TW201426263A - 導熱膏保護罩 - Google Patents

導熱膏保護罩 Download PDF

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Publication number
TW201426263A
TW201426263A TW101150273A TW101150273A TW201426263A TW 201426263 A TW201426263 A TW 201426263A TW 101150273 A TW101150273 A TW 101150273A TW 101150273 A TW101150273 A TW 101150273A TW 201426263 A TW201426263 A TW 201426263A
Authority
TW
Taiwan
Prior art keywords
protection cover
thermal
bottom plate
paste
thermal grease
Prior art date
Application number
TW101150273A
Other languages
English (en)
Inventor
Yao-Ting Chang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101150273A priority Critical patent/TW201426263A/zh
Priority to US13/787,845 priority patent/US20140174705A1/en
Publication of TW201426263A publication Critical patent/TW201426263A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/22—Fastening; Joining by using magnetic effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)

Abstract

一種導熱膏保護罩，用於保護設於一散熱器的底板的導熱膏，該底板設有複數鐵磁性的鎖固件，該導熱膏保護罩設有一收容該導熱膏的收容槽及複數分別可吸附該等鎖固件的磁鐵。

Description

導熱膏保護罩
本發明涉及一種導熱膏保護罩。
散熱器的底部常設置導熱膏以幫助發熱電子元件將熱量傳導至散熱器。散熱器的底板的底部需設一保護罩以保護導熱膏。習知保護罩常卡固於散熱器的底板，保護罩容易變形而無法再利用。
鑒於以上，有必要提供一種可再利用的導熱膏保護罩。
一種導熱膏保護罩，用於保護設於一散熱器的底板的導熱膏，該底板設有複數鐵磁性的鎖固件，該導熱膏保護罩設有一收容該導熱膏的收容槽及複數分別可吸附該等鎖固件的磁鐵。
該導熱膏保護罩透過磁鐵吸附散熱器的底板的鎖固件，故將導熱膏保護罩自散熱器移除時不會損壞導熱膏保護罩，該導熱膏保護罩可回收再利用。
請參照圖1和圖2，本發明導熱膏保護罩10的較佳實施方式用於保護設置於散熱器20的底板21的底面的導熱膏22。該散熱器20的底板21大致呈方形。底板21的四角處各穿設有一鐵磁性的鎖固件23，如螺絲。
該導熱膏保護罩10包括一方形的主體11。主體11包括兩相對的側壁12。主體11的頂面的中部設有一收容槽13。每一側壁12的兩端延伸出兩凸塊15。每一凸塊15的頂面設有一凹槽16。每一凹槽16的底壁黏固一磁鐵18。
請參照圖3，組裝時，將散熱器20的底板21置於主體11的頂面。導熱膏22收容於主體11的收容槽13。該等鎖固件23位於底板21下方的部份分別收容於該等凹槽16。該等鎖固件23的底端分別吸附於該等磁鐵18。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
10．．．導熱膏保護罩
11．．．主體
12．．．側壁
13．．．收容槽
15．．．凸塊
16．．．凹槽
18．．．磁鐵
20．．．散熱器
21．．．底板
22．．．導熱膏
23．．．鎖固件
圖1是本發明導熱膏保護罩的較佳實施方式與一散熱器的立體分解圖。
圖2是圖1中的散熱器於另一方向的立體圖。
圖3是圖1的立體組裝圖。
10．．．導熱膏保護罩
11．．．主體
12．．．側壁
13．．．收容槽
15．．．凸塊
16．．．凹槽
18．．．磁鐵
20．．．散熱器
21．．．底板
23．．．鎖固件

Claims (5)

  1. 一種導熱膏保護罩，用於保護設於一散熱器的底板的導熱膏，該底板設有複數鐵磁性的鎖固件，該導熱膏保護罩設有一收容該導熱膏的收容槽及複數分別可吸附該等鎖固件的磁鐵。
  2. 如申請專利範圍第1項所述之導熱膏保護罩，設有複數收容並固定該等磁鐵的凹槽，其中該等鎖固件的底部分別收容於該等凹槽。
  3. 如申請專利範圍第2項所述之導熱膏保護罩，其中該等磁鐵分別黏固於該等凹槽的底壁。
  4. 如申請專利範圍第2項所述之導熱膏保護罩，包括一方形的主體，其中該收容槽設於該主體的頂面，該主體於四角處分別延伸形成一凸塊，該等凹槽分別設於該等凸塊的頂面。
  5. 如申請專利範圍第1項所述之導熱膏保護罩，其中每一鎖固件為一螺絲。
TW101150273A 2012-12-26 2012-12-26 導熱膏保護罩 TW201426263A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101150273A TW201426263A (zh) 2012-12-26 2012-12-26 導熱膏保護罩
US13/787,845 US20140174705A1 (en) 2012-12-26 2013-03-07 Heat sink assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101150273A TW201426263A (zh) 2012-12-26 2012-12-26 導熱膏保護罩

Publications (1)

Publication Number Publication Date
TW201426263A true TW201426263A (zh) 2014-07-01

Family

ID=50973305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101150273A TW201426263A (zh) 2012-12-26 2012-12-26 導熱膏保護罩

Country Status (2)

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US (1) US20140174705A1 (zh)
TW (1) TW201426263A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992489A (zh) * 2015-02-04 2016-10-05 富瑞精密组件（昆山）有限公司 散热装置
TWI583296B (zh) * 2015-02-03 2017-05-11 鴻準精密工業股份有限公司 散熱裝置

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
TWM504269U (zh) * 2014-11-19 2015-07-01 Giga Byte Tech Co Ltd 板件固定結構
USD892753S1 (en) * 2018-10-31 2020-08-11 Bitmain Technologies Inc. Heat sink
US11145568B2 (en) * 2018-12-10 2021-10-12 Intel Corporation Magnetically affixed heat spreader
JP7170620B2 (ja) * 2019-11-26 2022-11-14 三菱電機株式会社 半導体装置および放熱フィンの製造方法

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Publication number Priority date Publication date Assignee Title
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US6519153B1 (en) * 2001-08-08 2003-02-11 Intel Corporation Heat sink retention frame
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6826054B2 (en) * 2002-09-09 2004-11-30 Hon Hai Precision Ind. Co., Ltd. Heat sink clip assembly
TW573905U (en) * 2003-06-11 2004-01-21 Hon Hai Prec Ind Co Ltd A retainer for mounting a grease cap
US7319592B2 (en) * 2006-04-11 2008-01-15 Inventec Corporation Recyclable protective cover for a heat-conductive medium
TW200844724A (en) * 2007-05-10 2008-11-16 Ind Tech Res Inst Miniature heat-dissipating fan device
US9263659B2 (en) * 2011-06-10 2016-02-16 Perpetua Power Source Technologies, Inc. System and method for thermal protection of an electronics module of an energy harvester

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583296B (zh) * 2015-02-03 2017-05-11 鴻準精密工業股份有限公司 散熱裝置
CN105992489A (zh) * 2015-02-04 2016-10-05 富瑞精密组件（昆山）有限公司 散热装置

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