TW201421800A - Method of forming conductive pattern on non-conductive substrates - Google Patents

Abstract

The present invention is a method of forming a conductive pattern on non-conductive substrates. The process performs a surface treatment to at least a local area of a non-conductive substrate to form a plurality of holes on the non-conductive substrate surface. The aperture of each of the holes is between 0. O2 μ m to 40 μ m, and the depth of each of the holes is also between 0. O2 μ m to 40 μ m. The non-conductive substrate is contacted with a surfactant mixed solution, and then to a reductant solution, and finally to an electroless metal plating solution, so that metal ions of the electroless metal plating solution can be precipitated at the local area of the non-conductive substrate to form a conductive pattern.

Description

Method of forming a conductive pattern on a non-conductive substrate

The invention relates to a method for forming a conductive pattern on a non-conductive substrate, and more particularly to a method for forming a conductive pattern on the non-conductive substrate by electroless plating after surface treatment of a non-conductive substrate.

According to various electronic devices with communication functions (such as mobile phones, satellite navigation devices, notebook computers, etc.), it can provide users with many conveniences in life and work (such as wireless communication, wireless positioning, Wireless transmission of data, etc.) Therefore, in recent years, the consumer market of such electronic devices has become increasingly large. With the rapid growth of the consumer market, the relevant operators of these electronic devices have not invested a lot of research and development energy in order to have a place in this consumer market. Among them, the related research and development of the antennas of these electronic devices has been continuously in progress.

In Japanese Patent No. 11-202818, entitled "Antenna Structure", a method of manufacturing an antenna is disclosed, which requires first mixing a dielectric material with a glass frit, and then rolling and coating the same. On the surface of the substrate to form an antenna structure. The mixed granulation process is complicated, and the coating layer and the substrate are not well combined.

In Japanese Patent No. 2000-221582 and No. 2001-04106, entitled "Chip Antenna and Method of Manufacturing the Same", a method of manufacturing an antenna is disclosed in which an antenna conductor and a dielectric wafer are stacked on a wafer. In the antenna made by this method, although the volume has been greatly reduced compared with the conventional antenna, it still needs to occupy some space inside the device.

In Japanese Patent No. 2002-015637, entitled "Method of Manufacturing a Planar Antenna", the antenna manufacturing method disclosed is a multilayer electroplating method on a metal substrate, and the metal substrate is embossed. Holes to obtain antenna elements, as this method will generate a large amount of stamping waste, will increase the cost, and the metal substrate will increase the weight of the finished product, and this method cannot make a curved antenna.

In the invention patent No. I241052, entitled "Manufacturing Method of Microchip Antenna", an antenna manufacturing method is disclosed, which is fabricated on a dielectric substrate and then encapsulated in a ceramic or plastic material. Although the method has the advantage of being able to manufacture a large number of antennas, it still takes up valuable space inside the dielectric substrate.

In the prior patent of Taiwan No. I248698, entitled "Manufacturing Method of Antenna Module for Wireless Electronic Devices", an antenna manufacturing method is disclosed, which is to first fabricate an antenna loop, and to perform in-mold The method of shooting completes the package, and the production of the antenna by this method is not only cumbersome, but also has a limited yield in practical applications.

In Japanese Patent No. 2002-368914, entitled "Built-in Antenna, Manufacturing Method Thereof, Fixing Method, and Electronic Device Using the Same", an antenna manufacturing method is disclosed, which must first be an antenna with a metal piece. The stamping is formed, and a plurality of square holes are opened in the built-in casing, so that the casing is difficult to manufacture in the production process, and a stereoscopic antenna cannot be produced by this method.

In Taiwan Patent No. I272045, entitled "Electronic Printing Process", the antenna manufacturing method disclosed is that a conductive material is printed on a pad printing film, and the conductive film on the pad film is printed. The substance is transferred to the substrate again, but the thickness of the antenna manufactured by this method is limited, and the method cannot be applied Used to make antennas on curved surfaces.

In U.S. Patent Nos. 60/697,599 and 11/452,108, entitled "Method of Making a Radio Frequency Identification Tag and Its Forming Structure", an antenna manufacturing method is disclosed which repeats the semiconductor layer and the conductor layer. Stacked on a metal foil, if the antenna is to be fabricated by this method, high cost must be invested in the process equipment, and the method cannot manufacture the antenna on the curved surface.

In Japanese Patent No. 2005-077108, entitled "Radio Frequency Identification (RFID) Labels, Module Components, and RFID Identification Label Manufacturing Methods," the disclosed antenna manufacturing method will be mixed with a metal filler. The resin material paste is formed on the substrate and is attached to the metal patch. However, since the conductive property of the resin material paste is unstable after the molding, it is inevitably an unstable factor in the overall design.

In the patent application No. I308809, entitled "Cylindrical Antenna Device and Method of Manufacture", the antenna manufacturing method disclosed is that a metal layer is formed on the periphery of the columnar body, and then a part of the metal layer is removed. The desired specific image is formed, but when the antenna is produced by this method, the removed metal layer will increase the cost required to fabricate the antenna.

In the patent application No. I313524, entitled "Manufacturing Method of Electronic Device and Its Linear Antenna", the antenna manufacturing method disclosed therein is integrally formed with the casing, but the antenna structure is still independent. The metal structure must occupy part of the space of the casing.

In Taiwan Patent No. I320219, entitled "Method of Continuous Electroplating of Circuit Components and Structure of Circuit Components", the method of fabricating the antenna is based on the use of a semiconductor process to form a line structure on a germanium substrate, which cannot be used in a general basis. material Formed on.

In the patent of the Japanese Patent No. I323633, entitled "Shell Structure of Electronic Devices", the antenna manufacturing method disclosed therein forms an antenna pattern on a metal casing, but cannot form an antenna on a plastic substrate.

In Taiwan Patent No. I327607, entitled "Electroplating Parts and Methods of Manufacture", the method of manufacturing an electroplated part is to deposit a complete metal layer on the entire surface and remove unnecessary portions. This practice will also increase the cost of manufacturing the antenna.

In the prior patent of Taiwan No. I330906, entitled "A cylindrical antenna device and a method of manufacturing the same", the antenna manufacturing method disclosed is that a metal layer is formed on the periphery of the columnar body, and then a part of the metal layer is removed. In order to form the desired specific image, as such, this practice will also increase the cost of manufacturing the antenna.

In Taiwan Patent No. I335080, entitled "Method for Wetly Making Metal Wires", the wire manufacturing method disclosed is a method of bonding a catalytic layer on an insulating substrate using a viscous material, and above it. The first metal layer is plated to form a specific wiring pattern, but the adhesion of the catalytic layer is poor, so that the first metal layer has a peeling loss.

In the prior art patent No. 03009488.2 and U.S. Patent No. 60/466,309, entitled "Antenna Device for Communication Equipment", the antenna manufacturing method disclosed is a method in which a separate antenna assembly is embedded in a casing. One practice will affect the thickness of the housing.

In Taiwan Patent No. I337786, entitled "Method of Manufacturing an Antenna for Radio Frequency RFID (RFID)", the method of fabricating the antenna disclosed is masked, plasma cleaned, corona treated or ozonated. Surface activation, but The etching is still performed on the entire surface of the attachment, which is complicated and costly.

In Japanese Patent No. 2005-194496, entitled "RFID Marking and Method of Manufacture", the antenna manufacturing method disclosed is that a conductive particle is mixed into a thermoplastic resin to form a paste, and a conductive loop is formed thereon. However, the conductivity of this method is not easy to control.

In the patent application No. I344333, entitled "Electronic device housing and its manufacturing method", the antenna manufacturing method disclosed therein is to embed an antenna element on a metal casing, which is complicated to assemble and occupies the shell. A certain volume of the body.

In Japanese Patent No. 2006-114849, entitled "Metal Pattern Forming Method, Metal Pattern, and Printed Wiring Board", the disclosed circuit fabrication method is performed by forming a polymer layer on the surface of the substrate and then reducing it. The photoresist layer on which the desired wiring is formed, followed by electroplating to form the desired pattern, has a complicated process and the cost of the photoresist is high.

In the patent publication entitled "Metal Electrode Manufacturing Method", in the Korean Patent Publication No. 10-2006-0033619, No. 10-2006-0038640, and No. 10-2006-0038641, the electrode manufacturing method disclosed therein is based on The surface of the material is formed by photoresist, and the method has the disadvantages of complicated process and high cost.

In the patent application entitled "Radio Frequency Identification Label and Its Manufacturing Method" in Japanese Patent No. 2006-216727 and No. 2007-001989, the antenna manufacturing method disclosed therein forms a circuit by means of printing etching, and the method is also There are shortcomings in the complicated cost of the process.

In the Korean Patent No. 10-2007-0020168, entitled "Method of Forming a Low Resistivity Metal Pattern," the method disclosed is a method of forming a sensitized layer and a photosensitive layer on a surface of a substrate for pattern etching. This method also has a process Complex and costly shortcomings.

In Japanese Patent No. I361208, entitled "Method for Forming a Metal Pattern on a Substrate", the method for fabricating the antenna disclosed is to transfer the desired pattern to the surface of the substrate after using the printed circuit. When the antenna is formed, the antenna is faced with the disadvantages of complicated process and high cost, and when the antenna is fabricated on the curved surface by the method, the antenna produced by the antenna has a problem of high defect rate and unstable quality.

In Japanese Patent No. 2007-030682, entitled "Electronic Component Manufacturing System and Electronic Component Manufacturing Method", the manufacturing method disclosed is that after forming a desired component on a leading substrate, The method of printing and pasting is moved to the finished substrate. This method also has the disadvantages of complicated process and high cost. When the antenna is fabricated on the curved surface by the method, the antenna produced by the method also has high defect rate and unstable quality. The problem.

Japanese Patent No. 10-2006-0033757 and No. 10-2007-0035607, entitled "Resin Composition Containing Catalytic Precursor for Electroless Electroplating to Form Electromagnetic Shielding Layer, Method of Forming Metal Pattern Using the Resin Composition" In the prior art of the metal pattern formed by the method, the disclosed manufacturing method requires a specific resin to be mixed with a specific substance, and a general semiconductor process is employed, so that the overall process is complicated and costly.

In summary, it is known that the technique for manufacturing an antenna often has to occupy a large amount of space in the device, which is disadvantageous to miniaturization of the entire electronic product; in addition, most of the techniques are only suitable for manufacturing a planar antenna, and it is difficult to apply to production. The antenna on the curved surface makes the application range of the produced antenna greatly limited; in addition, although some conventional techniques can overcome the above problems, there are complicated processes and manufactures. The disadvantage of expensive price, and even the antenna produced by some of the prior art, the adhesion between the antenna and the attached surface is not good, so that the antenna is easily peeled off and consumed, in addition to affecting the production yield of the product, it also affects The stability of the finished product quality. Therefore, how to design a conductive pattern on a non-conductive substrate can form a conductive pattern on a non-conductive substrate in a relatively simple and low-cost process, and the conductive pattern can be used as an antenna. The antenna produced does not need to occupy the space inside the device. In addition, the antenna can be produced on various curved surfaces according to the shape of the non-conductive substrate, which greatly expands the application range of the antenna process, and further ensures the antenna and its production. The adhesion between the attached surfaces and the improvement of the production yield of the produced antenna products and the stability of the finished product quality have become an important subject of the present invention.

In view of the above-mentioned shortcomings of the prior art for manufacturing antennas, the inventors have finally developed a non-conductive substrate of the present invention after repeated research and testing by virtue of their long-term experience in serving related industries. The method of forming a conductive pattern can be used to solve various problems encountered by the prior art by the present invention.

It is an object of the present invention to provide a method of forming a conductive pattern on a non-conductive substrate by subjecting at least a partial region of a non-conductive substrate to surface treatment (eg, chemical etching, sanding or laser polishing). Engraving), such that the surface of the non-conductive substrate forms a plurality of holes (for example, a circle, a square, an irregular shape, or a combination of a plurality of shapes described above, the holes may be arranged in a symmetric arrangement, an irregular arrangement or a mixed arrangement), each of which The diameter of the hole is between 0.02μm and 40μm The depth is also between 0.02 μm and 40 μm; the non-conductive substrate is contacted with a surfactant mixed solution (including palladium ions, stabilizer, hydrochloric acid and colloidal particle carrier); 嗣, the non-conductive substrate is contacted a reducing agent solution (including a neutralizing agent and hydrochloric acid) to form an active layer on the localized region on the non-conductive substrate; finally, contacting the non-conductive substrate with an electroless plating metal plating solution (including a chelating agent, The metal ions, the opening agent and the stabilizer are used to cause metal ions in the electroless metal plating solution to be deposited on the metal plating layer to form a conductive pattern. Thus, through the simple and low-cost process described above, the related art can form the conductive pattern on the non-conductive substrate, so that the conductive pattern can be used as an antenna, which not only makes the antenna produced by the relevant industry unnecessary to occupy. A large amount of space in the device, and the relevant manufacturer can produce the antenna on various curved surfaces according to the shape of the non-conductive substrate, which greatly expands the application range of the antenna process; in addition, the solution is mixed with the surfactant by the holes The matching of the colloidal particle carrier can greatly improve the bonding force between the produced antenna and the surface to which it is attached, and can effectively improve the production yield of the produced antenna and the stability of the finished product quality.

For your convenience, the review committee can make a further understanding and understanding of the purpose, structure and efficacy of the present invention. The embodiments are described in conjunction with the drawings, which are described in detail as follows:

The present invention is a method for forming a conductive pattern on a non-conductive substrate. Referring to FIG. 1, in the main flow of the present invention, the method includes the following steps: (101) surface coating a non-conductive substrate Processing to form a plurality of pores having a pore diameter and a depth between 0.02 μm and 40 μm on the surface of the non-conductive substrate a hole (102) contacting the non-conductive substrate with a surfactant mixture solution; (103) contacting the non-conductive substrate with a reducing agent solution; and (104) contacting the non-conductive substrate with an electroless metal plating Liquid to form a conductive pattern.

The non-conductive substrate may be acrylonitrile butadiene styrene (ABS), polycarbonate (Polycarbonate, PC), polystyrene (PS) or phenol formaldehyde (Polystyrene, PS). Phenol formaldehyde (referred to as PF, also known as bakelite) or made of the above materials (for example: 70% ABS and 30% PC mixed), but the material is not limited to this.

In a preferred embodiment of the present invention, the surface treatment is performed on at least a partial region of the non-conductive substrate by means of laser engraving, wherein the light source used for the laser engraving may be a fiber laser or a second Polar laser, carbon dioxide laser or tube laser can also be used by laser mixing of these two or more sources. In particular, the method of surface-treating the non-conductive substrate is not the case, and the actual application may be carried out by chemical etching or sandpaper polishing. The non-conductive substrate is surface-treated, and a plurality of holes are formed on the surface of the local region, and each of the holes has a diameter of between 0.02 μm and 40 μm and a depth of between 0.02 μm and 40 μm. The present invention does not limit the specific shape of the holes, that is, the holes may be circular, square, irregular, or a combination of the foregoing various shapes; in addition, the present invention does not limit the arrangement of the holes, for example. In terms of the holes, the holes may be arranged in a symmetrical arrangement, an irregular arrangement or a mixed arrangement.

Referring to Fig. 2, the pattern formed by surface treatment of the local region of the non-conductive substrate is applied by the method of the present invention. In a preferred embodiment of the present invention, after the holes are formed in the partial region, the non-conductive substrate is contacted with the surfactant mixed solution, and the surfactant solution includes palladium ions (active ions). And stabilizer, hydrochloric acid and colloidal particle carrier, and the particle size of the colloidal particle carrier matches the diameter of each of the holes. Thus, by matching the colloidal particle carriers with the respective holes, the colloidal particle carriers and the palladium ions carried by the colloidal particles can be firmly embedded in the holes, thereby improving the stability of the plating structure.

Referring to FIG. 1 , in the main flow of the present invention, when the local region of the non-conductive substrate forms the holes, the non-conductive substrate is brought into contact with the surfactant mixed solution. However, in other preferred embodiments of the present invention, the non-conductive substrate is brought into contact with a degreaser solution before contacting the non-conductive substrate with the surfactant mixed solution. The degreaser solution removes the release agent remaining on the surface of the non-conductive substrate, thereby improving the adhesion effect of the colloidal particle carriers. In a preferred embodiment of the invention, the degreaser comprises a mixed solution of a wetting agent, a polymeric dispersant, a rust inhibitor, an anionic surfactant, and a nonionic surfactant.

The non-conductive substrate is contacted with the reducing agent (including a neutralizing agent and hydrochloric acid) after the carrier of the colloidal particles is attached to the localized region, and the colloidal particles are catalyzed by the reducing agent solution. The carried palladium ions are reduced to palladium atoms (active atoms) and firmly deposited in each of the holes to form an active layer in the local region; finally, the local region of the non-conductive substrate is brought into contact with the An electroless metal plating solution in which metal ions in the electroless metal plating solution can A precipitate is formed on the active layer and the conductive pattern is formed. Wherein, the electroless metal plating solution comprises a chelating agent, a metal ion, a cylinder opening agent and a stabilizer; when the metal ion selected is a copper ion, the electroless metal plating solution further comprises a salting agent and formaldehyde; When the metal ion is a noble metal (such as gold, silver, nickel, palladium or cobalt) ions, the electroless metal plating solution further includes an acid agent and ammonia water.

Referring to Fig. 3, the pattern formed by plating a copper layer in the local region by the method of the present invention. As can be seen from the drawing, the conductive pattern is formed in the local region of the non-conductive substrate by the method of the present invention, and the effect is very uniform and good. In addition, after the copper layer is formed in the local region by the method of the present invention, the local region can be further contacted with the surfactant mixed solution, the reducing agent solution and the electroless metal plating liquid phase, thereby being formed. The electroless plating reaction is further continued on the metal layer of the local region, and even a different metal layer is plated on the original metal layer. For example, as shown in FIG. 4, the copper layer is further subjected to the present invention. The pattern formed by plating a nickel layer. In particular, when a metal plating layer has been formed on the partial region, and the electroless plating reaction is further performed by the method of the present invention, the surface treatment may be further required, and the reducing agent solution is further required. In contact with, for example, in another preferred embodiment of the present invention, the partial region where a metal plating layer has been formed only needs to be continuously contacted with another surfactant mixed solution and the electroless plating metal plating solution. The electroless plating reaction can be further performed on the metal layer, wherein the other surfactant mixed solution includes palladium ions, a stabilizer, boric acid and an alkali agent, and at this time, the palladium ion in the other surfactant mixed solution It will not precipitate outside the local area, but will precipitate directly on the metal plating. The aforementioned repeated steps, whether or not the reducing agent solution is used, can be repeatedly performed.

The preferred processing conditions for each step are described below for a preferred embodiment of the present invention. First, a non-conductive substrate prepared by mixing 70% ABS and 30% PC is surface-treated by fiber laser. Forming a plurality of pores having a pore diameter and a depth of about 0.3 μm in the partial region of the non-conductive substrate; contacting the localized portion with the degreaser solution for 3-30 minutes under a reaction condition of 25-65 ° C; Under a reaction condition of 65 ° C, the localized area is contacted with the surfactant solution for 1-30 minutes; 嗣, under a reaction condition of 25-65 ° C, the localized area is contacted with the reducing agent solution for 1-30 minutes; Finally, the localized region is contacted with the electroless plating solution for 1-180 minutes under the reaction conditions of 25-85 ° C to allow metal ions in the electroless plating solution to precipitate in the localized region and form the conductive pattern.

It can be seen from the above description that, by the method disclosed in the present invention, the related art can form the conductive pattern on the non-conductive substrate in a relatively simple and low-cost process, so that the conductive pattern can be used as an antenna. The antenna not only does not need to occupy a large amount of space in the device, but also because the related manufacturer can produce the antenna on various curved surfaces according to the shape of the non-conductive substrate, this method further broadens the application range of the antenna process; The matching of the pores with the colloidal particle carrier in the surfactant mixture solution can greatly enhance the bonding force between the produced antenna and the surface to which it is attached, and can effectively improve the production yield and finished product quality of the produced antenna. stability.

The foregoing is only a few preferred embodiments of the present invention, but the scope of the claimed invention is not limited thereto, and the technical contents disclosed in the present invention are disclosed by those skilled in the art. Equivalent changes that can be easily considered are within the scope of the claimed invention.

1 is a schematic diagram of the main flow of the present invention; FIG. 2 is a pattern formed by surface treatment of a partial region of a non-conductive substrate by the method of the present invention; and FIG. 3 is a partial portion of the pattern plated by the method of the present invention. a pattern formed after the last copper layer; and Fig. 4 is a pattern formed by plating the nickel layer on the copper layer by the method of the present invention.

Claims (18)

A method of forming a conductive pattern on a non-conductive substrate by subjecting a non-conductive substrate to a surface treatment of at least a partial region on the non-conductive substrate to form a plurality of holes on the surface thereof The diameter and depth of each of the holes are between 0.02 μm and 40 μm; the local region of the non-conductive substrate is contacted with a surfactant mixed solution to make the colloidal particle carrier in the surfactant solution The active ion carried can be firmly embedded in each of the holes; the local area of the non-conductive substrate is contacted with a reducing agent solution, so that the active ions carried by the colloidal particles are reduced to active atoms and stabilized Depositing in each of the holes to form an activation layer in the local region; and contacting the local region of the non-conductive substrate with an electroless metal plating solution to cause metal ions in the electroless plating metal plating solution It can be deposited on the active layer and form a conductive pattern. The method of claim 1, wherein the surfactant solution comprises palladium ions, a stabilizer, hydrochloric acid, and a colloidal particle carrier, and the particle size of the colloidal particle carriers matches the diameter of each of the pores. The method of claim 2, further comprising: contacting the non-conductive substrate with a degreaser solution before the non-conductive substrate is brought into contact with the surfactant mixed solution, thereby removing the residue by the degreaser solution. a release agent on the surface of the non-conductive substrate. The method of claim 3, wherein the localized region of the non-conductive substrate is contacted with the surfactant solution for 1-30 minutes under reaction conditions of 25-65 °C. The method of claim 3, wherein the localized region of the non-conductive substrate is contacted with the degreaser solution for 3-30 minutes under reaction conditions of 25-65 °C. The method of claim 5, wherein the degreaser comprises a wetting agent, a polymeric dispersant, a rust inhibitor, an anionic surfactant, and a nonionic surfactant. The method of claim 3, wherein the localized region of the non-conductive substrate is contacted with the reducing agent solution for 1-30 minutes under reaction conditions of 25-65 °C. The method of claim 7, wherein the reducing agent solution comprises a neutralizing agent and hydrochloric acid. The method of claim 3, wherein the localized region of the non-conductive substrate is contacted with the electroless plating solution for 1-180 minutes under reaction conditions of 25-85 °C. The method of claim 9, wherein the electroless plating metal plating solution comprises a chelating agent, a metal ion, a cylinder opening agent, and a stabilizer. The method of claim 10, wherein the electroless metal plating solution further comprises a salting agent and formaldehyde, and the metal ion is a copper ion. The method of claim 10, wherein the electroless metal plating solution further comprises an acid agent and ammonia water, and the metal ion is a noble metal ion. The method of claim 12, wherein the noble metal ion is a gold ion, a silver ion, a nickel ion, a palladium ion or a cobalt ion. The method of claim 3, 4, 6, 8, 11, or 13, wherein the non-conductive substrate may be surface-treated by laser engraving, chemical etching or sandpaper, or may be mixed by the above two or more methods. Used to make a table of the non-conductive substrate Surface treatment. The method of claim 14, wherein the laser engraving is performed by a fiber laser, a diode laser, a carbon dioxide laser, a tube laser or a combination of the above two or more light sources. The method of claim 15, wherein the localized region of the non-conductive substrate contacts the surfactant mixed solution, the reducing agent solution, and the non-electroplating metal plating solution. The electroplated metal plating is in contact with the liquid phase, or is continuously contacted with another surfactant mixed solution and the electroless plating metal plating solution. The method of claim 16, wherein the another surfactant mixed solution comprises palladium ions, a stabilizer, boric acid, and an alkali agent. The method of claim 17, wherein the non-conductive substrate is an acrylonitrile-butadiene-styrene resin, polycarbonate, polystyrene, phenol formaldehyde or a mixture of the foregoing.