drawing the end strip region R11.

圖14係顯示描繪端部帶狀區域R11之光學頭33之概略俯視圖。又,圖15係顯示描繪基板90中位於與副掃描方向為相反方向之端部之帶狀區域R1之光學頭33之概略俯視圖。 Fig. 14 is a schematic plan view showing the optical head 33 which depicts the end band region R11. Moreover, FIG. 15 is a schematic plan view showing the optical head 33 in which the strip-shaped region R1 located at the end opposite to the sub-scanning direction of the substrate 90 is drawn.

如圖14所示,基板90於預聚焦處理時朝-X方向移動。對其自基板90觀察時,光學頭33朝與副掃描方向相反之方向相對地移動移動量Mx。考慮到有效區域VR之裕度(r),該移動量Mx以以下之式表示。 As shown in FIG. 14, the substrate 90 is moved in the -X direction at the time of the pre-focusing process. When viewed from the substrate 90, the optical head 33 relatively moves by the movement amount Mx in a direction opposite to the sub-scanning direction. The amount of movement Mx is expressed by the following equation in consideration of the margin (r) of the effective area VR.

Mx=a-p+q+r(式4) Mx=a-p+q+r (Formula 4)

另外,藉由使基板90朝-X方向移動,描繪基板90中位於與副掃描方向為相反方向之端部之帶狀區域R1之光學頭33所具備之檢測器61之檢測位置71接近基板90之端部。對於描繪該帶狀區域R1之光學頭33,無須執行預聚焦處理。原因係因為即便不進行預聚焦處理,於進行帶狀區域R1之描繪時,亦可於有效區域VR內檢測間隔距離之變動。然而,於對該光學頭33亦執行預聚焦處理之情形時,需要於使基板90朝-X方向移動時,使光學頭33所具備之檢測器61之檢測位置71包含於有效區域VR。因此,需要如圖15所示般滿足以下之條件式。 Further, by moving the substrate 90 in the -X direction, the detection position 71 of the detector 61 provided in the optical head 33 of the strip-shaped region R1 of the substrate 90 in the opposite direction to the sub-scanning direction is close to the substrate 90. The end. For the optical head 33 which depicts the strip-shaped region R1, it is not necessary to perform a pre-focusing process. The reason is that even if the pre-focusing process is not performed, the variation of the separation distance can be detected in the effective region VR when the strip region R1 is drawn. However, when the pre-focusing process is also performed on the optical head 33, it is necessary to include the detection position 71 of the detector 61 provided in the optical head 33 in the effective area VR when the substrate 90 is moved in the -X direction. Therefore, it is necessary to satisfy the following conditional expression as shown in FIG.

SW-a>a-p+2q+2r‧‧‧(式5) SW-a>a-p+2q+2r‧‧‧(式5)

a<SW/2-q-r‧‧‧(式6) a<SW/2-q-r‧‧‧(Form 6)

圖16係顯示由預聚焦處理所獲得之基板90之表面高度之變動之 圖表85之圖。如圖16所示,於檢測基板90之表面高度之變動時,藉由設置於控制部5或自動聚焦機構6之運算機構,取得出現頻率最高之變動量。且,於光學頭33之焦點位置固定於與該變動量對應之位置之狀態下進行主掃描,從而進行端部帶狀區域R11之圖案之掃描。當然,如圖11~圖13中所說明般,亦可將描繪端部帶狀區域R11時之間隔距離L1之變動量設定為於預聚焦處理中最後獲得之變動量、於預聚焦處理時獲得之變動量之平均值、或於預聚焦處理時獲得之對應位置之變動量。 Figure 16 is a diagram showing the variation of the surface height of the substrate 90 obtained by the pre-focusing process. Figure 85. As shown in FIG. 16, when the height of the surface of the substrate 90 is detected, the amount of fluctuation of the highest frequency of occurrence is obtained by the arithmetic unit provided in the control unit 5 or the autofocus mechanism 6. Then, the main scanning is performed in a state where the focus position of the optical head 33 is fixed to the position corresponding to the fluctuation amount, and the pattern of the end band-shaped region R11 is scanned. Of course, as described in FIGS. 11 to 13, the variation amount of the separation distance L1 at the time of drawing the end band-shaped region R11 can be set as the amount of variation finally obtained in the pre-focusing process, which is obtained at the time of the pre-focusing process. The average of the amount of change or the amount of change in the corresponding position obtained during the pre-focusing process.

<2.圖案描繪處理之流程> <2. Flow of pattern drawing processing>

接著,對描繪裝置100之圖案描繪處理之流程加以簡單說明。圖17係顯示圖案描繪處理之流程之圖。 Next, the flow of the pattern drawing processing of the drawing device 100 will be briefly described. Fig. 17 is a view showing the flow of the pattern drawing processing.

首先,於描繪處理前進行預聚焦處理(圖17:步驟S1)。接著,於預聚焦處理完成後,決定描繪端部帶狀區域R11時之自動聚焦機構6之動作內容(圖17:步驟S2)。具體而言,確定(1)由何光學頭33執行端部帶狀區域R11之描繪、及(2)端部帶狀區域R11之描繪以第幾次之主掃描進行。且,確定(3)擔當該描繪之光學頭33之自動聚焦機構6之檢測位置71是否包含於預先設定之有效區域VR。由於檢測位置71包含於有效區域VR之情形時,可順利地測定間隔距離L1之變動,故選擇通常之自動聚焦處理之動作。另一方面,於檢測位置71包含於有效區域VR外之不適合區域NR之情形時,如上述般,選擇利用於前次主掃描時獲得之間隔距離L1之變動之檢測結果之自動聚焦處理。 First, pre-focus processing is performed before the drawing process (FIG. 17: step S1). Next, after the pre-focusing process is completed, the operation content of the autofocus mechanism 6 when the end band region R11 is drawn is determined (FIG. 17: Step S2). Specifically, it is determined (1) where the optical head 33 performs the drawing of the end band region R11, and (2) the drawing of the end band region R11 is performed by the main scanning of the first few times. Further, it is determined (3) whether or not the detection position 71 of the autofocus mechanism 6 serving as the optical head 33 of the drawing is included in the preset effective area VR. Since the detection position 71 is included in the effective area VR, the fluctuation of the separation distance L1 can be smoothly measured, so that the normal auto focus processing operation is selected. On the other hand, when the detection position 71 is included in the unsuitable area NR outside the effective area VR, as described above, the auto focus processing using the detection result of the variation of the separation distance L1 obtained in the previous main scanning is selected.

決定端部帶狀區域R11之自動聚焦機構6之動作後,執行圖案描繪處理(圖17:步驟S3)。於該步驟S3中,最初之主掃描係使用於步驟S1之預聚焦處理中所獲得之結果,而實施自動聚焦處理。又,對於端部帶狀區域R11,以使自動聚焦機構6進行於步驟S2中所決定之動作之方式進行控制。如以上般對基板90之描繪對象區域進行圖案之描 繪。 After the operation of the autofocus mechanism 6 of the end band region R11 is determined, pattern drawing processing is performed (FIG. 17: Step S3). In the step S3, the first main scanning system performs the autofocus processing using the results obtained in the prefocusing processing of the step S1. Further, the end band-shaped region R11 is controlled such that the autofocus mechanism 6 performs the operation determined in step S2. The pattern of the drawing object area of the substrate 90 is described as above. painted.

以上,雖詳細地說明了本發明,但上述之說明於所有態樣中為例示,本發明並非限定於其者。當明白可不脫離本發明之範圍設想未例示之無數個變形例。 The present invention has been described in detail above, but the description thereof is exemplified in all aspects, and the present invention is not limited thereto. Numerous variations that are not exemplified without departing from the scope of the invention are apparent.

3‧‧‧曝光部 3‧‧‧Exposure Department

6‧‧‧自動聚焦機構 6‧‧‧Auto Focus Mechanism

33a‧‧‧光學頭 33a‧‧‧ Optical head

33b‧‧‧光學頭 33b‧‧‧ Optical head

33c‧‧‧光學頭 33c‧‧ optical head

33d‧‧‧光學頭 33d‧‧‧Optical head

33e‧‧‧光學頭 33e‧‧ optical head

61‧‧‧檢測器 61‧‧‧Detector

71a‧‧‧檢測位置 71a‧‧‧Detection location

71b‧‧‧檢測位置 71b‧‧‧Detection location

71c‧‧‧檢測位置 71c‧‧‧Detection location

71d‧‧‧檢測位置 71d‧‧‧Detection location

71e‧‧‧檢測位置 71e‧‧‧Detection location

90‧‧‧基板 90‧‧‧Substrate

332‧‧‧投影光學系統 332‧‧‧Projection optical system

613‧‧‧受光部 613‧‧‧Receiving Department

CPa‧‧‧中央位置 CPa‧‧‧Central location

CPb‧‧‧中央位置 CPb‧‧‧ central location

CPc‧‧‧中央位置 CPc‧‧‧ central location

CPd‧‧‧中央位置 CPd‧‧‧ central location

CPe‧‧‧中央位置 CPe‧‧‧ central location

L1‧‧‧間隔距離 L1‧‧‧ separation distance

x‧‧‧方向 X‧‧‧ directions

X‧‧‧方向 X‧‧‧ direction

y‧‧‧方向 Y‧‧‧ direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (10)

一種描繪裝置,其係對形成有感光體之基板照射光而於上述基板上描繪圖案者,且包含:複數個光學頭,其排列於副掃描方向,且各自射出帶狀之描繪光;掃描機構,其藉由使上述複數個光學頭相對於上述基板,朝上述副掃描方向及與上述副掃描方向正交之主掃描方向相對地移動,而以上述描繪光掃描基板;及複數個自動聚焦機構,其設置於上述複數個光學頭之各者上,並配合由檢測上述光學頭及上述基板之間之間隔距離之變動之檢測器所檢測出之上述間隔距離之變動,調整上述光學頭之上述描繪光之焦點位置;且上述複數個光學頭中之至少一部分光學頭之上述自動聚焦機構,以從上述描繪光之中央位置向與上述副掃描方向相反之方向偏移之基板上之位置,作為上述間隔距離之變動之檢測位置。 A drawing device for irradiating light onto a substrate on which a photoreceptor is formed to draw a pattern on the substrate, and comprising: a plurality of optical heads arranged in a sub-scanning direction and each emitting strip-shaped drawing light; and a scanning mechanism And scanning the substrate by the drawing light by moving the plurality of optical heads relative to the substrate in the sub-scanning direction and the main scanning direction orthogonal to the sub-scanning direction; and a plurality of autofocus mechanisms And arranging the optical heads on each of the plurality of optical heads, and adjusting the variation of the separation distance detected by a detector that detects a change in a separation distance between the optical head and the substrate Depicting a focus position of the light; and the autofocusing mechanism of at least a part of the plurality of optical heads is located on a substrate offset from a central position of the drawing light in a direction opposite to the sub-scanning direction The detection position of the above variation of the separation distance. 如請求項1之描繪裝置,其中上述一部分光學頭係除了向與上述副掃描方向相反之方向配置於最外側之上述光學頭以外之1個以上者。 The drawing device of claim 1, wherein the part of the optical heads is one or more of the optical heads disposed on the outermost side in a direction opposite to the sub-scanning direction. 如請求項1之描繪裝置,其中上述一部分光學頭包含:安裝機構,其係以將上述檢測位置分別設定在相對於上述描繪光之中央位置向上述副掃描方向或其相反方向偏移之位置之方式安裝上述檢測器。 The drawing device of claim 1, wherein the part of the optical head comprises: a mounting mechanism for setting the detection position to a position offset from the central position of the drawing light toward the sub-scanning direction or an opposite direction thereof; Install the above detector. 如請求項1之描繪裝置,其中上述一部分光學頭中之描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述 自動聚焦機構,係於描繪上述端部帶狀區域時,基於前次主掃描時所獲得之上述間隔距離之變動之檢測結果,調整上述焦點位置。 The drawing device of claim 1, wherein the optical head of the drawing substrate in the partial optical head is located at an end strip region of the end portion in the sub-scanning direction The autofocus mechanism adjusts the focus position based on the detection result of the variation of the separation distance obtained in the previous main scan when the end band region is drawn. 如請求項1之描繪裝置,其進而包含控制部,其控制上述掃描機構及上述自動聚焦機構;且上述控制部如下動作:一面以使上述一部分光學頭中描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述自動聚焦機構之檢測位置,被包含於基板之既定有效區域之方式,使上述光學頭沿著上述副掃描方向相對移動,然後朝上述主掃描方向相對移動,一面使上述自動聚焦機構進行上述間隔距離之變動之檢測。 The drawing device of claim 1, further comprising: a control unit that controls the scanning mechanism and the autofocus mechanism; and the control unit operates to cause the substrate to be drawn in the sub-scanning direction at a portion of the optical head The detection position of the autofocus mechanism of the optical head of the end band region is included in a predetermined effective area of the substrate, so that the optical head relatively moves along the sub-scanning direction, and then faces the main scanning direction. Moving, the autofocus mechanism performs the detection of the variation of the separation distance. 一種描繪方法,其係對形成有感光體之基板照射光而於上述基板上描繪圖案者,且包含:(a)自排列於副掃描方向之複數個光學頭之各者射出帶狀之描繪光之步驟;(b)於上述(a)步驟中,藉由使上述複數個光學頭相對於上述基板,朝上述副掃描方向及與上述副掃描方向正交之主掃描方向相對移動,而以上述描繪光掃描基板之步驟;及(c)於上述(b)步驟中,藉由檢測器檢測上述光學頭及上述基板之間之間隔距離之變動,並配合所檢測出之上述間隔距離之變動,調整上述光學頭之上述描繪光之焦點之步驟;且於上述步驟(c)中,對於上述複數個光學頭中之至少一部分光學頭,於自上述描繪光之中央位置向與上述副掃描方向相反之方向偏移之基板上之位置,檢測上述間隔距離之變動。 A drawing method for irradiating a substrate on which a photoreceptor is formed to draw a pattern on the substrate, and comprising: (a) each of a plurality of optical heads arranged in a sub-scanning direction emits a strip-shaped drawing light (b) in the step (a), the plurality of optical heads are relatively moved in the sub-scanning direction and the main scanning direction orthogonal to the sub-scanning direction by the plurality of optical heads relative to the substrate Depicting a step of scanning the substrate; and (c) in the step (b), detecting, by the detector, a variation in the distance between the optical head and the substrate, and matching the detected variation in the separation distance, a step of adjusting a focus of the light drawn by the optical head; and in the step (c), at least a part of the optical heads of the plurality of optical heads are opposite to the sub-scanning direction from a central position of the drawing light The position on the substrate shifted in direction is detected as a change in the separation distance. 如請求項6之描繪方法,其中上述一部分光學頭中包含向上述副 掃描方向配置於最外側之上述光學頭。 The drawing method of claim 6, wherein the part of the optical head includes the above-mentioned pair The scanning head is disposed on the outermost optical head. 如請求項6之描繪方法,其中上述一部分光學頭包含安裝機構,其以將上述檢測位置分別設定在相對於上述描繪光之中央位置向上述副掃描方向或其相反方向偏移之位置之方式,安裝上述檢測器。 The drawing method of claim 6, wherein the part of the optical head includes a mounting mechanism for setting the detection position to a position shifted to a position relative to the sub-scanning direction or an opposite direction with respect to a central position of the drawing light, Install the above detector. 如請求項6之描繪方法,其中於上述(c)步驟中,對於上述一部分光學頭中描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭,係於描繪上述端部帶狀區域時,基於由前次主掃描所獲得之上述間隔距離之變動之檢測結果,調整上述焦點位置。 The drawing method of claim 6, wherein in the step (c), the optical head of the end portion of the substrate in the sub-scanning direction of the substrate is drawn on the end portion In the case of the strip region, the focus position is adjusted based on the detection result of the variation of the above-described separation distance obtained by the previous main scan. 如請求項6之描繪方法,其中上述(c)步驟包含:(c-1)以使針對上述一部分光學頭中描繪基板之位於上述副掃描方向端部之端部帶狀區域之上述光學頭之上述檢測位置,被包含於基板之既定有效區域之方式,使上述光學頭沿著上述副掃描方向相對移動之步驟;及(c-2)於上述(c-1)步驟之後,一面使上述光學頭朝上述主掃描方向相對移動,一面檢測上述間隔距離之變動之步驟。 The drawing method of claim 6, wherein the step (c) comprises: (c-1), wherein the optical head of the end strip region of the end portion of the substrate in the sub-scanning direction is drawn for the portion of the optical head The detecting position is included in a predetermined effective area of the substrate, and the optical head is relatively moved along the sub-scanning direction; and (c-2) after the step (c-1), the optical is made The step of detecting the change in the separation distance while the head is relatively moved in the main scanning direction.
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